CN117004357A - Underfill composition, preparation method and application thereof - Google Patents
Underfill composition, preparation method and application thereof Download PDFInfo
- Publication number
- CN117004357A CN117004357A CN202310925145.1A CN202310925145A CN117004357A CN 117004357 A CN117004357 A CN 117004357A CN 202310925145 A CN202310925145 A CN 202310925145A CN 117004357 A CN117004357 A CN 117004357A
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- CN
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- Prior art keywords
- parts
- underfill composition
- agent
- epoxy resin
- diglycidyl ether
- Prior art date
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- Pending
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- 239000000203 mixture Substances 0.000 title claims abstract description 33
- 238000002360 preparation method Methods 0.000 title abstract description 4
- 239000003822 epoxy resin Substances 0.000 claims abstract description 24
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 24
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000012745 toughening agent Substances 0.000 claims abstract description 17
- 229920000459 Nitrile rubber Polymers 0.000 claims abstract description 14
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 12
- 229920001971 elastomer Polymers 0.000 claims abstract description 12
- 239000007788 liquid Substances 0.000 claims abstract description 12
- 239000005077 polysulfide Substances 0.000 claims abstract description 12
- 229920001021 polysulfide Polymers 0.000 claims abstract description 12
- 150000008117 polysulfides Polymers 0.000 claims abstract description 12
- 239000000654 additive Substances 0.000 claims abstract description 11
- 230000000996 additive effect Effects 0.000 claims abstract description 11
- 239000007822 coupling agent Substances 0.000 claims abstract description 11
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 11
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims abstract description 6
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical group C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000012752 auxiliary agent Substances 0.000 claims description 9
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 claims description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- XUCHXOAWJMEFLF-UHFFFAOYSA-N bisphenol F diglycidyl ether Chemical compound C1OC1COC(C=C1)=CC=C1CC(C=C1)=CC=C1OCC1CO1 XUCHXOAWJMEFLF-UHFFFAOYSA-N 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 claims description 2
- FGPFIXISGWXSCE-UHFFFAOYSA-N 2,2-bis(oxiran-2-ylmethoxymethyl)propane-1,3-diol Chemical compound C1OC1COCC(CO)(CO)COCC1CO1 FGPFIXISGWXSCE-UHFFFAOYSA-N 0.000 claims description 2
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 claims description 2
- ZJRAAAWYHORFHN-UHFFFAOYSA-N 2-[[2,6-dibromo-4-[2-[3,5-dibromo-4-(oxiran-2-ylmethoxy)phenyl]propan-2-yl]phenoxy]methyl]oxirane Chemical compound C=1C(Br)=C(OCC2OC2)C(Br)=CC=1C(C)(C)C(C=C1Br)=CC(Br)=C1OCC1CO1 ZJRAAAWYHORFHN-UHFFFAOYSA-N 0.000 claims description 2
- BWDQITNIYSXSON-UHFFFAOYSA-N 2-[[3,5-bis(oxiran-2-ylmethoxy)phenoxy]methyl]oxirane Chemical compound C1OC1COC(C=C(OCC1OC1)C=1)=CC=1OCC1CO1 BWDQITNIYSXSON-UHFFFAOYSA-N 0.000 claims description 2
- UUODQIKUTGWMPT-UHFFFAOYSA-N 2-fluoro-5-(trifluoromethyl)pyridine Chemical compound FC1=CC=C(C(F)(F)F)C=N1 UUODQIKUTGWMPT-UHFFFAOYSA-N 0.000 claims description 2
- IMKMEPLAEXUGBU-UHFFFAOYSA-N 3-[3-aminopropyl(diethoxy)silyl]oxybutan-1-ol Chemical compound NCCC[Si](OCC)(OCC)OC(C)CCO IMKMEPLAEXUGBU-UHFFFAOYSA-N 0.000 claims description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 claims description 2
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 claims description 2
- BTXFTCVNWMNXKH-UHFFFAOYSA-N NC1=CC=CC=C1.CCO[Si](C)(OCC)OCC Chemical compound NC1=CC=CC=C1.CCO[Si](C)(OCC)OCC BTXFTCVNWMNXKH-UHFFFAOYSA-N 0.000 claims description 2
- 239000003963 antioxidant agent Substances 0.000 claims description 2
- 230000003078 antioxidant effect Effects 0.000 claims description 2
- 239000013530 defoamer Substances 0.000 claims description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 2
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 claims description 2
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 claims description 2
- 239000002270 dispersing agent Substances 0.000 claims description 2
- 125000002883 imidazolyl group Chemical group 0.000 claims description 2
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 claims 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims 1
- 229920002554 vinyl polymer Polymers 0.000 claims 1
- -1 accelerator Substances 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract description 3
- 230000000052 comparative effect Effects 0.000 description 6
- 238000001723 curing Methods 0.000 description 6
- 238000004806 packaging method and process Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- MXLBKVCGLRNKBW-UHFFFAOYSA-N C(=C)OO[Si](C(C)(C)C)(C(C)(C)C)C(C)(C)C Chemical compound C(=C)OO[Si](C(C)(C)C)(C(C)(C)C)C(C)(C)C MXLBKVCGLRNKBW-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses an underfill composition, a preparation method and application thereof, wherein the underfill composition comprises the following components in parts by weight: 10-25 parts of epoxy resin; 50-80 parts of spherical silicon dioxide; 5-15 parts of curing agent; 0.1-3 parts of coupling agent; 0.1-2 parts of promoter; 0.5-2 parts of additive; 5-10 parts of toughening agent; the additive is 5-phenyl tetrazole; the toughening agent comprises nitrile rubber epoxy resin copolymer and liquid polysulfide rubber. The invention uses a system of epoxy resin, spherical silicon dioxide, curing agent, coupling agent, accelerator, additive and flexibilizer with specific content; thereby improving the flexibility of the material and reducing the thermal expansion coefficient; and adhesion to the PCB substrate.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to an underfill composition, a preparation method and application thereof.
Background
Underfill (Underfill) is used as an important electronic adhesive for packaging integrated circuits, and in advanced packaging such as 2.5D and 3D packaging, the Underfill is used for filling gaps between the chip and the interconnection bumps of the packaging substrate, and the Underfill is used for dispersing stress borne by the surface of the chip and relieving the problem of internal stress caused by mismatch of thermal expansion coefficients of the chip, the solder and the substrate. Secondly, the flip chip bottom filling material has certain mechanical properties, so that the mechanical structure strength of the connected chips can be improved, and the influence of external force impact on the chips is prevented. However, the underfill has a thermal expansion coefficient mismatch between shrinkage during thermal curing and cooling after curing, and thus, a large stress is applied to the chip, so that the chip may crack under certain conditions. Aiming at the problem that the underfill is easy to generate layering cracking in a large chip packaging structure, the problems are mainly relieved by improving the adhesive force of the underfill and reducing the thermal expansion coefficient.
Accordingly, there is a need to provide an underfill composition that has good flexibility, low coefficient of thermal expansion, and good adhesion.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the first aspect of the invention provides an underfill composition which can effectively improve the flexibility and the adhesion and reduce the thermal expansion coefficient.
The second aspect of the present invention also provides a method of preparing an underfill composition.
The third aspect of the invention also provides the use of an underfill composition.
An embodiment according to the first aspect of the present invention provides an underfill composition comprising the following components in parts by weight:
10-25 parts of epoxy resin;
50-80 parts of spherical silicon dioxide;
5-15 parts of curing agent;
0.1-3 parts of coupling agent;
0.1-2 parts of promoter;
0.5-2 parts of additive;
5-10 parts of toughening agent;
the additive is 5-phenyl tetrazole;
the toughening agent comprises nitrile rubber epoxy resin copolymer and liquid polysulfide rubber.
The underfill composition according to the embodiment of the invention has at least the following beneficial effects:
the invention uses a system of epoxy resin, spherical silicon dioxide, curing agent, coupling agent, accelerator, additive and flexibilizer with specific content; thereby improving the flexibility of the material and reducing the thermal expansion coefficient; and adhesion to the substrate. Presumably, the reason for this is that spherical silica and a coupling agent are selected so as to improve the addition amount and dispersibility of the filler in the system; reducing thermal expansion coefficient, improving fluidity, enhancing modulus, and reducing hygroscopicity. The invention selects 5-phenyl tetrazole to improve fluidity and reduce thermal expansion coefficient. According to the invention, the nitrile rubber epoxy resin copolymer and the liquid polysulfide rubber are selected as the toughening agents, so that the flexibility of the nitrile rubber epoxy resin copolymer can be effectively improved.
According to some embodiments of the invention, the mass ratio of the nitrile rubber epoxy resin copolymer to the liquid polysulfide rubber is 1: (0.5-2).
According to some embodiments of the invention, the epoxy resin is selected from at least one of bisphenol a diglycidyl ether, bisphenol F diglycidyl ether, bisphenol S diglycidyl ether, o-methylol bisphenol a diglycidyl ether, dimethylol bisphenol a diglycidyl ether, tetrabromobisphenol a diglycidyl ether, resorcinol diglycidyl ether, phloroglucinol triglycidyl ether, and pentaerythritol diglycidyl ether.
According to some embodiments of the invention, the curing agent is selected from at least one of meta-phenylenediamine, dicyandiamide, benzyl dimethylamine, diaminodiphenylmethane and diaminodiphenyl sulfone.
According to some embodiments of the invention, the coupling agent is selected from at least one of gamma-aminopropyl triethylsiloxane, gamma-glycidoxypropyl trimethoxysiloxane, gamma-methacrylate propyl trimethoxysiloxane, gamma-thiol propyl trimethoxysiloxane, vinyl tri-t-butyl peroxy silane, beta-hydroxyethyl-gamma-aminopropyl triethoxysilane, aniline methyl triethoxysilane, and diethylene triaminopropyl triethoxysilane.
According to some embodiments of the invention, the spherical silica has an average particle size of 0.1 to 10 μm.
According to some embodiments of the invention, the accelerator is selected from imidazole or 2,4, 6-tris (dimethylaminomethyl) phenol.
According to some embodiments of the invention, the underfill composition further comprises a toner and/or an auxiliary agent; the content of the toner is 0.1 to 5 parts by mass; the content of the auxiliary agent is 0.01-10 parts by mass; the auxiliary agent is at least one selected from defoamer, flatting agent, dispersant and antioxidant.
According to some embodiments of the invention, the toner comprises carbon black.
According to a second aspect of the present invention, there is provided a method for preparing the underfill composition, comprising the steps of:
uniformly mixing epoxy resin, spherical silicon dioxide, a curing agent, a coupling agent, an accelerator, an additive, a toughening agent and optional toner and/or auxiliary agents to obtain the underfill composition.
In a third aspect, the present invention provides the use of an underfill composition in a underfill for a chip or PCB substrate.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Detailed Description
The following are specific embodiments of the present invention, and the technical solutions of the present invention will be further described with reference to the embodiments, but the present invention is not limited to these embodiments.
The reagents, methods and apparatus employed in the present invention, unless otherwise specified, are all conventional in the art.
Epoxy resin: bisphenol F diglycidyl ether was purchased from Mitsubishi chemical corporation under the designation 806 and had an epoxy equivalent weight of 160g/eq;
nitrile rubber epoxy copolymers are available from the winning industry group under the model Albipox1000.
Spherical silica particles having an average particle diameter of 8. Mu.m.
Toughening agent A: the mass ratio of the nitrile rubber epoxy resin copolymer to the liquid polysulfide rubber is 1:1;
toughening agent B: the mass ratio of the nitrile rubber epoxy resin copolymer to the liquid polysulfide rubber is 1:0.5;
toughening agent C: the mass ratio of the nitrile rubber epoxy resin copolymer to the liquid polysulfide rubber is 1:2;
toughening agent D: the mass ratio of the nitrile rubber epoxy resin copolymer to the liquid polysulfide rubber is 1:0.3;
toughening agent E: the mass ratio of the nitrile rubber epoxy resin copolymer to the liquid polysulfide rubber is 1:2.5;
toughening agent F: nitrile rubber epoxy resin copolymers;
toughening agent G: liquid polysulfide rubber.
Example 1
Example 1 provides an underfill composition having the components and amounts shown in table 1 and prepared as follows:
and uniformly mixing the epoxy resin, the spherical silicon dioxide, the curing agent, the coupling agent, the accelerator, the additive, the toughening agent and optional toner and/or auxiliary agent according to a proportion to obtain the underfill composition.
Examples 2 to 5
Examples 2-5 provide a series of underfill compositions having components and amounts shown in Table 1 and prepared in the same manner as in example 1.
Table 1 examples 1 to 5 (parts)
Examples 6 to 7 and comparative examples 1 to 3
Examples 6-7 and comparative examples 1-3 provide a series of underfill compositions having components and amounts shown in Table 1, prepared in the same manner as in example 1.
Table 2 examples 6 to 7 and comparative examples 1 to 3 (parts)
Performance testing
The following test was performed on the filler compositions prepared in examples 1 to 7 and comparative examples 1 to 3:
coefficient of Thermal Expansion (CTE), test instrument: TMA.
Normal temperature adhesive force: the underfill compositions obtained in each example and comparative example were coated on a PCB board (100 mm. Times.25 mm. Times.1.6 mm), laminated with a PCB board, the thickness of the adhesive layer was controlled with a 0.13mm copper wire, the area of the adhesive layer was 25.4 mm. Times.5 mm, and heat-cured at 130℃for 2 hours, thereby producing an experimental piece. The two sheets of the sample cured and bonded were pulled apart in opposite directions using a universal tester at room temperature (25 ℃) and the samples were tested for hot stretch shear and the bond values were recorded as strength (MPa). The results are shown in Table 2.
Elongation at break: according to GBT30776-2014 test.
Table 2 data for examples 1 to 7 and comparative examples 1 to 3
The present invention has been described in detail with reference to the above embodiments, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the spirit of the present invention.
Claims (10)
1. An underfill composition, characterized by comprising the following components in parts by weight:
10-25 parts of epoxy resin;
50-80 parts of spherical silicon dioxide;
5-15 parts of curing agent;
0.1-3 parts of coupling agent;
0.1-2 parts of promoter;
0.5-2 parts of additive;
5-10 parts of toughening agent;
the additive is 5-phenyl tetrazole;
the toughening agent comprises nitrile rubber epoxy resin copolymer and liquid polysulfide rubber.
2. The underfill composition according to claim 1, wherein the mass ratio of the nitrile rubber epoxy resin copolymer to the liquid polysulfide rubber is 1: (0.5-2).
3. The underfill composition of claim 1, wherein the epoxy resin is selected from at least one of bisphenol a diglycidyl ether, bisphenol F diglycidyl ether, bisphenol S diglycidyl ether, o-methylol bisphenol a diglycidyl ether, dimethylol bisphenol a diglycidyl ether, tetrabromo bisphenol a diglycidyl ether, resorcinol diglycidyl ether, phloroglucinol triglycidyl ether, and pentaerythritol diglycidyl ether.
4. The underfill composition according to claim 1, wherein the curing agent is selected from at least one of meta-phenylenediamine, dicyandiamide, benzyl dimethylamine, diaminodiphenylmethane and diaminodiphenyl sulfone.
5. The underfill composition according to claim 1, wherein the coupling agent is selected from at least one of gamma-aminopropyl triethylsiloxane, gamma-glycidoxypropyl trimethoxysiloxane, gamma-methacrylate propyl trimethoxysiloxane, gamma-thiol propyl trimethoxysiloxane, vinyl tri-t-butylperoxy silane, beta-hydroxyethyl-gamma-aminopropyl triethoxysilane, aniline methyl triethoxysilane, and diethylenetriaminopropyl triethoxysilane.
6. The underfill composition according to claim 1, wherein the spherical silica has an average particle size of 0.1 to 10 μm.
7. The underfill composition according to claim 1, wherein the accelerator is selected from imidazole or 2,4, 6-tris (dimethylaminomethyl) phenol.
8. The underfill composition according to claim 1, wherein the underfill composition further comprises a toner and/or an auxiliary agent; the content of the toner is 0.1 to 5 parts by mass; the content of the auxiliary agent is 0.01-10 parts by mass; the auxiliary agent is at least one selected from defoamer, flatting agent, dispersant and antioxidant.
9. The method of preparing an underfill composition according to any one of claims 1 to 8, comprising the steps of:
uniformly mixing epoxy resin, spherical silicon dioxide, a curing agent, a coupling agent, an accelerator, an additive, a toughening agent and optional toner and/or auxiliary agents to obtain the underfill composition.
10. Use of the underfill composition of any one of claims 1-8 in a underfill for a chip or PCB substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310925145.1A CN117004357A (en) | 2023-07-26 | 2023-07-26 | Underfill composition, preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310925145.1A CN117004357A (en) | 2023-07-26 | 2023-07-26 | Underfill composition, preparation method and application thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117004357A true CN117004357A (en) | 2023-11-07 |
Family
ID=88575610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310925145.1A Pending CN117004357A (en) | 2023-07-26 | 2023-07-26 | Underfill composition, preparation method and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117004357A (en) |
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2023
- 2023-07-26 CN CN202310925145.1A patent/CN117004357A/en active Pending
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