CN117024844A - Method for treating resin package by electric excitation xenon irradiation - Google Patents
Method for treating resin package by electric excitation xenon irradiation Download PDFInfo
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- CN117024844A CN117024844A CN202311027290.4A CN202311027290A CN117024844A CN 117024844 A CN117024844 A CN 117024844A CN 202311027290 A CN202311027290 A CN 202311027290A CN 117024844 A CN117024844 A CN 117024844A
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- Prior art keywords
- xenon lamp
- light
- resin
- resin package
- material layer
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- 239000011347 resin Substances 0.000 title claims abstract description 101
- 229920005989 resin Polymers 0.000 title claims abstract description 101
- 229910052724 xenon Inorganic materials 0.000 title claims abstract description 98
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 title claims abstract description 97
- 238000000034 method Methods 0.000 title claims abstract description 30
- 230000005284 excitation Effects 0.000 title abstract description 8
- 239000000463 material Substances 0.000 claims abstract description 33
- 230000005855 radiation Effects 0.000 claims abstract description 10
- 238000005538 encapsulation Methods 0.000 claims description 9
- 239000011358 absorbing material Substances 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 5
- 230000007246 mechanism Effects 0.000 claims description 5
- 230000001960 triggered effect Effects 0.000 claims description 5
- 238000000926 separation method Methods 0.000 abstract description 9
- 230000008901 benefit Effects 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 5
- 239000005022 packaging material Substances 0.000 abstract description 5
- 230000031700 light absorption Effects 0.000 abstract description 3
- 239000007788 liquid Substances 0.000 abstract description 3
- 230000005540 biological transmission Effects 0.000 abstract description 2
- 239000002894 chemical waste Substances 0.000 abstract description 2
- 238000009826 distribution Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000002313 adhesive film Substances 0.000 description 3
- 239000006059 cover glass Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000004925 denaturation Methods 0.000 description 2
- 230000036425 denaturation Effects 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011978 dissolution method Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J11/00—Recovery or working-up of waste materials
- C08J11/04—Recovery or working-up of waste materials of polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
- C08J2323/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
- C08J2323/04—Homopolymers or copolymers of ethene
- C08J2323/08—Copolymers of ethene
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
Abstract
The invention discloses a method for treating a resin package by electric excitation xenon irradiation, which comprises the following steps: placing the cleaned resin package below the xenon lamp, and enabling the light-transmitting material layer to face upwards; adjusting the distance between the xenon lamp and the resin packaging material, exciting xenon gas through high-voltage electric shock, triggering the xenon lamp to generate light radiation to irradiate the resin packaging material, and enabling light and energy released by irradiation to reach the light absorption material layer through the light transmission material layer; the resin enters a molten state after absorbing energy released by light, and the mechanical properties of the resin are destroyed, so that each material layer of the resin package is separated by a physical stripping means. The method can realize the separation effect of different material layers of the resin package on the premise of short time, low noise and no chemical waste liquid. The method can quickly realize the separation treatment of the resin package, has the advantage of high efficiency and no secondary pollution in the field of disassembly of the resin package, and avoids the problem of secondary treatment.
Description
Technical Field
The invention relates to the technical field of comprehensive utilization of resource recovery, in particular to a method for treating a resin package by irradiation of electric excitation xenon.
Background
Resins are generally organic polymers that have a softening or melting range after heating, and that have a tendency to flow under external forces during softening, and that are solid or semi-solid at ordinary temperatures. The resin can be used as an adhesive and a cementing agent; can be used for packaging articles, manufacturing plastics and coatings; can also play a role in decoration and protection.
With the advancement of modernization, in the electronics industry, resins are often used to encapsulate microelectronic devices, circuit boards, and different materials are also bonded with resins. The need for recycling of the materials of the article often arises after the use of the package, adhesive, is completed. At present, the treatment modes of the recycled resin package or the resin adhesive mainly comprise a solvent dissolution method, a heat treatment method, a mechanical separation method and the like, and each technology has the defects, and the solvent method can generate waste liquid which is difficult to treat; most of mechanical separation methods abrade resin and other materials into small particles, and then purify and separate the particles, so that the purity of each recovered component is low; the heat treatment process inevitably generates gas pollution. It is therefore necessary to develop efficient, environmentally friendly, low cost processes.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems in the related art to some extent.
To this end, an embodiment of the present invention proposes a method of treating a resin package by irradiation of an electro-xenon gas.
The invention provides a method for treating a resin package by irradiation of electric excitation xenon, which comprises the following steps:
(1) Placing the cleaned resin package below the xenon lamp and enabling the light-transmitting material layer to face upwards, wherein the resin package comprises at least one light-transmitting material layer and at least one light-absorbing material layer which are bonded and packaged together by resin;
(2) Adjusting the distance between the xenon lamp and the resin encapsulation, exciting xenon gas through high-voltage electric shock, triggering the xenon lamp to generate light radiation to irradiate the resin encapsulation, and enabling light and energy released by irradiation to pass through the light-transmitting material layer to reach the light-absorbing material layer, wherein the wave band of the xenon lamp is 150-2000nm;
(3) The resin enters a molten state after absorbing energy released by light, and the mechanical properties of the resin are destroyed, so that each material layer of the resin package is separated by a physical stripping means.
In some embodiments, the wavelength bands of the xenon lamp include ultraviolet, visible, and infrared wavelength bands.
In some embodiments, the time for triggering the xenon lamp to generate the optical radiation to irradiate the resin package in the step (2) is less than 900ms.
In some embodiments, after triggering the xenon lamp to generate the optical radiation to irradiate the resin package in the step (2), the temperature of the resin package is increased by at least 150 ℃.
In some embodiments, the xenon lamp in step (2) is within 10cm of the resin encapsulation.
In some embodiments, the xenon lamp is over-voltage triggered.
In some embodiments, the xenon lamp is one or a combination of a straight tube xenon lamp, a U-shaped xenon lamp, a spiral xenon lamp, a disc-shaped xenon lamp.
In some embodiments, the xenon lamp source releases energy uniformly across the resin encapsulant using a combination of one or more of a light guide post, a light guide plate, or a light source reflective mask.
In some embodiments, the xenon lamp after the completion of the flash is cooled using a cooling mechanism.
Compared with the prior art, the invention has the beneficial effects that:
the method can realize the separation effect of different material layers of the resin package on the premise of short time, low noise and no chemical waste liquid.
The method can quickly realize the separation treatment of the resin package, has the advantage of high efficiency and no secondary pollution in the field of disassembly of the resin package, and avoids the problem of secondary treatment.
Drawings
The foregoing and/or additional aspects and advantages of the invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:
FIG. 1 is a flow chart of a method for treating a resin package by electric excitation xenon irradiation according to the present invention.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present invention and should not be construed as limiting the invention.
A method of treating a resin package by irradiation of electric xenon according to an embodiment of the present invention will be described below with reference to the accompanying drawings.
As shown in fig. 1, the method for treating the resin package by the electric excitation xenon irradiation of the present invention comprises the steps of:
(1) Placing the cleaned resin package below the xenon lamp, and enabling the light-transmitting material layer to face upwards;
(2) Adjusting the distance between the xenon lamp and the resin packaging material, exciting xenon gas through high-voltage electric shock, triggering the xenon lamp to generate light radiation to irradiate the resin packaging material, and enabling light and energy released by irradiation to reach the light absorption material layer through the light transmission material layer;
(3) The resin enters a molten state after absorbing energy released by light, and the mechanical properties of the resin are destroyed, so that each material layer of the resin package is separated by a physical stripping means.
The resin package comprises at least one light-transmitting material layer and at least one light-absorbing material layer which are bonded and encapsulated together by resin, i.e. the resin package is composed of the light-transmitting material layer, the resin, the light-absorbing material layer and other materials. The light-transmitting material layer faces upwards, so that the light emitted by the xenon lamp can irradiate through the light-transmitting material layer. In addition, the cleaning process of the resin package can remove dust and dirt of the resin package, so that the subsequent xenon lamp irradiation effect is enhanced.
The method for treating the electric-induced xenon irradiation, which is used in the invention, starts to decompose after irradiation from the aspect of resin property change of the resin encapsulation, changes viscosity, and finally separates materials of the encapsulation by a physical stripping means.
The xenon lamp is an electric light source which emits light by utilizing xenon discharge, the emitted light is in a continuous spectrum, and the energy distribution is from 200nm to 2000nm, namely, the energy output from ultraviolet light to infrared light is uninterrupted, and the energy distribution characteristics of the xenon lamp are very similar to the energy distribution characteristics of solar spectrum. Compared with the existing xenon lamp, the xenon lamp has the advantages that the wave band of the 150-200nm part is increased, and accordingly the energy of the xenon lamp in the ultraviolet wave band is increased. The wave bands of the xenon lamp comprise an ultraviolet wave band, a visible light wave band and an infrared light wave band, wherein the ultraviolet wave band can promote resin to be changed in quality, so that the breaking of a C-O, C =C bond of the resin is quickened, and the visible light wave band and the infrared light wave band can increase the energy released by the xenon lamp, so that the light absorption layer material receives larger energy, and the resin is changed in quality, thereby achieving the separation purpose.
The time for triggering the xenon lamp to generate light radiation to irradiate the resin package is within 900ms, and the xenon lamp used in the invention accelerates the denaturation of the resin and reduces the irradiation time. The irradiation time is short, and the energy consumption is lower, namely the irradiation of the resin packaging material is completed in a shorter time, so that the resin is denatured and the viscosity losing speed is increased.
After the xenon lamp is triggered to generate light radiation to irradiate the resin package, the temperature of the resin package is raised by at least 150 ℃. The xenon lamp irradiation disclosed by the invention has the advantages that the energy released by the xenon lamp irradiation is larger, so that the resin package can be lifted to a higher temperature in a short time, the denaturation of the resin is accelerated, and the energy consumption is saved.
When the resin package is irradiated, the vertical distance between the xenon lamp and the resin package needs to be kept within 10cm, if the distance is too far, the light irradiated on the main body of the resin package by the light source is gradually reduced, the light irradiated on the environment is increased, and if the distance is too close, the non-uniformity of the distribution of the released energy is improved, and the separation effect of materials of the resin package is affected.
The xenon lamp used in the invention needs to adopt an overvoltage triggering mode, which is different from the conventional modes such as direct current precombustion or external triggering. The xenon lamp needs larger working voltage to trigger, a conventional trigger discharge switch is omitted, and meanwhile, the xenon lamp is used as a basis for the design of an integrated process.
The xenon lamp is one or a combination of a plurality of straight-tube xenon lamps, U-shaped xenon lamps, spiral xenon lamps and disc-shaped xenon lamps, and is selected according to specific situations in practical application.
The xenon lamp needs to use any one or a plurality of combinations of a light guide column, a light guide plate or a light source reflecting mask, so that the energy non-uniformity released by the light source on the resin package can not influence the separation effect of materials.
And a cooling mechanism of the xenon lamp system is connected with the xenon lamp triggering condition, and the cooling mechanism pauses when the xenon lamp is triggered, and the cooling mechanism starts to operate after the flash of the xenon lamp is finished to cool the lamp tube.
The method of treating a resin package by irradiation of xenon under electric excitation according to the present invention will be described with reference to specific examples.
Example 1:
the cleaned resin package is placed under a xenon lamp with its light-transmitting material layer facing upwards. The xenon lamp of the embodiment is a straight-tube xenon lamp, and the light guide plate is utilized to make the energy released by the xenon lamp light source on the resin package uniform.
The resin package is sent into a xenon lamp irradiation treatment system with the wave band of 150-2000nm, the distance between the resin package and the xenon lamp is adjusted to 8cm, and the xenon lamp irradiation system is started and irradiates the resin package for 900ms.
After the irradiation is completed, the resin package is taken out, and the layers of the resin package are separated by physical peeling.
Example 2:
the resin package comprises cover glass, an EVA adhesive film, a crystal silicon wafer, an EVA adhesive film and a back plate which are sequentially arranged up and down. The cleaned resin package was placed under a xenon lamp with its cover glass facing upward. The xenon lamp of the embodiment is a combination of a spiral xenon lamp and a disc-shaped xenon lamp, and the energy released by the xenon lamp light source on the resin package is uniform by utilizing the light guide column and the light source reflecting mask.
The resin package is sent into a xenon lamp irradiation treatment system with the wave band of 180-2000nm, the distance between the resin package and the xenon lamp is adjusted to 6cm, and the xenon lamp irradiation system is started and irradiates the resin package for 750ms.
And after the irradiation is finished, taking out the resin package, and separating the cover glass, the EVA adhesive film, the crystal silicon wafer and the back plate of the resin package respectively through physical stripping.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms may be directed to different embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the invention, the scope of which is defined by the claims and their equivalents.
Claims (9)
1. A method for treating a resin package by electric xenon irradiation, comprising the steps of:
(1) Placing the cleaned resin package below the xenon lamp and enabling the light-transmitting material layer to face upwards, wherein the resin package comprises at least one light-transmitting material layer and at least one light-absorbing material layer which are bonded and packaged together by resin;
(2) Adjusting the distance between the xenon lamp and the resin encapsulation, exciting xenon gas through high-voltage electric shock, triggering the xenon lamp to generate light radiation to irradiate the resin encapsulation, and enabling light and energy released by irradiation to pass through the light-transmitting material layer to reach the light-absorbing material layer, wherein the wave band of the xenon lamp is 150-2000nm;
(3) The resin enters a molten state after absorbing energy released by light, and the mechanical properties of the resin are destroyed, so that each material layer of the resin package is separated by a physical stripping means.
2. The method of claim 1, wherein the wavelength bands of the xenon lamp comprise an ultraviolet wavelength band, a visible wavelength band, and an infrared wavelength band.
3. The method of claim 1, wherein the step (2) is performed for a time within 900ms when the xenon lamp is triggered to generate the light radiation to irradiate the resin package.
4. The method of claim 1, wherein the temperature of the resin package is increased by at least 150 ℃ after the irradiation of the resin package with the light radiation generated by the xenon lamp in step (2).
5. The method of claim 1, wherein the xenon lamp in step (2) is within 10cm of the resin encapsulation.
6. The method of claim 1, wherein the xenon lamp is over-voltage triggered.
7. The method of claim 1, wherein the xenon lamp is one or a combination of straight tube xenon lamp, U-shaped xenon lamp, spiral xenon lamp, disc-shaped xenon lamp.
8. The method of claim 1, wherein the xenon lamp light source is configured to release uniform energy on the resin encapsulation using a combination of one or more of a light guide column, a light guide plate, or a light source reflective mask.
9. The method of claim 1 wherein the xenon lamp after completion of the flash is cooled by a cooling mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311027290.4A CN117024844A (en) | 2023-08-15 | 2023-08-15 | Method for treating resin package by electric excitation xenon irradiation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311027290.4A CN117024844A (en) | 2023-08-15 | 2023-08-15 | Method for treating resin package by electric excitation xenon irradiation |
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| Publication Number | Publication Date |
|---|---|
| CN117024844A true CN117024844A (en) | 2023-11-10 |
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| CN202311027290.4A Pending CN117024844A (en) | 2023-08-15 | 2023-08-15 | Method for treating resin package by electric excitation xenon irradiation |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111439806A (en) * | 2019-04-10 | 2020-07-24 | 中国科学院北京综合研究中心 | Method for rapidly controlling algae in water body by using intensive pulse light |
| CN112543528A (en) * | 2020-12-17 | 2021-03-23 | 中电科仪器仪表(安徽)有限公司 | Xenon lamp triggering device and control method |
| CN114364077A (en) * | 2021-12-30 | 2022-04-15 | 南京驭领科技有限公司 | Pulse xenon lamp ultraviolet disinfection lamp driving circuit and control method thereof |
| CN115446073A (en) * | 2022-09-02 | 2022-12-09 | 重庆远达烟气治理特许经营有限公司科技分公司 | Process and device for separating photovoltaic modules |
| CN115446092A (en) * | 2022-09-02 | 2022-12-09 | 重庆远达烟气治理特许经营有限公司科技分公司 | Laminate irradiation treatment system and method |
-
2023
- 2023-08-15 CN CN202311027290.4A patent/CN117024844A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111439806A (en) * | 2019-04-10 | 2020-07-24 | 中国科学院北京综合研究中心 | Method for rapidly controlling algae in water body by using intensive pulse light |
| CN112543528A (en) * | 2020-12-17 | 2021-03-23 | 中电科仪器仪表(安徽)有限公司 | Xenon lamp triggering device and control method |
| CN114364077A (en) * | 2021-12-30 | 2022-04-15 | 南京驭领科技有限公司 | Pulse xenon lamp ultraviolet disinfection lamp driving circuit and control method thereof |
| CN115446073A (en) * | 2022-09-02 | 2022-12-09 | 重庆远达烟气治理特许经营有限公司科技分公司 | Process and device for separating photovoltaic modules |
| CN115446092A (en) * | 2022-09-02 | 2022-12-09 | 重庆远达烟气治理特许经营有限公司科技分公司 | Laminate irradiation treatment system and method |
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