CN117007948B - Chip test device - Google Patents
Chip test device Download PDFInfo
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- CN117007948B CN117007948B CN202311280748.7A CN202311280748A CN117007948B CN 117007948 B CN117007948 B CN 117007948B CN 202311280748 A CN202311280748 A CN 202311280748A CN 117007948 B CN117007948 B CN 117007948B
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- chip
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- water tank
- box
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- 238000012360 testing method Methods 0.000 title claims abstract description 129
- 230000007246 mechanism Effects 0.000 claims abstract description 41
- 239000004065 semiconductor Substances 0.000 claims abstract description 28
- 238000001179 sorption measurement Methods 0.000 claims abstract description 19
- 238000007789 sealing Methods 0.000 claims abstract description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 141
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000005057 refrigeration Methods 0.000 claims description 7
- 238000005485 electric heating Methods 0.000 claims description 5
- 239000000523 sample Substances 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 3
- 230000003028 elevating effect Effects 0.000 claims 3
- 230000002745 absorbent Effects 0.000 claims 1
- 239000002250 absorbent Substances 0.000 claims 1
- 238000010521 absorption reaction Methods 0.000 claims 1
- 238000000605 extraction Methods 0.000 abstract description 27
- 238000000034 method Methods 0.000 abstract description 9
- 230000008569 process Effects 0.000 abstract description 8
- 238000001816 cooling Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/82—Rotary or reciprocating members for direct action on articles or materials, e.g. pushers, rakes, shovels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D31/00—Other cooling or freezing apparatus
- F25D31/005—Combined cooling and heating devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2877—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to cooling
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
The invention discloses a chip test device, which relates to the technical field of semiconductor chips and comprises a test box and chip blocks, wherein movable grooves are formed in two sides of the test box, sealing plates are sleeved in inner cavities of the two movable grooves, movable frames are fixedly sleeved on the two sealing plates, and one ends of the movable frames extend to the outside of the test box. This chip test device adsorbs fixedly through adsorption equipment and air extraction mechanism to the chip piece that does not test or test is accomplished, drive movable frame, chip piece lateral shifting through the cooperation between reciprocating screw and the movable block, place the chip piece that does not test into the chip standing groove through a first electric putter and test, place the chip piece that the test is accomplished on conveying mechanism to carry next process with another first electric putter, realized carrying out the function of automatic unloading to the chip piece of test, improved this chip test device's convenience.
Description
Technical Field
The invention relates to the technical field of semiconductor chips, in particular to a chip test device.
Background
The semiconductor chip is a semiconductor device which is etched and wired on a semiconductor sheet and can realize certain functions, the semiconductor chip is a core component in various equipment, the semiconductor chip is widely applied to the fields of mobile broadband, internet, national defense and military and the like, in order to meet the requirements of mass production and ensure the stability of the semiconductor chip in operation, the semiconductor chip is required to be tested after the production of the semiconductor chip is finished so as to screen out the semiconductor chip with higher performance reliability, different application requirements of people are met, the semiconductor chip to be tested is placed on a wafer carrying table in the test, but the efficiency of the test of the semiconductor chip is influenced by manual placement and taking of workers in the test of the conventional semiconductor chip, and besides the test of whether the semiconductor chip can operate or not, the stability of the semiconductor chip in operation under different temperature environments is also required to be considered.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a chip test device which can realize automatic loading and unloading of a semiconductor chip during detection and ensure the detection of the running stability of the semiconductor chip under the simulated high-temperature or low-temperature condition.
In order to achieve the above purpose, the invention is realized by the following technical scheme: the utility model provides a chip test device, includes test box and chip piece, the movable groove has all been seted up to the both sides of test box, two the inner chamber of movable groove all overlaps and is equipped with the shrouding, the side of shrouding is laminated with the inner wall of movable groove mutually, utilizes the shrouding to seal the movable groove, two fixed the cup joint has the fly frame on the shrouding, the one end of fly frame extends to the outside of test box, the bottom of fly frame is provided with two adsorption mechanisms that adsorb the chip piece, be provided with the suction mechanism that carries out the air extraction to the adsorption mechanism on fly frame and the test box, the top of test box inner chamber rotates and is connected with the reciprocating screw, the outside screw thread of reciprocating screw cup joints the movable block, the top surface of movable block is laminated with the top surface of test box inner chamber, the bottom surface of movable block is connected with the top surface of fly frame, during the use, drives movable block, fly frame, and chip piece lateral shifting through the cooperation between the movable block, the both sides of test box inner chamber are fixed mounting respectively has touch sensor, the side mounting of test box motor has the first guide screw, guide table Wen Chengpian is provided with the guide groove to the bottom of the test box inner chamber, guide table 35 is provided with the bottom of the test box 35, guide table top of the test box bottom is provided with, guide groove 35 is provided with, guide groove bottom of the test box bottom is provided with, guide groove 35, the cooling down, and is provided with the bottom of the test box is provided with the cooling groove down to the test table down, and is equipped with the cooling down to the test box, the other side of the test box is provided with a conveying mechanism for conveying the tested chip blocks.
Further, the adsorption mechanism comprises an extension column arranged at the bottom of the movable frame and a mounting groove arranged in the movable frame, a telescopic groove is formed in the bottom surface of the extension column, a first electric push rod is fixedly arranged in the mounting groove, the output end of the first electric push rod extends to the inner cavity of the telescopic groove and is fixedly connected with a lifting seat, the side surface of the lifting seat is attached to the inner wall of the telescopic groove, a spring is fixedly connected to the bottom surface of the lifting seat, a T-shaped round box is fixedly connected to the bottom end of the spring, a plurality of adsorption holes are formed in the bottom of the extension column, and the side surface of the top end of the T-shaped round box is attached to the inner wall of the telescopic groove.
Further, the air extraction mechanism comprises an air extraction pump fixedly installed on the side face of the test box and a main air extraction groove formed in the movable frame, two second air extraction hoses are arranged at the bottom of the main air extraction groove and located in the movable frame, the bottom ends of the two second air extraction hoses penetrate through the inner cavity of the telescopic groove and are fixedly sleeved to the inner cavity of the T-shaped round box, the input end of the air extraction pump is fixedly connected with a first air extraction hose, and the bottom end of the first air extraction hose is fixedly sleeved to the inner cavity of the main air extraction groove.
Further, the refrigeration mechanism comprises a cold water tank fixedly connected to the bottom surface of the test box, a semiconductor refrigeration sheet is fixedly arranged at the bottom of the cold water tank, a refrigeration surface of the semiconductor refrigeration sheet is located in an inner cavity of the cold water tank, a first water pump is fixedly arranged at the side part of the cold water tank, the input end of the first water pump extends to the inner cavity of the cold water tank, a first water inlet pipe is fixedly connected to the output end of the first water pump, one end of the first water inlet pipe extends to the inner cavity of the annular groove, a first water return pipe is fixedly sleeved on the side part of the cold water tank, one end of the first water return pipe extends to the inner cavity of the test box and is fixedly connected with a first electric control valve, and the input end of the first electric control valve extends to the inner cavity of the annular groove.
Further, heating mechanism includes the hot-water tank of fixed connection in the test box bottom surface, the inner chamber fixed mounting of hot-water tank has the electric bar, the side fixed mounting of hot-water tank has the second water pump, the input of second water pump extends to the inner chamber of hot-water tank, the output fixedly connected with second inlet tube of second water pump, the one end of second inlet tube extends to the inner chamber of ring channel, the lateral part of hot-water tank is fixed to be cup jointed the second wet return, the one end of second wet return extends to the inner chamber of test box and fixedly connected with second electrically controlled valve, the input of second electrically controlled valve extends to the inner chamber of ring channel.
Further, the feeding mechanism comprises a chip feeding box fixedly connected to one side of the test box, a second electric push rod is fixedly installed at the bottom of an inner cavity of the chip feeding box, a top plate is fixedly connected to the output end of the second electric push rod, a plurality of chip blocks are placed on the top surface of the top plate, and a feeding door is hinged to the front surface of the chip feeding box.
Further, the conveying mechanism comprises two conveying frames fixedly connected to the other side of the test box, two conveying rollers are rotatably connected between the conveying frames, a conveying belt is connected between the conveying rollers in a transmission mode, the side face of the conveying belt is attached to the inner wall of the conveying frame, a second motor is fixedly arranged on the outer side of the conveying frame, and an output shaft of the second motor is connected with one end of a rotating shaft of the conveying roller.
Further, the inner walls of the cold water tank and the hot water tank are fixedly provided with temperature sensors, the front surfaces of the cold water tank and the hot water tank are provided with threaded plugs in a threaded mode, and the front surfaces of the cold water tank and the hot water tank are fixedly provided with display screens.
Further, the front of the test box is hinged with a sealing door, the front of the sealing door is provided with a perspective plate, and the front of the test box is fixedly provided with a controller.
The invention provides a chip test device, which has the following beneficial effects:
1. this chip test device adsorbs fixedly through adsorption equipment and air extraction mechanism to the chip piece that does not test or test is accomplished, drive movable frame, chip piece lateral shifting through the cooperation between reciprocating screw and the movable block, place the chip piece that does not test into the chip standing groove through a first electric putter and test, place the chip piece that the test is accomplished on conveying mechanism to carry next process with another first electric putter, realized carrying out the function of automatic unloading to the chip piece of test, improved this chip test device's convenience.
2. The chip test device utilizes the semiconductor refrigerating sheet and the electric heating rod to respectively refrigerate and heat water in the inner cavities of the cold water tank and the hot water tank, cold water in the inner cavity of the cold water tank is pumped into the annular groove through the first water pump in the process of the chip block operation test, cold water in the inner cavity of the annular groove is led into the inner cavity of the chip placing groove through the guide Wen Chengpian table, so that the chip block is positioned in a low-temperature environment for operation, cold water in the inner cavity of the annular groove flows back into the cold water tank through opening the first electric control valve, in addition, the first electric control valve is closed, the second electric control valve is opened, hot water in the inner cavity of the hot water tank is pumped into the annular groove through the second water pump in the process of the chip block operation test, hot water in the inner cavity of the annular groove is led into the inner cavity of the chip placing groove through the guide Wen Chengpian table, and hot water in the inner cavity of the annular groove flows back into the hot water tank through the second electric control valve, so that the chip block is repeatedly operated in the high-temperature environment, the chip block is operated in the high-temperature environment, the stability of the chip block in operation test under different environments is realized, and the work quality of the chip test device is improved.
Drawings
FIG. 1 is a schematic cross-sectional view of the present invention;
FIG. 2 is a schematic diagram of the structure of the present invention;
FIG. 3 is a schematic cross-sectional view of a test chamber of the present invention;
FIG. 4 is an enlarged schematic view of the structure of the present invention at A in FIG. 1;
FIG. 5 is a schematic perspective view of a chip supply cartridge according to the present invention;
fig. 6 is a schematic perspective view of a T-shaped round box according to the present invention.
In the figure: 1. a test chamber; 2. a movable groove; 3. a sealing plate; 4. a movable frame; 5. an extension column; 6. an adsorption mechanism; 7. an air extraction mechanism; 8. a reciprocating screw rod; 9. a moving block; 10. a first motor; 11. a guide Wen Chengpian; 13. an annular groove; 14. a chip placement groove; 15. a probe; 16. a refrigeration mechanism; 17. a heating mechanism; 18. a supply mechanism; 19. a conveying mechanism; 20. a telescopic slot; 21. a mounting groove; 22. a first electric push rod; 23. a lifting seat; 24. a spring; 25. t-shaped round box; 26. adsorption holes; 27. an air extracting pump; 28. a first air extraction hose; 29. a main air extraction groove; 30. a second air extraction hose; 31. a contact sensor; 32. a chip supply box; 33. a feeding door; 34. a second electric push rod; 35. a top plate; 36. a chip block; 37. a cold water tank; 38. a semiconductor refrigeration sheet; 39. a first water pump; 40. a first water inlet pipe; 41. a first return pipe; 42. a first electrically controlled valve; 43. a hot water tank; 44. an electric heating rod; 45. a second water pump; 46. a second water inlet pipe; 47. a second return pipe; 48. a second electrically controlled valve; 49. a temperature sensor; 50. a display screen; 51. a threaded plug; 52. a carriage; 53. a conveying roller; 54. a conveyor belt; 55. a second motor; 56. sealing the door; 57. a perspective plate; 58. and a controller.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
Referring to fig. 1 to 6, the present invention provides a technical solution: a chip test device comprises a test box 1 and a chip block 36, wherein movable grooves 2 are respectively arranged on two sides of the test box 1, sealing plates 3 are respectively sleeved in inner cavities of the two movable grooves 2, the side surfaces of the sealing plates 3 are attached to the inner walls of the movable grooves 2, so that the movable grooves 2 are sealed by the sealing plates 3, movable frames 4 are fixedly sleeved on the two sealing plates 3, one ends of the movable frames 4 extend to the outside of the test box 1, two adsorption mechanisms 6 for adsorbing the chip block 36 are arranged at the bottoms of the movable frames 4, air suction mechanisms 7 for sucking air in the adsorption mechanisms 6 are arranged on the movable frames 4 and the test box 1, a reciprocating screw rod 8 is rotationally connected to the top of the inner cavity of the test box 1, a movable block 9 is sleeved on the outer side threads of the reciprocating screw rod 8, the top surface of the movable block 9 is attached to the top surface of the inner cavity of the test box 1, the movable block 9 is limited by the top surface of the inner cavity of the test box 1, the movable block 9 can only move along the axial direction of the reciprocating screw rod 8, the bottom surface of the movable block 9 is connected with the top surface of the movable frame 4, when the movable block 9 is used, the movable block 9, the movable frame 4, the sealing plate 3 and the chip block 36 are driven to move transversely through the cooperation between the reciprocating screw rod 8 and the movable block 9, the contact sensors 31 are fixedly arranged on the two sides of the top end of the inner cavity of the test box 1 respectively, the moving position of the movable block 9 is detected by the contact sensors 31, the first motor 10 is fixedly arranged on the side surface of the test box 1, the output shaft of the first motor 10 is connected with the end part of the reciprocating screw rod 8, the bottom of the inner cavity of the test box 1 is provided with the guide Wen Chengpian table 11, the top surface of the guide Wen Chengpian table 11 is provided with the chip placing groove 14, the bottom of the inner cavity of the chip placing groove 14 is provided with the probe 15, the inner cavity size of the chip placing groove 14 is matched with the outline size of the chip block 36, the chip block 36 is guaranteed to be stably placed in the inner cavity of the chip placing groove 14, the contact end on the chip block 36 is just contacted with the probe 15, the annular groove 13 is arranged in the guide Wen Chengpian table 11, the refrigerating mechanism 16 for introducing cold water into the annular groove 13 is arranged at the bottom of the test box 1, the heating mechanism 17 for introducing hot water into the annular groove 13 is arranged at the bottom of the test box 1, the supply mechanism 18 for supporting the chip block 36 is arranged on one side of the test box 1, and the conveying mechanism 19 for conveying the tested chip block 36 is arranged on the other side of the test box 1.
The adsorption mechanism 6 includes an extension column 5 disposed at the bottom of the movable frame 4 and a mounting groove 21 disposed inside the movable frame 4, the bottom surface of the extension column 5 is provided with a telescopic groove 20, a first electric push rod 22 is fixedly mounted inside the mounting groove 21, an output end of the first electric push rod 22 extends to an inner cavity of the telescopic groove 20 and is fixedly connected with a lifting seat 23, a side surface of the lifting seat 23 is attached to an inner wall of the telescopic groove 20, a spring 24 is fixedly connected to the bottom surface of the lifting seat 23, the T-shaped round box 25 can stretch and retract by utilizing the elastic force of the spring 24, damage to the chip 36 caused by the T-shaped round box 25 when the chip 36 is extruded and fixed is avoided, a T-shaped round box 25 is fixedly connected to the bottom end of the spring 24, the distance between the two T-shaped round boxes 25 is equal to the distance between the chip accommodating groove 14 and the chip accommodating box 32, and the bottom end of the T-shaped round box 25 extends to the bottom of the extension column 5 and is provided with a plurality of adsorption holes 26, and the bottom end of the T-shaped round box 25 is attached to the inner wall of the telescopic groove 20.
The air extraction mechanism 7 comprises an air extraction pump 27 fixedly installed on the side face of the test box 1 and a main air extraction groove 29 formed in the movable frame 4, two second air extraction hoses 30 are arranged at the bottom of the main air extraction groove 29 and located in the movable frame 4, the bottom ends of the two second air extraction hoses 30 penetrate through the inner cavity of the telescopic groove 20 and are fixedly sleeved to the inner cavity of the T-shaped round box 25, the input end of the air extraction pump 27 is fixedly connected with a first air extraction hose 28, and the bottom end of the first air extraction hose 28 is fixedly sleeved to the inner cavity of the main air extraction groove 29.
The refrigerating mechanism 16 comprises a cold water tank 37 fixedly connected to the bottom surface of the test box 1, water is arranged in an inner cavity of the cold water tank 37, a semiconductor refrigerating sheet 38 is fixedly arranged at the bottom of the cold water tank 37, a refrigerating surface of the semiconductor refrigerating sheet 38 is located in the inner cavity of the cold water tank 37, a heating surface of the semiconductor refrigerating sheet 38 is located at the bottom of the cold water tank 37 so as to radiate heat to the outside air, a first water pump 39 is fixedly arranged at the side part of the cold water tank 37, an input end of the first water pump 39 extends to the inner cavity of the cold water tank 37, a first water inlet pipe 40 is fixedly connected to an output end of the first water pump 39, one end of the first water inlet pipe 40 extends to the inner cavity of the annular groove 13, a first water return pipe 41 is fixedly sleeved on the side part of the cold water tank 37, one end of the first water return pipe 41 extends to the inner cavity of the test box 1 and is fixedly connected with a first electric control valve 42, and an input end of the first electric control valve 42 extends to the inner cavity of the annular groove 13.
The heating mechanism 17 comprises a hot water tank 43 fixedly connected to the bottom surface of the test box 1, water is pre-arranged in the inner cavity of the hot water tank 43, an electric heating rod 44 is fixedly arranged in the inner cavity of the hot water tank 43, a second water pump 45 is fixedly arranged on the side surface of the hot water tank 43, the input end of the second water pump 45 extends to the inner cavity of the hot water tank 43, the output end of the second water pump 45 is fixedly connected with a second water inlet pipe 46, one end of the second water inlet pipe 46 extends to the inner cavity of the annular groove 13, a second water return pipe 47 is fixedly sleeved on the side part of the hot water tank 43, one end of the second water return pipe 47 extends to the inner cavity of the test box 1 and is fixedly connected with a second electric control valve 48, and the input end of the second electric control valve 48 extends to the inner cavity of the annular groove 13.
The feeding mechanism 18 comprises a chip feeding box 32 fixedly connected to one side of the test box 1, a second electric push rod 34 is fixedly arranged at the bottom of an inner cavity of the chip feeding box 32, a top plate 35 is fixedly connected to the output end of the second electric push rod 34, the side face of the top plate 35 is attached to the inner wall of the chip feeding box 32, a plurality of chip blocks 36 are placed on the top face of the top plate 35, the external dimension of the chip blocks 36 is matched with the size of the inner cavity of the chip feeding box 32, the chip blocks 36 are guaranteed to be stably placed in the chip feeding box 32, the chip blocks 36 are adsorbed and moved through a T-shaped round box 25 and then are just placed in the chip placing groove 14, and the front face of the chip feeding box 32 is hinged with a feeding door 33.
The conveying mechanism 19 comprises two conveying frames 52 fixedly connected to the other side of the test box 1, two conveying rollers 53 are rotatably connected between the two conveying frames 52, a conveying belt 54 is connected between the two conveying rollers 53 in a transmission mode, the side face of the conveying belt 54 is attached to the inner wall of the conveying frame 52, the phenomenon that chip blocks 36 conveyed on the conveying belt 54 drop from the side face is avoided, a second motor 55 is fixedly arranged on the outer side of one conveying frame 52, and an output shaft of the second motor 55 is connected with one end of a rotating shaft of one conveying roller 53.
Wherein, the inner wall of cold water tank 37 and hot-water tank 43 all fixed mounting has temperature sensor 49, detects the temperature of cold water tank 37 and hot-water tank 43 inner chamber through temperature sensor 49, and screw plug 51 is all installed to the front of cold water tank 37 and hot-water tank 43, and the water that pulls out, adds and change in cold water tank 37 and hot-water tank 43 through removing screw plug 51, and the front of cold water tank 37 and hot-water tank 43 all fixed mounting has display screen 50, utilizes display screen 50 to show the temperature that temperature sensor 49 detected.
The front of the test box 1 is hinged with a sealing door 56, the front of the sealing door 56 is provided with a perspective plate 57, the process of testing the chip block 36 in the inner cavity of the test box 1 is controlled through the perspective plate 57, a controller 58 is fixedly arranged on the front of the test box 1, the device is controlled through the controller 58, and meanwhile, the test result of the chip block 36 is displayed.
In summary, when the chip test device is used, firstly, the chip block 36 to be tested is placed in the inner cavity of the chip supply box 32, and after the uppermost chip block 36 is taken away, the second electric push rod 34 is utilized to drive the top plate 35 to drive the chip block 36 to move upwards, so that the top surface of the uppermost chip block 36 is lifted to be level with the top surface of the chip supply box 32 at the moment;
then, the first electric push rod 22 is started to drive the two groups of lifting seats 23, the springs 24 and the T-shaped round box 25 to move downwards, so that the bottom surface of the T-shaped round box 25 is contacted with the top surface of a chip block 36 at the top of the inner cavity of the chip supply box 32, the air suction pump 27 is started to suck air into the inner cavity of the T-shaped round box 25 through the first air suction hose 28, the main air suction groove 29 and the second air suction hose 30, at the moment, the suction holes 26 generate suction force to suck the chip block 36 in the inner cavity of the chip supply box 32, the first electric push rod 22 is started again to drive the lifting seats 23, the springs 24, the T-shaped round box 25 and the chip block 36 to move upwards, the first motor 10 is started to drive the reciprocating screw rod 8 to rotate, the moving block 9, the movable frame 4 and the sealing plate 3 and the chip block 36 are driven to move transversely through the cooperation between the reciprocating screw rod 8 and the moving block 9, when the contact sensor 31 at the right side is contacted with the moving block 9, the controller 58 controls the first motor 10 to stop running, the chip block 36 just moves to the position right above the chip placing groove 14, at the moment, the first electric push rod 22 is started again to place the chip block 36 into the inner cavity of the chip placing groove 14, so that the chip block 36 is contacted with the probe 15, the operation of the air pump 27 is stopped to remove the adsorption of the adsorption hole 26 on the chip block 36, at the moment, the first motor 10 and the first electric push rod 22 drive the two T-shaped round boxes 25 to move back to the original position again, the side surface of the moving block 9 is contacted with the left contact sensor 31, the first electric push rod 22 is started to drive the two T-shaped round boxes 25 to move downwards again, one T-shaped round box 25 is contacted with the top surface of the other chip block 36 in the inner cavity of the chip supplying box 32, preparation is made for the next chip block 36 to be loaded, the other T-shaped round box 25 is contacted with the top surface of the chip block 36 placed in the inner cavity of the chip placing groove 14, fixing the chip block 36 placed in the chip placement groove 14;
then, running the chip block 36 placed in the chip placing groove 14, simultaneously starting the semiconductor refrigerating sheet 38 and the electric heating rod 44 to respectively refrigerate and heat water in the inner cavity of the cold water tank 37 and the hot water tank 43, starting the first water pump 39 to pump cold water in the inner cavity of the cold water tank 37 into the annular groove 13 through the first water inlet pipe 40 in the running test process of the chip block 36, guiding cold meaning of the cold water in the annular groove 13 into the inner cavity of the chip placing groove 14 through the guide Wen Chengpian table 11 to enable the chip block 36 to run in a low-temperature environment, and enabling cold water in the inner cavity of the annular groove 13 to flow back into the cold water tank 37 through the first water return pipe 41 by opening the first electric control valve 42, and in addition, closing the first electric control valve 42 and opening the second electric control valve 48, starting the second water pump 45 to pump hot water in the inner cavity of the hot water tank 43 into the annular groove 13 through the second water inlet pipe 46 in the running test process of the chip block 36, guiding hot meaning of the hot water in the annular groove 13 into the inner cavity of the chip placing groove 14 through the guide Wen Chengpian table 11 to enable the chip block 36 to run in a high-temperature environment, and enabling hot water in the inner cavity of the annular groove 13 to flow back into the annular groove 43 through the second electric control valve 48 to run in the high-temperature environment, and repeatedly running test process of the chip block 43;
finally, after the test is completed, the suction pump 27 is started to enable the suction holes 26 on the bottom surfaces of the two T-shaped round boxes 25 to generate suction force, one T-shaped round box 25 adsorbs the chip blocks 36 in the chip supply box 32, the other T-shaped round box 25 adsorbs the chip blocks 36 in the inner cavity of the chip placement groove 14, the first electric push rod 22 is started to drive the T-shaped round boxes 25 and the chip blocks 36 to move upwards, the first motor 10 is started to drive the reciprocating screw rod 8 to rotate, the movable frame 4, the T-shaped round boxes 25 and the two chip blocks 36 are driven to move by utilizing the cooperation between the reciprocating screw rod 8 and the movable block 9, one chip block 36 is moved to the upper side of the chip placement groove 14, the tested chip blocks 36 are moved to the upper side of the conveying belt 54, the chip blocks 36 are placed in the inner cavity of the chip placement groove 14 and the top surface of the conveying belt 54 respectively, the suction pump 27 is closed to release the adsorption of the chip blocks 36, the second motor 55 is started to drive the conveying roller 53 and the conveying belt 54 to rotate along the pointer, the tested chip blocks 36 are conveyed to the lower working procedure by utilizing the conveying belt 54, and after the two T-shaped round boxes 25 are reset to the chip blocks 14 again, the chip blocks can be placed in the inner cavity of the chip placement groove 14.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (9)
1. The utility model provides a chip test device, includes test box (1) and chip piece (36), its characterized in that: the utility model discloses a test box, including test box (1), movable groove (2) have all been seted up to both sides of test box (1), two the inner chamber of movable groove (2) is all overlapped and is equipped with shrouding (3), the side of shrouding (3) is laminated with the inner wall of movable groove (2), utilizes shrouding (3) to seal movable groove (2), two fixed movable rack (4) of having cup jointed on shrouding (3), the outside that extends to test box (1) of one end of movable rack (4), the bottom of movable rack (4) is provided with two adsorption units (6) that adsorb chip piece (36), be provided with on movable rack (4) and test box (1) and carry out suction unit (7) to suction in adsorption unit (6), the top rotation of test box (1) inner chamber is connected with reciprocating screw (8), the outside screw thread of reciprocating screw (8) has cup jointed movable block (9), the top surface of movable block (9) and the top surface of test box (1) inner chamber laminate mutually, when the bottom surface and movable rack (4) of movable block (9) carry out absorbent adsorption unit (6), through reciprocating screw (9) and movable rack (3) and the horizontal movement between chip piece (4) and the movable rack (3), the utility model discloses a test box, including test box (1), contact sensor (31) are fixed mounting respectively to both sides on inner chamber top, the side fixed mounting of test box (1) has first motor (10), the output shaft of first motor (10) is connected with the tip of reciprocal lead screw (8), the bottom of test box (1) inner chamber is provided with leads Wen Chengpian platform (11), the top surface of leading Wen Chengpian platform (11) is provided with chip standing groove (14), the bottom of chip standing groove (14) inner chamber is provided with probe (15), the inside of leading Wen Chengpian platform (11) is provided with ring channel (13), the bottom of test box (1) is provided with the refrigeration mechanism (16) of leading into cold water in ring channel (13), the bottom of test box (1) is provided with the mechanism (17) of heating that leads into hot water in ring channel (13), one side of test box (1) is provided with and is used for carrying out feeding mechanism (18) of supporting chip piece (36), the opposite side of test box (1) is provided with carries out conveying mechanism (19) to chip piece (36) after the test.
2. The chip test apparatus according to claim 1, wherein: the utility model provides an adsorption equipment (6) is including setting up extending column (5) in adjustable shelf (4) bottom and seting up mounting groove (21) in adjustable shelf (4) inside, flexible groove (20) have been seted up to the bottom surface of extending column (5), the inside fixed mounting of mounting groove (21) has first electric putter (22), the output of first electric putter (22) extends to the inner chamber and the fixedly connected with elevating socket (23) of flexible groove (20), the side of elevating socket (23) is laminated with the inner wall of flexible groove (20) mutually, the bottom fixedly connected with spring (24) of elevating socket (23), the bottom fixedly connected with T shape circle box (25) of spring (24), the bottom of T shape circle box (25) extends to the bottom of extending column (5) and sets up a plurality of absorption holes (26), the side on T shape circle box (25) top is laminated with the inner wall of flexible groove (20) mutually.
3. A chip test apparatus according to claim 2, wherein: the utility model provides a set of flexible hose (29) is drawn together in the main air suction groove (29) of sucking pump (27) and seting up in movable frame (4) inside of fixed mounting in test box (1) side, the bottom of main air suction groove (29) just is located the inside of movable frame (4) and is provided with two second air suction hose (30), two the inner chamber that flexible groove (20) was run through to the bottom of second air suction hose (30) and fixedly cup joint to the inner chamber of T shape circle box (25), the input fixedly connected with first air suction hose (28) of sucking pump (27), the bottom fixed of first air suction hose (28) cup joints to the inner chamber of main air suction groove (29).
4. The chip test apparatus according to claim 1, wherein: the refrigerating mechanism (16) comprises a cold water tank (37) fixedly connected to the bottom surface of the test box (1), a semiconductor refrigerating sheet (38) is fixedly arranged at the bottom of the cold water tank (37), a refrigerating surface of the semiconductor refrigerating sheet (38) is located in an inner cavity of the cold water tank (37), a first water pump (39) is fixedly arranged at the side part of the cold water tank (37), the input end of the first water pump (39) extends to the inner cavity of the cold water tank (37), a first water inlet pipe (40) is fixedly connected to the output end of the first water pump (39), one end of the first water inlet pipe (40) extends to the inner cavity of the annular groove (13), a first water return pipe (41) is fixedly sleeved at the side part of the cold water tank (37), one end of the first water return pipe (41) extends to the inner cavity of the test box (1) and is fixedly connected with a first electric control valve (42), and the input end of the first electric control valve (42) extends to the inner cavity of the annular groove (13).
5. The chip test apparatus according to claim 4, wherein: the heating mechanism (17) comprises a hot water tank (43) fixedly connected to the bottom surface of the test box (1), an electric heating rod (44) is fixedly arranged in an inner cavity of the hot water tank (43), a second water pump (45) is fixedly arranged on the side surface of the hot water tank (43), an input end of the second water pump (45) extends to the inner cavity of the hot water tank (43), a second water inlet pipe (46) is fixedly connected to an output end of the second water pump (45), one end of the second water inlet pipe (46) extends to the inner cavity of the annular groove (13), a second water return pipe (47) is fixedly sleeved on the side portion of the hot water tank (43), one end of the second water return pipe (47) extends to the inner cavity of the test box (1) and is fixedly connected with a second electric control valve (48), and an input end of the second electric control valve (48) extends to the inner cavity of the annular groove (13).
6. The chip test apparatus according to claim 1, wherein: the feeding mechanism (18) comprises a chip feeding box (32) fixedly connected to one side of the test box (1), a second electric push rod (34) is fixedly installed at the bottom of an inner cavity of the chip feeding box (32), a top plate (35) is fixedly connected to the output end of the second electric push rod (34), a plurality of chip blocks (36) are placed on the top surface of the top plate (35), and a feeding door (33) is hinged to the front surface of the chip feeding box (32).
7. The chip test apparatus according to claim 1, wherein: conveying mechanism (19) are including two carriage (52) of fixed connection at test box (1) opposite side, two rotate between carriage (52) and be connected with two conveying roller (53), two the transmission is connected with conveyer belt (54) between conveying roller (53), the side of conveyer belt (54) is laminated with the inner wall of carriage (52), one the outside fixed mounting of carriage (52) has second motor (55), the output shaft of second motor (55) is connected with one end of a conveying roller (53) pivot.
8. The chip test apparatus according to claim 5, wherein: the inner walls of the cold water tank (37) and the hot water tank (43) are fixedly provided with temperature sensors (49), the front faces of the cold water tank (37) and the hot water tank (43) are provided with threaded plugs (51) in a threaded mode, and the front faces of the cold water tank (37) and the hot water tank (43) are fixedly provided with display screens (50).
9. The chip test apparatus according to claim 1, wherein: the front of the test box (1) is hinged with a sealing door (56), the front of the sealing door (56) is provided with a perspective plate (57), and the front of the test box (1) is fixedly provided with a controller (58).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311280748.7A CN117007948B (en) | 2023-10-07 | 2023-10-07 | Chip test device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311280748.7A CN117007948B (en) | 2023-10-07 | 2023-10-07 | Chip test device |
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| CN117007948A CN117007948A (en) | 2023-11-07 |
| CN117007948B true CN117007948B (en) | 2023-12-15 |
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| CN213170297U (en) * | 2020-07-04 | 2021-05-11 | 天津方圆系统集成有限公司 | A sucker structure for chip test |
| CN114371190A (en) * | 2022-01-10 | 2022-04-19 | 上海鎏汇达高科技发展集团有限公司 | Temperature test box with good heat insulation effect |
| CN115999656A (en) * | 2023-02-14 | 2023-04-25 | 鹰潭泰尔物联网研究中心有限公司 | Quick temperature change test box with automatic defrosting device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021115169A1 (en) * | 2019-12-13 | 2021-06-17 | 山东才聚电子科技有限公司 | Chip detection device, chip detection system, and control method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07240449A (en) * | 1994-02-25 | 1995-09-12 | Aging Tesuta Kaihatsu Kyodo Kumiai | Semiconductor chip tester |
| JPH07287049A (en) * | 1994-04-15 | 1995-10-31 | Fujitsu Ltd | Testing device for semiconductor chip |
| CN104603626A (en) * | 2012-09-11 | 2015-05-06 | 夏普株式会社 | Testing jig, inspection device, mounting device, and testing device |
| CN207271275U (en) * | 2017-09-29 | 2018-04-27 | 淮安欣展高分子科技有限公司 | One kind is used for high-and-low temperature humid heat test box |
| CN213170297U (en) * | 2020-07-04 | 2021-05-11 | 天津方圆系统集成有限公司 | A sucker structure for chip test |
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| CN115999656A (en) * | 2023-02-14 | 2023-04-25 | 鹰潭泰尔物联网研究中心有限公司 | Quick temperature change test box with automatic defrosting device |
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|---|---|
| CN117007948A (en) | 2023-11-07 |
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Application publication date: 20231107 Assignee: Yancheng Haoxin Technology Co.,Ltd. Assignor: Jiangsu Haoyang Microelectronics Co.,Ltd. Contract record no.: X2023980053701 Denomination of invention: A chip testing device Granted publication date: 20231215 License type: Common License Record date: 20231223 |