CN117012743A

CN117012743A - Electronic device assembly

Info

Publication number: CN117012743A
Application number: CN202310499510.7A
Authority: CN
Inventors: 林承园; 全五燮
Original assignee: Semiconductor Components Industries LLC
Current assignee: Semiconductor Components Industries LLC
Priority date: 2022-05-04
Filing date: 2023-05-04
Publication date: 2023-11-07

Abstract

The application relates to an electronic device assembly comprising a substrate having a surface, a patterned metal layer disposed on the surface of the substrate, a semiconductor device circuit implemented on the patterned metal layer, and a molded body comprising a plurality of signal pins. The signal pins of the plurality of signal pins include a first portion that protrudes from a first surface of the molded body. The first portion is externally accessible. The signal pins of the plurality of signal pins further include a second portion extending from a second surface of the molded body opposite the first surface. A second portion of the individual signal pins of the plurality of signal pins is located inside the electronic device assembly, electrically coupled to the patterned metal layer, and electrically continuous with the first portion.

Description

Electronic device assembly

Technical Field

The present application relates to electronic device assemblies. More particularly, the present application relates to semiconductor device modules, such as power semiconductor device modules and related electronic device assemblies.

Background

A semiconductor device (e.g., a semiconductor die) may be included in a package assembly or module. Such a module may include a substrate, a semiconductor die disposed on the substrate, electrical interconnects, and a molding compound. The electrical interconnects may include conductive clips, wire connections, signal pins, and/or power tabs. The molding compound may encapsulate portions of the assembly, wherein at least portions of the signal pins and portions of the power tabs may be accessible from outside the molding compound, e.g., to enable electrical connection in a related system. In previous embodiments, alignment of the substrate in the mold cavity for the package in the mold compound may be difficult, which may result in incorrect positioning of the signal pins and/or power supply tabs on the module. Furthermore, the power tabs in the previous embodiments may significantly increase the stray inductance of the associated module due to the length and/or physical configuration of the power tabs.

Furthermore, in the previous embodiments, modules having the same or similar functionality implemented in different packaging configurations may change the arrangement of their signal pins, which prevents interchangeability of one module configuration with another module configuration in a related system. That is, the layout of the printed circuit board including (combined with, integrated with) a given module is specific to the signal pin arrangement of the module. In addition, in the previous embodiments, the individual signal pins are prone to misalignment, for example, due to tilting during connection into the module. Furthermore, in the previous embodiments, the molding compound may be stripped from associated heat dissipating devices (e.g., heat sinks, fluid cooling jackets, etc.) coupled to the module due to thermal cycling associated with long term use and/or during reliability testing.

Disclosure of Invention

In a general aspect, an electronic device assembly includes a substrate having a surface, a patterned metal layer disposed on the surface of the substrate, a semiconductor device circuit implemented on the patterned metal layer, and a molded body including a plurality of signal pins. The signal pins of the plurality of signal pins include a first portion that protrudes from a first surface of the molded body. The first portion of the signal pin is externally accessible. The signal pins of the plurality of signal pins further include a second portion extending from a second surface of the molded body opposite the first surface. A second portion of the individual signal pins of the plurality of signal pins is located inside the electronic device assembly, electrically coupled to the patterned metal layer, and electrically continuous with the first portion.

Embodiments may include one or more of the following features, alone or in combination. For example, the second portion of the signal pin may include a plurality of bends.

The molded body may include a plurality of alignment features configured to position the electronic device assembly in the package molding tool. The plurality of alignment features may include at least one of: a plurality of recesses in the first surface of the molded body, or a plurality of through holes in the molded body.

The molded body may include a plurality of power tabs. The power tabs of the plurality of power tabs may include: a first portion disposed in a plane parallel to the first surface of the molded body, and a second portion orthogonal to the first portion. The second portion of the power tab may extend from the second surface of the molded body, be electrically continuous with the first portion of the power tab, and be electrically coupled with the patterned metal layer.

The first portion of the power tab may be disposed in a slot defined in the molded body.

The power tab is a single body that is bent to define a first portion of the power tab and a second portion of the power tab.

The second portion of the power tab may be a conductive post that electrically couples the first portion of the power tab with the patterned metal layer.

In another general aspect, an electronic device assembly includes a substrate having a surface, a patterned metal layer disposed on the surface of the substrate, a semiconductor device circuit implemented on the patterned metal layer, and an interposer having a first side and a second side opposite the first side. The interposer includes a plurality of signal pin receptacles accessible from a first side of the interposer, a plurality of caps surrounding the plurality of signal pin receptacles on a second side of the interposer, respectively, and at least one signal redistribution layer electrically coupling the plurality of signal pin receptacles to a plurality of contact pads on the second side of the interposer, respectively. The electronic device assembly also includes a plurality of conductive posts that electrically couple the plurality of contact pads with the patterned metal layer, respectively.

Embodiments may include one or more of the following features, alone or in combination. For example, the electronic device assembly may include at least one electronic component disposed on a first side of the interposer. The at least one electronic component may be electrically coupled with at least one of the plurality of signal pin receptacles via at least one signal redistribution layer.

The interposer may include a printed circuit board.

The at least one signal redistribution layer may comprise a plurality of signal redistribution layers.

The interposer may include a plurality of cutouts. The electronic device assembly may include a plurality of power tabs disposed in the plurality of cutouts, respectively, and a plurality of conductive posts electrically coupling the plurality of power tabs with the patterned metal layer, respectively.

The electronic device assembly may include a molding compound. A plurality of signal pin receptacles may be exposed from the molding compound.

The electronics assembly may include a plurality of signal pins that are respectively inserted into a plurality of signal pin receptacles.

In another general aspect, an electronic device assembly includes a heat dissipating apparatus having a surface. The heat sink device includes a first recess defined in the surface and a second recess defined in the surface. The second groove is spaced apart from and parallel to the first groove. The electronic device assembly also includes a substrate coupled to a surface of the heat sink apparatus. The substrate is disposed between the first recess and the second recess. The electronic device assembly also includes a semiconductor device circuit and a molding compound implemented on the substrate. A first portion of the molding compound encapsulates the substrate and the semiconductor device circuitry. A second portion of the molding compound is disposed in the first recess and a third portion of the molding compound is disposed in the second recess.

Embodiments may include one or more of the following features, alone or in combination. For example, the first groove may extend from a first edge of the heat sink device to a second edge of the heat sink device, the second edge being opposite the first edge. The second groove may extend from a first edge of the heat sink to a second edge of the heat sink.

The heat sink device may include a first protrusion disposed between the first groove and the second groove along a first edge of the heat sink device. The fourth portion of the molding compound may encapsulate the first protrusion. The heat sink device may include a second protrusion disposed between the first groove and the second groove along a second edge of the heat sink device. The fifth portion of the molding compound may encapsulate the second protrusion.

The heat sink device may be a heat sink or a fluid cooling jacket.

The electronics assembly may include a plurality of externally accessible signal pins; and a plurality of externally accessible power tabs.

Drawings

Fig. 1 is a diagram illustrating an exemplary electronics assembly.

Fig. 2A and 2B are diagrams illustrating exemplary molded bodies that may be included in the electronic device assembly of fig. 1.

Fig. 3 is a diagram illustrating an exemplary substrate assembly.

Fig. 4A and 4B are diagrams illustrating exemplary aspects of an electronic device assembly, such as the electronic device assembly of fig. 1.

Fig. 5A and 5B are diagrams illustrating another exemplary molded body that may be included in an electronic device assembly.

Fig. 6A-6C are diagrams illustrating exemplary aspects of an electronic device assembly including the molded body of fig. 5A and 5B.

Fig. 7A and 7B are diagrams illustrating another exemplary electronics assembly.

Fig. 8A-8D are diagrams illustrating multiple views of an interposer that may be included in the electronic device assembly of fig. 7A and 7B.

Fig. 9A and 9B are diagrams illustrating exemplary aspects of an electronic device assembly, such as the electronic device assembly of fig. 7A and 7B.

Fig. 10 is a diagram illustrating another exemplary electronics assembly.

Fig. 11A-11D are diagrams illustrating another exemplary electronics assembly.

Fig. 12A and 12B are diagrams illustrating exemplary aspects of another electronics assembly.

Fig. 13A and 13B are diagrams illustrating exemplary aspects of another electronics assembly.

Fig. 14 is a diagram illustrating a unitary power tab frame.

Fig. 15 is a flow chart illustrating an exemplary method for manufacturing an electronic device assembly.

Fig. 16 is a flow chart illustrating another exemplary method for manufacturing an electronic device assembly.

Fig. 17 is a flow chart illustrating another exemplary method for manufacturing an electronic device assembly.

Fig. 18 is a flow chart illustrating another exemplary method for manufacturing an electronic device assembly.

Like reference symbols in the various drawings indicate like elements. For all such elements, the reference numerals for some similar elements may not be repeated. In some cases, different reference numbers may be used for similar or analogous elements. Some reference numerals for certain elements of a particular embodiment may not be repeated in each of the figures corresponding to the embodiment. Some reference numerals for certain elements of a particular embodiment may be repeated among other figures corresponding to the embodiment, but may not be discussed in detail with reference to each corresponding figure. The drawings are for purposes of illustrating exemplary embodiments and are not necessarily to scale.

Detailed Description

The present disclosure relates to packaged semiconductor device apparatuses, which may be referred to as modules, assemblies, electronic device assemblies, semiconductor device modules, power semiconductor device modules, and the like, and to related methods for manufacturing such apparatuses. The methods shown and described herein may be used to implement semiconductor device modules (e.g., half-bridge power modules in the exemplary embodiments described herein) that may overcome at least some of the disadvantages of the prior methods described above. For example, embodiments described herein may facilitate improvements in mold cavity alignment, reduce stray inductance, system signal pin placement uniformity for different modules, reduce signal pin misalignment, and/or reduce mold compound stripping from associated heat sinks. Although the methods described herein are generally described with respect to half-bridge power modules, in some embodiments, semiconductor device modules implementing other circuits are also possible, e.g., full-bridge power modules, three-phase half-bridge modules, multi-phase half-bridge modules, etc.

Fig. 1 is a diagram illustrating an exemplary electronics assembly 100. The electronic device assembly 100 may implement a semiconductor device power module, such as a half-bridge circuit. As shown in fig. 1, the electronic device assembly 100 includes a plurality of signal pins 110, a positive power supply tab 130a (positive power supply tab), a positive power supply tab 130B (positive power supply tab), a negative power supply tab 140 (negative power supply tab), and an output power supply tab 150, which in this example may be included in a molded body, such as the example molded body shown in fig. 2A and 2B. The electronic device assembly 100 further includes a molding compound 160, wherein portions of the plurality of signal pins 110, positive power supply tabs 130a, positive power supply tabs 130b, negative power supply tabs 140, and output power supply tabs 150 are accessible from outside of the molding compound 160 (e.g., they have portions disposed outside of the molding compound 160).

As described above, the electronic device assembly 100 may include a half-bridge circuit. In some embodiments, the half-bridge circuit may be implemented using one or more high-side switches and one or more low-side switches included on the substrate and encapsulated in the molding compound 160. For purposes of illustration, in this disclosure, a half-bridge circuit is described that includes a plurality of high-side switches and a plurality of corresponding low-side switches. In some embodiments, in some examples, the high-side and low-side switches may be implemented using power Metal Oxide Semiconductor Field Effect Transistors (MOSFETs), such as silicon carbide (SiC) MOSFETs, or may be implemented using Insulated Gate Bipolar Transistors (IGBTs).

In such an embodiment, positive power tab 130a and positive power tab 130b may be coupled with a high side switch (e.g., coupled with the drain terminal of a MOSFET or the collector terminal of an IGBT). The negative power tab 140 may be coupled with a low-side switch (e.g., coupled with a source terminal of a MOSFET or an emitter terminal of an IGBT). The output power tab 150 may be coupled with an output node of the half-bridge circuit (e.g., a common node of a high-side source terminal and a low-side drain terminal of a MOSFET, or a common node of a high-side emitter terminal and a low-side collector terminal of an IGBT). The plurality of signal pins 110 of the electronic component assembly 100 may be used to transmit signals, such as gate control signals, voltage sense signals, thermal sense signals, etc., for controlling and/or monitoring the operation of the half-bridge circuit.

Fig. 2A and 2B are diagrams illustrating an exemplary molded body 200 that may be included in the electronics assembly of fig. 1. Thus, the molded body 200 is described with further reference to the elements of the electronic device assembly 100 of fig. 1. Fig. 2A shows an isometric view of the molded body 200, and fig. 2B shows a side view of the molded body 200. As shown in fig. 2A and 2B, the molded body 200 includes a molded portion 210, which may be formed using, for example, injection molding. The molding portion 210 includes a surface S1 and a surface S2 opposite to the flat surface S1.

In this example, the plurality of signal pins 110, positive power supply tabs 130a, positive power supply tabs 130b, negative power supply tabs 140, and output power supply tabs 150 are integrated (included in or integrally integrated) in the molded portion 210 of the molded body 200. For example, in some embodiments, a plurality of signal pins and power tabs may be placed in a molding tool, and then the molded portion 210 may be formed, for example, using an injection molding or other molding process, to produce a molded body 200 that includes the plurality of signal pins and power tabs.

The molded body 200 shown in fig. 2A and 2B includes a plurality of protrusions 214 on the surface S1 from which the plurality of signal pins 110 protrude, respectively. That is, the plurality of protrusions 214 surround portions of the plurality of signal pins 110 near the surface S1, respectively. The plurality of protrusions 214 may provide mechanical support for the plurality of signal pins 110, for example, to help prevent misalignment of the signal pins and/or bending of the signal pins.

The molded body 200 also includes a plurality of alignment features 216 on the surface S1. In this example, the plurality of alignment features 216 are cylindrical protrusions on the surface S1 that define corresponding circular recesses 216a. In some embodiments, the circular recess may be a circular through hole in the molded portion 210. The corresponding circular recesses 216a of the plurality of alignment features 216 may matingly engage pins included in a molding cavity used to form the molding compound 160 of the electronic device assembly 100. That is, the plurality of alignment features 216 may facilitate alignment of the molded body 200 and associated substrate (such alignment being part of a transfer molding process). In some embodiments, the protrusions of the plurality of alignment features 216 may be omitted and the alignment features may be defined as recesses or through holes in the molded portion 210.

In this example, a portion of the power tab may be disposed in a slot defined in the molded portion 210, such as slot 151 shown in fig. 2A associated with the output power tab 150. These slots may be created by, for example, a molded portion 210 formed around the power tab during an injection molding process.

In fig. 2B (i.e., a side view of the molded body 200 from the right side of the view shown in fig. 2A), the molded portion 210 is shown as transparent so that the internal structure of the molded body 200 is visible. As shown in fig. 2B, each of the plurality of signal pins 110 includes a portion 110a and a portion 110B, wherein the portion 110a extends beyond a surface S1 of the molded portion 210 (e.g., from a corresponding one of the plurality of protrusions 214) and the portion 110B extends beyond a surface S2 of the molded portion 210. For a given signal pin, portions 110a and 110b are electrically continuous. That is, the portions 110a and 110b may be physically continuous or may be electrically coupled to each other within the molded portion 210. As shown in fig. 2B, the portion 110B of each signal pin may include a plurality of bends. These bends may be used to configure the plurality of signal pins 110, respectively: the respective substrates are contacted based on the locations of the contact pads for the signal pins on the substrates. That is, with the arrangement shown in fig. 2B, by appropriately constructing (bending) the inner signal pin portion (portion 110B), the same outer signal pin arrangement (portion 110 a) can be used for different modules (e.g., different substrate sizes and layouts, different package sizes, etc.). This enables interchangeability of modules in a given system, due to the use of the same external signal pin arrangement for different modules.

Fig. 2B also shows the arrangement of positive power supply tabs 130B and output power supply tabs 150 in the molded portion 210 of the molded body 200. Other power tabs (positive power tab 130a and negative power tab 140) may be similarly arranged, although they are not visible in the view of fig. 2B because they are arranged behind at least positive power tab 130B. As shown in fig. 2B, positive power tab 130B includes a portion 130B1 and a portion 130B2. Also, the output power tab 150 includes a portion 150a and a portion 150b. In this example, portion 130B1 and portion 150B are disposed in plane P and have surfaces parallel to surface S1 of mold portion 210 (to the left of the view of fig. 2B and exposed from mold compound 160). As further shown in fig. 2B, portions 130B2 and 150B extend beyond surface S2 of the molded portion and are orthogonal to plane P. In this example, positive power tab 130b and output power tab 150 (and other power tabs) are respective single bodies that are bent to define portions 130b1 and 130b2 of positive power tab 130b and portions 150a and 150b of output power tab 150.

Fig. 3 is a diagram illustrating an exemplary substrate assembly 300. The substrate assembly 300 is given by way of example and for illustrative purposes. The particular arrangement of the substrate assemblies will depend on the particular implementation. For example, the number of transistors may vary, the size and location of the contact pads may be different, etc. Also, while substrate assembly 300 is shown as implementing a half-bridge circuit, in some embodiments, other circuits may be implemented on a substrate assembly included in the electronic device assemblies described herein. In this example, the substrate assembly 300 may be included in the electronic device assembly 100 of fig. 1 and implemented in conjunction with the molded body 200 of fig. 2A and 2B. Thus, the substrate assembly 300 is further described with reference to the elements of the electronics assembly 100 and the molded body 200.

In the example of fig. 3, the substrate assembly 300 includes a direct-bonded metal (DBM) substrate, such as a direct-bonded copper (DBC) substrate. The DBM substrate of the substrate assembly 300 includes a ceramic layer 305. A patterned metal layer 310, such as a patterned copper layer, is disposed on (directly bonded to) the ceramic layer 305. The patterned metal layer 310 includes portions (sections) for implementing the half-bridge circuits of the substrate assembly 300. The substrate assembly 300 further includes a plurality of high side transistors 312, a plurality of low side transistors 313, a plurality of conductive clips 314, and a plurality of wire connections 316. The conductive clips and wire connections are used to make electrical connections to interconnect the plurality of high side transistors 312, the plurality of low side transistors 313, and the patterned metal layer 310 to thereby implement a half bridge circuit.

The substrate assembly 300 further includes a plurality of contact pads defined on the patterned metal layer 310 for coupling the signal pins and the power tabs with the half-bridge circuit. For example, substrate assembly 300 includes contact pad 330a, contact pad 330b, contact pad 340, and contact pad 350. In the electronic device assembly 100 of fig. 1, the positive power supply tab 130a may be coupled with the contact pad 330a, the positive power supply tab 130b may be coupled with the contact pad 330b, the negative power supply tab 140 may be coupled with the contact pad 340, and the output power supply tab 150 may be coupled with the contact pad 350. The substrate assembly 300 further includes a plurality of signal pin contact pads 355 to which the plurality of signal pins 110 (e.g., portions 110b of the plurality of signal pins 110) may be coupled, respectively.

Fig. 4A and 4B are diagrams illustrating exemplary aspects of an electronics assembly 400 (which may be an embodiment of the electronics assembly 100 of fig. 1). For example, the electronic device assembly 400 includes the molded body 200 of fig. 2A and 2B and the substrate assembly 300 of fig. 3. Accordingly, fig. 4A and 4B are further described with reference to elements of the electronic device assembly 100, the molded body 200, and the substrate assembly 300. Fig. 4A and 4B are side views of an electronics assembly 400, for example, a right side view of the arrangement of electronics assembly 100 in the view of fig. 1. In fig. 4A and 4B, the molding compound 160 and the molding portion 210 of the molded body 200 are shown as transparent to illustrate the internal structure of the electronic device assembly 400. Further, in fig. 4A and 4B, one or more elements of the electronics assembly 400 are not shown for clarity.

Fig. 4A illustrates the connection of a plurality of signal pins 110 to a substrate assembly 300 (e.g., the connection of a plurality of signal pins to a plurality of signal pin contact pads 355 of the substrate assembly 300). As shown in fig. 4A, the molding portion 210 of the molded body 200 is disposed within the molding compound 160, and the respective portions 110b of the plurality of signal pins 110 extend out of the molding portion 210 and are also disposed within the molding compound. As shown in fig. 4A, portion 110b of signal pin 110 is located inside electronics assembly 400. That is, the portion 110b is not exposed, e.g., the portion 110b is disposed within the molding portion 210 and/or the molding compound 160. Not all signal pins of the electronics assembly 400 are shown in fig. 4A, as some signal pins are located on the back side and are obscured by the signal pins 110 shown in the figure. Similarly, these blocked signal pins may be coupled with the substrate assembly 300. The plurality of bends in the portions 110b of the plurality of signal pins 110 are configured to align the respective portions 110b with their respective contact pads on the substrate assembly 300. Soldering, sintering, brazing, conductive adhesive, etc. may be used to couple portion 110b with substrate assembly 300.

Fig. 4B illustrates the connection of the positive power tab 130B and the output power tab 150 to the substrate assembly 300. The positive power tab 130a and the negative power tab 140 are not shown in fig. 4B because they are disposed on the back of the positive power tab 130B and are obscured in this view. Similarly, these shielded power tabs may be coupled with the substrate assembly 300. As shown in fig. 4A, the molded portion 210 of the molded body 200 in fig. 4B is disposed within the molding compound 160, and the portion 130B2 of the positive power tab 130B and the portion 150B of the output power tab 150 extend out of the molded portion 210 and are also disposed within the molding compound. Soldering, sintering, brazing, conductive adhesive, etc. may be used to couple portions 130b1 and 150b with substrate assembly 300. For example, portion 130b1 may be coupled with contact pad 330b and portion 150b may be coupled with contact pad 350.

Fig. 5A and 5B are diagrams illustrating another exemplary molded body 500 that may be included in an electronic device assembly. The molded body 500 includes similar aspects as the molded body 200 of fig. 2A and 2B. For example, the molded body 500 includes a molded portion 510, a plurality of signal pins 110 (having portions 110a and 110 b) integrated in the molded portion 510, a plurality of protrusions 514 surrounding portions of the signal pins 110, and a plurality of alignment features 516. For brevity, these features of the molded body 500 will not be described in detail with reference to fig. 5A and 5B. As shown in fig. 1 and 2 with respect to the molded body 200, fig. 5A shows an isometric view of the molded body 500, and fig. 5B shows a right side view of the molded body 500 arranged in fig. 5A. As with fig. 2B, in the view of fig. 5B, the molding portion 510 is shown as transparent so that the internal structure of the molded body 500 can be seen.

The molded body 500 differs from the molded body 200 in that the molded body 500 does not include a power tab for the associated electronics components that are included (integrated, consolidated) in the molded portion 510. In embodiments of an electronic device assembly including the molded body 500, power tabs may be implemented separate from the molded body 500 and coupled with a corresponding substrate assembly, either directly (e.g., using direct wire connections) or via corresponding conductive posts.

Fig. 6A-6C are diagrams illustrating exemplary aspects of an electronic device assembly 600 including the molded body 500 of fig. 5A and 5B. Accordingly, reference is made to the elements of the molded body 500 in the views of the electronics assembly 600 shown in fig. 6A-6C. As with electronic device assembly 100 and electronic device assembly 400, electronic device assembly 600 may implement a half-bridge circuit, however other circuit embodiments are possible. Fig. 6A shows a front side view of the electronics assembly 600, and fig. 6B and 6C show views from the right side of the electronics assembly 600 shown in the view of fig. 6A. In this example, the molded portion 510 of the molded body 500 may be encapsulated in a molding compound 660. In some embodiments, respective upper surfaces of the plurality of protrusions 514 may be exposed from the molding compound 660. For reference purposes, the mold portion 510 is shown in fig. 6A-6C to illustrate its placement in the mold compound 660.

The electronics assembly 600 includes a positive power tab 630a, a positive power tab 630b, a negative power tab 640, and an output power tab 650. In contrast to the electronic device assembly 100 in which the surface of the power tab is exposed from the molding compound 160, in the electronic device assembly 600 the power tab extends (protrudes) from a side surface or edge of the molding compound 660. For example, in the view of fig. 6A, positive power tab 630b, and negative power tab 640 extend from a bottom edge of electronics assembly 600, while output power tab 650 extends from a top edge of electronics assembly 600.

In the side view of the electronics assembly 600 in fig. 6A and 6C, as in the side view of the electronics assembly 400 in fig. 4A and 4B, the molding compound 660 and the molded portion 510 of the molded body 500 are shown as transparent to illustrate the internal structure of the electronics assembly 600. Further, in fig. 6B and 6C, one or more elements of the electronics assembly 600 are not shown for clarity.

Fig. 6B illustrates the connection of the plurality of signal pins 110 to the substrate assembly 300 a. The substrate assembly 300a may have the same or different configuration as the substrate assembly 300 of fig. 3, depending on the particular embodiment. As shown in fig. 6B, the mold portion 510 of the molded body 500 is disposed within the mold compound 660, and the respective portions 110B of the plurality of signal pins 110 extend out of the mold portion 510 and are also disposed within the mold compound. As shown in fig. 6A, as with the electronics assembly 400 shown in fig. 4A, the portion 110b of the signal pin 110 is located inside the electronics assembly 600. That is, the portion 110b is not exposed, e.g., the portion 110b is disposed within the molding portion 510 and/or the molding compound 160. Not all signal pins of the electronics assembly 600 are shown in fig. 6B, as some signal pins are located on the back side and are obscured by signal pins 110 shown in the figure. Similarly, these blocked signal pins may be coupled with the substrate assembly 300 a. The plurality of bends in the portions 110b of the plurality of signal pins 110 are configured to align the respective portions 110b with their respective contact pads on the substrate assembly 300 a. In this example, the plurality of signal pins 110 may have the same arrangement and corresponding functionality as the plurality of signal pins 110 of the electronics assemblies 100 and 400. Soldering, sintering, brazing, conductive adhesive, etc. may be used to couple the portion 110b of the signal pin 110 of the electronic device assembly 600 with the substrate assembly 300 a.

Fig. 6C illustrates the connection of the positive power tab 630b and the output power tab 650 to the substrate assembly 300 a. The positive power tab 630a and the negative power tab 640 are not shown in fig. 6C because they are disposed on the back of the positive power tab 630b and obscured from view in this view. Similarly, these occluded power tabs may be coupled with the substrate assembly 300 a. As shown in fig. 6B, the molding portion 510 of the molded body 500 in fig. 6C is disposed within a molding compound 660. In this example, respective portions of the positive power supply tab 630b and the output power supply tab 650 disposed within the molding compound 660 are bent, and contact surfaces of the bent portions are attached to (coupled to) respective contact pads of the substrate assembly 300 a. Positive power tab 630b and output power tab 650 may be coupled with substrate assembly 300a using soldering, sintering, brazing, conductive adhesive, or the like.

Fig. 7A and 7B are diagrams illustrating another exemplary electronics assembly 700. As with electronics assembly 100 and electronics assembly 400, electronics assembly 700 may implement a half-bridge circuit or other power semiconductor device module. For purposes of illustration, the electronic device assembly 700 is described as implementing a half-bridge circuit. As shown in fig. 7A, the electronic device assembly 700 includes a plurality of signal pins 710 inserted into an interposer 720. The plurality of signal pins 710 may be configured to: is press-fit into a corresponding signal pin receptacle included in interposer 720. In this example, the plurality of signal pins 710 may also be configured to: is press-fit inserted in an associated system including the electronics assembly 700. In some embodiments, the plurality of signal pins 710 may be configured for soldering connections in interposer 720 and/or related systems.

The electronics assembly 700 also includes a positive power tab 730a, a positive power tab 730b, a negative power tab 740, and an output power tab 750. The electronic device assembly 700 also includes a molding compound 760 that encapsulates portions of the electronic device assembly 700. As shown in fig. 7A, portions of interposer 720 may be exposed from molding compound 760 such that signal pin receptacles of interposer 720 are externally accessible for insertion of a plurality of signal pins 710. As also shown in fig. 7A, the corresponding surfaces of the power tabs are exposed from the molding compound 760. These surfaces may be used to electrically connect power tabs in related systems.

Fig. 7B shows an exploded view of the elements of the electronics assembly 700 of fig. 7A. For example, fig. 7B shows a plurality of signal pins 710, interposer 720, positive power tab 730a, positive power tab 730B, negative power tab 740, output power tab 750, and molding compound 760. In addition, fig. 7B shows a substrate assembly 300B of the electronic device assembly 700. In some embodiments, the substrate assembly 300b may be identical to the substrate assembly 300a of fig. 3, or may have a different configuration (e.g., size, layout, etc.) than it. Fig. 7B also shows conductive posts 732a coupled to positive power tab 730a, conductive posts 732B coupled to positive power tab 730B, and conductive posts 742 coupled to negative power tab 740. Although not visible in fig. 7B, the output power tab 750 may also have more than one conductive post coupled thereto. These conductive posts may facilitate electrically coupling the power tabs with the substrate assembly 300b in the electronic device assembly 700.

Fig. 8A-8D are diagrams illustrating multiple views of an interposer (e.g., interposer 720) that may be included in the electronic device assembly 700 of fig. 7A and 7B. Accordingly, for purposes of illustration, fig. 8A-8D are described with further reference to the electronics assembly 700 shown in fig. 7A and 7B. Fig. 8A shows a front side view of interposer 720, and fig. 8B shows a side view of interposer 720 from the right side in the view of fig. 8A. Fig. 8C shows a backside view of interposer 720. Fig. 8D shows an isometric view of the backside of interposer 720 with conductive pillars coupled to contact pads of interposer 720.

As shown in fig. 8A, interposer 720 includes a printed circuit board 721. The printed circuit board 721 may include multiple layers and have one or more signal distribution layers (redistribution layers, etc.). The printed circuit board 721 also includes a plurality of signal pin receptacles 722, which may be conductive vias that are electrically coupled to the printed circuit traces of the one or more redistribution layers, respectively. Printed circuit board 721 of interposer 720 further includes notch 830a, notch 830b, notch 840, and notch 850. In this example, the power tabs of the electronics assembly 700 may be disposed in cutouts of the printed circuit board 721, respectively. In some embodiments, the power tabs may be integrally integrated with interposer 720, for example, by being adhesively coupled in cutouts of printed circuit board 721.

As shown in the side view of fig. 8B, interposer 720 includes a plurality of caps 724 disposed on the back side of printed circuit board 721 of interposer 720, wherein plurality of caps 724 enclose (seal, cover) a plurality of signal pin receptacles 722 on the back side of interposer 720, respectively. In this example, the plurality of caps 724 may prevent molding compound from reaching the plurality of signal pin receptacles 722 during the molding packaging of the electronic device assembly 700 to prevent the molding compound from interfering with the insertion of the plurality of signal pins 710 into the plurality of signal pin receptacles 722. The plurality of caps 724 also prevent moisture and/or other contaminants from entering the electronics assembly 700 through the plurality of signal pin receptacles 722. Fig. 8B also shows a plurality of conductive posts 726 that are electrically coupled to the printed circuit board 721 of the interposer 720, e.g., the plurality of conductive posts are electrically coupled to contact pads disposed on the back surface of the printed circuit board 721. In this example, one or more redistribution layers of the printed circuit board 721 may electrically couple the plurality of signal pins 710 with a plurality of conductive posts 726, respectively, wherein the plurality of conductive posts 726 are arranged in a corresponding manner to contact pads on the substrate assembly 300 b. As with mold 200 and mold 500, redistribution of signals (e.g., from a plurality of signal pins 710 to a plurality of conductive posts 726) facilitates consistent signal pin placement for different semiconductor device modules (e.g., different package sizes, different contact pad locations on a substrate assembly).

Fig. 8C shows the backside of interposer 720 without a plurality of conductive pillars 726. For example, as shown in fig. 8C, the printed circuit board 721 includes a plurality of contact pads 725 to which a plurality of conductive posts 726 may be coupled (e.g., by soldering, sintering, brazing, etc.). Fig. 8D shows an isometric view of interposer 720 in which a plurality of conductive posts 726 are coupled to a plurality of contact pads 725. In some embodiments, the plurality of conductive posts 726 may be included in the substrate assembly 300b instead of the interposer 720. In such an embodiment, the plurality of conductive posts 726 may then be coupled with the plurality of contact pads 725 during assembly of the electronic device assembly 700.

Fig. 9A and 9B are diagrams illustrating exemplary aspects of an electronic device assembly, such as the electronic device assembly 700 of fig. 7A and 7B. Accordingly, fig. 9A and 9B are further described and illustrated with reference to elements of the electronic device assembly 700 and interposer 720. Fig. 9A and 9B are side views of an electronics assembly 700, e.g., a right side view of an arrangement of electronics assembly 700 in the view of fig. 7A. The molding compound 760 and/or the plurality of caps 724 are shown transparent in fig. 9A and 9B to illustrate the internal structure of the electronic device assembly 700. Further, in the views of fig. 9A and 9B, one or more elements of the electronics assembly 700 are not shown for clarity. Fig. 9A shows the plurality of signal pins 710 after insertion into the plurality of signal pin receptacles 722 of interposer 720.

As shown in fig. 9A, respective portions of the plurality of signal pins 710 are disposed within a plurality of caps 724. The plurality of signal pin receptacles 722, a layer or redistribution layer of the printed circuit board 721, and a plurality of contact pads 725 may electrically couple the plurality of signal pins 710 with corresponding ones of the plurality of conductive posts 726. Not all signal pins of the electronics assembly 700 are shown in fig. 9A, as some signal pins are located on the back side and are obscured by signal pins 710 shown in the figure. Similarly, these blocked signal pins may be plugged into corresponding ones of the plurality of signal pin receptacles 722.

Fig. 9B illustrates the electrical connection of the positive power tab 730B and the output power tab 750 to the substrate assembly 300B. The positive power tab 730a and the negative power tab 740 are not shown in fig. 9B because they are disposed on the back of the positive power tab 730B and are obscured in this view. Similarly, these occluded power tabs may be coupled with the substrate assembly 300 b. As shown in fig. 9B, the portion of positive power supply tab 730B that is inside of molding compound 760 is coupled to substrate assembly 300B via conductive post 732B, while the portion of output power supply tab 750 that is inside of molding compound 760 is coupled to substrate assembly 300B via conductive post 752. Positive power tab 730b and output power tab 750 may be coupled to conductive post 732b and conductive post 752, respectively, and conductive posts 732b and 752 may be coupled to substrate 300d using soldering, sintering, brazing, conductive adhesive, or the like.

Fig. 10 is a diagram illustrating another exemplary electronics assembly 700a. In this example, the electronics assembly 700a is a variation of the electronics assembly 700 of fig. 7A and 7B. Thus, the electronic device assembly 700a is further described and illustrated with reference to the elements of the electronic device assembly 700. As schematically illustrated in fig. 10, at least one electronic component 1010 may be included on interposer 720 of electronic device assembly 700a. Although visible in fig. 10, in some embodiments, the electronic components 1010 may be disposed within (encapsulated within) a molding compound 760. As also schematically illustrated in fig. 10, the electronic component 1010 may be electrically coupled with the plurality of signal pins 710 via a redistribution layer 1015, which may be one of a plurality of redistribution layers of the interposer 720. In some embodiments, the electronic component 1010 may include an integrated circuit (e.g., a gate driver circuit), passive elements (e.g., capacitors, resistors, and/or inductors), and the like.

Fig. 11A-11D are diagrams illustrating another exemplary electronics assembly 1100. As shown in fig. 11A, the electronics assembly 1100 includes a heat sink device 1110. As two examples, the heat sink device 1110 may be a heat sink or a fluid cooling jacket. As shown in fig. 11A, a plurality of semiconductor device modules 1120 may be disposed on the heat sink apparatus 1110. In some embodiments, the plurality of semiconductor device modules 1120 may be implemented using the methods described herein. In the electronic device assembly 1100, a surface of the heat sink apparatus 1110 may have a plurality of grooves defined therein, wherein the grooves are configured to anchor the molding compound of the plurality of semiconductor device modules 1120 to the surface of the heat sink apparatus 1110. For example, for a particular semiconductor device module 1120, grooves 1112a and 1112b may each extend from an edge E1 of heat sink 1110 to an edge E2 of heat sink 1110, where edge E2 is opposite edge E1. In this example, groove 1112b is spaced apart from and parallel to groove 1112 a.

Fig. 11B shows a portion of a heat sink apparatus 1110 of a particular semiconductor device module 1120. As shown in fig. 11B, a substrate 300c that may be used to implement the power semiconductor circuits of a particular semiconductor device module 1120 may be disposed between the grooves 1112a and the grooves 1112B. In some embodiments, grooves 1112a and 1112b may be formed using a machining operation, or during casting of heat sink apparatus 1110. As further shown in fig. 11B, the heat sink device 1110 may include a protrusion 1114a disposed along the edge E1 and a protrusion 1114B disposed along the edge E2. As further described below with reference to fig. 11D, the protrusions 1114a and 1114b may be configured to further anchor the molding compound of the semiconductor module to the surface of the heat sink 1110.

Fig. 11C shows an exploded view of a semiconductor device module 1120 of the electronic device assembly 1100 and a corresponding portion of a surface of the heat sink apparatus 1100, wherein the semiconductor device module 1120 is disposed on the corresponding portion of the surface of the heat sink apparatus in the electronic device assembly 1100. As shown in fig. 11C, the module 1120 includes a molding compound 1160 encapsulating portions of the module 1120. In this example, molding compound 1160 includes anchor portions 1122a corresponding to grooves 1112a and anchor portions 1122b corresponding to grooves 1112 b. In other words, as shown in fig. 11D, the substrate 300c of the module 1120 is coupled to the heat sink device 1110 by the sintering material 1170, and after the package molding operation, the anchor portion 1122a of the molding compound 1160 will be disposed in the groove 1112a, and the anchor portion 1122b of the molding compound 1160 will be disposed in the groove 1112 b. Fig. 11C further shows an enlarged view of groove 1112a (which may also be applied to groove 1112 b), wherein groove 1112a (and groove 1112 b) are configured to anchor molding compound 1160 to a surface of heat sink 1110 via anchor portion 1122a and anchor portion 1122b, respectively.

Fig. 11D shows a side view of the module 1120 from the right side of the arrangement shown in fig. 11A, e.g., the electronics assembly 1100 is cut along the groove 1112 b. As shown in fig. 11D, the molding compound 1160 may extend around the protrusion 1114a below the protrusion 1114a and around the protrusion 1114b below the protrusion 1114 b. That is, the molding compound may encapsulate the protrusions 1114a and 1114b to further anchor the molding compound 1160 to the surface of the heat sink 1110. The methods of fig. 11A-11D help prevent the molding compound 1160 from peeling from the heat sink 1110 due to thermal cycling associated with long term use and/or the molding compound from peeling from the heat sink 1110 during reliability testing.

Fig. 12A and 12B are diagrams illustrating exemplary aspects of another electronics assembly 1200. Illustratively and for purposes of illustration, the electronics assembly 1200 is described as implementing a half-bridge circuit. The external signal pin (e.g., for signal pin 1210) and power tab arrangement of electronics assembly 1200 is consistent with the external signal pin and power tab arrangement of electronics assembly 600. However, in contrast to the electronics assembly 600, the electronics assembly 1200 does not include the molded body 500 and differs at least in how the power tabs are coupled with the corresponding substrate (substrate 300 d). For example, the electronic device assembly 1200 includes a positive power tab 1230a, a positive power tab 1230b, a negative power tab 1240, and an output power tab 1250 for a half-bridge circuit. As with the power tabs of the electronics assembly 600, portions of the power tabs of the electronics assembly 1200 can extend (extend) from the edges of the molding compound 1260.

In this example, the power tabs may each include a respective straight body (copper body) coupled with the substrate 300c through a respective conductive post. For example, fig. 12B shows a side view of the electronics assembly 1200 from the right side of the electronics assembly 1200 shown in fig. 12A. As with the side view of the electronics assembly 400 (in fig. 4A and 4B) and the side view of the electronics assembly 600 (in fig. 6B and 6C), the molding compound 1260 is shown as transparent to illustrate the internal structure of the electronics assembly 1200. Further, in fig. 12B, one or more elements of the electronics assembly 1200 are not shown for clarity. Fig. 12B shows the connection of positive power tab 1230B and output power tab 1250 to substrate 300 d. The positive power tab 1230B and the negative power tab 1240 are not shown in fig. 12B because they are disposed on the back of the positive power tab 1230B and are obscured in this view. Similarly, these blocked power tabs may be coupled with the substrate 300 d.

As shown in fig. 12B, the portion of positive power tab 1230B located inside molding compound 1260 is coupled to substrate 300d via conductive post 1232B, while the portion of output power tab 1250 located inside molding compound 1260 is coupled to substrate 300d via conductive post 1252. The positive power tab 1230b and the output power tab 1250 may be coupled with the conductive posts 1232b and 1252, respectively, and the conductive posts 1232b and 1252 may be coupled with the substrate 300d using soldering, sintering, brazing, conductive adhesive, or the like.

Fig. 13A and 13B are diagrams illustrating exemplary aspects of another electronics assembly 1300. Illustratively and for purposes of illustration, the electronics assembly 1300 is described as implementing a half-bridge circuit. In contrast to the electronics assembly 1200, the electronics assembly 1300 has an external power tab arrangement in which respective surfaces of the power tabs are exposed from the molding compound 1360. For example, the electronics assembly 1300 includes a positive power supply tab 1330a, a positive power supply tab 1330b, a negative power supply tab 1340, and an output power supply tab 1350 for a half-bridge circuit, each having a surface exposed from the molding compound 1360. As with the power tabs of the electronic device assembly 1200, the electronic devices of the power tab assembly 1300 may each include a respective straight body (copper body) coupled with the substrate 300c via a respective conductive post.

For example, fig. 13B shows a side view of the electronics assembly 1300 from the right side of the electronics assembly 1300 shown in fig. 13A. As with the side view of the electronics assembly 1200 in fig. 12A, the molding compound 1360 is shown as transparent to illustrate the internal structure of the electronics assembly 1300. Further, in fig. 13B, one or more elements of the electronics assembly 1300 are not shown for clarity. Fig. 13B shows the connection of the positive power tab 1330B and the output power tab 1350 to the substrate 300 e. The positive power tab 1330B and the negative power tab 1340 are not shown in fig. 13B because they are disposed on the back of the positive power tab 1330B and are obscured in this view. Similarly, these blocked power tabs may be coupled with the substrate 300 e.

As shown in fig. 13B, the portion of positive power supply tab 1330B that is inside molding compound 1360 is coupled with substrate 300e via conductive post 1332B, while the portion of output power supply tab 1350 that is inside molding compound 1360 is coupled with substrate 300e via conductive post 1352. The positive power tab 1330b and the output power tab 1350 may be coupled with the conductive posts 1332b and 1352, respectively, and the conductive posts 1332b and 1352 may be coupled with the substrate 300d using soldering, sintering, brazing, conductive adhesive, or the like.

Due to the use of the straight body power tabs and conductive posts, the power tab arrangement of the electronics assembly 1200 and 1300 may reduce stray inductance as compared to previous embodiments. For example, the present embodiments may reduce stray inductance due to reduced overall conduction length associated with the power supply tabs and/or reduced current path direction changes in the power supply tab current path. In the embodiments described herein, the conductive pillars may be, for example, copper pillars.

Fig. 14 is a diagram illustrating a unitary power tab frame. In some embodiments, a unitary power tab frame 1400 may be used to produce the electronic device assembly 1300 of fig. 13A and 13B. A similar unitary power tab frame may be used to produce the electronic device assembly 1200 of fig. 12A and 12B. As shown in fig. 14, unitary power tab frame 1400 includes a frame portion 1410, a power tab 1430a (e.g., a positive power tab), a power tab 1430b (e.g., a positive power tab), a power tab 1440 (e.g., a negative power tab), and a power tab 1450 (e.g., an output power tab). For example, the power tabs and frame portion 1410 of the unitary power tab frame 1400 are formed as a single body using a stamping process. For example, in the methods described herein, during module assembly, the power tabs of the unitary power tab frame 1400 may be coupled with the substrate of the electronic device assembly using, for example, corresponding conductive posts. The frame portion 1410 may then be used as an alignment mechanism for positioning the substrate in a molding cavity for package molding (e.g., transfer molding). This helps prevent dislocation of the substrate in the mold cavity. After the molding process is completed, the power tabs may be separated from the frame portion 1410 using a trimming process.

Fig. 15 is a flow chart illustrating an exemplary method 1500 for manufacturing an electronic device assembly. In some embodiments, the method 1500 may be used to produce the electronic device assembly 100 of fig. 1, which may implement, for example, a semiconductor device power module such as a half-bridge circuit. As shown in fig. 15, the method 1500 includes: at block 1505, one or more semiconductor die are sintered to a substrate, such as a patterned metal layer of a DBM substrate. In some embodiments, other methods may be used to couple the semiconductor die to the substrate, such as soldering, brazing, conductive adhesive, and the like. At block 1510, method 1500 includes disposing (arranging, mounting) one or more conductive clips on a patterned metal layer on a semiconductor die and/or substrate. The operations at block 1510 may include performing a solder paste printing operation to apply an electrical solder paste on a surface of the semiconductor die and/or the patterned metal layer to which a corresponding surface of the conductive clip is to be attached. At block 1515, method 1500 includes performing a soldering operation to electrically and physically couple the conductive clip of block 1510 with the semiconductor die and/or the patterned metal layer. At block 1520, the method 1500 includes a cleaning operation (e.g., a flux cleaning operation) to remove flux in the soldering operation of block 1515. At block 1525, method 1500 includes forming a wire connection between the semiconductor die and the patterned metal layer.

At block 1530, the method 1500 further includes disposing (arranging, mounting) one or more signal pins and one or more power tabs on the patterned metal layer of the substrate. The signal pins and/or power tabs may be included in a molded body (including both signal pins and power tabs) such as the molded body of fig. 2A and 2B, or in a molded body (including signal pins) such as the molded body of fig. 5A and 5B. Operations at block 1530 may include performing a solder paste printing operation to apply an electrical solder paste on a surface of the patterned metal layer to which corresponding surfaces of the signal pins and the power tabs are to be attached. At block 1535, the method 1500 includes performing a soldering operation to electrically and physically couple the signal pins and power tabs of block 1530 with the patterned metal layer. At block 1540, the method 1500 includes a cleaning operation (e.g., a flux cleaning operation) to remove flux in the soldering operation of block 1535.

At block 1545, the method 1500 includes a molding operation (e.g., a transfer molding operation) that may be performed to encapsulate portions of the produced electronic device assembly. At block 1550, the method 1500 includes a trimming operation to remove excess molding compound in the molding operation of block 1545. At block 1555, the method 1500 includes a trimming operation to separate the power tabs from the associated frame. In some embodiments, for example, in embodiments in which the power tab is included in a molded body (e.g., molded body 200 of fig. 2A and 2B), the trimming operation at block 1555 may be omitted. At block 1560, the packaged semiconductor device assembly produced by blocks 1505 through 1555 may be attached by sintering to a heat sink (heat sink, heat dissipation mechanism, etc.), such as a heat spreader or fluid cooling jacket. Other attachment methods may be used at block 1560, such as soldering, brazing, thermally conductive adhesives, and the like.

Fig. 16 is a flow chart illustrating another exemplary method 1600 for manufacturing an electronic device assembly. In some embodiments, method 1600 may be used to produce electronic device assembly 700 of fig. 7A, which may implement, for example, a semiconductor device power module such as a half-bridge circuit. As shown in fig. 16, a method 1600 includes: at block 1605, one or more semiconductor die are sintered to a substrate, such as a patterned metal layer of a DBM substrate. In some embodiments, other methods may be used to couple the semiconductor die to the substrate, such as soldering, brazing, conductive adhesive, and the like. At block 1610, method 1600 includes disposing (arranging, mounting) one or more conductive clips on a patterned metal layer on a semiconductor die and/or substrate. The operations at block 1610 may include performing a solder paste printing operation to apply an electrical solder paste on a surface of the semiconductor die and/or the patterned metal layer to which a corresponding surface of the conductive clip is to be attached. At block 1615, method 1600 includes performing a soldering operation to electrically and physically couple the conductive clip of block 1610 to the semiconductor die and/or the patterned metal layer. At block 1620, the method 1600 includes a cleaning operation (e.g., a flux cleaning operation) to remove flux in the soldering operation of block 1615. At block 1625, method 1600 includes forming a wire connection between the semiconductor die and the patterned metal layer.

At block 1630, the method 1600 further includes disposing (arranging, mounting) a plurality of conductive posts on the patterned metal layer of the substrate. Operations at block 1630 may also include disposing (arranging, installing) an interposer (e.g., interposer 720) and one or more power tabs, respectively, on the conductive pillars. In some embodiments, the conductive posts may be included in the interposer, in the substrate, and/or in the power tabs. Operations at block 1630 may include performing a solder paste printing operation to coat surfaces of the contact pads of the patterned metal layer and/or interposer to which corresponding surfaces of the signal pins, conductive posts, and/or power tabs are to be attached. At block 1635, the method 1600 includes performing a soldering operation to electrically and physically couple the conductive pillars with the patterned metal layer, the contact pads of the interposer, and/or the one or more power tabs. At block 1640, method 1600 includes a cleaning operation (e.g., a flux cleaning operation) to remove flux in the soldering operation of block 1635.

At block 1645, method 1600 includes a molding operation (e.g., a transfer molding operation) that may be performed to encapsulate portions of the produced electronic device assembly. At block 1650, method 1600 includes a trimming operation to remove excess molding compound in the molding operation of block 1645. At block 1655, the method 1600 includes a trimming operation to separate the power tab from the associated frame. In some embodiments, for example, in embodiments in which the power tab is integrally included in the interposer, the trimming operation at block 1655 may be omitted. At block 1660, the packaged semiconductor device assembly produced by blocks 1605-1655 may be attached to a heat sink (heat sink, heat dissipation mechanism, etc.) such as a heat spreader or fluid cooling jacket using sintering. Other attachment methods may be used at block 1660, such as soldering, brazing, thermally conductive adhesives, and the like. At block 1665, signal pins may be inserted (e.g., press-fit) into signal pin receptacles of an interposer.

Fig. 17 is a flow chart illustrating another exemplary method 1700 for manufacturing an electronic device assembly. In some embodiments, the method 1700 may be used to produce the electronics assembly 1100 of fig. 11A, which may include a plurality of semiconductor device power modules (e.g., half-bridge circuits) disposed on a heat sink or fluid cooling jacket. As shown in fig. 17, at block 1705, method 1700 includes sintering one or more substrates (e.g., DBM substrates) onto a heat sink. In some embodiments, other processes (e.g., soldering, brazing, conductive adhesive, etc.) may be used to couple one or more substrates with the heat sink device. At block 1710, the method 1700 includes sintering one or more semiconductor die onto each of the one or more substrates, e.g., to a patterned metal layer of a DBM substrate. In some embodiments, other methods (e.g., soldering, brazing, conductive adhesive, etc.) may be used to couple the semiconductor die to the substrate.

At block 1715, method 1700 includes disposing (arranging, mounting) one or more conductive clips onto the patterned metal layer on the semiconductor die and/or substrate. The operations at block 1715 may include performing a solder paste printing operation to apply an electrical solder paste on a surface of the semiconductor die and/or the patterned metal layer to which a corresponding surface of the conductive clip is to be attached. At block 1720, the method 1700 includes performing a soldering operation to electrically and physically couple the conductive clip of block 1715 to the semiconductor die and/or the patterned metal layer. At block 1725, the method 1700 includes a cleaning operation (e.g., a flux cleaning operation) to remove flux in the soldering operation of block 1720. At block 1730, method 1700 includes forming a wire connection between a semiconductor die and a patterned metal layer.

At block 1735, the method 1700 further includes disposing (disposing, mounting) the signal pins (or conductive posts of the interposer assembly) and the power tabs on the patterned metal layer of the substrate. In some embodiments, the signal pins, conductive posts, and/or power tabs may be included in a molded body or interposer assembly, such as described herein. In some embodiments, such as those using press-fit signal pins, the application signal pins may be omitted at block 1735. The operations at block 1735 may include performing a solder paste printing operation to apply an electrical solder paste on a surface of the patterned metal layer to which corresponding surfaces of the signal pins, conductive posts, and/or power tabs are to be attached. At block 1740, the method 1700 includes performing a soldering operation to electrically and physically couple the signal pins, conductive posts, and/or power tabs of block 1735 with the patterned metal layer. At block 1745, the method 1700 includes a cleaning operation (e.g., a flux cleaning operation) to remove flux in the soldering operation of block 1740.

At block 1750, a molding operation (e.g., a transfer molding operation) may be performed to encapsulate portions of the electronic device assembly created on the heat sink device, such as encapsulation of the molding compound 1160 shown in fig. 11C and 11D. At block 1755, method 1700 includes a trimming operation to remove excess molding compound in the molding operation of block 1750. At block 1760, the method 1700 includes a trimming operation to separate the power tabs from the associated frame. In some embodiments, for example, in embodiments in which the power tab is integrally included in the molded body or interposer, the trimming operation at block 1760 may be omitted. At block 1765, a signal pin (e.g., a press-fit signal pin) is inserted. In an embodiment, the signal pins are applied at block 1735 and soldered at block 1740, the signal pin insertion operation at block 1765 may be omitted.

Fig. 18 is a flow chart illustrating another exemplary method 1800 for manufacturing an electronic device assembly. In some embodiments, method 1800 may be used to produce electronic device assembly 1200 of fig. 12A or electronic device assembly 1300 of fig. 13A, which may implement a semiconductor device power module such as a half-bridge circuit. As shown in fig. 18, the method 1800 includes: at block 1805, one or more semiconductor die are sintered to a substrate, such as a patterned metal layer of a DBM substrate. In some embodiments, other methods (e.g., soldering, brazing, conductive adhesive, etc.) may be used to couple the semiconductor die to the substrate. At block 1810, the method 1800 includes disposing (arranging, mounting) one or more conductive clips, one or more signal pins, one or more conductive posts, and/or one or more conductive tabs of an electronics assembly. The operations at block 1810 may include performing a solder paste printing operation to apply an electrical solder paste to couple the respective surfaces to one another. At block 1815, method 1800 includes performing a soldering operation to electrically and physically couple the surfaces of the conductive clips, signal pins, conductive posts, and/or power tabs of block 1810 with the corresponding surfaces of the semiconductor die and/or patterned metal layer. At block 1820, the method 1800 includes a cleaning operation (e.g., a flux cleaning operation) to remove flux in the soldering operation of block 1815. At block 1825, method 1800 includes forming a wire connection between the semiconductor die and the patterned metal layer.

At block 1830, the method 1800 includes a molding operation (e.g., a transfer molding operation) that may be performed to encapsulate portions of the produced electronic device assembly. At block 1835, the method 1800 includes a trimming operation to remove excess molding compound in the molding operation of block 1830. At block 1840, the method 1800 includes a trimming operation to separate the power tabs from the associated frame. At block 1845, the packaged semiconductor device assembly produced by blocks 1805 through 1840 may be attached (coupled) to a heat sink apparatus (heat sink, heat dissipation mechanism, etc.), such as a heat spreader or fluid cooling jacket. Other attachment methods may be used at block 1845, such as soldering, brazing, thermally conductive adhesives, and the like.

It will be understood that in the foregoing description, when an element such as a layer, region or substrate is referred to as being "on", "connected" to, electrically connected "to, coupled" to or electrically coupled "to another element, it can be directly on, connected or coupled to the other element or intervening elements may be present. In contrast, when an element is referred to as being "directly on," "directly connected to" or "directly coupled to" another element or layer, there are no intervening elements or layers present. Although the terms "directly on … …," directly connected to, "or" directly coupled to "may not be used throughout, elements shown as" directly on … …, "" directly connected to, "or" directly coupled to "may be referred to as" directly on … …, "" directly connected to, "or" directly coupled to. The claims of the present application may be modified to document exemplary relationships described in the specification or shown in the drawings.

As used in this specification, the singular forms may include the plural unless the context clearly indicates otherwise. Spatially relative terms (e.g., above, over, above, below, beneath, under, lower, top, bottom, etc.) are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. In some embodiments, the relative terms "above" and "below" may include vertically above and vertically below, respectively. In some embodiments, the term "adjacent" may include laterally adjacent or horizontally adjacent.

Some embodiments may be implemented using a variety of different semiconductor processing and/or packaging techniques. Some embodiments may be implemented using a variety of different types of semiconductor device processing techniques associated with semiconductor substrates including, but not limited to, for example, silicon (Si), silicon carbide (SiC), gallium arsenide (GaAs), gallium nitride (GaN), and/or the like.

Although certain features of the described embodiments have been illustrated as described herein, many modifications, substitutions, changes, and equivalents will now occur to those skilled in the art. It is, therefore, to be understood that the appended claims are intended to cover all such modifications and changes as fall within the scope of the embodiments. It is understood that these are by way of example only and not limitation, and that various changes in form and details may be made. Any portion of the apparatus and/or methods described herein can be combined in any combination, except mutually exclusive combinations. The embodiments described herein may include various combinations and/or sub-combinations of the functions, components, and/or features of the different embodiments described.

Claims

1. An electronic device assembly, the electronic device assembly comprising:

a substrate having a surface;

a patterned metal layer disposed on a surface of the substrate;

a semiconductor device circuit implemented on the patterned metal layer; and

a molded body comprising a plurality of signal pins, a single signal pin of the plurality of signal pins comprising:

a first portion extending from a first surface of the molded body, the first portion being externally accessible; and

a second portion protruding from a second surface of the molded body opposite the first surface, the second portion:

inside the electronics assembly;

electrically coupled to the patterned metal layer; and

electrically continuous with the first portion.

2. The electronic device assembly of claim 1, wherein the second portion of the signal pin comprises a plurality of bends.

3. The electronic device assembly of claim 1, wherein the molded body comprises a plurality of alignment features configured to position the electronic device assembly in a package molding tool, the plurality of alignment features comprising at least one of:

A plurality of recesses in a first surface of the molded body; or alternatively

A plurality of through holes in the molded body.

4. The electronic device assembly of claim 1, wherein the molded body further comprises a plurality of power tabs, a single power tab of the plurality of power tabs comprising:

a first portion disposed in a plane parallel to a first surface of the molded body; and

a second portion orthogonal to the first portion, the second portion of the power tab:

extending from a second surface of the molded body;

electrically continuous with the first portion of the power tab; and is also provided with

Electrically coupled to the patterned metal layer,

a first portion of the power tab is disposed in a slot defined in the molded body, and

5. The electronic device assembly of claim 1, wherein the molded body further comprises a plurality of power tabs, a single power tab of the plurality of power tabs comprising:

extending from a second surface of the molded body;

Electrically coupled to the patterned metal layer,

the second portion of the power tab is a conductive post that electrically couples the first portion of the power tab with the patterned metal layer.

6. An electronic device assembly, the electronic device assembly comprising:

a substrate having a surface;

a patterned metal layer disposed on a surface of the substrate;

a semiconductor device circuit implemented on the patterned metal layer;

an interposer having a first side and a second side opposite the first side, the interposer comprising:

a plurality of signal pin receptacles accessible from a first side of the interposer;

a plurality of caps surrounding the plurality of signal pin receptacles on a second side of the interposer, respectively; and

at least one signal redistribution layer electrically coupling the plurality of signal pin receptacles to a plurality of contact pads on a second side of the interposer, respectively; and

A plurality of conductive pillars electrically coupling the plurality of contact pads with the patterned metal layer, respectively.

7. The electronic device assembly of claim 6, further comprising at least one electronic component disposed on the first side of the interposer, the at least one electronic component electrically coupled with at least one of the plurality of signal pin receptacles via the at least one signal redistribution layer.

8. The electronic device assembly of claim 6, wherein:

the interposer includes a printed circuit board; and is also provided with

The interposer further includes a plurality of cutouts, and the electronic device assembly further includes:

a plurality of power tabs disposed in the plurality of cutouts, respectively; and

a plurality of conductive posts electrically coupling the plurality of power tabs with the patterned metal layer, respectively.

9. The electronic device assembly of claim 6, wherein the electronic device assembly further comprises:

a molding compound from which the plurality of signal pin receptacles are exposed; and

and the signal pins are respectively inserted into the signal pin sockets.

10. An electronic device assembly, the electronic device assembly comprising:

a heat sink apparatus having a surface, the heat sink apparatus comprising:

a first recess defined in the surface; and

a second groove defined in the surface, the second groove spaced apart from and parallel to the first groove;

a substrate coupled to a surface of the heat sink device, the substrate disposed between the first recess and the second recess;

a semiconductor device circuit implemented on the substrate; and

a molding compound, a first portion of the molding compound encapsulating the substrate and semiconductor device circuitry, a second portion of the molding compound disposed in the first recess, and a third portion of the molding compound disposed in the second recess.

11. The electronic device assembly of claim 10, wherein:

the first groove extends from a first edge of the heat sink device to a second edge of the heat sink device, the second edge being opposite the first edge; and is also provided with

The second recess extends from a first edge of the heat sink to a second edge of the heat sink,

The heat dissipating device further includes:

a first protrusion disposed between the first recess and the second recess along a first edge of the heat sink device, the fourth portion of the molding compound encapsulating the first protrusion; and

a second protrusion disposed between the first recess and the second recess along a second edge of the heat sink device, the fifth portion of the molding compound encapsulating the second protrusion.

12. The electronic device assembly of claim 10, wherein the electronic device assembly further comprises:

a plurality of externally accessible signal pins; and

a plurality of externally accessible power tabs.