CN116936404A - Buffer discharging system and buffer discharging method - Google Patents

Buffer discharging system and buffer discharging method Download PDF

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Publication number
CN116936404A
CN116936404A CN202310713000.5A CN202310713000A CN116936404A CN 116936404 A CN116936404 A CN 116936404A CN 202310713000 A CN202310713000 A CN 202310713000A CN 116936404 A CN116936404 A CN 116936404A
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CN
China
Prior art keywords
buffer
tray
test
unloading
chips
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Pending
Application number
CN202310713000.5A
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Chinese (zh)
Inventor
张东东
包荣剑
万杨
章华荣
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Hangzhou Changchuan Technology Co Ltd
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Hangzhou Changchuan Technology Co Ltd
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Application filed by Hangzhou Changchuan Technology Co Ltd filed Critical Hangzhou Changchuan Technology Co Ltd
Priority to CN202310713000.5A priority Critical patent/CN116936404A/en
Publication of CN116936404A publication Critical patent/CN116936404A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/34—Sorting according to other particular properties
    • B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/36—Sorting apparatus characterised by the means used for distribution
    • B07C5/361—Processing or control devices therefor, e.g. escort memory
    • B07C5/362—Separating or distributor mechanisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/36—Sorting apparatus characterised by the means used for distribution
    • B07C5/38—Collecting or arranging articles in groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C2301/00—Sorting according to destination
    • B07C2301/0008—Electronic Devices, e.g. keyboard, displays

Abstract

The application relates to a buffer discharging system and a buffer discharging method, which can improve the discharging efficiency of a whole machine while giving consideration to the higher efficiency of each manipulator. The buffer discharging system comprises: a receiving tray; a test tray circulating between a first unloading position and a second unloading position; a buffer tray assembly including a first movable buffer tray corresponding to a first unloading position and a second movable buffer tray corresponding to a second unloading position; the first unloading manipulator is used for taking out the chips from the test tray positioned at the first unloading position so as to put the chips into the corresponding grade area of the first movable buffer disk according to the test result; the second unloading manipulator is used for taking out the chips from the test tray positioned at the second unloading position so as to put the chips into the corresponding grade area of the second movable buffer disk according to the test result; and the sorting manipulator is used for taking out chips from the corresponding grade areas in the first movable buffer disk and the second movable buffer disk respectively so as to put in the receiving tray of the corresponding grade.

Description

Buffer discharging system and buffer discharging method
Technical Field
The application relates to the technical field of chip manufacturing, in particular to a buffer discharging system and a buffer discharging method.
Background
With rapid development of technology, communication equipment, consumer electronics and other products are increasing; the quality of the chip is directly related to the quality of the electronic product, so the chip is usually required to be tested after the production is finished, and the chip is sorted and palletized according to various grades according to the test result.
During chip testing and sorting, the trays of the Tray feeding and sorting part need manual intervention to carry out Tray feeding and Tray discharging operations, but the internal test Tray (T-Tray carrier Tray) does not need manual intervention under normal conditions, and the test Tray automatically presents a 'mouth' -shaped circulation inside the machine. The specific test sorting process is as follows: firstly, carrying chips in a feeding tray and filling the chips in the feeding tray with a test tray automatically by a special loading manipulator at a feeding position; after horizontal or vertical conveying and testing by a testing station, completely taking down chips on the testing tray at an unloading station by a special unloading manipulator so as to put the chips into a receiving tray of a corresponding grade according to a testing result; finally, the empty test trays are transported back to the feed level, thereby forming a circulating reflow on the predetermined circulation path.
However, in existing chip test sort systems: on one hand, the distance between the test tray and the material receiving tray is long, so that the stroke of the manipulator is long, and the efficiency of the whole machine is seriously influenced; on the other hand, because the chips with the same grade on the test tray are often distributed in different areas, one chip with a certain grade has to be taken out firstly by the unloading manipulator when the material is taken out, and another chip with the same grade is taken out after a plurality of chip pits are skipped, and then the adsorbed chips are placed on the same material receiving tray, so that the unloading sorting efficiency of the unloading manipulator is seriously affected.
Disclosure of Invention
The application has the advantages that the buffer discharging system and the buffer discharging method are provided, and the discharging efficiency of the whole machine can be improved while each manipulator has higher efficiency.
Another advantage of the present application is to provide a buffer unloading system and a buffer unloading method, in which in one embodiment of the present application, the buffer unloading system can set a buffer tray in a conveying path between a test tray and a supply tray, so as to unload chips and sort chips by an unloading manipulator and a sorting manipulator, respectively, which is helpful to shorten a conveying stroke of the manipulator and improve unloading efficiency.
Another advantage of the present application is to provide a buffer unloading system and a buffer unloading method, in which in one embodiment of the present application, the buffer unloading system can unload chips from left and right areas of the same test tray by two unloading robots respectively to match the efficiency of one sorting robot so as to improve the unloading efficiency of the whole machine.
Another advantage of the present application is to provide a buffer discharge system and a buffer discharge method, wherein in one embodiment of the present application, the buffer discharge system enables the discharge robot to perform a pitch change in only one direction, and the sorting robot to perform a pitch change in only the other direction, which helps to simplify the structure of the robot.
Another advantage of the present application is to provide a buffer discharge system and a buffer discharge method in which expensive materials or complex structures are not required in the present application in order to achieve the above objects. The present application thus successfully and efficiently provides a solution that not only provides a simple buffer discharge system and buffer discharge method, but also increases the practicality and reliability of the buffer discharge system and buffer discharge method.
To achieve at least one of the above or other advantages and objects of the application, there is provided a buffer discharging system comprising:
a receiving tray;
a test tray configured to circulate between a first unloading position and a second unloading position;
a buffer tray assembly disposed in a conveyance path between the receiving tray and the test tray, and including a first moving buffer tray corresponding to the first unloading position and a second moving buffer tray corresponding to the second unloading position;
the first unloading manipulator is arranged between the first unloading position and the first movable buffer disk and is used for taking out chips from the test tray positioned at the first unloading position so as to put the chips into the corresponding grade area of the first movable buffer disk according to a test result;
the second unloading manipulator is arranged between the second unloading position and the second movable buffer disk and is used for taking out chips from the test tray positioned at the second unloading position so as to put the chips into the corresponding grade area of the second movable buffer disk according to the test result; and
the sorting manipulator is arranged between the buffer disc assembly and the material receiving tray and is used for taking out chips from corresponding grade areas in the first movable buffer disc and the second movable buffer disc respectively so as to put in the material receiving tray of the corresponding grade.
According to one embodiment of the application, the first unloading bit and the second unloading bit are spaced apart along a first direction; the test tray has a first test area and a second test area arranged along the first direction; when the test tray moves to the first unloading position, the first unloading manipulator is used for taking out chips from the first test area of the test tray to put the chips into the first movable buffer disk; and when the test tray moves to the second unloading position, the second unloading manipulator is used for taking out chips from the second test area of the test tray so as to put the chips into the second movable buffer disk.
According to one embodiment of the application, the first moving buffer tray comprises a first buffer tray, a second buffer tray and a driving device connected with the first buffer tray and the second buffer tray, wherein the first buffer tray and the second buffer tray are movably arranged on a carrying path between the first unloading position and the material receiving tray and used for alternately moving back and forth between the first unloading position and the material receiving tray under the driving of the driving device.
According to one embodiment of the application, the test tray and the receiving tray are arranged along a second direction, wherein the second direction is perpendicular to the first direction; the first and second buffer trays are arranged at intervals in a third direction that is mutually perpendicular to the first and second directions, respectively.
According to one embodiment of the application, the driving device comprises a first driving motor, a second driving motor, a first transmission mechanism connected with an output shaft of the first driving motor and a second transmission mechanism connected with an output shaft of the second driving motor, wherein the first transmission mechanism is in transmission connection with the first buffer carrier disc and is used for converting the rotary motion of the first driving motor into the translational motion of the first buffer carrier disc; the second transmission mechanism is in transmission connection with the second buffer carrier disc and is used for converting the rotation motion of the second driving motor into the translation motion of the second buffer carrier disc.
According to one embodiment of the application, the buffer tray assembly further comprises a fixed buffer tray fixedly arranged in a carrying path between the receiving tray and the first or second moving buffer tray for buffering chips taken out of the first or second moving buffer tray via the sorting robot when the receiving tray is full.
According to one embodiment of the application, a plurality of the fixed buffer trays are arranged at intervals, wherein the first moving buffer tray and the second moving buffer tray are respectively located between two adjacent fixed buffer trays, and at least one of the fixed buffer trays is located between the first moving buffer tray and the second moving buffer tray.
According to one embodiment of the application, the material receiving tray is provided with a plurality of material receiving chip pits which are arranged in an array manner, the test tray is provided with a plurality of test chip pits which are arranged in an array manner, and the buffer tray assembly is provided with a plurality of buffer chip pits which are arranged in an array manner; the space between adjacent buffer chip pits on the fixed buffer disk in two directions is respectively equal to the space between adjacent receiving chip pits in the corresponding directions.
According to one embodiment of the application, the material receiving tray is provided with a plurality of material receiving chip pits which are arranged in an array manner, the test tray is provided with a plurality of test chip pits which are arranged in an array manner, and the buffer tray assembly is provided with a plurality of buffer chip pits which are arranged in an array manner; wherein the pitch of adjacent buffer chip pits on the first moving buffer disk and the second moving buffer disk in one direction is equal to the pitch of adjacent test chip pits in the one direction, and the pitch of adjacent buffer chip pits on the first moving buffer disk and the second moving buffer disk in the other direction is equal to the pitch of adjacent receiving chip pits in the other direction.
According to one embodiment of the application, the first unloading robot and the second unloading robot are respectively provided for adjusting the pitch of the picked chips in the second direction to be equal to the pitch of the adjacent buffer chip pits in the second direction when the chips are carried; the sorting manipulator is arranged for adjusting the spacing of the picked chips in the first direction to be equal to the spacing of adjacent receiving chip pits in the first direction when the chips are handled.
According to another aspect of the present application, there is further provided a buffer discharging method, including the steps of:
after the test tray is moved to the first unloading position, the chip is taken out from the first test area of the test tray so as to be put into the corresponding grade area of the first movable buffer tray of the buffer tray assembly according to the test result;
after the test tray is moved to a second unloading position, the chip is taken out from a second test area of the test tray so as to be placed into a corresponding grade area of a second movable buffer disk of the buffer disk assembly according to a test result; and
and respectively taking out the chips from the corresponding grade areas in the first movable buffer disk and the second movable buffer disk so as to put the chips into the receiving trays of the corresponding grades.
According to one embodiment of the application, the buffer unloading method further comprises the steps of:
and alternately moving the first buffer carrier disc and the second buffer carrier disc of the first movable buffer disc back and forth between the first unloading position and the material receiving tray so as to put the chips taken out from the test tray positioned at the first unloading position into one buffer carrier disc adjacent to the first unloading position, and take out the chips from the other buffer carrier disc so as to put the chips into the material receiving tray.
According to one embodiment of the application, the buffer unloading method further comprises the steps of:
when the receiving tray is full, chips taken out from the first movable buffer tray or the second movable buffer tray are placed in a fixed buffer tray fixedly arranged on a conveying path between the receiving tray and the first movable buffer tray or the second movable buffer tray.
According to one embodiment of the application, the buffer unloading method further comprises the steps of:
adjusting the spacing of chips taken out from the test tray in one direction to be equal to the spacing of adjacent buffer chip pits on the first moving buffer tray or the second moving buffer tray in the one direction; and
and respectively adjusting the spacing of the chips taken out from the first movable buffer tray and the second movable buffer tray in the other direction to be equal to the spacing of adjacent receiving chip pits on the receiving tray in the other direction.
Drawings
FIG. 1 is a schematic diagram of a buffer discharge system according to one embodiment of the present application;
FIG. 2 shows a schematic layout of a buffer discharge system according to the above-described embodiment of the present application;
FIG. 3 shows a schematic view of a partial explosion of a buffer discharge system according to the above-described embodiment of the present application;
FIG. 4 is a schematic view showing the structure of a buffer tray assembly in a buffer discharging system according to the above embodiment of the present application;
fig. 5 is a flow chart of a buffer unloading method according to an embodiment of the application.
Description of main reference numerals: 10. a receiving tray; 100. receiving a chip pit; 20. a test tray; 200. testing the chip pits; 201. a first unloading position; 202. a second unloading position; 21. a first test area; 22. a second test area; 30. a buffer tray assembly; 300. buffering the chip pits; 31. a first movable buffer tray; 311. a first buffer carrier; 312. a second buffer carrier; 313. a driving device; 3131. a first driving motor; 3132. a second driving motor; 3133. a first transmission mechanism; 3134. a second transmission mechanism; 32. a second movable buffer tray; 33. fixing a buffer disc; 40. a first unloading manipulator; 50. a second unloading manipulator; 60. sorting manipulator.
The foregoing general description of the application will be described in further detail with reference to the drawings and detailed description.
Detailed Description
The following description is presented to enable one of ordinary skill in the art to make and use the application. The preferred embodiments in the following description are by way of example only and other obvious variations will occur to those skilled in the art. The basic principles of the application defined in the following description may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the application.
It will be appreciated by those skilled in the art that in the present disclosure, the terms "longitudinal," "transverse," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," etc. refer to an orientation or positional relationship based on that shown in the drawings, which is merely for convenience of description and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore the above terms should not be construed as limiting the present application.
In the present application, the terms "a" and "an" in the claims and specification should be understood as "one or more", i.e. in one embodiment the number of one element may be one, while in another embodiment the number of the element may be plural. The terms "a" and "an" are not to be construed as unique or singular, and the term "the" and "the" are not to be construed as limiting the amount of the element unless the amount of the element is specifically indicated as being only one in the disclosure of the present application.
In the description of the present application, it should be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the present application, unless explicitly stated or limited otherwise, the terms "connected," "connected," and "connected" should be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; either directly or indirectly via an intermediary. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
Considering that in the existing scheme, the distance between the test tray and the material receiving tray is far, so that the stroke of the manipulator is long, and the efficiency of the whole machine is seriously influenced; and chips with the same grade on the test tray are often distributed in different areas, so that one chip with a certain grade has to be taken out firstly by the unloading manipulator when the unloading manipulator is used for taking materials, and the other chip with the same grade is taken out after a plurality of chip pits are skipped, thereby seriously affecting the unloading sorting efficiency of the unloading manipulator. Therefore, the application creatively provides a buffer discharging system and a buffer discharging method, which can improve the discharging efficiency of the whole machine while giving consideration to the higher efficiency of each manipulator.
In particular, referring to fig. 1 to 5 of the drawings of the specification of the present application, a buffer discharging system is provided according to one embodiment of the present application, which may include a receiving tray 10, a test tray 20, a buffer tray assembly 30, a first discharging robot 40, a second discharging robot 50, and a sorting robot 60. The test tray 20 is configured to circulate between a first unloading station 201 and a second unloading station 202. It will be appreciated that the test tray 20 is configured to circulate along a predetermined circulation path, and that the predetermined circulation path is provided with a first unloading station 201 and a second unloading station 202, both for chip unloading.
More specifically, the buffer tray assembly 30 is disposed in a transfer path between the receiving tray 10 and the test tray 20, and the buffer tray assembly 30 includes a first moving buffer tray 31 corresponding to the first unloading position 201 and a second moving buffer tray 32 corresponding to the second unloading position 202. The first unloading robot 40 is disposed between the first unloading station 201 and the first movable buffer tray 31, and is used for taking out chips from the test tray 20 located at the first unloading station 201 to place the chips into the corresponding level areas of the first movable buffer tray 31 according to the test results. The second unloading robot 50 is disposed between the second unloading station 202 and the second movable buffer tray 32, and is configured to take out chips from the test tray 20 located at the second unloading station 202 to place the chips into the corresponding level areas of the second movable buffer tray 32 according to the test results. The sorting robot 60 is disposed between the buffer tray assembly 30 and the receiving tray 10, and is used for taking out chips from the corresponding grade areas in the first moving buffer tray 31 and the second moving buffer tray 32, respectively, to put in the receiving tray 10 of the corresponding grade. It is understood that the corresponding rank region referred to in the present application may be implemented, but is not limited to, a good region for storing good products and at least one bad region for storing bad products on the moving buffer tray.
Notably, are: on the one hand, since the buffer discharging system of the present application sets the buffer tray assembly 30 between the receiving tray 10 and the test tray 20 to transfer chips between the test tray 20 and the buffer tray assembly 30 through the first discharging robot 40 and the second discharging robot 50 and to transfer chips between the buffer tray assembly 30 and the receiving tray 10 through the sorting robot 60, the transfer stroke of each robot is shortened, so that the buffer tray assembly 30 plays a role of buffer transition, which is helpful for improving the transfer efficiency; on the other hand, since the first unloading robot 40 and the second unloading robot 50 can simultaneously take out chips from the test trays 20 located at the first unloading position 201 and the second unloading position 202, respectively, to respectively put in the first movable buffer tray 31 and the second movable buffer tray 32, the buffer unloading system of the present application configures two unloading robots to simultaneously unload so as to match with the sorting efficiency of one sorting robot, thereby improving the unloading efficiency of the whole machine.
More specifically, as shown in fig. 1 and 2, the first unloading bit 201 and the second unloading bit 202 are arranged at intervals along a first direction; the test tray 20 and the receiving tray 10 are arranged along a second direction, wherein the second direction is perpendicular to the first direction, so that the test tray 20 can move between the first unloading position 201 and the second unloading position 202 along the first direction, so that the first unloading robot 40 and the second unloading robot 50 can unload from the same test tray 20 at the first unloading position 201 and the second unloading position 202 in sequence, respectively, which is helpful to improve the unloading efficiency.
Alternatively, as shown in fig. 2, the test tray 20 may have a first test area 21 and a second test area 22 arranged along the first direction; when the test tray 20 moves to the first unloading position 201, the first unloading robot 40 is configured to take out chips from the first test area 21 of the test tray 20 to place the chips into the first moving buffer tray 31; when the test tray 20 moves to the second unloading position 202, the second unloading manipulator 50 is configured to take out chips from the second test area 22 of the test tray 20 to place the chips into the second moving buffer tray 32, so that the relative positions of the two unloading manipulators can be reasonably arranged, the unloading ranges of the two unloading manipulators can be considered, and the unloading efficiency can be improved. In other words, after the chips in the first test area 21 of one test tray 20 are completely unloaded by the first unloading robot 40 at the first unloading position 201, the test tray 20 is moved to the second unloading position 202 to unload the chips from the second test area 22 of the test tray 20 by the second unloading robot 50; at this time, the other test tray 20 is moved to the first unloading position 201 to be unloaded from the first test area 21 of the other test tray 20 by the first unloading robot 40, so that the first unloading robot 40 and the second unloading robot 50 respectively unload from different test areas of different test trays 20 at the same time, without interference, so as to improve the unloading efficiency. It will be appreciated that this first direction of the application is implemented as a left-right direction, such as the x±direction in fig. 1; this second direction of the present application is implemented as a front-rear direction, such as y±direction in fig. 1.
As illustrated in fig. 1 and 4, the first moving buffer tray 31 of the present application may include a first buffer tray 311, a second buffer tray 312, and a driving device 313 connected to the first buffer tray 311 and the second buffer tray 312, the first buffer tray 311 and the second buffer tray 312 being movably disposed in a carrying path between the first unloading position 201 and the receiving tray 10 for alternately moving back and forth between the first unloading position 201 and the receiving tray 10 under the driving of the driving device 313. In this way, when the first buffer tray 311 or the second buffer tray 312 receives the chips unloaded from the test tray 20 at a position close to the test tray 20, the second buffer tray 312 or the first buffer tray 311 is located at a position close to the receiving tray 10, so that the sorting manipulator can take out the chips from the second buffer tray 312 or the first buffer tray 311 to place the chips into the corresponding receiving tray 10, so that the chip unloading and the chip sorting can be performed simultaneously, and the carrying stroke of each manipulator is shortened, thereby improving the unloading efficiency of the whole machine. It is understood that the second motion buffer tray 32 of the present application may have the same structure as the first motion buffer tray 31, and the present application will not be described herein.
Alternatively, as shown in fig. 4, the first buffer tray 311 and the second buffer tray 312 are arranged at intervals in a third direction, which is perpendicular to the first direction and the second direction, respectively; that is, the first buffer tray 311 and the second buffer tray 312 are in a stacked state so as to reduce the planar space occupied by the apparatus. It is understood that this third direction of the present application is implemented as an up-down direction, such as the z±direction in fig. 4.
Alternatively, the driving device 313 includes a first driving motor 3131, a second driving motor 3132, a first transmission mechanism 3133 connected to an output shaft of the first driving motor 3131, and a second transmission mechanism connected to an output shaft of the second driving motor 3132; the first transmission mechanism 3133 is drivingly connected to the first buffer carrier 311, and is configured to convert a rotational motion of the first driving motor 3131 into a translational motion of the first buffer carrier 311; the second transmission mechanism 3134 is drivingly connected to the second buffer carrier 312 for converting the rotational movement of the second driving motor 3132 into a translational movement of the second buffer carrier 312. In other words, the first buffer tray 311 and the second buffer tray 312 of the first moving buffer tray 31 of the present application are arranged one above the other, so that the first buffer tray 311 and the second buffer tray 312 driven by the driving device 313 can alternately reciprocate without colliding with each other due to spatial misalignment.
According to the above embodiment of the present application, as shown in fig. 1 and 4, the buffer tray assembly 30 may further include a fixed buffer tray 33, where the fixed buffer tray 33 is fixedly disposed on a conveying path between the receiving tray 10 and the first moving buffer tray 31 or the second moving buffer tray 32, so as to buffer chips taken out from the first moving buffer tray 31 or the second moving buffer tray 32 by the sorting manipulator 60 when the receiving tray 10 is full, so as to buffer chips in a special situation such as the receiving tray 10 is full, and perform a buffer function, which is helpful to save waiting time of the manipulator, improve conveying efficiency, and ensure that the buffer unloading system of the present application can perform sorting and unloading normally and efficiently.
Alternatively, as shown in fig. 4, a plurality of fixed buffer trays 33 are arranged at intervals, wherein the first moving buffer tray 31 and the second moving buffer tray 32 are respectively located between two adjacent fixed buffer trays 33, and at least one fixed buffer tray 33 is located between the first moving buffer tray 31 and the second moving buffer tray 32, so that the handling efficiency of the robot is improved while the space is fully utilized, and the compactness of the system is improved. In addition, the fixed buffer tray 33 located between the first and second moving buffer trays 31 and 32 can also increase the interval between the first and second moving buffer trays 31 and 32, preventing collision between the robot arms.
It should be noted that, as shown in fig. 1 and 3, since the receiving tray 10 has a plurality of receiving chip pits 100 arranged in an array, the test tray 20 has a plurality of testing chip pits 200 arranged in an array, and the distance between adjacent receiving chip pits 100 on the receiving tray 10 is generally different from the distance between adjacent testing chip pits 200 on the test tray 20, in order to simplify the structure and control manner of the manipulator, the buffer tray assembly 30 of the present application may be provided with a plurality of buffer chip pits 300 arranged in an array, wherein the pitch of adjacent receiving chip pits 300 on the first moving buffer tray 31 and the second moving buffer tray 32 in one direction is equal to the pitch of adjacent receiving chip pits 200 in the other direction, and the pitch of adjacent receiving chip pits 300 on the first moving buffer tray 31 and the second moving buffer tray 32 in the other direction is equal to the pitch of adjacent receiving chip pits 100 in the other direction.
For example, the pitch of the adjacent buffer chip pits 300 on the first and second movable buffer trays 31 and 32 in the second direction is equal to the pitch of the adjacent test chip pits 200 in the second direction, and the pitch of the adjacent buffer chip pits 300 on the first and second movable buffer trays 31 and 32 in the first direction is equal to the pitch of the adjacent receiving chip pits 100 in the first direction. Thus, if Pbx and Pby represent the pitches of adjacent test chip pits 200 in the first direction and the second direction, respectively, pax and Pay represent the pitches of adjacent receiving chip pits 100 in the first direction and the second direction, respectively; the pitch of the buffer chip pits 300 adjacent to the first moving buffer tray 31 and the second moving buffer tray 32 in the first direction is Pax and the pitch in the second direction is Pby.
Further, the first unloading robot 40 and the second unloading robot 50 are respectively provided for adjusting the pitch of the picked chips in the first direction to be equal to the pitch of the adjacent buffer chip pits 300 in the first direction when the chips are carried; the sorting robot 60 is provided for adjusting the pitch of the picked chips in the second direction to be equal to the pitch of the adjacent chip pits 100 in the second direction when the chips are carried.
In other words, since the pitch of the adjacent buffer chip pits 300 on the buffer tray assembly 30 in the second direction is equal to the pitch of the adjacent test chip pits 200 on the test tray 20 in the second direction, and the pitch of the adjacent buffer chip pits 300 in the first direction is equal to the pitch of the adjacent receiving chip pits 100 on the receiving tray 10 in the first direction, the first unloading robot 40 and the second unloading robot 50 only need to change the pitch between the adjacent chips in the first direction, and the sorting robot 60 only needs to change the pitch between the adjacent chips in the second direction, so that the structure of the robot and the control manner thereof are simplified.
It should be noted that the arrangement pitch of the buffer chip pits 300 on the fixed buffer tray 33 may be identical to the arrangement pitch of the receiving chip pits 100 on the receiving tray 10, so as to buffer chips instead of the receiving tray 10. In other words, the pitches of the adjacent buffer chip pits 300 on the fixed buffer tray 33 in both directions are respectively equal to the pitches of the adjacent receiving chip pits 100 in the corresponding directions. For example, the pitch of the adjacent receiving chip pits 100 in the first direction and the second direction is denoted by Pax and Pay, respectively; the pitches of the buffer chip pits 300 adjacent to the fixed buffer disk 33 in the first direction and the second direction are Pax and Pay, respectively.
It should be noted that, according to another aspect of the present application, as shown in fig. 5, an embodiment of the present application provides a buffer unloading method, which may include the steps of:
after the test tray is moved to the first unloading position, the chip is taken out from the first test area of the test tray so as to be put into the corresponding grade area of the first movable buffer tray of the buffer tray assembly according to the test result;
after the test tray is moved to a second unloading position, the chip is taken out from a second test area of the test tray so as to be placed into a corresponding grade area of a second movable buffer disk of the buffer disk assembly according to a test result; and
and respectively taking out the chips from the corresponding grade areas in the first movable buffer disk and the second movable buffer disk so as to put the chips into the receiving trays of the corresponding grades.
It should be noted that, in the above embodiment of the present application, the buffer discharging method may further include the steps of:
and alternately moving the first buffer carrier disc and the second buffer carrier disc of the first movable buffer disc back and forth between the first unloading position and the material receiving tray so as to put the chips taken out from the test tray positioned at the first unloading position into one buffer carrier disc adjacent to the first unloading position, and take out the chips from the other buffer carrier disc so as to put the chips into the material receiving tray.
Optionally, in one embodiment of the present application, the buffer unloading method may further include the steps of:
when the receiving tray is full, chips taken out from the first movable buffer tray or the second movable buffer tray are placed in a fixed buffer tray fixedly arranged on a conveying path between the receiving tray and the first movable buffer tray or the second movable buffer tray.
Optionally, in one embodiment of the present application, the buffer unloading method may further include the steps of:
adjusting the spacing of chips taken out from the test tray in one direction to be equal to the spacing of adjacent buffer chip pits on the first moving buffer tray or the second moving buffer tray in the one direction; and
and respectively adjusting the spacing of the chips taken out from the first movable buffer tray and the second movable buffer tray in the other direction to be equal to the spacing of adjacent receiving chip pits on the receiving tray in the other direction.
The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The foregoing examples illustrate only a few embodiments of the application, which are described in detail and are not to be construed as limiting the scope of the application. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of protection of the present application is to be determined by the appended claims.

Claims (12)

1. Buffering discharge system, its characterized in that includes:
a receiving tray (10);
a test tray (20), the test tray (20) being arranged to circulate between a first unloading position (201) and a second unloading position (202);
-a buffer tray assembly (30), the buffer tray assembly (30) being arranged in a handling path between the receiving tray (10) and the testing tray (20), and the buffer tray assembly (30) comprising a first mobile buffer tray (31) corresponding to the first unloading station (201) and a second mobile buffer tray (32) corresponding to the second unloading station (202);
a first unloading manipulator (40), wherein the first unloading manipulator (40) is arranged between the first unloading position (201) and the first movable buffer disk (31) and is used for taking out chips from the test tray (20) positioned at the first unloading position (201) so as to put the chips into the corresponding grade area of the first movable buffer disk (31) according to a test result;
a second unloading manipulator (50), wherein the second unloading manipulator (50) is arranged between the second unloading position (202) and the second movable buffer disk (32) and is used for taking out chips from the test tray (20) positioned at the second unloading position (202) so as to put the chips into the corresponding grade area of the second movable buffer disk (32) according to the test result; and
sorting manipulator (60), sorting manipulator (60) set up in between buffer dish subassembly (30) with receive material tray (10) is used for respectively from first removal buffer dish (31) with in second removal buffer dish (32) correspond the rank regional take out the chip, in order to put into corresponding rank receive material tray (10).
2. Buffer discharge system according to claim 1, characterized in that the first discharge position (201) and the second discharge position (202) are arranged at intervals along a first direction; the test tray (20) has a first test area (21) and a second test area (22) arranged along the first direction; when the test tray (20) moves to the first unloading position (201), the first unloading manipulator (40) is used for taking chips out of the first test area (21) of the test tray (20) to put the chips into the first movable buffer disk (31); when the test tray (20) moves to the second unloading position (202), the second unloading manipulator (50) is used for taking out chips from the second test area (22) of the test tray (20) to put in the second movable buffer disk (32).
3. Buffer unloading system according to claim 2, characterized in that the first mobile buffer tray (31) comprises a first buffer tray (311), a second buffer tray (312) and drive means (313) connected to the first buffer tray (311) and the second buffer tray (312), the first buffer tray (311) and the second buffer tray (312) being movably arranged in a transport path between the first unloading position (201) and the receiving tray (10) for alternating back and forth movement between the first unloading position (201) and the receiving tray (10) under the drive of the drive means (313).
4. A buffer discharge system according to claim 3, characterized in that the test tray (20) and the receiving tray (10) are arranged along a second direction, wherein the second direction is perpendicular to the first direction; the first buffer tray (311) and the second buffer tray (312) are arranged at intervals in a third direction.
5. Buffer unloading system according to any of claims 1 to 4, characterized in that the buffer tray assembly (30) further comprises a fixed buffer tray (33), the fixed buffer tray (33) being fixedly arranged in a handling path between the receiving tray (10) and the first moving buffer tray (31) or the second moving buffer tray (32) for buffering chips taken out from the first moving buffer tray (31) or the second moving buffer tray (32) via the sorting robot (60) when the receiving tray (10) is full.
6. Buffer discharge system according to claim 5, characterized in that a plurality of said fixed buffer trays (33) are arranged at intervals, wherein said first moving buffer tray (31) and said second moving buffer tray (32) are respectively located between two adjacent said fixed buffer trays (33), and at least one of said fixed buffer trays (33) is located between said first moving buffer tray (31) and said second moving buffer tray (32).
7. The buffer discharge system according to claim 6, wherein the receiving tray (10) has a plurality of receiving chip pits (100) arranged in an array, the test tray (20) has a plurality of test chip pits (200) arranged in an array, and the buffer tray assembly (30) has a plurality of buffer chip pits (300) arranged in an array; wherein the spacing between adjacent buffer chip pits (300) on the fixed buffer disk (33) in two directions is equal to the spacing between adjacent receiving chip pits (100) in corresponding directions.
8. The buffer discharge system according to any one of claims 1 to 4, wherein the receiving tray (10) has a plurality of receiving chip pits (100) arranged in an array, the test tray (20) has a plurality of test chip pits (200) arranged in an array, and the buffer tray assembly (30) has a plurality of buffer chip pits (300) arranged in an array; wherein the pitch of the adjacent buffer chip pits (300) on the first moving buffer tray (31) and the second moving buffer tray (32) in one direction is equal to the pitch of the adjacent test chip pits (200) in the one direction, and the pitch of the adjacent buffer chip pits (300) on the first moving buffer tray (31) and the second moving buffer tray (32) in the other direction is equal to the pitch of the adjacent receiving chip pits (100) in the other direction.
9. The buffer unloading method is characterized by comprising the following steps:
after the test tray is moved to the first unloading position, the chip is taken out from the first test area of the test tray so as to be put into the corresponding grade area of the first movable buffer tray of the buffer tray assembly according to the test result;
after the test tray is moved to a second unloading position, the chip is taken out from a second test area of the test tray so as to be placed into a corresponding grade area of a second movable buffer disk of the buffer disk assembly according to a test result; and
and respectively taking out the chips from the corresponding grade areas in the first movable buffer disk and the second movable buffer disk so as to put the chips into the receiving trays of the corresponding grades.
10. The buffered discharge method of claim 9, further comprising the steps of:
and alternately moving the first buffer carrier disc and the second buffer carrier disc of the first movable buffer disc back and forth between the first unloading position and the material receiving tray so as to put the chips taken out from the test tray positioned at the first unloading position into one buffer carrier disc adjacent to the first unloading position, and take out the chips from the other buffer carrier disc so as to put the chips into the material receiving tray.
11. The buffered discharge method of claim 9, further comprising the steps of:
when the receiving tray is full, chips taken out from the first movable buffer tray or the second movable buffer tray are placed in a fixed buffer tray fixedly arranged on a conveying path between the receiving tray and the first movable buffer tray or the second movable buffer tray.
12. The buffer discharge method according to any one of claims 9 to 11, characterized in that the buffer discharge method further comprises the steps of:
adjusting the spacing of chips taken out from the test tray in one direction to be equal to the spacing of adjacent buffer chip pits on the first moving buffer tray or the second moving buffer tray in the one direction; and
and respectively adjusting the spacing of the chips taken out from the first movable buffer tray and the second movable buffer tray in the other direction to be equal to the spacing of adjacent receiving chip pits on the receiving tray in the other direction.
CN202310713000.5A 2023-06-15 2023-06-15 Buffer discharging system and buffer discharging method Pending CN116936404A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310713000.5A CN116936404A (en) 2023-06-15 2023-06-15 Buffer discharging system and buffer discharging method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310713000.5A CN116936404A (en) 2023-06-15 2023-06-15 Buffer discharging system and buffer discharging method

Publications (1)

Publication Number Publication Date
CN116936404A true CN116936404A (en) 2023-10-24

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310713000.5A Pending CN116936404A (en) 2023-06-15 2023-06-15 Buffer discharging system and buffer discharging method

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Country Link
CN (1) CN116936404A (en)

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