CN116937188A - Back-fed millimeter wave substrate integrated waveguide slot array antenna structure and radar equipment - Google Patents
Back-fed millimeter wave substrate integrated waveguide slot array antenna structure and radar equipment Download PDFInfo
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- 239000002184 metal Substances 0.000 claims abstract description 278
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/061—Two dimensional planar arrays
- H01Q21/064—Two dimensional planar arrays using horn or slot aerials
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
- H01Q13/10—Resonant slot antennas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0006—Particular feeding systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0006—Particular feeding systems
- H01Q21/0075—Stripline fed arrays
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Abstract
The application provides a slot array antenna structure of a back-fed millimeter wave substrate integrated waveguide and radar equipment, comprising: a plurality of metal layers, a plurality of dielectric substrates and a plurality of first metal holes; the dielectric substrates are correspondingly distributed between two adjacent metal layers; the metal layers and the dielectric substrates comprise a first area and a second area; the plurality of first metal holes are correspondingly formed in the plurality of metal layers and the first areas of the plurality of dielectric substrates; the plurality of metal layers comprise a first metal layer and a second metal layer which are sequentially arranged along a first direction; wherein a plurality of first metal holes in the first metal layer and the second metal layer are equidistantly arranged along the second direction to form two parallel rows; wherein the second direction is perpendicular to the first direction; the first area and the second area are arranged along the second direction; the technical scheme solves the problem of signal interference between the antenna structure and the feed structure.
Description
Technical Field
The application relates to the field of radar antennas, in particular to a slot array antenna structure of a back-fed millimeter wave substrate integrated waveguide and radar equipment.
Background
As an indispensable key component in the technical field of microwave antennas, millimeter wave antennas are widely used in radar and communication systems. The millimeter wave antenna needs to have the following characteristics: higher antenna gain and better directivity; the integrated circuit is convenient to integrate with other circuits of the system; small size, light weight, low cost and convenient mass production.
The traditional rectangular metal waveguide structure antenna can realize better performance indexes such as antenna gain, directivity and the like, but higher processing precision is required. In particular, for millimeter wave bands, the processing precision directly affects the antenna performance, and the antenna has large size and heavy weight, is difficult to integrate with a planar circuit, and is difficult to meet the system requirements of high integration, high-performance communication and intelligent perception at present.
The substrate integrated waveguide antenna can effectively overcome the defects of the traditional metal waveguide structure antenna and has wide application prospect. However, with the increasing complexity of radar and communication systems, a multilayer PCB is required to achieve high-integration system integration, which brings new challenges to the design, manufacture and application of the substrate integrated waveguide antenna. For example: the antenna and the peripheral circuit are easy to interfere with each other, and the stability of the laminated structure and the processing technology of the multi-layer PCB can seriously influence the performance of the antenna and the like.
The conventional millimeter wave antenna manufactured by adopting the multilayer PCB processing technology can be divided into two schemes of same-side feeding and back-side feeding according to the arrangement relation of a transmission feeding structure and an antenna radiation structure on a PCB. Existing ipsilateral or dorsal feed schemes cannot meet the following design goals simultaneously: mutual interference of antenna radiation signals and transmission line signals is avoided; good metal cavity shielding, heat dissipation of a chip at a feed side and antenna radiation are realized; the influence of material thickness variation and processing errors caused by the multilayer PCB lamination process on the antenna performance is reduced; simple process, low cost and stable and reliable key radiation structure.
It is therefore of particular importance to those skilled in the art to develop an array antenna unit that reduces the effect of material thickness variations caused by PCB processing on antenna performance and that avoids signal interference.
Disclosure of Invention
The application provides a slot array antenna structure of a back-fed millimeter wave substrate integrated waveguide and radar equipment, which are used for solving the problem of signal interference between an antenna structure and a feed structure.
According to a first aspect of the present application, there is provided a slot array antenna structure of a feedback millimeter wave substrate integrated waveguide, comprising: a plurality of metal layers, a plurality of dielectric substrates and a plurality of first metal holes; the dielectric substrates are correspondingly distributed between the adjacent metal layers; wherein the metal layers and the dielectric substrates each comprise a first region and a second region; the plurality of first metal holes are correspondingly formed in the plurality of metal layers and the first areas of the plurality of dielectric substrates; the plurality of metal layers comprise a first metal layer and a second metal layer which are sequentially arranged along a first direction; wherein the first metal holes in the first metal layer and the second metal layer are all equidistantly arranged in two rows parallel to each other along the second direction; wherein the second direction is perpendicular to the first direction; wherein the first region and the second region are arranged along the second direction;
wherein the first metal layer further comprises a transmission feed structure, and the transmission feed structure is disposed in the second region of the first metal layer; the transmission feed structure includes: a transmission feeder and a feed transition structure; wherein the transmission feeder line is arranged in the feed transition structure;
the second metal layer further comprises a plurality of radiation slit structures; and the plurality of radiation slit structures are alternately arranged in the second region of the second metal layer along the second direction; and the plurality of first metal holes on the second metal layer surround the plurality of radiation slit structures;
the plurality of radiation calibers are correspondingly arranged in the rest of the plurality of metal layers and the plurality of dielectric substrates; wherein the plurality of first metal holes respectively surround the corresponding radiation calibers.
Optionally, the feed transition structure is a Y-shaped bifurcation slit structure; the transmission feeder line is arranged in the Y-shaped bifurcation slit structure;
the first metal holes are respectively arranged at two ends of the Y-shaped opening at equal intervals along the second direction to form two parallel rows.
Optionally, the transmission feeder is a coplanar waveguide, a substrate integrated waveguide or a microstrip line.
Optionally, the transmission feed structure further includes: a plurality of shielding metal holes; the shielding metal holes are symmetrically arranged at two sides of the periphery of the Y-shaped bifurcation slit structure along the second direction;
the shielding metal holes are correspondingly formed on the second metal plate, and the rest of the metal layers and the dielectric substrates.
Optionally, each of the first metal layer and the second metal layer further includes:
a plurality of second metal holes; the plurality of second metal holes are distributed on one side, far away from the second area, of the first metal layer and the second metal layer, and are connected with the corresponding plurality of first metal holes;
the first metal layer, the second metal layer, the plurality of first metal holes and the plurality of second metal holes jointly form a substrate integrated waveguide; and the plurality of second metal holes are used for short-circuiting the terminal of the substrate integrated waveguide.
Optionally, the top view of each of the plurality of radiation slit structures is rectangular.
Optionally, the lengths of the plurality of radiation slit structures along the second direction are about λ/2; wherein λ characterizes a wavelength of electromagnetic waves in the substrate integrated waveguide.
Optionally, a distance between two adjacent radiation slit structures is about c/2f; wherein c is the speed of light in the air, and f is the working frequency of the slot array antenna structure of the back-fed millimeter wave substrate integrated waveguide.
Optionally, the plurality of metal layers further includes: a third metal layer, a fourth metal layer, a fifth metal layer, and a sixth metal layer;
wherein the shielding metal holes, the first metal holes and the second metal holes are correspondingly formed in the third metal layer, the fourth metal layer and the fifth metal layer;
wherein the plurality of radiation apertures are respectively formed in the third metal layer, the fourth metal layer, the fifth metal layer and the sixth metal layer correspondingly;
the shielding metal holes, the first metal holes and the second metal holes are distributed around the radiation caliber correspondingly.
Optionally, the plurality of dielectric substrates include:
the first dielectric substrate, the second dielectric substrate, the third dielectric substrate, the fourth dielectric substrate and the fifth dielectric substrate are sequentially arranged along the first direction; wherein the first dielectric substrate, the third dielectric substrate and the fifth dielectric substrate are core plate layers; the second medium substrate and the fourth medium substrate are prefabricated layers;
the first dielectric substrate, the second dielectric substrate, the third dielectric substrate, the fourth dielectric substrate and the fifth dielectric substrate are respectively provided with a plurality of shielding metal holes, a plurality of first metal holes and a plurality of second metal holes in a corresponding mode;
the plurality of radiation calibers are respectively formed on the third medium substrate, the fourth medium substrate and the fifth medium substrate correspondingly;
the shielding metal holes, the first metal holes and the second metal holes are distributed around the radiation caliber correspondingly.
Optionally, the cross section of the radiation caliber is rectangular.
Optionally, the width of the radiation aperture along the third direction is not smaller than the total arrangement width of the plurality of radiation slit structures along the third direction; wherein the third direction is parallel to the arrangement direction of the plurality of second metal holes.
Optionally, the method further comprises: a plurality of cylinders; the plurality of cylinders correspondingly penetrate through the plurality of shielding metal holes, the plurality of first metal holes and the plurality of second metal holes;
and one ends of the cylinders are connected to the sixth metal layer.
According to a second aspect of the present application, there is also provided a millimeter wave radar apparatus comprising the feedback millimeter wave substrate integrated waveguide slot array antenna structure of any one of the first aspect of the present application.
According to the back-fed millimeter wave substrate integrated waveguide slot array antenna structure, the transmission feed structure and the plurality of radiation slot structures are respectively arranged on the first metal layer and the second metal layer, so that mutual interference between transmission signals and radiation signals is effectively avoided, and meanwhile, the effects of flexibly regulating and controlling the gain and the directional diagram of the back-fed millimeter wave substrate integrated waveguide slot array antenna can be achieved by changing the number, the size and the positions of the plurality of radiation slot structures. In addition, a plurality of first metal holes are uniformly distributed around a plurality of radiation gap structures and a plurality of radiation apertures to form shielding fences on the sides of the plurality of radiation gap structures, so that leakage of microwave signals is reduced, and the effect of suppressing surface waves is achieved.
Further, by setting the first dielectric substrate layer as the core plate layer, the stability of the core plate layer is utilized, so that the influence of material thickness variation and process errors caused by a PCB process on the performance of the slot array antenna of the back-fed millimeter wave substrate integrated waveguide can be reduced.
Drawings
In order to more clearly illustrate the embodiments of the application or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the application, and that other drawings can be obtained according to these drawings without inventive faculty for a person skilled in the art.
Fig. 1 is an exploded view of a three-dimensional structure of a slot array antenna structure of a slot array of a substrate integrated waveguide for back-feeding millimeter waves according to an embodiment of the present application;
fig. 2 is a cross-sectional view of a laminated structure of a slot array antenna structure of a slot array of a substrate integrated waveguide of a feedback millimeter wave according to an embodiment of the present application;
fig. 3 is a top view of a first metal layer of a slot array antenna structure of a slot array of a feedback millimeter wave substrate integrated waveguide according to an embodiment of the present application;
fig. 4 is a top view of a second metal layer of a slot array antenna structure of a slot array of a feedback millimeter wave substrate integrated waveguide according to an embodiment of the present application;
fig. 5 is a top view of any one of the third metal layer to the fifth dielectric substrate of the slot array antenna structure of the integrated waveguide of the back-fed millimeter wave substrate according to an embodiment of the present application;
fig. 6 is a diagram of simulation results of return loss at an antenna input end of a slot array antenna structure of a feedback millimeter wave substrate integrated waveguide according to an embodiment of the present application;
FIG. 7 is a graph showing the variation of antenna gain with frequency in the frequency range of 76-81GHz for a slot array antenna structure of a slot array of a substrate integrated waveguide for a feedback millimeter wave according to an embodiment of the present application;
fig. 8 is an E-plane antenna radiation pattern at a frequency of 78GHz for a slot array antenna structure of a feedback millimeter wave substrate integrated waveguide according to an embodiment of the present application;
fig. 9 is an H-plane antenna radiation pattern at a frequency of 78GHz in a slot array antenna structure of a feedback millimeter wave substrate integrated waveguide according to an embodiment of the present application.
Description of the drawings:
1-a plurality of first metal holes;
a 2-feed transition structure;
3-a transmission feeder;
4-a plurality of radiation slit structures;
5-a plurality of radiation calibers;
6-a plurality of shielding metal holes;
7-a plurality of second metal holes;
8-a plurality of cylinders.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
The terms "first," "second," "third," "fourth" and the like in the description and in the claims and in the above drawings, if any, are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the application described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Existing ipsilateral or dorsal feed schemes cannot meet the following design goals simultaneously: mutual interference of antenna radiation signals and transmission line signals is avoided; good metal cavity shielding, heat dissipation of a chip at a feed side and antenna radiation are realized; the influence of material thickness variation and processing errors caused by the multilayer PCB lamination process on the antenna performance is reduced; simple process, low cost and stable and reliable key radiation structure.
In the same-side feeding scheme, the antenna and the feeding structure are arranged on the same side of the PCB, so that the influence of processing errors of the multi-layer transition structure on the antenna performance can be reduced, but the scheme has the following problems: firstly, the energy radiated by an antenna may influence the working stability of surrounding devices, so that the problems of saturation of a radio frequency receiver, noise floor elevation, disordered digital circuit timing sequence and the like are caused; secondly, the peripheral devices and wiring can cause distortion of the antenna pattern, so that the antenna beam is directed away from the expected direction; in addition, the antenna housing is required to protect the outer side of the antenna surface, and the heat dissipation performance of the antenna housing material is poor, so that high-efficiency contact heat dissipation cannot be realized.
In the backside feed scheme, the antenna and feed structure are placed on both sides of the PCB, generally requiring higher end processing (e.g., blind via processing of a multi-layer PCB as in 202211454715.5). Because the circuit processing precision and the thickness of the multi-layer circuit medium have great influence on the antenna performance, the common PCB process is difficult to meet the requirement of millimeter wave high-frequency band, and the consistency problem is faced in large-scale commercial mass production.
In view of the above-mentioned shortcomings of the prior art, the present application proposes a slot array antenna unit of a back-fed millimeter wave substrate integrated waveguide, which includes a transmission feeder, an antenna feed transition structure, a substrate integrated waveguide, a radiation slot array and a radiation aperture. The transmission feeder line can be a coplanar waveguide, a microstrip line, a substrate integrated waveguide or the like; the antenna feed transition structure is a Y-shaped bifurcation slit structure; the substrate integrated waveguide consists of a metal copper layer and two parallel rows of metallized through hole arrays, and the terminal of the substrate integrated waveguide is short-circuited; the radiation gap array consists of rectangular gaps which are alternately distributed along the central line; the radiation aperture is realized by rectangular windowing of other metal layers on the same side of the radiation slot array. The antenna feed structure and the radiation structure are arranged on two sides of the same layer of core board, so that mutual interference of antenna radiation signals and transmission line signals can be avoided. Meanwhile, the thickness of the core plate and the stability of electrical parameters are utilized, the influence of material thickness change and processing process errors caused by the multilayer PCB lamination process on the antenna performance is reduced, and the common through holes are adopted, so that a complex blind hole process is not required.
Furthermore, in the technical scheme provided by the application, the feeding side circuit is convenient to shield by adopting the metal cavity and realize good heat dissipation, the shielding cavity can not influence the radiation performance of the antenna, the antenna side can be protected by adopting the antenna housing, the heat dissipation of the feeding side circuit and the shielding effect of the metal cavity can not be influenced, and the good metal cavity shielding, the heat dissipation of the feeding side circuit and the radiation effect of the antenna are realized.
Therefore, the application can effectively avoid the mutual interference of antenna radiation signals and transmission line signals, can reduce the influence of material thickness variation and processing errors caused by the multilayer PCB lamination process on the antenna performance, and has simple process; meanwhile, good metal cavity shielding, power supply side circuit heat dissipation and antenna radiation effects can be achieved.
Meanwhile, the effect of regulating and controlling the antenna gain and the directional diagram can be achieved by changing the arrangement mode of the radiation slots on the radiation side of the antenna.
The technical scheme of the application is described in detail below by specific examples. The following embodiments may be combined with each other, and some embodiments may not be repeated for the same or similar concepts or processes.
Referring to fig. 1 to 9, L1, L2, L3, L4, L5 and L6 respectively represent: a first metal layer; a second metal layer; a third metal layer; a fourth metal layer; a fifth metal layer and a sixth metal layer; sub1, sub2, sub3, sub4, and Sub5 respectively represent: the first dielectric substrate, the second dielectric substrate, the third dielectric substrate, the fourth dielectric substrate and the fifth dielectric substrate;
according to an embodiment of the present application, there is provided a slot array antenna structure of a feedback millimeter wave substrate integrated waveguide, including: a plurality of metal layers, a plurality of dielectric substrates and a plurality of first metal holes 1; the dielectric substrates are correspondingly distributed between the adjacent metal layers; wherein the metal layers and the dielectric substrates each comprise a first region and a second region; the plurality of first metal holes 1 are correspondingly formed in the plurality of metal layers and the first areas of the plurality of dielectric substrates; the plurality of metal layers comprise a first metal layer and a second metal layer which are sequentially arranged along a first direction; wherein the first metal holes 1 in the first metal layer and the second metal layer are all equidistantly arranged in two parallel rows along the second direction; wherein the second direction is perpendicular to the first direction; wherein the first region and the second region are arranged along the second direction;
wherein the first metal layer further comprises a transmission feed structure, and the transmission feed structure is disposed in the second region of the first metal layer; the transmission feed structure includes: a transmission feeder 3 and a feed transition structure 2; wherein the transmission feeder line 3 is arranged in the feed transition structure 2; a top view of the first metal layer is shown in fig. 3;
the second metal layer further comprises a plurality of radiation slit structures 4; and the plurality of radiation slit structures 4 are alternately arranged in the second region of the second metal layer along the second direction; and the number of first metal holes 1 on the second metal layer surrounds the number of radiation slit structures 4; a top view of the second metal layer is shown in fig. 4;
a plurality of radiation apertures 5 correspondingly arranged in the rest of the metal layers and the dielectric substrates; wherein the plurality of first metal holes 1 respectively surround the corresponding radiation apertures 5; a top view of the plurality of metal layers and the plurality of radiation apertures in the plurality of dielectric substrates is shown in fig. 5;
the feedback millimeter wave substrate integrated waveguide slot array antenna structure receives a microwave signal through the transmission feed structure, transmits the microwave signal into an area surrounded by the plurality of first metal holes 1, radiates the microwave signal to the plurality of radiation apertures 5 through the plurality of radiation slot structures 4, radiates the microwave signal outwards through the plurality of radiation apertures 5, and a three-dimensional structure explosion diagram of the feedback millimeter wave substrate integrated waveguide slot array antenna structure is shown in fig. 1; a cross-sectional view of a laminated structure of the slot array antenna structure of the back-fed millimeter wave substrate integrated waveguide is shown in fig. 2;
wherein, sub1+l2 shall be L2, wherein Sub1 shall be located between L1 and L2, and the icons are labeled as follows in fig. 1 and fig. 2 for convenience of description: sub1+L2, sub2+L3, sub3+L4, sub4+L5, sub5+L6.
According to the technical scheme provided by the application, the transmission feed structure and the plurality of radiation slot structures are respectively arranged on the first metal layer and the second metal layer, so that the mutual interference between a transmission signal and a radiation signal can be effectively avoided, and the effects of flexibly regulating and controlling the gain and the pattern of the back-fed millimeter wave substrate integrated waveguide slot array antenna can be realized by changing the number, the size and the positions of the plurality of radiation slot structures. In addition, a plurality of first metal holes are uniformly distributed around a plurality of radiation gap structures and a plurality of radiation apertures to form shielding fences on the sides of the plurality of radiation gap structures, so that leakage of microwave signals is reduced, and the effect of suppressing surface waves is achieved.
Further, the application can effectively avoid the mutual interference of antenna radiation signals and transmission line signals, realize good metal cavity shielding, power supply side circuit heat dissipation and antenna radiation effects, and reduce the influence of material thickness variation and processing process errors caused by the multilayer PCB lamination process on the antenna performance.
In the technical scheme provided by the application, the through hole process only adopts a common through hole process, and a complex blind hole process is not required. The process difficulty is reduced.
In an embodiment, each of the plurality of radiation slit structures 4 has a rectangular shape in top view; in a specific embodiment, the number of the radiation slit structures 4 is 8.
In one embodiment, the radiation aperture 5 has a rectangular cross-section; so as to ensure that the radiated electromagnetic waves pass smoothly.
In a preferred embodiment, the frequency of the microwave signal is 78GHz.
In one embodiment, the first metal layer and the second metal layer each further comprise:
a plurality of second metal holes 7; the second metal holes 7 are distributed on one side, far away from the second area, of the first metal layer and the second metal layer, and are respectively connected with the corresponding first metal holes 1;
wherein, the first metal layer, the second metal layer, the plurality of first metal holes 1 and the plurality of second metal holes 7 together form a substrate integrated waveguide; and the second metal holes 7 are used for short-circuiting the terminal of the substrate integrated waveguide.
In another embodiment, the terminal of the substrate integrated waveguide may also be connected to a matching load.
In one embodiment, the antenna housing is used for protecting one side of the substrate integrated waveguide to avoid affecting the shielding effect of the metal cavity on the side of the transmission feed structure, and meanwhile, the transmission feed structure can achieve good heat dissipation.
In one embodiment, the feed transition structure 2 is a Y-shaped bifurcated slit structure; the transmission feeder line 3 is arranged in the Y-shaped bifurcation slit structure;
the first metal holes 1 are respectively arranged in two parallel rows from two ends of the Y-shaped opening along the second direction at equal intervals.
In one embodiment, the transmission feed structure further comprises: a plurality of shielding metal holes 6; the shielding metal holes 6 are symmetrically arranged at two sides of the periphery of the Y-shaped bifurcation slit structure along the second direction;
wherein, the shielding metal holes 6 are correspondingly formed on the second metal plate, and the rest of the metal layers and the dielectric substrates.
Wherein, a plurality of shielding metal holes 6, transmission feeder lines 3 and feed transition structures 2 are arranged in the second area of the first metal layer, which can facilitate the connection and test with the radio frequency device.
In one embodiment, the transmission feeder 3 is a coplanar waveguide, a substrate integrated waveguide, or a microstrip line. In a specific embodiment, the transmission feeder 3 is a coplanar waveguide. The coplanar waveguide has the characteristics of low dielectric loss, low radiation loss, high isolation and the like, and is convenient to connect with devices; the coplanar waveguide forms a shielding structure of the coplanar waveguide through a plurality of shielding metal holes; the substrate integrated waveguide end forms a shielding structure of the substrate integrated waveguide through the first metal holes and the second metal holes so as to avoid leakage of microwave signals and interference to surrounding circuits.
Of course, the transmission feeder may be in other implementation forms, and any implementation form of the transmission feeder that can achieve the purpose of the present application is within the protection scope of the present application, which is not limited by the present application.
In one embodiment, the plurality of metal layers further comprises: a third metal layer, a fourth metal layer, a fifth metal layer, and a sixth metal layer;
wherein the shielding metal holes 6, the first metal holes 1 and the second metal holes 7 are correspondingly formed in the third metal layer, the fourth metal layer and the fifth metal layer;
wherein the plurality of radiation apertures 5 are respectively formed in the third metal layer, the fourth metal layer, the fifth metal layer and the sixth metal layer correspondingly;
the shielding metal holes 6, the first metal holes 1 and the second metal holes 7 are distributed around the radiation aperture 5 correspondingly. In one embodiment, the metal layers may each be copper layers.
The first metal layer to the sixth metal layer are penetrated by a plurality of shielding metal holes 6, a plurality of first metal holes 1 and a plurality of second metal holes 7, so that a shielding structure of a coplanar waveguide and a Substrate Integrated Waveguide (SIW) is formed, electromagnetic wave leakage and interference to surrounding circuits are avoided, and the plurality of shielding metal holes 6, the plurality of first metal holes 1 and the plurality of second metal holes 7 adopt a through hole process, so that processing difficulty and cost can be reduced.
The third metal layer, the fourth metal layer, the fifth metal layer and the sixth metal layer are hollowed out to form a plurality of radiation apertures 5, metal holes are reserved on the periphery to form shielding fences, the radiation energy of the antenna is reduced, the radiation energy is leaked through the multilayer circuit board, and the surface wave suppression effect is achieved.
In one embodiment, the plurality of dielectric substrates includes:
the first dielectric substrate, the second dielectric substrate, the third dielectric substrate, the fourth dielectric substrate and the fifth dielectric substrate are sequentially arranged along the first direction; wherein the first dielectric substrate, the third dielectric substrate and the fifth dielectric substrate are core plate layers; the second medium substrate and the fourth medium substrate are prefabricated layers;
the first dielectric substrate is made of a core material, so that good structural stability can be kept in the manufacturing process of the multilayer PCB, and the lamination influence is small. The core board is subjected to pre-hardening treatment, and the thickness and the electrical parameters of the core board are relatively determined and stable. The thickness and electrical parameters of the core plate are more stable than those of the prepreg PP layer (i.e. the prefabricated layer) used for lamination bonding, and the influence of material thickness variation and processing errors caused by the multi-layer PCB lamination process on the antenna performance can be reduced. By designing the antenna body structure (including the feed transition structure and the antenna radiation slot) on the first metal layer and the second metal layer on both sides of the first dielectric substrate, the antenna performance can be ensured to be substantially unaffected by the multilayer PCB lamination process.
Wherein the first dielectric substrate, the second dielectric substrate, the third dielectric substrate, the fourth dielectric substrate and the fifth dielectric substrate are respectively and correspondingly provided with the shielding metal holes 6, the first metal holes 1 and the second metal holes 7;
the radiation calibers 5 are respectively formed on the third medium substrate, the fourth medium substrate and the fifth medium substrate correspondingly;
the shielding metal holes 6, the first metal holes 1 and the second metal holes 7 are distributed around the radiation caliber 5 correspondingly; to form a shielding fence on the radiation aperture side, thereby reducing leakage of microwave signals and realizing the effect of suppressing surface waves.
In a specific embodiment, the materials of the first dielectric substrate and the fifth dielectric substrate are RO3003G2 high-frequency laminated plates; the second dielectric substrate and the fourth dielectric substrate are made of a speedwave300p prepreg; the third dielectric substrate is made of RO4835 laminated board.
Wherein, the above lamination structure is set as the central symmetry structure, namely: the first medium layer and the fifth medium layer are the same core plate, the second medium layer and the fourth medium layer are the same PP layer (prefabricated layer), so that the high reliability of the medium substrate is improved, and the warping deformation of the medium substrate caused by different material characteristics is prevented.
Of course, the above-mentioned dielectric substrates may be made of other materials, and the application is not limited thereto, and any dielectric substrate material capable of achieving the corresponding effects of the application is within the scope of the application.
In one embodiment, the length of the plurality of radiation slit structures 4 in the second direction is about λ/2; wherein λ characterizes a wavelength of electromagnetic waves in the substrate integrated waveguide.
In one embodiment, the spacing between the nearest edges of two adjacent radiation slit structures 4 is about c/2f; wherein c is the speed of light in the air, and f is the working frequency of the slot array antenna structure of the back-fed millimeter wave substrate integrated waveguide. The radiation slot structures are alternately arranged on the second metal layer, and electric fields of two adjacent radiation slot structures are in phase, so that microwave signals radiated by the radiation slot structures are overlapped in space and in phase, stronger microwave signals are generated, and the effects of flexibly regulating and controlling the gain and the directional diagram of the feedback millimeter wave substrate integrated waveguide slot array antenna are realized by regulating the number, the size and the position of the radiation slot structures.
In one embodiment, the width of the radiation aperture 5 along the third direction is greater than or equal to the total width of the plurality of radiation slit structures 4 arranged along the third direction; the third direction is parallel to the arrangement direction of the plurality of second metal holes 7, so as to ensure that the microwave signal can smoothly radiate outwards through the radiation aperture.
In a specific embodiment, taking the transmission feeder line 3 as a coplanar waveguide, the top view of each of the plurality of radiation slot structures 4 is rectangular (as shown in fig. 4), and the shape of the cross section of the radiation aperture 5 is rectangular (as shown in fig. 5), the performance of the slot array antenna of the back-fed millimeter wave substrate integrated waveguide provided by the application is specifically described:
firstly, the inventor of the present application performs a simulation experiment on the return loss of the slot array antenna of the back-fed millimeter wave substrate integrated waveguide to obtain an S-parameter simulation result, as shown in fig. 6, where the abscissa represents the frequency of the microwave signal, the unit GHz, the ordinate represents the S-parameter, the unit dB, and S (1, 1) represents the return loss of the microwave signal input by the port 1 and reflected back to the port 1. The curve in fig. 6 is a plot of return loss as a function of frequency of the microwave signal; as can be seen from fig. 6: s11 is less than or equal to-14 dB in the frequency range of 76-81 GHz; wherein, the echo loss can reflect the effect of impedance matching of the input port of the back-fed millimeter wave substrate integrated waveguide slot array antenna, while the lower the value of the echo loss is, the better the antenna performance is, as can be seen from fig. 6, the back-fed millimeter wave substrate integrated waveguide slot array antenna can show good performance in the whole working frequency range.
Next, a graph of gain variation of the feedback millimeter wave substrate integrated waveguide slot array antenna with frequency is shown in fig. 7, wherein the abscissa represents the frequency of the microwave signal, unit GHz, and the ordinate represents the antenna gain, unit dBi; as can be seen from fig. 7, in the frequency range of 76-81GHz, the antenna gain is greater than 11.5dBi, and since the antenna gain can reflect the capability of the back-fed millimeter wave substrate integrated waveguide slot array antenna to intensively emit the microwave signal in a certain direction, the larger the number of antenna gains, the stronger the directivity of the antenna is, and the more concentrated the transmission of the microwave signal can be achieved, as can be seen from fig. 7, the back-fed millimeter wave substrate integrated waveguide slot array antenna can exhibit good directivity in the whole working frequency range.
Correspondingly, at a 78GHz frequency point, an E-plane antenna radiation pattern of the feedback millimeter wave substrate integrated waveguide slot array antenna is shown in fig. 8; the radiation pattern of the H-plane antenna is shown in fig. 9, where the curve in fig. 8 represents the radiation pattern of the E-plane antenna of the slot array antenna of the feedback millimeter wave substrate integrated waveguide in this embodiment; fig. 9 is a graph showing an H-plane antenna radiation pattern of the slot array antenna of the feedback millimeter wave substrate integrated waveguide in this embodiment; in fig. 8 and 9, the outer rings each represent an angle, and the radial gradients each represent an antenna gain; as can be seen from fig. 8 and 9, the E-plane 3dB beam width is about ±30°, the H-plane 3dB beam width is about ±12°, the E-plane wide beam can achieve a larger beam coverage, and the H-plane beam is narrower to achieve a higher gain performance.
According to the technical scheme provided by the application, different antenna frequency responses and radiation patterns can be obtained by adjusting the gap size and the gap distance.
In one embodiment, the method further comprises: a plurality of cylinders 8; the plurality of cylinders 8 correspondingly penetrate through the plurality of shielding metal holes 6, the plurality of first metal holes 1 and the plurality of second metal holes 7;
wherein one end of the cylinders 8 is connected to the sixth metal layer. As shown in fig. 1, it should be noted that the cylinders are hollow metal cavities, which represent the metal layers and the metal layers plated on the inner walls of the shielding metal holes, the first metal holes and the second metal holes in the dielectric substrates.
The technical scheme provided by the application can effectively avoid the mutual interference of antenna radiation signals and transmission line signals, can reduce the influence of material thickness variation and processing process errors on the antenna performance caused by a multilayer PCB lamination process, and has simple process.
Furthermore, in the technical scheme provided by the application, the feeding side circuit is convenient to shield by adopting the metal cavity and realize good heat dissipation, the shielding cavity can not influence the radiation performance of the antenna, the antenna side can be protected by adopting the antenna housing, the heat dissipation of the feeding side circuit and the shielding effect of the metal cavity can not be influenced, and the good metal cavity shielding, the heat dissipation of the feeding side circuit and the radiation effect of the antenna are realized.
The antenna adopts a slot array as a radiation structure, and the gain and the directional diagram of the antenna can be flexibly regulated and controlled by setting the number, the size and the position of the slots.
According to a second aspect of the present application, there is also provided a millimeter wave radar apparatus comprising the feedback millimeter wave substrate integrated waveguide slot array antenna structure of any one of the first aspect of the present application.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and not for limiting the same; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the application.
Claims (14)
1. The utility model provides a back-fed millimeter wave substrate integrated waveguide slot array antenna structure which characterized in that includes: a plurality of metal layers, a plurality of dielectric substrates and a plurality of first metal holes; the dielectric substrates are correspondingly distributed between the adjacent metal layers; wherein the metal layers and the dielectric substrates each comprise a first region and a second region; the plurality of first metal holes are correspondingly formed in the plurality of metal layers and the first areas of the plurality of dielectric substrates; the plurality of metal layers comprise a first metal layer and a second metal layer which are sequentially arranged along a first direction; wherein the first metal holes in the first metal layer and the second metal layer are all equidistantly arranged in two rows parallel to each other along the second direction; wherein the second direction is perpendicular to the first direction; wherein the first region and the second region are arranged along the second direction;
wherein the first metal layer further comprises a transmission feed structure, and the transmission feed structure is disposed in the second region of the first metal layer; the transmission feed structure includes: a transmission feeder and a feed transition structure; wherein the transmission feeder line is arranged in the feed transition structure;
the second metal layer further comprises a plurality of radiation slit structures; and the plurality of radiation slit structures are alternately arranged in the second region of the second metal layer along the second direction; and the plurality of first metal holes on the second metal layer surround the plurality of radiation slit structures;
the plurality of radiation calibers are correspondingly arranged in the rest of the plurality of metal layers and the plurality of dielectric substrates; wherein the plurality of first metal holes respectively surround the corresponding radiation calibers.
2. The structure of the slot array antenna of the back-fed millimeter wave substrate integrated waveguide of claim 1, wherein the feed transition structure is a Y-shaped bifurcated slot structure; the transmission feeder line is arranged in the Y-shaped bifurcation slit structure;
the first metal holes are respectively arranged at two ends of the Y-shaped opening at equal intervals along the second direction to form two parallel rows.
3. The back-fed millimeter wave substrate integrated waveguide slot array antenna structure of claim 2, wherein said transmission feed line is a coplanar waveguide, a substrate integrated waveguide, or a microstrip line.
4. The back-fed millimeter wave substrate integrated waveguide slot array antenna structure of claim 3, wherein said transmission feed structure further comprises: a plurality of shielding metal holes; the shielding metal holes are symmetrically arranged at two sides of the periphery of the Y-shaped bifurcation slit structure along the second direction;
the shielding metal holes are correspondingly formed on the second metal plate, and the rest of the metal layers and the dielectric substrates.
5. The feedback millimeter wave substrate integrated waveguide slot array antenna structure of claim 4, wherein the first metal layer and the second metal layer each further comprise:
a plurality of second metal holes; the plurality of second metal holes are distributed on one side, far away from the second area, of the first metal layer and the second metal layer, and are connected with the corresponding plurality of first metal holes;
the first metal layer, the second metal layer, the plurality of first metal holes and the plurality of second metal holes jointly form a substrate integrated waveguide; and the plurality of second metal holes are used for short-circuiting the terminal of the substrate integrated waveguide.
6. The back-fed millimeter wave substrate integrated waveguide slot array antenna structure of claim 5, wherein a top view of each of said plurality of radiating slot structures is rectangular.
7. The feedback millimeter wave substrate integrated waveguide slot array antenna structure of claim 6, wherein the lengths of the plurality of radiating slot structures along the second direction are approximately λ/2; wherein λ characterizes a wavelength of electromagnetic waves in the substrate integrated waveguide.
8. The structure of claim 7, wherein the spacing between two adjacent radiating slot structures is about c/2f; wherein c is the speed of light in the air, and f is the working frequency of the slot array antenna structure of the back-fed millimeter wave substrate integrated waveguide.
9. The back-fed millimeter wave substrate integrated waveguide slot array antenna structure of claim 8, wherein said plurality of metal layers further comprises: a third metal layer, a fourth metal layer, a fifth metal layer, and a sixth metal layer;
wherein the shielding metal holes, the first metal holes and the second metal holes are correspondingly formed in the third metal layer, the fourth metal layer and the fifth metal layer;
wherein the plurality of radiation apertures are respectively formed in the third metal layer, the fourth metal layer, the fifth metal layer and the sixth metal layer correspondingly;
the shielding metal holes, the first metal holes and the second metal holes are distributed around the radiation caliber correspondingly.
10. The structure of claim 9, wherein the plurality of dielectric substrates comprise:
the first dielectric substrate, the second dielectric substrate, the third dielectric substrate, the fourth dielectric substrate and the fifth dielectric substrate are sequentially arranged along the first direction; wherein the first dielectric substrate, the third dielectric substrate and the fifth dielectric substrate are core plate layers; the second medium substrate and the fourth medium substrate are prefabricated layers;
the first dielectric substrate, the second dielectric substrate, the third dielectric substrate, the fourth dielectric substrate and the fifth dielectric substrate are respectively provided with a plurality of shielding metal holes, a plurality of first metal holes and a plurality of second metal holes in a corresponding mode;
the plurality of radiation calibers are respectively formed on the third medium substrate, the fourth medium substrate and the fifth medium substrate correspondingly;
the shielding metal holes, the first metal holes and the second metal holes are distributed around the radiation caliber correspondingly.
11. The structure of claim 10, wherein the cross section of the radiating aperture is rectangular.
12. The structure of claim 11, wherein the width of the radiation aperture along a third direction is not less than the total width of the plurality of radiation slot structures along the third direction; wherein the third direction is parallel to the arrangement direction of the plurality of second metal holes.
13. The back-fed millimeter wave substrate integrated waveguide slot array antenna structure of claim 12, further comprising: a plurality of cylinders; the plurality of cylinders correspondingly penetrate through the plurality of shielding metal holes, the plurality of first metal holes and the plurality of second metal holes;
and one ends of the cylinders are connected to the sixth metal layer.
14. A millimeter wave radar device comprising the backfeed millimeter wave substrate integrated waveguide slot array antenna structure of any one of claims 1-13.
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| CN202310950726.0A CN116937188A (en) | 2023-07-31 | 2023-07-31 | Back-fed millimeter wave substrate integrated waveguide slot array antenna structure and radar equipment |
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| CN202310950726.0A CN116937188A (en) | 2023-07-31 | 2023-07-31 | Back-fed millimeter wave substrate integrated waveguide slot array antenna structure and radar equipment |
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