CN116963378A - Flexible circuit board and display device - Google Patents
Flexible circuit board and display device Download PDFInfo
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- CN116963378A CN116963378A CN202211502781.5A CN202211502781A CN116963378A CN 116963378 A CN116963378 A CN 116963378A CN 202211502781 A CN202211502781 A CN 202211502781A CN 116963378 A CN116963378 A CN 116963378A
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- circuit board
- flexible circuit
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- 239000010410 layer Substances 0.000 claims abstract description 86
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 61
- 239000012790 adhesive layer Substances 0.000 claims abstract description 47
- 230000002787 reinforcement Effects 0.000 claims abstract description 12
- 238000003475 lamination Methods 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 10
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 7
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 239000006260 foam Substances 0.000 claims description 5
- 239000010439 graphite Substances 0.000 claims description 5
- 229910002804 graphite Inorganic materials 0.000 claims description 5
- -1 polyethylene terephthalate Polymers 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 abstract description 47
- 230000001070 adhesive effect Effects 0.000 abstract description 46
- 230000002441 reversible effect Effects 0.000 abstract description 7
- 230000017525 heat dissipation Effects 0.000 description 8
- 239000003292 glue Substances 0.000 description 6
- 238000005452 bending Methods 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- 230000002829 reductive effect Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000003139 buffering effect Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000008719 thickening Effects 0.000 description 2
- 230000037303 wrinkles Effects 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000008093 supporting effect Effects 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
- G09F9/335—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes being organic light emitting diodes [OLED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The application discloses a flexible circuit board and a display device, wherein the front surface of the flexible circuit board is provided with a device region, the back surface of the flexible circuit board is provided with a device corresponding region corresponding to the device region, the device corresponding region is provided with a reinforcing pad, the back surface of the flexible circuit board is provided with a back adhesive component, and the back adhesive component comprises: the buffer belt is positioned on the back surface of the flexible circuit board and is adjacent to the reinforcing pad; and the back adhesive layer is arranged on the back surface of the flexible circuit board in a lamination manner and covers or avoids the buffer belt. Above-mentioned flexible circuit board through setting up the buffer area at the back of flexible circuit board, and makes the buffer area adjacent the reinforcement pad to can make the gum layer paste thickness variation more mild behind the back of flexible circuit board through the perpendicular distance at the back of buffer area buffer reinforcement pad and flexible circuit board, alleviate because the perpendicular distance at the back of reinforcement pad and flexible circuit board is to the pulling stress that gum layer produced, avoid gum layer to receive to pull and lead to gum to drop, reverse from the appearance of type and the mould seal scheduling problem.
Description
Technical Field
The application belongs to the technical field of display equipment, and particularly relates to a flexible circuit board and a display device.
Background
At present, an organic light emitting diode (Organic Light Emitting Diode, OLED) display has been widely used in end products such as mobile phones due to its advantages of self-luminescence, fast response, low energy consumption, flexibility, ultra-thin and wide color gamut. As shown in fig. 1, in order to narrow the lower frame, a PAD Bending (PAD Bending) process is often adopted, a panel layer (PNL) lower PAD (PAD) and a flexible circuit board (Flexible Printed Circuit, FPC) are bent (Bending) to the back of the display module, and are connected with a heat dissipation film layer (SCF) on the back of the display module through a flexible circuit board back adhesive.
In the related art, the back adhesive of the circuit board has the problems of falling off, reverse separation or stamping. It should be noted that the information disclosed in the above background section is only for enhancing understanding of the background of the present disclosure and thus may include information that does not constitute prior art known to those of ordinary skill in the art.
Disclosure of Invention
The application aims to at least solve the technical problems of reverse release and stamping caused by the existence of the step difference in different areas of the flexible circuit board by the back adhesive of the flexible circuit board to a certain extent. To this end, the application provides a back adhesive assembly, a flexible circuit board and a display device.
The front surface of the flexible circuit board is provided with a device area, the back surface of the flexible circuit board is provided with a device corresponding area corresponding to the device area, the device corresponding area is provided with a reinforcing pad, the back surface of the flexible circuit board is provided with a back adhesive component, and the back adhesive component comprises:
the buffer belt is positioned on the back surface of the flexible circuit board and is adjacent to the reinforcing pad;
and the back adhesive layer is arranged on the back surface of the flexible circuit board in a lamination manner and covers or avoids the buffer belt.
In some embodiments, the thickness of the buffer tape is less than the thickness of the reinforcement pad relative to the back side of the flexible circuit board.
In some embodiments, the thickness of the backsize layer corresponding to the reinforcement pad is different from the thickness of the backsize layer corresponding to the remaining area of the back side of the flexible circuit board.
In some embodiments, the backing layer is avoided from the buffer zone, and the backing layer is divided into at least a first backing layer and a second backing layer with the buffer zone as a boundary.
In some embodiments, the thickness of the first and second backsize layers is different, and the thickness of the buffer zone is less than the thickness difference of the reinforcing pad and the adjacent first or second backsize layer.
In some embodiments, the material of the buffer belt is selected from any one or more of polyethylene terephthalate, foamed plastic and graphite.
In some embodiments, the buffer tape is spaced from 0.1mm to 1.8mm from the boundary of each region on the flexible circuit board.
In some embodiments, the flexible circuit board is provided with a fingerprint hole, the back surface of the flexible circuit board is provided with an electronic shielding film in a lamination manner, and the electronic shielding film avoids the fingerprint hole and the device corresponding area; wherein, the interval between the boundary of the buffer zone and the corresponding area of the device is 1.5+/-0.1 mm; the spacing between the buffer tape and the boundary of the electron shielding film is 0.5+/-0.1 mm; the spacing between the buffer belt and the boundary of the fingerprint hole is 0.2+/-0.1 mm; the spacing between the buffer belt and the boundary of the gum layer is 0.3+/-0.1 mm; the spacing between the buffer tape and the boundary of the flexible circuit board is 0.3 + -0.1 mm.
In some embodiments, an adhesive layer is disposed on a side of the buffer tape adjacent to the flexible circuit board.
The embodiment of the application also provides a display device which comprises the flexible circuit board.
The embodiment of the application has at least the following beneficial effects:
above-mentioned flexible circuit board through setting up the buffer area at the back of flexible circuit board, and makes the buffer area adjacent the reinforcement pad to can make the gum layer paste thickness variation more mild behind the back of flexible circuit board through the perpendicular distance at the back of buffer area buffer reinforcement pad and flexible circuit board, alleviate because the perpendicular distance at the back of reinforcement pad and flexible circuit board is to the pulling stress that gum layer produced, avoid gum layer to receive to pull and lead to gum to drop, reverse from the appearance of type and the mould seal scheduling problem.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram showing the positional relationship between a flexible circuit board and a display module;
FIG. 2 shows a top view of the flexible circuit board with the adhesive back pulled flush;
FIG. 3 shows a cross-sectional view of the flexible circuit board of FIG. 2;
FIG. 4 shows a cross-sectional view of a device corresponding region of the back side of a flexible circuit board with reinforcing pads
Fig. 5 is a schematic view showing the structure of a flexible circuit board according to an embodiment of the application
FIG. 6 shows a cross-sectional view of the flexible circuit board of FIG. 5 in the A-A direction;
FIG. 7 shows a B-B cross-sectional view of the flexible circuit board of FIG. 5;
FIG. 8 is a schematic diagram of a flexible circuit board according to another embodiment of the application;
FIG. 9 shows a C-C cross-sectional view of the flexible circuit board of FIG. 8;
fig. 10 shows a D-D cross-sectional view of the flexible circuit board of fig. 8.
Reference numerals:
1000. a display device; 11. a release film; 12. back glue; 100. a back adhesive assembly; 110. back-adhesive release film; 111. a release film handle; 120. a back adhesive layer; 121. a first gum layer; 122. a second gum layer; 130. a buffer belt; 131. a first buffer belt; 132. a second buffer belt; 200. a flexible circuit board; 210. a flexible circuit board body; 220. a reinforcing pad; 221. double faced adhesive tape; 230. a device region; 231. boundary of the device corresponding region; 240. an electron shielding film; 241. a boundary of the electron shielding film; 250. a finger hole; 300. a display module; 310. a glass cover sheet layer; 320. a transparent adhesive water layer; 330. a polarizing layer; 340. a panel layer; 350. a protective film layer; 360. a heat dissipation film layer; 370. a driving chip; 380. a liner.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
Furthermore, the present application may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present application provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.
The application is described below with reference to specific embodiments in conjunction with the accompanying drawings:
the first aspect of the present application provides a flexible circuit board 200, as shown in fig. 4 and 5, in which a device region 230 is disposed on a front surface of the flexible circuit board 200, a device corresponding region corresponding to the device region 230 is disposed on a back surface of the flexible circuit board 200, a reinforcing pad 220 is disposed on the device corresponding region, a back adhesive assembly 100 is disposed on the back surface of the flexible circuit board 200, and the back adhesive assembly 100 includes: the buffer belt 130 is positioned on the back surface of the flexible circuit board 200 and is adjacent to the reinforcing pad 220; the back adhesive layer 120 is stacked on the back surface of the flexible circuit board 200, and covers or avoids the buffer tape 130.
According to the flexible circuit board 200 of the embodiment, the buffer belt 130 is arranged on the back surface of the flexible circuit board 200, and the buffer belt 130 is adjacent to the reinforcing pad 220, so that the vertical distance between the reinforcing pad 220 and the back surface of the flexible circuit board 200 can be buffered through the buffer belt 130, the thickness change of the back adhesive layer 120 after being stuck on the back surface of the flexible circuit board 200 is more gentle, the pulling stress on the back adhesive layer 120 caused by the vertical distance between the reinforcing pad 220 and the back surface of the flexible circuit board is reduced, and the problems of back adhesive 12 falling, counter-release, stamping and the like caused by pulling of the back adhesive layer 120 are avoided.
Based on the same inventive concept, the second broad aspect of the present application also provides a display device 1000, the display device 1000 including the above-described flexible circuit board 200.
Because the display device 1000 provided by the present application includes the adhesive-backed assembly 100 according to the above technical scheme or the flexible circuit board 200 according to the above technical scheme, the display device 1000 provided by the present application has all the beneficial effects of the adhesive-backed assembly 100 or the flexible circuit board 200 according to the above technical scheme, and will not be described herein.
In the display device 1000, as shown in fig. 1, in order to narrow the lower frame of the display device 1000, a pad bending process is often used to bend the lower pad 380 of the panel layer 340 and the flexible circuit board 200 to the back of the display module 300, and the heat dissipation film layer 360 on the back of the display module 300 is connected with the back adhesive 12 of the flexible circuit board 200. The display module 300 is sequentially stacked in the thickness direction with a glass cover layer 310 (CG), a transparent adhesive layer 320 (Optically Clear Adhesive, TOCA), a polarizing layer 330 (POL), a panel layer 340 (PNL), a protective Film layer 350 (Back Film, BF), and a heat dissipation Film layer 360 (SCF), the panel layer 340 is bent to the Back of the display module 300 and connected with the flexible circuit board 200, the protective Film layer 350, a gasket 380, and a driving chip 370 are provided at a portion of the panel layer 340 bent to the Back of the display module 300, the protective Film layer 350 is provided at a side of the panel layer 340 adjacent to the Back of the display module 300, the gasket 380 (PET) is provided at a side of the protective Film layer 350 adjacent to the Back of the display module 300, and the driving chip 370 (Integrated Circuit, IC) is provided at a side of the panel layer 340 remote from the display module 300.
The flexible circuit board 200 includes a flexible circuit board body 210, a reinforcing pad 220, and a device region 230, wherein the flexible circuit board body 210 has a multi-layer structure. In the flexible circuit board 200 shown in fig. 2 and 3, the back of the flexible circuit board 200 does not adopt a reinforcing design in a device corresponding area, the back glue 12 is generally in a whole-surface pull-through design, the back glue 12 is tiled on the back of the flexible circuit board 200, the back glue layer 120 is stacked on the release film 11, the release film 11 is provided with a handle protruding from the back glue 12, and the back glue 12 can be integrally pulled through and stuck on the back of the flexible circuit board 200 by holding the handle on the release film 11. However, in the flexible circuit board 200 shown in fig. 4, since the number of structural layers of the flexible circuit board body 210 is reduced, it is necessary to provide a reinforcing pad 220 at a device corresponding region of the back surface of the flexible circuit board 200, and the reinforcing pad 220 is adhered to the back surface of the flexible circuit board 200 by a double-sided tape 221 so as to reinforce the device region 230 of the flexible circuit board 200. The back side of the flexible circuit board 200 may form a certain thickness difference between the reinforcing pad 220 and the remaining area. If the whole surface of the back adhesive 12 is flush with the reinforcing pad 220, the thickness of the back adhesive 12 will be increased, and the whole space of the terminal will be occupied too much; if the thickness of the back adhesive 12 is reduced, the back adhesive 12 has a thickness difference between the reinforcing pad 220 and the back surface area of the adjacent flexible circuit board 200, the device area 230 will be pulled after binding, and when the thickness difference between the reinforcing pad 220 and the back surface area of the adjacent flexible circuit board 200 is too large, the back adhesive 12 is easily torn apart, so that the back adhesive 12 is dropped; secondly, the stamping around the device region 230 is easily caused; in addition, the release film 11 is provided with the back adhesive 12 at the position of thickness conversion, so that the problem of reverse release is caused.
In order to avoid the problem of reverse release and stamping of the back adhesive 12 caused by the thickness difference between the reinforcing pad 220 and the back surface area of the adjacent flexible circuit board 200, the application proposes to arrange the buffer belt 130 on the back surface of the flexible circuit board 200 and make the buffer belt 130 adjacent to the reinforcing pad 220, thereby balancing the thickness difference between the reinforcing pad 220 and the back surface area of the adjacent flexible circuit board 200 by using the buffer belt 130, making the thickness change between the reinforcing pad 220 and the back surface area of the adjacent flexible circuit board 200 more gentle, and further making the bending degree of the back adhesive layer 120 in the thickness change area of the back surface of the reinforcing pad 220 and the flexible circuit board 200 reduced, and through verification, the problem of release, reverse release or stamping caused by the forced pulling of the back adhesive layer 120 can be better solved by the buffer belt 130.
Optionally, the back adhesive assembly 100 of this embodiment further includes a back adhesive release film 110, where the back adhesive release film 110 is laminated on a side of the back adhesive layer 120 away from the flexible circuit board 200, and the back adhesive release film 110 provides strength and hardness support for the back adhesive assembly 100, so that the back adhesive layer 120 can be conveniently adhered to the back surface of the flexible circuit board 200, and after the back adhesive layer 120 is adhered to the back surface of the flexible circuit board 200, the back adhesive release film 110 is removed from the back adhesive layer 120. Further preferably, the size of the back adhesive layer 120 corresponds to the back surface of the flexible circuit board 200, and the back adhesive release film 110 may be provided with a release film handle 111 protruding from the flexible circuit board 200 and the back adhesive layer 120.
In this embodiment, as shown in fig. 5 to 7, the backing layer 120 may avoid the buffer tape 130, and the buffer tape 130 may be attached to the back surface of the flexible circuit board 200 to compensate for the thickness of the thickness variation area of the back surface of the flexible circuit board 200, so as to provide a thickness buffering effect.
In other embodiments, as shown in fig. 8 to 10, the back adhesive layer 120 may cover the buffer tape 130, that is, the buffer tape 130 may be disposed between the back adhesive layer 120 and the flexible circuit board 200, one side of the buffer tape 130 may be attached to the back surface of the flexible circuit board 200 to compensate for the thickness of the thickness variation region on the back surface of the flexible circuit board 200, to provide a thickness buffering effect, and the other side of the buffer tape 130 may be attached to the back adhesive layer 120, and may further be attached to the heat dissipation film layer 360 through the back adhesive layer 120, and in addition, since the other side of the buffer tape 130 is attached to the back adhesive layer 120, the buffer tape and the back adhesive layer 120 may be integrally disposed together on the back surface of the flexible circuit board 200, so that the number of operation steps may be reduced and the work efficiency may be improved.
As an alternative embodiment, the thickness of the buffer tape 130 is less than the thickness of the reinforcing pad 220 relative to the back side of the flexible circuit board.
In the present embodiment, as shown in fig. 5 to 7, the reinforcing pad 220 is provided at the device corresponding region of the back surface of the flexible circuit board 200, so that the thickness of the reinforcing pad 220 at the back surface of the flexible circuit board 200 is relatively large, and the thickness of the remaining region of the flexible circuit board 200 is relatively small. It is because the thickness difference exists in the whole back of the flexible circuit board 200 due to the arrangement of the reinforcing pad 220 on the back of the flexible circuit board 200, the design scheme that the back adhesive layer 120 is pulled through and flush cannot be adopted, and the buffer tape 130 needs to be adopted to make the rest area of the back of the flexible circuit board 200 except for the reinforcing pad 220 carry out compensation thickening, so the thickness range of the compensation thickening is preferably the thickness of the reinforcing pad 220 relative to the back of the flexible circuit board 200, and meanwhile, in order to avoid that the thickness of the rest area of the flexible circuit board 200 exceeds the thickness of the reinforcing pad 220 through the thickness compensation of the buffer tape 130, the thickness of the buffer tape 130 needs to be smaller than the thickness of the reinforcing pad 220 relative to the back of the flexible circuit board 200.
As an alternative embodiment, the thickness of the backing layer 120 corresponding to the reinforcing pad 220 is different from the thickness of the backing layer 120 corresponding to the remaining area of the back surface of the flexible circuit board 200.
In this embodiment, the reinforcing pad 220 and the rest of the flexible circuit board 200 are adhered and fixed to the heat dissipation film layer 360 on the back of the display module 300 through the back adhesive layer 120. In order to avoid or reduce the bending degree of the back adhesive layer 120 due to the thickness variation, the thickness of the back adhesive layer 120 may have different thicknesses corresponding to the thicknesses of the reinforcing pad 220 and the rest of the flexible circuit board 200, or may divide the back adhesive layer 120 according to the relative thicknesses of the back areas of the flexible circuit board 200, and set different thicknesses of the back adhesive layer 120 according to the different areas, so as to compensate a part of thickness difference by the back adhesive layer 120.
As a further alternative embodiment, the backing layer 120 is avoided from the buffer tape 130, and the backing layer 120 is divided into at least a first backing layer 121 and a second backing layer 122 by the buffer tape 130.
In this embodiment, as shown in fig. 5 to 7, the backing layer 120 is designed in segments with the buffer belt 130 as a boundary, so that the first backing layer 121 and the second backing layer 122 can have different structures according to the setting positions of the buffer belt 130 to match the structures of the buffer belt 130 and the flexible circuit board 200. Further, if the backing layer 120 is integrally designed, the backing layer 120 is prone to uneven wrinkles at the location under the condition that the thickness difference exists between the adjacent sides of the reinforcing pad 220, so that the backing layer 120 is divided into different areas by using the buffer belt 130 as a boundary, and the problem of wrinkles of the backing layer 120 can be avoided.
As an alternative embodiment, the thickness of the first and second backsize layers 121 and 122 is different, and the thickness of the buffer tape 130 is smaller than the thickness difference between the reinforcing pad 220 and the adjacent first or second backsize layer 121 or 122.
In this embodiment, since the device region 230 is disposed at a different position on the front surface of the flexible circuit board 200, the position of the device corresponding region on the back surface of the flexible circuit board 200 is changed, and the position of the reinforcing pad 220 disposed on the device corresponding region on the flexible circuit board 200 is also changed. As shown in fig. 5 to 7, the reinforcing pad 220 is disposed at the upper left corner of the back of the flexible circuit board 200 as shown in the drawing, so that there is a greater influence of a greater thickness on the adhesive backed layer 120 at the right and lower edges of the reinforcing pad 220. The buffer tape 130 may be disposed at the right side of the reinforcing mat 220 and the lower side of the reinforcing mat 220, respectively, to compensate for the thickness difference of the right side edge and the lower side edge of the reinforcing mat 220.
In this embodiment, as shown in fig. 5, the back surface of the flexible circuit board 200 may be divided into a plurality of areas, where the back surface of the flexible circuit board 200 may be divided into an upper half portion and a lower half portion by using the reinforcing pad 220 as a contrast, the thickness of the reinforcing pad 220 disposed in the upper half portion of the flexible circuit board 200 is different from the positions of the remaining areas of the back surface of the upper half portion of the flexible circuit board 200 and the height of the lower half portion of the back surface of the flexible circuit board 200, so that according to the area division of the back surface of the flexible circuit board 200, the first adhesive layer 121 may be disposed in the upper half portion of the flexible circuit board 200, and the first adhesive layer 121 is divided into two portions by using the reinforcing pad 220 as a boundary, and the first adhesive layer 121 is separated from the reinforcing pad 220 as far as possible while the first adhesive layer 121 satisfies the bonding strength, so that the first buffer tape 131 may be disposed in the area between the reinforcing pad 220 and the first adhesive layer 121, and the thickness difference between the reinforcing pad 220 and the first adhesive layer 121 is compensated by the first buffer tape 131 is determined according to the thickness difference between the reinforcing pad 220 and the first adhesive layer 121; wherein, the thickness of the first buffer belt 131 is denoted as E1, the thickness of the first back adhesive layer 121 is denoted as H1, and the thickness of the reinforcing pad 220 area is denoted as F, and the thickness E1 of the first buffer belt 131 satisfies E1. Ltoreq.F-H1. The second adhesive backing layer 122 may be disposed at the lower half of fig. 5 of the flexible circuit board 200, and the second buffer tape 132 may be disposed at the region between the second adhesive backing layer 122 and the first adhesive backing layer 121 and the region between the second adhesive backing layer 122 and the reinforcing pad 220, the thickness difference between the second adhesive backing layer 122 and the reinforcing pad 220 may be compensated by the second buffer tape 132, and the thickness difference between the second adhesive backing layer 122 and the first adhesive backing layer 121 may be compensated by the second buffer tape 132, and the thickness of the second buffer tape 132 may be determined according to the thickness difference between the reinforcing pad 220 and the first adhesive backing layer 121 and the thickness difference between the first adhesive backing layer 121 and the second adhesive backing layer 122; the thickness of the second buffer tape 132 is denoted as E2, and the thickness of the second backing layer 122 is denoted as H2, the thickness E2 of the second buffer tape 132 is between (F-H2) to (H2-H1), that is, the thickness E2 of the second buffer tape 132 is between the thickness difference between the reinforcing pad 220 and the second backing layer 122, and the thickness difference between the first backing layer 121 and the second backing layer 122. In addition, the second adhesive layer 122 may be further divided into left and right parts, wherein the thickness of the left second adhesive layer 122 is determined according to the thickness difference between the reinforcing pad 220 and the back surface of the flexible circuit board 200, and the thickness of the right second adhesive layer 122 is determined according to the thickness difference between the first adhesive layer 121 and the back surface of the flexible circuit board 200.
As an alternative embodiment, the material of the buffer belt 130 is selected from any one or more of polyethylene terephthalate (PET), FOAM (FOAM), and graphite.
In the flexible circuit board 200 of the present application, the material of the buffer tape 130 may be selected from materials having a supporting effect, including, but not limited to, polyethylene terephthalate (PET), FOAM (FOAM), graphite. When graphite is used as one or more of the materials of the buffer zone 130, the buffer zone 130 can have the function of buffering the vertical distance between the relatively thick area and the relatively thin area, and also has the function of heat dissipation.
As an alternative embodiment, the buffer tape 130 is spaced from 0.1mm to 1.8mm from the boundary of each region on the flexible circuit board 200.
In the flexible circuit board 200 of the present application, the shape of the buffer tape 130 is not limited, and the corresponding shape of the buffer tape 130 may be set according to the technical capabilities of the suppliers, or may be adaptively adjusted according to the contour of the reinforcing pad 220 or other structures of the flexible circuit board 200. Optionally, the spacing between the buffer tape 130 and the boundary of each area on the flexible circuit board 200 is between 0.1mm and 1.8mm, so that on one hand, the positioning of the buffer tape 130 is facilitated, and error in thickness compensation caused by the buffer tape 130 crossing the boundary of each area is avoided, for example, the buffer tape 130 crossing the boundary of the reinforcing pad 220 makes the thickness of the reinforcing pad 220 higher, and on the contrary, the bending degree of the back adhesive 12 at the position is greater to generate pulling; on the other hand, the buffer tape 130 is prevented from crossing the boundaries of the regions to interfere with the regions, for example, the buffer tape 130 crosses the boundaries of the fingerprint holes 250 to interfere with the regions of the fingerprint holes 250; in addition, it may be convenient to offset the positioning error of the buffer belt 130, ensuring that the buffer belt 130 does not cross the boundaries of the regions within the positioning error.
As a further alternative embodiment, as shown in fig. 5, a finger hole 250 is formed on the flexible circuit board 200, an electronic shielding film 240 is laminated on the back surface of the flexible circuit board 200, and the electronic shielding film 240 avoids the finger hole 250 and a device corresponding area; wherein, the interval Q1 between the buffer tape 130 and the boundary 231 of the device corresponding region is 1.5+/-0.1 mm; the spacing Q2 between the buffer tape 130 and the boundary of the electron shielding film 240 is 0.5±0.1mm; the spacing Q3 between the buffer strip 130130 and the boundary of the fingerprint hole 250 is 0.2+ -0.1 mm; the spacing Q4, Q5, Q6 between the buffer tape 130130 and the boundary of the backsize layer 120 is 0.3±0.1mm; the spacing Q7 between the buffer tape 130130 and the boundary of the flexible circuit board 200 is 0.3±0.1mm.
As an alternative embodiment, the side of the buffer tape 130 adjacent to the flexible circuit board 200 is provided with an adhesive layer.
In this embodiment, an adhesive layer is disposed on a side of the buffer tape 130 adjacent to the flexible circuit board 200, that is, a single side of the buffer tape 130 is provided with adhesive, the adhesive surface is adhered to the flexible circuit board 200, and the non-adhesive surface is facing the heat dissipation film layer 360. Therefore, the buffer tape 130 can be adhered and fixed on the flexible circuit board 200 through the adhesive layer, so that the area provided with the buffer tape 130 can not be pulled by force after binding.
In the present application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" indicate orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.
It should be noted that all the directional indicators in the embodiments of the present application are only used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture, and if the specific posture is changed, the directional indicators are correspondingly changed.
In the present application, unless specifically stated and limited otherwise, the terms "connected," "affixed," and the like are to be construed broadly, and for example, "affixed" may be a fixed connection, a removable connection, or an integral body; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
Furthermore, descriptions such as those referred to as "first," "second," and the like, are provided for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implying an order of magnitude of the indicated technical features in the present disclosure. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Further, one skilled in the art can engage and combine the different embodiments or examples described in this specification.
In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present application.
While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the application, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. The utility model provides a flexible circuit board, its characterized in that, the front of flexible circuit board is equipped with the device district, the back of flexible circuit board have with the device corresponding area that the device district corresponds, the device corresponds the district and is equipped with the reinforcement pad, the back of flexible circuit board is equipped with the gum subassembly, the gum subassembly includes:
the buffer belt is positioned on the back surface of the flexible circuit board and is adjacent to the reinforcing pad;
and the back adhesive layer is arranged on the back surface of the flexible circuit board in a lamination manner and covers or avoids the buffer belt.
2. The flexible circuit board of claim 1, wherein the thickness of the buffer strip is less than the thickness of the reinforcement pad relative to the back side of the flexible circuit board.
3. The flexible circuit board of claim 1, wherein a thickness of the backsize layer corresponding to the reinforcement pad is different from a thickness of the backsize layer corresponding to a remaining area of the back side of the flexible circuit board.
4. The flexible circuit board of claim 1, wherein the backing layer is free of the buffer tape, the backing layer being separated into at least a first backing layer and a second backing layer bounded by the buffer tape.
5. The flexible circuit board of claim 4, wherein the first and second backsize layers have different thicknesses, and wherein the buffer tape has a thickness that is less than a thickness difference between the reinforcement pad and the adjacent first or second backsize layer.
6. The flexible circuit board of claim 1 wherein the material of the buffer tape is selected from any one or more of polyethylene terephthalate, foam, and graphite.
7. The flexible circuit board of claim 4 wherein the buffer tape is spaced from 0.1mm to 1.8mm from the boundaries of the regions on the flexible circuit board.
8. The flexible circuit board of claim 7, wherein a finger hole is formed in the flexible circuit board, an electronic shielding film is laminated on the back surface of the flexible circuit board, and the electronic shielding film avoids the finger hole and the device corresponding region; wherein, the interval between the boundary of the buffer zone and the corresponding area of the device is 1.5+/-0.1 mm; the spacing between the buffer tape and the boundary of the electron shielding film is 0.5+/-0.1 mm; the spacing between the buffer belt and the boundary of the fingerprint hole is 0.2+/-0.1 mm; the spacing between the buffer belt and the boundary of the gum layer is 0.3+/-0.1 mm; the spacing between the buffer tape and the boundary of the flexible circuit board is 0.3 + -0.1 mm.
9. The flexible circuit board of any of claims 1 to 8, wherein the buffer tape is provided with an adhesive layer on a side adjacent to the flexible circuit board.
10. A display device comprising the flexible circuit board according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211502781.5A CN116963378A (en) | 2022-11-28 | 2022-11-28 | Flexible circuit board and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211502781.5A CN116963378A (en) | 2022-11-28 | 2022-11-28 | Flexible circuit board and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116963378A true CN116963378A (en) | 2023-10-27 |
Family
ID=88455382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211502781.5A Pending CN116963378A (en) | 2022-11-28 | 2022-11-28 | Flexible circuit board and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116963378A (en) |
-
2022
- 2022-11-28 CN CN202211502781.5A patent/CN116963378A/en active Pending
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