CN117001857A - Wafer cutting equipment - Google Patents
Wafer cutting equipment Download PDFInfo
- Publication number
- CN117001857A CN117001857A CN202310755856.9A CN202310755856A CN117001857A CN 117001857 A CN117001857 A CN 117001857A CN 202310755856 A CN202310755856 A CN 202310755856A CN 117001857 A CN117001857 A CN 117001857A
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- Prior art keywords
- block
- housing
- groove
- wafer
- blade
- Prior art date
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- 238000005520 cutting process Methods 0.000 title claims abstract description 47
- 230000007246 mechanism Effects 0.000 claims abstract description 76
- 238000004140 cleaning Methods 0.000 claims abstract description 16
- 238000003825 pressing Methods 0.000 claims description 39
- 230000006835 compression Effects 0.000 claims description 11
- 238000007906 compression Methods 0.000 claims description 11
- 241000826860 Trapezium Species 0.000 claims description 6
- 239000007921 spray Substances 0.000 claims description 3
- 230000002349 favourable effect Effects 0.000 abstract description 46
- 230000009471 action Effects 0.000 abstract description 18
- 238000012423 maintenance Methods 0.000 abstract description 2
- 239000002893 slag Substances 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 39
- 230000000694 effects Effects 0.000 description 20
- 239000000498 cooling water Substances 0.000 description 11
- 238000009434 installation Methods 0.000 description 11
- 230000009286 beneficial effect Effects 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 244000309464 bull Species 0.000 description 6
- 230000008094 contradictory effect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 238000005086 pumping Methods 0.000 description 3
- 230000000740 bleeding effect Effects 0.000 description 2
- 230000010405 clearance mechanism Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000005574 cross-species transmission Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention relates to the technical field of wafer cutting, in particular to wafer cutting equipment, which comprises a dicing saw, wherein a cutting mechanism is arranged on the dicing saw, a fastening mechanism is arranged on the cutting mechanism, a fixing mechanism is arranged on the dicing saw, a placing mechanism is arranged in the dicing saw, a cleaning mechanism is arranged on the cutting mechanism, and a locking mechanism is arranged on the cleaning mechanism; the cutting mechanism is favorable for cutting the wafer, the cutter of the cutting mechanism is firmly installed through the fastening mechanism and is convenient to detach, the cutting mechanism and the dicing saw are firmly installed through the fixing mechanism, the follow-up detachment and maintenance are convenient, the operation is more convenient, the cleaning mechanism is favorable for radiating heat during cutting, part of the broken slag is collected and stored, the cleaning mechanism is convenient to clean and recover through the locking mechanism, the wafer is firmly placed through the action of the placing mechanism, and the moisture is not sucked into the vacuum pump to cause damage.
Description
Technical Field
The invention relates to the technical field of wafer cutting, in particular to wafer cutting equipment.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit, the original material is silicon, high-purity polycrystalline silicon is dissolved and then is doped with silicon crystal seeds, then the silicon crystal seeds are slowly pulled out to form cylindrical monocrystalline silicon, a silicon crystal rod is ground, polished and sliced to form the silicon wafer, namely the wafer, the wafer is mainly processed in a sheet processing mode and a batch processing mode, namely 1 or more wafers are processed simultaneously, as the feature size of a semiconductor is smaller and smaller, processing and measuring equipment is more and more advanced, new data characteristics appear in the wafer processing, and the wafer is required to be cut through a dicing saw in the production process, so that the production and the manufacture of subsequent components are facilitated.
However, the blade that traditional dicing saw used is fastened through the bolt, because the blade is little and can rotate through the main shaft, thereby very inconvenient when the dismouting, need a plurality of instrument cooperation operations, reduced the efficiency of dismouting, and the main shaft passes through a large amount of bolt fastenings with equipment, the dismouting is loaded down with trivial details, the time has been long the bolt corrosion and is difficult for the operation, the piece inconvenient that carries in the blade cutting wafer in-process is collected partially, thereby make the piece can unrestrained on mesa and wafer, cause the secondary wearing and tearing to the wafer easily, most of passing through the anchor clamps centre gripping when placing simultaneously, complex operation, the roughness inconvenient control, cause the wafer damage slightly carelessly easily.
Disclosure of Invention
The invention provides wafer cutting equipment aiming at the problems in the prior art.
The technical scheme adopted for solving the technical problems is as follows: the wafer cutting equipment comprises a dicing saw, wherein a cutting mechanism is arranged on the dicing saw, a fastening mechanism is arranged on the cutting mechanism, a fixing mechanism is arranged on the dicing saw, a placing mechanism is arranged in the dicing saw, a cleaning mechanism is arranged on the cutting mechanism, and a locking mechanism is arranged on the cleaning mechanism.
Specifically, cutting mechanism includes the motor cabinet, install the motor cabinet on the dicing saw, the block is connected with driving motor on the motor cabinet, the last cover of driving motor one end output shaft is connected with the baffle, the cover is connected with the blade on the driving motor output shaft, the blade is contradicted with the baffle, the cover is connected with the clamp plate on the driving motor output shaft, the clamp plate is contradicted with the blade, install the fixed block in the motor drive shaft, the fixed block is contradicted with the clamp plate, clamp plate and baffle are round platform shape structure.
Specifically, a plurality of locating rods are installed to baffle one side, locating rod and the inside sliding connection of driving motor output shaft, slipmat is installed to baffle one side, slipmat is contradicted with blade one side.
Specifically, fastening mechanism includes the rack, a plurality of helical racks are installed to driving motor output shaft inside wall, fixed block one end and driving motor output shaft inboard sliding connection, the bayonet lock of symmetry is installed to fixed block one end inboard, the bayonet lock is through a plurality of conflict springs and the inside sliding connection of fixed block, bayonet lock one end top side is tooth structure, bayonet lock one end is sharp tooth and helical rack sharp tooth opposite in direction, bayonet lock one end top extends to the fixed block outside and contradicts with the helical rack, fixed block lateral wall sliding connection has the depression bar of symmetry, the depression bar extends to the inside perpendicular connection of bayonet lock of fixed block.
Specifically, the briquetting of ring mechanism is installed to clamp plate one side, the briquetting is through a plurality of compression springs and the inside sliding connection of clamp plate, briquetting one side is tooth form structure, briquetting one side is contradicted with blade one side.
Specifically, fixed establishment includes the draw-in groove, be equipped with the draw-in groove on the dicing saw, motor cabinet top and the inside sliding connection of draw-in groove, motor cabinet top and draw-in groove are trapezium structure, the inside sliding connection of dicing saw has the pinion rack, the pinion rack top is equipped with two drive slots, the pinion rack bottom extends to inside the draw-in groove and contradicts with the motor cabinet top, the pinion rack bottom is tooth form structure with the motor cabinet top.
Specifically, the inside sliding connection of dicing saw has the slider, the inside threaded connection of slider has the screw rod, screw rod one end extends to the dicing saw outside, screw rod one end is connected with the inside rotation of dicing saw, two drive blocks are installed to the slider bottom, the drive block extends to inside the drive groove, drive block and drive groove are trapezium structure.
Specifically, slider one end internally mounted has the ejector pad, the ejector pad passes through connecting spring and the inside sliding connection of slider, screw rod and the inside sliding connection of ejector pad.
Specifically, clearance mechanism includes the housing, can dismantle on the dicing saw and be connected with the housing, the housing is the arc structure, blade edge rotates with the housing inboard to be connected, the inside both sides of housing are equipped with a plurality of orifice that are annular distribution, install two connecting pipes on the housing, housing one end lateral wall is equipped with the guiding gutter, the guiding gutter has certain slope, housing bottom one end inboard sliding connection has the collection box, it is located guiding gutter one end bottom to collect the box, it extends to the housing outside to collect box one side, screen cloth is installed at housing one side top.
Specifically, the guiding gutter is inside to be equipped with the guard plate, the guard plate top is connected with the inside rotation of guiding gutter through the pivot.
Specifically, the locking mechanism comprises a driving rod, the driving rod is installed at the inside central line department of collecting box one side, the driving rod passes through reset spring and collects the inside sliding connection of box, the inside center department of collecting box one side rotates and is connected with the bull stick, bull stick one side is equipped with the recess, bull stick one end extends to the collecting box outside, install the turning round on the bull stick, the driving rod top is hemispherical structure, the driving rod top is contradicted with the bull stick, the driving rod bottom extends to inside the housing.
Specifically, placing the mechanism including placing the platform, scribing machine internally mounted has places the platform, place platform one side and install the air duct, air duct one end extends to and places the platform inside, place a plurality of adapter sleeves that are the equidistance and distribute are installed to platform top inboard, the adapter sleeve passes through movable spring and places the inside longitudinal sliding connection of platform, a plurality of adapter sleeve bottom lateral wall is equipped with logical groove, it is equipped with the spread groove of a plurality of symmetries to place platform top inboard, spread groove one end extends to the adapter sleeve lateral wall, the spread groove other end extends to and places the platform inside, adapter sleeve top threaded connection has the kicking block.
The beneficial effects of the invention are as follows:
(1) According to the wafer cutting equipment, the wafer is conveniently cut under the action of the cutting mechanism, and the cutter of the cutting mechanism is firmly installed and conveniently detached through the fastening mechanism, namely: being favorable to installing driving motor under the effect through the motor cabinet, through the cooperation of baffle and clamp plate, be favorable to carrying out the centre gripping to the blade and install on driving motor output shaft, through the installation of fixed block, be favorable to making the fixed block contradict the clamp plate, realize that the blade centre gripping is firm stable, conveniently carry out cutting work to the wafer, be favorable to carrying out the location to the baffle under the effect of locating lever, prevent the phenomenon that the baffle took place the rotation, be favorable to firmly to the blade centre gripping, under the effect through the slipmat, be favorable to the baffle to behind the blade centre gripping, the slipmat contradicts the antiskid to the blade, make the blade rotate more stable, can not skid, slide through the fixed block and slide into driving motor output shaft inside back, the bayonet lock is contradicted with the rack is sharp tooth direction opposite, because bayonet lock one end is contradicted the shrink, thereby realize that the bayonet lock is one-way sliding and can't reset on the rack, be favorable to the fixed block to contradicting to the clamp plate more closely, through pressing two depression bars, drive the bayonet lock breaks away from the effect of conflict spring and slide down, bayonet lock and helical gear separation, make fixed block and driving motor output shaft separate, be favorable to dismantling the blade, easy to the effect of the blade, easy to detach, the clamp plate is more convenient to be contradicting with the clamp plate, and make the blade compact with the compression block through the effect through the compression spring, make the side wall is more compact with the compression compact because of the blade.
(2) According to the wafer cutting equipment, the cutting mechanism and the dicing saw are firmly installed under the action of the fixing mechanism, the subsequent disassembly and maintenance are convenient, and the operation is more convenient, namely: through the pinion rack installation back, the motor cabinet top slides into inside the draw-in groove, after the motor cabinet slides certain position, through rotating the screw rod, screw rod drive slider slides, the slider drives the drive piece and slides inside the drive slot, the drive piece is contradicted the pinion rack, it is inseparable to make the pinion rack contradict the motor cabinet top, be favorable to the motor cabinet installation firm, make push block and slider inside have the elasticity under the effect through connecting spring, drive through the screw rod to the push block, make the push block pass through connecting spring to slider drive control, make the slider conflict back in place under connecting spring's effect, the push block can continue to slide, be favorable to the slider to contradict inseparable difficult not hard up.
(3) According to the wafer cutting equipment, the cleaning mechanism is beneficial to cleaning heat dissipation during cutting, and part of crushed slag is collected and stored, and the cleaning mechanism is convenient to clean and recover through the locking mechanism, namely: through the installation of housing, be favorable to protecting the blade outside, simultaneously through the connection of two connecting pipes and outside cooling water, make the cooling water get into inside the housing, and spout through a plurality of orifice, be favorable to making the cooling water spout to the blade both sides, play the piece of cooling and washing cutting position, simultaneously, through the rotation of blade, be favorable to making the piece carried to inside the guiding gutter, make the piece get into through the guiding gutter and collect the inside case and deposit, make things convenient for moisture to discharge through the effect of screen cloth, conveniently clear up the work to the piece through taking out the collecting box, through the rotation of guard plate and guiding gutter, make the guard plate shelter from the guiding gutter under the effect of gravity, be favorable to the piece that gets into can not backward flow overflow, make the piece impact force that gets into reduce simultaneously, prevent to collecting the inside piece impact splash of box, insert inside the rear of housing through the collecting box, through rotating the twist and drive the bull stick rotates, be favorable to the lifter to the driving lever conflict, make the actuating lever get rid of reset spring's effect down slide into inside the housing, be favorable to limiting unable slip to collecting box, through reverse rotation twist, the actuating lever slides into inside the recess, the bottom the driving lever and the suction box is separated with the convenience of collecting.
(4) The wafer cutting equipment disclosed by the invention is favorable for conveniently and firmly placing the wafer under the action of the placing mechanism, and cannot cause damage to the inside of the vacuum pump due to the fact that moisture is sucked into the vacuum pump, namely: the utility model discloses a convenient vacuum pump connection with outside through the effect of air duct down is favorable to placing platform and spread groove inside and is bleeding, through blocking up the spread groove owing to the adapter sleeve under the effect of movable spring, the adapter sleeve is inside can not be by bleeding, the cooling water of placing the platform top can not be adsorbed, through placing the wafer, place at a plurality of kicking block tops, through pressing the wafer, the kicking block drives the adapter sleeve gliding, be favorable to logical groove and the spread groove intercommunication on the adapter sleeve, do benefit to the inside bleed to the adapter sleeve, owing to the kicking block has the gas permeability, thereby adsorb fixedly to the wafer, conveniently cut the work.
Drawings
The invention will be further described with reference to the drawings and examples.
FIG. 1 is a schematic diagram of an overall structure of a wafer dicing apparatus according to a preferred embodiment of the present invention;
FIG. 2 is an enlarged schematic view of the portion A shown in FIG. 1;
FIG. 3 is a schematic diagram of a connection structure between a motor base and a dicing saw according to the present invention;
FIG. 4 is a schematic diagram of a connection structure between a driving motor and a blade according to the present invention;
FIG. 5 is an enlarged schematic view of the B-section structure shown in FIG. 4;
FIG. 6 is a schematic view of the connection structure of the blade and the fixed block of the present invention;
FIG. 7 is a schematic view of the connection structure of the housing and the collection box of the present invention;
FIG. 8 is a schematic view of the connection structure of the collecting box and the driving rod of the present invention;
FIG. 9 is a schematic view of a connection structure between a placement table and an airway tube according to the present invention;
fig. 10 is a schematic view of a connection structure between a placing table and a connecting sleeve according to the present invention.
In the figure: 1. dicing saw; 2. a cutting mechanism; 201. a motor base; 202. a driving motor; 203. a pressing plate; 204. a fixed block; 205. a blade; 206. a baffle; 207. a positioning rod; 208. an anti-slip pad; 3. a fastening mechanism; 301. a compression bar; 302. a bayonet lock; 303. a contact spring; 304. a helical rack; 305. briquetting; 306. a compression spring; 4. a fixing mechanism; 401. a screw; 402. a pushing block; 403. a connecting spring; 404. a slide block; 405. a clamping groove; 406. a driving block; 407. a driving groove; 408. a toothed plate; 5. a cleaning mechanism; 501. a housing; 502. a connecting pipe; 503. a collection box; 504. a screen; 505. a protection plate; 506. a spray hole; 507. a diversion trench; 6. a locking mechanism; 601. a turning button; 602. a driving rod; 603. a return spring; 604. a rotating rod; 605. a groove; 7. a placement mechanism; 701. a placement table; 702. a top block; 703. an air duct; 704. connecting sleeves; 705. a movable spring; 706. a through groove; 707. and a connecting groove.
Detailed Description
The invention is further described in connection with the following detailed description in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the invention easy to understand.
As shown in fig. 1 to 10, the wafer cutting device of the present invention comprises a dicing machine 1, wherein a cutting mechanism 2 is installed on the dicing machine 1, a fastening mechanism 3 is installed on the cutting mechanism 2, a fixing mechanism 4 is installed on the dicing machine 1, a placing mechanism 7 is installed inside the dicing machine 1, a cleaning mechanism 5 is installed on the cutting mechanism 2, and a locking mechanism 6 is installed on the cleaning mechanism 5.
Specifically, the cutting mechanism 2 includes motor cabinet 201, install motor cabinet 201 on the dicing machine 1, the block is connected with driving motor 202 on the motor cabinet 201, the cover is connected with baffle 206 on the driving motor 202 one end output shaft, cover is connected with blade 205 on the driving motor 202 output shaft, blade 205 contradicts with baffle 206, cover is connected with clamp plate 203 on the driving motor 202 output shaft, clamp plate 203 contradicts with blade 205, install fixed block 204 on the motor drive shaft, fixed block 204 contradicts with clamp plate 203, clamp plate 203 and baffle 206 are circular-table structure, are favorable to right driving motor 202 installs under the effect of motor cabinet 201, through baffle 206 with the cooperation of clamp plate 203 is favorable to right the blade 205 centre gripping is installed on the driving motor 202 output shaft, through the installation of fixed block 204 is favorable to making fixed block 204 contradict with clamp plate 203 realizes that the blade 205 centre gripping is firm and stable, conveniently carries out the cutting work to the wafer.
Specifically, a plurality of locating levers 207 are installed to baffle 206 one side, locating lever 207 and the inside sliding connection of driving motor 202 output shaft, slipmat 208 is installed to baffle 206 one side, slipmat 208 is contradicted with blade 205 one side, through be favorable to under the effect of locating lever 207 to baffle 206 is fixed a position, prevents baffle 206 takes place the phenomenon of rotation, is favorable to right blade 205 centre gripping is firm, through under the effect of slipmat 208, is favorable to baffle 206 is right after the blade 205 centre gripping, slipmat 208 is right blade 205 is contradicted antiskid, makes blade 205 is more stable when rotating, can not skid.
Specifically, fastening mechanism 3 includes the rack, a plurality of helical racks 304 are installed to driving motor 202 output shaft inside wall, fixed block 204 one end and driving motor 202 output shaft inboard sliding connection, fixed block 204 one end inboard installs symmetrical bayonet lock 302, bayonet lock 302 is through a plurality of conflict spring 303 with the inside sliding connection of fixed block 204, bayonet lock 302 one end topside is the tooth form structure, bayonet lock 302 one end is sharp tooth and helical rack 304 are sharp tooth opposite, bayonet lock 302 one end top extends to the fixed block 204 outside and contradicts with helical rack 304, fixed block 204 lateral wall sliding connection has symmetrical depression bar 301, depression bar 301 extends to inside and the bayonet lock 302 vertical connection of fixed block 204, through fixed block 204 slides in after driving motor 202 output shaft is inside, bayonet lock 302 with helical rack 304 is contradicted, because bayonet lock 302 one end is sharp tooth with helical rack 304 is opposite, bayonet lock 302 can be by the shrink of contradicting, thereby realize bayonet lock 302 is in on the helical rack 304 unidirectional slip and reset block 203 is favorable to the clamp bar 203 is more favorable to the realization the clamp bar is carried by the clamp bar 302 and is more closely to the clamp bar 301 is separated by the clamp bar 203 and is carried down to the clamp bar 302 and is separated by the axial compression bar 301.
Specifically, the pressing plate 203 is provided with the pressing block 305 with an annular mechanism on one side, the pressing block 305 is in sliding connection with the inside of the pressing plate 203 through a plurality of compression springs 306, one side of the pressing block 305 is in a toothed structure, one side of the pressing block 305 is in abutting contact with one side of the blade 205, when the pressing plate 203 is in abutting contact with the blade 205, the pressing block 305 on the pressing plate 203 is in abutting contact with the side wall of the blade 205, and the pressing block 203 is driven by the compression springs 306 to tightly abut against the blade 205 and not easily loosen, and as one side of the pressing block 305 is in a toothed structure, the clamping of the blade 205 is firmer.
Specifically, fixed establishment 4 includes draw-in groove 405, be equipped with draw-in groove 405 on the dicing saw 1, motor cabinet 201 top and the inside sliding connection of draw-in groove 405, motor cabinet 201 top and draw-in groove 405 are trapezium structure, the inside sliding connection of dicing saw 1 has pinion rack 408, pinion rack 408 top is equipped with two drive slots 407, pinion rack 408 bottom extends to inside the contradicting of draw-in groove 405 with motor cabinet 201 top, pinion rack 408 bottom and motor cabinet 201 top are tooth form structure, the inside sliding connection of dicing saw 1 has slider 404, slider 404 inside threaded connection has screw 401, screw 401 one end extends to the dicing saw 1 outside, screw 401 one end and the inside rotation connection of dicing saw 1, two drive blocks 406 are installed to the slider 404 bottom, drive blocks 406 extend to inside the drive slot 407, drive blocks 406 and drive slot 407 are trapezium structure, through the pinion rack 408 installs the back, the pinion rack 201 top is gone into inside the draw-in groove 405, certain position of slider 404 is in the inside the side of motor cabinet 201 the side by side of sliding connection, the slider 401 is in the inside the side of motor cabinet 408, the slider is in the side of being favorable to be in the motor cabinet 408.
Specifically, a push block 402 is installed inside one end of the slider 404, the push block 402 is slidably connected with the inside of the slider 404 through a connecting spring 403, the screw 401 is slidably connected with the inside of the push block 402, the push block 402 and the inside of the slider 404 are telescopic under the action of the connecting spring 403, the push block 402 is driven and controlled by the screw 401 through the driving of the screw 401 to the slider 404, and after the slider 404 is abutted against in place under the action of the connecting spring 403, the push block 402 can continue to slide, which is beneficial to the tight and difficult loosening of the slider 404.
Specifically, the clearance mechanism 5 includes the housing 501, be connected with housing 501 on the dicing saw 1 can be dismantled, housing 501 is the arc structure, blade 205 edge rotates with housing 501 inboard to be connected, housing 501 inside both sides are equipped with a plurality of orifice 506 that are annular distribution, install two connecting pipes 502 on the housing 501, housing 501 one end lateral wall is equipped with guiding gutter 507, guiding gutter 507 has a certain slope, housing 501 bottom one end inboard sliding connection has a collection box 503, collection box 503 is located guiding gutter 507 one end bottom, collection box 503 one side extends to the housing 501 outside, housing 501 one side top is installed the screen cloth 504, through the installation of housing 501 is favorable to protecting the blade 205 outside, simultaneously through two connecting pipes 502 and external cooling water's connection, make the cooling water get into the housing 501 inside to through a plurality of orifice 506 blowout is favorable to making the cooling water spout to blade 205 both sides, plays cooling and washes cutting position, simultaneously through the rotation of blade 205 is favorable to making the guiding gutter 507 be carried to the inside and is convenient for the piece to collect the piece to be taken out through the inside the collection box 503 is taken out through the piece that the piece is convenient for collecting the piece is taken out to the piece through the inside the collection box 503.
Specifically, the guiding gutter 507 is inside to be equipped with guard plate 505, guard plate 505 top is connected through pivot and the inside rotation of guiding gutter 507, through guard plate 505 with the rotation of guiding gutter 507 makes under the effect of gravity guard plate 505 is right the guiding gutter 507 shelters from, is favorable to the piece of getting into can not backward flow to spill over, makes the piece impact force that gets into reduce simultaneously, prevents to right the inside piece impact four splash of collecting box 503.
Specifically, the locking mechanism 6 includes a driving rod 602, a driving rod 602 is installed at a middle line inside one side of the collecting box 503, the driving rod 602 is slidably connected with the inside of the collecting box 503 through a reset spring 603, a rotating rod 604 is rotatably connected at the center inside one side of the collecting box 503, a groove 605 is formed in one side of the rotating rod 604, one end of the rotating rod 604 extends to the outside of the collecting box 503, a rotating knob 601 is installed on the rotating rod 604, the top of the driving rod 602 is of a hemispherical structure, the top of the driving rod 602 is in contact with the rotating rod 604, the bottom of the driving rod 602 extends to the inside of the housing 501, after the collecting box 503 is inserted into the inside of the housing 501, the rotating knob 601 drives the rotating rod 604 to rotate, the rotating rod 604 is favorable for the rotating rod 604 to contact with the driving rod 602, the driving rod 602 is free from sliding into the inside of the housing 501 under the action of the reset spring 603, the driving rod 602 is favorable for limiting and cannot slide to the collecting box 503, the driving rod 602 slides into the inside the groove 605 in a reverse direction, and the bottom of the driving rod 602 is separated from the inside of the housing 501, and the driving rod 501 is convenient to be cleaned.
Specifically, the placement mechanism 7 includes the placement platform 701, the placement platform 701 is installed to the inside of dicing saw 1, air duct 703 is installed to placement platform 701 one side, air duct 703 one end extends to the inside of placement platform 701, a plurality of connecting sleeves 704 that are equidistant distribution are installed to placement platform 701 top inboard, connecting sleeve 704 is through movable spring 705 and the inside vertical sliding connection of placement platform 701, a plurality of connecting sleeve 704 bottom lateral wall is equipped with logical groove 706, placement platform 701 top inboard is equipped with a plurality of symmetrical spread grooves 707, spread grooves 707 one end extends to connecting sleeve 704 lateral wall, the spread grooves 707 other end extends to the inside of placement platform 701, connecting sleeve 704 top threaded connection has kicking block 702, through the effect of air duct 703 is convenient to be connected with outside vacuum pump down, is favorable to be right place platform 701 with inside bleed-off of spread grooves 707, through because connecting sleeve 704 is in under the effect of movable spring 705 the inside longitudinal sliding connection of connecting sleeve 707, the cooling water of placement platform 701 top can not be adsorbed by the absorption, through placing the piece, has the air permeability to be favorable to carry out with the wafer 702 through the fixed connection of the top block 704 when the wafer is pushed down by a plurality of places, the wafer 702 has the top block 704 and is connected through the top block 704, thereby the top is favorable to be cut down by the wafer 702.
When the invention is used, firstly, the installation of the driving motor 202 is facilitated under the action of the motor base 201, the clamping and the installation of the blade 205 on the output shaft of the driving motor 202 are facilitated through the matching of the baffle plate 206 and the pressing plate 203, the clamping of the pressing plate 203 by the fixing block 204 is facilitated, the firm and stable clamping of the blade 205 is realized, the cutting work on a wafer is convenient, the positioning of the baffle plate 206 is facilitated under the action of the positioning rod 207, the phenomenon of autorotation of the baffle plate 206 is prevented, the firm clamping of the blade 205 is facilitated, the anti-slip mat 208 is facilitated to press the blade 205 after the clamping of the blade 205 by the anti-slip mat 208, the rotation of the blade 205 is more stable and can not slip, the clamping pin 302 is pressed against the inclined rack 304 after the fixing block 204 slides into the output shaft of the driving motor 202, because the sharp teeth at one end of the bayonet lock 302 are opposite to the sharp teeth of the diagonal rack 304, the bayonet lock 302 can be collided and contracted, thereby realizing that the bayonet lock 302 slides unidirectionally on the diagonal rack 304 and cannot reset, being beneficial to the fixing block 204 to more tightly clamp the pressing plate 203, the pressing rods 301 drive the bayonet lock 302 to slide under the action of the collision springs 303 by pressing the two pressing rods 301, the bayonet lock 302 is separated from the diagonal rack 304, the fixing block 204 is convenient to separate and disassemble from the output shaft of the driving motor 202, the disassembly of the blade 205 is facilitated, the operation is more convenient, when the pressing plate 203 is collided with the blade 205, the pressing block 305 on the pressing plate 203 is collided with the side wall of the blade 205, the pressing block 203 is driven by the action of the compression springs 306 to tightly clamp the pressing block 305 with the blade 205 and not easy to loosen, the blade 205 is clamped more firmly due to the toothed structure at one side of the pressing block 305, the top of the motor seat 201 slides into the inside the clamping groove 405 after the installation of the toothed plate 408, after the motor cabinet 201 slides to a certain position, the screw 401 drives the sliding block 404 to slide, the sliding block 404 drives the driving block 406 to slide in the driving slot 407, the driving block 406 is propped against the toothed plate 408, so that the toothed plate 408 is propped against the top of the motor cabinet 201 tightly, the motor cabinet 201 is favorable for firm installation, the pushing block 402 and the sliding block 404 are provided with retractility under the action of the connecting spring 403, the pushing block 402 is driven and controlled by the screw 401 to the sliding block 404 through the connecting spring 403, after the sliding block 404 is propped against in place under the action of the connecting spring 403, the pushing block 402 can continue to slide, the sliding block 404 is favorable for tightly propping against and not easily loosening, the blade 205 is favorable for protection outside the blade 501 through the installation of the housing 501, meanwhile, the cooling water enters the housing 501 through the connection of the two connecting pipes 502 and is sprayed out through the plurality of spray holes 506, the cooling water is favorable to be sprayed to the two sides of the blade 205 to cool and wash the chips at the cutting position, meanwhile, the rotation of the blade 205 is favorable to lead the chips to be carried into the diversion trench 507, the chips enter the collection box 503 to be stored through the diversion trench 507, the water is convenient to be discharged under the action of the screen 504, the collection box 503 is drawn out to facilitate the cleaning work of the chips, the diversion trench 507 is shielded by the protection plate 505 under the action of gravity through the rotation of the protection plate 505 and the diversion trench 507, the entering chips are favorable to not flow back and overflow, the impact force of the entering chips is reduced, the chips in the collection box 503 are prevented from being impacted and splashed, after the collection box 503 is inserted into the housing 501, the rotation of the rotation torsion bar 601 drives the rotation of the rotation rod 604, the collision of the driving rod 604 to the driving rod 602 is favorable, the driving rod 602 is separated from the action of the reset spring 603 and slides into the housing 501, the device is beneficial to limiting the collection box 503 and not sliding, the driving rod 602 slides into the groove 605 through the reverse rotation of the rotary knob 601, the bottom of the driving rod 602 is separated from the housing 501, the collection box 503 is convenient to pump and clean, the collection box is conveniently connected with an external vacuum pump through the action of the air duct 703, the collection box is beneficial to pumping air inside the placing table 701 and the connecting groove 707, the connecting groove 707 is blocked under the action of the movable spring 705 through the connecting sleeve 704, the inside of the connecting sleeve 704 is not pumped, cooling water at the top of the placing table 701 is not adsorbed, when a wafer is placed, the wafer is placed at the top of the plurality of top blocks 702, the top blocks 702 drive the connecting sleeve 704 to slide downwards through pressing the wafer, the through groove 706 on the connecting sleeve 704 is beneficial to communicating with the connecting groove 707, the pumping air inside the connecting sleeve 704 is beneficial to pumping the connecting sleeve 704, and the top blocks 702 are fixed through air permeability, so that the wafer is adsorbed and the cutting work is convenient.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.
Claims (10)
1. The wafer cutting equipment is characterized by comprising a dicing saw (1), wherein a cutting mechanism (2) is arranged on the dicing saw (1), a fastening mechanism (3) is arranged on the cutting mechanism (2), a fixing mechanism (4) is arranged on the dicing saw (1), a placing mechanism (7) is arranged in the dicing saw (1), a cleaning mechanism (5) is arranged on the cutting mechanism (2), and a locking mechanism (6) is arranged on the cleaning mechanism (5);
the cutting mechanism (2) comprises a motor base (201), the motor base (201) is mounted on the dicing saw (1), a driving motor (202) is connected to the motor base (201) in a clamping mode, a baffle (206) is connected to an output shaft at one end of the driving motor (202) in a sleeved mode, a blade (205) is connected to the output shaft of the driving motor (202) in a sleeved mode, the blade (205) is in interference with the baffle (206), a pressing plate (203) is connected to the output shaft of the driving motor (202) in a sleeved mode, the pressing plate (203) is in interference with the blade (205), a fixing block (204) is mounted on a motor driving shaft, the fixing block (204) is in interference with the pressing plate (203), and both the pressing plate (203) and the baffle (206) are of a circular truncated cone-shaped structure;
the fastening mechanism (3) comprises racks, a plurality of diagonal racks (304) are installed on the inner side wall of an output shaft of the driving motor (202), one end of the fixed block (204) is connected with the inner side of the output shaft of the driving motor (202) in a sliding mode, symmetrical clamping pins (302) are installed on the inner side of one end of the fixed block (204), the clamping pins (302) are connected with the inner side of the fixed block (204) in a sliding mode through a plurality of abutting springs (303), the top side of one end of the clamping pins (302) is of a toothed structure, the sharp teeth of one end of the clamping pins (302) are opposite to the sharp teeth of the diagonal racks (304), one end top of the clamping pins (302) extends to the outer side of the fixed block (204) to abut against the diagonal racks (304), symmetrical pressing rods (301) are connected with the side walls of the fixed block (204) in a sliding mode, and the pressing rods (301) extend to the inner side of the fixed block (204) to be connected with the clamping pins (302) vertically.
2. A wafer dicing apparatus according to claim 1, wherein: a plurality of locating rods (207) are arranged on one side of the baffle plate (206), the locating rods (207) are in sliding connection with the inside of an output shaft of the driving motor (202), an anti-slip pad (208) is arranged on one side of the baffle plate (206), and the anti-slip pad (208) is in interference with one side of the blade (205).
3. A wafer dicing apparatus according to claim 1, wherein: the pressing plate (203) is provided with a pressing block (305) of an annular mechanism on one side, the pressing block (305) is in sliding connection with the inside of the pressing plate (203) through a plurality of compression springs (306), one side of the pressing block (305) is of a tooth-shaped structure, and one side of the pressing block (305) is abutted against one side of the blade (205).
4. A wafer dicing apparatus according to claim 1, wherein: fixed establishment (4) are including draw-in groove (405), be equipped with draw-in groove (405) on dicing saw (1), motor cabinet (201) top and the inside sliding connection of draw-in groove (405), motor cabinet (201) top and draw-in groove (405) are trapezium structure, inside sliding connection of dicing saw (1) has pinion rack (408), pinion rack (408) top is equipped with two drive slots (407), pinion rack (408) bottom extends to inside and the motor cabinet (201) top conflict of draw-in groove (405), pinion rack (408) bottom is tooth form structure with motor cabinet (201) top.
5. The wafer dicing apparatus according to claim 4, wherein: the inside sliding connection of scriber (1) has slider (404), the inside threaded connection of slider (404) has screw rod (401), screw rod (401) one end extends to the scriber (1) outside, screw rod (401) one end is connected with the inside rotation of scriber (1), two drive blocks (406) are installed to slider (404) bottom, drive block (406) extend to inside drive slot (407), drive block (406) are trapezium structure with drive slot (407).
6. The wafer dicing apparatus according to claim 5, wherein: the novel sliding block is characterized in that a pushing block (402) is arranged at one end of the sliding block (404) in an inner portion, the pushing block (402) is connected with the sliding block (404) in a sliding mode through a connecting spring (403), and the screw rod (401) is connected with the pushing block (402) in the sliding mode.
7. A wafer dicing apparatus according to claim 1, wherein: the cleaning mechanism (5) comprises a housing (501), the housing (501) is detachably connected to the dicing saw (1), the housing (501) is of an arc-shaped structure, edges of the blades (205) are rotationally connected with the inner side of the housing (501), a plurality of spray holes (506) which are distributed in a ring shape are formed in two sides of the interior of the housing (501), two connecting pipes (502) are arranged on the housing (501), a guide groove (507) is formed in one end side wall of the housing (501), a certain gradient is formed in the guide groove (507), a collecting box (503) is connected to the inner side of one end of the bottom of the housing (501) in a sliding mode, the collecting box (503) is located at one end of the bottom of the guide groove (507), one side of the collecting box (503) extends to the outer side of the housing (501), and a screen (504) is arranged at the top of one side of the housing (501).
8. The wafer dicing apparatus according to claim 7, wherein: the guide groove (507) is internally provided with a protection plate (505), and the top of the protection plate (505) is rotationally connected with the inside of the guide groove (507) through a rotating shaft.
9. The wafer dicing apparatus according to claim 7, wherein: the locking mechanism (6) comprises a driving rod (602), the driving rod (602) is installed at the middle line in one side of the collecting box (503), the driving rod (602) is connected with the inside of the collecting box (503) in a sliding mode through a reset spring (603), a rotating rod (604) is connected to the inside center of one side of the collecting box (503) in a rotating mode, a groove (605) is formed in one side of the rotating rod (604), one end of the rotating rod (604) extends to the outer side of the collecting box (503), a torque (601) is installed on the rotating rod (604), the top of the driving rod (602) is of a hemispherical structure, the top of the driving rod (602) is in abutting contact with the rotating rod (604), and the bottom of the driving rod (602) extends to the inside of the housing (501).
10. A wafer dicing apparatus according to claim 1, wherein: placement mechanism (7) are including placing platform (701), dicing saw (1) internally mounted has place platform (701), air duct (703) are installed to place platform (701) one side, air duct (703) one end extends to place inside platform (701), place inside a plurality of adapter sleeves (704) that are the equidistance and distribute of installing in platform (701) top, adapter sleeve (704) are through movable spring (705) and place inside longitudinal sliding connection of platform (701), a plurality of adapter sleeve (704) bottom lateral wall is equipped with logical groove (706), place platform (701) top inboard is equipped with a plurality of symmetric spread grooves (707), spread groove (707) one end extends to adapter sleeve (704) lateral wall, spread groove (707) other end extends to place inside platform (701), adapter sleeve (704) top threaded connection has kicking block (702).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310755856.9A CN117001857B (en) | 2023-06-26 | 2023-06-26 | Wafer cutting equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310755856.9A CN117001857B (en) | 2023-06-26 | 2023-06-26 | Wafer cutting equipment |
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| CN117001857A true CN117001857A (en) | 2023-11-07 |
| CN117001857B CN117001857B (en) | 2024-03-29 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117565246A (en) * | 2024-01-15 | 2024-02-20 | 沈阳汉为科技有限公司 | Scribing machine with contact height measuring device |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0538404U (en) * | 1991-10-28 | 1993-05-25 | 有限会社丸十材木店 | Wood binding |
| JPH0831859A (en) * | 1994-07-19 | 1996-02-02 | Kaijo Corp | Bonder and mechanism for pressing and securing board |
| EP1148256A2 (en) * | 2000-01-26 | 2001-10-24 | IPEG GmbH, Ingenieurdienstleistungen | Connector for tensile and releasable clamp/press joint, especially for two boards |
| CN111231016A (en) * | 2020-02-11 | 2020-06-05 | 商帅 | High-speed cutting woodworking machine |
| CN113351971A (en) * | 2021-08-09 | 2021-09-07 | 徐州达沃机械科技有限公司 | Cutting equipment of triangular steel for building iron tower |
| JP2021130253A (en) * | 2020-02-20 | 2021-09-09 | 株式会社マキタ | Portable cutter |
| CN214532082U (en) * | 2021-02-26 | 2021-10-29 | 江苏仪征苏中建设有限公司 | Assembled building strutting arrangement |
| CN113629595A (en) * | 2021-08-18 | 2021-11-09 | 南京信息职业技术学院 | Annular multi-angle cable opening device |
| CN214860583U (en) * | 2021-06-10 | 2021-11-26 | 成都市公共卫生临床医疗中心 | Novel chest closed drainage tube gripper |
| CN216298590U (en) * | 2021-09-30 | 2022-04-15 | 武汉明瑞加五金制品有限公司 | Auxiliary device for machining die parts |
| CN114407211A (en) * | 2021-12-16 | 2022-04-29 | 无锡京运通科技有限公司 | A multistage slicer for monocrystalline silicon processing |
| CN115026454A (en) * | 2022-06-24 | 2022-09-09 | 江苏龙只达智能科技有限公司 | Metal desk-top filing cabinet production welding set |
| CN218713486U (en) * | 2022-11-09 | 2023-03-24 | 盐城市波阳机械制造有限公司 | Bucket tooth convenient to tear open and trade bucket prong |
-
2023
- 2023-06-26 CN CN202310755856.9A patent/CN117001857B/en active Active
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0538404U (en) * | 1991-10-28 | 1993-05-25 | 有限会社丸十材木店 | Wood binding |
| JPH0831859A (en) * | 1994-07-19 | 1996-02-02 | Kaijo Corp | Bonder and mechanism for pressing and securing board |
| EP1148256A2 (en) * | 2000-01-26 | 2001-10-24 | IPEG GmbH, Ingenieurdienstleistungen | Connector for tensile and releasable clamp/press joint, especially for two boards |
| CN111231016A (en) * | 2020-02-11 | 2020-06-05 | 商帅 | High-speed cutting woodworking machine |
| JP2021130253A (en) * | 2020-02-20 | 2021-09-09 | 株式会社マキタ | Portable cutter |
| CN214532082U (en) * | 2021-02-26 | 2021-10-29 | 江苏仪征苏中建设有限公司 | Assembled building strutting arrangement |
| CN214860583U (en) * | 2021-06-10 | 2021-11-26 | 成都市公共卫生临床医疗中心 | Novel chest closed drainage tube gripper |
| CN113351971A (en) * | 2021-08-09 | 2021-09-07 | 徐州达沃机械科技有限公司 | Cutting equipment of triangular steel for building iron tower |
| CN113629595A (en) * | 2021-08-18 | 2021-11-09 | 南京信息职业技术学院 | Annular multi-angle cable opening device |
| CN216298590U (en) * | 2021-09-30 | 2022-04-15 | 武汉明瑞加五金制品有限公司 | Auxiliary device for machining die parts |
| CN114407211A (en) * | 2021-12-16 | 2022-04-29 | 无锡京运通科技有限公司 | A multistage slicer for monocrystalline silicon processing |
| CN115026454A (en) * | 2022-06-24 | 2022-09-09 | 江苏龙只达智能科技有限公司 | Metal desk-top filing cabinet production welding set |
| CN218713486U (en) * | 2022-11-09 | 2023-03-24 | 盐城市波阳机械制造有限公司 | Bucket tooth convenient to tear open and trade bucket prong |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117565246A (en) * | 2024-01-15 | 2024-02-20 | 沈阳汉为科技有限公司 | Scribing machine with contact height measuring device |
| CN117565246B (en) * | 2024-01-15 | 2024-03-15 | 沈阳汉为科技有限公司 | Scribing machine with contact height measuring device |
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|---|---|
| CN117001857B (en) | 2024-03-29 |
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