CN116953987A - Backlight module and display device - Google Patents
Backlight module and display device Download PDFInfo
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- CN116953987A CN116953987A CN202310930737.2A CN202310930737A CN116953987A CN 116953987 A CN116953987 A CN 116953987A CN 202310930737 A CN202310930737 A CN 202310930737A CN 116953987 A CN116953987 A CN 116953987A
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- heat dissipation
- driving substrate
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- light
- connection
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 108
- 239000000758 substrate Substances 0.000 claims abstract description 100
- 239000012788 optical film Substances 0.000 claims abstract description 21
- 230000008054 signal transmission Effects 0.000 claims abstract description 5
- 230000007704 transition Effects 0.000 claims description 36
- 238000007789 sealing Methods 0.000 claims description 34
- 238000005476 soldering Methods 0.000 claims description 13
- 238000003466 welding Methods 0.000 claims description 12
- 239000010408 film Substances 0.000 description 16
- 238000010586 diagram Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 8
- 238000009792 diffusion process Methods 0.000 description 6
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- 238000005516 engineering process Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
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- 238000005859 coupling reaction Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 235000010446 mineral oil Nutrition 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133628—Illuminating devices with cooling means
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
Abstract
The embodiment of the application discloses a backlight module and a display device, which comprise an optical film layer and a light-emitting layer which are sequentially laminated, wherein the light-emitting layer is used for emitting light, the optical film layer is used for adjusting the direction of the light, the light-emitting layer comprises a light-emitting unit, a driving substrate and a heat dissipation layer, the light-emitting unit is arranged on one side of the driving substrate adjacent to the optical film layer, a driving circuit arranged on the driving substrate receives a driving signal from a signal transmission line to drive the light-emitting unit to emit the light, and the heat dissipation layer is arranged on one side of the driving substrate far away from the light-emitting unit and is used for dissipating heat of the driving substrate. By arranging the heat dissipation layer near the driving substrate in the light-emitting layer, the temperature of the driving substrate can be effectively reduced, and the running stability and safety of the backlight module can be improved.
Description
Technical Field
The present application relates to the field of display technologies, and in particular, to a backlight module and a display device.
Background
At present, a Mini LED display panel is a display technology with great development prospect, mini LED backlight refers to a high-order direct type backlight display technology and a product which are manufactured by adopting Mini LED chips (flip chips) or LED packaging devices (adopting forward or flip chips) and have local dimming, and by adopting a direct type design, mini LEDs are densely distributed in a large amount, so that the area dimming with a small range is realized, and compared with the traditional backlight technology, better brightness uniformity, higher color contrast ratio and thinner terminal products and higher color rendering property can be realized at the same time.
However, since the Mini LEDs are densely arranged, heat generated during image display is high, and under the condition of continuous operation, heat is gradually accumulated, so that the internal circuit structure of the driving substrate is easily affected, and further the display effect is affected, so that how to effectively maintain the Mini LED display panel in a lower temperature range during image display is a problem to be solved.
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, the present application provides a backlight module and a display device capable of effectively reducing the temperature of a driving substrate to ensure safety and operation stability.
The application provides a backlight module which comprises an optical film layer, a light-emitting layer and a back plate which are sequentially stacked, wherein the light-emitting layer is used for emitting light, the optical film layer is used for adjusting the direction of the light, and the back plate is used for laying a signal transmission line and supporting the light-emitting layer and the optical film layer. The light-emitting layer comprises a light-emitting unit, a driving substrate and a heat dissipation layer, wherein the light-emitting unit is arranged on one side, adjacent to the optical film layer, of the driving substrate, a driving circuit arranged on the driving substrate receives driving signals from the signal transmission line to drive the light-emitting unit to emit light, and the heat dissipation layer is arranged on one side, far away from the light-emitting unit, of the driving substrate and is used for dissipating heat of the driving substrate.
Optionally, a heat dissipation groove and a plurality of heat dissipation through holes are arranged on one side of the heat dissipation layer adjacent to the driving substrate, the heat dissipation groove is used for filling heat dissipation medium, the heat dissipation through holes are communicated with the heat dissipation groove and used for inputting the heat dissipation medium into the heat dissipation groove and outputting the heat dissipation medium out of the heat dissipation groove, and when the heat dissipation medium circularly flows in the heat dissipation groove, heat of the driving substrate is dissipated.
Optionally, the backlight module further includes a heat dissipating device, where the heat dissipating device includes a heat dissipating box and a heat dissipating tube, the heat dissipating box is located on a side of the back plate away from the optical film layer, and the heat dissipating tube is connected between the heat dissipating box and the heat dissipating through hole, and is used for conveying a heat dissipating medium in the heat dissipating box to the heat dissipating groove, and receiving the heat dissipating medium output from the heat dissipating groove.
Optionally, the backlight module further includes a sealing layer and a transition connecting plate, the sealing layer is disposed on one side of the heat dissipation layer away from the driving substrate, the heat dissipation layer includes a first connection through hole, the sealing layer includes a second connection through hole, the first connection through hole and the second connection through hole are disposed adjacently, the transition connecting plate is embedded in the first connection through hole and the second connection through hole, and is connected to the driving substrate through the first connection through hole, and is exposed on one side surface of the sealing layer away from the heat dissipation layer through the second connection through hole.
Optionally, the backlight module further includes a connection device, where the connection device is disposed on a side of the sealing layer away from the heat dissipation layer, and is connected to the transition connection board, and electrically connected to the driving substrate through the transition connection board, and the connection device is configured to provide electrical connection for a side of the sealing layer away from the heat dissipation layer
Optionally, the backlight module further includes a temperature sensing device, where the temperature sensing device is disposed on a side of the driving substrate away from the light emitting layer or disposed in the driving substrate, and is configured to detect a temperature of the driving substrate.
Optionally, when the temperature sensing device detects that the temperature of the driving substrate is greater than or equal to a first threshold temperature, the heat dissipating device controls the heat dissipating medium to flow at a first speed, and when the temperature sensing device detects that the temperature of the driving substrate is greater than or equal to a second threshold temperature, the heat dissipating device increases the flow rate of the heat dissipating medium from the first speed to a second speed so as to control the temperature of the driving substrate to be maintained within a preset range.
Optionally, a plurality of first welding pins and a plurality of first pins are arranged at positions, opposite to the first connecting through holes, of the transition connecting plate, a plurality of second welding pins and a plurality of second pins are arranged at one side, adjacent to the driving substrate, of the transition connecting plate, the first welding pins are correspondingly connected with the second welding pins, and the first pins are connected with the second pins;
the transition connecting plate is further provided with a plurality of third welding legs and a plurality of third pins adjacent to one side of the sealing layer, the connecting device is provided with a plurality of fourth welding legs and a plurality of fourth pins, the third welding legs are correspondingly connected with the fourth welding legs, and the third pins are correspondingly connected with the fourth pins.
Optionally, at least one driving control circuit is disposed on a side of the sealing layer away from the heat dissipation layer, and the driving control circuit is electrically connected to the connection device, and is electrically connected to the driving substrate through the connection device, so as to drive the light emitting element to emit light in cooperation with the driving substrate.
The application also provides a display device, which comprises a display panel and the backlight module, wherein the backlight module is used for providing a backlight source when the display panel displays images.
Compared with the prior art, the heat dissipation layer is arranged on one side of the driving substrate in the light-emitting layer, and part of the driving control circuit is arranged on one side of the sealing layer away from the heat dissipation layer, so that the heat dissipation layer is in full contact with the driving substrate, the heat dissipation effect is better, the safety of the backlight module when light rays are emitted is effectively ensured, the temperature of the driving substrate is in a preset range, and the running stability of the driving substrate is effectively ensured.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic cross-sectional view of a backlight module according to a first embodiment of the present application;
FIG. 2 is a schematic layout of the light emitting layer in FIG. 1;
FIG. 3 is a schematic view of a first planar structure of the heat dissipation layer in FIG. 2;
FIG. 4 is a schematic view of a second planar structure of the heat dissipation layer in FIG. 2;
FIG. 5 is a schematic diagram of a first planar layout of a driving substrate;
FIG. 6 is a schematic diagram of a connection of a transition connection plate to a drive substrate;
FIG. 7 is a schematic plan view of the transition web of FIG. 6;
FIG. 8 is a schematic diagram of a transition web assembly;
FIG. 9 is a schematic view of the connection structure of the connection device and the transition connection plate of FIG. 8;
FIG. 10 is a schematic plan view of the connector device of FIG. 9;
FIG. 11 is a schematic diagram showing a layout of a temperature sensing device in a backlight module;
fig. 12 is a schematic structural diagram of a display device according to a second embodiment of the present application.
Reference numerals:
the display device-100, the backlight module-1, the display panel-2, the optical film sheet layer-10, the first film sheet-11, the second film sheet-12, the third film sheet-13, the fourth film sheet-14, the light emitting layer-20, the light emitting unit-21, the driving substrate-22, the first soldering leg-221, the first pin-222, the heat dissipating layer-23, the heat dissipating groove-231, the heat dissipating through hole-232, the first connecting hole-233, the heat dissipating medium transferring port-234, the sealing layer-24, the connecting device-25, the fourth soldering leg-251, the fourth pin-252, the transition connecting plate-26, the second soldering leg-261, the second pin-262, the third soldering leg-263, the third pin-264, the back plate-30, the heat dissipating device-40, the heat dissipating tube-41, the heat dissipating box-42, and the temperature sensing device-50.
Detailed Description
In order that the application may be readily understood, a more complete description of the application will be rendered by reference to the appended drawings. The drawings illustrate preferred embodiments of the application. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
The following description of the embodiments refers to the accompanying drawings, which illustrate specific embodiments in which the application may be practiced. The numbering of the components itself, e.g. "first", "second", etc., is used herein merely to distinguish between the described objects and does not have any sequential or technical meaning. The term "coupled" as used herein includes both direct and indirect coupling (coupling), unless otherwise indicated. Directional terms, such as "upper", "lower", "front", "rear", "left", "right", "inner", "outer", "side", etc., in the present application are merely referring to the directions of the attached drawings, and thus, directional terms are used for better, more clear explanation and understanding of the present application, rather than indicating or implying that the apparatus or element being referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; may be a mechanical connection; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art. It should be noted that the terms "first," "second," and the like in the description and the claims of the present application and in the drawings are used for distinguishing between different objects and not for describing a particular sequential order.
Furthermore, the terms "comprises," "comprising," "includes," "including," or "having," when used in this specification, are intended to specify the presence of stated features, operations, elements, etc., but do not limit the presence of one or more other features, operations, elements, etc., but are not limited to other features, operations, elements, etc. Furthermore, the terms "comprises" or "comprising" mean that there is a corresponding feature, number, step, operation, element, component, or combination thereof disclosed in the specification, and that there is no intention to exclude the presence or addition of one or more other features, numbers, steps, operations, elements, components, or combinations thereof. Furthermore, when describing embodiments of the application, use of "may" means "one or more embodiments of the application. Also, the term "exemplary" is intended to refer to an example or illustration.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
Referring to fig. 1, fig. 1 is a schematic cross-sectional structure of a backlight module according to a first embodiment of the application.
As shown in fig. 1, the backlight module 1 includes an optical film layer 10, a light-emitting layer 20 and a back plate 30, which are sequentially stacked, wherein the light-emitting layer 20 is used for emitting light, the optical film layer 10 is used for adjusting the direction of the light emitted by the light-emitting layer 20, and the back plate 30 is used for laying signal transmission lines and providing support for the light-emitting layer 20 and the optical film layer 10.
The optical film layer 10 includes a first film 11, a second film 12, a third film 13, and a fourth film 14, which are sequentially stacked, wherein the first film 11 to the fourth film 14 are used for adjusting diffusion, refraction, and the like of light emitted from the light emitting layer 20.
In an exemplary embodiment, the first film 11 and the third film 13 may be diffusion sheets, the second film 12 may be prism sheets, that is, the prism sheets are sandwiched between the two diffusion sheets, the fourth film 14 may be a diffusion sheet, and the direction of the light emitted from the light emitting layer 20 is within a preset range by setting optical films such as the diffusion sheets, the prism sheets, and the diffusion sheets, and of course, the first film 11 to the fourth film 14 may also be set as other optical films according to specific needs, which is not limited in the present application.
The light emitting layer 20 includes a light emitting unit 21, a driving substrate 22, a heat dissipation layer 23, a sealing layer 24, and a connection device 25, wherein the plurality of light emitting units 21 are disposed on a side of the driving substrate 22 adjacent to the optical film layer 10, and the driving substrate 22 is used for outputting a driving signal to the light emitting unit 21 to drive the light emitting unit 21 to emit light. The heat dissipation layer 23 is disposed on a side of the driving substrate 22 away from the light emitting unit 21, and is used for dissipating heat from the driving substrate 22 when the driving substrate 22 drives the light emitting unit 21 to emit light, and the sealing layer 24 is disposed on a side of the heat dissipation layer 23 away from the driving substrate 22, and is used for sealing the heat dissipation layer 23.
The backlight module 1 further includes a heat dissipating device 40, the heat dissipating device 40 includes a heat dissipating tube 41 and a heat dissipating box 42, the heat dissipating tube 41 is connected between the heat dissipating box 42 and the heat dissipating layer 23, and the heat dissipating tube 41 is configured to circulate a heat dissipating medium stored in the heat dissipating box 42 between the heat dissipating box 42 and the heat dissipating layer 23, so that the heat dissipating layer 23 dissipates heat to the driving substrate 22.
In an exemplary embodiment, the heat dissipating device 40 may be a liquid cooling heat dissipating device, the heat dissipating medium is a heat dissipating cold liquid, and the heat dissipating cold liquid may be water, an electronic fluorinated liquid, a mineral oil, or the like, or may be any liquid with a better heat dissipating effect by controlling the heat dissipating tube 41 between the heat dissipating box 42 and the heat dissipating layer 23 to maintain the temperature of the heat dissipating layer 23 within a preset range, so that heat exchange is performed between the driving substrate 22 and the heat dissipating layer 23, and further, the temperature of the driving substrate 22 is reduced, and the problem that the internal circuit structure of the driving substrate 22 is heated and changed due to too high temperature of the driving substrate 22 is avoided, thereby affecting the display efficiency.
In an exemplary embodiment, the heat sink 40 may be an air-cooled heat sink, and the temperature of the driving substrate 22 is reduced by controlling the air flow between the heat sink 42 and the heat sink layer 23 to maintain the temperature of the heat sink layer 23 within a preset range.
Referring to fig. 2, fig. 2 is a schematic layout diagram of the light emitting layer in fig. 1.
As shown in fig. 2, a plurality of light emitting units 21 are arranged in an array on a side of the driving substrate 22 away from the heat dissipation layer 23, and the light emitting units 21 are configured to receive driving signals output by the driving substrate 22 to emit light with corresponding brightness.
The light-emitting layer 20 further includes a connection device 25 and a transition connection board 26, wherein the connection device 25 is disposed on a side of the sealing layer 24 away from the heat dissipation layer 23, and the transition connection board 26 penetrates through the heat dissipation layer 23 and the sealing layer 24 and is connected to the driving substrate 22, and the connection device 25 is connected to the transition connection board 26 and is connected to the driving substrate 22 via the transition connection board 26. Through setting up connecting device 25 in sealing layer 24 keep away from heat dissipation layer 23 one side to connect in drive base plate 22 through transition connecting plate 26, make the components and parts that will set up originally on drive base plate 22 set up in sealing layer 24 through connecting in device 25, namely set up components and parts in sealing layer 24 keep away from heat dissipation layer 23 one side, and through connecting device 25 electric connection in drive base plate 22, reduced the thickness of drive base plate 22 when realizing the drive function, thereby reduced the distance between drive base plate 22 and the heat dissipation layer 23, promoted the radiating effect to drive base plate 22.
Referring to fig. 3 and fig. 4 together, fig. 3 is a schematic view of a first planar structure of the heat dissipation layer in fig. 2, and fig. 4 is a schematic view of a second planar structure of the heat dissipation layer in fig. 2.
As shown in fig. 3, the first plane and the second plane are two planes disposed opposite to each other of the heat dissipation layer 23, wherein the first plane is a plane adjacent to the side of the driving substrate 22, and the second plane is a plane distant from the side of the driving substrate 22. In the first plane, the heat dissipation layer 23 includes a heat dissipation groove 231, a plurality of heat dissipation through holes 232, and at least one first connection through hole 233, wherein the heat dissipation groove 231 is filled with a heat dissipation medium, and the heat dissipation through holes 232 are connected to the heat dissipation groove 231 for delivering the heat dissipation medium to the heat dissipation groove 231. The first connection through-hole 233 is used for providing the transition connection plate 26.
As shown in fig. 4, in the second plane, the heat dissipation layer 23 further includes a plurality of heat dissipation medium transmission ports 234, wherein the heat dissipation medium transmission ports 234 include an inlet and an outlet, the inlet and the outlet are respectively connected to different heat dissipation through holes 232, and the heat dissipation pipe 41 is respectively connected to the heat dissipation groove 231 through the inlet and the outlet for circularly transmitting the heat dissipation medium into the heat dissipation groove 231 to dissipate heat of the driving substrate 22. Since the light emitting units 21 are densely arranged, the light emitting units 21 are main heat sources when emitting light, that is, heat needs to be dissipated near the light emitting units 21, and the heat dissipation grooves 231 are directly arranged on the side, far away from the light emitting units 21, of the driving substrate 22, so that heat in the light emitting units 21 and the driving substrate 22 can be taken away to the greatest extent when the heat dissipation medium flows in the heat dissipation grooves 231, and a better heat dissipation effect can be achieved.
In an exemplary embodiment, the number of the heat dissipation medium transferring ports 234 may be set according to specific needs, for example, according to a water flow speed and a heat dissipation effect, which is not limited by the present application.
In an exemplary embodiment, the heat dissipation layer 23 may be made of a resin material, or may be made of an aluminum alloy or stainless steel, and the heat dissipation grooves 231 may be formed by performing conventional turning, laser processing, hot press molding, or the like on the heat dissipation layer 23.
Referring to fig. 5 and fig. 6 together, fig. 5 is a schematic plan layout of a driving substrate, and fig. 6 is a schematic connection diagram of a transition connection board and the driving substrate.
As shown in fig. 5 and 6, the first plane of the driving substrate 22 is a plane facing the side of the heat dissipation layer 23, and in the first plane, the driving substrate 22 includes a plurality of first fillets 221 and a plurality of first pins 222, and the first fillets 221 and the first pins 222 are used for corresponding connection with the transition connection plates 26, and the connection devices 25 may be electrically connected to the driving substrate 22 by being connected with the transition connection plates 26.
Referring to fig. 7 and 8, fig. 7 is a schematic plan view of the transition connection plate in fig. 6, and fig. 8 is a schematic combined view of the transition connection plate.
As shown in fig. 7, the opposite sides of the transition connection board 26 are respectively provided with a second soldering leg 261, a second pin 262, a third soldering leg 263 and a third pin 264, wherein the second soldering leg 261 and the second pin 262 are adjacently arranged for respectively corresponding connection with the first soldering leg 221 and the first pin 222 in the driving substrate 22, and the third soldering leg 263 and the third pin 264 are adjacently arranged for connection with the connection device 25.
As shown in fig. 8, after the transition connection board 26 is correspondingly connected to the driving substrate 22, the transition connection board 26 is exposed on a side of the sealing layer 24 away from the heat dissipation layer 23 through the first connection through holes 233 in the heat dissipation layer 23 and the second connection through holes (not identified) in the sealing layer 24. The second solder leg 261 and the second pin 262 are disposed adjacent to the driving substrate 22, so as to be connected with the driving substrate 22 correspondingly, and the third solder leg 263 and the third pin 264 are disposed adjacent to the sealing layer 24, so as to be exposed on a side of the sealing layer 24 away from the heat dissipation layer 23, so as to be connected with the connection device 25.
Referring to fig. 9, fig. 9 is a schematic diagram illustrating a connection structure between the connection device and the transition connection board in fig. 8.
As shown in fig. 9, after the connection device 25 is connected with the transition connection board 26, the connection device 25 is located at a side of the sealing layer 24 away from the heat dissipation layer 23, and the connection device 25 is used for connecting components in the driving substrate 22, that is, by setting the connection device 25, a driving control circuit (not shown) and components such as a resistor and a capacitor, which are originally set in the driving substrate 22, can be set at a side of the sealing layer 24 away from the heat dissipation layer 23, and the driving control circuit and the components are electrically connected with the driving substrate 22 through the connection device 25 so as to cooperate with the driving substrate 22 to drive the light-emitting unit 21 to emit light, and because the components in the driving substrate 22 are set at the sealing layer 24, the thickness of the driving substrate 22 is reduced, thereby reducing the distance between the heat dissipation layer 23 and the driving substrate 22, improving the contact area between the driving substrate 22 and the heat dissipation layer 23, and further effectively improving the heat dissipation effect of the heat dissipation layer 23.
In an exemplary embodiment, a control circuit board may be disposed on a side of the sealing layer 24 away from the heat dissipation layer 23, and a plurality of driving control circuits and components such as resistors and capacitors may be disposed on the control circuit board, and the control circuit board is electrically connected to the driving substrate 22 through the connection device 25, so as to cooperate with the driving substrate 22 to drive the light emitting unit 21 to emit light.
Referring to fig. 10, fig. 10 is a schematic plan view of the connection device in fig. 9.
As shown in fig. 10, the connection device 25 includes a fourth leg 251 and a fourth leg 252, wherein the fourth leg 251 and the fourth leg 252 are correspondingly connected to a third leg 263 and a third leg 264 in the transition connection board 26.
Referring to fig. 11, fig. 11 is a schematic diagram illustrating a layout of a temperature sensing device in a backlight module.
As shown in fig. 11, the backlight module 1 further includes a temperature sensing device 50, where the temperature sensing device 50 is disposed on a side of the driving substrate 22 away from the optical film layer 10, and is configured to detect a current temperature of the driving substrate 22 when the driving substrate 22 drives the light emitting unit 21 to emit light. And the flow speed of the heat dissipation medium in the heat dissipation pipe can be adjusted according to the temperature detection result.
In an exemplary embodiment, a control module may be disposed in the heat dissipating device 40, for adjusting the flow speed of the heat dissipating medium according to the detection result of the temperature sensing device 50, so as to maintain the temperature of the driving substrate 22 within a preset range. For example, when the temperature sensing device 50 detects that the temperature is equal to or higher than the first threshold temperature, the heat dissipating device 40 controls the heat dissipating medium to flow at a first speed, and when the temperature sensing device 50 detects that the temperature is equal to or higher than the second threshold temperature, the heat dissipating device 40 controls the flow speed of the heat dissipating medium to rise from the first speed to a second speed, so as to increase the heat dissipating efficiency. Wherein the first threshold temperature is less than the second threshold temperature. By reducing the flow speed of the heat dissipation medium when the temperature is low, the running power of the heat dissipation device 40 can be reduced, so that the power consumption is reduced, the flow speed of the heat dissipation medium is increased when the temperature is high, the heat dissipation effect of the heat dissipation device 40 is improved, and the driving capability deterioration caused by the overhigh temperature of the driving substrate 22 is effectively avoided.
In the exemplary embodiment, the temperature sensing device 50 may be disposed at other positions according to specific needs, for example, the temperature sensing device 50 may be disposed adjacent to the light emitting unit 21, the temperature sensing device 50 may be embedded in the driving substrate 22, and the like, which is not limited in the present application.
Referring to fig. 12, fig. 12 is a schematic structural diagram of a display device according to a second embodiment of the application. As shown in fig. 12, the display device 100 includes a backlight 1 and a display panel 2, the backlight 1 and the display panel 2 are stacked, and the backlight 1 is used to provide a backlight source when the display panel 2 displays an image.
It is to be understood that the application is not limited in its application to the examples described above, but is capable of modification and variation in light of the above teachings by those skilled in the art, and that all such modifications and variations are intended to be included within the scope of the appended claims.
Claims (10)
1. The backlight module comprises an optical film layer and a light-emitting layer which are sequentially stacked, wherein the light-emitting layer is used for emitting light, and the optical film layer is used for adjusting the direction of the light;
the light-emitting device is characterized in that the light-emitting layer comprises a light-emitting unit, a driving substrate and a heat dissipation layer, the light-emitting unit is arranged on one side, adjacent to the optical film layer, of the driving substrate, a driving circuit arranged on the driving substrate receives driving signals from the signal transmission line to drive the light-emitting unit to emit light, and the heat dissipation layer is arranged on one side, far away from the light-emitting unit, of the driving substrate and is used for dissipating heat of the driving substrate.
2. The backlight module according to claim 1, wherein a heat dissipation groove and a plurality of heat dissipation through holes are formed on a side of the heat dissipation layer adjacent to the driving substrate, the heat dissipation groove is used for filling heat dissipation medium, the heat dissipation through holes are communicated with the heat dissipation groove and used for inputting the heat dissipation medium into the heat dissipation groove and outputting the heat dissipation medium out of the heat dissipation groove, and when the heat dissipation medium circularly flows in the heat dissipation groove, heat of the driving substrate is dissipated.
3. The backlight module according to claim 2, further comprising a heat dissipating device, wherein the heat dissipating device comprises a heat dissipating box and a heat dissipating tube, the heat dissipating box is located at a side of the back plate away from the optical film layer, and the heat dissipating tube is connected between the heat dissipating box and the heat dissipating through hole, and is configured to convey a heat dissipating medium in the heat dissipating box into the heat dissipating groove, and receive the heat dissipating medium output from the heat dissipating groove.
4. A backlight module according to claim 3, further comprising a sealing layer and a transition connection plate, wherein the sealing layer is disposed on a side of the heat dissipation layer away from the driving substrate, the heat dissipation layer comprises a first connection through hole, the sealing layer comprises a second connection through hole, the first connection through hole and the second connection through hole are disposed adjacently, the transition connection plate is embedded in the first connection through hole and the second connection through hole, is connected to the driving substrate through the first connection through hole, and is exposed on a surface of the sealing layer away from the heat dissipation layer through the second connection through hole.
5. The backlight module according to claim 4, further comprising a connection device disposed on a side of the sealing layer away from the heat dissipation layer and connected to the transition connection board, the connection device being electrically connected to the driving substrate via the transition connection board, the connection device being configured to provide electrical connection to the side of the sealing layer away from the heat dissipation layer.
6. The backlight module according to claim 5, further comprising a temperature sensing device disposed on a side of the driving substrate away from the light emitting layer or disposed in the driving substrate, for detecting a temperature of the driving substrate.
7. The backlight module according to claim 6, wherein,
when the temperature sensing device detects that the temperature of the driving substrate is greater than or equal to a first threshold value, the heat dissipating device controls the heat dissipating medium to flow at a first speed, and when the temperature sensing device detects that the temperature of the driving substrate is greater than or equal to a second threshold value, the heat dissipating device increases the flow rate of the heat dissipating medium from the first speed to a second speed so as to control the temperature of the driving substrate to be maintained within a preset range.
8. The backlight module according to claim 7, wherein a plurality of first soldering feet and a plurality of first pins are arranged at positions, opposite to the first connecting through holes, of the transition connecting plate, a plurality of second soldering feet and a plurality of second pins are arranged at one side, adjacent to the driving substrate, of the transition connecting plate, the first soldering feet are correspondingly connected with the second soldering feet, and the first pins are connected with the second pins;
the transition connecting plate is further provided with a plurality of third welding legs and a plurality of third pins adjacent to one side of the sealing layer, the connecting device is provided with a plurality of fourth welding legs and a plurality of fourth pins, the third welding legs are correspondingly connected with the fourth welding legs, and the third pins are correspondingly connected with the fourth pins.
9. The backlight module according to claim 8, wherein at least one driving control circuit is disposed on a side of the sealing layer away from the heat dissipation layer, and the driving control circuit is electrically connected to the connection device and is electrically connected to the driving substrate through the connection device, so as to drive the light emitting element to emit light in cooperation with the driving substrate.
10. A display device comprising a display panel and a backlight module according to any one of claims 1-9 for providing a backlight source for image display of the display panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310930737.2A CN116953987A (en) | 2023-07-25 | 2023-07-25 | Backlight module and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310930737.2A CN116953987A (en) | 2023-07-25 | 2023-07-25 | Backlight module and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116953987A true CN116953987A (en) | 2023-10-27 |
Family
ID=88444235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310930737.2A Pending CN116953987A (en) | 2023-07-25 | 2023-07-25 | Backlight module and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116953987A (en) |
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2023
- 2023-07-25 CN CN202310930737.2A patent/CN116953987A/en active Pending
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