CN116978650A - Thermal tripping protection piezoresistor - Google Patents
Thermal tripping protection piezoresistor Download PDFInfo
- Publication number
- CN116978650A CN116978650A CN202311045869.3A CN202311045869A CN116978650A CN 116978650 A CN116978650 A CN 116978650A CN 202311045869 A CN202311045869 A CN 202311045869A CN 116978650 A CN116978650 A CN 116978650A
- Authority
- CN
- China
- Prior art keywords
- thermal
- temperature alloy
- thermal tripping
- electrode
- piezoresistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 229910045601 alloy Inorganic materials 0.000 claims abstract description 75
- 239000000956 alloy Substances 0.000 claims abstract description 75
- 239000004033 plastic Substances 0.000 claims abstract description 45
- 239000003822 epoxy resin Substances 0.000 claims abstract description 29
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 29
- 238000002844 melting Methods 0.000 claims abstract description 9
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 7
- 230000008018 melting Effects 0.000 claims abstract description 6
- 238000000605 extraction Methods 0.000 claims description 32
- 229910000601 superalloy Inorganic materials 0.000 claims description 4
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 150000002894 organic compounds Chemical class 0.000 claims description 2
- 229920002050 silicone resin Polymers 0.000 claims description 2
- 230000001419 dependent effect Effects 0.000 abstract description 20
- 238000009434 installation Methods 0.000 abstract description 3
- 238000005538 encapsulation Methods 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 230000002159 abnormal effect Effects 0.000 description 4
- 229920000877 Melamine resin Polymers 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008033 biological extinction Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229910000743 fusible alloy Inorganic materials 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000001012 protector Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/12—Overvoltage protection resistors
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
- H02H5/00—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection
- H02H5/04—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection responsive to abnormal temperature
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
- H02H9/00—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection
- H02H9/04—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage
Abstract
The invention discloses a thermal tripping protection piezoresistor, wherein a resin encapsulation piezoresistor and a thermal tripping device in an insulating plastic shell are electrically connected in series, so as to solve the problems of slow tripping, large volume and narrow tripping current range: the thermal tripping device is formed by electrically connecting two electrodes with a distance of more than 2mm and a high-temperature alloy with a middle melting point of more than 180 ℃, a tripping gap of more than 2mm is arranged between the high-temperature alloy containing an arc extinguishing agent and the connecting point of the two electrodes, the piezoresistor and the thermal tripping device form a compact assembly through a common electrode, the high-temperature alloy with gaps left at the periphery is close to the piezoresistor body and is not stressed, and the plastic shell is sealed by a plastic cover plate and epoxy resin. The invention has the advantages that: the voltage dependent resistor is connected in series with the circuit to provide overvoltage protection under normal conditions, and is disconnected from the circuit to prevent fire when the voltage dependent resistor abnormally heats or is in short circuit; the structure is compact, the cost is low, the volume is small, the large current and the small current can be tripped rapidly, and the tripping is not influenced by the installation position.
Description
Technical Field
The invention discloses a piezoresistor, in particular to a thermal tripping protection piezoresistor.
Background
The varistor is used as an overvoltage protection element in series in the circuit. When abnormal overvoltage occurs, the voltage dependent resistor limits the increase of the voltage amplitude and absorbs the overvoltage energy due to the nonlinear characteristic, so as to play a role in protection. However, when the voltage dependent resistor is deteriorated and the power frequency overvoltage exceeds the load capacity of the voltage dependent resistor, the voltage dependent resistor can generate abnormal heat or short circuit, and further the voltage dependent resistor can burn out open fire and overflow, so that the whole equipment is burnt out and scrapped if the voltage dependent resistor is light, and the overflow of the accident can cause further serious consequences.
In order to solve the problem, the conventional method is to connect the piezoresistor and the thermal tripping device in series, and the piezoresistor is connected in the circuit to play a role of overvoltage protection under normal conditions, when the piezoresistor is deteriorated and the power frequency overvoltage exceeds the load capacity of the piezoresistor, the abnormal heating of the piezoresistor occurs, and the heat of the piezoresistor is conducted to the thermal tripping device to melt the fusible alloy at the tripping point, so that the piezoresistor is disconnected from the circuit to prevent ignition. Surge Protection Devices (SPDs) and thermal protection varistors (TMOVs) are the primary products of the prior art that employ this type of technology.
In the technology, the heating of the piezoresistor is conducted to the tripping point through the electrode, the tripping point is welded and connected by adopting low-temperature soldering tin/low-melting point alloy, the low-temperature soldering tin/low-melting point alloy is melted when the piezoresistor abnormally heats or is in short circuit, the gap between one electrode of the piezoresistor and one lead-out electrode of the surge suppressor, which is tightly attached to the welding tripping point, is small, and the two electrodes are forced to be separated by the pulling force or the pressure of mechanical mechanisms such as springs, so that the mechanism is complex, large in volume, unreliable and high in cost; the tripping point low-temperature soldering tin/low-melting point alloy is influenced by mechanical tension on the pressure sensitive resistor abnormality, is easily influenced by external temperature disturbance or overvoltage in a specification tolerance range, and is easily subjected to false tripping under the condition that the pressure sensitive resistor is not overloaded/not degraded, so that the protective effect of the pressure sensitive resistor is lost in advance; because the distance from heat conduction to the tripping point is long, the surface of the pressure sensitive electrode is large in heat dissipation and the time delay of the tripping action of the mechanical mechanism is large, so that the tripping action is slower when the piezoresistor is overloaded or fails; because the distance from heat conduction to the tripping point is long, the large heat dissipation speed of the surface of the pressure sensitive electrode is high, the probability that the small power frequency short circuit current is not tripped is high, and the larger current can catch fire directly before tripping; the outer shell of the SPD is not sealed, and the communication air is easy to catch fire and overflow open fire.
The thermal protection varistor (TMOV) is a thermal trip device, which is a thermal fuse connected in series with the varistor, and the thermal fuse and the varistor body are tightly attached to obtain good thermal coupling. The temperature fuse is provided with a shell or is arranged in an insulating way with the piezoresistor, and the temperature fuse and the piezoresistor are stacked and combined into an outer package, so that the volume is large; the temperature fuse is generally made of low-temperature alloy, and the temperature fuse is easily fused by mistake when in circuit welding, overvoltage in specification or other thermal disturbance, so that the piezoresistor is separated from the circuit in advance to lose the due overvoltage protection effect; the temperature fuse generally adopts low-temperature alloy, has high cost, and has a shell to enable abnormal heating of the conduction piezoresistor to be slow, so that the tripping speed is slow; the organic surfactant fills the shell to enable the periphery of the low-temperature alloy to have no gap, the low-temperature alloy has large breaking resistance and slow tripping, and the low-current tripping has sufficient time, but the high-current tripping is not time to trip and fires before tripping, so that the tripping current range is small.
In order to solve the problem that the Surge Protector (SPD) and the thermal protection varistor (TMOV) are prone to false tripping, the applicant's prior patent application (application publication No. CN 116052971A) proposes a solution in which medium and high temperature solder is used as the functional unit of the thermal tripping device, and the thermal tripping device further comprises a housing and two electrodes. The problem of the mistake tripping when having solved circuit soldering tin, but when actual tripping, trip gear's shell has restricted the heat transfer and the trip after the soldering tin melts, and the state of taking off can change when different installation states, has the problem that trip speed is slow and heavy current tripping is difficult equally, and the existence of shell also can increase the complexity, cost and the packaging efficiency of device.
In summary, the prior art has the problems of large volume, slow trip and narrow trip current range.
Disclosure of Invention
In order to overcome the defects of large volume, slow tripping, narrow tripping current range and the like of the thermal tripping protection piezoresistor in the prior art, the invention provides the thermal tripping protection piezoresistor, wherein the thermal tripping device which is in linkage with the piezoresistor body is arranged, the structure is simpler, and the reliability of the tripping effect is improved.
The technical scheme adopted for solving the technical problems is as follows: the voltage dependent resistor and the thermal tripping device are electrically connected in series in the insulating plastic shell, the voltage dependent resistor is an epoxy resin or silicone resin encapsulated voltage dependent resistor, the voltage dependent resistor comprises a voltage dependent outgoing electrode, a voltage dependent resistor body and a common electrode which are electrically connected in sequence, the thermal tripping device comprises the common electrode, a high-temperature alloy and the thermal tripping outgoing electrode which are electrically connected in sequence, the melting point of the high-temperature alloy is higher than 180 ℃, the connection point of the common electrode and the high-temperature alloy and the connection point of the thermal tripping outgoing electrode and the high-temperature alloy are in a tripping gap of more than 2mm, the distance between the common electrode and the thermal tripping outgoing electrode is more than 2mm, and the plastic shell is a shell with one end opening; the piezoresistor and the thermal tripping device form an up-down tiling assembly through a common electrode, the high-temperature alloy is close to the piezoresistor body, and the high-temperature alloy is not stressed; the plastic shell is sealed by a plastic cover plate and epoxy resin, gaps are reserved on the periphery of the high-temperature alloy, and the pressure-sensitive extraction electrode and the thermal tripping extraction electrode extend out of the plastic cover plate and are sealed by the epoxy resin.
The technical scheme adopted by the invention for solving the technical problems further comprises the following steps:
the high-temperature alloy adopts a high-temperature alloy with the fusing temperature of 180-320 ℃.
The high-temperature alloy is a round wire.
The superalloy outer and/or inner core comprises an arc suppressing agent selected from organic compounds capable of producing gas at high temperatures.
The joint of the common electrode and the high-temperature alloy and the joint of the thermal trip leading-out electrode and the high-temperature alloy are not smaller than 3mm trip clearance, and the distance between the common electrode and the thermal trip leading-out electrode is not smaller than 3mm.
The common electrode selectively extends or does not extend out of the plastic cover plate and the epoxy resin.
And a second thermal tripping device which is the same as the thermal tripping device is arranged at other parts close to the piezoresistor body and consists of high-temperature alloy and two electrodes extending out of the plastic cover plate and the epoxy resin, and the second thermal tripping device is close to the piezoresistor body to form thermal coupling.
The second thermal tripping device is arranged at other parts close to the piezoresistor body, has the same structure as the thermal tripping device and consists of a thermal tripping electrode, a high-temperature alloy and a second thermal tripping lead-out electrode which are electrically connected in sequence, the temperature alloy of the second thermal tripping device is arranged at the lead part of the piezoresistor close to the piezoresistor body, the second thermal tripping device and the thermal tripping device share the thermal tripping electrode to be electrically connected, the second thermal tripping device, the thermal tripping device and the piezoresistor are flatly paved in a plane to form a compact assembly, and the compact assembly is filled into a plastic cover plate and an epoxy resin sealed plastic shell, and a gap is reserved at the periphery of the high-temperature alloy of the second thermal tripping device and is not stressed; the pressure-sensitive extraction electrode, the thermal trip extraction electrode and the second thermal trip extraction electrode extend out of the plastic cover plate and the epoxy resin, and the common electrode extends out of the plastic cover plate and the epoxy resin or does not extend out of the plastic cover plate and the epoxy resin.
The invention is composed of high-temperature alloy and two electrodes, which is simple and small, the piezoresistor and the high-temperature alloy are tiled on a plane and are installed close to each other, thus reducing the volume; the high-temperature alloy is adopted to connect the common electrode and the full tripping gap between the common electrode and the thermal tripping electrode, so that mechanical stress is not needed for tripping, a large amount of gas is generated by an arc extinguishing agent contained in the high-temperature alloy to accelerate arc extinction when the high-temperature alloy is melted and tripped, the molten high-temperature alloy can be contained in gaps around the unstressed high-temperature alloy to prevent the tripping from being subjected to resistance, the sealed plastic shell with gaps is insulated from oxygen, the piezoresistor is enabled to be burnt in a limited way to provide heat for tripping, the naked flame is not allowed to leak, the quick tripping is realized before the naked flame leaks, and the reliable tripping can be realized when the current is large and small.
The beneficial effects of the invention are as follows: the thermal tripping protection piezoresistor provided by the invention has the advantages of simple and compact structure, small volume, capability of bearing welding high temperature during assembly, overvoltage surge pulse impact within a specification range and transient overvoltage condition tolerated by the piezoresistor without false tripping, quick tripping, reliable tripping of large and small currents, low cost and high assembly efficiency.
Compared with the prior patent application of the applicant, the tripping device has the advantages that the structure is simpler, the cost is saved, the assembly efficiency is improved, the limit of the shell on the molten solder is eliminated, the tripping state change in different installation states is eliminated, and the reliability of the tripping effect is improved.
The invention will be further described with reference to the drawings and detailed description.
Drawings
Fig. 1 is a schematic diagram of an exploded structure according to an embodiment of the invention.
Fig. 2 is a schematic view illustrating an exploded view of an embodiment of the present invention.
FIG. 3 is a diagram illustrating a structure of a decomposition state according to an embodiment of the present invention.
Fig. 4 is a schematic view illustrating an exploded view of a second embodiment of the present invention.
Fig. 5 is a schematic diagram illustrating a three-exploded-state structure according to an embodiment of the present invention.
Fig. 6 is a schematic view illustrating an exploded view of a third embodiment of the present invention.
In the figure, a 1-plastic shell, a 2-plastic cover plate, 3-epoxy resin, a 4-piezoresistor body, 5-superalloy, a 6-pressure-sensitive extraction electrode, a 7-common electrode, an 8-thermal trip extraction electrode, 9-superalloy and a 10-second thermal trip extraction electrode.
Detailed Description
This example is a preferred embodiment of the present invention, and other principles and basic structures are the same as or similar to those of this example, and all fall within the scope of the present invention.
For further illustration of the various embodiments, the invention is provided with the accompanying drawings. The accompanying drawings, which are incorporated in and constitute a part of this disclosure, illustrate embodiments and together with the description, serve to explain the principles of the embodiments. With reference to these matters, one of ordinary skill in the art will understand other possible embodiments and advantages of the present invention. The components in the figures are not drawn to scale and like reference numerals are generally used to designate like components.
Embodiment one: as shown in fig. 1-2, in the embodiment, an epoxy resin encapsulated varistor in an insulating plastic housing is electrically connected in series with a thermal tripping device, the varistor comprises a pressure-sensitive lead-out electrode 6, a varistor body 4 and a common electrode 7 which are electrically connected in sequence, the thermal tripping device comprises the common electrode 7, a high-temperature alloy 5 and a thermal tripping lead-out electrode 8 which are electrically connected in sequence, the high-temperature alloy 5 is a circular wire containing a melamine arc extinguishing agent core, the melting temperature of the high-temperature alloy 5 is 220 ℃, two connection points of the common electrode 7 and the thermal tripping lead-out electrode 8 and the high-temperature alloy 5 are 3.5mm tripping gaps, the distance between the common electrode 7 and the thermal tripping lead-out electrode 8 is 3.5mm, and the plastic housing 1 is a shell with one end opening; the piezoresistor and the thermal tripping device form an up-down tiling assembly through a common electrode 7, the high-temperature alloy 5 is close to the piezoresistor body 4, and the high-temperature alloy 5 is not stressed; the plastic shell 1 is sealed by a plastic cover plate 2 and an epoxy resin 3, a gap is reserved at the periphery of the high-temperature alloy 5, the pressure-sensitive extraction electrode 6 and the thermal trip extraction electrode 8 extend out of the plastic cover plate 2 and the epoxy resin 3, and the common electrode 7 does not extend out of the plastic cover plate 2 and the epoxy resin 3.
In the application process, the voltage-sensitive extraction electrode 6 and the thermal trip extraction electrode 8 connect the voltage dependent resistor in parallel to a circuit to play an overvoltage protection role, and when the voltage dependent resistor abnormally heats or is in short circuit, the trip device trips before open fire overflows to enable the voltage dependent resistor to be separated from the circuit, so that fire faults are eliminated.
Embodiment two: as shown in fig. 3 to 4, in the embodiment, an epoxy resin encapsulated varistor in an insulating plastic housing is electrically connected in series with a thermal tripping device, the varistor comprises a voltage-sensitive lead-out electrode 6, a varistor body 4 and a common electrode 7 which are electrically connected in sequence, the thermal tripping device comprises the common electrode 7, a high-temperature alloy 5 and the thermal tripping lead-out electrode 8 which are electrically connected in sequence, the high-temperature alloy 5 is a circular wire containing a melamine arc extinguishing agent core, the melting temperature of the high-temperature alloy 5 is 220 ℃, two connection points of the common electrode 7 and the thermal tripping lead-out electrode 8 and the high-temperature alloy 5 are 3.5mm tripping gaps, the distance between the common electrode 7 and the thermal tripping lead-out electrode 8 is 3.5mm, and the plastic housing 1 is a shell with one end opening; the piezoresistor and the thermal tripping device form an up-down tiling assembly through a common electrode 7, the high-temperature alloy 5 is close to the piezoresistor body 4, and the high-temperature alloy 5 is not stressed; the plastic shell 1 is sealed by a plastic cover plate 2 and epoxy resin 3, a gap is reserved at the periphery of the high-temperature alloy 5, and the pressure-sensitive extraction electrode 6, the common electrode 7 and the thermal trip extraction electrode 8 extend out of the plastic cover plate 2 and the epoxy resin 3.
In the application process, the voltage-sensitive extraction electrode 6 and the thermal trip extraction electrode 8 connect the voltage dependent resistor in parallel to a circuit to play an overvoltage protection role, when the voltage dependent resistor abnormally heats or is in short circuit, the tripping device trips before open fire overflows to enable the voltage dependent resistor to be separated from the circuit, fire faults are eliminated, and the common electrode 7 and the thermal trip extraction electrode 8 serve as signal sampling electrodes in a tripping state during tripping.
Embodiment III: as shown in fig. 5 to 6, in the embodiment, an epoxy resin in an insulating plastic housing encapsulates a varistor, a thermal tripping device and a second thermal tripping device, which are electrically connected in series, the varistor comprises a voltage-sensitive outgoing electrode 6, a varistor body 4 and a common electrode 7 which are electrically connected in sequence, the thermal tripping device comprises the common electrode 7, a high-temperature alloy 5 and a thermal tripping outgoing electrode 8 which are electrically connected in sequence, the second thermal tripping device comprises the thermal tripping outgoing electrode 8, the high-temperature alloy 9 and the second thermal tripping outgoing electrode 10 which are electrically connected in sequence, the high-temperature alloy 5 and the high-temperature alloy 9 are circular lines containing melamine arc extinguishing agent cores, the melting temperature of the high-temperature alloy 5 and the high-temperature alloy 9 is 220 ℃, the two connection points of the common electrode 7 and the thermal tripping outgoing electrode 8 and the high-temperature alloy 5 are 3.5mm tripping gaps, the distance between the common electrode 7 and the thermal tripping outgoing electrode 8 is 3.5mm, the two connection points of the thermal tripping outgoing electrode 8, the second thermal tripping outgoing electrode 10 and the high-temperature alloy 9 are 3.5mm tripping gaps, and one end of the thermal tripping shell is 1.5 mm; the piezoresistor, the thermal tripping device and the second thermal tripping device form an up-down tiling assembly through a common electrode 7 and a thermal tripping lead-out electrode 8, the high-temperature alloy 5 and the high-temperature alloy 9 are close to the piezoresistor body 4, and the high-temperature alloy 5 and the high-temperature alloy 9 are not stressed; the plastic shell 1 is sealed by a plastic cover plate 2 and epoxy resin 3, gaps are reserved on the peripheries of the high-temperature alloy 5 and the high-temperature alloy 9, the pressure-sensitive extraction electrode 6, the thermal trip extraction electrode 8 and the second thermal trip extraction electrode extend out of the plastic cover plate 2 and the epoxy resin 3, and the common electrode 7 does not extend out of the plastic cover plate 2 and the epoxy resin 3.
In the application process, the voltage-sensitive extraction electrode 6 and the thermal trip extraction electrode 8 are connected in parallel to the circuit to play an overvoltage protection role, when the piezoresistor abnormally heats or is in short circuit, the tripping device trips before open fire overflows to enable the piezoresistor to be separated from the circuit, fire faults are eliminated, the second thermal tripping device fuses with the thermal tripping device at the same time, and the thermal trip extraction electrode 8 and the second thermal trip extraction electrode serve as indication signal ends of a thermal trip state.
While the invention has been particularly shown and described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A thermal trip protection varistor, the varistor and thermal trip device in the insulating plastic shell connect electrically in series, characterized by: the varistor is an epoxy resin or silicone resin encapsulated varistor and comprises a pressure-sensitive extraction electrode (6), a varistor body (4) and a common electrode (7) which are electrically connected in sequence, the thermal tripping device comprises the common electrode (7), a high-temperature alloy (5) and a thermal tripping extraction electrode (8) which are electrically connected in sequence, the melting point of the high-temperature alloy (5) is more than 180 ℃, the connection point of the common electrode (7) and the high-temperature alloy (5) and the connection point of the thermal tripping extraction electrode (8) and the high-temperature alloy (5) are release gaps of more than 2mm, the distance between the common electrode (7) and the thermal tripping extraction electrode (8) is more than 2mm, and the plastic shell (1) is a shell with one end open; the piezoresistor and the thermal tripping device form a compact assembly through a common electrode (7), the high-temperature alloy (5) is close to the piezoresistor body (4), and the high-temperature alloy (5) is not stressed; the plastic shell (1) is sealed, gaps are reserved on the periphery of the high-temperature alloy (5), and the pressure-sensitive extraction electrode (6) and the thermal tripping extraction electrode (8) extend out of the plastic cover plate (2) and the epoxy resin (3).
2. The thermal trip protection varistor of claim 1, wherein: the high-temperature alloy (5) adopts a high-temperature alloy with the fusing temperature of 180-320 ℃.
3. The thermal trip protection varistor of claim 1, wherein: the high-temperature alloy (5) is a round wire rod.
4. The thermal trip protection varistor of claim 1, wherein: the exterior and/or the interior core of the superalloy (5) comprises an arc-extinguishing agent selected from organic compounds capable of producing gas at high temperatures.
5. The thermal trip protection varistor of claim 1, wherein: the piezoresistor and the thermal tripping device are tiled and combined on a plane.
6. The thermal trip protection varistor of claim 1, wherein: the thermal tripping device is arranged at the lead part of the piezoresistor.
7. The thermal trip protection varistor of claim 1, wherein: the distance between the common electrode (7) and the thermal trip leading-out electrode (8) is not less than 3mm.
8. The thermal trip protection varistor of claim 1, wherein: the common electrode (7) selectively extends or does not extend out of the plastic cover plate (2) and the epoxy resin (3).
9. The thermal trip protection varistor of claim 1, wherein: the other parts close to the piezoresistor body (4) are provided with a second thermal tripping device which is the same as the thermal tripping device and consists of a high-temperature alloy (10) and two electrodes which extend out of the plastic cover plate (2) and the epoxy resin (3), and the second thermal tripping device is close to the piezoresistor body (4) to form thermal coupling.
10. The thermal trip protection varistor of claim 9, wherein: the voltage-sensitive resistor is characterized in that a second thermal tripping device is arranged at other parts close to the voltage-sensitive resistor body (4), the second thermal tripping device has the same structure as the thermal tripping device and consists of a thermal tripping electrode (8), a high-temperature alloy (9) and a second thermal tripping electrode (10) which are electrically connected in sequence, the high-temperature alloy (9) is arranged at the lead part of the voltage-sensitive resistor close to the voltage-sensitive resistor body (4), the second thermal tripping device and the thermal tripping device are electrically connected by sharing the thermal tripping electrode (8), the second thermal tripping device, the thermal tripping device and the voltage-sensitive resistor are flatly paved in a plane to form a compact assembly, and the compact assembly is filled into a plastic housing (1) sealed by a plastic cover plate (2) and epoxy resin (3), and gaps are reserved at the periphery of the high-temperature alloy (5) and are not stressed; the pressure-sensitive extraction electrode (6), the thermal trip extraction electrode (8) and the second thermal trip electrode (10) extend out of the plastic cover plate (2) and the epoxy resin (3), and the common electrode extends out of the plastic cover plate (2) and the epoxy resin (3) or does not extend out of the plastic cover plate (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311045869.3A CN116978650A (en) | 2023-08-18 | 2023-08-18 | Thermal tripping protection piezoresistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311045869.3A CN116978650A (en) | 2023-08-18 | 2023-08-18 | Thermal tripping protection piezoresistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116978650A true CN116978650A (en) | 2023-10-31 |
Family
ID=88475061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311045869.3A Pending CN116978650A (en) | 2023-08-18 | 2023-08-18 | Thermal tripping protection piezoresistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116978650A (en) |
-
2023
- 2023-08-18 CN CN202311045869.3A patent/CN116978650A/en active Pending
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