CN116973458B - Preparation method of piezoelectric composite material array structure - Google Patents

Preparation method of piezoelectric composite material array structure Download PDF

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Publication number
CN116973458B
CN116973458B CN202311234606.7A CN202311234606A CN116973458B CN 116973458 B CN116973458 B CN 116973458B CN 202311234606 A CN202311234606 A CN 202311234606A CN 116973458 B CN116973458 B CN 116973458B
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piezoelectric
piezoelectric composite
piezoelectric ceramic
composite material
ceramic block
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CN116973458A (en
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周进节
刘瑶
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North University of China
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North University of China
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22Details, e.g. general constructional or apparatus details
    • G01N29/24Probes
    • G01N29/2437Piezoelectric probes
    • G01N29/245Ceramic probes, e.g. lead zirconate titanate [PZT] probes

Abstract

The application relates to the technical field of piezoelectric composite material array structures in air-coupled linear array ultrasonic probes, in particular to a preparation method of a piezoelectric composite material array structure. In order to solve the problems of manufacturing errors and assembly errors among a plurality of array element units in the traditional preparation method of the piezoelectric composite material array structure, the preparation method of the novel piezoelectric composite material array structure is provided, and comprises the following steps: the method comprises the steps of material preparation, length cutting, first filling and sealing, first excess filling material removal, width cutting, second filling and sealing, second excess filling material removal, bottom surface grinding, electrode plating, lead wire bonding, first matching layer bonding, second matching layer bonding, fixing on a probe inner shell and array element unit cutting. The preparation method is simple and ingenious, has high preparation efficiency, and can avoid manufacturing errors and assembly errors among array element units, thereby improving the focusing performance of the air coupling linear array ultrasonic probe.

Description

Preparation method of piezoelectric composite material array structure
Technical Field
The application relates to the technical field of air coupling linear array ultrasonic probes, in particular to the technical field of piezoelectric composite material array structures in air coupling linear array ultrasonic probes, and specifically relates to a preparation method of a piezoelectric composite material array structure.
Background
The ultrasonic nondestructive detection technology is a detection means for detecting and evaluating surface and internal structural anomalies or defects of an object to be detected by utilizing the ultrasonic technology on the premise of not damaging the object to be detected, and is widely applied to various industrial fields. The ultrasonic nondestructive testing is mainly divided into contact ultrasonic nondestructive testing and non-contact ultrasonic nondestructive testing, and the non-contact ultrasonic nondestructive testing can only be adopted for the testing of certain special occasions such as medicines, foods and the like. The non-contact ultrasonic nondestructive testing comprises an electromagnetic ultrasonic nondestructive testing technology, a laser ultrasonic nondestructive testing technology and an air coupling ultrasonic nondestructive testing technology, wherein the air coupling ultrasonic nondestructive testing technology is a novel ultrasonic nondestructive testing technology taking air as a transmission medium, and the non-contact ultrasonic nondestructive testing technology has become an important point of research of a plurality of students in recent years.
The core of the air coupling linear array ultrasonic probe is a piezoelectric composite material array structure, the piezoelectric composite material array structure comprises i independent array element units, an air interval is adopted between every two adjacent independent array element units, each independent array element unit comprises a 1-3 piezoelectric composite material formed by a plurality of square piezoelectric ceramic columns in an equidistant arrangement mode, an upper electrode, a lower electrode, a first matching layer and a second matching layer, polymers are filled between every two adjacent square piezoelectric ceramic columns, the upper electrode and the lower electrode are respectively plated on the upper surface and the lower surface of the piezoelectric composite material, the first matching layer is adhered to the upper surface of the upper electrode, the second matching layer is adhered to the upper surface of the first matching layer, and a lead is welded on one side face of each piezoelectric composite material.
The traditional preparation method of the piezoelectric composite material array structure comprises the steps of respectively preparing a plurality of independent array element units, then assembling and fixing the plurality of independent array element units in the probe inner shell, and focusing energy emitted by the plurality of array element units at a detection position to realize ultrasonic detection. Because each independent array element unit is independently manufactured, manufacturing errors among a plurality of independent array element units inevitably occur, so that certain differences exist in resonant frequency, sensitivity and phase of the plurality of independent array element units; meanwhile, a plurality of independent array element units are easy to have errors during assembly, so that the propagation distances from the plurality of independent array element units to focuses are deviated, and finally the focused focuses have large distribution intervals and dispersed energy, so that the detection capability and the detection precision are reduced; in addition, the unreasonable array distribution of a plurality of piezoelectric ceramic columns in each piezoelectric composite material and unreasonable distribution among array element units can cause side lobes, grating lobes and even crosstalk phenomena during ultrasonic focusing, thereby affecting the detection performance of the whole air coupling linear array ultrasonic probe.
Disclosure of Invention
The application provides a novel preparation method of a piezoelectric composite array structure, which aims to solve the problems that the traditional preparation method of the piezoelectric composite array structure is easy to have manufacturing errors and assembly errors among a plurality of array element units.
The application is realized by adopting the following technical scheme:
a preparation method of a piezoelectric composite material array structure comprises the following steps:
1) Preparing materials: taking a piezoelectric ceramic block which is consistent with the length and width of the piezoelectric composite material array structure to be prepared and thicker than the thickness t of the piezoelectric composite material with the specific frequency to be prepared, wherein the piezoelectric ceramic block is a polarized piezoelectric ceramic block;
2) Length cutting: the method comprises the steps that cutting is not cut along the length direction of a piezoelectric ceramic block for a plurality of times, wherein the cutting is uniformly distributed along the width direction of the piezoelectric ceramic block, and the cutting depth of each cutting is larger than the thickness t of a piezoelectric composite material with specific frequency to be prepared, so that a plurality of length direction cutting grooves required by a plurality of piezoelectric composite materials are formed;
3) And (3) primary filling and sealing: filling and sealing filling materials in the plurality of length direction cutting grooves;
4) Removing the superfluous filling material for the first time: curing and molding the piezoelectric ceramic block after the first filling and sealing, and removing redundant filling materials on the upper surface of the piezoelectric ceramic block;
5) Width cutting: cutting without cutting is performed for a plurality of times along the length direction of the piezoelectric ceramic block, wherein the cutting depth of each cutting is larger than the thickness t of the piezoelectric composite material with specific frequency to be prepared, and a plurality of width-direction cutting grooves required by a plurality of piezoelectric composite materials are formed, so that the piezoelectric ceramic block is divided into a plurality of piezoelectric ceramic columns forming a plurality of piezoelectric composite materials, and two adjacent piezoelectric composite materials are not divided during the width cutting;
6) And (3) secondary filling and sealing: filling and sealing filling materials in the plurality of width-direction cutting grooves;
7) And (5) removing the redundant filling material for the second time: curing and molding the piezoelectric ceramic block after the second filling and sealing, and removing redundant filling materials on the upper surface of the piezoelectric ceramic block;
8) And (3) bottom surface grinding: grinding the bottom surface of the piezoelectric ceramic block, so that the thickness of the ground piezoelectric ceramic block is equal to the thickness t of the piezoelectric composite material with specific frequency;
9) Plating an electrode: plating an electrode and a lower electrode on the upper surface and the lower surface of the piezoelectric ceramic block after the bottom surface is ground;
10 Wire(s): welding electrode leads at the location of each piezoelectric composite;
11 Bonding the first matching layer: bonding a first matching layer on the upper surface of the upper electrode of the piezoelectric ceramic block;
12 Bonding the second matching layer: a second matching layer is adhered on the upper surface of the first matching layer;
13 Fixed to the probe inner housing): the method comprises the steps of respectively bonding five surfaces, except an upper electrode surface, of a piezoelectric ceramic block bonded with a first matching layer and a second matching layer to five inner wall surfaces of a probe inner shell, the top opening of which is difficult to cut off an inner bottom plate of the probe inner shell, and exposing the second matching layer to the top opening of the probe inner shell, so that the piezoelectric ceramic block bonded with the first matching layer and the second matching layer is fixed in the probe inner shell;
14 Array element unit division: the piezoelectric ceramic block bonded with the first matching layer and the second matching layer is cut into a plurality of independent array element units, air kerfs between adjacent array element units are formed, and the adjacent array element units are separated by air, wherein the bottom plate of the inner shell of the probe is not cut off in the process of dividing the array element units, so that the preparation of the piezoelectric composite array structure is completed (when the piezoelectric composite array structure is prepared, the layout of the piezoelectric composite array structure is designed in advance, such as the positions, the sizes and the numbers of the width-direction kerfs, the length-direction kerfs and the air kerfs between the adjacent array element units, and the piezoelectric composite array structure can be prepared according to the layout designed in advance and the preparation method.
Principle analysis: the piezoelectric ceramic block is always an integral body in the whole preparation process by cutting without cutting for a plurality of times in length cutting and width cutting and cutting without cutting a bottom plate of the inner shell of the probe when the array element units are cut, and the preparation process does not need assembly among the array element units, so that assembly errors do not exist; meanwhile, the plurality of array element units are synchronously prepared, so that manufacturing errors during independent cutting and preparation of the plurality of array element units are avoided, processing consistency and processing precision of the piezoelectric composite material array are improved, and detection performance and detection precision of the air coupling linear array ultrasonic probe are improved.
Further, when the piezoelectric composite array structure is prepared, parameters in the piezoelectric composite array structure are designed, so that a processing foundation is laid for subsequent preparation, and the specific design steps are as follows: (1) defining dimensional parameters in the piezoelectric composite array structure: the length direction cutting groove and the width direction cutting groove of each piezoelectric composite material are b, the side length of each piezoelectric ceramic column in each piezoelectric composite material is a, the length of each piezoelectric composite material is A, the width of each piezoelectric composite material is C, the width of an air kerf between two adjacent array element units is C, and the number of the array element units is i; (2) constructing a theoretical analysis model of the air-coupled linear array ultrasonic probe by adopting finite element software, and constructing a composite sound field calculation model of the air-coupled linear array ultrasonic probe after phase control delay superposition; (3) simulating through a synthesized sound field calculation model after phase control delay superposition of an air coupling linear array ultrasonic probe in finite element software, extracting the focal point size and sound pressure of a focused sound field, extracting side lobe and grating lobe size positions and sound pressure, researching and analyzing the influence of i array element units excited at a time on the sound field focusing characteristic, and analyzing to obtain the specific value of the size parameter a, b, c, A, C, i of the optimal piezoelectric composite material array structure. The specific values of the size parameters of the piezoelectric composite array are obtained through simulation analysis by adopting simulation software, so that acoustic crosstalk among array elements is eliminated, and the layout structure of the piezoelectric composite array structure in the high-performance air-coupled ultrasonic probe is obtained. As known to those skilled in the art, the first matching layer and the second matching layer have little influence on side lobes, grating lobes and even crosstalk when focusing ultrasonic waves between array elements, so that the parameters of the first matching layer and the second matching layer are not specially designed.
Further, a limited nonlinear optimization algorithm is adopted, an air coupling linear array ultrasonic probe theoretical analysis model is called, and (a, b, C, A, C, i) is taken as a parameter to be optimized, and C is taken as a parameter to be optimized<0.42mm,a<v a /(2f),a<v b /(2f),i∈[1,16]Is a constraint condition, wherein v a V is the propagation velocity of ultrasonic waves on piezoelectric ceramics b Is the propagation velocity of ultrasonic waves on the filling material, F is the ultrasonic frequency, and F (a, b, C, A, C, i) =0.8 w 1 +0.1w 2 +0.1w 3 For optimization purposes, where w 1 , w 2 And w 3 The method comprises the steps of respectively obtaining the highest energy of a main lobe, a side lobe and a grating-free center, then selecting a proper initial value to obtain the size parameters of the piezoelectric composite material array structure with strong main lobe energy, weak side lobe and grating-free center, thereby eliminating acoustic crosstalk among array elements, and rapidly analyzing to obtain the specific value of the size parameter a, b, c, A, C, i in the optimal piezoelectric composite material array structure.
The beneficial effects of the application are as follows:
1) The preparation method is simple and ingenious, has high preparation efficiency, can avoid manufacturing errors and assembly errors among array element units, and can eliminate the problem of focus energy divergence caused by deviations of resonance frequency, sensitivity, phase, propagation distance and the like, so that the detection capability and the detection system are improved;
2) By designing layout structure parameters of the piezoelectric composite material array structure, the energy dissipation of side lobes and grating lobes in the focusing process is eliminated, and meanwhile, the performance degradation caused by crosstalk among array element units is avoided, so that focusing energy is concentrated, and the detection performance of the whole air coupling linear array ultrasonic probe is improved.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description, serve to explain the principles of the application.
In order to more clearly illustrate the embodiments of the application or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, and it will be obvious to a person skilled in the art that other drawings can be obtained from these drawings without inventive effort.
FIG. 1 is a schematic diagram of a layout structure of a piezoelectric composite array according to the present application;
FIG. 2 is a side view of FIG. 1;
FIG. 3 is a top view of FIG. 1;
fig. 4 is a flowchart of a method for manufacturing a piezoelectric composite array structure according to the present application.
In the figure: 1-length direction cutting, 2-width direction cutting, 3-piezoceramic columns, 4-air cutting slits and 5-piezoelectric composite materials.
Detailed Description
In order that the above objects, features and advantages of the application will be more clearly understood, a further description of the application will be made. It should be noted that, without conflict, the embodiments of the present application and features in the embodiments may be combined with each other.
In the description, it should be noted that the terms "first," "second," and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. It should be noted that, unless explicitly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms described above will be understood by those of ordinary skill in the art as the case may be.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application, but the present application may be practiced otherwise than as described herein; it will be apparent that the embodiments in the specification are only some, but not all, embodiments of the application.
Specific embodiments of the present application will be described in detail below with reference to the accompanying drawings.
As shown in fig. 1, 2, 3 and 4, a method for preparing a piezoelectric composite array structure includes the following steps:
1) Preparing materials: taking a piezoelectric ceramic block which is consistent with the length and width of the piezoelectric composite material array structure to be prepared and thicker than the thickness t of the piezoelectric composite material 5 with the specific frequency to be prepared, wherein the piezoelectric ceramic block is a polarized piezoelectric ceramic block;
2) Length cutting: the cutting is uniformly distributed along the width direction of the piezoelectric ceramic block for a plurality of times, the cutting is not cut along the length direction of the piezoelectric ceramic block, and the cutting depth of each time is larger than the thickness t of the piezoelectric composite material 5 with specific frequency to be prepared, so that a plurality of length direction cutting grooves 1 required by a plurality of piezoelectric composite materials 5 are formed;
3) And (3) primary filling and sealing: filling and sealing the filling material (in concrete implementation, the filling material is polymer) in the plurality of longitudinal grooves 1;
4) Removing the superfluous filling material for the first time: curing and molding the piezoelectric ceramic block after the first filling and sealing, and removing redundant filling materials on the upper surface of the piezoelectric ceramic block;
5) Width cutting: performing non-cutting along the width direction of the piezoelectric ceramic block for a plurality of times along the length direction of the piezoelectric ceramic block, wherein the cutting depth of each cutting is larger than the thickness t of the piezoelectric composite material 5 with specific frequency to be prepared, and forming a plurality of width direction cutting grooves 2 required by the piezoelectric composite materials 5, so that the piezoelectric ceramic block is divided into a plurality of piezoelectric ceramic columns 3 forming the piezoelectric composite materials 5, and the adjacent two piezoelectric composite materials 5 are not divided during the width cutting;
6) And (3) secondary filling and sealing: filling and sealing the filling material in the plurality of width-direction cutting grooves 2;
7) And (5) removing the redundant filling material for the second time: curing and molding the piezoelectric ceramic block after the second filling and sealing, and removing redundant filling materials on the upper surface of the piezoelectric ceramic block;
8) And (3) bottom surface grinding: grinding the bottom surface of the piezoelectric ceramic block, so that the thickness of the ground piezoelectric ceramic block is equal to the thickness t of the piezoelectric composite material 5 with the specific frequency;
9) Plating an electrode: plating an electrode and a lower electrode on the upper surface and the lower surface of the piezoelectric ceramic block after the bottom surface is ground;
10 Wire(s): welding electrode leads at the location of each piezoelectric composite 5;
11 Bonding the first matching layer: bonding a first matching layer on the upper surface of the upper electrode of the piezoelectric ceramic block;
12 Bonding the second matching layer: a second matching layer is adhered on the upper surface of the first matching layer;
13 Fixed to the probe inner housing): the method comprises the steps of respectively bonding five surfaces, except an upper electrode surface, of a piezoelectric ceramic block bonded with a first matching layer and a second matching layer to five inner wall surfaces of a probe inner shell, the top opening of which is difficult to cut off an inner bottom plate of the probe inner shell, and exposing the second matching layer to the top opening of the probe inner shell, so that the piezoelectric ceramic block bonded with the first matching layer and the second matching layer is fixed in the probe inner shell;
14 Array element unit division: the piezoelectric ceramic block bonded with the first matching layer and the second matching layer is cut into a plurality of independent array element units, and air slits 4 between the adjacent array element units are formed, so that the adjacent array element units are separated by air, wherein the bottom plate of the inner shell of the probe is not cut off in the process of dividing the array element units, so that the preparation of the piezoelectric composite array structure is completed (when the piezoelectric composite array structure is prepared, the layout of the piezoelectric composite array structure is designed in advance, such as the positions, the sizes and the number of the width-direction cutting grooves 2, the length-direction cutting grooves 1 and the air slits 4 between the adjacent array element units, and the piezoelectric composite array structure can be prepared according to the layout designed in advance and the preparation method.
Principle analysis: the piezoelectric ceramic block is always an integral body in the whole preparation process by cutting without cutting for a plurality of times in length cutting and width cutting and cutting without cutting a bottom plate of the inner shell of the probe when the array element units are cut, and the preparation process does not need assembly among the array element units, so that assembly errors do not exist; meanwhile, the plurality of array element units are synchronously prepared, so that manufacturing errors during independent cutting and preparation of the plurality of array element units are avoided, processing consistency and processing precision of the piezoelectric composite material array are improved, and detection performance and detection precision of the air coupling linear array ultrasonic probe are improved.
In the specific implementation, in the step 4), the piezoelectric ceramic block after the first filling and sealing is cured and formed through a vacuum drying oven, and in the step 7), the piezoelectric ceramic block after the second filling and sealing is cured and formed through the vacuum drying oven, so that the curing efficiency is high and the forming effect is good.
In the specific implementation, in the step 9), the upper electrode and the lower electrode are both electrodes made of gold, silver, tin or copper metals.
In this embodiment, in step 9), the upper electrode and the lower electrode may be both coated on the upper surface and the lower surface of the piezoelectric ceramic block whose bottom surface is polished by a magnetron sputtering method, a brush plating method or a spray plating method.
In the specific embodiment, in step 13), the piezoelectric ceramic blocks bonded with the first matching layer and the second matching layer are bonded with the inner wall of the inner shell of the probe by adopting a silicone rubber or epoxy resin adhesive.
In the specific embodiment, in the step 4) and the step 7), a surface grinder is used to remove the redundant filling material on the piezoelectric ceramic block.
In the specific implementation, when the piezoelectric composite material array structure is prepared, parameters in the array structure are designed, so that a processing foundation is laid for subsequent preparation, and the specific design steps are as follows: (1) defining dimensional parameters in the piezoelectric composite array structure: the slot widths of the length direction slot 1 and the width direction slot 2 of each piezoelectric composite material 5 are b, the side length of each piezoelectric ceramic column 3 in each piezoelectric composite material 5 is a, the length of each piezoelectric composite material 5 is A, the width is C, the width of the air kerf 4 between two adjacent array element units is C, and the number of the array element units is i; (2) constructing a theoretical analysis model of the air-coupled linear array ultrasonic probe by finite element software (COMSOL simulation software is adopted in specific implementation), and constructing a composite sound field calculation model of the air-coupled linear array ultrasonic probe after phase control delay superposition; (3) the method is characterized in that simulation is carried out through a composite sound field calculation model after phase control delay superposition of an air coupling linear array ultrasonic probe in finite element software (COMSOL simulation software is adopted in specific implementation), focal point size and sound pressure of a focused sound field are extracted, side lobe and grating lobe size positions and sound pressure are extracted, influence of single excitation of i array element units on sound field focusing characteristics is researched and analyzed, and therefore specific values of size parameters a, b, c, A, C, i of an optimal piezoelectric composite material array structure are obtained through analysis. The specific values of the size parameters of the piezoelectric composite array are obtained through simulation analysis by adopting simulation software, so that acoustic crosstalk among array elements is eliminated, and the layout structure of the piezoelectric composite array structure in the high-performance air-coupled ultrasonic probe is obtained. As known to those skilled in the art, the first matching layer and the second matching layer have little influence on side lobes, grating lobes and even crosstalk when focusing ultrasonic waves between array elements, so that the parameters of the first matching layer and the second matching layer are not specially designed.
In the specific implementation, a restrictive nonlinear optimization algorithm is adopted (in the specific implementation, the restrictive nonlinear optimization algorithm can be programmed on MATLAB), an air coupling linear array ultrasonic probe theoretical analysis model is called (in the specific implementation, a bat file is adopted to call the air coupling linear array ultrasonic probe theoretical analysis model on COMSOL simulation software), and (a, b, C, A, C, i) is the parameter to be optimized, and C is adopted<0.42mm,a<v a /(2f),a<v b /(2f),i∈[1,16]Is a constraint condition, wherein v a V is the propagation velocity of ultrasonic waves on piezoelectric ceramics b Is the propagation velocity of ultrasonic waves on the filling material, F is the ultrasonic frequency, and F (a, b, C, A, C, i) =0.8 w 1 +0.1w 2 +0.1w 3 For optimization purposes, where w 1 , w 2 And w 3 The highest energy of the main lobe, the side lobe and the grating-free center are respectively obtained, and then proper initial values are selected to obtain strong main lobe energy, weak side lobe and no gratingThe method can quickly analyze and obtain the optimal specific value of the dimension parameter a, b, c, A, C, i in the piezoelectric composite array structure.
The foregoing is only a specific embodiment of the application to enable those skilled in the art to understand or practice the application. Although described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the embodiments, and they should be construed as covering the scope of the appended claims.

Claims (8)

1. The preparation method of the piezoelectric composite material array structure is characterized by comprising the following steps of:
1) Preparing materials: taking a piezoelectric ceramic block which is consistent with the length and width of the piezoelectric composite material array structure to be prepared and thicker than the thickness t of the piezoelectric composite material (5) with specific frequency to be prepared, wherein the piezoelectric ceramic block is a polarized piezoelectric ceramic block;
2) Length cutting: the method comprises the steps that cutting is not cut along the length direction of a piezoelectric ceramic block for a plurality of times, wherein the cutting depth of each cutting is larger than the thickness t of a piezoelectric composite material (5) with specific frequency to be prepared, and the cutting grooves (1) in the length direction, which are required by a plurality of piezoelectric composite materials (5), are uniformly distributed along the width direction of the piezoelectric ceramic block;
3) And (3) primary filling and sealing: filling and sealing filling materials in the plurality of longitudinal cutting grooves (1);
4) Removing the superfluous filling material for the first time: curing and molding the piezoelectric ceramic block after the first filling and sealing, and removing redundant filling materials on the upper surface of the piezoelectric ceramic block;
5) Width cutting: a plurality of cutting-off cuts are carried out along the length direction of the piezoelectric ceramic blocks for a plurality of times along the width direction of the piezoelectric ceramic blocks, the cutting depth of each cutting-off cut is larger than the thickness t of the piezoelectric composite material (5) with specific frequency to be prepared, a plurality of width direction cutting grooves (2) required by the piezoelectric composite materials (5) are formed, so that the piezoelectric ceramic blocks are divided into a plurality of piezoelectric ceramic columns (3) of the piezoelectric composite materials (5), and two adjacent piezoelectric composite materials (5) are not divided during the width cutting;
6) And (3) secondary filling and sealing: filling and sealing filling materials in the plurality of width-direction cutting grooves (2);
7) And (5) removing the redundant filling material for the second time: curing and molding the piezoelectric ceramic block after the second filling and sealing, and removing redundant filling materials on the upper surface of the piezoelectric ceramic block;
8) And (3) bottom surface grinding: grinding the bottom surface of the piezoelectric ceramic block, so that the thickness of the ground piezoelectric ceramic block is equal to the thickness t of the piezoelectric composite material (5) with specific frequency;
9) Plating an electrode: plating an electrode and a lower electrode on the upper surface and the lower surface of the piezoelectric ceramic block after the bottom surface is ground;
10 Wire(s): welding electrode leads at the location of each piezoelectric composite (5);
11 Bonding the first matching layer: bonding a first matching layer on the upper surface of the upper electrode of the piezoelectric ceramic block;
12 Bonding the second matching layer: a second matching layer is adhered on the upper surface of the first matching layer;
13 Fixed to the probe inner housing): the method comprises the steps of respectively bonding five surfaces, except an upper electrode surface, of a piezoelectric ceramic block bonded with a first matching layer and a second matching layer to five inner wall surfaces of a probe inner shell, the top opening of which is difficult to cut off an inner bottom plate of the probe inner shell, and exposing the second matching layer to the top opening of the probe inner shell, so that the piezoelectric ceramic block bonded with the first matching layer and the second matching layer is fixed in the probe inner shell;
14 Array element unit division: and cutting the piezoelectric ceramic block bonded with the first matching layer and the second matching layer into a plurality of independent array element units to form air kerfs (4) between adjacent array element units, wherein the bottom plate of the inner shell of the probe is not cut off in the process of dividing the array element units, so that the preparation of the piezoelectric composite material array structure is completed.
2. The method for manufacturing a piezoelectric composite array structure according to claim 1, wherein in the step 4), the piezoelectric ceramic block after the first potting is cured and formed by a vacuum drying oven, and in the step 7), the piezoelectric ceramic block after the second potting is cured and formed by a vacuum drying oven.
3. The method of claim 2, wherein in step 9), the upper electrode and the lower electrode are both electrodes made of gold, silver, tin or copper metals.
4. The method of claim 3, wherein in the step 9), the upper electrode and the lower electrode are both coated on the upper surface and the lower surface of the piezoelectric ceramic block with the bottom surface removed by a magnetron sputtering method, a brush plating method or a spray plating method.
5. The method of manufacturing a piezoelectric composite array structure according to claim 4, wherein in the step 13), the piezoelectric ceramic blocks bonded with the first matching layer and the second matching layer are bonded with the inner wall of the inner shell of the probe by using a silicone rubber or epoxy resin adhesive.
6. The method for manufacturing a piezoelectric composite array structure according to claim 5, wherein in step 4) and step 7), a surface grinder is used to remove the redundant filling material on the piezoelectric ceramic block.
7. The method for preparing a piezoelectric composite array structure according to claim 1 or 2 or 3 or 4 or 5 or 6, wherein parameters in the piezoelectric composite array structure are designed firstly when the piezoelectric composite array structure is prepared, and a processing foundation is laid for subsequent preparation, and the specific design steps are as follows:
(1) defining dimensional parameters in the piezoelectric composite array structure: the groove widths of the length direction cutting grooves (1) and the width direction cutting grooves (2) of each piezoelectric composite material (5) are b, the side length of each piezoelectric ceramic column (3) in each piezoelectric composite material (5) is a, the length of each piezoelectric composite material (5) is A, the width is C, the width of an air cutting joint (4) between two adjacent array element units is C, and the number of the array element units is i;
(2) constructing a theoretical analysis model of the air-coupled linear array ultrasonic probe by adopting finite element software, and constructing a composite sound field calculation model of the air-coupled linear array ultrasonic probe after phase control delay superposition;
(3) simulating through a synthesized sound field calculation model after phase control delay superposition of the air coupling linear array ultrasonic probe in finite element software, extracting the focal size and sound pressure of a focused sound field, extracting side lobe and grating lobe size positions and sound pressure, researching and analyzing the influence of i array element units excited once on the sound field focusing characteristic, analyzing and obtaining the specific value of the size parameter a, b, c, A, C, i of the optimal piezoelectric composite material array structure, and obtaining the specific value of the size parameter of the piezoelectric composite material array through simulation analysis by adopting simulation software, so that acoustic crosstalk among array elements is eliminated, and obtaining the layout structure of the piezoelectric composite material array structure in the high-performance air coupling ultrasonic probe.
8. The method for preparing a piezoelectric composite array structure according to claim 7, wherein a limited nonlinear optimization algorithm is adopted, an air coupling linear array ultrasonic probe theoretical analysis model is called, a, b, c, A, C, i is taken as a parameter to be optimized, and c is taken as a parameter to be optimized<0.42mm,a<v a /(2f),a<v b /(2f),i∈[1,16]Is a constraint condition, wherein v a V is the propagation velocity of ultrasonic waves on piezoelectric ceramics b Is the propagation velocity of ultrasonic waves on the filling material, F is the ultrasonic frequency, and F (a, b, C, A, C, i) =0.8 w 1 +0.1w 2 +0.1w 3 For optimization purposes, where w 1 , w 2 And w 3 The method comprises the steps of respectively obtaining the highest energy of a main lobe, a side lobe and a grating-free center, then selecting a proper initial value to obtain the size parameters of the piezoelectric composite material array structure with strong main lobe energy, weak side lobe and grating-free center, thereby eliminating acoustic crosstalk among array elements, and rapidly analyzing to obtain the specific value of the size parameter a, b, c, A, C, i in the optimal piezoelectric composite material array structure.
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