CN116990727A - Magnetic flux sensor structure - Google Patents
Magnetic flux sensor structure Download PDFInfo
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- CN116990727A CN116990727A CN202310968640.0A CN202310968640A CN116990727A CN 116990727 A CN116990727 A CN 116990727A CN 202310968640 A CN202310968640 A CN 202310968640A CN 116990727 A CN116990727 A CN 116990727A
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- probe
- magnetic flux
- adapter plate
- flux sensor
- magnetic
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- 230000005291 magnetic effect Effects 0.000 title claims abstract description 86
- 230000004907 flux Effects 0.000 title claims abstract description 49
- 239000000523 sample Substances 0.000 claims abstract description 109
- 238000012545 processing Methods 0.000 claims abstract description 49
- 239000004020 conductor Substances 0.000 claims abstract description 46
- 239000011159 matrix material Substances 0.000 claims abstract description 16
- 230000005284 excitation Effects 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 11
- 230000003287 optical effect Effects 0.000 claims description 9
- 229910010293 ceramic material Inorganic materials 0.000 claims description 4
- 239000012811 non-conductive material Substances 0.000 claims description 4
- 238000010276 construction Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 29
- 238000005457 optimization Methods 0.000 abstract description 4
- 238000010923 batch production Methods 0.000 abstract 1
- 230000035945 sensitivity Effects 0.000 description 7
- 238000012544 monitoring process Methods 0.000 description 6
- 238000001514 detection method Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000009434 installation Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/0047—Housings or packaging of magnetic sensors ; Holders
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/0052—Manufacturing aspects; Manufacturing of single devices, i.e. of semiconductor magnetic sensor chips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Measuring Magnetic Variables (AREA)
Abstract
The application provides a magnetic flux sensor structure, and relates to the field of sensors. The structure comprises a magnetic-sensing probe, an adapter plate, a signal processing plate, a probe matrix and at least one signal conductor accommodated in the probe matrix, wherein one end of the signal conductor is connected with an electrode of the sensor, the other end of the signal conductor is electrically connected with the adapter plate, and the signal processing plate is used for providing excitation for the magnetic-sensing probe and processing an output signal from the magnetic-sensing probe; one surface of the adapter plate is connected with the probe base body, the other surface of the adapter plate is connected with the signal processing plate, one surface of the adapter plate, which is close to the probe base body, is provided with a cavity structure which is matched with the magnetic sensitive probe, one end of the magnetic sensitive probe is connected with the probe base body, and the other end of the magnetic sensitive probe is arranged in the cavity structure. Through carrying out structural optimization, can promote magnetic flow sensor's firm performance to simple structure, the yield and the production efficiency of manufacturing are promoted easily in batch production and in the production process of being convenient for.
Description
Technical Field
The application relates to the field of sensors, in particular to a magnetic flux sensor structure.
Background
The magnetic flux sensor is a sensor which works on the principle of magnetic induction based on the magnetic flux effect. By using a special circuit design, high-sensitivity detection is realized, and the overall noise level of the magnetic flux sensor is less than or equal to 10 pTrms/VHz@1Hz in an environment with a stable interference electric field or magnetic field. The magnetic flux sensor (including gradient array) can be widely applied to: aerospace, mining safety monitoring, new energy production safety monitoring, electric power safety monitoring, railway and road bridge safety monitoring, biomedical, intelligent building site safety monitoring, water conservancy dam safety monitoring, geological exploration, geomagnetic positioning navigation and other fields. However, due to the microstructure of the magnetic flux sensor, the magnetic flux sensor is easy to damage if being influenced by external factors such as falling, extrusion, external collision and the like.
Therefore, the magnetic flux sensor is firm and reliable, has a simple structure, and is convenient for mass production and capable of improving the manufacturing yield and the production efficiency in the mass production process.
Disclosure of Invention
In order to overcome or at least partially solve the above-mentioned problems, the present application provides a magnetic flux sensor structure, which can improve the firmness of the magnetic flux sensor by performing structural optimization, has a simple structure, is convenient for mass production, and is easy to improve the yield and the production efficiency of manufacturing in the production process.
The application is realized in the following way:
the application provides a magnetic flux sensor structure, which comprises a magnetic sensitive probe, an adapter plate, a signal processing plate, a probe matrix and at least one signal conductor accommodated in the probe matrix, wherein one end of the signal conductor is connected with an electrode of the sensor, the other end of the signal conductor is electrically connected with the adapter plate, and the signal processing plate is used for providing excitation for the magnetic sensitive probe and processing an output signal from the magnetic sensitive probe; one surface of the adapter plate is connected with the probe base body, the other surface of the adapter plate is connected with the signal processing plate, one surface of the adapter plate, which is close to the probe base body, is provided with a cavity structure which is matched with the magnetic sensitive probe, one end of the magnetic sensitive probe is connected with the probe base body, and the other end of the magnetic sensitive probe is arranged in the cavity structure.
Furthermore, the adapter plate is detachably connected with the probe base body and the signal processing plate.
Furthermore, the connection modes between the adapter plate, the probe base body and the signal processing plate are all welding.
Further, the signal conductors housed in the probe body are all optical conductors, or are all electrical conductors, or are partially optical conductors, and are partially electrical conductors.
Further, the circuit components on the signal processing board are integrated on one side of the signal processing board away from the adapter board.
Further, the signal conductor is a bonding pad welded on the probe base body, the electrode of the magnetosensitive probe is welded on the corresponding bonding pad, and the bonding pad is also abutted with the corresponding electric connection position of the adapter plate.
Further, the adapter plate, the signal processing plate and the probe body have the same shape and size.
Furthermore, the probe matrix is made of ceramic materials.
Further, the probe substrate is an elastic substrate made of a PCB substrate or a non-conductive material.
Compared with the prior art, the application has at least the following advantages or beneficial effects:
(1) By optimizing the structures of the magnetic sensitive probe, the adapter plate, the signal processing plate, the probe matrix and the like which form the magnetic flux sensor, the structure strength can be effectively enhanced under the condition that the sensitivity of the sensor is not affected by optimizing the previous connection relation, so that the sensor is not damaged due to collision and falling to a certain degree.
(2) The whole magnetic flux sensor has a simple structure, is convenient for mass production and is easy to improve the manufacturing yield and the production efficiency in the production process.
(3) The electrode of the magnetic sensitive probe is directly welded on the probe matrix to form a bonding pad, and then the bonding pad is abutted with the corresponding electric connection position of the adapter plate, so that a signal conductor for connecting the magnetic sensitive probe and the adapter plate can be formed by using the bonding pad, and the overall structure of the sensor can be further simplified.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a side cross-sectional view of one embodiment of a magnetic flux sensor structure of the present application;
FIG. 2 is a side cross-sectional view of yet another embodiment of a magnetic flux sensor configuration of the present application;
fig. 3 is a side cross-sectional view of another embodiment of a magnetic flux sensor structure of the present application.
Icon: 1. a magnetically sensitive probe; 2. an adapter plate; 3. a probe base; 4. a signal processing board; 5. a cavity structure; 6. a signal conductor.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments of the present application. The components of the embodiments of the present application generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the application, as presented in the figures, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
Examples
Some embodiments of the present application are described in detail below with reference to the accompanying drawings. The various embodiments and features of the embodiments described below may be combined with one another without conflict.
The embodiment of the application provides a magnetic flux sensor structure, which can improve the firmness of a magnetic flux sensor through structural optimization, has a simple structure, is convenient for mass production, and is easy to improve the manufacturing yield and the production efficiency in the production process.
Referring to fig. 1-3, the magnetic flux sensor structure includes a magneto-sensitive probe 1, an adapter plate 2, a signal processing board 4, a probe base 3, and at least one signal conductor 6 accommodated in the probe base 3, wherein one end of the signal conductor 6 is connected to an electrode of the sensor, and the other end is electrically connected to the adapter plate 2, and the signal processing board 4 is used for providing excitation to the magneto-sensitive probe 1 and processing an output signal from the magneto-sensitive probe 1; one surface of the adapter plate 2 is connected with the probe matrix 3, the other surface is connected with the signal processing plate 4, one surface of the adapter plate 2, which is close to the probe matrix 3, is provided with a cavity structure 5 which is matched with the magnetosensitive probe 1, one end of the magnetosensitive probe 1 is connected with the probe matrix 3, and the other end of the magnetosensitive probe 1 is arranged in the cavity structure 5.
The magnetic flux sensor is a sensor that can obtain a constant output in a low magnetic field, and is a magnetic sensor that has high sensitivity for converting magnetic effects (converting magnetic force and electric force). Wherein the magneto-sensitive probe 1 is the most basic unit of the sensor and is also the most vulnerable part, influenced by its own microstructure construction. Therefore, when the sensor is affected by external factors such as dropping, extrusion, external force collision, etc., the magneto-sensitive probe 1 is most likely to be damaged or the sensitivity is reduced. Therefore, it is conceivable to perform a reinforcing treatment on the magnetosensitive probe 1, for example, to add a protective layer to the outer surface thereof. However, on the one hand, the sensitivity of the magnetosensitive probe 1 is reduced, and the whole magnetic flux sensor becomes larger, so that the performance of the magnetic flux sensor is influenced.
The volume problem is mainly as follows: in the design and manufacture of a magneto-sensitive element as a detection magnetic field, the general detection concept is: the magnetism of a point in the magnetic field is measured. The definition as a point is infinitely small in geometry. In magnetic field detection, since the area, volume, gap size, etc. of the magnetic field are limited areas (dimensions), it is desirable that the area of the magnetic sensor should be smaller and more accurate than the area of the magnetic field to be measured. In the technique of magnetic field imaging, the smaller the element volume, the more pixels are acquired within the same area. The higher the resolution, the higher the sharpness. In surface magnetic field measurement and detection of a multi-stage magnet, such a requirement is necessarily required in a magnetic grating ruler.
In the above embodiment, however, first, the magneto-sensitive probe 1 is integrated on a small probe base 3, and the signal conductor 6 for connecting the electrode of the magneto-sensitive probe 1 with the interposer 2 is provided on the probe base 3. In practice, the signal conductor 6 is used for making an electrical connection between the magnetosensitive probe 1 and the signal processing board 4, so if the interposer 2 is integrated on the signal processing board 4, two ends of the signal conductor 6 are connected between the electrode of the magnetosensitive probe 1 and the signal processing board 4, respectively. Then, the adapter plate 2 is provided with a cavity structure 5 matched with the magnetosensitive probe 1 to be connected with the probe matrix 3, and the magnetosensitive probe 1 is placed in the cavity structure 5 to realize the protection function. Finally, the other surface of the adapter plate 2 is connected with the signal processing plate 4, so that the whole installation and processing process of the magnetic flux sensor structure can be realized. That is, the magnetic sensitive probe 1 can be accommodated by the probe substrate 3 with length and width larger than those of the magnetic sensitive probe 1, and the two-layer structure of the adapter plate 2 and the signal processing plate 4 further enhances the structural strength, so that the magnetic flux sensor is not damaged by collision and falling to a certain extent. The magnetic flux sensor is based on the structural optimization of the magnetic flux sensor, and the overall structural strength is enhanced, so that the sensitivity is not unnecessarily affected as in the prior art by the technical means of adding a protective layer. And the installation and processing process in the steps is adopted, so that the processing is simple and convenient, and the mass production of the magnetic flux sensor is facilitated. And because the structure is simple and the processing process is simple, the yield and the production efficiency of the magnetic flux sensor in the mass production and manufacturing process can be improved.
Wherein, as shown in fig. 1 and 3, in some embodiments of the present application, the adapter plate 2, the signal processing plate 4 and the probe body 3 have the same shape and size. In this way, when the adapter plate 2, the signal processing board 4 and the probe base 3 are connected and fixed, the three are convenient to fix (for example, the three can be fixed by the same fixing clamp before being connected by wire). And, because the three have the same shape and size, it is also easy and convenient to pack the final product. The same shape and size as used herein means that the three plates are uniform, and the thickness is not required to be uniform.
Referring to fig. 2, in some embodiments of the present application, a pit structure capable of accommodating the interposer 2 may be further formed on the signal processing board 4, so that the interposer 2 may be protected as well, and the strength of the overall structure may be further enhanced.
Referring to fig. 1-3, in some embodiments of the present application, the adapter plate 2 is detachably connected to the probe base 3 and the signal processing board 4.
In the above embodiment, one surface of the adapter plate 2 is detachably connected with the probe base body 3, and the other surface of the adapter plate is detachably connected with the signal processing plate 4, so that on one hand, after the three parts are processed, the sensor can be simply assembled to be generated, and on the other hand, the parts with quality problems can be conveniently overhauled or replaced. Illustratively, a threaded connection, snap-fit, or the like may be employed.
Referring to fig. 1-3, in some embodiments of the present application, the connection between the adapter plate 2 and the probe base 3 and the signal processing board 4 are all welding.
In the above embodiment, the magnetic flux sensor is not required to be detached for maintenance under the conventional circumstances, so that each part of the magnetic flux sensor can be directly welded, and the magnetic flux sensor is convenient to connect and high in strength. Moreover, the tightness of the sensor can be improved by welding, and the problem that the sensitivity of the sensor is reduced due to the fact that foreign matters such as dust and the like outside the sensor are carried out inside the sensor is avoided.
Referring to fig. 3, in some embodiments of the present application, the signal conductors 6 contained in the probe body 3 are all optical conductors, or are all electrical conductors, or are partially optical conductors, and are partially electrical conductors.
In the above embodiment, by reasonably selecting the types of the signal conductors 6, the effective connection between the magnetosensitive probe 1 and the adapter plate 2 can be performed according to actual situation requirements, and the connection compatibility and the effectiveness of signal transmission are improved. For example, a signal insulator may be disposed between the signal conductor 6 and the probe body 3 to ensure that when the signal conductor 6 is an optical conductor, no optical signal is transmitted between the optical conductor and the probe body 3, and when the signal conductor 6 is an electrical conductor, no electrical signal is transmitted between the electrical conductor and the probe body 3, so as to ensure stable and effective signal transmission therein.
Referring to fig. 1-3, in some embodiments of the present application, the circuit components on the signal processing board 4 are integrated on a side of the signal processing board 4 away from the interposer 2. Therefore, the stacking between the adapter plate 2 and the signal processing plate 4 can be prevented conveniently, and the electrodes of the two plates can be electrically connected and fixed subsequently to form an independent complete magnetic flux sensor unit.
In some embodiments of the present application, the signal conductors 6 are pads soldered to the probe body 3, and the electrodes of the magnetosensitive probe 1 are soldered to the corresponding pads, and the pads are also abutted against the corresponding electrical connection positions of the interposer 2.
In the above embodiment, the electrode of the magnetosensitive probe 1 is directly welded on the probe base 3 to form a bonding pad, and then the bonding pad is abutted against the corresponding electrical connection position of the interposer 2, so that the bonding pad can be used to form the signal conductor 6 for connecting the magnetosensitive probe 1 and the interposer 2.
In some embodiments of the present application, the probe body 3 is made of ceramic material.
In the embodiment, the characteristics of good thermal conductivity, high insulativity, high air tightness, low dielectric constant, stable dielectric constant, high temperature resistance, corrosion resistance and the like of the ceramic material can be utilized, and the overall performance of the magnetic flux sensor can be comprehensively improved.
In some embodiments of the present application, the probe substrate 3 is an elastic substrate made of a PCB substrate or a non-conductive material. When the PCB substrate is adopted, the durability of the PCB substrate can be improved, and the PCB substrate is convenient for mounting electronic components. When the elastic matrix made of the non-conductive material is adopted, the elastic matrix can be utilized to play a role in anti-collision buffer when the magnetic flux sensor collides.
In summary, the exemplary embodiment of the present application provides a magnetic flux sensor structure, in which a magneto-sensitive probe 1 is first integrated on a small probe base 3, and a signal conductor 6 for connecting an electrode of the magneto-sensitive probe 1 with an adapter plate 2 is provided on the probe base 3. Then, the adapter plate 2 is provided with a cavity structure 5 matched with the magnetosensitive probe 1 to be connected with the probe matrix 3, and the magnetosensitive probe 1 is placed in the cavity structure 5 to realize the protection function. Finally, the other surface of the adapter plate 2 is connected with the signal processing plate 4, so that the whole installation and processing process of the magnetic flux sensor structure can be realized. That is, by optimizing the configurations of the structures of the magnetic sensitive probe 1, the adapter plate 2, the signal processing board 4, the probe base 3, and the like, which constitute the magnetic flux sensor, the structural strength can be effectively enhanced without affecting the sensitivity of the sensor, so that the sensor is not damaged to some extent by knocks and falls. And the sensor is convenient to mass production and manufacture by utilizing the characteristics of simple structure and convenient installation, and the yield and the production efficiency of the sensor are easy to improve in the production process.
It will be evident to those skilled in the art that the application is not limited to the details of the foregoing illustrative embodiments, and that the present application may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (9)
1. The magnetic flux sensor structure is characterized by comprising a magnetic sensitive probe, an adapter plate, a signal processing plate, a probe matrix and at least one signal conductor accommodated in the probe matrix, wherein one end of the signal conductor is connected with an electrode of the sensor, the other end of the signal conductor is electrically connected with the adapter plate, and the signal processing plate is used for providing excitation for the magnetic sensitive probe and processing an output signal from the magnetic sensitive probe;
one surface of the adapter plate is connected with the probe base body, the other surface of the adapter plate is connected with the signal processing plate, one surface of the adapter plate, which is close to the probe base body, is provided with a cavity structure which is matched with the magnetic sensitive probe, one end of the magnetic sensitive probe is connected with the probe base body, and the other end of the magnetic sensitive probe is arranged in the cavity structure.
2. The magnetic flux sensor structure of claim 1, wherein the adapter plate is detachably connected to the probe base and the signal processing plate.
3. The magnetic flux sensor structure of claim 1, wherein the adapter plate is welded to the probe body and the signal processing plate.
4. A magnetic flux sensor construction according to claim 1, wherein the signal conductors received in the probe body are all optical conductors or all electrical conductors, or part of the signal conductors are optical conductors and the other part of the signal conductors are electrical conductors.
5. The magnetic flux sensor structure of claim 1, wherein the circuit components on the signal processing board are integrated on a side of the signal processing board away from the adapter board.
6. The magnetic flux sensor structure of claim 1, wherein the signal conductors are pads soldered to the probe body, the electrodes of the magnetosensitive probe are soldered to the corresponding pads, and the pads are further abutted to the corresponding electrical connection locations of the interposer.
7. The magnetic flux sensor construction of claim 1, wherein the adapter plate, the signal processing plate and the probe base have the same shape and size.
8. A magnetic flux sensor structure according to claim 1, wherein the probe body is made of a ceramic material.
9. A magnetic flux sensor structure according to claim 1, wherein the probe body is an elastomeric body of PCB substrate or non-conductive material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310968640.0A CN116990727A (en) | 2023-08-02 | 2023-08-02 | Magnetic flux sensor structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310968640.0A CN116990727A (en) | 2023-08-02 | 2023-08-02 | Magnetic flux sensor structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116990727A true CN116990727A (en) | 2023-11-03 |
Family
ID=88533465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310968640.0A Pending CN116990727A (en) | 2023-08-02 | 2023-08-02 | Magnetic flux sensor structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116990727A (en) |
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2023
- 2023-08-02 CN CN202310968640.0A patent/CN116990727A/en active Pending
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