CN116997077A

CN116997077A - PCB and conductive connection method thereof

Info

Publication number: CN116997077A
Application number: CN202311014532.6A
Authority: CN
Inventors: 张继胜
Original assignee: Suzhou Inspur Intelligent Technology Co Ltd
Current assignee: Suzhou Inspur Intelligent Technology Co Ltd
Priority date: 2023-08-11
Filing date: 2023-08-11
Publication date: 2023-11-03

Abstract

The invention provides a PCB and a conductive connection method thereof, wherein the PCB comprises: a support layer and a conductive layer laid on at least one surface of the support layer; wherein, embedded segmentation cable in the supporting layer, dislocation parallel arrangement between the segmentation cable, conductive layer and segmentation cable pass through the preformed hole selectivity conductive connection on the supporting layer. The invention provides the segmented cables which are embedded in the support layer of the PCB in parallel, so that signals can be directly transmitted through the cables or transmitted through the mode of the cables, namely the printed circuits and the cables, thereby greatly reducing the duty ratio of the printed circuits in the signal transmission line, enabling the PCB with low quality to realize high-speed and high-quality transmission of the signals on a longer line, greatly reducing the cost of the PCB and having higher product competitive advantage.

Description

PCB and conductive connection method thereof

Technical Field

The invention relates to the technical field of PCB (printed circuit board) design, in particular to a PCB and a conductive connection method thereof.

Background

With the wide application of AI technology and the rapid development of cloud computing, the requirements on data transmission and data processing in integrated circuits are also higher and higher, and in the design of a PCB (Printed circuit boards printed circuit board), if the transmission loss of the printed circuit is larger, the following two solutions are available at present if the high-speed and high-quality transmission of signals is to be realized;

firstly, the transmission rate and quality of signals are guaranteed by adjusting the circuit layout to shorten the wiring length on the PCB so as to reduce the transmission loss of the signals, and the disadvantage of the method is that the whole layout needs to be readjusted every time, the design and progress of the whole scheme or project are affected, and the high-speed and high-quality transmission of each signal cannot be guaranteed;

secondly, through the panel of the board of upgrading PCB, utilize the lower characteristics of high-grade panel signal loss, can let high-speed signal have longer wiring length on the PCB board to satisfy the design overall arrangement demand, the shortcoming of this kind of mode is that the cost of PCB board is too high for the competitive advantage of its product drops greatly.

Therefore, a PCB board with low cost and small signal transmission loss is needed in the art.

Disclosure of Invention

In order to provide a low-cost PCB board with small signal transmission loss, in a first aspect of the present invention, a PCB board is provided, including: a support layer and a conductive layer laid on at least one surface of the support layer; the segmented cables are embedded in the supporting layer and are arranged in parallel in a staggered mode, and the conducting layer is selectively connected with the segmented cables in a conducting mode through reserved holes in the supporting layer.

In one or more embodiments, the segmented cable is composed of a conductive wire core and an insulating layer wrapping the conductive wire core, wherein the conductive wire core is flat and has a thickness smaller than that of the supporting layer.

In one or more embodiments, the shape of the conductive core further includes: the section of the conductive wire core is triangular, and the height of the section is smaller than the thickness of the supporting layer.

In one or more embodiments, in a structure in which a conductive layer is laid on one side of a support layer, a triangular plane of the segmented cable is parallel to the conductive layer, and a triangular edge is closer to the conductive layer than a plane.

In one or more embodiments, the segmented cable further includes: the wiring terminal is in a circular ring shape or a circular disc shape and is arranged right below the reserved hole, wherein the outer diameter of the circular ring is smaller than or equal to the diameter of the reserved hole.

In one or more embodiments, the terminal is a copper ring, a round copper sheet, or a conductive layer etched into a round shape.

In one or more embodiments, the PCB board has multiple support layers, each support layer has embedded therein staggered parallel arranged segmented cables, a conductive layer is disposed between the support layers, and through-holes on each support layer are connected for selective conductive connection of the segmented cables between the layers.

In one or more embodiments, the segmented cable further includes: and the staggered parallel arrangement segmented cables and the inclined segmented cables are hard core cables relative to the staggered parallel arrangement segmented cables.

In one or more embodiments, the material of the support layer includes: the conductive layer is a copper film.

In a second aspect of the present invention, a conductive connection method based on any one of the embodiments of the PCB board is provided, where the method includes: etching the conductive layer according to a target circuit diagram to form an etched wire so as to be bridged between reserved holes above any two sections of segmented cables; embedding wire studs in and on the two preformed holes connected by the etched wires Fang Dianhan; inserting pins of an electrical element into the reserved holes at preset positions and tightly contacting with the wiring terminals; and spot-welding the pins on the conductive layer of the end points of the etched lead.

The beneficial effects of the invention include: the invention provides the segmented cables which are embedded in the support layer of the PCB in parallel, so that signals can be directly transmitted through the cables or transmitted through the mode of the cables, namely the printed circuits and the cables, thereby greatly reducing the duty ratio of the printed circuits in the signal transmission line, enabling the PCB with low quality to realize high-speed and high-quality transmission of the signals on a longer line, greatly reducing the cost of the PCB and having higher product competitive advantage.

Drawings

In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are necessary for the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention and that other embodiments may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of a PCB board according to a first embodiment of the present invention;

fig. 2 is a schematic structural diagram of a PCB board according to a second embodiment of the present invention;

fig. 3 is a flow chart of a conductive connection method of a PCB board of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the following embodiments of the present invention will be described in further detail with reference to the accompanying drawings.

It should be noted that, in the embodiments of the present invention, all the expressions "first" and "second" are used to distinguish two entities with the same name but different entities or different parameters, and it is noted that the "first" and "second" are only used for convenience of expression, and should not be construed as limiting the embodiments of the present invention, and the following embodiments are not described one by one.

Since the transmission loss of a PCB is mainly due to its printed circuit, it is especially a low quality PCB that is inexpensive. Therefore, in order to design a PCB board capable of realizing high-speed and high-quality signal transmission and low in cost, the invention provides a PCB board which is characterized in that a plurality of sections of parallel-arranged segmented cables are embedded in a supporting layer of the PCB board, so that signals can be directly transmitted through the cables or transmitted in a cable-printed circuit-cable mode, the occupation ratio of the printed circuit in a signal transmission line is greatly reduced, the high-speed and high-quality signal transmission on a longer line can be realized even if the PCB board with low quality is realized, the cost of the PCB board is greatly reduced, and the PCB board has higher product competition advantage. Embodiments of the present invention will be described in detail below with reference to the attached drawing figures:

referring to fig. 1, a schematic structure of a PCB board according to an embodiment of the present invention is shown, including: a support layer 10 and a conductive layer 20 applied to at least one side of the support layer; wherein, the segmented cables 30 are embedded in the supporting layer, the segmented cables 30 are arranged in parallel in a staggered manner, and the conductive layer 20 is selectively connected with the segmented cables 30 in a conductive manner through the reserved holes 40 on the supporting layer.

It should be noted that, the embedded mode of the segmented cable can be realized by pressing the segmented cable in the middle by using two supporting layers with the thickness half of the normal thickness; and then holes are punched in one or both sides of the support plate to connect the segmented cables. The purpose of staggered parallel arrangement among the segmented cables is to facilitate longitudinal wiring connection, and when the segmented cables adopt hard wire cores, the folding resistance of the PCB can be enhanced; finally, the conductive layer is not connected with the embedded segmented cable initially, and the conductive layer and the embedded segmented cable are selectively connected in a conductive manner only when needed, and the specific conductive connection mode is shown in the following method embodiments.

In a further embodiment, the segmented cable is composed of a conductive core and an insulating layer wrapping the conductive core, wherein the conductive core is flat and has a thickness smaller than that of the supporting layer. In order to better ensure the transmission quality of signals or more densely buried wires, the segmented cables embedded in the supporting layer can be cables with insulating covers, so that the impedance between the segmented cables or between the segmented cables and the conductive wires is increased, and the flat cables are easier to put for lamination.

In a further embodiment, the shape of the conductive core further comprises: the section of the conductive wire core is triangular, and the height of the section is smaller than the thickness of the supporting layer. The interface is the segmentation wire of triangle nature and is easily put in order to carry out the pressfitting first, and second can increase cable conducting surface and conducting layer's distance under certain circumstances to guarantee signal transmission quality, for example:

in a further embodiment, in the structure in which the conductive layer is laid on one side of the support layer, the triangular plane of the segmented cable is parallel to the conductive layer, and the triangular edge is closer to the conductive layer than the plane.

In addition, in the multilayer structure, the triangular wire cores can avoid direct opposite of the conductive surfaces of the cables, and interference among signals is reduced.

In a further embodiment, the segmented cable further comprises: binding post, binding post are ring form or circular to set up under the preformed hole, wherein, the external diameter of ring is less than or equal to the diameter of preformed hole.

It should be noted that, the application scenarios of the two connection terminals are different, and the adoption of the wafer-shaped connection terminal in the single-layer structure can effectively increase the contact area, thereby reducing the contact resistance; the annular connecting terminal in the multilayer structure can realize conductive connection of the segmented cables among layers; the wiring terminal is a copper ring, a round copper sheet or a conductive layer etched into a round shape.

In a further embodiment, the PCB board has a plurality of support layers, each support layer having embedded therein staggered parallel arrangement of segmented cables, a conductive layer disposed between the support layers, and a preformed hole in each support layer being in through connection for selective conductive connection of the segmented cables between the layers. As can be seen from the foregoing embodiments, the connection terminals of the segmented cable in the multilayer structure can only be circular, and please refer to the following method embodiments.

In a further embodiment, referring to fig. 2, the segmented cable of the present invention further includes: the staggered parallel arrangement segmented cables and the inclined segmented cables are hard core cables relative to the inclined segmented cables of the staggered parallel arrangement segmented cables.

It should be noted that the diagonal segmented cable helps to shorten the routing length in the direction of the vertical segmented cable and reduce the duty cycle of the printed circuit. When the hard core cables are adopted, the inclined segmented cables are also beneficial to improving the torsion resistance of the PCB. In fig. 2, black dots on the obliquely segmented cable are connection terminals, and a reserved hole (not shown) is arranged right above the connection terminals.

In a further embodiment, the material of the support layer in each of the above embodiments includes: phenolic resin, glass fiber, epoxy resin or inorganic aluminum, and the conductive layer is a copper film.

In a second aspect of the present invention, a method for conducting connection of a PCB board based on any of the above embodiments is provided, referring to fig. 3, the method includes: step S1, etching a conductive layer according to a target circuit diagram to form an etched wire so as to be bridged between reserved holes above any two sections of segmented cables; step S2, embedding a wire post in the two reserved holes connected by the etched wire and putting the wire post on the two reserved holes Fang Dianhan; step S3, pins of the electrical element are inserted into reserved holes in preset positions and are in close contact with the wiring terminals; and S4, spot welding the pins on the conductive layer of the end points of the etched wires.

In the above steps, the step S1 and the step S2 realize conductive connection between the printed circuit and the embedded segmented cable, and the specific implementation manner is that one end of the wire post is in contact connection with the connection terminal of the segmented cable, and the other end of the wire post is connected with the printed circuit through a welding point, wherein the wire post can be a copper post; step S3 and step S4 realize the conductive connection of the electrical element with the segmented cable. By the method, the universality and the reliability of the novel PCB communication path can be ensured.

The foregoing is an exemplary embodiment of the present disclosure, but it should be noted that various changes and modifications could be made herein without departing from the scope of the disclosure as defined by the appended claims. The functions, steps and/or actions of the method claims in accordance with the disclosed embodiments described herein need not be performed in any particular order. Furthermore, although elements of the disclosed embodiments may be described or claimed in the singular, the plural is contemplated unless limitation to the singular is explicitly stated.

It should be understood that as used herein, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly supports the exception. It should also be understood that "and/or" as used herein is meant to include any and all possible combinations of one or more of the associated listed items.

The foregoing embodiment of the present invention has been disclosed with reference to the number of embodiments for the purpose of description only, and does not represent the advantages or disadvantages of the embodiments.

Those of ordinary skill in the art will appreciate that: the above discussion of any embodiment is merely exemplary and is not intended to imply that the scope of the disclosure of embodiments of the invention, including the claims, is limited to such examples; combinations of features of the above embodiments or in different embodiments are also possible within the idea of an embodiment of the invention, and many other variations of the different aspects of the embodiments of the invention as described above exist, which are not provided in detail for the sake of brevity. Therefore, any omission, modification, equivalent replacement, improvement, etc. of the embodiments should be included in the protection scope of the embodiments of the present invention.

Claims

1. A PCB board, comprising:

a support layer and a conductive layer laid on at least one surface of the support layer;

the segmented cables are embedded in the supporting layer and are arranged in parallel in a staggered mode, and the conducting layer is selectively connected with the segmented cables in a conducting mode through reserved holes in the supporting layer.

2. The PCB of claim 1, wherein the segmented cable is composed of a conductive core and an insulating layer surrounding the conductive core, wherein the conductive core is flat and has a thickness less than a thickness of the supporting layer.

3. The PCB of claim 2, wherein the shape of the conductive core further comprises: the section of the conductive wire core is triangular, and the height of the section is smaller than the thickness of the supporting layer.

4. A PCB board according to claim 3, wherein in the structure in which the supporting layer is provided with a single-sided conductive layer, the triangular plane of the segmented cable is parallel to the conductive layer, and the triangular edge is closer to the conductive layer than the plane.

5. The PCB of claim 4, wherein the segmented cable further comprises: the wiring terminal is in a circular ring shape or a circular disc shape and is arranged right below the reserved hole, wherein the outer diameter of the circular ring is smaller than or equal to the diameter of the reserved hole.

6. The PCB of claim 5, wherein the terminals are copper rings, round copper sheets, or conductive layers etched into a round shape.

7. A PCB board according to any of claims 1-6, wherein the PCB board has a plurality of support layers, each support layer having embedded therein staggered parallel arrangement of segmented cables, a conductive layer being laid between the support layers, and preformed holes in each support layer being connected therethrough for selective conductive connection of the segmented cables from layer to layer.

8. The PCB of any one of claims 1-6, wherein the segmented cable further comprises: and the staggered parallel arrangement segmented cables and the inclined segmented cables are hard core cables relative to the staggered parallel arrangement segmented cables.

9. A PCB board according to any of claims 1-6, wherein the material of the support layer comprises: the conductive layer is a copper film.

10. A method of conductive connection of a PCB board according to any of claims 1-9, characterized in that the method comprises:

etching the conductive layer according to a target circuit diagram to form an etched wire so as to be bridged between reserved holes above any two sections of segmented cables;

embedding wire studs in and on the two preformed holes connected by the etched wires Fang Dianhan;

inserting pins of an electrical element into the reserved holes at preset positions and tightly contacting with the wiring terminals;

and spot-welding the pins on the conductive layer of the end points of the etched lead.