CN116953333A - High-frequency near-field current sensor and probe - Google Patents

High-frequency near-field current sensor and probe Download PDF

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Publication number
CN116953333A
CN116953333A CN202310946271.5A CN202310946271A CN116953333A CN 116953333 A CN116953333 A CN 116953333A CN 202310946271 A CN202310946271 A CN 202310946271A CN 116953333 A CN116953333 A CN 116953333A
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China
Prior art keywords
measuring coil
current sensor
field current
high frequency
coil
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Pending
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CN202310946271.5A
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Chinese (zh)
Inventor
傅荣颢
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Yaoxin Microelectronics Technology Shanghai Co ltd
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Yaoxin Microelectronics Technology Shanghai Co ltd
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Priority to CN202310946271.5A priority Critical patent/CN116953333A/en
Publication of CN116953333A publication Critical patent/CN116953333A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R19/00Arrangements for measuring currents or voltages or for indicating presence or sign thereof
    • G01R19/0092Arrangements for measuring currents or voltages or for indicating presence or sign thereof measuring current only
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R15/00Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
    • G01R15/14Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
    • G01R15/18Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using inductive devices, e.g. transformers
    • G01R15/181Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using inductive devices, e.g. transformers using coils without a magnetic core, e.g. Rogowski coils

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Measuring Instrument Details And Bridges, And Automatic Balancing Devices (AREA)

Abstract

The application provides a high-frequency near-field current sensor and a probe, which comprises: measuring coil, shielding shell and signal processing module, wherein: the measuring coil is used for closely contacting the device to be measured to obtain a high-frequency induction signal, wherein the placement angle of the measuring coil is perpendicular to the working current direction of the device to be measured; the shielding shell is arranged outside the measuring coil and used for insulating and protecting the measuring coil; the signal processing module is connected with the output end of the measuring coil, and performs error elimination on the high-frequency induction signal to acquire working current parameters of the device to be measured in the first time. The high-frequency current measuring device can directly measure the wiring of the circuit board and the high-frequency current of the pins of the surface mount device, obtains the working current parameters of the device to be measured at the first time, and has great practical value in the optimal design of the device to be measured. Simple structure, easy and simple to handle, have extensive suitability.

Description

High-frequency near-field current sensor and probe
Technical Field
The application relates to the technical field of sensor design and application, in particular to a high-frequency near-field current sensor and a probe.
Background
The current probe is an electrical device for measuring direct current and alternating current, such as high-speed transient state, pulse current or power frequency sinusoidal current. The current probe comprises an ultrahigh frequency high bandwidth coaxial noninductive shunt, a pearson coil, an oscilloscope AC/DC high frequency probe, a Hall device and a Rogowski coil (a coil named as Walter Rogowski of German physicist), wherein the high frequency high bandwidth coaxial noninductive shunt has the advantages of excellent performance, capability of measuring DC signals with the GHz bandwidth level and limitation of a testing environment because the high frequency high bandwidth coaxial noninductive shunt is required to be connected in series to a circuit to be tested; the pearson coil has the advantages of no need of being connected in series to a circuit to be tested, good isolation and extremely large size, and is difficult to measure a microcircuit system; the AC/DC high-frequency probe of the oscilloscope has the defects of overlarge volume, difficult measurement of a miniature circuit system and limited measuring range; hall devices are difficult to operate in high frequency environments; the rogowski coil is the most flexible and convenient high-frequency current measuring tool at present, the minimum wire diameter can be 1 mm, and the rogowski coil can be conveniently sleeved on the lead wires or the semiconductor pins of most devices to be measured, but cannot measure high-frequency current in the test environment of the wiring of a printed circuit board and the pins of a patch device.
It should be noted that the foregoing description of the background art is only for the purpose of providing a clear and complete description of the technical solution of the present application and is presented for the convenience of understanding by those skilled in the art. The above-described solutions are not considered to be known to the person skilled in the art simply because they are set forth in the background of the application section.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, an object of the present application is to provide a high-frequency near-field current sensor and probe for solving the problem that the high-frequency current measurement is difficult to be performed on the wiring of the printed circuit board and the pins of the chip device in the prior art.
To achieve the above and other related objects, the present application provides a high-frequency near-field current sensor including at least: measuring coil, shielding shell and signal processing module, wherein:
the measuring coil is used for closely contacting the device to be measured to obtain a high-frequency induction signal, wherein the placement angle of the measuring coil is perpendicular to the working current direction of the device to be measured;
the shielding shell is arranged outside the measuring coil and used for insulating and protecting the measuring coil;
the signal processing module is connected with the output end of the measuring coil, and performs error elimination on the high-frequency induction signal to acquire working current parameters of the device to be measured in the first time.
Optionally, the measurement coil comprises an air core coil.
Optionally, the measuring coilThe maximum width of the cross section is between 0.5 mm and 1.5 mm.
Optionally, the number of turns of the measuring coil is between 100 turns and 1000 turns.
Optionally, the shape of the cross section of the measuring coil includes: round, rectangular, regular hexagonal, regular octagonal, oval.
Optionally, the bandwidth of the high frequency induction signal is between 10Hz and 200 MHz.
Optionally, the device under test includes: wiring of the printed circuit board and pins of the chip device.
Optionally, the allowable working temperature of the shielding shell is more than or equal to 105 ℃.
Optionally, the signal processing module comprises an integration processing circuit.
To achieve the above and other related objects, the present application provides a probe including the high frequency near field current sensor for measuring an operating current parameter of a device under test.
As described above, the high-frequency near-field current sensor and the probe have the following beneficial effects:
1) The high-frequency near-field current sensor and the probe can directly measure the wiring of the circuit board and the high-frequency current of the pins of the patch device, acquire the working current parameters of the device to be tested in the first time, and have great practical value for the optimal design of the device to be tested.
2) The high-frequency near-field current sensor and the probe have the advantages of simple structure, simplicity and convenience in operation and wide applicability.
Drawings
Fig. 1 shows a schematic structural diagram of an exemplary rogowski coil according to the present application.
Fig. 2 shows a schematic diagram of a high frequency near field current sensor according to the present application.
Fig. 3 is a schematic diagram showing a measured waveform of the high-frequency near-field current sensor according to the present application.
Fig. 4 shows a schematic diagram of the measured waveform of the probe of the present application.
Description of the reference numerals
11. Rogowski coil
2. High-frequency near-field current sensor
21. Measuring coil
22. Signal processing module
23. Device under test
Detailed Description
Other advantages and effects of the present application will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present application with reference to specific examples. The application may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present application.
Please refer to fig. 1 to 4. It should be noted that the illustrations provided in the present embodiment merely illustrate the basic concept of the present application by way of illustration, and only the components related to the present application are shown in the drawings and are not drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of the components in actual implementation may be arbitrarily changed, and the layout of the components may be more complicated.
Fig. 1 shows a schematic structural diagram of a rogowski coil. The conventional rogowski coil is arranged in such a manner that a uniform coil winding is performed on a non-magnetic framework with a constant cross-sectional area, the non-magnetic framework and the coil wound on the non-magnetic framework form a rogowski coil 11, the coil returns to a starting point along a central axis of the non-magnetic framework, the starting point of the coil outputs an induction signal, and a device to be tested is a conductor. An alternating or pulsed current in the conductor generates a magnetic field, and the interaction of the magnetic field with the rogowski coil causes the rogowski coil to generate an inductive signal that is proportional to the rate of change of the current generated by the conductor under test. In order to obtain an output voltage proportional to the induced signal, an integrating device is usually connected at the starting point, which integrates the induced signal to obtain an output voltage, the output voltage proportional to the induced signal being linear throughout a wideband, which is defined as the frequency range from the starting frequency to the cut-off frequency. At low frequencies the gain of the integrator increases, theoretically as the frequency approaches zero, the gain of the integrator becomes infinite, which will lead to unacceptable dc drift and low frequency noise; therefore, the gain of the integrator needs to be limited to low frequencies, which is achieved by connecting a low pass filter in parallel with the integrating capacitance. The distributed inductance and the distributed capacitance of the rogowski coil enable the rogowski coil to be in a high frequency bandwidth, and the range of the high frequency bandwidth is usually 10MHz or more, so that the high frequency induction signal can be measured. The output voltage generated by the integrator is detected by using a testing device, wherein the testing device comprises an oscilloscope, and the working current parameters (such as current waveform and other parameters) of the device to be tested are obtained by detecting the output voltage, so that the performance of the device to be tested is analyzed, and the device to be tested is conveniently optimized. However, rogowski coils cannot measure the wiring of a printed circuit board and the pins of a chip device.
Therefore, the application provides a high-frequency near-field current sensor and a probe, which are implemented as follows:
as shown in fig. 2, the present embodiment provides a high-frequency near-field current sensor 2, the high-frequency near-field current sensor 2 including: a measuring coil 21, a shielding housing (the shielding housing is not shown in fig. 2) and a signal processing module 22, wherein:
as shown in fig. 2, the measuring coil 21 is used for closely contacting the device under test 23 to obtain a high-frequency induction signal, wherein the placement angle of the measuring coil 21 is perpendicular to the working current direction of the device under test 23. It should be noted that, the placement angle of the measurement coil 21 is perpendicular to the direction of the working current of the device under test 23, so that the measurement coil 21 obtains the maximum induced magnetic field and thus the maximum induced electric field, so as to perform parameter measurement through the test device. The measurement coil 21 makes emergency contact with the device under test 23 in order to minimize the attenuation of the induced magnetic field.
Specifically, as an example, the measurement coil 21 includes an air core coil; the maximum width of the cross section of the measuring coil 21 is between 0.5 mm and 1.5 mm, and it should be noted that the coil is generally cylindrical in shape, i.e. the cross section of the coil is circular, and the maximum width of the cross section of the measuring coil 21 is equal to the outer diameter of the cylinder x 2; if the cross section of the coil is square, the maximum width of the cross section of the measuring coil 21 is equal to the side length of the square; if the cross section of the coil is a regular hexagon, the maximum width of the cross section of the measuring coil 21 is equal to the height of the regular hexagon; the number of turns of the measuring coil 21 is between 100 turns and 1000 turns; the shape of the cross section of the measuring coil includes: round, rectangular, regular hexagonal, regular octagonal, oval. The Quality Factor is a physical quantity used for describing the energy consumption characteristics of a resonant circuit or a mechanical system, in the circuit, the Quality Factor is a physical quantity used for describing the energy consumption characteristics of the resonant circuit or the mechanical system, the higher the value is, the better the device can store and release energy without loss, and the higher the sharpness of circuit response is, in the mechanical system, the Quality Factor describes the vibration response capability of the system, the higher the value is, the lower the vibration attenuation speed of the system is, the longer the vibration duration is, the further the Quality Factor is an important parameter describing the performance of the resonator, the larger the Quality Factor is, the narrower the response bandwidth is, the better the Quality Factor is suitable for being applied to the implementation of the corresponding Quality Factor, and the like, and the Quality Factor is suitable for being directly matched with the characteristics of the resonant circuit, such as the high-frequency Quality Factor is suitable for being used for realizing the direct control of the Quality Factor. It should be noted that, the measuring coil 21 includes, but is not limited to, an air core coil, and a high frequency choke coil may be used, so long as the measuring coil can be used to closely contact the device to be measured to obtain a high frequency induction signal, and any arrangement form of the measuring coil 21 is suitable and is not limited to the present embodiment.
The mutual inductance and self inductance of the measuring coil 21 linearly increase with the increase of the wire diameter (the wire diameter refers to the diameter of the wire of the measuring coil) within a constraint range, and the increasing speed becomes slow when the wire diameter exceeds a certain range. Meanwhile, the internal resistance of the measuring coil 21 increases linearly with the increase of the wire diameter, and the increasing multiple of mutual inductance and self inductance is larger than the increasing multiple of the internal resistance. The equivalent capacitance of the measuring coil 21 increases gradually with increasing wire diameter. When the wire diameter of the measuring coil 21 is small, the number of turns is also small. The mutual inductance, internal resistance and self-inductance of the measuring coil 21 increase and decrease with increasing wire diameter, which is caused by two factors, one of which is that the cross-sectional area of the measuring coil 21 decreases with increasing wire diameter; secondly, the increase of the wire diameter gradually increases the number of turns. The reduction of the cross-sectional area leads the mutual inductance, the internal resistance and the self-inductance to have a reduced trend; the increase of the number of turns causes the mutual inductance, the internal resistance and the self-inductance to have an increasing trend, and the mutual inductance, the internal resistance and the self-inductance of the measuring coil 21 are increased and then reduced under the combined action of the two aspects. The equivalent capacitance decreases with increasing wire diameter and changes faster and faster. Thus, the wire diameter of the measuring coil 21 includes, but is not limited to, between 0.5 mm and 1.5 mm; the number of turns of the measuring coil 21 includes, but is not limited to, between 100 turns and 1000 turns, and the wire diameter and the number of turns of the measuring coil 21 need to be set according to the actual environment, which is not described in detail herein.
The shape of the measuring coil 21 affects the uniformity of the induced magnetic field, the more regular the shape, the better the uniformity of the magnetic field, and the more stable the strength of the generated high frequency induced signal, and thus the shape of the measuring coil 21 includes, but is not limited to: the shape of the measuring coil 21 is not limited to this embodiment, as long as it can generate a uniform magnetic field.
Specifically, as an example, the bandwidth of the high frequency induction signal is between 10MHz and 200 MHz. It should be noted that, the range of the high frequency bandwidth is usually 10MHz or more, and the frequency of the sensing signal is determined by the working current of the device under test and the parameters of the measuring coil 21, and the specific working process is not described herein.
Specifically, as an example, the device under test includes: wiring of the printed circuit board and pins of the chip device. It should be noted that, due to the special arrangement of the rogowski coil, the wiring of the printed circuit board and the pins of the chip device cannot be directly measured, so that the rogowski coil is limited to be applied in the micro integrated circuit system, but the high-frequency near-field current sensor of the embodiment can acquire the high-frequency induction signal in the first time through the close contact between the measuring coil 21 and the device 23 to be measured, and has great application value.
The shielding housing is arranged outside the measuring coil 21 and protects the measuring coil 21 in an insulating manner, wherein the shielding housing is not shown in fig. 2. Specifically, as an example, the shield case allows an operating temperature of 105 degrees celsius or more. It should be noted that, the measure index of the shielding shell is insulation grade, and the insulation grade specifically refers to heat-resistant grade of the shielding shell, and the insulation grade is respectively as follows according to the temperature size arrangement: stage Y, stage a, stage E, stage B, stage F, stage H and stage C, respectively, which allow operating temperatures of: 90 degrees celsius, 105 degrees celsius, 120 degrees celsius, 130 degrees celsius, 155 degrees celsius, 180 degrees celsius, and above 180 degrees celsius. The shielding case is related to the thickness of the material in addition to the material, and different materials and thicknesses may affect the induced magnetic field generated by the measuring coil 21 and thus affect the high-frequency induction signal, so the shielding case should be set according to the actual situation, and the present embodiment is not limited thereto.
As shown in fig. 2, the signal processing module 22 is connected to the output end of the measuring coil 21, and performs error elimination on the high-frequency induction signal to obtain the working current parameter of the device under test at the first time. Specifically, as an example, the signal processing module 22 includes an integration processing circuit. It should be noted that, the integrating processing circuit is configured to integrate the high-frequency induction signal to obtain an output voltage, where the output voltage is proportional to the high-frequency induction signal, and the output signal is easier to observe through the testing device. Further, the signal processing module 22 may also be set by using a fitting circuit, and specific operation processes are not described herein, so long as the error of the high-frequency induction signal can be eliminated to obtain the working current parameter of the device to be tested at the first time, any setting form of the signal processing module 22 is applicable, and the embodiment is not limited thereto.
As an example, fig. 3 shows a schematic diagram of an actual measurement waveform of the high-frequency near-field current sensor according to the present embodiment, where a channel 3 shows a standard waveform when a device to be tested works, where the device to be tested is a power device packaged by a patch, and the standard waveform is fitted by an oscilloscope; channel 1 shows that the waveform of the device to be tested is acquired at the first time by the high-frequency near-field current sensor according to the embodiment and acquired by an oscilloscope; channel 2 shows waveforms of the device under test acquired by the 30MHz rogowski coil, wherein the patch of the device under test cannot be soldered on a printed circuit board when the rogowski coil is used, and measurement is required by extending leads of three pins of the device under test. It can be seen that the waveform obtained by using the high-frequency near-field current sensor is more similar to the standard waveform, that is, the performance of the high-frequency near-field current sensor according to the present embodiment is better than that of the rogowski coil.
The embodiment also provides a probe, which comprises the high-frequency near-field current sensor and is used for measuring the working current parameters of the device to be measured. It should be noted that the device under test includes: wiring of the printed circuit board and pins of the chip device.
As an example, fig. 4 shows a schematic diagram of the actual measurement waveform of the probe of the present embodiment. It can be seen that the waveform of the device to be measured by the probe almost coincides with the standard waveform, so the probe of the embodiment has wide application value.
In summary, the high-frequency near-field current sensor and probe of the present application includes: measuring coil, shielding shell and signal processing module, wherein: the measuring coil is used for closely contacting the device to be measured to obtain a high-frequency induction signal, wherein the placement angle of the measuring coil is perpendicular to the working current direction of the device to be measured; the shielding shell is arranged outside the measuring coil and used for insulating and protecting the measuring coil; the signal processing module is connected with the output end of the measuring coil, and performs error elimination on the high-frequency induction signal to acquire working current parameters of the device to be measured in the first time. The high-frequency near-field current sensor and the probe can directly measure the wiring of the circuit board and the high-frequency current of the pins of the patch device, acquire the working current parameters of the device to be tested in the first time, and have great practical value for the optimal design of the device to be tested. The high-frequency near-field current sensor and the probe have the advantages of simple structure, simplicity and convenience in operation and wide applicability. Therefore, the application effectively overcomes various defects in the prior art and has high industrial utilization value.
The above embodiments are merely illustrative of the principles of the present application and its effectiveness, and are not intended to limit the application. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the application. Accordingly, it is intended that all equivalent modifications and variations of the application be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.

Claims (10)

1. A high frequency near field current sensor, the high frequency near field current sensor comprising at least: measuring coil, shielding shell and signal processing module, wherein:
the measuring coil is used for closely contacting the device to be measured to obtain a high-frequency induction signal, wherein the placement angle of the measuring coil is perpendicular to the working current direction of the device to be measured;
the shielding shell is arranged outside the measuring coil and used for insulating and protecting the measuring coil;
the signal processing module is connected with the output end of the measuring coil, and performs error elimination on the high-frequency induction signal to acquire working current parameters of the device to be measured in the first time.
2. The high frequency near field current sensor of claim 1, wherein: the measurement coil comprises an air core coil.
3. The high frequency near field current sensor of claim 1, wherein: the maximum width of the cross section of the measuring coil is between 0.5 mm and 1.5 mm.
4. The high frequency near field current sensor of claim 1, wherein: the number of turns of the measuring coil is between 100 turns and 1000 turns.
5. The high frequency near field current sensor of claim 1, wherein: the shape of the cross section of the measuring coil includes: round, rectangular, regular hexagonal, regular octagonal, oval.
6. The high frequency near field current sensor of claim 1, wherein: the bandwidth of the high frequency induction signal is between 10Hz and 200 MHz.
7. The high frequency near field current sensor of claim 1, wherein: the device under test includes: wiring of the printed circuit board and pins of the chip device.
8. The high frequency near field current sensor of claim 1, wherein: the allowable working temperature of the shielding shell is more than or equal to 105 ℃.
9. The high frequency near field current sensor of claim 1, wherein: the signal processing module includes an integration processing circuit.
10. A probe, characterized in that: the probe comprises a high frequency near field current sensor according to any one of claims 1-9 for measuring an operating current parameter of a device under test.
CN202310946271.5A 2023-07-28 2023-07-28 High-frequency near-field current sensor and probe Pending CN116953333A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310946271.5A CN116953333A (en) 2023-07-28 2023-07-28 High-frequency near-field current sensor and probe

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Application Number Priority Date Filing Date Title
CN202310946271.5A CN116953333A (en) 2023-07-28 2023-07-28 High-frequency near-field current sensor and probe

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013045778A1 (en) * 2011-09-26 2013-04-04 Neelogy Contactless current sensor
CN111741419A (en) * 2020-08-21 2020-10-02 瑶芯微电子科技(上海)有限公司 Bone conduction sound processing system, bone conduction microphone and signal processing method thereof
CN111856345A (en) * 2020-04-16 2020-10-30 中国电力科学研究院有限公司 Broadband magnetic field sensor device and method for measuring impulse current
CN214750773U (en) * 2020-11-23 2021-11-16 中国电力科学研究院有限公司 Broadband magnetic field sensor for measuring impulse current

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013045778A1 (en) * 2011-09-26 2013-04-04 Neelogy Contactless current sensor
CN111856345A (en) * 2020-04-16 2020-10-30 中国电力科学研究院有限公司 Broadband magnetic field sensor device and method for measuring impulse current
CN111741419A (en) * 2020-08-21 2020-10-02 瑶芯微电子科技(上海)有限公司 Bone conduction sound processing system, bone conduction microphone and signal processing method thereof
CN214750773U (en) * 2020-11-23 2021-11-16 中国电力科学研究院有限公司 Broadband magnetic field sensor for measuring impulse current

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