CN116936258A - Electronic component - Google Patents
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- CN116936258A CN116936258A CN202210331593.4A CN202210331593A CN116936258A CN 116936258 A CN116936258 A CN 116936258A CN 202210331593 A CN202210331593 A CN 202210331593A CN 116936258 A CN116936258 A CN 116936258A
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- Prior art keywords
- electronic component
- terminal plate
- connecting portion
- component according
- connection portion
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- 239000000758 substrate Substances 0.000 claims description 34
- 239000000126 substance Substances 0.000 claims description 4
- 239000003985 ceramic capacitor Substances 0.000 abstract description 14
- 230000000694 effects Effects 0.000 abstract description 12
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 238000012360 testing method Methods 0.000 description 27
- 238000005452 bending Methods 0.000 description 22
- 239000000463 material Substances 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 10
- 239000004020 conductor Substances 0.000 description 10
- 239000000919 ceramic Substances 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000013461 design Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The present invention provides an electronic component including: at least one element including an element body, and terminal electrodes arranged on both end surfaces of the element body in a longitudinal direction; and a terminal plate which is composed of a conductive plate and has an inner connection portion electrically connected to the terminal electrode and an outer connection portion extending from the inner connection portion to the external circuit and electrically connectable to the external circuit, wherein the outer connection portion is disposed so as to face the bottom surface of the element main body at a predetermined distance D, and the distance D is designed so that D/H is not more than 0.07 when the total height of at least one element is H. According to the electronic component of the present invention, the effect of the terminal plate of the electronic component can be maintained as much as possible, and the electronic component can be miniaturized. Further, according to the electronic component of the present invention, the strength of the terminal plate is improved, so that it is not necessary to distinguish the pick-up direction of the ceramic capacitor at the time of manufacturing, transporting, and mounting, thereby improving the production efficiency.
Description
Technical Field
The present invention relates to an electronic component, and more particularly, to an electronic component as a ceramic capacitor.
Background
In recent years, ceramic capacitors have been widely used. In the prior art (e.g., patent document 1: cn100440393 c), ceramic capacitors generally have: a main body having a ceramic layer and an inner conductor layer built therein; and a terminal electrode formed on an end surface of the element body and connected to the inner conductor layer; the terminal plate has an external connection portion electrically connected to the electrode connection portion of the terminal electrode and the external circuit, and the external connection portion is disposed to face the bottom surface of the element body at a predetermined distance. Compared with the case that the terminal electrode of the ceramic capacitor is directly connected with an external circuit, the effect of the connection with the external circuit through the terminal plate is that: on the one hand, when the ceramic capacitor vibrates under the action of an external electric field, the vibration can be easily absorbed through the deflection of the terminal plate, the vibration of the ceramic capacitor is weakened to be transmitted to an external circuit (a mounting substrate), and the noise generated by the mounting substrate is reduced; on the other hand, the plurality of ceramic capacitors may be electrically connected in advance through the terminal plate and then electrically connected to an external circuit, thereby reducing the mounting area.
However, if the spacing distance between the external connection portion of the terminal plate and the bottom surface of the element main body is excessively large, on the one hand, a large installation space is required due to the increase in the height of the ceramic capacitor, and on the other hand, the terminal plate is easily bent at the time of manufacture, transportation, installation, and therefore it is necessary to distinguish directions at the time of picking up the ceramic capacitor from the non-terminal plate side of the ceramic capacitor, which reduces the production efficiency.
Prior literature
Patent document 1: CN100440393C
Disclosure of Invention
The present invention has been made in view of the above-described circumstances, and an object of the present invention is to provide an electronic component such as a ceramic capacitor, which can achieve miniaturization of the electronic component while retaining the operational effects of the terminal plate of the electronic component as much as possible, and which can improve the strength of the terminal plate so that it is not necessary to distinguish the pickup direction of the electronic component at the time of manufacturing, transportation, and installation.
An electronic component according to an aspect of the present invention is characterized by comprising: at least one element including an element body and terminal electrodes arranged on both end surfaces of the element body in a longitudinal direction; and a terminal plate that is configured from a conductive plate and has an inner connection portion that is electrically connected to the terminal electrode and an outer connection portion that extends from the inner connection portion to an external circuit and is electrically connectable to the external circuit, wherein the outer connection portion is disposed so as to face the bottom surface of the element body at a predetermined distance D, and the distance D is designed so that D/H is not more than 0.07 when the total height of the at least one element is H.
In the electronic component of the present invention, it is preferable that the inner connecting portion has a convex portion protruding toward the terminal electrode from a surface of the inner connecting portion facing the terminal electrode, and the spacing distance D is designed to be 0.9P/(d+p). Ltoreq.1 when a vertical distance between a starting point of bending of the convex portion near the outer connecting portion and a bottom surface of the element main body is P.
In the electronic component of the present invention, when the length of the electronic component is L, it is preferable that the length E of the mounting substrate bonding surface of the outer connection portion is designed to be: the value of E/L is in the range of 0.1 to 0.35.
In the electronic component of the present invention, when the length of the electronic component is L, the distance D is preferably not more than 0.035.
In the electronic component of the present invention, it is preferable that at least a part of the outer connecting portion is directly opposed to the bottom surface of the element main body, and no intermediate substance is present between at least a part of the outer connecting portion and the bottom surface of the element main body.
In addition, in the electronic component of the present invention, it is preferable that the convex portion has a plurality of points arranged in a width direction of the element.
In the electronic component of the present invention, it is preferable that the points of the convex portions are formed in a flat shape extending in the width direction of the element.
In the electronic component of the present invention, it is preferable that the convex portion is formed in a linear shape extending in the width direction of the element.
In the electronic component of the present invention, it is preferable that when the height of the element is T, the vertical distance is P and p.ltoreq.t/2.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the electronic component of the present invention, the effect of the terminal plate of the electronic component can be maintained as much as possible, and the electronic component can be miniaturized. Further, according to the electronic component of the present invention, the strength of the terminal plate is improved, so that it is not necessary to distinguish the pick-up direction of the ceramic capacitor at the time of manufacturing, transporting, and mounting, thereby improving the production efficiency.
Drawings
Fig. 1 is a perspective view schematically showing a state in which an electronic component according to an embodiment of the present invention is mounted on a mounting substrate.
Fig. 2 is a perspective view schematically showing a state in which an electronic component according to another embodiment of the present invention is mounted on a mounting substrate.
Fig. 3 is a sectional view schematically showing an electronic component according to the present invention.
Fig. 4 is a diagram schematically showing a bending test performed on a mounting substrate on which electronic components are mounted.
Fig. 5 is a diagram schematically showing a deformation test performed on an electronic component.
Reference numerals
Electronic component 1
Element 10
Element body 11
Inner conductor layers 110, 111
Extraction portions 110A, 111A
Ceramic layer 112
Terminal electrode 12
Terminal plate 20
Inside connection portion 21
Outer connecting portion 22
Convex portion 23
External circuit 30
Bonding material 40
Mounting substrate 50
Joint 60
Detailed Description
The invention will be described in more detail below with reference to the drawings and the embodiments.
Fig. 1 is a perspective view schematically showing a state in which an electronic component according to a first embodiment of the present invention is mounted on a mounting substrate. As shown in fig. 1, an electronic component 1 of the present invention has an element 10. The element 10 has an element body 11 as a main component. The element body 11 is a rectangular parallelepiped sintered body obtained by sintering a laminate in which a plurality of ceramic green sheets are laminated. Fig. 3 is a sectional view schematically showing an electronic component according to the present invention.
As shown in fig. 3, a ceramic layer 112 and inner conductor layers 110 and 111 are incorporated in the element body 11 of the element 10. The inner conductor layers 110, 111 are alternately arranged in the stacking direction (also referred to as "height direction") Z with the ceramic layers 112 interposed therebetween. The number of stacked layers of the inner conductor layers 110, 111 is not particularly limited.
The element 10 further includes terminal electrodes 12 arranged on both end surfaces of the element body 11 in the longitudinal direction (X direction). Each of the inner conductor layers 110 and 111 has a lead portion 110A and 111A. The lead portions 110A, 110A of the inner conductor layers 110, 111 are connected to the terminal electrode 12 in the longitudinal direction of the element body.
The material of the inner conductor layers 110 and 111 formed in a substantially rectangular shape may be nickel or a conductive material including palladium, copper, or the like. The material of the ceramic layer 112 may be a material containing CaZrO 3 、BaTiO 3 、MgTiO 3 、TiO 2 、BaCaTiZr、PbTiO 3 Etc. The material of the terminal electrode 12 may be Cu, ni, sn, ag, conductive resin, or the like.
As shown in fig. 1 to 3, the electronic component 1 of the present invention further includes a terminal plate 20. The terminal plate 20 is constituted by a conductive plate, and has: an inner connection portion 21 electrically connected to the terminal electrode 12, and an outer connection portion 22 extending from the inner connection portion 21 to the external circuit 30 and electrically connectable to the external circuit 30. The material of the terminal plate 20 may be a metal terminal material including SUS, cu, phosphor bronze, and the like, but other metals may be used as long as they have conductivity and elasticity. The terminal plate 20 may be subjected to plating.
The inside connection portion 21 and the terminal electrode 12 are connected by a joint portion 60 as shown in fig. 1 and 3. For example, high temperature solder may be used as the material of the joint 60. However, a conductive organic binder may be used instead of the high temperature solder.
As shown in fig. 1 to 3, the terminal plate 20 is formed in an L-shape, and the outer connection portion 22 of the terminal plate 20 extends along the mounting substrate 50 located below the electronic component 1 and exceeds the terminal electrode 12 of the element 10 in the longitudinal direction (X direction) of the electronic component 1. The terminal plate 20 is electrically connected to an external circuit 30 formed on the mounting substrate 50 by solder 40.
The outer connecting portion 22 is disposed so as to face the bottom surface of the element body 11 with a predetermined gap D. At least a part of the outer connecting portion 22 is directly opposed to the bottom surface of the element main body 20, and no intermediate substance exists between at least a part of the outer connecting portion 22 and the bottom surface of the element main body 11. That is, the predetermined gap D is a distance between at least a part of the outer connecting portion 22 and the bottom surface of the element main body 20 at a portion where no intermediate substance exists.
As shown in fig. 3, the total height of the element 10 is H and the height of the individual element 10 is T. The electronic component 1 shown in fig. 3 contains 2 elements 10, i.e., h= 2*T. At this time, the predetermined gap D and the total height H of the element 10 satisfy the following relationship: D/H is less than or equal to 0.07. It should be noted that, when the electronic component 1 includes a plurality of elements 10 stacked in the height direction (Z direction) of the electronic component 1, the total height H of the elements 10 corresponds to the total of the element heights T of the plurality of elements 10, i.e., h=n×t, where n is the number of stacked elements 10, and n may also be 1.
As shown in fig. 3, the electronic component has a length L. The length of the joint surface between the outer connecting portion 22 and the mounting board 50 is E. In this case, the value of E/L is in the range of 0.18 to 0.35. The length L and the spacing distance D of the electronic components satisfy D/L.ltoreq.0.035, and D/L.ltoreq.0.02 is preferable.
As shown in fig. 1 to 3, the inner connecting portion 21 has a convex portion 23 protruding toward the terminal electrode 12 from a surface of the inner connecting portion 21 facing the terminal electrode 12. In general, protruding portions 23 are provided at both ends of the inner connecting portion 21 of the terminal plate 20. Since the electronic component 1 may be inverted or the like during manufacturing and mounting, the position of the joint portion 60 can be restricted by providing the protruding portions 23 at both ends of the inner connecting portion 21. In particular, by the convex portion 23 provided at the position where the inner connecting portion 21 is close to the outer connecting portion 22, the joining material of the joining portion 60 can be restricted from reaching the bottom surface of the element 10, that is, there is no joining material at the bottom surface of the element 10, and therefore, when the joining material is deformed due to a temperature change or the like, stress generated therefrom does not act on the bottom surface of the element 10.
As shown in fig. 1, the convex portion 23 is formed in a linear shape extending in the width direction of the element. Further, as shown in fig. 2, the convex portion 23 may have a plurality of points arranged in a row along the width direction (Y direction) of the element 10. The points of the convex portions 23 are formed in a flat shape extending in the width direction of the element 10.
Further, as shown in fig. 3, when the vertical distance between the starting point of the bending of the convex portion 23 near the outer connecting portion and the bottom surface of the element main body 11 is P, the vertical distance P and the separation distance D satisfy the following relationship: P/(D+P) is more than or equal to 0.9 and less than or equal to 1. In addition, the height T of the element 10 is such that P.ltoreq.T/2 is satisfied from the vertical distance P.
The operational effects of the structure of the electronic component 1 of the present invention will be described below.
In general, the following effects can be achieved by providing the terminal plate 20 in the electronic component 1. First, the stress on the electronic component 1 due to the bending of the mounting substrate 50 can be reduced by the elasticity of the terminal plate. Further, by optimizing the thermal expansion coefficient of the terminal plate 20, deterioration of the solder 40 due to thermal contraction of the mounting substrate 50 and the terminal plate 20 can be reduced. The plurality of elements 10 are electrically connected to each other via the terminal plate 20, and then electrically connected to the external circuit 30 via the terminal plate 20. Thus, the mounting area can be reduced as compared with a case where the plurality of elements 10 are electrically connected to the external circuit 30, respectively. Further, the element 10 is connected to the mounting substrate 50 through the terminal plate 20, that is, the element 10 is not in contact with the mounting substrate 50, noise can be reduced.
In the present invention, by the above-described structural design, the above-described operational effects of the terminal plate 20 can be retained as much as possible, and the rigidity of the terminal plate 20 can be further improved. That is, the terminal plate 20 is not easily deformed when an external force is applied. Thus, the electronic component 1 can be picked up on the outer connection portion 22 side of the terminal plate 20 when the electronic component 1 is mounted and manufactured. That is, there is no need to consider the direction in which the electronic component 1 is picked up at the time of picking up, and thus, the tact is improved. In addition, by the above-described structural design, the total height of the electronic component 1 is reduced as compared with the electronic component 1 having a large separation distance D, and thus, miniaturization of the electronic component is achieved.
The inventors confirmed the effect of the above structural design on the electronic component 1 by the following experiments.
[ bending test ]
As shown in fig. 4, a mounting substrate on which electronic components are mounted by solder is placed on a test stand. An epoxy resin substrate of 1.6mm was used as the mounting substrate. The distance between the cylindrical supporting pieces on both sides and the center of the mounting substrate in the length direction was 45mm, respectively. At the center in the longitudinal direction of the mounting substrate, a pressing block was used to slowly press the mounting substrate at a speed of 1.0 mm/sec. The press block is approximately rectangular, and the side of the press block facing the mounting substrate is an arc of R230 when viewed from the Y direction. In addition, in the X-Y plane, the compacts were rectangular with a length of 50mm and a width of 20 mm. Under the pressing process, the mounting substrate is bent. The bending amount is calculated as the bending amount of the center in the length direction of the mounting substrate, that is, the distance of the center from the initial position in the Z direction. The bending test measures the amount of bending of the substrate when the electronic component starts to be damaged (for example, cracks occur in the solder for mounting the electronic component). Accordingly, the bending test reflects the ability of the terminal plate to alleviate stress on the electronic component due to bending of the mounting substrate.
[ deformation test ]
As shown in fig. 5, a force is applied to one end of the outer connection portion of the electronic component in the Z direction for 60 seconds so that the separation distance D becomes 0. Then, the applied force F is released, and the deformation amount Δd of the outer connecting portion at this time is measured. As shown by the broken line in fig. 5, when the outer connecting portion contacts the bottom surface of the element 10, the deformation amount Δd=the gap D.
Hereinafter, a bending test and a deformation test are performed with respect to the above structural relationship.
[ relation to D/H ]
The dimensions of each sample are shown in table 1 below. The length L of the electronic component was 4.5mm and the width W was 3.2mm. The electronic component has two stacked elements with total heights H of 3mm, 4.8mm, respectively. The length E of the joint surface between the outer connecting part and the mounting substrate is 1.2mm. At this time, the relation between the gap distance D and the total height H of the element is adjusted. That is, the difference between the examples and the comparative examples is the relationship of D/H. The above-described bending test and deformation test were performed on examples and comparative examples, respectively, and the test results are shown in table 1.
[ Table 1 ]
As can be seen from table 1, the larger the distance D, the more remarkable the effect of the elastic terminal plate of the terminal plate in reducing the stress generated on the electronic component by the bending of the mounting substrate. When D/H is less than or equal to 0.07, the capability of the elastic terminal plate of the terminal plate to relieve stress on the electronic component due to bending of the mounting substrate can be well maintained. In addition, in the deformation test, the result of the electronic component having D/H.ltoreq.0.07 is superior to that of the electronic component having D/H > 0.07. That is, although the terminal plate of the electronic component having D/H of 0.07 or less has a higher rigidity, the electronic component is less likely to deform due to external force. Although examples 1.9 and 1.10 were deformed in the deformation test, the deformation amount was small, but the deformation had no influence on the appearance and performance. Thus, the electronic component improves the rigidity of the terminal plate while maintaining the above-mentioned original functions of the terminal plate by satisfying D/H.ltoreq.0.07.
[ relation to P/H ]
The dimensions of each sample are shown in table 2 below. The length L of the electronic component was 4.5mm and the width W was 3.2mm. The electronic component has two stacked elements with total heights H of 3mm, 4.8mm, respectively. The length E of the joint surface between the outer connecting part and the mounting substrate is 1.2mm. At this time, the vertical distance P (i.e., the vertical distance between the starting point of the bending of the convex portion near the outer connecting portion and the bottom surface of the element main body) is adjusted so that P varies between 0.76mm and 1.36 mm. That is, the difference between the examples and the comparative examples is the relationship of P/H. The above-described bending test and deformation test were performed on examples and comparative examples, respectively, and the test results are shown in table 2.
[ Table 2 ]
As can be seen from Table 2, when 0.9.ltoreq.P/(D+P). Ltoreq.1, the ability of the elastic terminal plate of the terminal plate to alleviate stress on the electronic parts due to bending of the mounting substrate can be well maintained. In addition, in the deformation test, the deformation amount of the electronic component of 0.9.ltoreq.P/(D+P). Ltoreq.1 was 0, with the result that it was superior to the electronic component of P/(D+P) < 0.9. Thus, the electronic component improves the rigidity of the terminal plate while maintaining the above-mentioned original effects of the terminal plate by satisfying 0.9.ltoreq.P/(D+P). Ltoreq.1.
[ relation to E/L ]
The dimensions of each sample are shown in Table 3 below. Electronic components are classified into the following three specifications: 1) the length L of the electrons is 3.9mm, the width W is 2.5mm, 2) the length L of the electrons is 4.5mm, the width W is 3.2mm, and 3) the length L of the electrons is 5.5mm, the width W is 5.0mm. The three-gauge electronic components each have two stacked elements, the total height H of which is 4.8mm. The vertical distance P was 1.26mm, and P/(D+P) was 0.93. At this time, the length E of the joint surface between the outer connecting portion and the mounting substrate is adjusted. That is, the difference between the examples and the comparative examples is the relation of E/L. The above-described bending test and deformation test were performed on examples and comparative examples, respectively, and the test results are shown in table 3.
[ Table 3 ]
As can be seen from Table 3, when E/L is in the range of 0.18 to 0.35, the ability of the elastic terminal plate of the terminal plate to alleviate stress on the electronic parts due to bending of the mounting substrate can be maintained well. In the deformation test, the deformation amount of the electronic component having an E/L in the range of 0.18 to 0.35 was 0, and as a result, the electronic component having an E/L in the range of 0.18 to 0.35 was superior. Thus, the electronic component maintains the above-mentioned original function of the terminal plate and improves the rigidity of the terminal plate by setting E/L in the range of 0.18-0.35.
[ relationship to D/L ]
The dimensions of each sample are shown in table 4 below. Electronic components are classified into the following three specifications: 1) the length L of the electrons is 3.9mm, the width W is 2.5mm, 2) the length L of the electrons is 4.5mm, the width W is 3.2mm, and 3) the length L of the electrons is 5.5mm, the width W is 5.0mm. The three-gauge electronic components each have two stacked elements, the total height H of which is 4.8mm. The relationship between the vertical distance P and P/(d+p) is shown in table 4. At this time, the relation of D/L is adjusted. That is, the difference between the examples and the comparative examples is the relationship of D/L. The above-described bending test and deformation test were performed on examples and comparative examples, respectively, and the test results are shown in table 4.
[ Table 4 ]
As can be seen from Table 4, when D/L is not more than 0.035, the ability of the elastic terminal plate of the terminal plate to alleviate stress on the electronic parts due to bending of the mounting substrate can be maintained well. In addition, in the deformation test, the deformation amount of the electronic component having D/L.ltoreq.0.035 was 0, resulting in an advantage over the electronic component having D/L > 0.035. Thus, the electronic component improves the rigidity of the terminal plate while maintaining the above-mentioned original functions of the terminal plate by satisfying the relation of D/L.ltoreq.0.035.
By the comparative tests of the above respective groups of examples and comparative examples, it was confirmed that: according to the electronic component of the present invention, the effect of the terminal plate of the electronic component can be maintained as much as possible, and the electronic component can be miniaturized. Further, according to the electronic component of the present invention, the strength of the terminal plate is improved, so that it is not necessary to distinguish the pick-up direction of the ceramic capacitor at the time of manufacturing, transporting, and mounting, thereby improving the production efficiency.
While the invention has been described in detail in connection with the drawings and embodiments, it should be understood that the foregoing description is not intended to limit the invention in any way. Modifications and variations of the invention may be made as desired by those skilled in the art without departing from the true spirit and scope of the invention, and such modifications and variations fall within the scope of the invention.
Claims (9)
1. An electronic component, comprising:
at least one element including an element body and terminal electrodes arranged on both end surfaces of the element body in a longitudinal direction; and
a terminal plate composed of a conductive plate and having an inner connection portion electrically connected to the terminal electrode and an outer connection portion extending from the inner connection portion to an external circuit and electrically connectable to the external circuit,
the outer connecting portion is disposed to face the bottom surface of the element main body at a predetermined distance D,
when the total height of the at least one element is H, the distance D is designed such that D/H is less than or equal to 0.07.
2. The electronic component according to claim 1, wherein,
the inner connecting portion has a convex portion protruding toward the terminal electrode from a surface of the inner connecting portion opposite to the terminal electrode,
when the vertical distance between the curved start point of the convex portion near the outer side connecting portion and the bottom surface of the element main body is P, the spacing distance D is designed to be 0.9.ltoreq.P/(D+P.ltoreq.1.
3. The electronic component according to claim 1 or 2, wherein,
when the length of the electronic component is L, the length E of the mounting substrate joint surface of the outer connecting portion is designed to be: the value of E/L is in the range of 0.18 to 0.35.
4. The electronic component according to any one of claim 1 to 3, wherein,
when the length of the electronic component is L, the spacing distance D is designed to be D/L less than or equal to 0.035.
5. The electronic component according to any one of claims 1 to 4, wherein,
at least a portion of the outer connecting portion is directly opposed to the bottom surface of the element body, and no intermediate substance is present between at least a portion of the outer connecting portion and the bottom surface of the element body.
6. The electronic component according to any one of claims 2 to 5, wherein,
the convex portion has a plurality of points arranged in a widthwise direction of the element.
7. The electronic component according to claim 6, wherein,
the points of the convex portions are formed in a flat shape extending in the width direction of the element.
8. The electronic component according to any one of claims 2 to 5, wherein,
the convex portion is formed in a linear shape extending in the width direction of the element.
9. The electronic component according to any one of claims 2 to 8, wherein,
when the height of the element is T, the vertical distance is P, and P is less than or equal to T/2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210331593.4A CN116936258A (en) | 2022-03-31 | 2022-03-31 | Electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210331593.4A CN116936258A (en) | 2022-03-31 | 2022-03-31 | Electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116936258A true CN116936258A (en) | 2023-10-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210331593.4A Pending CN116936258A (en) | 2022-03-31 | 2022-03-31 | Electronic component |
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| Country | Link |
|---|---|
| CN (1) | CN116936258A (en) |
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2022
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