CN117029357A - Semiconductor grade vacuum multi-layer cold plate - Google Patents
Semiconductor grade vacuum multi-layer cold plate Download PDFInfo
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- CN117029357A CN117029357A CN202311298953.6A CN202311298953A CN117029357A CN 117029357 A CN117029357 A CN 117029357A CN 202311298953 A CN202311298953 A CN 202311298953A CN 117029357 A CN117029357 A CN 117029357A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 25
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 122
- 239000007788 liquid Substances 0.000 claims abstract description 95
- 230000017525 heat dissipation Effects 0.000 claims abstract description 81
- 230000007246 mechanism Effects 0.000 claims abstract description 57
- 230000000903 blocking effect Effects 0.000 claims abstract description 37
- 238000012545 processing Methods 0.000 claims abstract description 21
- 238000001816 cooling Methods 0.000 claims description 31
- 230000000694 effects Effects 0.000 claims description 16
- 230000005855 radiation Effects 0.000 claims description 16
- 230000005484 gravity Effects 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 10
- 238000012546 transfer Methods 0.000 claims description 10
- 229910000838 Al alloy Inorganic materials 0.000 claims description 9
- 238000005219 brazing Methods 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 238000007599 discharging Methods 0.000 claims description 2
- 125000004122 cyclic group Chemical group 0.000 claims 1
- 230000002708 enhancing effect Effects 0.000 claims 1
- 238000013461 design Methods 0.000 abstract description 12
- 238000004140 cleaning Methods 0.000 abstract description 11
- 239000007789 gas Substances 0.000 description 37
- 238000000034 method Methods 0.000 description 13
- 230000008569 process Effects 0.000 description 13
- 238000002347 injection Methods 0.000 description 8
- 239000007924 injection Substances 0.000 description 8
- 238000003466 welding Methods 0.000 description 8
- 238000009434 installation Methods 0.000 description 6
- 238000005266 casting Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 238000004064 recycling Methods 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 4
- 239000012530 fluid Substances 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005728 strengthening Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000000110 cooling liquid Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000003698 laser cutting Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
- F25D17/02—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating liquids, e.g. brine
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
- F25D17/04—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection
- F25D17/06—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection by forced circulation
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Abstract
The application relates to the technical field of semiconductor processing equipment, in particular to a semiconductor grade vacuum multi-layer cold disc; the cold disc comprises a cold disc main body, a plurality of working units, a liquid runner, a gas runner, a heat conducting layer, a fixing mechanism, a heat dissipation plate, a rotating shaft and a rotating shaft, wherein the working units are arranged in the cold disc main body and run relatively independently; according to the application, through the multi-layer design of the cold disc, the waterway and the air channel are simultaneously designed in the cold disc, and the cold disc is subjected to modularized design, so that the heat dissipation efficiency is ensured, and the blocking risk is avoided; the gas in the gas circuit can further radiate heat and cool the radiating liquid in the water circuit so as to ensure that the radiating liquid temperature of each working unit is consistent, and meanwhile, the gas is sprayed to the inside of the equipment periodically to perform a cleaning function.
Description
Technical Field
The application relates to the technical field of semiconductor processing equipment, in particular to a semiconductor grade vacuum multi-layer cold plate.
Background
The processing equipment of semiconductor often can use the cold dish to dispel the heat or control the temperature in the operation of inside, and the cold dish dispels the heat to equipment inside through setting up the water-cooling, realizes the jet-propelled detritus to equipment inside through setting up the gas circuit.
The semiconductor processing equipment can have the situation that the temperature of a part area is higher for a long time under a special use scene, the internal waterway design of the existing cold tray is often an integral design, the high-efficiency cooling cannot be carried out on the part high-temperature area, the phenomenon that the internal part of the semiconductor processing equipment is too high in local temperature can be caused due to the fact that the uniform heat dissipation cannot be carried out, the semiconductor part cannot meet the requirement and even fails to be processed, and the high-efficiency performance of water cooling heat dissipation is not fully exerted; the step of cooling the liquid is arranged outside the cold disc, so that the liquid in the cold disc cannot be cooled at the first time.
The waste scraps generated in the semiconductor processing process in the equipment are treated by continuously filling inert gas into the internal gas circuit of the existing cold disk, but the direction strength of each time of gas injection is not changed, and dead angles are cleaned, so that the processing is affected, the yield of parts is low, and unnecessary economic loss is caused; the air path which needs to be additionally designed can increase the processing difficulty of the cold disc, and is inconvenient to maintain in the later period; under the circumstances, there is an urgent need for a multi-layer cold plate that can combine the waterway and the air channel, reduce the travel of the waterway, thereby increasing the heat dissipation efficiency, realize the local rotation of the cold plate and ensure the heat dissipation uniformity, realize the waterway cooling inside the cold plate through the heat dissipation of the air channel, and ensure the high efficiency of the water cooling heat dissipation.
Disclosure of Invention
In order to change the problem that the temperature of a local area in the device cannot reach an ideal temperature and the operation of the device is affected because the existing cold disc can effectively cool the interior of the device, but the liquid temperature at the rear end of a flow channel of the cold disc is higher, so that the heat dissipation effect is uneven.
In order to achieve the above object, the present application provides the following technical solutions.
The application provides a semiconductor grade vacuum multi-layer cold plate, which comprises a cold plate main body, an air vent and a water through port, wherein the cold plate main body is mainly used for radiating and controlling the temperature in semiconductor processing equipment, and the air vent and the water through port are arranged on the cold plate main body and are used for filling gas and recycling liquid in the cold plate; a plurality of working units are arranged in the cold disc main body; the working units are operated relatively independently, a liquid runner and a gas runner are arranged between every two working units and used for transporting liquid and gas, the working units are of a multilayer structure with upper heat conduction and lower heat dissipation, the uppermost layer of each working unit is provided with a heat conduction layer, the material of the heat conduction layer is copper, and heat can be transferred from a higher temperature side to a lower temperature side according to the principle of the second law of thermodynamics. Namely, heat is quickly transferred into the working unit from a high-temperature environment outside the working unit, and then a large amount of heat is taken away by the quick flow of liquid with high specific heat capacity; a fixing mechanism is fixedly arranged below the heat conducting layer for a circle, the installation mode is set to be welding and riveting, the fixing mechanism is tightly matched with the heat conducting layer to form a sealed space for gas movement, and the sealed space is used for strengthening the pushing force of the internal gas pressure of the sealed space so as to realize the rotation of the working unit; the circulating mechanism is fixedly arranged right below the heat conducting layer, the installation mode is set to be bonding and integral casting, a waterway is arranged in the circulating mechanism, a large amount of heat is taken away through quick circulation of liquid with larger specific heat capacity to realize water cooling and heat dissipation of the heat conducting layer, the waterway on two sides is firstly processed, and then the two parts are subjected to a manufacturing process of aluminum alloy vacuum brazing face to ensure internal tightness, the aluminum alloy is set to be high in mechanical strength while the heat dissipation efficiency of the aluminum alloy is higher, corrosion and oxidation are not easy to occur, and the vacuum brazing is set to effectively avoid oxidation of the cold disc in the welding process so as to ensure the tightness and structural strength of the waterway; the annular array fixed mounting has the heating panel below the circulation mechanism, and the mounting means sets up to laser brazing or vacuum brazing, heating panel side fixed mounting has the axis of rotation, thereby the gas promotion of axis of rotation in the gas circuit thereby the heating panel drives circulation mechanism rotates and realizes more even efficient radiating effect.
The cold disc is mostly required to dissipate heat in a water cooling mode, so that the internal temperature of the equipment cannot be too high, and the circulating mechanism comprises an annular flow passage, a water inlet, a water outlet and a blocking pin; the annular flow passage is arranged in a multi-layer structure from inside to outside and can be arranged in 4-8 layers; the water inlet and the water outlet are arranged on the annular flow channel, and the processing mode can be set to water knife cutting and turning, and the water inlet is characterized in that the liquid input by the water inlet passes through the annular flow channel and is discharged from the water outlet; the blocking pin is fixedly arranged on the annular flow channel in a welding and bonding mode, is positioned between the water outlet and the water inlet, and is used for breaking laminar flow formed by liquid flowing from the water inlet to the water outlet so as to increase the Reynolds coefficient of the flowing liquid into a turbulent flow state; when laminar flow flows, because the fluid between each layer of water flow is relatively not mixed, the relative arrangement of liquid molecules in the water flow is relatively regular, so that the heat exchange mode is mainly carried out by virtue of local conduction, and turbulent flow is the intensive mixing among fluid particles in each layer, so that the arrangement of liquid molecules in the water flow is relatively disordered, the heat exchange efficiency is greatly enhanced, and the heat release efficiency is better than that of laminar flow during turbulent flow, thereby improving the heat transfer efficiency of liquid.
The travel of the water flow determines the heat dissipation efficiency to a certain extent, the water inlet and the water outlet are arranged at intervals, so that the circulating flow speed of the liquid in the water inlet is higher, the travel of the water flow is reduced to avoid the problem of blockage, and the liquid is divided into two water flows to flow in two directions after being input through the water inlet in the annular flow channel, so that the circulation efficiency is improved, and if the water inlet is blocked somewhere, the circulation speed is not greatly influenced; the rotating shaft is tightly matched with the water inlet, so that liquid passes through the annular flow channel and then is discharged into the heat dissipation plate through the water outlet to cool the heat dissipation plate, and then the liquid returns to the rotating shaft again to convey the next working unit.
The blocking pin is designed to achieve better heat dissipation efficiency improvement under the condition of extremely low cost, the blocking pin is arranged to be a cylinder provided with a spiral groove, and the processing mode of groove opening can be set to be integrated casting and injection mold manufacturing; when the liquid is shunted from the water inlet to enter the annular flow passage, the state of the liquid is changed through the blocking pin, so that the Reynolds coefficient of the liquid is increased and changed into a turbulent state, and the heat transfer efficiency of the liquid is improved; the blocking pin is arranged into a cylinder provided with a spiral groove, so that the Reynolds number of liquid is favorable for increasing, the Reynolds number is a dimensionless number which can express the flow condition of the fluid, and is related to the flow speed, the density and the viscosity coefficient of the fluid, the Reynolds number is not in a laminar flow state when being larger than 2000, and the heat transfer coefficient of the blocking pin is higher when the Reynolds number is larger; when the liquid passes through the spiral grooves, the motion state of the liquid can be changed irregularly, so that the Reynolds coefficient of the liquid is increased; the blocking pin changes the liquid in the annular flow passage into a turbulent motion state so as to achieve better heat transfer efficiency of the liquid.
The cooling disc is provided with an air passage to realize the auxiliary effect in the semiconductor processing process, the rotating shaft is communicated with a flow passage formed in the cooling plate, the cooling plate is provided with a cooling flow passage, and the processing mode can be set to casting two parts and then aluminum alloy vacuum brazing, so that the processing difficulty is reduced, and the air tightness and corrosion resistance required in the use process are ensured; the heat dissipation flow channel is arranged in an S shape to obtain a larger air contact area, the S-shaped flow channel design can realize the larger air contact area as far as possible in a limited space, thereby realizing the rapid cooling and heat dissipation of liquid and ensuring that the temperature of the liquid entering the next working unit is lower; the rapid cooling of the liquid in the heat dissipation flow channel is realized through air circulation in the air channel, the upper end of the heat dissipation flow channel is communicated with the water outlet, the lower end of the heat transfer flow channel is communicated with the inside of the rotating shaft, the liquid enters the heat dissipation flow channel through the water outlet, and the heat dissipation is carried out in the S-shaped flow channel by utilizing the circulated air; the rotating shaft is provided with a water supply flow passage which is communicated with the water inlet; the liquid enters the water inlet through the water supply flow channel to realize low-temperature liquid supply of the annular flow channel, the water collecting flow channel is arranged at the lower end of the rotating shaft and used for collecting and discharging the liquid in the heat dissipation plate and then enabling the liquid to enter the next working unit for reuse.
In the operation process of the cold disc, a fixing mechanism is needed to realize continuous guarantee of a heat dissipation effect and air injection chip removal, the fixing mechanism comprises a fixing ring, an air inlet, an air outlet, an air flow channel, a limiting block, a rotating shaft and a control sheet, the fixing ring is fixedly arranged on one circle of the heating layer, the air inlet and the air outlet are formed in two sides of the fixing ring, the air flow channel is formed above the air inlet, the processing mode is set to laser cutting and cutting processing, the limiting block is fixedly arranged at the upper end inside the air flow channel, the mounting mode is set to welding and bonding, the rotating shaft is fixedly arranged in the air flow channel in the middle position of the limiting block, the mounting mode is set to bonding and riveting, and the control sheet is rotatably arranged on the rotating shaft; the control piece is used for temporarily blocking the air passage of the air inlet when the side surface of the heat radiation plate rotates, and the internal pressure of the air flow channel can be rapidly increased so that the control piece overcomes the gravity of the control piece and completes rotation at a certain angle under the support of the limiting block, and the air flow channel is periodically opened to enable air to jet and remove scraps outside the cold disc; the limiting blocks are arranged in two, wherein the limiting blocks are used for limiting the working state and the non-working state of the control piece respectively.
When the air is injected, high pressure and intermittent air injection are required, the control sheets are arranged along the two sides of the rotating shaft and are made of non-density materials, in a horizontal state, the control blocks horizontally limit the air by means of downward gravity and limiting blocks which are half of the larger density, the air pressure in the air flow channel is increased, the control sheets are upwards opened by being pushed by the gravity, and the air injection is carried out on equipment on the cold disc; the utility model discloses a control piece, including control piece, heating panel, air inlet, fixed establishment, control piece and control piece, still be provided with around it is used for strengthening the rubber circle of sealed effect for form a sealing environment with the gas runner, the control piece is the horizontality under the support cooperation of stopper when not working, the heating panel side keeps off the air inlet to when the inside gas-supply of fixed establishment of control piece its below atmospheric pressure increases and can lead to the horizontality to be destroyed overcome control ring's gravity rotation realizes outside exhaust effect.
Regarding the number setting of the radiating plates, the number of the radiating plates is 3-5, the air inlets pressurize the closed space formed by every two radiating plates and the fixing mechanism to drive the rotation of the air inlets, so that the circulation mechanism is driven to rotate, and the heat dissipation efficiency is prevented from being reduced due to overhigh temperature in a certain area, and the uniform heat dissipation outside the cold plate is realized; in this sealed space, the air inlet carries out air transportation to the air inlet to increase the internal air pressure, so as to push the heat dissipation plate to rotate in one direction, thereby realizing the rotary heat dissipation of the circulating mechanism and uniformly dissipating the heat of the heat conduction layer.
The beneficial effects of the application are as follows.
1. According to the application, by arranging the circulating mechanism and the heat conducting layer, the independent heat conducting work and the independent heat radiating work are effectively ensured by the multi-layer alternate design, and the two parts complement each other; the traditional unidirectional long flow passage is changed, the design is a multi-layer annular flow passage, the travel of water-cooling liquid is reduced, the design of bent angles is avoided, the heat dissipation efficiency can be improved, the blocking risk is reduced, and the working efficiency of heat dissipation of the cold disc can be improved due to the interval design of the water inlet and the water outlet; a blocking pin with spiral grooves is arranged to increase the reynolds number of the liquid so as to change the liquid into a turbulent state, and a larger heat conduction coefficient is obtained.
2. According to the application, the heat radiation plate and the rotating shaft are arranged, and in the internal environment of the equipment facing the local high temperature, the air pressurizes the sealed environment between the adjacent heat radiation plate and the fixed ring through the air inlet, so that the air obtains thrust to rotate forwards, the circulating mechanism can rotate to ensure the whole aspect of heat radiation work, the high-temperature area is ensured to perform higher-efficiency heat radiation, and the consistency of the internal temperature of the equipment is ensured.
3. According to the application, the air flow channel and the control piece are arranged, when the air inlet is blocked on the side surface of the heat dissipation plate, the air flow channel is pressurized, and the control piece is pushed to incline upwards, so that the air is rapidly sprayed out, and the cleaning effect on the inside of the equipment is realized.
Drawings
The drawings that accompany the detailed description can be briefly described as follows.
Fig. 1 is a schematic overall view of the present application.
Fig. 2 is a schematic diagram of the location of the working unit of the present application.
Fig. 3 is a cross-sectional view of the present application.
Fig. 4 is a schematic view of the direction of flow of the liquid according to the present application.
FIG. 5 is a horizontal cross-sectional view of the circulation mechanism of the present application.
Fig. 6 is a vertical cross-section of the circulation mechanism of the present application.
FIG. 7 is a schematic cross-sectional view of a circulation mechanism of the present application.
FIG. 8 is a schematic view of a blocking pin of the present application.
Fig. 9 is a schematic view of the position of the flow channel of the rotating shaft according to the present application.
Fig. 10 is a cross-sectional view of the securing mechanism of the present application.
FIG. 11 is a schematic view of the structure of the fixing mechanism of the present application.
Fig. 12 is an enlarged view of the securing mechanism of the present application.
In the figure: 1. a cold plate main body; 2. a vent; 3. a water-through port; 4. a heat conducting layer; 5. a circulation mechanism; 51. an annular flow passage; 52. a water inlet; 53. a water outlet; 54. a blocking pin; 56. a water inlet channel; 57. a water outlet channel; 58. a spiral groove; 6. a heat dissipation plate; 61. a heat dissipation flow channel; 7. a rotating shaft; 71. a water supply flow passage; 72. a water collecting flow passage; 73. a rotating block; 8. a fixing mechanism; 81. a fixing ring; 82. an air inlet; 83. an air outlet; 84. a gas flow passage; 85. a limiting block; 86. a control sheet; 87. a balance shaft; 88. and a gas nozzle.
Detailed Description
The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application.
As shown in fig. 1 to 12, a semiconductor grade vacuum multi-layer cold plate comprises a cold plate main body 1, an air vent 2 and a water through port 3, wherein the cold plate main body 1 is mainly used for radiating and controlling the temperature in semiconductor processing equipment, the air vent 2 and the water through port 3 are arranged on the cold plate main body 1, and the air vent 2 and the water through port 3 are used for filling gas and recycling liquid in the cold plate; the inside of the cold disc main body 1 is provided with a plurality of working units, and the working units are used for realizing modularized area division on the cold disc, so that the heat dissipation efficiency in each working unit area is ensured to be the same, and the consistent average of the air temperature inside the equipment is ensured; the working units are operated relatively independently, a liquid runner and a gas runner 84 are arranged between every two working units and are used for transporting liquid and gas, the working units are of a multi-layer structure with upper heat conduction and lower heat dissipation, the uppermost layer of the working units is provided with a heat conduction layer 4, the material of the heat conduction layer 4 is copper, and the copper has strong heat conduction, is relatively low in price and is convenient to control the cost; the operation of the heat conducting layer 4 is based on the principle of the second law of thermodynamics, whereby heat is transferred from the higher temperature side to the lower temperature side: namely, heat is quickly transferred into the working unit from a high-temperature environment outside the working unit, and then a large amount of heat is taken away by the quick flow of the liquid with high specific heat capacity; a fixing mechanism 8 is fixedly arranged below the heat conducting layer 4 for a circle, the installation mode is set to be riveted, the fixing mechanism 8 is tightly matched with the heat conducting layer 4 to form a sealed space for gas movement, and the sealed space is used for strengthening the pushing force of the internal gas pressure so as to realize the rotation of the working unit; the circulation mechanism 5 is fixedly arranged right below the heat conducting layer 4, the installation mode is set as an integral casting, a waterway is arranged in the circulation mechanism 5, a large amount of heat is taken away through quick circulation of liquid with larger specific heat capacity to realize water cooling and heat dissipation of the heat conducting layer 4, the waterway on two sides is firstly processed, and then the two parts are subjected to a manufacturing process of aluminum alloy vacuum brazing face to ensure the internal tightness, the pollution of air avoided in the vacuum brazing process is mainly avoided, and the phenomenon that a welding flux or a welding piece is subjected to high temperature in the welding process and is subjected to oxidation reaction with oxygen to form an unstable oxidation layer to cause insufficient mechanical strength is mainly avoided, and the corrosion resistance in the use process is weakened; the aluminum alloy is arranged because the aluminum alloy has high heat dissipation efficiency, high mechanical strength, difficult corrosion and oxidation, mature aluminum alloy processing technology, low price and low density; the annular array below the circulating mechanism 5 is fixedly provided with the radiating plates 6, the installation mode is set to be laser brazing, the radiating plates 6 are mainly contacted with gas, the requirement on corrosion resistance is low, and the working requirement can be met by setting to ensure the strength of the mechanical structure through laser welding; the rotation shaft 7 is fixedly arranged on the side face of the heat dissipation plate 6, and the rotation shaft 7 can rotate to drive the heat dissipation plate 6 and the circulating structure, so that the heat conduction layer 4 is rotated while the air circulation rate is accelerated, and the cooling effect is more average without dead angles.
As shown in fig. 4 and 5, the circulation mechanism 5 includes an annular flow passage 51, a water inlet 52, a water outlet 53, and a blocking pin 54; the annular flow passage 51 is of a multi-layer structure from inside to outside, and can be 6 layers, the contact area of the annular flow passage 51 can be increased by setting more layers, and the heat dissipation efficiency is improved, but the risk of pipe blockage can be increased by setting more layers, so that the heat dissipation can be well met by setting 6 layers, the blockage phenomenon can be avoided as much as possible, the stability of later use is ensured, and the possibility of maintenance is reduced; the water inlet 52 and the water outlet 53 are arranged on the annular flow channel 51, and the function of the water inlet 52 is that the water knife cutting can be set in a mode that liquid is input into the water inlet 52 through the annular flow channel 51 and then discharged from the water outlet 53, and the cut of the high-pressure water knife is complete and free of burrs and cannot deform, so that the follow-up circulating mechanism 5 and the heat dissipation plate 6 can be conveniently and fixedly installed, and the air tightness of the follow-up circulating mechanism is ensured to finish the efficient recycling of the liquid; the blocking pin 54 is fixedly arranged on the annular flow channel 51, the installation mode is set to be adhesive, the volume of the blocking pin 54 is smaller, the blocking pin 54 can be fixed by adopting the adhesive, the cost of the welded smaller parts is higher, the manufacturing cost is not beneficial to control, the blocking pin 54 is positioned between the water outlet 53 and the water inlet 52, the blocking pin 54 is used for breaking the laminar flow formed by the liquid flowing from the water inlet 52 to the water outlet 53, and the reynolds coefficient of the flowing liquid is increased to be in a turbulent flow state; the water inlet 52 is connected with a water inlet channel 56, and the water outlet 53 is connected with a water outlet channel 57.
When the cold plate starts to work, cooling liquid enters the annular flow channel 51 from the water inlet 52, under the action of the blocking pin 54, the Reynolds coefficient is increased to form a turbulent state by relatively uniform laminar flow, heat transferred from the upper heat conducting layer 4 of the circulating mechanism 5 is absorbed, and the heat is output through the water outlet 53, so that the circulating heat dissipation of the heat conducting layer 4 is completed.
By arranging the multi-layer annular flow channels 51, the heat dissipation efficiency is improved, when a certain layer of annular flow channels 51 are blocked, the heat dissipation efficiency of the circulating structure is only reduced, the working state of the circulating structure is not changed, the risk of blocking is greatly reduced, the use stability of the cold disc is enhanced, and the service life of the cold disc is prolonged; the provision of the blocking pin 54 achieves a further improvement in the efficiency of heat conduction of the liquid therein at a lower cost.
As shown in fig. 4 and 5, the water inlet 52 and the water outlet 53 are designed at intervals, the water inlet 52 is arranged on the rotating shaft 7, a flow channel is arranged in the rotating shaft 7 and used for conveying the liquid in the previous working unit into the circulating mechanism 5 to radiate the heat conducting layer 4, the water outlet 53 is arranged on the heat radiating plate 6, the liquid enters the heat radiating plate 6 through the water outlet 53 to radiate and cool after being absorbed by the circulating mechanism 5, and then is input into the rotating shaft 7 and input into the next working unit to finish recycling; the water outlet 53 and the water inlet 52 are arranged at intervals, so that the circulating flow speed of the liquid in the annular flow channel 51 can be higher, the water flow stroke is reduced to avoid the problem of blockage, and the liquid is divided into two water flows to flow in two directions after being input through the water inlet 52 in the annular flow channel 51, so that the circulation efficiency is improved; the heat dissipation efficiency can be improved and the blocking risk is reduced through the interval design of the water inlet 52 and the water outlet 53.
As shown in fig. 6, the blocking pin 54 is provided as a cylinder with a spiral groove 58, and the groove can be formed by integral casting, and the blocking pin 54 is difficult to cut due to smaller volume and greater difficulty in cutting; the liquid, when passing the blocking pin 54, will change its direction of movement irregularly due to the presence of the helical groove 58, which will change its movement state into turbulence. In the working process, liquid enters the annular flow passage 51 through the water inlet 52, and when passing through the blocking pin 54, the liquid is changed in motion state by the spiral groove 58, so that the liquid is converted into a turbulent state, and the heat transfer efficiency of the liquid is improved. By designing the spiral grooves 58 on the blocking pins 54, the movement state of the liquid in the annular flow channel 51 can be further changed, and the reynolds coefficient of the liquid is increased to change into a turbulent state, so that better heat conduction efficiency is realized, and the heat dissipation effect on the heat conducting layer 4 is improved.
As shown in fig. 3 and 7, the rotating shaft 7 is communicated with a flow passage formed in the heat dissipation plate 6, and the heat dissipation plate 6 is provided with a heat dissipation flow passage 61; the heat dissipation flow channel 61 is arranged in an S shape to obtain a larger air contact area, and the design of the flow channel arranged in the S shape can realize the larger air contact area as far as possible in a limited space, so that the gas is utilized to realize the rapid cooling and heat dissipation of liquid, and the temperature of the liquid entering the next working unit is ensured to be lower, thereby ensuring the cooling effect; the rapid cooling of the liquid in the heat dissipation flow channel 61 is realized by air circulation in the air channel, the upper end of the heat dissipation flow channel 61 is communicated with the water outlet 53, and the lower end of the heat transfer flow channel is communicated with the inside of the rotating shaft 7.
When the heat radiation work starts, liquid enters the water supply flow channel 71 in the rotating shaft 7 and is input into the circulation mechanism 5, the heat absorption and the temperature reduction of the heat conduction layer 4 are realized in the circulation mechanism 5, then the liquid is discharged to the heat radiation flow channel 61 in the heat radiation plate 6 from the water outlet 53, the temperature reduction is realized through the air flow in the heat radiation plate 6, and then the liquid is discharged to the rotating block 73 through the water collection flow channel 72 and then enters the next working unit for recycling.
The cooling and cooling of the heat conduction layer 4 can be realized by rapidly transferring low-temperature liquid into the circulating mechanism 5 through the water supply pipeline designed in the rotating shaft 7, and the heat dissipation flow channel 61 is designed to cool the liquid which is heated by heat absorption, so that the temperature of the liquid entering each working unit is lower, the whole heat dissipation of the cold disc can be ensured to have no dead angle, and the heat dissipation effect is uniform and stable.
As shown in fig. 8, 9 and 10, the fixing mechanism 8 comprises a fixing ring 81, an air inlet 82, an air outlet 83, an air flow passage 84, a limiting block 85, a control plate 86, a balance shaft 87 and an air nozzle 88, wherein the fixing ring 81 is fixedly arranged on a circle of a heating layer, the fixing ring 81 is used for controlling air circulation and cleaning air above a cold plate, the air inlet 82 and the air outlet 83 are arranged on two sides of the fixing ring 81, the air inlet 82 and the air outlet are used for facilitating air circulation, the air flow passage 84 is arranged above the air inlet 82, a processing mode is set as laser cutting, the limiting block 85 is fixedly arranged at the upper end inside the air flow passage 84, the limiting block 85 is used for limiting the position of the control plate 86 so as to ensure that the control plate 86 is horizontally arranged and inclined by a certain angle during working, the mounting mode is set as bonding, the balance shaft 87 is fixedly arranged in the air flow passage 84 at the middle position of the limiting block 85, the balance shaft 87 is used for rotating so as to drive the cooling plate to cool, the mounting mode is set as bonding, and the control plate 86 is rotationally arranged on the balance shaft 87. The control plate 86 is used for temporarily blocking the air path of the air inlet 82 when the side surface of the heat dissipation plate 6 rotates, so that the internal pressure of the air flow channel 84 can be rapidly increased, and the control plate 86 overcomes the gravity of the control plate and completes rotation at a certain angle under the support of the limiting block 85, so that the air flow channel 84 is periodically opened, and air is injected to the outside of the cold tray through the air injection port 88 to remove scraps; the limiting block 85 is provided with two, wherein the working and non-working states of the control piece 86 are limited respectively.
During the operation of the fixing mechanism 8, gas enters the fixing ring 81 from the gas inlet 82 and then enters the cavity, the heat dissipation plate 6 is pushed to drive the rotation shaft 7 to rotate, and the gas is discharged from the gas outlet 83 to enter the gas inlet 82 of the next working unit. The air pressure in the air channel is changed through the rotation of the heat radiation plate 6 to push the control plate 86 of the air channel 84 so as to realize periodical air injection, thereby cleaning scraps possibly generated in the processing process in the equipment; on one hand, the modularized heat dissipation is carried out on the liquid by utilizing gas circulation, the liquid temperature in each working unit is guaranteed to be equal, and on the other hand, the gas flow channel 84 is arranged to carry out jet cleaning on the inside of the equipment which cannot be subjected to water spraying cleaning.
As shown in fig. 10, 11 and 12, the control piece 86 is made of a material with no density along two sides of the rotating shaft 7, in a horizontal state, the control block relies on downward gravity and a limiting block 85 which are received by half of a larger density to horizontally limit the control piece, and the control piece cooperates with a sealing rubber ring to realize a relatively sealed environment, so that the friction force of the sealing rubber ring can be increased, and the sprayed gas pressure is higher, and the cleaning capability is stronger.
The air flow channel 84 is kept in a normal state, only when the heat radiation plate 6 rotates to the air inlet 82, the air inlet 82 is blocked, air can enter the air flow channel 84 upwards, after being pressurized for a short time, the air pressure in the air flow channel 84 is increased, the gravity is overcome to push the control plate 86 upwards to realize the opening of the air flow channel, and the air is sprayed to the equipment on the cold plate for cleaning; when the heat radiation plate 6 rotates for a certain angle, the air inlet 82 is not blocked, and the control plate 86 is reset under the action of gravity, so that periodic jet gas cleaning is realized. By providing control tabs 86 of different densities, a transition between the horizontal state and the operating state is achieved; realize opening fast and closing, gas injection pressure is great to realize better clearance effect.
As shown in fig. 1 and 3, the number of the heat dissipation plates 6 is 3, a relatively sealed space is formed between every two adjacent heat dissipation plates 6 and the fixing mechanism 8, in the sealed space, the air inlet 82 carries air to the heat dissipation plates to increase the internal air pressure, the generated thrust can push the heat dissipation plates 6 to move forwards in a unidirectional way until the air inlet 82 is the same as the next sealed space, and the continuous pushing of the heat dissipation plates 6 is realized in a circulating way.
The rotation of the heat sink 6 carries out gas transportation to the inside by the gas inlet 82, so that the pressure in a sealed space formed by two adjacent heat sinks 6 and the fixing mechanism 8 is increased, and the generated thrust forces the heat sink 6 to push forward, and then the gas is discharged when passing through the gas outlet 83.
The continuous rotation of the circulating mechanism 5 is realized through the design of the heat radiation plate 6 and the air outlet 83 so as to ensure that the heat radiation work of the heat conduction layer 4 is as uniform as possible without dead angles, and the temperature consistency on the cold plate is ensured.
When the cooling device is used, liquid enters the rotating shaft 7 of one working unit from the water through hole 3 of the cooling disc, flows in the water supply flow passage 71 formed in the rotating shaft 7 and enters the circulating mechanism 5 through the water inlet 52, the circulating mechanism 5 is filled with the whole annular flow passage 51 to rapidly dissipate heat of the upper heat conducting layer 4 and then is discharged from the water outlet 53 to enter the heat dissipation flow passage 61 in the heat dissipation plate 6, the cooling of the liquid in the heat dissipation flow passage 61 is realized through air circulation, and the temperature of the liquid flowing to the water collecting flow passage 72 approaches to the initial temperature so as to ensure that the liquid temperature of each working unit is consistent. The gas enters from the gas inlet 82, and is pressurized in the sealing space formed between the fixed ring 81 and the two adjacent heat dissipation plates 6 to push the fixed ring to rotate forwards, so that the circulation mechanism 5 is driven to rotate to ensure the heat dissipation effect; when the side of the heat radiation plate 6 blocks the air inlet 82, air is introduced into the air flow channel 84 to push up the control plate against gravity to form a passage to quickly spray a large amount of air into the interior of the equipment to finish cleaning. The gas and liquid used in the cold plate can be recycled to perform the functions of cooling, heat dissipation and cleaning again in the next working unit.
It should be understood that, in various embodiments of the present application, the size of the sequence number of each process does not mean that the execution sequence of each process should be determined by its functions and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.
Claims (8)
1. The utility model provides a semiconductor grade vacuum multilayer cold plate, includes cold plate main part (1), air vent (2) and water inlet (3), cold plate main part (1) are mainly used for carrying out heat dissipation and accuse temperature in the semiconductor processing equipment, air vent (2) and water inlet (3) are seted up on cold plate main part (1), are used for carrying out the filling of gas and the cyclic utilization of liquid to cold plate inside;
the cooling disc is characterized in that a plurality of working units are arranged in the cooling disc main body (1), the working units are of a multilayer structure with upper heat conduction and lower heat dissipation, the uppermost layer of the working units is provided with a heat conduction layer (4), and the heat conduction layer (4) rapidly transfers heat to the working units from a high-temperature environment outside the working units according to a second law principle of thermodynamics and rapidly flows through liquid with high specific heat capacity to realize the removal of a large amount of heat; a fixing mechanism (8) is fixedly arranged below the heat conducting layer (4) for a circle, and the fixing mechanism (8) is tightly matched with the heat conducting layer (4) to form a sealing space for gas movement; a circulating mechanism (5) is fixedly arranged right below the heat conducting layer (4), a waterway is arranged in the circulating mechanism (5) so as to realize water cooling and heat dissipation of the heat conducting layer (4), and the waterway is processed firstly and then the manufacturing process of aluminum alloy vacuum brazing is carried out face to face so as to ensure the internal tightness; the utility model discloses a heat dissipation device, including circulation mechanism (5), annular array and rotation axis, circulation mechanism (5) are including annular array fixed mounting has heating panel (6) below, heating panel (6) side fixed mounting has axis of rotation (7), thereby the gas promotion of axis of rotation (7) in the gas circuit heating panel (6) thereby drive circulation mechanism (5) rotate and realize more even efficient radiating effect.
2. The semiconductor grade vacuum multi-layer cold plate of claim 1, wherein: the circulating mechanism (5) comprises an annular flow passage (51), a water inlet (52), a water outlet (53) and a blocking pin (54); the annular flow passage (51) is of a multi-layer structure from inside to outside, the water inlet (52) and the water outlet (53) are formed in the annular flow passage (51), and the function of the annular flow passage is that the water inlet (52) inputs liquid and discharges the liquid from the water outlet (53) after passing through the annular flow passage (51); the blocking pin (54) is fixedly arranged on the annular flow passage (51), the position of the blocking pin is particularly arranged between the water outlet (53) and the water inlet (52), and the blocking pin (54) is used for breaking laminar flow formed by liquid flowing from the water inlet (52) to the water outlet (53), so that the heat transfer efficiency of the liquid is improved.
3. The semiconductor grade vacuum multi-layer cold plate of claim 2, wherein: the water inlet (52) and the water outlet (53) are arranged at intervals, so that the circulating flow speed of the liquid in the water inlet is higher, and the water flow stroke is reduced to avoid the problem of blockage; the rotating shaft (7) is tightly matched with the water inlet (52) to enable liquid to pass through the annular flow channel (51) and then to be discharged into the heat dissipation plate (6) through the water outlet (53), and the liquid returns to the rotating shaft (7) again to convey the next working unit after being cooled.
4. A semiconductor grade vacuum multi-layer cold plate as claimed in claim 3, wherein: the blocking pin (54) is a cylinder provided with a spiral groove, and the blocking pin (54) changes the liquid in the annular flow passage (51) into a turbulent motion state so as to achieve better heat transfer efficiency of the liquid.
5. The semiconductor grade vacuum multi-layer cold plate of claim 4, wherein: the rotating shaft (7) is communicated with a flow passage formed in the radiating plate (6), the radiating plate (6) is provided with a radiating flow passage (61), the radiating flow passage (61) is S-shaped to obtain a larger air contact area, the rapid cooling of liquid in the radiating flow passage (61) is realized through air circulation in an air passage, the upper end of the radiating flow passage (61) is communicated with the water outlet (53), and the lower end of the radiating flow passage (61) is communicated with the inside of the rotating shaft (7); the rotary shaft (7) is provided with a water supply flow passage (71), the water supply flow passage (71) is communicated with the water inlet (52), liquid enters the water inlet (52) through the water supply flow passage (71) to realize low-temperature liquid supply to the annular flow passage (51), the lower end of the rotary shaft (7) is provided with a water collecting flow passage (72), and the water collecting flow passage (72) is used for collecting and discharging liquid in the heat dissipation plate (6) and then enabling the liquid to enter the next working unit for reuse.
6. The semiconductor grade vacuum multi-layer cold plate of claim 5, wherein: the fixing mechanism (8) comprises a fixing ring (81), an air inlet (82), an air outlet (83), a gas flow channel (84), a limiting block (85) and a control plate (86), wherein the fixing ring (81) is fixedly installed on the heat conducting layer (4) for a circle, the air inlet (82) and the air outlet (83) are formed in two sides of the fixing ring (81), the gas flow channel (84) is formed above the air inlet (82), the limiting block (85) is fixedly installed at the upper end inside the gas flow channel (84), the rotating shaft (7) is fixedly installed in the gas flow channel (84) at the middle position of the limiting block (85), and the control plate (86) is rotatably installed on the rotating shaft (7); the control piece (86) is used for temporarily blocking the air passage of the air inlet (82) when the side surface of the heat radiation plate (6) rotates, and the internal pressure of the air flow channel (84) can be rapidly increased so that the control piece (86) overcomes the gravity of the control piece and completes rotation at a certain angle under the support of the limiting block (85), and the air flow channel (84) is periodically opened to enable air to jet outside the cold disc main body (1) to remove scraps.
7. The semiconductor grade vacuum multi-layer cold plate of claim 6, wherein: the control piece (86) is made of materials without density along two sides of the rotating shaft (7), rubber rings used for enhancing sealing effect are further arranged around the control piece, the control piece (86) is in a horizontal state under the supporting cooperation of the limiting block (85) when the control piece is not in operation, the side face of the cooling plate (6) blocks the air inlet (82) to the fixing mechanism (8) when the air is conveyed inside, the air pressure below the control piece (86) is increased, the horizontal state is damaged, and the effect of outwards exhausting is achieved by overcoming the gravity rotation of the control piece (86).
8. The semiconductor grade vacuum multi-layer cold plate of claim 7, wherein: the heat dissipation plates (6) are arranged in a plurality, the air inlets (82) pressurize the airtight space formed by every two heat dissipation plates (6) and the fixing mechanism (8) to enable the airtight space to rotate, so that the circulation mechanism (5) is driven to rotate, the heat dissipation efficiency is reduced due to the fact that the temperature of a certain area is too high, and uniform heat dissipation outside the cold plate is achieved.
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