CN117019847A - Solid state disk physical destruction method and solid state disk - Google Patents
Solid state disk physical destruction method and solid state disk Download PDFInfo
- Publication number
- CN117019847A CN117019847A CN202311292318.7A CN202311292318A CN117019847A CN 117019847 A CN117019847 A CN 117019847A CN 202311292318 A CN202311292318 A CN 202311292318A CN 117019847 A CN117019847 A CN 117019847A
- Authority
- CN
- China
- Prior art keywords
- destroying
- chip
- destruction
- destroyed
- solid state
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000006378 damage Effects 0.000 title claims abstract description 170
- 239000007787 solid Substances 0.000 title claims abstract description 130
- 238000000034 method Methods 0.000 title claims abstract description 58
- 238000010586 diagram Methods 0.000 description 8
- 238000011144 upstream manufacturing Methods 0.000 description 7
- 238000001514 detection method Methods 0.000 description 6
- 238000012545 processing Methods 0.000 description 3
- 238000013500 data storage Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
- B09B5/00—Operations not covered by a single other subclass or by a single other group in this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
- B09B2101/00—Type of solid waste
- B09B2101/15—Electronic waste
Landscapes
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Storage Device Security (AREA)
Abstract
The invention discloses a solid state disk physical destruction method and a solid state disk, comprising the following steps: under the condition that a destroying indication signal meeting a preset non-false touch condition is received, grouping all chips in the solid state disk to obtain all chip groups to be destroyed and destroying sequences of all chip groups to be destroyed, wherein the chip groups to be destroyed comprise at least one chip, and each chip has a corresponding protection module; invoking each protection module to process the received external input power supply to obtain a destruction power supply output by each protection module; destroying each chip group to be destroyed one by one, thereby completing the destruction of the solid state disk. By grouping and destroying all chips in the solid state disk, the situation that the chips are destroyed incompletely due to the fact that the power required for destroying all the chips simultaneously is larger than the power of an input power supply for destroying the solid state disk is avoided, and the situation that data leakage is caused by the fact that the chips are destroyed incompletely is avoided.
Description
Technical Field
The invention relates to the technical field of computer information security, in particular to a solid state disk physical destruction method and a solid state disk.
Background
Before the solid state disk is the most common device for storing data, along with the wide application of the solid state disk, the solid state disk starts to store a large amount of important data of users. Under some special application scenes, the data in the solid state disk is required to be destroyed, and the solid state disk can be destroyed to achieve the aim of destroying the data.
When destroying the solid state disk, generally, a power supply is input to the solid state disk, then the power supply is used for destroying all chips in the solid state disk, and the traditional destroying scheme can cause that the power of the input power supply can not meet the power required when all the chips are destroyed simultaneously, so that all the chips can not be destroyed thoroughly, and data in the solid state disk is leaked.
Disclosure of Invention
In view of the above, by applying the scheme provided by the embodiment of the invention, each chip in the solid state disk can be destroyed in batches by taking the group as a unit, so that the power required for destroying the chip each time can be ensured to be smaller than the power consumption of an input power supply for destroying the solid state disk, the chip can be ensured to be thoroughly destroyed each time, and the data leakage in the solid state disk is avoided.
In order to achieve the above object, the embodiment of the present invention provides the following technical solutions:
a solid state disk physical destruction method comprises the following steps:
under the condition that a destroying indication signal meeting a preset non-false touch condition is received, grouping all chips in the solid state disk based on a preset destroying strategy to obtain all chip groups to be destroyed and destroying sequences of all the chip groups to be destroyed, wherein the chip groups to be destroyed comprise at least one chip, and each chip has a corresponding protection module;
invoking each protection module to process the received external input power supply to obtain a destruction power supply output by each protection module;
determining the chip set to be destroyed with the first destroying sequence as a target chip set based on the destroying sequence of each chip set to be destroyed;
determining each protection module corresponding to the target chipset as a target protection module;
destroying a chip corresponding to the destroying power supply output by each target protection module;
and determining the chip set to be destroyed, which is positioned at the later position of the target chip set in the destruction sequence, as a new target chip set, and returning to the step of determining each protection module corresponding to the target chip set as a target protection module until all chips are destroyed.
The method, optionally, further comprises:
receiving a destruction indication signal;
determining the signal type of the destruction indication signal;
determining whether the destruction indication signal meets a destruction trigger condition of the signal type;
when the destroying indication signal is determined to meet the destroying trigger condition of the signal type, determining that the destroying indication signal meets the non-false touch condition.
The method, optionally, wherein determining whether the destruction indication signal meets the destruction trigger condition of the signal type includes:
when the signal type of the destruction indication signal is a level type, determining whether the duration of the destruction indication signal is greater than or equal to a preset first duration;
when the duration time of the destroying indication signal is determined to be longer than or equal to the first duration time, determining that the destroying indication signal meets the destroying trigger condition of the signal type; when the duration of the destroying indication signal is smaller than the first duration, determining that the destroying indication signal does not meet the destroying trigger condition of the signal type;
when the signal type of the destruction indication signal is a voltage type, determining whether the voltage value of the destruction indication signal is larger than or equal to a preset voltage, and determining whether the duration of the voltage value of the destruction indication signal, which is larger than or equal to the preset voltage, is larger than or equal to a preset second duration;
When the voltage value of the destruction indication signal is greater than or equal to a preset voltage and the time duration for which the voltage value of the destruction indication signal is greater than or equal to the preset voltage is greater than or equal to the second time duration, determining that the destruction indication signal meets the destruction trigger condition of the signal type; otherwise, determining that the destruction indication signal does not meet the destruction trigger condition of the signal type.
According to the method, optionally, based on a preset destroying policy, each chip in the solid state disk is grouped to obtain each chip group to be destroyed and the destroying sequence of each chip group to be destroyed, including:
determining the received power of an external input power supply;
determining the number of chips in the solid state disk and the destruction power of each chip;
grouping the chips based on the power supply power and the destruction power to obtain chip groups to be destroyed, wherein the sum of the destruction power of the chips in each chip group to be destroyed is smaller than the power supply power;
and distributing a destroying sequence for each chip to be destroyed.
In the above method, optionally, the invoking each protection module to process the received external input power to obtain the destruction power output by each protection module includes:
And for each protection module, controlling the protection module to boost the external input power supply, so that the voltage of the boosted power supply is in a preset chip destruction voltage range, and performing current limiting treatment on the boosted power supply to obtain a destruction power supply.
In the above method, optionally, the destroying power source output by each target protection module is used to destroy a chip corresponding to the destroying power source, including:
and for each target protection module, controlling a power switch circuit connected with the target protection module to be in a passage state, so that a destroying power supply output by the target protection module is input into a chip corresponding to the target protection module through the power switch circuit to break down the chip.
The method, optionally, further comprises:
and generating destroying state information of each chip group to be destroyed based on destroying states of each chip group to be destroyed.
The method, optionally, further comprises:
and controlling the flashing state of a preset destroying state indicator lamp based on the physical destroying progress of the solid state disk.
A solid state disk comprising:
a destruction control unit and a chip unit;
The chip unit comprises a plurality of chip modules, wherein the chip modules comprise a protection module, a power switch circuit and a chip which are sequentially connected in series;
the destroying control unit is used for executing the solid state disk physical destroying method according to any one of claims 1-8.
The solid state disk described above further includes:
destroying the status indicator lamp;
the destroying status indicator lamp is used for indicating the physical destroying progress of the solid state disk.
The invention provides a solid state disk physical destruction method and a solid state disk, comprising the following steps: under the condition that a destroying indication signal meeting a preset non-false touch condition is received, grouping all chips in the solid state disk based on a preset destroying strategy to obtain all chip groups to be destroyed and destroying sequences of all chip groups to be destroyed, wherein the chip groups to be destroyed comprise at least one chip, and each chip has a corresponding protection module; invoking each protection module to process the received external input power supply to obtain a destruction power supply output by each protection module; determining the chip group to be destroyed with the first destroying sequence as a target chip group based on the destroying sequence of each chip group to be destroyed; determining each protection module corresponding to the target chipset as a target protection module; destroying the corresponding chip by using the destroying power supply output by each target protection module; and determining the chip set to be destroyed, which is positioned at the later position of the target chip set in the destruction sequence, as a new target chip set, and returning to the step of determining each protection module corresponding to the target chip set as a target protection module until all chips are destroyed. According to the invention, each chip in the solid state disk is destroyed in groups, so that the condition that the destruction of the chip is incomplete due to the fact that the power required for destroying all the chips is larger than the power of the power supply for destroying the solid state disk at the same time can be avoided, the chips are destroyed in batches, the power required for destroying the chips is smaller than the power of the power supply for destroying the solid state disk, and the chips in the solid state disk can be destroyed in batches, so that the solid state disk can be destroyed thoroughly, and data leakage is avoided.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present invention, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of a method for destroying solid state disk physically, which is provided by the embodiment of the invention;
FIG. 2 is a flowchart of a method for determining whether a received destruction indication signal satisfies a non-false touch condition according to an embodiment of the present invention;
fig. 3 is a flowchart of a method for grouping each chip in a solid state disk based on a preset destruction policy to obtain each chip group to be destroyed and a destruction sequence of each chip group to be destroyed according to the embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a solid state disk according to an embodiment of the present invention;
FIG. 5 is a timing chart of single-channel destroying control of a solid state disk according to an embodiment of the present invention;
FIG. 6 is a two-channel destroying control timing chart of a solid state disk according to an embodiment of the present invention;
Fig. 7 is a four-way destruction control timing chart of a solid state disk according to an embodiment of the present application.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
In the present disclosure, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The invention is operational with numerous general purpose or special purpose computing device environments or configurations. For example: personal computers, server computers, hand-held or portable devices, tablet devices, multiprocessor devices, distributed computing environments that include any of the above devices or devices, and the like. The invention can be applied to the solid state disk, and the solid state disk can be arranged on a computer terminal or electronic equipment needing data storage.
Referring to fig. 1, a method flowchart of a solid state disk physical destruction method provided by an embodiment of the present invention is specifically described below:
s101, under the condition that a destroying indication signal meeting a preset non-false touch condition is received, determining each chip group to be destroyed and the destroying sequence of each chip group to be destroyed based on a preset destroying strategy.
The chip set to be destroyed comprises at least one chip, each chip is provided with a protection module corresponding to the chip, and preferably, the chip can be a NAND Flash chip.
In the method provided by the invention, when the destroying indication signal is detected, whether the destroying indication signal meets the non-false touch condition or not needs to be determined, namely, whether the destroying indication signal is a signal generated under the condition of false touch or not needs to be determined, and the situation that the solid state disk is destroyed due to false touch of a user can be avoided by executing the operation.
Referring to fig. 2, a flowchart of a method for determining whether a received destruction indication signal satisfies a non-false touch condition according to an embodiment of the present invention is described below.
S201, receiving a destruction indication signal.
The solid state disk receives a destruction indication signal through a solid state disk interface; the destruction indication signal may be sent by an upstream system of the solid state disk, and the upstream system may be a system applying the solid state disk.
Preferably, the solid state disk may use the detection module to detect whether the destruction indication signal is received.
S202, determining the signal type of the destruction indication signal.
In determining the signal type of the destruction indication signal, the determination may be made based on the identification in the destruction indication signal.
The signal type is one of a level type and a voltage type; the level type is to take the level signal as a destruction indication signal, and the voltage type is to take the voltage signal as a destruction indication signal.
Preferably, the types of the destruction indication signals applied by different upstream systems are different, and some upstream systems can apply all the types of signals, but only one type of signal can be selected to be sent when the destruction indication signals are sent.
S203, determining whether the destruction indication signal meets the destruction trigger condition of the signal type; executing S204 when the destruction indication signal is determined to meet the destruction trigger condition of the signal type; when it is determined that the destruction instruction signal does not satisfy the destruction trigger condition of the signal type, S205 is performed.
Different signal types have different destruction trigger conditions, when the destruction indication signal meets the destruction trigger conditions of the signal types corresponding to the destruction indication signal, the destruction indication signal can be determined not to be a false touch signal, and at the moment, the solid state disk can start a physical destruction program to destroy chips in the solid state disk.
And describing whether the different types of destruction indication signals meet the corresponding destruction trigger conditions.
When the signal type of the destroying indication signal is the level type, determining whether the duration of the destroying indication signal is greater than or equal to a preset first duration;
when the duration time of the destroying indication signal is longer than or equal to the first duration time, the destroying indication signal is determined to meet the destroying trigger condition of the signal type; when the duration of the destroying indication signal is smaller than the first duration, the destroying indication signal is determined to not meet the destroying trigger condition of the signal type.
It should be noted that, when the signal type of the destruction instruction signal is a level type, the detection module detects a pin for indicating whether to perform physical destruction, preferably, the pin model is at a high level, and when the low level is detected, the detection module can be regarded as receiving the destruction instruction signal, and the destruction instruction signal can be regarded as a physical destruction signal.
The first duration of the present application may be set according to actual requirements, and may be set to 1 second, or 2 seconds, for example.
Preferably, when the duration of the high level duration is greater than or equal to the first duration, determining that the destruction indication signal meets the destruction trigger condition of the signal type; and when the duration of the high level is smaller than the first duration, determining that the destruction indication signal does not meet the destruction trigger condition of the signal type.
When the signal type of the destroying indication signal is a voltage type, determining whether the voltage value of the destroying indication signal is larger than or equal to a preset voltage, and determining whether the duration of time when the voltage value of the destroying indication signal is larger than or equal to the preset voltage is larger than or equal to a preset second duration;
when the voltage value of the destroying indication signal is larger than or equal to the preset voltage and the duration time of the destroying indication signal, which is larger than or equal to the preset voltage, is longer than or equal to the second duration time, determining that the destroying indication signal meets the destroying trigger condition of the signal type; otherwise, determining that the destruction indication signal does not meet the destruction trigger condition of the signal type.
Preferably, the detection module may also be used to detect whether there is a voltage signal as the destruction indication signal, and when detected, the destruction indication signal may be considered to be received. Further, when the destruction indication signal is a voltage signal, the voltage may be a voltage source provided by the system end to the solid state disk for destruction.
The voltage value of the preset voltage can be set according to actual requirements, the second time length can be set according to actual requirements, for example, 1 second or 2 seconds, further, the first time length can be used as the second time length here, and the first time length and the second time length can be regarded as the triggering effective time of the physical destruction indication signal; the present application is not limited to the preset voltage and the second time period.
Preferably, when the signal type of the destruction indication signal is a voltage type, determining that the destruction indication signal does not meet the destruction trigger condition of the signal type when the voltage value of the destruction indication signal is smaller than a preset voltage or the duration of time when the voltage value of the destruction indication signal is greater than or equal to the preset voltage is smaller than a second duration; further, when the duration of the destroying indication signal which is greater than or equal to the preset voltage is smaller than the second duration, it may be determined that the destroying indication signal does not satisfy the destroying trigger condition of the signal type.
S204, determining that the destruction indication signal meets a non-false touch condition.
S205, determining that the destruction indication signal does not meet the non-false touch condition.
When the destroying indication signal meets the non-false touch condition, the destroying indication signal can be determined to be a signal of false touch, which means that a physical destroying program can be started at the moment to physically destroy the solid state disk; when the destroying indication signal does not meet the non-false touch condition, the destroying indication signal can be determined to be a signal generated when the solid state disk is touched by mistake, and the solid state disk cannot be destroyed at the moment, so that the situation that data are destroyed by mistake due to the fact that the solid state disk is destroyed by mistake is avoided, and unnecessary equipment damage is avoided.
After the received destroying indication signal meets the non-false touch condition, each chip in the solid state disk can be grouped to obtain each chip group to be destroyed, so that the chips can be destroyed by taking the group as a unit.
Referring to fig. 3, a flowchart of a method for grouping each chip in a solid state disk based on a preset destruction policy to obtain each chip group to be destroyed and a destruction sequence of each chip group to be destroyed according to an embodiment of the present invention is described below.
S301, determining the received power supply power of the external input power supply.
S302, determining the number of chips in the solid state disk and the destruction power of each chip.
The number of chips in the solid state disk is counted, and preferably, the number of the chips can be determined based on configuration information of the solid state disk.
The destroying power of the chip can be understood as the power consumption required when destroying the chip, and further, the destroying power of each chip is the same.
S303, grouping the chips based on the power supply power and the destruction power to obtain chip sets to be destroyed, wherein the sum of the destruction power of the chips in each chip set to be destroyed is smaller than the power supply power.
It should be noted that, when the chips are grouped, the sum of the destruction power of the chips in the same group is smaller than the power of the power supply.
Preferably, the individual chips are grouped in a plurality of ways, and as an example, one chip can be used as one chip group to be destroyed. The destroying power of the chips can be also applied, the number of chips which can be born by the power supply at most is determined, and then the chips are grouped by taking the number of chips as the maximum number of chips for grouping, so that a plurality of chip sets to be destroyed can be obtained, wherein the number of chips in the chip sets to be destroyed is larger than or equal to the number of chips which can be born by the power supply at most.
When the number of chips which can be borne by the power supply at maximum is determined, dividing the power supply by the destruction power, then taking an integer from the obtained quotient, and determining the obtained integer as the number of chips which can be borne by the power supply at maximum; illustratively, when the quotient is 2, the number of chips that can be borne by the maximum power supply is determined to be 2, and when the quotient is 3.3, the number of chips that can be borne by the maximum power supply is determined to be 3.
Further, after the number of chips that can be borne by the power supply at most is obtained, the chips may be grouped by selecting a value smaller than the number of chips.
For example, the number of chips that can be borne by the power supply is 5 at most, 4 chips can be selected to be grouped, and then the number of chips in each chip set to be destroyed is less than or equal to 4. The number of chips in each chip set to be destroyed obtained after grouping can be the same, and the situation that the number of chips is different exists.
S304, distributing a destroying sequence for each chip group to be destroyed.
When the destroying sequence is allocated to each chip group to be destroyed, the destroying sequence can be allocated randomly, and the mode of allocating the destroying sequence is not limited by the application. When a destroying sequence is allocated to each chip group to be destroyed, a number can be allocated to each chip group to be destroyed, which is used for indicating the destroying sequence of the chip group to be destroyed, for example, when the number is 1, the destroying sequence of the chip group to be destroyed is the first position; and when the number is 2, the destroying sequence of the chip set to be destroyed is the second, and the like, and no illustration is given here.
The plurality of chip groups to be destroyed are obtained by grouping all the chips in the solid state disk, so that the chips can be destroyed in groups later, the condition that the power required by destroying all the chips simultaneously is greater than the power of an input power supply can be avoided, and all the chips can be destroyed thoroughly.
S102, calling each protection module to process the received external input power supply to obtain the destruction power supply output by each protection module.
It should be noted that the protection module may perform a boosting operation and a current limiting operation. Preferably, the protection module comprises a boost module and a current limiting module, the boost module is used for realizing boost operation, and the current limiting module is used for realizing current limiting operation.
The external input power supply is a power supply provided by an upstream system of the solid state disk, and the power supply is used for physically destroying the solid state disk.
Each protection module processes the external input power supply, and the specific processing process is as follows: the control protection module performs boosting treatment on the external input power supply, so that the voltage of the boosted power supply is in a preset chip destruction voltage range, and performs current limiting treatment on the boosted power supply to obtain a destruction power supply.
Preferably, the boosting processing is to ensure that the voltage value of the destroying power supply is in a preset chip destroying power supply range, the current limiting processing is to uniformly distribute power values to chips to be destroyed when the chips in the solid state disk are destroyed, the constant current output of the destroying power supply is controlled, the upstream system is ensured to normally work, and the phenomenon that certain chips pull the voltage and the current to affect the destroying operation of other chips during physical destroying is avoided.
When the protection module is subjected to boosting operation, the output voltage value of the protection module can be adjusted in a mode of matching the voltage dividing resistance value, so that software development is not required, and the output voltage value can be adjusted only by changing the resistance of the resistor; through the boosting operation, the voltage value of the input power supply with low voltage of 5V, 12V and the like can be increased, so that the voltage value of the power supply finally used for destroying the chip meets the destroying requirement. Based on the boosting operation of the protection module, the application scene and the application range of the scheme can be enlarged, the input values of 5V-36V wide voltage can be adapted, the input values of 5V, 12V and specific voltage values can be adapted, the voltage values of the input power supplies with low voltage can be increased, the voltage value of the power supply finally used for destroying the chip can meet the destroying requirement, and the solid state disk can be destroyed by using the input power supply with low voltage.
The destruction chip has a requirement for the negative value of the voltage, for example, the destruction chip can be destroyed only when the negative value of the voltage is greater than 24 volts. According to the scheme, through boosting operation, the voltage of the external input power supply with low voltage can be increased, so that the voltage value of the power supply used for destroying the chip is ensured to meet the destroying requirement.
Preferably, the chip destruction power supply may range from 24 volts to 36 volts.
S103, determining the chip group to be destroyed with the destruction sequence being the first one as a target chip group based on the destruction sequence of each chip group to be destroyed.
S104, determining each protection module corresponding to the target chipset as a target protection module.
And determining the protection modules corresponding to each chip in the target chipset as target protection modules, wherein the number of the target protection modules is the same as the number of the chips in the target chipset.
S105, destroying the corresponding chip by using the destroying power supply output by each target protection module.
And generating a control signal of each chip in the target chip set, wherein the control signal is used for controlling a destruction power supply output by a target protection module corresponding to the chip to destroy the chip.
Further, based on each control signal, the power switch circuit corresponding to each target protection module is controlled to be in a channel state, so that the destroying power output by each target protection module is input into the corresponding chip through the corresponding power switch circuit, and the chip is broken down, and then the chip is destroyed. The voltage of the destroying power supply meets the voltage value when the chip is destroyed, so that after the destroying power supply is input into the chip, the chip is broken down by the voltage of the destroying power supply, and the physical destruction of the chip is completed.
It should be noted that, each chip has a corresponding power switch circuit, and the chip is connected with the protection module through the power switch circuit; after the power switch circuit is in a passage state, the protection module gives a destroying power supply to a power supply input pin of the chip so as to perform physical destroying operation.
The control signal is used for controlling the switching state of a power switch circuit connected with the chip, and the power switch circuit defaults to an open-circuit state so as to ensure that voltage cannot be input to the chip when the control signal is not available, thereby avoiding the situation that the chip is destroyed by mistake.
The control signal is used for switching the power switch circuit from the open state to the access state, and keeping the access state for a preset duration, so that the destroying power output by the protection module is continuously input into the chip within the duration, and the chip is destroyed. Preferably, the duration of the control of the on state of the power switch circuit may be set based on actual requirements, and the duration may be understood as a duration consumed for destroying each chip in the target chipset, and may be understood as a duration of inputting the destroying power to the chip, in other words, the duration is a chip destroying time of the target chipset.
Preferably, the time period required for destroying the chip is the same for all the target chipsets.
S106, determining whether the destroying sequence of the target chip group is the last bit; when the destruction sequence of the target chipset is not the last bit, S107 is executed; when the destruction sequence of the target chipset is the last bit, S108 is performed.
And S107, determining the chip set to be destroyed, which is positioned at the later position of the target chip set in the destruction sequence, as a new target chip set, and returning to the step S104.
For example, assuming that the destruction sequence of the target chipset is the first, the chipset to be destroyed with the destruction sequence of the second may be used as a new target chipset, and then S104 is executed back, so that each chip in each chipset to be destroyed may be destroyed gradually.
S108, determining to destroy all chips in the solid state disk, and finishing the physical destruction operation of the solid state disk.
Preferably, it can be determined that the physical destruction operation of the solid state disk is completed within a preset physical destruction period, and it is to be noted that the physical destruction period is equal to the sum of the time required by each chip group to be destroyed to destroy the chip and the triggering effective time of the destruction indication signal.
Furthermore, during the process of destroying each chip, the solid state disk can also generate destroying state information of each chip group to be destroyed based on destroying states of each chip group to be destroyed, and output the destroying state information through the serial port, wherein the destroying state information can be used for tracking and recording physical destroying states of specific scenes, so that the physical destroying operation is ensured to be completed.
The destroying state information comprises destroying records of all chip groups to be destroyed in the solid state disk, and the destroying records record information such as destroying sequence of the chip groups to be destroyed and voltage value of destroying power supply applied by each chip when the chip is destroyed. The destroying state information is convenient for a subsequent user to verify whether all chips in the solid state disk are destroyed.
The invention can also control the flashing state of the preset destroying state indicator lamp based on the physical destroying progress based on the solid state disk; for example, before the solid state disk does not receive the destruction indication signal meeting the non-false touch condition, the destruction status indicator is not on, that is, it can be understood that the physical destruction procedure of the solid state disk is not started, in other words, the solid state disk is not in the physical destruction status; when the solid state disk receives a destroying indication signal meeting a non-false touch condition, the destroying state indicator is flashed, for example, any one of 300mS-500mS is used as a time interval for flashing, and the solid state disk is in a physical destroying state; when the solid state disk is completely physically destroyed, the destroy status indicator lights flash slowly, for example, flash at 1S as time intervals.
The solid state disk can be indicated to be in a physical destroying state through the destroying state indicator lamp, and is in the physical destroying state and the physical destroying state is completed.
In the method provided by the embodiment of the invention, under the condition that a destroying indication signal meeting a preset non-false touch condition is received, all chips in the solid state disk are grouped based on a preset destroying strategy to obtain all chip groups to be destroyed and destroying sequences of all chip groups to be destroyed, wherein the chip groups to be destroyed comprise at least one chip, and each chip has a corresponding protection module; invoking each protection module to process the received external input power supply to obtain a destruction power supply output by each protection module; determining the chip group to be destroyed with the destruction sequence being the first as a target chip group based on the destruction sequence of each chip group to be destroyed; determining each protection module corresponding to the target chipset as a target protection module; destroying the corresponding chip by using the destroying power supply output by each target protection module; and determining the chip set to be destroyed, which is positioned at the later position of the target chip set in the destruction sequence, as a new target chip set, and returning to the step of determining each protection module corresponding to the target chip set as a target protection module until all chips are destroyed. According to the invention, each chip in the solid state disk is destroyed in groups, so that the condition that the destruction of the chip is incomplete due to the fact that the power required for destroying all the chips is larger than the power of the power supply for destroying the solid state disk at the same time can be avoided, the chips are destroyed in batches, the power required for destroying the chips is smaller than the power of the power supply for destroying the solid state disk, and the chips in the solid state disk can be destroyed in batches, so that the solid state disk can be destroyed thoroughly, and data leakage is avoided.
The solid state disk physical destruction method provided by the invention is applied to a solid state disk, and referring to fig. 4, a schematic structural diagram of the solid state disk provided by the embodiment of the invention is shown, and the solid state disk comprises a destruction control unit 401, a chip unit 402 and a destruction status indicator lamp 403.
The chip unit comprises a plurality of chip modules, wherein the chip modules comprise a protection module, a power switch circuit and a chip which are sequentially connected in series; illustratively, referring to fig. 4, the protection module 1, the power control circuit 1, and the chip 1 constitute one chip module; the protection module 2, the power control circuit 2 and the chip 2 form a chip module, and so on, the invention is not illustrated; in the drawing, N is a positive integer.
The destroying control unit is used for grouping all chips in the solid state disk based on a preset destroying strategy under the condition that a destroying indication signal meeting a preset non-false touch condition is received, so as to obtain all chip groups to be destroyed and destroying sequences of all chip groups to be destroyed, wherein the chip groups to be destroyed comprise at least one chip, and each chip is provided with a corresponding protection module; invoking each protection module to process the received external input power supply to obtain a destruction power supply output by each protection module; determining the chip group to be destroyed with the first destroying sequence as a target chip group based on the destroying sequence of each chip group to be destroyed; determining each protection module corresponding to the target chipset as a target protection module; destroying the corresponding chip by using the destroying power supply output by each target protection module; and determining the chip set to be destroyed, which is positioned at the later position of the target chip set in the destruction sequence, as a new target chip set, and returning to the step of determining each protection module corresponding to the target chip set as a target protection module until all chips are destroyed.
The destroying control unit can realize the functions of voltage detection of an input power supply, detection of destroying indication signals, control of time-related content in the destroying process, grouping of each chip, setting of destroying sequence of each chip group to be destroyed, destroying state indication, outputting of destroying state information and the like; further, the implementation of the related functions can be implemented by setting corresponding modules. Furthermore, the destroying control unit can use MCU or CPLD to realize the control of the opening and closing judgment of the physical destroying power supply channel.
The destroying state indicator lamp is used for indicating the physical destroying progress of the solid state disk; for example, when the solid state disk is not destroyed, the destroy status indicator lamp is not on; when the solid state disk is in the chip destroying stage, the destroying state indicator lamp flash; when the solid state disk destroying chip is completed, the destroying status indicator lamp slowly flashes; the three states of the solid state disk can be displayed by destroying the flashing state of the state indicator lamp. The state indicator lamp is destroyed, so that the state of the solid state disk can be intuitively displayed to a user, the user can intuitively distinguish the state of the solid state disk, the situation that the user stops providing the power supply required by destroying the solid state disk when the solid state disk is not destroyed is avoided, and the solid state disk is further ensured to be destroyed thoroughly.
The solid state disk also comprises a solid state disk interface, and the solid state disk interface is used for receiving an input power supply and a destruction indication signal provided by an upstream system.
The destroying control unit is also provided with a serial port, the generated destroying state information can be output through the serial port, and the destroying state information can be printed and displayed through the serial port information.
It should be noted that after grouping each chip in the solid state disk, obtaining a plurality of chip sets to be destroyed, where the chip sets to be destroyed include at least one chip; and then, sequentially destroying the chips in the chip set to be destroyed.
Preferably, the invention provides a response example to illustrate the destroying process of the solid state disk, which is specifically described below.
The example is illustrated with reference to fig. 4, and the solid state disk is assumed to include 16 chips, each chip is grouped to obtain each chipset to be destroyed, and the example is illustrated based on a timing chart for destroying each chipset to be destroyed.
Example one: when each chip set to be destroyed only comprises one chip, 16 chip sets to be destroyed can be obtained. The control timing diagram of destroying each chip group to be destroyed one by one is shown in fig. 5, and because only one chip is destroyed each time, the passage when destroying the chip can be regarded as a destroying passage, so fig. 5 can be called a single-channel destroying control timing diagram.
As shown in fig. 5, each chip generates a corresponding control signal, and the power switch circuit corresponding to the chip is controlled to switch from the off state to the on state by the control signal, and the on state is maintained for a preset destruction time period, wherein the destruction time period can be regarded as T2 in fig. 5, and the destruction time period can be set according to actual requirements.
Example two: when each chip set to be destroyed contains two chips, 8 chip sets to be destroyed can be obtained, a control timing diagram for destroying each chip set to be destroyed one by one is shown in fig. 6, two chips are arranged in each destroyed chip set to be destroyed, and a passage during destroying one chip can be regarded as a destroying passage, so that fig. 6 can be called a two-channel simultaneous destroying control timing diagram.
Example three: when each chip set to be destroyed contains 4 chips, 4 chip sets to be destroyed can be obtained, the control timing diagram for destroying each chip set to be destroyed is shown in fig. 7, four chips are arranged in each destroyed chip set to be destroyed, and the passage when one chip is destroyed can be regarded as one destroy passage, therefore, fig. 7 can be called a four-passage simultaneous destroy control timing diagram.
Further, when destroying the chip set to be destroyed, it is necessary to eliminate each chip in the chip set at the same time.
In fig. 5 to fig. 7, T2 is a destroying time period of each chip set to be destroyed, which can be understood that, during the destroying time period of the chip set, each chip in the chip set to be destroyed is destroyed, specifically, based on a control signal, a power switch circuit connected with the chip is controlled to switch from an off state to an on state, and the on state is continued for a preset destroying time period; t2 can also be understood as the duration of time that the power input chip is destroyed.
T1 in fig. 5 to 7 is the trigger valid time of the destruction indication signal, and the description of the trigger valid time is described above, and will not be described here.
T3 in fig. 5 to fig. 7 is a time period spent for completing physical destruction of the solid state disk, where t3=t1+m×t2, where m represents the number of chipsets to be destroyed.
It should be noted that, T1, T2 and T3 may all be set according to actual requirements.
When the chips in the solid state disk are destroyed, the power switches can be controlled to be in the passage state at the same time, so that the chips can be destroyed at the same time, namely the chips can be destroyed in a multi-channel manner, and the physical destruction operation time of the solid state disk can be shortened.
The invention can control the destroying cycle times of the solid state disk, groups the chips, can select the number of the chips destroyed each time, the number can be from 1 to the maximum number of the chips assembled in the positive solid state disk, and can select a plurality of chips to be destroyed simultaneously as much as possible under the condition that the power of the input power supply meets the voltage required by destroying the chips so as to save the destroying time.
According to the method, the chips in the solid state disk are grouped to obtain a plurality of chip sets to be destroyed, and then the chips in the chip sets to be destroyed are destroyed one by one. The chips are destroyed in batches, so that the power required by destroying the chips each time is effectively ensured to be smaller than the power of an input power supply for destroying the solid state disk, and the chips in the chip set to be destroyed can be thoroughly destroyed each time.
The specific implementation process and derivative manner of the above embodiments are all within the protection scope of the present invention.
In this specification, each embodiment is described in a progressive manner, and identical and similar parts of each embodiment are all referred to each other, and each embodiment mainly describes differences from other embodiments. In particular, for a system or system embodiment, since it is substantially similar to a method embodiment, the description is relatively simple, with reference to the description of the method embodiment being made in part. The systems and system embodiments described above are merely illustrative, wherein the elements illustrated as separate elements may or may not be physically separate, and the elements shown as elements may or may not be physical elements, may be located in one place, or may be distributed over a plurality of network elements. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment. Those of ordinary skill in the art will understand and implement the present invention without undue burden.
Those of skill would further appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both, and that the various illustrative elements and steps are described above generally in terms of functionality in order to clearly illustrate the interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. The solid state disk physical destruction method is characterized by comprising the following steps of:
under the condition that a destroying indication signal meeting a preset non-false touch condition is received, grouping all chips in the solid state disk based on a preset destroying strategy to obtain all chip groups to be destroyed and destroying sequences of all the chip groups to be destroyed, wherein the chip groups to be destroyed comprise at least one chip, and each chip has a corresponding protection module;
invoking each protection module to process the received external input power supply to obtain a destruction power supply output by each protection module;
determining the chip set to be destroyed with the first destroying sequence as a target chip set based on the destroying sequence of each chip set to be destroyed;
determining each protection module corresponding to the target chipset as a target protection module;
destroying a chip corresponding to the destroying power supply output by each target protection module;
and determining the chip set to be destroyed, which is positioned at the later position of the target chip set in the destruction sequence, as a new target chip set, and returning to the step of determining each protection module corresponding to the target chip set as a target protection module until all chips are destroyed.
2. The method as recited in claim 1, further comprising:
receiving a destruction indication signal;
determining the signal type of the destruction indication signal;
determining whether the destruction indication signal meets a destruction trigger condition of the signal type;
when the destroying indication signal is determined to meet the destroying trigger condition of the signal type, determining that the destroying indication signal meets the non-false touch condition.
3. The method of claim 2, wherein the determining whether the destruction indication signal satisfies a destruction trigger condition of the signal type comprises:
when the signal type of the destruction indication signal is a level type, determining whether the duration of the destruction indication signal is greater than or equal to a preset first duration;
when the duration time of the destroying indication signal is determined to be longer than or equal to the first duration time, determining that the destroying indication signal meets the destroying trigger condition of the signal type; when the duration of the destroying indication signal is smaller than the first duration, determining that the destroying indication signal does not meet the destroying trigger condition of the signal type;
when the signal type of the destruction indication signal is a voltage type, determining whether the voltage value of the destruction indication signal is larger than or equal to a preset voltage, and determining whether the duration of the voltage value of the destruction indication signal, which is larger than or equal to the preset voltage, is larger than or equal to a preset second duration;
When the voltage value of the destruction indication signal is greater than or equal to a preset voltage and the time duration for which the voltage value of the destruction indication signal is greater than or equal to the preset voltage is greater than or equal to the second time duration, determining that the destruction indication signal meets the destruction trigger condition of the signal type; otherwise, determining that the destruction indication signal does not meet the destruction trigger condition of the signal type.
4. The method of claim 1, wherein grouping each chip in the solid state disk based on a preset destruction policy to obtain each chip group to be destroyed and a destruction sequence of each chip group to be destroyed comprises:
determining the received power of an external input power supply;
determining the number of chips in the solid state disk and the destruction power of each chip;
grouping the chips based on the power supply power and the destruction power to obtain chip groups to be destroyed, wherein the sum of the destruction power of the chips in each chip group to be destroyed is smaller than the power supply power;
and distributing a destroying sequence for each chip to be destroyed.
5. The method of claim 1, wherein said invoking each of said protection modules to process the received external input power to obtain the destruction power output by each of said protection modules comprises:
and for each protection module, controlling the protection module to boost the external input power supply, so that the voltage of the boosted power supply is in a preset chip destruction voltage range, and performing current limiting treatment on the boosted power supply to obtain a destruction power supply.
6. The method of claim 1, wherein destroying the corresponding chip using the destruction power output by each of the target protection modules comprises:
and for each target protection module, controlling a power switch circuit connected with the target protection module to be in a passage state, so that a destroying power supply output by the target protection module is input into a chip corresponding to the target protection module through the power switch circuit to break down the chip.
7. The method as recited in claim 1, further comprising:
and generating destroying state information of each chip group to be destroyed based on destroying states of each chip group to be destroyed.
8. The method as recited in claim 1, further comprising:
and controlling the flashing state of a preset destroying state indicator lamp based on the physical destroying progress of the solid state disk.
9. A solid state disk, comprising:
a destruction control unit and a chip unit;
the chip unit comprises a plurality of chip modules, wherein the chip modules comprise a protection module, a power switch circuit and a chip which are sequentially connected in series;
the destroying control unit is used for executing the solid state disk physical destroying method according to any one of claims 1-8.
10. The solid state disk of claim 9, further comprising:
destroying the status indicator lamp;
the destroying status indicator lamp is used for indicating the physical destroying progress of the solid state disk.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311292318.7A CN117019847B (en) | 2023-10-08 | 2023-10-08 | Solid state disk physical destruction method and solid state disk |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311292318.7A CN117019847B (en) | 2023-10-08 | 2023-10-08 | Solid state disk physical destruction method and solid state disk |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117019847A true CN117019847A (en) | 2023-11-10 |
| CN117019847B CN117019847B (en) | 2023-12-29 |
Family
ID=88630414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311292318.7A Active CN117019847B (en) | 2023-10-08 | 2023-10-08 | Solid state disk physical destruction method and solid state disk |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117019847B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105184195A (en) * | 2015-07-31 | 2015-12-23 | 山东超越数控电子有限公司 | Design method of multi-hard disc sub-time destroying |
| CN216249236U (en) * | 2021-11-23 | 2022-04-08 | 湖南智存合壹信息科技有限公司 | Solid state disk false triggering prevention intelligent destruction system and solid state disk |
| WO2023020494A1 (en) * | 2021-08-17 | 2023-02-23 | 深圳市安信达存储技术有限公司 | Intelligent destruction method based on loongson processor |
| CN115879177A (en) * | 2022-10-12 | 2023-03-31 | 中国航空工业集团公司洛阳电光设备研究所 | Intelligent passive real-time physical destruction circuit for airborne solid-state storage disk |
| CN116432253A (en) * | 2023-04-28 | 2023-07-14 | 西安超越申泰信息科技有限公司 | Device and method for physically destroying storage hard disk |
| CN116796381A (en) * | 2023-06-08 | 2023-09-22 | 西安超越申泰信息科技有限公司 | System, method, device and storage medium for destroying hard disk based on server |
-
2023
- 2023-10-08 CN CN202311292318.7A patent/CN117019847B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105184195A (en) * | 2015-07-31 | 2015-12-23 | 山东超越数控电子有限公司 | Design method of multi-hard disc sub-time destroying |
| WO2023020494A1 (en) * | 2021-08-17 | 2023-02-23 | 深圳市安信达存储技术有限公司 | Intelligent destruction method based on loongson processor |
| CN216249236U (en) * | 2021-11-23 | 2022-04-08 | 湖南智存合壹信息科技有限公司 | Solid state disk false triggering prevention intelligent destruction system and solid state disk |
| CN115879177A (en) * | 2022-10-12 | 2023-03-31 | 中国航空工业集团公司洛阳电光设备研究所 | Intelligent passive real-time physical destruction circuit for airborne solid-state storage disk |
| CN116432253A (en) * | 2023-04-28 | 2023-07-14 | 西安超越申泰信息科技有限公司 | Device and method for physically destroying storage hard disk |
| CN116796381A (en) * | 2023-06-08 | 2023-09-22 | 西安超越申泰信息科技有限公司 | System, method, device and storage medium for destroying hard disk based on server |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117019847B (en) | 2023-12-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20110271036A1 (en) | Phased nand power-on reset | |
| CN101414272A (en) | Method and apparatus for detecting memory leakage | |
| CN106971075A (en) | Detection process method, device and relevant device | |
| CN106154072A (en) | A kind of Testing System for Electronic Equipment and method | |
| CN117019847B (en) | Solid state disk physical destruction method and solid state disk | |
| CN106056012A (en) | Terminal power key control method and system | |
| CN112631664B (en) | Signal distribution method, signal distribution device, computer equipment and readable storage medium | |
| CN105786315A (en) | Time display method and device | |
| CN116796381A (en) | System, method, device and storage medium for destroying hard disk based on server | |
| CN108924366B (en) | Low-voltage reminding method and device, electronic equipment and storage medium | |
| CN107391324B (en) | Test control device and method of storage system | |
| CN113434179B (en) | Online upgrade method, device and equipment of programmable power supply and storage medium | |
| CN108170607B (en) | Control device and control method of OTP switch | |
| CN115657830A (en) | Power-on control method, device and system and computer readable storage medium | |
| CN111683443B (en) | Man-machine interaction method based on state machine | |
| CN107093408B (en) | The control method and device of backlight lightening when smart machine is switched on | |
| US9424186B2 (en) | Method and apparatus for controlling memory startup | |
| CN112673539B (en) | Power supply device and method for managing DC power at power supply device | |
| CN108879589B (en) | Overcurrent protection method and device, terminal equipment and storage medium | |
| CN105183176A (en) | Application processing method and application processing device | |
| CN110377467A (en) | Fault Locating Method, device, equipment and the storage medium of server start process | |
| CN108121917A (en) | The operation of integrated circuit is scrambled | |
| CN116093885B (en) | Low-voltage protection method and device applied to model airplane electronic speed regulator | |
| CN115307500B (en) | Method, system and medium for realizing time-sharing charging of electronic detonator | |
| US12019487B2 (en) | Power sequence synchronization between multiple devices |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |