CN116940884A - Correction device - Google Patents

Abstract

The correction device of the invention can perform positioning with high precision without increasing the manufacturing cost. The correction device comprises: a first stage having an adsorption stage to adsorb a substrate; a portal frame arranged on the upper side of the adsorption platform; the second platform is arranged on the portal frame; a head portion provided on the second stage and having a correction head portion for correcting the substrate; a first moving part which changes the relative positions of the first platform and the gantry in a first direction; a second moving part that changes a relative position of the first stage and the second stage in a second direction substantially orthogonal to the first direction; and a head moving section that moves the head relative to the second stage. The second stage has a first shaft disposed substantially in the first direction, and a second shaft disposed substantially in the second direction, and the head moving portion moves the head in the first direction along the first shaft and moves the head in the second direction along the second shaft. The positioning accuracy of the head moving portion is higher than the positioning accuracy of the first moving portion and the positioning accuracy of the second moving portion.

Description

Correction device

Technical Field

The present invention relates to a correction device.

Background

Patent document 1 discloses a gantry XY stage in which Dan Dingpan is provided on 9 vibration absorbing brackets provided on a stage, a pair of guide bases is provided on a stone slab, a pair of posts movable in the Y direction with respect to Dan Dingpan, a beam, and a movable base movable in the X direction with respect to the beam are provided on the guide bases, and a laser optical unit is mounted on the movable base.

Prior art literature

Patent literature

Patent document 1: japanese patent laid-open No. 2006-49384.

Disclosure of Invention

Problems to be solved by the invention

In recent years, with the enlargement of glass substrates, gantry XY stages such as the invention described in patent document 1 have been used for positioning. A linear encoder is used in the gantry XY stage, but since positioning accuracy of several tens μm is required, there is a problem in that an expensive linear encoder must be used. In addition, in the gantry XY stage of the invention described in patent document 1, in order to position the gantry that moves greatly with high accuracy, it is necessary to improve the machining accuracy of the entire stone slab, and there is a problem that the manufacturing cost increases.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a correction device capable of positioning with high accuracy without increasing manufacturing costs.

Solution for solving the problem

In order to solve the above-described problems, a correction device according to the present invention includes, for example: a first stage having an adsorption stage to adsorb a substrate; a portal frame arranged on the upper side of the adsorption platform; a second platform disposed at the gantry; a head portion provided on the second stage and having a correction head portion for correcting the substrate; a first moving part that changes a relative position of the first platform and the gantry in a first direction; a second moving part that changes a relative position of the first stage and the second stage in a second direction substantially orthogonal to the first direction; and a head moving portion that moves the head with respect to the second stage, the second stage having a first axis disposed substantially along the first direction and a second axis disposed substantially along the second direction, the head moving portion moving the head along the first axis in the first direction and moving the head along the second axis in the second direction, the positioning accuracy of the head moving portion being higher than the positioning accuracy of the first moving portion and the positioning accuracy of the second moving portion.

According to the correction device of the present invention, the head moving section moves the head along the first axis and the second axis provided to the second stage. Therefore, the distance by which the head is moved in the first direction by the head moving portion is shorter than the distance by which the head is moved in the first direction by the first moving portion, and the distance by which the head is moved in the second direction by the head moving portion is shorter than the distance by which the head is moved in the second direction by the second moving portion. In addition, the positioning accuracy of the head moving portion is higher than the positioning accuracy of the first moving portion and the positioning accuracy of the second moving portion. Therefore, the positioning accuracy of the first moving part and the second moving part and the machining accuracy (flatness and the like) of the first stage can be reduced. This enables positioning to be performed with high accuracy without increasing manufacturing costs.

Here, the correction device preferably includes a first movement control unit that controls the first movement unit and the second movement unit, the substrate includes a pattern provided on a surface, the pattern includes a first pattern provided substantially along the first direction and a second pattern provided substantially along the second direction in a state of being provided on the first stage, the first movement unit and the second movement unit each include a reading unit that reads the pattern, and the first movement control unit controls the first movement unit based on a result of reading the second pattern by the reading unit, and controls the second movement unit based on a result of reading the first pattern by the reading unit. Thus, since the scale is replaced with a pattern, a glass scale is not required in the first moving portion and the second moving portion. Therefore, the use of an expensive linear encoder is not required, and the manufacturing cost can be reduced.

Here, it is preferable that the first movement control section acquires defect information as information on a position of a defect of the substrate, determines a defect overlapping pattern as a pattern overlapping the defect among the patterns based on the defect information, and controls the first movement section and the second movement section so that the head section is moved above the defect overlapping pattern in accordance with the number of the patterns read by the reading section. Thus, the head can be disposed in the vicinity of the defect without using a linear encoder.

Here, the correction described above is preferably performed by having a second movement control unit that controls the head movement unit, the head having an image acquisition unit that acquires an image of the substrate, the second movement control unit moving the head based on the image acquired by the image acquisition unit. Thus, the head can be positioned with high accuracy.

Here, it is preferable that the first moving portion and the second moving portion each have a linear motor using electromagnetic force as a driving source, and the head moving portion has a piezoelectric element as a driving source. This enables the head to be precisely moved.

Here, it is preferable that the positioning accuracy of the first moving portion and the second moving portion is thicker than the pitch of the pattern, and the positioning accuracy of the head moving portion is thinner than the pitch of the pattern. This enables the head to be precisely moved.

Effects of the invention

According to the present invention, positioning can be performed with high accuracy without increasing manufacturing cost.

Drawings

Fig. 1 is a schematic perspective view showing a correction device 1 according to a first embodiment.

Fig. 2 is a schematic front view showing the correction device 1.

Fig. 3 is a block diagram showing an electrical configuration of the correction device 1.

Fig. 4 is a flowchart showing a flow of processing of the correction device 1.

Fig. 5 is a diagram schematically showing a part of the substrate 100.

Detailed Description

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The correction device of the invention corrects the defect found in the manufacturing process of the liquid crystal display device.

The liquid crystal display device has a structure in which a liquid crystal is sandwiched between a pair of substrates, a color filter is formed on one of the substrates, the color filter is alternately coated with a resin in which blue, green, and red pigments are dispersed, and a circuit pattern is formed on the other substrate. If defects occur in the color filters and the circuit patterns, the defects cause failures such as abnormal display. Accordingly, in the correction device, the defect found by the inspection device is irradiated with laser light from the back surface of the substrate, and the defect is corrected. However, the substrate corrected by the correction device is not limited to the liquid crystal display device.

Fig. 1 is a schematic perspective view showing a correction device 1 according to a first embodiment. Fig. 2 is a schematic front view showing the correction device 1. Hereinafter, the depth direction of the correction device 1 is referred to as the X direction, and the direction orthogonal to the X direction in the horizontal plane is referred to as the Y direction. The direction orthogonal to the X direction and the Y direction is referred to as the Z direction (vertical direction).

The correction device 1 mainly includes a first stage 10, a gantry 20, a second stage 30, a head 40, a gantry moving portion 50 (corresponding to a first moving portion of the present invention), and a second stage moving portion 60 (corresponding to a second moving portion of the present invention), and a head moving portion 70.

The first stage 10 mainly has a base 11 and an adsorption stage 12. The base 11 is a member that serves as a base of the suction table 12 and the gantry 20, and is placed on the ground or the like. The base 11 is provided with a rough X-axis 13 extending substantially in the X-direction. The coarse movement X-axis 13 is provided near the +y-side end and near the-Y-side end of the base 11, respectively. Further, a gantry 20 is provided on the base 11 so as to cover the suction table 12.

The suction table 12 is a plate-like member having a substantially rectangular shape in plan view. The substrate 100 is mounted on the upper surface (+z-side surface) of the suction stage 12. When the substrate 100 is placed on the upper surface of the adsorption stage 12, the adsorption stage 12 sucks air to adsorb the substrate 100 to the adsorption stage 12.

The door 20 is a door type covering the upper side of the adsorption platform 12. The mast 20 mainly has a column 21 and a beam 22 provided to the column 21. The beam 22 is substantially rod-shaped and is provided on the upper side of the first stage 10. The struts 21 are arranged in the Z direction and the beams 22 are arranged in the Y direction.

A convex portion 21a is provided at the lower end of the pillar 21. The convex portion 21a is inserted into the concave portion 13a provided in the coarse movement X-axis 13. The concave portion 13a is provided to extend in the X direction, and the convex portion 21a is slid along the concave portion 13a, whereby the gantry 20 is moved in the X direction.

A second platform 30 is provided on the beam 22. Further, the beam 22 is provided with a rough Y-axis 23 substantially along the Y-direction. The second stage 30 is movable in the Y direction along the coarse Y axis 23.

A head 40 is provided on the second stage 30. The head 40 has a correction head 44 (see fig. 3), not shown. The correction head 44 includes, for example, a laser light source and an optical member, and emits laser light irradiated by the laser light source to the substrate 100 to correct the substrate 100. The correction head 44 is not limited to a method of correcting the substrate 100 using a laser. For example, the method further includes a method in which the correction head applies a metallic ink to the substrate 100, and the metallic ink is sintered by light irradiated from the lamp, so that the disconnection of the substrate 100 is corrected.

The head 40 further includes an image acquisition unit 45 (see fig. 3). The image acquisition unit 45 includes an image pickup device such as a CCD or CMOS, an magnifying optical system for magnifying observation. The image captured by the image capturing section 45 is output to a display device or the like, not shown. The image acquisition unit 45 can use, for example, an optical microscope and a conductive particle microscope.

The second stage 30 is provided with a jog X-axis 31 and a jog Y-axis 32. The jog X axis 31 is disposed substantially along the X direction, and the jog Y axis 32 is disposed substantially along the Y direction. The second stage 30 is provided with a head moving unit 70 that moves the head 40 relative to the second stage 30. The head moving unit 70 includes a piezoelectric element 71 (see fig. 3) as a driving source for moving the head 40 along the jog X axis 31, and a piezoelectric element 72 (see fig. 3) as a driving source for moving the head 40 along the jog Y axis 32. The driving source of the head moving unit 70 is not limited to a piezoelectric element, and may be, for example, a linear motor or a servo motor.

The gantry moving portion 50 moves the gantry 20 along the coarse X-axis 13 in the X-direction. The gantry moving portion 50 has a linear motor 51 (refer to fig. 3) using electromagnetic force as a driving source. The gantry moving unit 50 includes a reading unit 52 that reads a pattern provided on the substrate 100. The reading section 52 is provided on the column 21 and moves in the X direction as the gantry 20 moves in the X direction.

The second stage moving unit 60 moves the second stage 30 along the coarse Y-axis 23 in the Y-direction. The second stage moving part 60 has a linear motor 61 (refer to fig. 3) using electromagnetic force as a driving source. The second stage moving unit 60 includes a reading unit 62 for reading a pattern provided on the substrate 100. The reading section 62 is provided on the second stage 30, and moves in the Y direction as the second stage 30 moves in the Y direction.

The distance by which the head moving part 70 moves the head 40 in the X direction is shorter than the distance by which the gantry moving part 50 moves the gantry 20 in the X direction, and the distance by which the head moving part 70 moves the head 40 in the Y direction is shorter than the distance by which the second stage moving part 60 moves the second stage 30 in the Y direction. Specifically, the head moving unit 70 moves the head 40 in the X direction and the Y direction by a distance of about 2mm. The distance by which the gantry moving unit 50 moves the gantry 20 (the head 40 provided to the gantry 20) and the distance by which the second stage moving unit 60 moves the second stage 30 (the head 40 provided to the second stage 30) are each about 3000 mm.

In addition, the distance that the head moving portion 70 moves the head 40 in the X direction and the Y direction (the lengths of the jog X axis 31 and the jog Y axis 32) is not limited to 2mm. The distance the head moving section 70 moves the head 40 depends on the accuracy of an inspection device that inspects the substrate 100 for defects. In the present embodiment, since the accuracy of the inspection apparatus is within 1mm, the distance by which the head moving unit 70 moves the head 40 in the X direction and the Y direction is 2mm (approximately twice the accuracy of the inspection apparatus).

The speed at which the head moving portion 70 moves the head 40 in the X direction is slower than the speed at which the gantry moving portion 50 moves the gantry 20 in the X direction, and the speed at which the head moving portion 70 moves the head 40 in the Y direction is slower than the speed at which the second stage moving portion 60 moves the second stage 30 in the Y direction. Specifically, the head moving unit 70 moves the head 40 in the X direction and the Y direction at a speed of about 1 μm per second. The speed at which the gantry moving portion 50 moves the gantry 20 (head 40) and the speed at which the second stage moving portion 60 moves the second stage 30 (head 40) are each about 2mm in seconds.

The positioning accuracy of the head moving portion 70 is higher than the positioning accuracy of the gantry moving portion 50 and the positioning accuracy of the second stage moving portion 60. Specifically, the positioning accuracy in the X direction and the Y direction of the head 40 is smaller than the pixel pitch (pitch of the patterns 121 and 122 (see fig. 5)), and is about 0.1 μm in the present embodiment. The positioning accuracy of the gantry moving unit 50 and the positioning accuracy of the second stage moving unit 60 are thicker than the pixel pitch, and are each about 10 μm in the present embodiment.

That is, in the correction device 1, the head 40 is moved largely, rapidly, and roughly by the gantry moving portion 50 and the second stage moving portion 60, and the head 40 is moved finely, slowly, and accurately by the head moving portion 70.

Fig. 3 is a block diagram showing an electrical configuration of the correction device 1. The correction device 1 mainly includes a control unit 101, a storage unit 102, an input unit 103, an output unit 104, and a communication unit 105.

The control unit 101 is a program control device such as a CPU (Central Processing Unit: central processing unit) as an arithmetic unit, and operates in accordance with a program stored in the storage unit 102. The control unit 101 will be described in detail later.

The control unit 101 is connected to the suction stage 12, the correction head 44, the image acquisition unit 45, the gantry moving unit 50 (the linear motor 51 and the reading unit 52), the second stage moving unit 60 (the linear motor 61 and the reading unit 62), the head moving unit 70 (the piezoelectric elements 71 and 72), and the like.

The storage unit 102 is a nonvolatile memory, a volatile memory, or the like, holds a program or the like executed by the control unit 101, and operates as a substrate memory of the control unit 101. The input unit 103 includes an input device such as a keyboard and a mouse. The output unit 104 is a display or the like. The communication unit 105 acquires data from another device (for example, an inspection apparatus) via a network board or a storage medium, transmits the data to the control unit 101, and transmits the data generated by the control unit 101 to the other device via the network board or the like.

Next, the control unit 101 will be described. The control unit 101 includes a substrate adsorbing unit 101a, an information acquiring unit 101b, a first movement control unit 101c, a second movement control unit 101d, a pattern reading unit 101e, an image processing unit 101f, and a correction processing unit 101g as main functional units.

The substrate suction unit 101a controls the suction stage 12, sucks air in a state where the substrate 100 is placed on the suction stage 12, and sucks the substrate 100 on the upper side of the suction stage 12.

The information acquisition unit 101b acquires information (hereinafter, referred to as substrate information) related to the substrate 100 via the communication unit 105. The substrate information includes design information of the substrate such as the size of the substrate 100, the positions of the patterns, the intervals between adjacent patterns (the pitches of the patterns), and the like. The information acquisition unit 101b acquires information (hereinafter referred to as defect information) on the position of the defect of the substrate 100 via the communication unit 105. The defect information is recorded by a substrate coordinate system, and shows the position of the defect of the substrate 100. Before the processing by the correction device 1, defect information is acquired by an inspection device, not shown.

The first movement control unit 101c controls the gantry moving unit 50 to move the gantry 20 (the head 40) in the X direction. The first movement control unit 101c controls the second stage movement unit 60 to move the second stage 30 (the head 40) in the Y direction. The processing performed by the first movement control unit 101c will be described in detail later.

The second movement control unit 101d controls the head movement unit 70 so that the head 40 moves only a small distance in the X-direction and the Y-direction with respect to the second stage 30. The processing performed by the second movement control unit 101d will be described in detail later.

The pattern reading unit 101e obtains the measurement results of the reading units 52 and 62, and detects whether the reading units 52 and 62 read the pattern. For example, in the case of using the pattern reading section 101e of the optical lens type, a pattern is read from a captured image. In the case of using the laser-reflective pattern reading unit 101e, the laser beam is irradiated onto the substrate, and the laser beam reflected by the metal (pattern) is detected, thereby reading the pattern. In the case of using the capacitive coupling type pattern reading unit 101e, the capacitive sensor is brought close to the substrate and a voltage is applied, and the pattern is read by changing only the pattern by the capacitance. The optical lens type pattern reading section 101e can cope with a speed up to 100mm in seconds, and the laser reflection type and capacitive coupling type pattern reading section 101e can cope with a speed up to 2mm in seconds.

The image processing unit 101f acquires the image of the substrate 100 obtained by the image acquisition unit 45, performs image processing, and extracts defects from the acquired image. The image acquisition unit 45 and the image processing unit 101f can observe the substrate 100 with a resolution of about 100 μm. The processing performed by the image processing unit 101f is a general technical means, and therefore, a description thereof will be omitted.

The correction processing unit 101g controls the correction head 44 to irradiate the laser beam onto the substrate 100 based on the image obtained by the image obtaining unit 45. The processing performed by the correction processing unit 101g is a general technical means, and therefore, a description thereof will be omitted.

Next, the operation of the correction device 1 configured as described above will be described. Fig. 4 is a flowchart showing a flow of processing performed by the correction device 1 to correct a defect of the substrate 100.

Before being carried into the substrate 100, the information acquisition section 101b acquires defect information (step S101), and acquires substrate information (step S102). The order of the processing of step S101 and step S102 is not limited, and step S101 and step S102 may be performed simultaneously.

Then, after the substrate 100 is carried into the upper side of the suction stage 12 by the carry-in/carry-out section (not shown) (step S103), the control section 101 detects the alignment mark 123 of the substrate 100 using the lens (not shown) (see fig. 5), positions the substrate 100, and then sucks the substrate 100 onto the upper side of the suction stage 12 after positioning the substrate 100 (step S104).

Next, the first movement control unit 101c roughly moves (roughly and quickly moves to the far position) the gantry 20 and the second stage 30 (steps S105 to S107). The processing in steps S105 to S107 will be described in detail below.

(step S105)

The first movement control section 101c acquires substrate information and defect information via the information acquisition section 101 b. Then, the first movement control unit 101c determines a pattern overlapping with the defect (hereinafter referred to as a defect overlapping pattern) based on the substrate information and the defect information.

Fig. 5 is a diagram schematically showing a part of the substrate 100. The substrate information includes information on the positions and sizes of the patterns 121 and 122 and the alignment marks 123 included in the substrate 100, and the pitches of the patterns 121 and 122. In the example shown in fig. 5, alignment marks 123 are provided near the corners of the substrate 100, and patterns 121 in the left-right direction of the drawing sheet of fig. 5 are arranged in the up-down direction of the drawing sheet of fig. 5, and patterns 122 in the up-down direction of the drawing sheet of fig. 5 are arranged in the left-right direction of the drawing sheet of fig. 5. The pattern 121 has patterns 121-1, 121-2, 121-3 and … arranged in this order from the upper side of the paper of fig. 5, and the pattern 122 has patterns 122-1, 122-2, 122-3 and … arranged in this order from the left side of the paper of fig. 5.

Further, the defect information includes information about the location of the defect 110 of the substrate 100. The first movement control unit 101c determines, based on the substrate information and the defect information, which position of the substrate 100 the defect 110 exists and which pattern is a defect overlapping pattern, based on the position of the alignment mark 123 as a reference. In the example shown in fig. 5, the defect 110 is located in the pattern 121-3 and the pattern 122-6, and the pattern 121-3 and the pattern 122-6 are defect overlapping patterns.

The substrate 100 is placed on the upper side of the suction stage 12 such that the vertical direction of the drawing sheet of fig. 5 is along the X direction and the horizontal direction of the drawing sheet of fig. 5 is along the Y direction.

Next, the first movement control unit 101c calculates the number of patterns 121 and 122 from the current position to the defect overlapping pattern. When the process of step S105 is initially performed, the number of patterns 121 and 122 is calculated with the origin position (for example, the alignment mark 123) of the substrate 100 as a reference. In the example shown in fig. 5, the number of patterns 121 up to the defect overlapped pattern (pattern 121-3) is three, and the number of patterns 122 up to the defect overlapped pattern (pattern 122-6) is six.

(step S106)

The description of fig. 4 is returned. The first movement control unit 101c obtains the result of reading the pattern 121 by the reading unit 52 via the pattern reading unit 101e, and drives the linear motor 51 to move the gantry 20 in the X direction. The first movement control section 101c moves the gantry 20 in the X direction until the number of patterns 121 calculated in step S105 is detected by the reading section 52.

For example, in fig. 5, the field of view of the reading section 52 is indicated by 52 a. As the gantry 20 moves in the-X direction, the field of view 52a moves down the page of fig. 5. Since the number of patterns 121 up to the defect overlapping pattern is calculated as three in step S105, the first movement control section 101c moves the gantry 20 in the-X direction until the pattern reading section 101e detects the field of view 52a to detect the patterns 121 three times. As a result, the beam 22 of the gantry 20, i.e., the head 40, is disposed above the defect overlay pattern (pattern 121-3).

(step S107)

The description of fig. 4 is returned. The first movement control unit 101c obtains the result of reading the pattern 122 by the reading unit 62 via the pattern reading unit 101e, and drives the linear motor 61 to move the second stage 30 in the Y direction. The first movement control section 101c moves the second stage 30 in the Y direction until the number of patterns 122 calculated in step S104 is detected by the reading section 62.

For example, in fig. 5, the field of view of the reading section 62 is indicated by 62 a. When the second stage 30 moves in the +y direction, the field of view 62a moves to the right side of the paper surface of fig. 5. Since the number of patterns 122 up to the defective overlap pattern is calculated to be six in step S105, the first movement control section 101c moves the second stage 30 in the +y direction until the pattern reading section 101e detects the field of view 62a to detect the six-order patterns 122. As a result, the second stage 30, i.e., the head 40, is disposed above the defective overlap pattern (pattern 122-6).

The description of fig. 4 is returned. In this way, in steps S105 to S107, the first movement control unit 101c controls the gantry moving unit 50 and the second stage moving unit 60 so that the head 40 moves onto the defective overlay pattern according to the number of patterns 121 and 122 read by the reading units 52 and 62.

Next, the second movement control unit 101d moves the head 40 by a small distance (jog) in the X-direction and the Y-direction with respect to the second stage 30 (steps S108 to S109). The processing in steps S108 to S109 will be described in detail below.

(step S108)

The image processing unit 101f acquires the image obtained by the image acquisition unit 45, performs image processing, and extracts the defect 110 from the acquired image. The distance between the patterns 121 and 122 was 100 μm, and the field of view of the image acquisition unit 45 was 2mm ² In this case, since the head 40 is already arranged above the defect overlapping pattern in steps S105 to S107, the defect 110 is necessarily included in the field of view of the image acquisition unit 45.

(step S109)

The second movement control unit 101d moves the head 40 in the X direction and the Y direction based on the image acquired by the image acquisition unit 45. For example, the second movement control unit 101d obtains the distance between the current position (center of the image) and the defect 110 from the image processing result obtained in step S108, and moves the head 40 to the obtained distance by the piezoelectric elements 71 and 72. Thus, the head 40 is positioned with high accuracy so that the defect 110 is arranged at the center of the image obtained by the image acquisition unit 45.

The second movement control unit 101d may repeat the process of moving the head 40 by a fixed amount by the piezoelectric elements 71 and 72, and the image processing unit 101f may acquire the image obtained by the image acquisition unit 45 and extract the defect 110. That is, the second movement control unit 101d may repeat the processing of steps S108 and S109 until the defect is arranged at the center of the image obtained by the image acquisition unit 45.

After the head 40 is positioned, the correction processing unit 101g irradiates the substrate 100 with laser light based on the image obtained by the image acquisition unit 45 (step S110).

The control unit 101 determines whether or not the correction process has been performed for all defects included in the defect information acquired in step S101 (step S110) (step S111). If the correction process is not performed on all the defects (no in step S110), the control unit 101 returns the process to step S105. When the correction process is performed on all defects (yes in step S110), the control unit 101 stops the suction of the substrate 100 by the suction table 12, and the substrate 100 is carried out from the correction device 1 by a carry-in/out unit (not shown) (step S112), thereby ending a series of processes.

In the case where step S105 is performed after the second time, the first movement control unit 101c calculates the number of patterns 121 and 122 based on the position of the defect for which the correction process was performed last. For example, in the example shown in fig. 5, when the defect 111 is processed after the defect 110, the number of patterns 121 and 122 up to the defect 111 is calculated based on the position of the defect 110. The defect overlay pattern of defect 111 is patterns 121-1, 102-7, calculated as: the number of patterns 121 from the defect overlapping pattern of the defect 110 to the defect overlapping pattern of the defect 111 is two in the-X direction, and the number of patterns 122 from the defect overlapping pattern of the defect 110 to the defect overlapping pattern of the defect 111 is one in the +y direction. That is, in the case where step S105 is performed after the second time, the number of patterns 121, 122 from the current position up to the defect overlapping pattern is calculated, and the moving direction is obtained.

According to the present embodiment, the second stage 30 is provided on the gantry 20, the head 40 is provided on the second stage 30, the head 40 is roughly moved by the gantry moving portion 50 and the second stage moving portion 60, and the head 40 is precisely moved by the head moving portion 70, so that positioning can be performed with high accuracy without increasing the manufacturing cost of the respective components of the correction device 1. Specifically, by providing the jog X-axis 31 and the jog Y-axis 32 on the second stage 30, the positioning accuracy of the gantry moving portion 50 and the second stage moving portion 60, for example, the positioning accuracy of the linear motors 51 and 61, the machining accuracy (flatness, etc.) of the first stage 10 can be reduced, and the manufacturing cost can be reduced.

For example, in a conventional gantry XY stage using a linear encoder, the first stage must be precisely machined over the entire length of the gantry and the movement amount of the stage (approximately 3000 mm), and the manufacturing cost increases. In contrast, in the present embodiment, the objects to be precision machined are only the jog X-axis 31 and the jog Y-axis 32, and the length thereof is as short as about 2mm, so that the manufacturing cost can be reduced.

In addition, for example, in a conventional gantry XY stage using a linear encoder, a high-performance linear motor capable of positioning with high accuracy of about 0.1 μm must be used, and the manufacturing cost increases. In contrast, in the present embodiment, a high-performance linear motor is not required, and the manufacturing cost can be reduced.

Further, by using the linear motors 51 and 61 as the driving sources of the gantry moving portion 50 and the second stage moving portion 60 and using the piezoelectric elements 71 and 72 as the driving sources of the head moving portion 70, it is possible to reduce the manufacturing cost and to maintain high positioning accuracy of the head moving portion 70.

Further, according to the present embodiment, since there is no problem even if the positioning accuracy of the gantry moving portion 50 and the second stage moving portion 60 is low, the speed at which the gantry moving portion 50 moves the gantry 20 and the speed at which the second stage moving portion 60 moves the second stage 30 can be increased. This can shorten the processing time of the correction device 1.

Further, according to the present embodiment, according to the result of reading the patterns 121, 122 provided on the substrate 100 by the reading sections 52, 62, the head 40 is moved by the gantry moving section 50 and the second stage moving section 60, that is, the patterns are replaced with the scales, so that glass scales are not required on the gantry moving section 50 and the second stage moving section 60. Therefore, the use of an expensive linear encoder is not required, and the manufacturing cost can be reduced. As described above, the positioning using the patterns 121 and 122 provided on the substrate 100 cannot be performed in an exposure apparatus, a drawing apparatus, or the like in which a substrate to which no pattern is provided is a processing object, and can be performed only in the correction apparatus 1 in which a substrate 100 to which the patterns 121 and 122 are provided is a processing object.

Further, according to the present embodiment, the number and the moving direction of the patterns 121 and 122 up to the defect overlapping pattern are obtained, and the gantry moving portion 50 and the second stage moving portion 60 can move the head 40 according to the number and the moving direction, whereby the head can be arranged in the vicinity of the defect without using a linear encoder. Therefore, the image acquisition unit 45 can reliably acquire the image including the defects 110 and 111.

Further, according to the present embodiment, the second movement control section 101d controls the head movement section 70 to move the head 40 based on the image acquired by the image acquisition section 45, so that the head 40 can be positioned with high accuracy.

In the present embodiment, the gantry moving portion 50 corresponding to the first moving portion of the present invention moves the gantry 20 along the rough X-axis 13, but the first moving portion may change the relative positions of the first stage 10 and the gantry 20 in the X-direction. In the present embodiment, the second stage moving unit 60 corresponding to the second moving unit of the present invention moves the second stage 30 along the rough Y axis 23 in the Y direction, but the second moving unit may change the relative positions of the first stage 10 and the second stage 30 in the Y direction. For example, the first stage 10 is moved by the first moving portion and the second moving portion, thereby changing the relative positions of the first stage 10 and the gantry 20 in the X direction, or changing the relative positions of the first stage 10 and the second stage 30 in the Y direction. However, when the first stage 10 is moved, the size of the correction device in the horizontal direction is large (specifically, approximately four times the size when the gantry 20 and the second stage 30 are moved), so that it is preferable that the first moving unit moves the gantry 20 and the second moving unit moves the second stage 30.

The embodiments of the present invention have been described in detail above with reference to the drawings, but the specific configuration is not limited to the embodiments, and design changes and the like without departing from the scope of the gist of the present invention are also included.

In the present invention, the term "substantially" means not only the exact same but also errors and deformations to the extent that the identity is not lost. For example, the substantially parallel and substantially orthogonal are not limited to the strictly parallel and orthogonal cases. For example, even when simply expressed as parallel, orthogonal, or the like, not only strict parallel, orthogonal, or the like, but also approximately parallel, approximately orthogonal, or the like is included. In the present invention, the term "near" means, for example, near a, and indicates near a, and may or may not include a.

Description of the reference numerals

1: a correction device;

10: a first platform;

11: a base;

12: an adsorption platform;

13: roughly moving the X axis;

13a: a concave portion;

20: a door frame;

21: a support post;

21a: a convex portion;

22: a beam;

23: coarsely moving a Y axis;

30: a second platform;

31: micro X axis;

32: micro Y axis;

40: a head;

44: correcting the head;

45: an image acquisition unit;

50: a portal moving part;

60: a second stage moving section;

51. 61: a linear motor;

52. 62: a reading section;

52a, 62a: a field of view;

70: a head moving part;

71. 72: a piezoelectric element;

100: a substrate;

101: a control unit;

101a: a substrate adsorption part;

101b: an information acquisition unit;

101c: a first movement control unit;

101d: a second movement control unit;

101e: a pattern reading section;

101f: an image processing section;

101g: a correction processing unit;

102: a storage unit;

103: an input unit;

104: an output unit;

105: a communication unit;

110. 111: defects;

121. 121-1, 121-2, 121-3, 122-1, 122-2, 122-3, 122-6, 122-7: a pattern;

123: and (5) aligning the mark.

Claims (6)

1. A correction device, characterized by comprising:

a first stage having an adsorption stage to adsorb a substrate;

a portal frame arranged on the upper side of the adsorption platform;

a second platform disposed at the gantry;

a head portion provided on the second stage and having a correction head portion for correcting the substrate;

a first moving part that changes a relative position of the first platform and the gantry in a first direction;

a second moving part that changes a relative position of the first stage and the second stage in a second direction substantially orthogonal to the first direction; and

a head moving part which moves the head relative to the second stage,

the second platform has a first axis disposed generally along the first direction and a second axis disposed generally along the second direction,

the head moving portion moves the head in the first direction along the first axis, moves the head in the second direction along the second axis,

the positioning accuracy of the head moving portion is higher than the positioning accuracy of the first moving portion and the positioning accuracy of the second moving portion.

2. The correction device according to claim 1, wherein,

the correction device has a first movement control part for controlling the first movement part and the second movement part,

the substrate has a pattern disposed on a surface,

the pattern having a first pattern disposed substantially along the first direction and a second pattern disposed substantially along the second direction in a state of being disposed on the first stage,

the first moving part and the second moving part are respectively provided with a reading part for reading the pattern,

the first movement control unit controls the first movement unit according to a result of reading the second pattern in the reading unit, and controls the second movement unit according to a result of reading the first pattern in the reading unit.

3. The correction device according to claim 2, wherein,

the first movement control unit acquires defect information, which is information on the position of a defect of the substrate, determines a defect overlapping pattern, which is a pattern overlapping the defect, from among the patterns based on the defect information, and controls the first movement unit and the second movement unit so that the head is moved above the defect overlapping pattern according to the number of the patterns read by the reading unit.

4. A correction device according to any one of claims 1 to 3, characterized in that,

the correction device has a second movement control part for controlling the head movement part,

the head has an image acquisition section that acquires an image of the substrate,

the second movement control section moves the head section based on the image acquired by the image acquisition section.

5. A correction device according to any one of claims 1 to 4, characterized in that,

the first moving part and the second moving part respectively use a linear motor using electromagnetic force as a driving source,

the head moving section uses a piezoelectric element as a driving source.

6. A correction device according to claim 2 or 3, characterized in that,

the positioning accuracy of the first moving part and the second moving part is thicker than the pitch of the pattern,

the head moving part has a finer positioning accuracy than the pitch of the pattern.