CN116948580A - Bi-component epoxy adhesive plate glue and preparation method and application thereof - Google Patents

Bi-component epoxy adhesive plate glue and preparation method and application thereof Download PDF

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Publication number
CN116948580A
CN116948580A CN202310648116.5A CN202310648116A CN116948580A CN 116948580 A CN116948580 A CN 116948580A CN 202310648116 A CN202310648116 A CN 202310648116A CN 116948580 A CN116948580 A CN 116948580A
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parts
component
weight
epoxy
mixing
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温科雄
李增增
陈贵宝
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Guangdong Shuangke New Materials Co ltd
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Guangdong Shuangke New Materials Co ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/66—Mercaptans
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Polymers & Plastics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Electromagnetism (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)

Abstract

The invention provides a bi-component epoxy plate adhesive, a preparation method and application thereof, and relates to the technical field of plate adhesives in the photovoltaic industry, wherein the bi-component epoxy plate adhesive comprises a component A and a component B; the component A is mainly prepared from the following components in parts by weight: 45-65 parts of bisphenol A epoxy resin, 2-10 parts of flexible epoxy resin, 5-20 parts of diluent and 30-70 parts of filler; the component B is mainly prepared from the following components in parts by weight: 20-65 parts of modified polythiol, 1-10 parts of vinylamine modified aromatic amine, 30-70 parts of filler, 0.1-1 part of coupling agent and 1-8 parts of retarder. The invention solves the technical problems that the glue in the prior art is difficult to meet the production requirement of automatic sticky boards due to long usable time, slow positioning and low efficiency, and achieves the technical effects of accelerating the positioning time, improving the automatic production efficiency and reducing the cost on the basis of ensuring the performance and enough operation time of the glue.

Description

Bi-component epoxy adhesive plate glue and preparation method and application thereof
Technical Field
The invention relates to the technical field of plate sticking glue for upstream silicon rod slicing of solar cells, in particular to a bi-component epoxy plate sticking glue and a preparation method and application thereof.
Background
Because of the rapid updating of the technology, most manufacturers have started automatic upgrading and reconstruction of layout, and the existing glue on the market has the problems of long service time, slow positioning, low efficiency and the like, so that the production requirement of automatic sticky plates is difficult to meet.
In view of this, the present invention has been made.
Disclosure of Invention
The invention aims to provide a bi-component epoxy plate adhesive, which can accelerate positioning time, improve automatic production efficiency and reduce cost on the basis of ensuring the performance of the adhesive and enough operation time.
The second purpose of the invention is to provide a preparation method of the bi-component epoxy plate adhesive, which has simple and efficient process and is suitable for industrial production.
The invention further aims to provide an application of the bi-component epoxy plate adhesive, which can meet the requirement of automatic production, improve the yield of a production line and improve the production efficiency.
In order to achieve the above object of the present invention, the following technical solutions are specifically adopted:
in a first aspect, a two-component epoxy board adhesive comprises an A component and a B component;
the component A is mainly prepared from the following components in parts by weight:
45-65 parts of bisphenol A epoxy resin, 2-10 parts of flexible epoxy resin, 5-20 parts of diluent and 30-70 parts of filler;
the component B is mainly prepared from the following components in parts by weight:
20-65 parts of modified polythiol, 1-10 parts of vinylamine modified aromatic amine, 30-70 parts of filler, 0.1-1 part of coupling agent and 1-8 parts of retarder.
Further, the weight ratio of the component A to the component B is 1:1, a step of;
preferably, the diluent comprises a long chain reactive diluent;
preferably, the long chain reactive diluent comprises one or two of 1, 4-butanediol glycidyl ether and carbon dodecyl-carbon tetradecyl glycidyl ether;
preferably, the flexible epoxy includes one or both of the commercially available 171, 172.
Further, the preparation raw materials of the component A also comprise the following components in parts by weight:
0.05 to 1 part of anti-settling agent, 0.1 to 1 part of defoamer and 1 to 10 parts of foaming agent.
Further, the preparation raw materials of the component A also comprise 1-15 parts of titanium dioxide according to parts by weight.
Further, the preparation raw materials of the component B also comprise the following components in parts by weight:
1 to 10 parts of accelerator, 0.2 to 1 part of color paste, 0.1 to 1 part of defoamer and 0.05 to 1 part of anti-settling agent.
Further, the retarder includes a cycloaliphatic polymer.
In a second aspect, a method for preparing the two-component epoxy adhesive plate of any one of the above-mentioned aspects, comprising the following steps:
mixing the components in proportion to obtain the component A;
mixing the components in proportion to obtain the component B;
and mixing the component A and the component B in proportion to obtain the plate adhesive.
Further, the preparation method of the component A comprises the following steps:
mixing bisphenol A epoxy resin, flexible epoxy resin, diluent and anti-settling agent, adding filler, mixing, performing first grinding, adding foaming agent, mixing, and performing second grinding to obtain the component A.
Further, the preparation method of the component B comprises the following steps:
mixing modified polythiol, ethylene amine modified aromatic amine, an accelerator, a defoaming agent, an anti-settling agent, a coupling agent and a retarder, adding a filler, mixing, and grinding to obtain the component B.
In a third aspect, the use of a two-component epoxy board adhesive as defined in any one of the preceding claims in an automated manufacturing line.
Compared with the prior art, the invention has at least the following beneficial effects:
the bi-component epoxy adhesive plate glue provided by the invention has the advantages that the bisphenol A epoxy resin can provide stronger adhesiveness, the flexible epoxy resin can increase the tensile strength and flexibility of the glue, the modified polythiol can enable the glue to be quickly cured at normal temperature and has good poaching characteristics, the vinylamine modified aromatic amine can effectively improve the toughness, TG point (glass transition temperature) and adhesiveness of the glue, and the retarder can relatively accelerate the positioning time while slowing down the operation time, thereby meeting the requirements of automatic production; under the synergistic effect of the components and the weight ratio of the components, the epoxy adhesive has the advantages of high curing speed, good toughness, high TG point, good heat resistance and acid and alkali resistance, and also has high binding force and softening point, so that the risk of falling off the board is greatly reduced during cutting, the yield of an automatic production line is further improved, and meanwhile, the epoxy adhesive has a shorter service life, so that the production efficiency of the automatic production line is improved.
The preparation method of the bi-component epoxy plate adhesive provided by the invention has the advantages of simple process and high efficiency, and is suitable for industrial production.
The application of the bi-component epoxy adhesive plate adhesive provided by the invention can meet the requirement of automatic production, improve the yield of a production line and improve the production efficiency.
Detailed Description
The technical solutions of the present invention will be clearly and completely described in connection with the embodiments, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
According to a first aspect of the present invention, there is provided a two-component epoxy board adhesive comprising a component a and a component B;
the component A is mainly prepared from the following components in parts by weight: 45-65 parts of bisphenol A epoxy resin, 2-10 parts of flexible epoxy resin, 5-20 parts of diluent and 30-70 parts of filler;
typical but non-limiting parts by weight of bisphenol a epoxy resins in the present invention are for example 45 parts, 46 parts, 47 parts, 48 parts, 49 parts, 50 parts, 52 parts, 54 parts, 56 parts, 58 parts, 60 parts, 61 parts, 62 parts, 63 parts, 64 parts, 65 parts; typical, but non-limiting, parts by weight of flexible epoxy are, for example, 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, 10 parts, 11 parts, 12 parts, 13 parts, 14 parts, 15 parts; typical but non-limiting parts by weight of diluents are for example 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, 10 parts, 11 parts, 12 parts, 13 parts, 14 parts, 15 parts, 16 parts, 17 parts, 18 parts, 19 parts, 20 parts; typical but non-limiting parts by weight of fillers are, for example, 30 parts, 32 parts, 34 parts, 36 parts, 38 parts, 40 parts, 42 parts, 44 parts, 46 parts, 48 parts, 50 parts, 52 parts, 54 parts, 56 parts, 58 parts, 60 parts, 65 parts, 70 parts;
the component B is mainly prepared from the following components in parts by weight: 20-65 parts of modified polythiol, 1-10 parts of vinylamine modified aromatic amine, 30-70 parts of filler, 0.1-1 part of coupling agent and 1-8 parts of retarder;
typical but non-limiting parts by weight of modified polythiols in the present invention are, for example, 20 parts, 22 parts, 24 parts, 26 parts, 28 parts, 30 parts, 32 parts, 34 parts, 36 parts, 38 parts, 40 parts, 45 parts, 50 parts, 55 parts, 60 parts, 65 parts; typical but non-limiting parts by weight of vinylamine-modified aromatic amines are for example 1 part, 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, 10 parts; typical but non-limiting parts by weight of fillers are, for example, 30 parts, 32 parts, 34 parts, 36 parts, 38 parts, 40 parts, 42 parts, 44 parts, 46 parts, 48 parts, 50 parts, 52 parts, 54 parts, 56 parts, 58 parts, 60 parts, 65 parts, 70 parts; typical but non-limiting parts by weight of coupling agents are for example 0.1 part, 0.2 part, 0.4 part, 0.6 part, 0.8 part, 1 part; typical, but non-limiting, parts by weight of a retarder are, for example, 1 part, 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts.
The bi-component epoxy adhesive plate glue provided by the invention has the advantages that the bisphenol A epoxy resin can provide stronger adhesiveness, the flexible epoxy resin can increase the tensile strength and flexibility of the glue, the modified polythiol can enable the glue to be quickly cured at normal temperature and has good poaching characteristics, the vinylamine modified aromatic amine can effectively improve the toughness, TG point (glass transition temperature) and adhesiveness of the glue, and the retarder can speed up the positioning time while slowing down the operation time, so that the requirement of automatic production is met; under the synergistic effect of the components and the weight ratio of the components, the epoxy adhesive has the advantages of high curing speed, good toughness, high TG point, good heat resistance and acid and alkali resistance, and also has high binding force and softening point, so that the risk of falling off the board is greatly reduced during cutting, the yield of an automatic production line is further improved, and meanwhile, the epoxy adhesive has a shorter service life, so that the production efficiency of the automatic production line is improved.
In a preferred embodiment, the weight ratio of the a-component and the B-component may be 1:1, but not limited thereto, is more advantageous for improving the overall performance of the adhesive plate.
Reactive diluents in the present invention include, but are not limited to, long chain reactive diluents, which are more useful in adjusting the viscosity of the glue.
In the present invention, long chain reactive diluents include, but are not limited to, one or both of 1, 4-butanediol glycidyl ether, carbon dodecyl-carbon tetradecyl glycidyl ether.
In a preferred embodiment, the flexible epoxy resins of the present invention include, but are not limited to, one or both of the commercially available 171, 172.
In a preferred embodiment, the preparation raw materials of the component A further comprise the following components in parts by weight:
0.05 to 1 part of anti-settling agent, 0.1 to 1 part of defoamer and 1 to 10 parts of foaming agent.
Typical but non-limiting parts by weight of an anti-settling agent are, for example, 0.05 parts, 0.1 parts, 0.2 parts, 0.3 parts, 0.4 parts, 0.5 parts, 0.6 parts, 0.7 parts, 0.8 parts, 0.9 parts, 1 part; typical but non-limiting parts by weight of defoamers are for example 0.1 part, 0.2 part, 0.3 part, 0.4 part, 0.5 part, 0.6 part, 0.7 part, 0.8 part, 0.9 part, 1 part; typical but non-limiting parts by weight of the foaming agent are for example 1 part, 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, 10 parts.
The weight proportion of the anti-settling agent, the defoaming agent and the foaming agent in the raw materials for preparing the component A is more favorable for achieving the synergistic effect with other components, and the overall performance of the epoxy adhesive plate is further improved.
In a preferred embodiment, the preparation raw materials of the component a further include 1 to 15 parts of titanium dioxide in parts by weight, for example, 1 part, 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, 10 parts, 11 parts, 12 parts, 13 parts, 14 parts and 15 parts of titanium dioxide in parts by weight, but not limited thereto, and the specific parts of titanium dioxide in parts by weight can improve the appearance of the glue.
In a preferred embodiment, the preparation raw materials of the component B further comprise the following components in parts by weight:
1 to 10 parts of accelerator, 0.2 to 1 part of color paste, 0.1 to 1 part of defoamer and 0.05 to 1 part of anti-settling agent.
Wherein typical but non-limiting parts by weight of the accelerator are for example 1 part, 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, 10 parts; typical but non-limiting parts by weight of the color paste are for example 0.2 parts, 0.4 parts, 0.6 parts, 0.8 parts, 1 part; typical but non-limiting parts by weight of defoamers are for example 0.1 part, 0.2 part, 0.3 part, 0.4 part, 0.5 part, 0.6 part, 0.7 part, 0.8 part, 0.9 part, 1 part; typical but non-limiting parts by weight of the anti-settling agent are, for example, 0.05 parts, 0.1 parts, 0.2 parts, 0.3 parts, 0.4 parts, 0.5 parts, 0.6 parts, 0.7 parts, 0.8 parts, 0.9 parts, 1 part.
The weight proportion of the accelerator, the color paste, the defoamer and the anti-settling agent in the raw materials for preparing the component B is more favorable for achieving the synergistic effect with other components, and the overall performance of the epoxy adhesive plate is further improved.
In a preferred embodiment, the retarders of the present invention include, but are not limited to, cycloaliphatic polymers, which allow for slower handling times while relatively faster positioning times, meeting the requirements of automated production.
A typical two-component epoxy adhesive comprises an A component and a B component;
the component A is mainly prepared from the following components in parts by weight:
45-65 parts of bisphenol A epoxy resin, 2-10 parts of flexible epoxy resin, 5-20 parts of long-chain reactive diluent, 0.05-1 part of anti-settling agent, 0.1-1 part of defoamer, 1-10 parts of foaming agent, 30-70 parts of filler and 1-15 parts of titanium pigment;
the component B is mainly prepared from the following components in parts by weight:
20-65 parts of modified polythiol, 1-10 parts of vinylamine modified aromatic amine, 1-10 parts of accelerator, 30-70 parts of filler, 0.2-1 part of color paste, 0.1-1 part of defoamer, 0.05-1 part of anti-settling agent, 0.1-1 part of coupling agent and 1-8 parts of retarder.
According to the bi-component epoxy adhesive plate glue, the toughness, the TG point and the adhesiveness of the glue are effectively improved by adding the vinylamine modified aromatic amine, meanwhile, the operation time can be reduced by adding the retarder, the positioning time can be shortened, the requirement of automatic production can be met, and the adhered workpiece plate can be moved within 6-10 minutes; under the synergistic cooperation of the components and the weight ratio of the components, the bi-component epoxy adhesive plate adhesive has the characteristics of high curing speed, good toughness, high TG point, good heat resistance, good acid and alkali resistance and the like, has high binding force and softening point, can greatly reduce the risk of falling bars during cutting, further improves the yield of a production line, and has shorter usable time (below 3 hours) at the same time, so that the production efficiency is further improved.
According to a second aspect of the present invention, there is provided a method for preparing the two-component epoxy adhesive sheet of any one of the above, comprising the steps of:
mixing the components in proportion to obtain a component A;
mixing the components in proportion to obtain a component B;
and mixing the component A and the component B in proportion to obtain the plate adhesive.
The preparation method of the bi-component epoxy plate adhesive provided by the invention has the advantages of simple process and high efficiency, and is suitable for industrial production.
In a preferred embodiment, the method for preparing component a comprises the steps of:
mixing bisphenol A epoxy resin, flexible epoxy resin, diluent, anti-settling agent and defoamer, adding filler, mixing, performing first grinding, adding foaming agent, mixing, and performing second grinding to obtain the component A.
In the invention, epoxy resin, a diluent, an anti-settling agent and a defoaming agent are sequentially added into a reaction kettle, the temperature is controlled below 55 ℃ and the mixture is simultaneously stirred for 30 minutes in vacuum, then filler is added and stirred for 30 minutes in vacuum, then the mixture is discharged and ground, finally a foaming agent is added and stirred, then the mixture is subjected to grinding again (two sides are ground in total), and the mixture is packaged to obtain the component A.
In a preferred embodiment, the process for preparing the B component comprises the steps of:
mixing modified polythiol, ethylene amine modified aromatic amine, an accelerator, a defoaming agent, an anti-settling agent, a coupling agent and a retarder, adding a filler, mixing, and grinding to obtain a component B.
In the invention, modified polythiol, ethylene amine modified aromatic amine, an accelerator, a defoaming agent, an anti-settling agent, a coupling agent and a retarder are put into a reaction kettle, the temperature is controlled below 55 ℃ and simultaneously stirred for 30 minutes in vacuum, then filler is put into the reaction kettle and stirred for 30 minutes in vacuum, the mixture is discharged and ground, and then stirred for 10 minutes, and then the mixture is bottled by a grinder to obtain the component B.
According to a third aspect of the present invention, there is provided the use of a two-component epoxy adhesive as defined in any one of the preceding claims in an automated production line.
The application of the bi-component epoxy adhesive plate adhesive provided by the invention can meet the requirement of automatic production, improve the yield of a production line and improve the production efficiency.
Examples 1 to 3
Examples 1-3 provide a two-component epoxy board adhesive comprising a component A and a component B;
wherein, the raw materials for preparing the component A and the component B are shown in table 1, and the use ratio (weight) of the component A and the component B is 1:1. wherein, bisphenol A epoxy resin is Baling petrochemical 6101, 128, according to weight proportion 2:1, mixing and using; the flexible epoxy resin is commercially available 171; the diluent is commercial 1, 4-butanediol glycidyl ether; the anti-settling agent is BYK-410; the defoamer is BYK-052; the foaming agent is pine needle low-temperature microspheres; one or two of filler calcium carbonate, talcum powder and wollastonite; the specification of the titanium dioxide is Japanese stone original CR80; modified polythiol is Yifeng 405B; the vinylamine modified aromatic amine is hensite 113; the accelerator is DMP-30; color paste is produced by the mountain of Buddha; the coupling agent is dakangning Z-6020; the retarder is a commercially available cycloaliphatic polymer.
TABLE 1
The epoxy adhesive provided in the embodiments 1-3 not only has the advantages of high curing speed, good toughness, high TG point, heat resistance and good acid and alkali resistance under the synergistic effect of the components and the weight ratio thereof, but also has high binding force and softening point, so that the risk of falling off the board is greatly reduced during cutting, the yield of an automatic production line is further improved, and meanwhile, the epoxy adhesive also has a shorter service life, thereby improving the production efficiency of the automatic production line.
Example 4
The present example is a method for preparing the two-component epoxy plate adhesive of examples 1-3, comprising the steps of:
and (3) preparation of the component A: sequentially adding bisphenol A epoxy resin, flexible epoxy resin, a diluent and an anti-settling agent into a reaction kettle, controlling the temperature below 55 ℃, stirring for 30 minutes in vacuum, adding filler and titanium dioxide, stirring for 30 minutes in vacuum, discharging and grinding, finally adding a degumming factor, stirring, grinding again by a grinder, and packaging to obtain a component A;
and (3) preparation of a component B: putting modified polythiol, ethylene amine modified aromatic amine, an accelerator, a defoaming agent, an anti-settling agent, a coupling agent and a retarder into a reaction kettle, controlling the temperature below 55 ℃, stirring for 30 minutes in vacuum, then putting color paste and filler into the reaction kettle, stirring for 30 minutes in vacuum, discharging and grinding, stirring for 10 minutes again, and bottling by a grinder to obtain a component B;
when in use, the component A and the component B are mixed according to a proportion to obtain the plate adhesive.
Comparative example 1
The comparative example differs from example 2 in that the component B of the comparative example does not contain vinylamine-modified aromatic amine, but is replaced by an equal proportion of modified polythiol, and the remainder is the same as example 2, to obtain a two-component epoxy adhesive sheet, which has the disadvantage that the softening point is lowered and there is a risk of falling sheets upon cutting.
Comparative example 2
The comparative example differs from example 2 in that the component B of the comparative example does not contain a retarder, but is replaced by an equal amount of filler, and the remainder is the same as example 2, to obtain a two-component epoxy adhesive sheet, which has the disadvantage of too fast an operation time, resulting in a plastic sheet that is not yet well adhered, and the adhesive has cured, which is disadvantageous for the operation.
Comparative example 3
The difference between the comparative example and the example 2 is that the weight part of vinylamine modified aromatic amine in the component B of the comparative example is 12 parts, the modified polythiol is 33 parts, and the rest is the same as the example 2, so that the bi-component epoxy adhesive plate is obtained, and the positioning time is slow, and the requirement of automatic production cannot be met.
Comparative example 4
The comparative example differs from example 2 in that the weight part of the retarder in the B component of the comparative example is 10 parts, and the rest is the same as example 2, to obtain a two-component epoxy adhesive sheet, which has the disadvantage of long operation time, resulting in slow curing and unfavorable production.
Comparative example 5
The comparative example was different from example 2 in that the bisphenol a epoxy resin in the a component of the comparative example was 6101 in its entirety and the rest was the same as example 2, and a two-component epoxy adhesive sheet was obtained, which had the disadvantages of high viscosity and reduced adhesive strength.
Comparative example 6
The comparative example differs from example 2 in that the a component of the comparative example does not contain a flexible epoxy resin, but is replaced with an equal proportion of bisphenol a epoxy resin, and the remainder is the same as example 2, to obtain a two-component epoxy adhesive sheet, which has a disadvantage in that the toughness of the thin adhesive layer is deteriorated.
Comparative example 7
The difference between the comparative example and the example 2 is that the weight part of the flexible epoxy resin in the component A of the comparative example is 12 parts, and the rest is the same as the example 2, so that the bi-component epoxy adhesive plate glue is obtained, and the defect is that the glue layer is too soft, which is unfavorable for the subsequent degumming treatment.
According to the invention, under the synergistic cooperation of the components and the weight proportions thereof, the bi-component epoxy adhesive plate adhesive provided by the invention can further accelerate the positioning time, improve the production efficiency and reduce the cost while ensuring the performance of the adhesive and the enough operation time, and lays a foundation for the automatic realization of slicing factories.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the invention.

Claims (10)

1. The double-component epoxy plate adhesive is characterized by comprising a component A and a component B;
the component A is mainly prepared from the following components in parts by weight:
45-65 parts of bisphenol A epoxy resin, 2-10 parts of flexible epoxy resin, 5-20 parts of diluent and 30-70 parts of filler;
the component B is mainly prepared from the following components in parts by weight:
20-65 parts of modified polythiol, 1-10 parts of vinylamine modified aromatic amine, 30-70 parts of filler, 0.1-1 part of coupling agent and 1-8 parts of retarder.
2. The two-component epoxy adhesive plate of claim 1, wherein the weight ratio of the component a to the component B is 1:1, a step of;
preferably, the diluent comprises a long chain reactive diluent;
preferably, the long chain reactive diluent comprises one or two of 1, 4-butanediol glycidyl ether and carbon dodecyl-carbon tetradecyl glycidyl ether;
preferably, the flexible epoxy includes one or both of the commercially available 171, 172.
3. The two-component epoxy adhesive plate adhesive according to claim 1, wherein the preparation raw materials of the component A further comprise the following components in parts by weight:
0.05 to 1 part of anti-settling agent, 0.1 to 1 part of defoamer and 1 to 10 parts of foaming agent.
4. The two-component epoxy adhesive plate adhesive according to claim 1, wherein the preparation raw materials of the component A further comprise 1-15 parts by weight of titanium dioxide.
5. The two-component epoxy adhesive sheet according to any one of claims 1 to 4, wherein the preparation raw materials of the component B further comprise the following components in parts by weight:
1 to 10 parts of accelerator, 0.2 to 1 part of color paste, 0.1 to 1 part of defoamer and 0.05 to 1 part of anti-settling agent.
6. The two-part epoxy board adhesive of any one of claims 1-4, wherein the retarder comprises a cycloaliphatic polymer.
7. A method for preparing the two-component epoxy adhesive sheet according to any one of claims 1 to 6, comprising the steps of:
mixing the components in proportion to obtain the component A;
mixing the components in proportion to obtain the component B;
and mixing the component A and the component B in proportion to obtain the plate adhesive.
8. The preparation method according to claim 7, wherein the preparation method of the a component comprises the steps of:
mixing bisphenol A epoxy resin, flexible epoxy resin, diluent, anti-settling agent and defoamer, adding filler, mixing, performing first grinding, adding foaming agent, mixing, and performing second grinding to obtain the component A.
9. The method of producing according to claim 7, wherein the method of producing the B component comprises the steps of:
mixing modified polythiol, ethylene amine modified aromatic amine, an accelerator, a defoaming agent, an anti-settling agent, a coupling agent and a retarder, adding a filler, mixing, and grinding to obtain the component B.
10. Use of the two-component epoxy board adhesive of any one of claims 1-6 in an automated production line.
CN202310648116.5A 2023-06-02 2023-06-02 Bi-component epoxy adhesive plate glue and preparation method and application thereof Pending CN116948580A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310648116.5A CN116948580A (en) 2023-06-02 2023-06-02 Bi-component epoxy adhesive plate glue and preparation method and application thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310648116.5A CN116948580A (en) 2023-06-02 2023-06-02 Bi-component epoxy adhesive plate glue and preparation method and application thereof

Publications (1)

Publication Number Publication Date
CN116948580A true CN116948580A (en) 2023-10-27

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310648116.5A Pending CN116948580A (en) 2023-06-02 2023-06-02 Bi-component epoxy adhesive plate glue and preparation method and application thereof

Country Status (1)

Country Link
CN (1) CN116948580A (en)

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