CN116995005A - Wafer storage and transportation device - Google Patents
Wafer storage and transportation device Download PDFInfo
- Publication number
- CN116995005A CN116995005A CN202210765945.7A CN202210765945A CN116995005A CN 116995005 A CN116995005 A CN 116995005A CN 202210765945 A CN202210765945 A CN 202210765945A CN 116995005 A CN116995005 A CN 116995005A
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- CN
- China
- Prior art keywords
- unit
- transportation device
- wafer storage
- buffer
- base wall
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- Pending
Links
- 235000012431 wafers Nutrition 0.000 claims abstract description 66
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 19
- 238000004378 air conditioning Methods 0.000 claims description 2
- 230000004308 accommodation Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A wafer storage and transportation device comprises a shell unit, a door plate unit and a buffer unit. The housing unit includes a shell defining a receiving opening. The door panel unit includes a base plate defining a first buffer space. The base plate is provided with a base wall part, a first protruding part which extends from the base wall part opposite to the shell and jointly defines the first buffer space with the base wall part, and a plurality of first reinforcing ribs which connect the first protruding part with the base wall part. The first cover body holder of the buffer unit can be arranged in the first buffer space through the first buffer space defined by the substrate, so that wafers stored in the wafer storage and transportation device can approach the door plate unit without increasing the thickness of the door plate unit, and in addition, the structural strength of the door plate unit is enhanced through the first reinforcing rib, so that the effect meeting the industry standard is achieved.
Description
Technical Field
The invention relates to a storage and transportation box applied to semiconductor equipment, in particular to a wafer storage and transportation device.
Background
To facilitate global users and suppliers' understanding of semiconductor manufacturing definitions and product specifications, the semiconductor equipment materials industry association (SEMI) establishes SEMI standards, specifying product specifications associated with semiconductor manufacturing, known in the industry as SEMI standards.
As a Wafer storage and transportation device stores not only existing round wafers (Wafer), but also square wafers for solar industry may be stored. Referring to fig. 1, a conventional wafer storage and transportation box 1 is capable of storing round wafers 11 or square wafers (not shown) at the same time by improving the wafer storage and transportation box which can only store round wafers. However, the bottom area of the wafer storage and transportation box is too large and does not meet the standard dimension L1 specified by the SEMI standard.
Disclosure of Invention
One of the objects of the present invention is to provide a wafer storage and transportation device conforming to SEMI standard.
In some embodiments, the wafer storage and transportation device of the present invention is suitable for storing a plurality of wafers, and includes: the door comprises a shell unit, a door plate unit and a buffer unit.
The housing unit includes a shell defining a receiving opening.
The door panel unit is detachably mounted to the housing and is used for closing the accommodating opening, and comprises a base plate defining a first buffer space with an opening facing the housing. The base plate is provided with a base wall part, a first protruding part which extends from the base wall part opposite to the shell and jointly defines the first buffer space with the base wall part, and a plurality of first reinforcing ribs which connect the first protruding part with the base wall part.
The buffer unit comprises a first cover body holder arranged in the first buffer space, and the first cover body holder is provided with a plurality of first flexible buffer parts which are suitable for the wafer to lean against so as to absorb vibration.
In the wafer storage and transportation device, the substrate further defines two second buffer spaces which are positioned at two opposite sides of the first buffer space and are opened towards the shell, the substrate further comprises two second protruding parts which extend from the base wall part opposite to the shell, and each second protruding part and the base wall part jointly define the corresponding second buffer space.
In the wafer storage and transportation device of the invention, each first reinforcing rib is also connected with the adjacent second protruding part.
The substrate is also provided with a plurality of second reinforcing ribs for connecting the second protruding parts and the base wall parts.
The substrate is also provided with a plurality of third reinforcing ribs connected with the second reinforcing ribs.
The buffer unit further comprises two second cover body retainers respectively arranged in the second buffer space, and the second cover body retainers are provided with a plurality of second flexible buffer parts which are suitable for the wafers to lean against to absorb vibration.
The wafer storage and transportation device of the invention, the door plate unit also comprises an outer frame piece surrounding and connected with the base plate, and the outer frame piece is provided with a foolproof notch which is formed at the outer periphery and is matched with the accommodating opening of the shell in shape.
The wafer storage and transportation device further comprises an accessory unit, wherein the accessory unit comprises a plurality of identification pieces, the shell unit further comprises a base connected to the bottom of the shell, and the base is provided with a plurality of accessory holes for detachably installing the identification pieces.
In the wafer storage and transportation device, each identification piece is a wireless radio frequency identification tag.
The beneficial effects of the invention are that: the first cover body holder can be arranged in the first buffer space through the first buffer space defined by the base plate, so that the wafer stored in the wafer storage device can approach to the direction of the door plate unit without increasing the thickness of the door plate unit, and in addition, the structural strength of the door plate unit is enhanced through the first reinforcing rib, thereby achieving the effect of meeting SEMI standard.
Drawings
Other features and advantages of the invention will be apparent from the following description of the embodiments with reference to the accompanying drawings, in which:
FIG. 1 is a schematic top view of a conventional wafer carrier and transport cassette;
FIG. 2 is a perspective view of an embodiment of the wafer handling device of the present invention;
FIG. 3 is an exploded perspective view of the embodiment;
FIG. 4 is an exploded perspective view of the door panel unit in the illustrated embodiment;
FIG. 5 is an exploded perspective view of the door panel unit from another angle;
FIG. 6 is a schematic top view of the embodiment; a kind of electronic device with high-pressure air-conditioning system
Fig. 7 is a bottom view of the embodiment.
Detailed Description
Referring to fig. 2 and 3, an embodiment of the wafer storage and transportation device of the present invention is suitable for storing a plurality of wafers (refer to fig. 6, only one is shown), and includes a housing unit 2, a door unit 3 and a buffer unit 4.
The housing unit 2 comprises a casing 21 defining a receiving opening 211.
Referring to fig. 3, 4 and 5, the door unit 3 is detachably mounted to the housing 21 and used for closing the receiving opening 211, and includes a base plate 31 defining a first buffer space 311 with an opening facing the housing 21. The base plate 31 has a base wall 312, a first protrusion 313 extending from the base wall 312 opposite to the housing 21 and defining the first buffer space 311 with the base wall 312, and a plurality of first reinforcing ribs 314 connecting the first protrusion 313 and the base wall 312.
It should be noted that, in one implementation aspect of the present embodiment, the door unit 3 further includes an outer frame member 32 surrounding and connected to the base plate 31, and the outer frame member 32 has a fool-proof notch 321 formed at an outer periphery and shaped to fit in the receiving opening 211 of the housing 21. Since the fool-proof notch 321 makes the outer periphery of the outer frame member 32 asymmetrical, the user only has one mounting manner to mount the door unit 3 on the housing 21, thereby reducing the occurrence of mounting direction errors.
It is added that the door panel unit 3 is mounted to the housing unit 2 by a latch set 33, however, this is not a technical feature of the present invention, and will be understood by those skilled in the art with reference to the prior art, and will not be described herein.
The buffer unit 4 includes a first cover holder 41 provided in the first buffer space 311, and the first cover holder 41 has a plurality of first flexible buffer portions 411.
Specifically, the first buffer space 311 is substantially located in the center of the substrate 31, so that the first flexible buffer portion 411 of the first cover holder 41 can be adapted to be abutted against the circular wafer 6 and absorb the vibration of the wafer 6 during the transportation process, thereby reducing the breakage of the wafer 6.
Because of the first buffer space 311 defined by the base plate 31, the first cover holder 41 may be disposed in the first buffer space 311, so that the wafers 6 stored in the wafer storage and transportation device of the present invention may be moved closer to the door unit 3 without increasing the thickness of the door unit 3, and in addition, the first reinforcing rib 314 may enhance the structural strength of the door unit 3, thereby reaching the SEMI standard.
In one embodiment of the present invention, in order to prevent the square or square-like wafer 6 from being broken by impact at four corners, the substrate 31 further defines two second buffer spaces 316 located at opposite sides of the first buffer space 311 and open towards the housing 21, and the substrate 31 further has two second protruding portions 315 extending from the base wall portion 312 opposite to the housing 21, and each of the second protruding portions 315 and the base wall portion 312 together define the corresponding second buffer space 316. Each first reinforcing rib 314 is also connected to an adjacent said second projection 315. The buffer unit 4 further includes two second cover holders 42 respectively disposed in the second buffer space 316, where the second cover holders 42 have a plurality of second flexible buffer portions 421 adapted for the wafers 6 to abut against to absorb vibration.
Preferably, the base plate 31 further has a plurality of second reinforcing ribs 317 connecting the second protruding portions 315 and the base wall portion 312, so as to enhance the connection strength between the second protruding portions 315 and the base wall portion 312, thereby enhancing the overall structural strength of the door panel unit 3. In addition, the base plate 31 has two third reinforcing ribs 318 connected to the second reinforcing ribs 317 on the same side.
Referring to fig. 6, it is additionally described that, according to the foregoing description, wafers 6 of different specifications (round/square) can be mounted on the present embodiment, in order to prevent the field staff from mistaking, in the present embodiment, the housing unit 2 further has two handles 22 detachably mounted on the housing 21, preferably, the handles 22 can have different colors, patterns or materials according to the specifications of different wafers 6, and the field staff can directly observe the handles 22 through eyes, so that the specification of the wafers 6 in the wafer storage and transportation device can be known.
Referring to fig. 6 and 7, it is further explained that even the same shape wafer 6 may have a process variation, and thus, in one embodiment of the present invention, an accessory unit 5 is further included. The accessory unit 5 comprises a plurality of identifiers 51, the housing unit 2 further comprises a base 23 connected to the bottom of the casing 21, the base 23 having a plurality of accessory holes 231 for the removable mounting of the identifiers 51. Specifically, each identifier 51 is a Radio Frequency Identification (RFID) tag. Therefore, the identification piece 51 can be used for enabling on-site staff to know the specification of the wafer 6 in the wafer storage and transportation device. The judgment method is exemplified by, but not limited to, the following.
Judgment mode 1:
by removing or installing a specific number of the identification members 51, the field staff can know the specification of the wafer 6 in the wafer storage and transportation device. For example, in the present embodiment, there are three identifiers 51 and three fitting holes 231, and the fitting holes 231 are located on the left, right and rear sides of the base 23, respectively. When the RFID detecting device (not shown) in the factory detects three identifiers 51, i.e. the specification 1, when the RFID detecting device (not shown) in the factory detects only identifiers 51 on the left and right sides, i.e. the specification 2, and so on, a maximum of 8 combinations of different specifications can be generated, and the advantage of this approach is that each identifier 51 is identical, and it is not necessary to prepare different identifiers 51 according to different specifications.
Judgment mode 2:
each of the fitting holes 231 is for mounting the corresponding one of the identifiers 51 of the different specifications of the wafer 6, for example, there are also three identifiers 51 and three fitting holes 231, the identifier 51 in the fitting hole 231 on the left side has the size information, the identifier 51 in the fitting hole 231 on the right side has the thickness information, and the identifier 51 in the fitting hole 231 on the upper side has the process information. When the RFID detecting device (not shown) in the factory detects the three identifying members 51, the specification of the wafer 6 in the wafer storage and transportation device can be known by reading the information in the identifying members 51. The advantage of this approach is that it is possible to accommodate wafers 6 of various specifications in the factory, with good applicability, as long as there are a sufficient number of types of identifiers 51.
In summary, in the wafer storage and transportation device of the present invention, the first buffer space 311 defined by the substrate 31 allows the first cover holder 41 to be disposed in the first buffer space 311, so that the wafers 6 stored in the wafer storage and transportation device of the present invention can be moved closer to the door unit 3 without increasing the thickness of the door unit 3, and the first reinforcement rib 314 can enhance the structural strength of the door unit 3, so that the purpose of the present invention can be achieved.
The foregoing is merely illustrative of the present invention and is not intended to limit the scope of the invention, which is defined by the appended claims and their equivalents.
Claims (9)
1. The utility model provides a wafer warehousing and transportation device, is applicable to and stores a plurality of wafers, its characterized in that: and comprises:
a housing unit including a case defining an accommodation opening;
a door panel unit detachably mounted to the housing and adapted to close the receiving opening, and including a base plate defining a first buffer space having an opening toward the housing, the base plate having a base wall portion, a first protruding portion extending from the base wall portion opposite to the housing and defining the first buffer space together with the base wall portion, and a plurality of first reinforcing ribs connecting the first protruding portion and the base wall portion; a kind of electronic device with high-pressure air-conditioning system
The buffer unit comprises a first cover body holder arranged in the first buffer space, and the first cover body holder is provided with a plurality of first flexible buffer parts which are suitable for the wafers to lean against to absorb vibration.
2. The wafer storage and transportation device according to claim 1, wherein: the base plate also defines two second buffer spaces which are positioned at two opposite sides of the first buffer space and are opened towards the shell, the base plate is also provided with two second protruding parts which extend from the base wall part opposite to the shell, and each second protruding part and the base wall part jointly define the corresponding second buffer space.
3. The wafer storage and transportation device according to claim 2, wherein: each first reinforcing rib is also connected to an adjacent second projection.
4. The wafer storage and transportation device according to claim 2, wherein: the base plate is also provided with a plurality of second reinforcing ribs which connect the second protruding parts and the base wall parts.
5. The wafer storage and transportation device according to claim 4, wherein: the base plate also has a plurality of third reinforcing ribs connecting the second reinforcing ribs.
6. A wafer storage and transportation device according to claim 3, wherein: the buffer unit further comprises two second cover body retainers respectively arranged in the second buffer space, and the second cover body retainers are provided with a plurality of second flexible buffer parts which are suitable for being abutted by the wafer to absorb vibration.
7. The wafer storage and transportation device according to claim 1, wherein: the door plate unit also comprises an outer frame member surrounding and connected with the base plate, wherein the outer frame member is provided with a fool-proof notch which is formed at the outer periphery and is matched with the accommodating opening of the shell in a shape.
8. The wafer storage and transportation device according to claim 1, wherein: the device further comprises a fitting unit, wherein the fitting unit comprises a plurality of identification pieces, the shell unit further comprises a base connected to the bottom of the shell, and the base is provided with a plurality of fitting holes for detachably installing the identification pieces.
9. The wafer storage and transportation device according to claim 8, wherein: each identification is a radio frequency identification tag.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW111115844 | 2022-04-26 | ||
| TW111115844A TW202342342A (en) | 2022-04-26 | 2022-04-26 | Wafer storage and transportation device for achieving the effect of satisfying the SEMI standard |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116995005A true CN116995005A (en) | 2023-11-03 |
Family
ID=88523789
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210765945.7A Pending CN116995005A (en) | 2022-04-26 | 2022-07-01 | Wafer storage and transportation device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN116995005A (en) |
| TW (1) | TW202342342A (en) |
-
2022
- 2022-04-26 TW TW111115844A patent/TW202342342A/en unknown
- 2022-07-01 CN CN202210765945.7A patent/CN116995005A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| TW202342342A (en) | 2023-11-01 |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |