CN116979924A - Impact-resistant miniaturized tuning fork type piezoelectric vibrating piece and resonator - Google Patents
Impact-resistant miniaturized tuning fork type piezoelectric vibrating piece and resonator Download PDFInfo
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- CN116979924A CN116979924A CN202310983230.3A CN202310983230A CN116979924A CN 116979924 A CN116979924 A CN 116979924A CN 202310983230 A CN202310983230 A CN 202310983230A CN 116979924 A CN116979924 A CN 116979924A
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- vibrating piece
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- groove
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- 239000000853 adhesive Substances 0.000 claims abstract description 34
- 230000001070 adhesive effect Effects 0.000 claims abstract description 33
- 230000000694 effects Effects 0.000 abstract description 8
- 230000005484 gravity Effects 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000004873 anchoring Methods 0.000 abstract description 3
- 230000007547 defect Effects 0.000 abstract description 2
- 230000007797 corrosion Effects 0.000 description 10
- 238000005260 corrosion Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
Abstract
The invention relates to the technical field of piezoelectric frequency components, in particular to an impact-resistant miniaturized tuning fork type piezoelectric vibrating piece and a resonator, which comprise the following components: a base part provided with a pair of electrodes and a pair of vibrating arms extending along the Y-axis direction; the boss is convexly arranged at the bottom of the base part; the through groove is concavely arranged at the bottom of the boss. The base is directly carried to the bottom wall of the assembly cavity through the protruding boss, on one hand, the vibrating arm is guaranteed not to contact with the bottom surface of the assembly cavity, meanwhile, the quality of the fixed end of the vibrating piece is increased, the effect of adjusting the center of gravity of the vibrating piece is achieved, and then the defect that the impact resistance performance is reduced due to the fact that the center of gravity is deviated to the free end of the vibrating piece is overcome, on the other hand, the protruding boss of the base is utilized to replace a supporting table in the assembly cavity, the effect of simplifying the hollow base is achieved, the manufacturing difficulty of the hollow base is further reduced, the contact surface between the through groove and the conductive adhesive is utilized, the anchoring effect between the through groove and the conductive adhesive is enhanced, the adhesive force is increased, and the impact resistance performance is improved.
Description
Technical Field
The invention relates to the technical field of piezoelectric frequency components, in particular to an impact-resistant miniaturized tuning fork type piezoelectric vibrating piece and a resonator.
Background
The piezoelectric frequency component is a passive electronic device which generates a high-precision oscillation frequency signal by utilizing a piezoelectric effect, has the characteristics of stability and good anti-interference performance, and is widely applied to various electronic products.
In the prior art, as shown in fig. 1-2, one end of the assembly cavity is provided with a supporting table in an upward protruding manner, and the base of the vibration plate is fixed on the supporting table, however, in order to reduce ESR (equivalent series resistance) of the miniaturized resonator, the free end of the vibration plate is designed into a weight shape, and the following disadvantages exist in the structure: the mass of the free end of the vibration piece is increased, and the gravity center of the vibration piece deviates to the free end of the vibration piece after the vibration piece is carried on the supporting table, so that the impact resistance of the vibration piece is reduced; as shown in fig. 3 to 4, in order to adjust the center of gravity of the vibration plate so that the impact resistance is improved, supporting arms are additionally provided on both sides of the vibration plate, and a supporting table corresponding to the supporting arms is additionally provided in the middle of the assembly chamber, but the following disadvantages exist in this structure: transverse direction of vibrating piece(X-axis direction)The size is increased, (1) the space is easily limited when the assembly cavity is mounted, so that the assembly difficulty is increased; (2) The support table is small in size, the appearance of the support table is not easy to control, and the mounted vibrating piece is easy to cause poor posture, so that the impact resistance is affected; (3) The requirement on the assembly position is high, and if the assembly is improper, the supporting table is easy to contact with the vibrating arms, so that the use is affected.
Disclosure of Invention
In order to overcome the drawbacks and disadvantages of the related art, a first object of the present invention is to provide an impact-resistant miniaturized tuning fork-type piezoelectric vibrating piece.
In order to achieve the above purpose, the technical scheme of the invention is as follows:
an impact-resistant miniaturized tuning fork-type piezoelectric vibrating piece, comprising:
a base part provided with a pair of electrodes and a pair of vibrating arms extending along the Y-axis direction;
the boss is convexly arranged at the bottom of the base part;
the through groove is concavely arranged at the bottom of the boss.
Preferably, the through grooves comprise a plurality of first through grooves which are arranged side by side along the Y-axis direction.
Preferably, the opening end of the first through groove is provided with a first guiding surface.
Preferably, the through grooves comprise a plurality of second through grooves which are arranged side by side along the X-axis direction.
Preferably, the opening end of the second through groove is provided with a second guiding surface.
Preferably, the through groove includes:
the first through grooves are arranged side by side along the Y-axis direction;
the second through grooves are arranged side by side along the X-axis direction and can form cross through grooves with the first through grooves.
Preferably, the opening end of the cross through groove is provided with a third guiding surface.
Preferably, the length of the boss is 15% -20% of the length of the piezoelectric vibrating piece.
A second object of the present invention is to provide a resonator.
A resonator including the impact-resistant miniaturized tuning fork-type piezoelectric vibrating piece, further comprising:
a hollow base including an assembly cavity having an opening;
the first electrode plate comprises a first inner plate body and a first outer plate body which are communicated, the first inner plate body is arranged on the bottom wall of the assembly cavity, and the first outer plate body is positioned at the outer bottom of the hollow base;
the second electrode plate comprises a second inner sheet body and a second outer sheet body which are communicated, the second inner sheet body is arranged on the bottom wall of the assembly cavity, and the second outer sheet body is positioned at the outer bottom of the hollow base;
the conductive adhesive is arranged in the assembly cavity and can cover the first inner sheet body and the second inner sheet body, and the vibrating piece is fixed in the assembly cavity through the conductive adhesive;
during assembly, the conductive adhesive is filled in the through groove, and a pair of electrodes are respectively conducted with the first electrode plate and the second electrode plate through the conductive adhesive.
Preferably, the method further comprises:
and the upper cover can cover the opening of the assembly cavity.
The invention has the beneficial effects that: base part is led toThe protruding boss is directly carried to the bottom wall of the assembly cavity, so that the vibrating arm is prevented from contacting the bottom surface of the assembly cavity, the quality of the fixed end of the vibrating piece is increased, the effect of adjusting the gravity center of the vibrating piece is achieved, the defect that the impact resistance performance is reduced due to the fact that the gravity center deviates to the free end of the vibrating piece is overcome, the boss protruding from the base is used for replacing a supporting table in the assembly cavity, the effect of simplifying a hollow base is achieved, the manufacturing difficulty of the hollow base is further reduced, the contact surface between the vibrating piece and the conductive adhesive is increased by the through groove, and the vibration plate is made to be between the vibrating piece and the conductive adhesiveAnchoringThe effect is enhanced, the adhesive force is increased, and the impact resistance is improved. Compared with the prior art, the hollow base has the advantages of simple structure and low processing cost, greatly reduces the processing difficulty of the hollow base after omitting the supporting table, has higher freedom degree of vibration piece assembly, and can avoid the problem of reduced impact resistance caused by the bad size and appearance of the supporting table or the improper assembly position of the vibration piece.
Drawings
FIG. 1 is one of the top views of a prior art resonator;
FIG. 2 is a cross-sectional view of FIG. 1;
FIG. 3 is a second top view of a prior art resonator;
FIG. 4 is a cross-sectional view of FIG. 3;
FIG. 5 is a top view of a resonator according to an embodiment of the invention;
FIG. 6 is a cross-sectional view of FIG. 5;
fig. 7 is a top view of a schematic structural diagram of a vibrating plate according to embodiment 1 of the present invention;
fig. 8 is a bottom view of a schematic structural diagram of a vibrating plate according to embodiment 1 of the present invention;
fig. 9 is a flow chart showing a process for manufacturing a tuning fork vibrating piece according to embodiment 1 of the present invention;
fig. 10 is a bottom view of a schematic structural diagram of a vibrating plate according to embodiment 2 of the present invention;
fig. 11 is a bottom view of a schematic structural diagram of a vibrating plate according to embodiment 3 of the present invention;
fig. 12 is a bottom view of a schematic structural diagram of a vibrating plate according to embodiment 4 of the present invention.
The figure shows:
1-vibrating piece, 4-base, 5-vibrating arm, 6-head weight, 7-boss, 8-through groove and 9-supporting arm;
2-a hollow base, 10-an assembly cavity, 11-a supporting table and 12-an upper cover;
3-conductive adhesive.
Detailed Description
Embodiments of the present invention will now be described in detail with reference to the drawings, which are intended to be used as references and illustrations only, and are not intended to limit the scope of the invention.
Example 1
Referring to fig. 5 to 8, in the present embodiment, an impact-resistant miniaturized tuning fork-type piezoelectric vibrating piece includes:
a base 4 provided with a pair of electrodes and a pair of vibrating arms 5 extending along the Y-axis direction; the base 4 is a fixed end of the vibrating piece 1 for fixing the vibrating piece 1 body to the hollow base 2;
a boss 7 protruding from the bottom of the base 4;
the through groove 8 is concavely arranged at the bottom of the boss 7.
In the present embodiment, the Y axis is the longitudinal direction of the vibrating piece 1, the X axis is the width direction of the vibrating piece 1, and the Z axis is the thickness direction of the vibrating piece 1.
Referring to fig. 9, the present embodiment also provides a method for manufacturing a tuning-fork type piezoelectric vibrating piece, including:
(STEP 1) forming through groove 8:
p1, cleaning a wafer to remove dirt and foreign matters attached to the surface of the wafer so as to improve the photoetching quality;
p2: spraying corrosion-resistant films, wherein the corrosion-resistant films are respectively sprayed on the two main surfaces (+Z surface, -Z surface) of the wafer, and the preferable corrosion-resistant films are Au and Cr metal films, and the sprayed thickness is respectively
P3: coating photoresist, namely coating the photoresist on the surface of the corrosion-resistant film, wherein the photoresist is positive photoresist, and the thickness of the coating is 1 mu m;
p4 to P5: exposing and developing, namely transferring patterns of the boss 7 and the through groove 8 to the photoresist, removing the photoresist of the exposed part and exposing the corrosion resistant film;
p6: etching the corrosion-resistant film, namely removing the exposed corrosion-resistant film in the P5 by using a metal etching solution, and removing the corrosion-resistant film of the crystal to be etched in the P7;
p7: forming the through groove 8 and the boss 7, and etching the crystal in buffer acid (BOE) to form the through groove 8 and the boss 7 on the base 4 of the vibrating piece 1;
p8 to P9: and removing the photoresistance and the corrosion-resistant film on the surface of the crystal.
(STEP 2) outline shaping: the STEP2 and STEP1 are different in process from each other in that P12 to P14, and the external corrosion-resistant film of the vibration plate 1 is formed by P12 to P14, and the remaining STEPs are the same as those of STEP1, and will not be described here.
(STEP 3) vibrating arm groove forming: in this embodiment, grooves are formed on two main surfaces (+z-plane, -Z-plane) of the vibrating arm 5 along the Y-axis direction respectively, so as to improve the electric field efficiency and reduce ESR (not shown), and a pair of electrodes are respectively conducted with the first inner sheet and the second inner sheet through the conductive adhesive 3; the STEP3 is different from the STEP1 in the process of forming the vibrating arm grooves by using P17 to P21, and the rest STEPs are the same as those of the STEP1, and are not described here.
(STEP 4) electrode shaping: the STEP4 is different from the STEP1 in that P26 to P28, and P26 to P28 are used to form a pair of electrodes (not shown), and finally, the STEPs enter the post-STEP, and the rest STEPs are the same as the STEP of STEP1, and are not described here.
In the present embodiment, the vibrating arm 5 is provided with a head weight 6 at an end far from the base 4, and the head weight 6 is used for reducing ESR (equivalent series resistance) of the miniaturized resonator.
Preferably, the through grooves 8 include a plurality of first through grooves arranged side by side along the Y-axis direction.
In this embodiment, two first through grooves are provided, the two first through grooves are opened on the base 4 along the length direction of the vibrating arm 5, two sides of the first through grooves respectively penetrate through the base 4, and the bottom of the first through grooves is provided with an opening towards the bottom wall of the hollow base 2.
Preferably, the opening end of the first through groove is provided with a first guiding surface.
In this embodiment, the first guiding surface may be, but not limited to, an inclined surface or an arc surface, when the vibrating piece 1 is assembled, the conductive adhesive 3 is dispensed on the first inner sheet body and the second inner sheet body of the bottom wall of the hollow base 2, and then the boss 7 with the first through groove is inserted in a direction close to the conductive adhesive 3, and the conductive adhesive 3 is guided into the first through groove by using the first guiding surface, so as to improve the smoothness of the conductive adhesive 3 entering the first through groove.
Preferably, the length of the boss 7 is 15% -20% of the length of the piezoelectric vibrating piece 1.
In the present embodiment, taking the vibration plate 1 with 2012 size as an example, the length of the boss 7 along the Y-axis direction is 240-260 μm, and the preferred length of the boss is 250 μm; the length of the first through groove in the Y-axis direction is 15 to 60 μm, the depth of the first through groove is 40 to 60 μm in this embodiment, and the height of the boss 7 is 50 μm in this embodiment.
The present embodiment also provides a resonator including the impact-resistant miniaturized tuning-fork-type piezoelectric vibrating piece, further including:
a hollow base 2 comprising an assembly cavity 10 with an opening;
a first electrode plate (not shown in the figure) including a first inner conductive sheet body and a first outer conductive sheet body, wherein the first inner conductive sheet body is disposed on the bottom wall of the assembly cavity 10, and the first outer conductive sheet body is disposed at the outer bottom of the hollow base 2;
a second electrode plate (not shown in the figure) including a conductive second inner sheet body and a second outer sheet body, wherein the second inner sheet body is disposed on the bottom wall of the assembly cavity 10, and the second outer sheet body is disposed at the outer bottom of the hollow base 2;
the conductive adhesive 3 is arranged in the assembly cavity 10 and can cover the first inner sheet body and the second inner sheet body, and the vibrating piece 1 is fixed in the assembly cavity 10 through the conductive adhesive 3;
during assembly, the conductive adhesive 3 is filled in the through groove 8, and a pair of electrodes are respectively conducted with the first electrode plate and the second electrode plate through the conductive adhesive 3.
In this embodiment, the hollow base 2 includes a bottom plate and a ring connected to each other, the ring and the bottom plate form a fitting cavity 10 for fitting the vibration piece 1, compared with the prior art (as shown in fig. 1-2), the hollow base 2 of this embodiment is simplified in structure and easy to manufacture, and no support stand 11 is required to be processed on the inner bottom wall of the fitting cavity 10, so that the problem of reduced impact resistance caused by the size and shape of the support stand 11, the poor appearance (the support arm 9 is obliquely mounted on the support stand 11, as shown in fig. 4), or the improper fitting position of the vibration piece 1 (the interference between the support arm 9 and the support stand 11 in the width direction is easy to occur, as shown in fig. 3) can be avoided;
in this embodiment, the first inner sheet body is conducted with the first outer sheet body, the second inner sheet body is conducted with the second outer sheet body, one electrode on the vibrating piece 1 is conducted with the first inner sheet body through the conductive adhesive 3, and the other electrode on the vibrating piece 1 is conducted with the second inner sheet body through the conductive adhesive 3. After the conductive adhesive 3 is in contact fit with the first through groove, fixing is achieved through high-temperature curing, and the time of high-temperature curing of the conductive adhesive 3 in the embodiment is 2 hours, and the temperature is preferably 250 ℃.
Preferably, the method further comprises:
an upper cover 12 capable of closing the opening of the assembly chamber 10.
In this embodiment, in the high vacuum state, the upper cover 12 is welded and fixed to the open end of the hollow base 2 by resistance welding, so as to form a high vacuum cavity required for normal resonance of the vibrating piece, and further complete the assembly of the vibrating piece 1 and the resonator.
Example 2
This embodiment differs from embodiment 1 in that:
referring to fig. 10, the first through groove of the present embodiment is wavy, and the contact area between the first through groove and the conductive adhesive 3 is further increased by using the wavy groove wall without increasing the length, width and height of the base 4, so that the anchoring effect is further improved, the adhesion between the vibrating reed 1 and the conductive adhesive 3 is stronger, and the impact resistance is further improved by 30-40% compared with the prior art.
The rest of this embodiment is the same as embodiment 1, and will not be described here again.
Example 3
This embodiment differs from embodiment 1 in that:
referring to fig. 11, the through slots 8 include a plurality of second through slots arranged side by side along the X-axis direction.
In this embodiment, four second through grooves are provided, the four second through grooves are opened on the base 4 along the width direction of the vibrating arm 5, two ends of the second through grooves respectively penetrate through the base 4, and the bottom of the second through grooves is provided with an opening towards the bottom wall of the hollow base 2.
Preferably, the opening end of the second through groove is provided with a second guiding surface. And the conductive adhesive 3 is led into the second through groove by using the second leading-in surface, so that the smoothness of the conductive adhesive 3 entering the second through groove is improved.
The rest of this embodiment is the same as embodiment 1, and will not be described here again.
Example 4
This embodiment differs from embodiment 1 in that:
referring to fig. 12, the through slot 8 includes:
the first through grooves are arranged side by side along the Y-axis direction;
the second through grooves are arranged side by side along the X-axis direction and can form cross through grooves with the first through grooves.
In this embodiment, the first through grooves and the second through grooves are mutually perpendicular, the first through grooves are provided with two first through grooves, the two first through grooves are formed in the base 4 along the length direction of the vibrating arm 5, two sides of the first through grooves respectively penetrate through the base 4, the bottom of the first through grooves are provided with openings towards the bottom wall of the hollow base 2, the second through grooves are provided with four second through grooves, the four second through grooves are formed in the base 4 along the width direction of the vibrating arm 5, two ends of the second through grooves respectively penetrate through the base 4, and the bottom of the second through grooves are provided with openings towards the bottom wall of the hollow base 2, so that cross through grooves are formed.
Preferably, the opening end of the cross through groove is provided with a third guiding surface. The third guiding surface is used for guiding the conductive adhesive 3 into the cross through groove, so that the smoothness of the conductive adhesive 3 entering the cross through groove is improved
The rest of this embodiment is the same as embodiment 1, and will not be described here again.
The above disclosure is illustrative of the preferred embodiments of the present invention and should not be construed as limiting the scope of the invention, which is defined by the appended claims.
Claims (10)
1. An impact-resistant miniaturized tuning fork-type piezoelectric vibrating piece, characterized by comprising:
a base part provided with a pair of electrodes and a pair of vibrating arms extending along the Y-axis direction;
the boss is convexly arranged at the bottom of the base part;
the through groove is concavely arranged at the bottom of the boss.
2. The impact-resistant miniaturized tuning fork-type piezoelectric vibrating piece as claimed in claim 1, wherein said through grooves include a plurality of first through grooves arranged side by side in the Y-axis direction.
3. The impact-resistant miniaturized tuning fork-type piezoelectric vibrating piece as claimed in claim 2, wherein the opening end of the first through groove is provided with a first lead-in surface.
4. The impact-resistant miniaturized tuning fork-type piezoelectric vibrating piece as claimed in claim 1, wherein said through grooves comprise a plurality of second through grooves arranged side by side in the X-axis direction.
5. The impact-resistant miniaturized tuning fork-type piezoelectric vibrating piece as set forth in claim 4, wherein the opening end of said second through groove is provided with a second lead-in surface.
6. The impact-resistant miniaturized tuning fork-type piezoelectric vibrating piece as set forth in claim 1, wherein said through groove comprises:
the first through grooves are arranged side by side along the Y-axis direction;
the second through grooves are arranged side by side along the X-axis direction and can form cross through grooves with the first through grooves.
7. The impact-resistant miniaturized tuning fork-type piezoelectric vibrating piece as set forth in claim 6, wherein the opening end of the cross-shaped through groove is provided with a third lead-in surface.
8. The impact-resistant miniaturized tuning fork-type piezoelectric vibrating piece as claimed in claim 1, wherein the length of the boss is 15% -20% of the length of the piezoelectric vibrating piece.
9. A resonator including the impact-resistant miniaturized tuning fork-type piezoelectric resonator element according to any one of claims 1 to 8, characterized by further comprising:
a hollow base including an assembly cavity having an opening;
the first electrode plate comprises a first inner plate body and a first outer plate body which are communicated, the first inner plate body is arranged on the bottom wall of the assembly cavity, and the first outer plate body is positioned at the outer bottom of the hollow base;
the second electrode plate comprises a second inner sheet body and a second outer sheet body which are communicated, the second inner sheet body is arranged on the bottom wall of the assembly cavity, and the second outer sheet body is positioned at the outer bottom of the hollow base;
the conductive adhesive is arranged in the assembly cavity and can cover the first inner sheet body and the second inner sheet body, and the vibrating piece is fixed in the assembly cavity through the conductive adhesive;
during assembly, the conductive adhesive is filled in the through groove, and a pair of electrodes are respectively conducted with the first electrode plate and the second electrode plate through the conductive adhesive.
10. A resonator according to claim 9, further comprising:
and the upper cover can cover the opening of the assembly cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310983230.3A CN116979924A (en) | 2023-08-04 | 2023-08-04 | Impact-resistant miniaturized tuning fork type piezoelectric vibrating piece and resonator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310983230.3A CN116979924A (en) | 2023-08-04 | 2023-08-04 | Impact-resistant miniaturized tuning fork type piezoelectric vibrating piece and resonator |
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| Publication Number | Publication Date |
|---|---|
| CN116979924A true CN116979924A (en) | 2023-10-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310983230.3A Pending CN116979924A (en) | 2023-08-04 | 2023-08-04 | Impact-resistant miniaturized tuning fork type piezoelectric vibrating piece and resonator |
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| CN (1) | CN116979924A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3697766A (en) * | 1970-02-27 | 1972-10-10 | Junghans Gmbh Geb | Piezoelectric oscillator in the form of a tuning fork |
| JP2003152499A (en) * | 2001-11-19 | 2003-05-23 | Seiko Epson Corp | Piezoelectric device and manufacturing method of piezoelectric vibrating piece thereof, cellular telephone employing piezoelectric device and electronic equipment employing piezoelectric device |
| JP2004297555A (en) * | 2003-03-27 | 2004-10-21 | Seiko Epson Corp | Piezoelectric device and method for manufacturing piezoelectric oscillation piece |
| JP2004297580A (en) * | 2003-03-27 | 2004-10-21 | Seiko Epson Corp | Tuning fork piezoelectric oscillating piece and tuning fork piezoelectric vibrator |
| JP2004320297A (en) * | 2003-04-15 | 2004-11-11 | Daishinku Corp | Piezoelectric vibration device |
| CN213846635U (en) * | 2020-12-21 | 2021-07-30 | 泰晶科技股份有限公司 | Micro tuning fork crystal wafer |
-
2023
- 2023-08-04 CN CN202310983230.3A patent/CN116979924A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3697766A (en) * | 1970-02-27 | 1972-10-10 | Junghans Gmbh Geb | Piezoelectric oscillator in the form of a tuning fork |
| JP2003152499A (en) * | 2001-11-19 | 2003-05-23 | Seiko Epson Corp | Piezoelectric device and manufacturing method of piezoelectric vibrating piece thereof, cellular telephone employing piezoelectric device and electronic equipment employing piezoelectric device |
| JP2004297555A (en) * | 2003-03-27 | 2004-10-21 | Seiko Epson Corp | Piezoelectric device and method for manufacturing piezoelectric oscillation piece |
| JP2004297580A (en) * | 2003-03-27 | 2004-10-21 | Seiko Epson Corp | Tuning fork piezoelectric oscillating piece and tuning fork piezoelectric vibrator |
| JP2004320297A (en) * | 2003-04-15 | 2004-11-11 | Daishinku Corp | Piezoelectric vibration device |
| CN213846635U (en) * | 2020-12-21 | 2021-07-30 | 泰晶科技股份有限公司 | Micro tuning fork crystal wafer |
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