CN116926518A - Tinned aluminum alloy conductor material for photovoltaic solder strip, and preparation method and application thereof - Google Patents
Tinned aluminum alloy conductor material for photovoltaic solder strip, and preparation method and application thereof Download PDFInfo
- Publication number
- CN116926518A CN116926518A CN202311001475.8A CN202311001475A CN116926518A CN 116926518 A CN116926518 A CN 116926518A CN 202311001475 A CN202311001475 A CN 202311001475A CN 116926518 A CN116926518 A CN 116926518A
- Authority
- CN
- China
- Prior art keywords
- aluminum alloy
- tin
- nickel
- plated
- water washing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000838 Al alloy Inorganic materials 0.000 title claims abstract description 302
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 87
- 238000002360 preparation method Methods 0.000 title claims description 17
- 239000004020 conductor Substances 0.000 title abstract description 25
- 239000000463 material Substances 0.000 title abstract description 22
- 238000007747 plating Methods 0.000 claims abstract description 110
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 90
- 239000012535 impurity Substances 0.000 claims abstract description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 249
- 238000000034 method Methods 0.000 claims description 122
- 229910052759 nickel Inorganic materials 0.000 claims description 121
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 105
- 238000005406 washing Methods 0.000 claims description 103
- 238000009713 electroplating Methods 0.000 claims description 77
- 230000008569 process Effects 0.000 claims description 72
- 239000011701 zinc Substances 0.000 claims description 58
- 229910052725 zinc Inorganic materials 0.000 claims description 54
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 48
- 238000007598 dipping method Methods 0.000 claims description 38
- 238000003723 Smelting Methods 0.000 claims description 26
- 241000080590 Niso Species 0.000 claims description 21
- 238000004519 manufacturing process Methods 0.000 claims description 21
- 239000000126 substance Substances 0.000 claims description 18
- 239000003513 alkali Substances 0.000 claims description 17
- 238000005238 degreasing Methods 0.000 claims description 17
- 238000005530 etching Methods 0.000 claims description 17
- 238000005266 casting Methods 0.000 claims description 16
- 238000005096 rolling process Methods 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 14
- 239000002994 raw material Substances 0.000 claims description 9
- 229910052799 carbon Inorganic materials 0.000 claims description 8
- 239000011159 matrix material Substances 0.000 claims description 8
- 229910052757 nitrogen Inorganic materials 0.000 claims description 6
- 229910052760 oxygen Inorganic materials 0.000 claims description 6
- 239000002585 base Substances 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 5
- 239000012530 fluid Substances 0.000 claims description 4
- 229910052745 lead Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 abstract description 32
- 229910052782 aluminium Inorganic materials 0.000 abstract description 27
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 27
- 230000003647 oxidation Effects 0.000 abstract description 6
- 238000007254 oxidation reaction Methods 0.000 abstract description 6
- 230000005611 electricity Effects 0.000 abstract description 4
- 230000002035 prolonged effect Effects 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 70
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 45
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 18
- ZYGHJZDHTFUPRJ-UHFFFAOYSA-N coumarin Chemical compound C1=CC=C2OC(=O)C=CC2=C1 ZYGHJZDHTFUPRJ-UHFFFAOYSA-N 0.000 description 16
- 230000007797 corrosion Effects 0.000 description 15
- 238000005260 corrosion Methods 0.000 description 15
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 15
- 238000007689 inspection Methods 0.000 description 14
- 238000003466 welding Methods 0.000 description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 13
- 239000000654 additive Substances 0.000 description 13
- 230000000996 additive effect Effects 0.000 description 13
- 229910052802 copper Inorganic materials 0.000 description 13
- 239000010949 copper Substances 0.000 description 13
- 238000001035 drying Methods 0.000 description 13
- 230000011218 segmentation Effects 0.000 description 13
- 239000000203 mixture Substances 0.000 description 12
- 150000003841 chloride salts Chemical class 0.000 description 11
- 239000004615 ingredient Substances 0.000 description 11
- 239000011734 sodium Substances 0.000 description 11
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 9
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 description 9
- 229940081974 saccharin Drugs 0.000 description 9
- 235000019204 saccharin Nutrition 0.000 description 9
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 description 9
- 239000011780 sodium chloride Substances 0.000 description 9
- 229960000956 coumarin Drugs 0.000 description 8
- 235000001671 coumarin Nutrition 0.000 description 8
- 235000011006 sodium potassium tartrate Nutrition 0.000 description 8
- 238000005470 impregnation Methods 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 6
- 230000003064 anti-oxidating effect Effects 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 229940074439 potassium sodium tartrate Drugs 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 239000001476 sodium potassium tartrate Substances 0.000 description 4
- 239000001569 carbon dioxide Substances 0.000 description 3
- 229910002092 carbon dioxide Inorganic materials 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 238000011056 performance test Methods 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000003595 mist Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000010248 power generation Methods 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 235000016477 Taralea oppositifolia Nutrition 0.000 description 1
- 241001358109 Taralea oppositifolia Species 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000005431 greenhouse gas Substances 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/023—Alloys based on aluminium
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention provides a tin-plated aluminum alloy for a photovoltaic solder strip, which comprises, by mass, 1% -40% of Sn, 0.1% -25% of Ni, and the balance of Al and impurities; a tinning layer is arranged on the surface of the tinned aluminum alloy; the thickness of the tin plating layer is 1-100 mu m. According to the invention, the surface of the aluminum alloy conductor material is subjected to tinning treatment, so that the hardness, wear resistance and toughness of the existing aluminum alloy conductor material are greatly improved, various performance indexes of the aluminum alloy as a photovoltaic solder strip material are effectively optimized, particularly oxidation resistance is improved, the service life of the aluminum alloy material is prolonged, the service life of photovoltaic 25 years is at least met, the problem of aluminum weldability is most importantly solved, and the connection between the aluminum alloy material and a photovoltaic module battery piece is realized. The tin-plated aluminum alloy conductor material can be manufactured into a bus bar and an interconnection bar, is applied to connection between photovoltaic module battery pieces, and plays an important role in conductive electricity collection.
Description
Technical Field
The invention belongs to the technical field of aluminum alloy photovoltaic solder strips, and relates to a tin-plated aluminum alloy for a photovoltaic solder strip, and a preparation method and application thereof.
Background
The dual-carbon target is a strategy for low emission development of greenhouse gases in the 21 st century in China, and is characterized in that the emission level of carbon dioxide continuously rises from fast to slow and continuously falls after fluctuating at the inflection point with zero annual growth rate until the artificial emission source and absorption sink are balanced. The carbon dioxide emission reaches a peak before 2030, the total carbon dioxide emission per unit domestic production is reduced by more than 65% compared with 2005, the proportion of non-fossil energy accounting for primary energy consumption is about 25%, the total installed capacity of wind power and solar power generation is more than 12 hundred million kilowatts, and the carbon neutralization is realized before 2060.
The photovoltaic solder strip is also called tinned copper strip or tin-coated copper strip, and the shunt strip and the interconnection strip are applied to the connection between the photovoltaic module battery pieces and play an important role in conductive electricity collection. The welding strip is an important raw material in the welding process of the photovoltaic module, and the quality of the welding strip can directly influence the collection efficiency of the current of the photovoltaic module, so that the power of the photovoltaic module is greatly affected. The welding strip is firmly welded in the process of connecting the battery pieces in series, so that the occurrence of the phenomenon of virtual welding is avoided. The thickness of the welding strip is necessarily determined according to the characteristics of the selected battery piece when the welding strip is selected, the thickness of the welding strip is consistent with the width of a main deleting wire of the battery, and the hardness degree of the welding strip generally depends on the thickness of the battery piece and a welding tool.
In recent years, domestic photovoltaic power generation is rapidly developed, the total amount of photovoltaic installation in 2022 of China is 87.41GW, the dosage of photovoltaic solder strips in 2022 of China is 160 hundred million, and the dosage of the photovoltaic solder strips in 2025 of China is more than 200 hundred million. The photovoltaic solder strip adopts a tinned copper strip or a tinned copper strip, and copper mainly depends on import due to lack of domestic copper resources, copper price is always high, the copper consumption of the photovoltaic solder strip is very large, the manufacturing cost of the photovoltaic module is very high, and no good solution is provided. Aluminum has very good conductive performance, is a very good alternative, but aluminum has no weldability, and due to the chemical characteristics of aluminum, the coating of tin or the electroplating of tin on an aluminum belt is not easy to realize, and the technical threshold is very high, so that no related research or report exists in the field of photovoltaic solder belts.
Therefore, how to find a more suitable way to solve the problems of the existing aluminum alloy materials in the application occasions, further promote the aluminum alloy conductor materials to develop in the depth direction in the field of photovoltaic solder strips, and become one of the problems to be solved by a plurality of first-line researchers in the industry.
Disclosure of Invention
In view of the above, the technical problem to be solved by the invention is to provide a tin-plated aluminum alloy for a photovoltaic solder strip, and a preparation method and application thereof. According to the invention, the surface of the aluminum alloy conductor material is subjected to tinning treatment, so that the hardness, wear resistance and toughness, particularly the oxidation resistance of the existing aluminum alloy conductor material are greatly improved, the service life of the aluminum alloy material is prolonged, the service life of photovoltaic cells for 25 years is at least met, the problem of aluminum weldability is solved, and the connection between the aluminum alloy material and the photovoltaic module battery pieces is realized; and the process is simple, the controllability is strong, the site executable is high, and the method is suitable for popularization and application of industrial mass production.
The invention provides a tin-plated aluminum alloy for a photovoltaic solder strip, which comprises the following components in percentage by mass:
Sn：1％～40％；
Ni：0.1％～25％；
the balance of Al and impurities;
a tinning layer is arranged on the surface of the tinned aluminum alloy;
the thickness of the tin plating layer is 1-100 mu m.
Preferably, the tin-plated aluminum alloy further comprises 0.1 to 20wt% of Pb;
the tinned aluminum alloy comprises an aluminum alloy substrate, a nickel plating layer compounded on the substrate and a tinned layer compounded on the nickel plating layer;
the aluminum alloy matrix comprises an aluminum alloy wire and/or an aluminum alloy strip.
Preferably, the thickness of the aluminum alloy matrix is 0.1-8 mm;
the tin-plated aluminum alloy further comprises one or more of Zn, C, O, N in an amount of 1-40 wt%;
in the tin-plated aluminum alloy, the mass content of a tin-plated layer is 1% -50%;
in the tin-plated aluminum alloy, the thickness of the nickel plating layer is 100 nm-10 mu m.
The invention provides a preparation method of a tinned aluminum alloy for a photovoltaic solder strip, which is characterized by comprising the following steps of:
1) After pretreatment, zinc dipping and nickel plating are carried out on the aluminum alloy coil, and then the aluminum alloy coil compounded with the nickel plating layer is obtained;
2) And (3) tinning the aluminum alloy coil compounded with the nickel plating layer obtained in the steps, and then performing aftertreatment to obtain the tinned aluminum alloy coil.
Preferably, the preparation process of the aluminum alloy coil comprises the following steps:
after the aluminum alloy raw materials are subjected to smelting, casting and rolling procedures, an aluminum alloy coil is obtained;
the pretreatment step comprises one or more of surface chemical degreasing, hot water washing, cold water washing, strong alkali etching, water washing and light emitting;
and after the tinned aluminum alloy coil is segmented, the tinned aluminum alloy photovoltaic solder strip is obtained.
Preferably, the zinc-immersed treatment solution comprises:
the zinc dipping time is 5-10 min.
Preferably, the nickel plating method comprises plating bright nickel;
the treatment fluid for electroplating bright nickel comprises the following components:
the pH value of the electroplated bright nickel is 3.5-4.0;
d of the electroplated bright nickel k Is 6 to 8A/dm 2 ；
The temperature of the electroplated bright nickel is 40-45 ℃;
the time for electroplating the bright nickel is 10-15 min.
Preferably, the nickel plating method comprises the steps of plating dark nickel;
the treatment fluid for electroplating the dark nickel comprises the following components:
NiSO 4 ·6H 2 O 300～350g/L；
NaCl 40～45g/L；
Na 2 SO 4 85～95g/L；
d of the electroplated dark nickel k Is 8-10A/dm 2 ；
The temperature of the electroplated dark nickel is 35-40 ℃;
the time for electroplating the dark nickel is 10-15 min.
Preferably, the tinning method comprises electroplating tin;
the treatment solution for electroplated tin comprises the following components:
d of the electroplated tin k Is 6 to 10A/dm 2 ；
The temperature of the electrotinning is 20-30 ℃;
the time of the electrotinning is 6-15 min.
The invention also provides the tin-plated aluminum alloy prepared by any one of the technical schemes or the preparation method of any one of the technical schemes, and the application of the tin-plated aluminum alloy in the field of photovoltaic welding strips.
The invention provides a tin-plated aluminum alloy for a photovoltaic solder strip, which comprises, by mass, 1% -40% of Sn, 0.1% -25% of Ni, and the balance of Al and impurities; a tinning layer is arranged on the surface of the tinned aluminum alloy; the thickness of the tin plating layer is 1-100 mu m. Compared with the prior art, the tinned aluminum alloy wire for the photovoltaic solder strip has better hardness, wear resistance, toughness and oxidation resistance, solves the problem of weldability of an aluminum alloy material, can be directly welded with a photovoltaic module cell, realizes the key technical problem that the photovoltaic solder strip replaces copper with aluminum, and greatly reduces the manufacturing cost of the photovoltaic module. The tin-plated aluminum alloy conductor material can be manufactured into a bus bar and an interconnection bar, is applied to connection between photovoltaic module battery pieces, and plays an important role in conductive electricity collection.
According to the invention, the surface of the aluminum alloy conductor material is subjected to tinning treatment, so that the hardness, wear resistance and toughness of the existing aluminum alloy conductor material are greatly improved, various performance indexes of the aluminum alloy as a photovoltaic solder strip material are effectively optimized, particularly oxidation resistance is improved, the service life of the aluminum alloy material is prolonged, the service life of photovoltaic 25 years is at least met, the problem of aluminum weldability is most importantly solved, and the connection between the aluminum alloy material and a photovoltaic module battery piece is realized. The tin-plated aluminum alloy photovoltaic solder strip prepared by the method has good antioxidation property, the anticorrosion property of the tin-plated aluminum alloy is greatly exceeded, the atmosphere corrosion test and the electrolyte corrosion test are carried out according to GB 10124 "metal materials laboratory uniform corrosion full immersion test method", the corrosion rate is less than or equal to 0.03mm/a under the condition of 720 hours of the test period, the tin-plated aluminum alloy photovoltaic solder strip has good stability in salt mist and salt water, the antioxidation defect of an aluminum alloy material is overcome, the antioxidation problem of the tin-plated aluminum alloy photovoltaic solder strip prepared by adopting a tin-plated aluminum alloy conductor material under the long-term high-temperature condition is completely met, and the requirement of the photovoltaic 25-year service life is met.
The tin plating aluminum alloy process provided by the invention well solves the technical problem of tin plating on the surface of an aluminum alloy conductor, and successfully realizes the tin plating process on the surface of the aluminum alloy conductor by pre-zinc dipping, nickel plating on the basis of the pre-zinc dipping and tin plating, and the tin plating technology is realized on the surface of the aluminum alloy on the premise that the original electrical property and mechanical property of the aluminum alloy conductor are not affected, so that the problem of aluminum weldability is solved, the weldability of a tin plating aluminum alloy photovoltaic solder strip accords with GB/T31985 photovoltaic tin-coated solder strip, the problem of connection between battery pieces of a photovoltaic component is solved, the purpose that the photovoltaic solder strip replaces copper with aluminum is realized, and the manufacturing cost of a photovoltaic component is greatly reduced.
Experimental results show that the tinned aluminum alloy conductor material provided by the invention has good electric conductivity, tensile property and fatigue resistance, the electric conductivity is more than 62% IACS, the elongation at break is more than or equal to 10%, and the tensile strength is more than or equal to 120MPa.
Drawings
FIG. 1 is a microstructure image of a plated section of a tin-plated aluminum alloy for a photovoltaic solder strip prepared according to the present invention.
Detailed Description
For a further understanding of the present invention, preferred embodiments of the invention are described below in conjunction with the examples, but it should be understood that these descriptions are merely intended to illustrate further features and advantages of the invention and are not limiting of the invention claims.
All the raw materials of the present invention are not particularly limited in their sources, and may be purchased on the market or prepared according to conventional methods well known to those skilled in the art.
The purity of all the raw materials is not particularly limited, and the invention preferably adopts the purity requirement of the conventional technical pure or aluminum alloy photovoltaic solder strip preparation field.
All raw materials of the invention, the brands and abbreviations of which belong to the conventional brands and abbreviations in the field of the related application are clear and definite, and the person skilled in the art can purchase from the market or prepare by the conventional method according to the brands, abbreviations and the corresponding application.
The process used in the invention, the abbreviations thereof belong to the conventional abbreviations in the field, the specific steps and the conventional parameters of each abbreviation are clear and definite in the related field, and the process can be realized by a conventional method according to the abbreviations by a person skilled in the art.
The invention provides a tin-plated aluminum alloy for a photovoltaic solder strip, which is characterized by comprising the following components in percentage by mass:
Sn：1％～40％；
Ni：0.1％～25％；
the balance of Al and impurities;
a tinning layer is arranged on the surface of the tinned aluminum alloy;
the thickness of the tin plating layer is 1-100 mu m.
In the present invention, the addition amount of Sn is 1% to 40%, or 9% to 32%, or 17% to 24%.
In the present invention, the Ni is added in an amount of 0.1% to 25%, or 0.5% to 20%, or 1% to 15%, or 5% to 10%.
In the present invention, the thickness of the tin plating layer is preferably 1 to 100. Mu.m, more preferably 5 to 70. Mu.m, still more preferably 10 to 50. Mu.m, still more preferably 15 to 25. Mu.m.
In the present invention, the tin-plated aluminum alloy further preferably contains 0.1 to 20wt% of Pb, more preferably 1 to 10wt% of Pb, and preferably 3 to 8wt% of Pb.
In the invention, the tinned aluminum alloy comprises an aluminum alloy substrate, a nickel plating layer compounded on the substrate and a tinned layer compounded on the nickel plating layer. In particular, the tin-plated aluminum alloy preferably includes an aluminum alloy substrate and a plating layer compounded on the aluminum alloy substrate. Wherein the plating layer preferably comprises a nickel plating layer compounded on the substrate and a tin plating layer compounded on the nickel plating layer. In the invention, based on the preparation process, the aluminum alloy substrate is firstly plated with nickel and then plated with tin, and has a structure of plated with tin and plated with nickel. From the electron microscope microstructure of the tin-plated aluminum alloy finished product, no obvious layer boundary structure exists between the tin plating layer and the nickel plating layer, and further, the aluminum alloy substrate provided by the invention is considered to have an integral plating structure, or a tin-nickel mixed layer structure between the tin plating layer and the nickel plating layer.
Referring to fig. 1, fig. 1 is a microstructure image of a plated section of a tin-plated aluminum alloy for a photovoltaic solder strip prepared according to the present invention.
In the present invention, the aluminum alloy matrix preferably includes an aluminum alloy wire and/or an aluminum alloy ribbon, more preferably an aluminum alloy coil or an aluminum alloy ribbon.
In the present invention, the thickness of the aluminum alloy base is preferably 0.1 to 8mm, more preferably 0.5 to 7mm, and still more preferably 1 to 7mm.
In the present invention, the tin-plated aluminum alloy preferably further comprises 1wt% to 40wt% of one or more of Zn, C, O, N, more preferably 5wt% to 25wt% of one or more of Zn, C, O, N, and more preferably 5wt% to 15wt% of one or more of Zn, C, O, N.
In the present invention, in the tin-plated aluminum alloy, the mass content of the tin plating layer is preferably 1% to 50%, more preferably 10% to 30%, and still more preferably 15% to 25%.
In the present invention, the thickness of the nickel plating layer in the tin-plated aluminum alloy is preferably 100nm to 10. Mu.m, more preferably 1 μm to 6. Mu.m, still more preferably 2 μm to 4. Mu.m.
The invention adopts a tinning mode to form a tinning layer, but other elements are inevitably present in raw materials or processes or are present as a result of inspection mode, so that a certain amount of the elements are present after the detection of the tinning layer.
The invention provides a preparation method of a tinned aluminum alloy for a photovoltaic solder strip, which is characterized by comprising the following steps of:
1) After pretreatment, zinc dipping and nickel plating are carried out on the aluminum alloy coil, and then the aluminum alloy coil compounded with the nickel plating layer is obtained;
2) And (3) tinning the aluminum alloy coil compounded with the nickel plating layer obtained in the steps, and then performing aftertreatment to obtain the tinned aluminum alloy coil.
Firstly, after pretreatment, zinc dipping and nickel plating are carried out on an aluminum alloy coil, and then the aluminum alloy coil compounded with a nickel plating layer is obtained.
In the present invention, the preparation process of the aluminum alloy coil preferably includes the steps of:
and (3) carrying out smelting, casting and rolling procedures on the aluminum alloy raw material to obtain the aluminum alloy coil.
In the present invention, the pretreatment step preferably includes one or more of surface chemical degreasing, hot water washing, cold water washing, strong alkali etching, water washing, and light emitting, more preferably, a plurality of surface chemical degreasing, hot water washing, cold water washing, strong alkali etching, water washing, and light emitting.
In the invention, after the tinned aluminum alloy coil is segmented, a tinned aluminum alloy photovoltaic solder strip is preferably obtained.
In the present invention, the zincating treatment liquid preferably includes:
The zinc dipping time is 5-10 min.
Wherein the NaOH content is preferably 180-260 g/L, more preferably 190-250 g/L, more preferably 200-240 g/L, more preferably 210-230 g/L.
Wherein the content of ZnO is preferably 30 to 40g/L, more preferably 32 to 38g/L, and still more preferably 34 to 36g/L.
Wherein the content of the potassium sodium tartrate is preferably 50-60 g/L, more preferably 52-58 g/L, and still more preferably 54-56 g/L.
Wherein the FeCI is 3 ·6H 2 The O content is preferably 16 to 25g/L, more preferably 18 to 23g/L, and still more preferably 20 to 21g/L.
Wherein the NaNO 3 The content of (C) is preferably 16 to 25g/L, more preferably 18 to 23g/L, and still more preferably 20 to 21g/L.
In the present invention, the time for the zincating is preferably 5 to 10 minutes, more preferably 6 to 9 minutes, and still more preferably 7 to 8 minutes.
In the present invention, the nickel plating method preferably includes plating bright nickel.
In the present invention, the treatment liquid for plating bright nickel preferably includes:
wherein the NiSO 4 ·6H 2 The O content is preferably 400 to 450g/L, more preferably 410 to 440g/L, and still more preferably 420 to 430g/L.
Wherein the NiCl 2 ·6H 2 The O content is preferably 150 to 180g/L, more preferably 155 to 175g/L, and still more preferably 160 to 170g/L.
Wherein the H is 3 BO 4 The content of (C) is preferably 80 to 90g/L, more preferably 82 to 88g/L, and still more preferably 84 to 86g/L.
Wherein the saccharin content is preferably 10-50 g/L, more preferably 15-45 g/L, more preferably 20-40 g/L, more preferably 25-35 g/L.
Wherein the content of the 1.4-butynediol is preferably 6-8 g/L, more preferably 6.4-7.6 g/L, and even more preferably 6.8-7.2 g/L.
Wherein the content of coumarin is preferably 1-2 g/L, more preferably 1.2-1.8 g/L, and even more preferably 1.4-1.6 g/L.
Wherein the content of the sodium dodecyl sulfate is preferably 1 to 5g/L, more preferably 1.5 to 4.5g/L, more preferably 2 to 4g/L, and more preferably 2.5 to 3.5g/L.
In the present invention, the pH of the plated bright nickel is preferably 3.5 to 4.0, more preferably 3.6 to 3.9, and still more preferably 3.7 to 3.8.
In the invention, D of the electroplated bright nickel k Preferably 6 to 8A/dm 2 More preferably 6.4 to 7.6A/dm 2 More preferably 6.8 to 7.2A/dm 2 。
In the present invention, the temperature of the bright nickel plating is preferably 40 to 45 ℃, more preferably 41 to 44 ℃, and even more preferably 42 to 43 ℃.
In the present invention, the time for plating the bright nickel is preferably 10 to 15 minutes, more preferably 11 to 14 minutes, and still more preferably 12 to 13 minutes.
In the present invention, the nickel plating means preferably includes plating of dark nickel.
In the present invention, the treatment liquid for plating dark nickel preferably includes:
NiSO 4 ·6H 2 O 300～350g/L；
NaCl 40～45g/L；
Na 2 SO 4 85～95g/L。
wherein the NiSO 4 ·6H 2 The O content is preferably 300 to 350g/L, more preferably 310 to 340g/L, and still more preferably 320 to 330g/L.
Wherein the NaCl content is preferably 40 to 45g/L, more preferably 41 to 44g/L, and even more preferably 42 to 43g/L.
Wherein the Na is 2 SO 4 The content of (C) is preferably 85 to 95g/L, more preferably 87 to 93g/L, and even more preferably 89 to 91g/L.
In the invention, D of the electroplated dark nickel k Preferably 8 to 10A/dm 2 More preferably 8.4 to 9.6A/dm 2 More preferably 8.8 to 9.2A/dm 2 。
In the present invention, the temperature of the plated dark nickel is preferably 35 to 40 ℃, more preferably 36 to 39 ℃, and still more preferably 37 to 38 ℃.
In the present invention, the time for plating the dark nickel is preferably 10 to 15 minutes, more preferably 11 to 14 minutes, and still more preferably 12 to 13 minutes.
Finally, tinning the aluminum alloy coil compounded with the nickel plating layer obtained in the steps, and then performing aftertreatment to obtain the tinned aluminum alloy coil.
In the present invention, the means of tin plating preferably includes electrolytic tin plating.
In the present invention, the electrolytic tin plating treatment liquid preferably includes:
Wherein the SnSO 4 The content of (C) is preferably 140 to 170g/L, more preferably 145 to 165g/L, and even more preferably 150 to 160g/L.
Wherein the H is 2 SO 4 The content of (C) is preferably 240 to 270g/L, more preferably 245 to 265g/L, and still more preferably 250 to 260g/L.
Wherein the content of SS-820 is preferably 55-60 mL/L, more preferably 56-59 mL/L, and even more preferably 57-58 mL/L.
Wherein the content of SS-821 is preferably 5 to 10mL/L, more preferably 6 to 9mL/LL, and even more preferably 7 to 8mL/L.
In the present invention, D of the electroplated tin k Preferably 6 to 10A/dm 2 More preferably 6.5 to 9.5A/dm 2 More preferably 7 to 9A/dm 2 More preferably 7.5 to 8.5A/dm 2 。
In the present invention, the temperature of the electrolytic tin is preferably 20 to 30 ℃, more preferably 22 to 28 ℃, and still more preferably 24 to 26 ℃.
In the present invention, the time for the tin plating is preferably 6 to 15 minutes, more preferably 8 to 13 minutes, and still more preferably 10 to 11 minutes.
The invention is a complete and refined whole technical scheme, better guarantees the structure and composition of the tinned aluminum alloy photovoltaic solder strip, further improves the performance of the tinned aluminum alloy photovoltaic solder strip, and the tinned aluminum alloy for the photovoltaic solder strip and the preparation method thereof specifically comprise the following steps:
The invention provides a tin-plated aluminum alloy for a photovoltaic solder strip, which is prepared by plating a layer of tin with the thickness of not less than 1 mu m on the surface of an aluminum alloy material, wherein the tin-plated aluminum alloy comprises the following components in percentage by weight:
Sn：1～40％；
Ni：0.1％～25％；
the balance being Al and impurities.
Specifically, the tin-plated aluminum alloy further comprises 0.1-20 wt% of Pb.
Specifically, the tinned aluminum alloy further comprises 1-40 wt% of at least one of Zn, C, O and N.
Specifically, the aluminum alloy material is manufactured into an aluminum alloy coil through smelting, casting and rolling procedures, and the surface of the aluminum alloy coil is subjected to chemical degreasing, hot water washing, cold water washing, strong alkali etching, water washing, light emitting, water washing, zinc soaking, water washing, nickel electroplating, water washing, tin electroplating, water washing, drying, inspection, tinning of the aluminum alloy coil, segmentation and an aluminum alloy photovoltaic welding strip.
Specifically, the zinc dipping process comprises the following steps:
180-260 g/L NaOH, 30-40g/L ZnO, 50-60 g/L sodium potassium tartrate and FeCI 3 ·6H 2 O 16～25g/L，NaNO 3 16-25 g/L, temperature: the room temperature is kept for 5-10 min.
Specifically, the bright nickel electroplating process comprises the following steps:
NiSO 4 ·6H 2 O 400～450g/L，NiCl 2 ·6H 2 O 150～180g/L，H 3 BO 4 80-90 g/L saccharin 10-50 g/L, 1.4-butynediol 6-8 g/L, tonka bean1 to 2g/L of element, 1 to 5g/L of sodium dodecyl sulfate, 3.5 to 4.0g/L of pH value and D k 6～8A/dm 2 The temperature is 40-45 ℃ and the time is 10-15 min.
Specifically, the process for electroplating the dark nickel comprises the following steps:
NiSO 4 ·6H 2 O 300～350g/L，NaCl 40～45g/L，Na 2 SO 4 85～95g/L，D k 8～10A/dm 2 the temperature is 35-40 ℃ and the time is 10-15 min.
Specifically, the electrotinning process is as follows:
SnSO 4 140～170g/L，H 2 SO 4 240-270 mL/L, SS-820-60 mL/L (for cylinder opening). SS-821 5-L0 mL/L (additive), temperature 20-30 ℃, D k 6～10A/dm 2 The time is 6-15 min.
Specifically, the tinned aluminum alloy material can be manufactured into an aluminum alloy photovoltaic solder strip for a bus strip and an interconnection strip.
Specifically, the aluminum alloy material is manufactured into an aluminum alloy coil through smelting, casting and rolling procedures.
Specifically, the surface of the aluminum alloy coil is subjected to chemical degreasing, hot water washing, cold water washing, strong alkali etching, water washing, light emitting, water washing, zinc dipping, water washing, nickel electroplating, water washing, tin electroplating, water washing, drying, inspection, tinning of the aluminum alloy coil, segmentation and aluminum alloy photovoltaic solder strips.
Specifically, the zinc dipping process comprises the following steps:
180-260 g/L NaOH, 30-40g/L ZnO, 50-60 g/L sodium potassium tartrate and FeCI 3 ·6H 2 O 16～25g/L，NaNO 3 16-25 g/L, temperature: the room temperature is kept for 5-10 min.
Zinc impregnation is the key point of the process, and the quality of the zinc impregnation layer directly influences the quality of the nickel plating layer. The zinc impregnation function is as follows: (1) removing the exposed surface layer, (2) making the relative potential of the aluminum alloy conductor surface higher.
When in preparation, znO is firstly mixed into paste and added into sodium hydroxide solution, and is continuously stirred, otherwise Zn (OH) is easy to form 2 And (5) precipitation.The bonding force between the coating and the matrix can be improved by adding 3-valent Fe ions. The added potassium sodium tartrate can form a complex with 3-valent Fe ions to prevent the 3-valent Fe ions from forming Fe (OH) 3 And (5) precipitation. NaNO 3 The oxidation-reduction reaction can be promoted. Because the electrode potential of Zn is close to that of A1, the deposition speed of Zn is slow, the leaching time is too short, and a zinc layer cannot be deposited; the zinc layer is re-dissolved for too long, so that it is important to control the zinc dipping time, if the quality of the primary zinc dipping layer is poor, 100ml/L HNO can be used 3 And (5) removing the solution.
In order to enhance the binding force between the tinning layer and the aluminum matrix, the invention selects to plate a layer of nickel on the surface of the aluminum alloy in advance and then to plate tin on the basis of nickel, thus being easy to realize.
Specifically, the bright nickel electroplating process comprises the following steps:
NiSO 4 ·6H 2 O 400～450g/L，NiCl 2 ·6H 2 O 150～180g/L，H 3 BO 4 80-90 g/L saccharin 10-50 g/L, 1.4-butynediol 6-8 g/L coumarin 1-2 g/L, sodium dodecyl sulfate 1-5 g/L, pH 3.5-4.0 g/L, D k 6～8A/dm 2 The temperature is 40-45 ℃ and the time is 10-15 min.
Specifically, the process for electroplating the dark nickel comprises the following steps:
NiSO 4 ·6H 2 O 300～350g/L，NaCl 40～45g/L，Na 2 SO 4 85～95g/L，D k 8～10A/dm 2 the temperature is 35-40 ℃ and the time is 10-15 min.
After zinc impregnation of the aluminum workpiece, nickel is plated as soon as possible, and in order to prevent the zinc impregnation layer from being dissolved in the nickel plating solution, the aluminum substrate is charged into the nickel plating solution. The bright plating layer can be directly plated by electroplating bright nickel, the plating layer is fine, but the internal stress of the plating layer is large, the plating layer cannot be too thick, or else the plating layer is easy to peel.
The plating layer obtained by electroplating the dark nickel has fine crystallization, good toughness, smaller internal stress and better corrosion resistance than bright nickel.
Specifically, the electrotinning process is as follows:
SnSO 4 140～170g/L，H 2 SO 4 240-270 mL/L, SS-820-60 mL/L (for cylinder opening). SS-821 5-L0 mL/L (additive), temperature 20-30 ℃, D k 6～10A/dm 2 The time is 6-15 min.
In the operation process, the workpiece is required to be cleaned after the cathode is moved to plate, and the tinning time is determined according to the required thickness.
Specifically, the tinned aluminum alloy material prepared by the procedures can be further processed to prepare a photovoltaic solder strip which is used as a bus strip and an interconnection strip to play a role in connecting photovoltaic module battery pieces.
Further, the method comprises the steps of,
the invention discloses a tin-plated alloy material for a photovoltaic solder strip, which comprises the following components in percentage by weight:
Sn：1～40％；
Ni：0.1％～25％；
The balance being Al and impurities.
For matrix aluminum in the aluminum alloy, pure aluminum of industrial Al99.70 can be adopted, so that the aluminum alloy prepared by the method has the advantages of sufficient raw material supply, low cost, convenient purchase and the like; meanwhile, the aluminum base can also adopt refined aluminum or high-purity aluminum as a matrix alloy, and the aluminum base has higher quality than the common aluminum base material, and the processed product has more advantages in the aspects of electrical property and mechanical property.
The aluminum alloy coil is obtained by smelting, casting and rolling the aluminum alloy material. The surface of the aluminum alloy coil of the present embodiment is plated with tin having a thickness of 1000nm or more.
In order to prepare the tinned aluminum alloy material for the photovoltaic solder strip, the invention also provides a tinning process flow, wherein the tinning process flow is as follows: the method comprises the steps of chemical degreasing of the surface of an aluminum alloy coil, hot water washing, cold water washing, strong alkali etching, water washing, light emitting, water washing, zinc dipping, water washing, nickel electroplating, water washing, tin electroplating, water washing, drying, inspection, tinning of the aluminum alloy coil, segmentation and aluminum alloy photovoltaic solder strip.
In order to more fully illustrate the tin plating process, the invention further provides a zinc dipping process, which is as follows:
180-260 g/L NaOH, 30-40g/L ZnO, 50-60 g/L sodium potassium tartrate and FeCI 3 ·6H 2 O 16～25g/L，NaNO 3 16-25 g/L, temperature: the room temperature is kept for 5-10 min.
In order to enhance the binding force between the tinning layer and the aluminum substrate, the invention can be easily realized by plating a layer of nickel on the surface of the aluminum alloy in advance and then plating tin on the basis of the nickel.
According to the invention, if the bright nickel electroplating process is adopted, the bright nickel electroplating process comprises the following steps:
NiSO 4 ·6H 2 O 400～450g/L，NiCl 2 ·6H 2 O 150～180g/L，H 3 BO 4 80-90 g/L saccharin 10-50 g/L, 1.4-butynediol 6-8 g/L coumarin 1-2 g/L, sodium dodecyl sulfate 1-5 g/L, pH 3.5-4.0 g/L, D k 6～8A/dm 2 The temperature is 40-45 ℃ and the time is 10-15 min.
According to the invention, if the process of plating the dark nickel is adopted, the process of plating the dark nickel is as follows:
NiSO 4 ·6H 2 O 300～350g/L，NaCl 40～45g/L，Na 2 SO 4 85～95g/L，D k 8～10A/dm 2 the temperature is 35-40 ℃ and the time is 10-15 min.
After zinc impregnation of the aluminum workpiece, nickel is plated as soon as possible, and in order to prevent the zinc impregnation layer from being dissolved in the nickel plating solution, the aluminum substrate is charged into the nickel plating solution. The bright plating layer can be directly plated by electroplating bright nickel, the plating layer is fine, but the internal stress of the plating layer is large, the plating layer cannot be too thick, or else the plating layer is easy to peel.
The plating layer obtained by electroplating the dark nickel has fine crystallization, good toughness, smaller internal stress and better corrosion resistance than the bright nickel.
According to the invention, the electrotinning process is as follows:
SnSO 4 140～170g/L，H 2 SO 4 240-270 mL/L, SS-820-60 mL/L (for cylinder opening). SS-821 5-L0 mL/L (additive), temperature 20-30 ℃, D k 6～10A/dm 2 The time is 6-15 min.
In the operation process, the workpiece is required to be cleaned after the cathode is moved to plate, and the tinning time is determined according to the required thickness.
According to the invention, the tinned aluminum alloy material prepared by the procedures can be further processed into a photovoltaic solder strip which is used as a bus strip and an interconnection strip to play a role in connecting the battery pieces of the photovoltaic module.
The invention provides the tin-plated aluminum alloy prepared by any one of the technical schemes or the preparation method of any one of the technical schemes, and the application of the tin-plated aluminum alloy in the field of photovoltaic welding strips.
In the present invention, the photovoltaic solder strip preferably includes a bus strip and/or an interconnect strip.
The invention also provides a tinned aluminum alloy for the photovoltaic solder strip, and a preparation method and application thereof. The tinned aluminum alloy wire for the photovoltaic solder strip has better hardness, wear resistance, toughness and oxidation resistance, solves the problem of weldability of aluminum alloy materials, can be directly welded with a photovoltaic module battery piece, realizes the key technical problem that the photovoltaic solder strip replaces copper with aluminum, and greatly reduces the manufacturing cost of the photovoltaic module. The tin-plated aluminum alloy conductor material can be manufactured into a bus bar and an interconnection bar, is applied to connection between photovoltaic module battery pieces, and plays an important role in conductive electricity collection.
According to the invention, the surface of the aluminum alloy conductor material is subjected to tinning treatment, so that the hardness, wear resistance and toughness of the existing aluminum alloy conductor material are greatly improved, various performance indexes of the aluminum alloy as a photovoltaic solder strip material are effectively optimized, particularly oxidation resistance is improved, the service life of the aluminum alloy material is prolonged, the service life of photovoltaic 25 years is at least met, the problem of aluminum weldability is most importantly solved, and the connection between the aluminum alloy material and a photovoltaic module battery piece is realized. The tin-plated aluminum alloy photovoltaic solder strip prepared by the method has good antioxidation property, the anticorrosion property of the tin-plated aluminum alloy is greatly exceeded, the atmosphere corrosion test and the electrolyte corrosion test are carried out according to GB 10124 "metal materials laboratory uniform corrosion full immersion test method", the corrosion rate is less than or equal to 0.03mm/a under the condition of 720 hours of the test period, the tin-plated aluminum alloy photovoltaic solder strip has good stability in salt mist and salt water, the antioxidation defect of an aluminum alloy material is overcome, the antioxidation problem of the tin-plated aluminum alloy photovoltaic solder strip prepared by adopting a tin-plated aluminum alloy conductor material under the long-term high-temperature condition is completely met, and the requirement of the photovoltaic 25-year service life is met.
The tin plating aluminum alloy process provided by the invention well solves the technical problem of tin plating on the surface of an aluminum alloy conductor, and successfully realizes the tin plating process on the surface of the aluminum alloy conductor by pre-zinc dipping, nickel plating on the basis of the pre-zinc dipping and tin plating, and the tin plating technology is realized on the surface of the aluminum alloy on the premise that the original electrical property and mechanical property of the aluminum alloy conductor are not affected, so that the problem of aluminum weldability is solved, the weldability of a tin plating aluminum alloy photovoltaic solder strip accords with GB/T31985 photovoltaic tin-coated solder strip, the problem of connection between battery pieces of a photovoltaic component is solved, the purpose that the photovoltaic solder strip replaces copper with aluminum is realized, and the manufacturing cost of a photovoltaic component is greatly reduced.
Experimental results show that the tinned aluminum alloy conductor material provided by the invention has good electric conductivity, tensile property and fatigue resistance, the electric conductivity is more than 62% IACS, the elongation at break is more than or equal to 10%, and the tensile strength is more than or equal to 120MPa.
In order to further illustrate the present invention, the following detailed description is made with reference to the embodiments of the tin-plated aluminum alloy for photovoltaic solder strip, the preparation method and the application thereof, but it should be understood that these embodiments are implemented on the premise of the technical scheme of the present invention, and detailed implementation and specific operation procedures are given, which are only for further illustrating the features and advantages of the present invention, but not limiting the claims of the present invention, and the scope of protection of the present invention is not limited to the following embodiments.
Example 1
(1) Putting an aluminum-alloy ingot into a smelting furnace, and manufacturing an aluminum alloy coil through smelting, casting and rolling procedures;
(2) Electroplating a layer of tin with the thickness of 1 mu m on the surface of the aluminum alloy coil obtained in the step (1), wherein the procedure of the tin plating process on the surface of the aluminum alloy coil is as follows:
chemical degreasing of the surface of an aluminum alloy coil, hot water washing, cold water washing, strong alkali etching, water washing, light emitting, water washing, zinc dipping, water washing, nickel electroplating, water washing, tin electroplating, water washing, drying, inspection, tinning of the aluminum alloy coil, segmentation and aluminum alloy photovoltaic solder strip. The composition of the tin-plated aluminum alloy is shown in Table 1.
Referring to Table 1, table 1 shows the composition (wt%) of the tin-plated aluminum alloy photovoltaic solder strip prepared in the examples of the present invention.
(3) The zinc dipping process conditions in the step (2) are as follows:
180g/L NaOH, 30g/L ZnO, 50g/L potassium sodium tartrate and FeCI 3 ·6H 2 O 16g/L，NaNO 3 16g/L, under the condition of room temperature, the time is 5min;
(4) The bright nickel electroplating process in the step (2) comprises the following steps:
NiSO 4 ·6H 2 O 400g/L，NiCl 2 ·6H 2 O 150g/L，H 3 BO 4 80g/L saccharin 10g/L, 1.4-butynediol 6g/L, coumarin 1g/L, sodium dodecyl sulfate 1g/L, pH 3.5g/L, D k 6A/dm 2 The temperature is 40 ℃ and the time is 10min;
(5) The tin electroplating process in the step (2) is as follows:
SnSO 4 140g/L，H 2 SO 4 240mL/L, SS-820 55mL/L (for cylinder opening). SS-821 5mL/L (additive), temperature 20 ℃, D k 6A/dm 2 The time is 6min. The other ingredients are added in the form of chlorides.
The properties of the aluminum alloy photovoltaic solder strips prepared according to the above method were tested, and the results are shown in table 2.
Table 2 is a table of performance test data of the tin-plated aluminum alloy photovoltaic solder strip prepared in the example of the present invention.
Example 2
(1) Putting an aluminum-alloy ingot into a smelting furnace, and manufacturing the aluminum-alloy ingot into rolls through smelting, casting and rolling procedures;
(2) Electroplating a layer of tin with the thickness of 5 mu m on the surface of the aluminum alloy coil obtained in the step (1), wherein the procedure of the tin plating process on the surface of the aluminum alloy coil is as follows:
chemical degreasing of the surface of an aluminum alloy coil, hot water washing, cold water washing, strong alkali etching, water washing, light emitting, water washing, zinc dipping, water washing, nickel electroplating, water washing, tin electroplating, water washing, drying, inspection, tinning of the aluminum alloy coil, segmentation and aluminum alloy photovoltaic solder strip. The composition of the tin-plated aluminum alloy is shown in Table 1.
(3) The zinc dipping process conditions in the step (2) are as follows:
260g/L NaOH, 40g/L ZnO, 60g/L potassium sodium tartrate and FeCI 3 ·6H 2 O 25g/L，NaNO 3 25g/L, under the condition of room temperature, the time is 10min;
(4) The bright nickel electroplating process in the step (2) comprises the following steps:
NiSO 4 ·6H 2 O 450g/L，NiCl 2 ·6H 2 O 180g/L，H 3 BO 4 90g/L saccharin 50g/L, 1.4-butynediol 8g/L, coumarin 2g/L, sodium dodecyl sulfate 5g/L, pH 4.0g/L, D k 8A/dm 2 The temperature is 45 ℃ and the time is 11min;
(5) The tin electroplating process in the step (2) is as follows:
SnSO 4 170g/L，H 2 SO 4 270mL/L, SS-820 60mL/L (for cylinder opening). SS-821L 0mL/L (additive), temperature 30 ℃, D k 10A/dm 2 For 7min. The other ingredients are added in the form of chlorides.
The properties of the aluminum alloy photovoltaic solder strips prepared according to the above method were tested, and the results are shown in table 2.
Example 3
(1) Putting an aluminum-alloy ingot into a smelting furnace, and manufacturing an aluminum alloy coil through smelting, casting and rolling procedures;
(2) Electroplating a layer of tin with the thickness of 15m on the surface of the aluminum alloy coil obtained in the step (1), wherein the tin plating process flow of the surface of the aluminum alloy coil is as follows:
chemical degreasing of the surface of an aluminum alloy coil, hot water washing, cold water washing, strong alkali etching, water washing, light emitting, water washing, zinc dipping, water washing, nickel electroplating, water washing, tin electroplating, water washing, drying, inspection, tinning of the aluminum alloy coil, segmentation and aluminum alloy photovoltaic solder strip. The composition of the tin-plated aluminum alloy is shown in table 1;
(3) The zinc dipping process conditions in the step (2) are as follows:
NaOH 220/L, znO 35g/L, potassium sodium tartrate 55g/L, feCI 3 ·6H 2 O 20g/L，NaNO 3 20g/L, under the condition of room temperature, the time is 7min;
(4) The bright nickel electroplating process in the step (2) comprises the following steps:
NiSO 4 ·6H 2 O 425g/L，NiCl 2 ·6H 2 O 165g/L，H 3 BO 4 85g/L saccharin 30g/L, 1.4-butynediol 7g/L, coumarin 1.5g/L, sodium dodecyl sulfate 3g/L, pH 3.7g/L, D k 7A/dm 2 The temperature is 43 ℃ and the time is 12min;
(5) The tin electroplating process in the step (2) is as follows:
SnSO 4 155g/L，H 2 SO 4 255mL/L, SS-820 57mL/L (for cylinder opening). SS-821 7mL/L (additive), temperature 25 ℃, D k 8A/dm 2 The time is 8min. The other ingredients are added in the form of chlorides.
The properties of the aluminum alloy photovoltaic solder strips prepared according to the above method were tested, and the results are shown in table 2.
Example 4
(1) Putting an aluminum-alloy ingot into a smelting furnace, and manufacturing an aluminum alloy coil through smelting, casting and rolling procedures;
(2) Electroplating a layer of tin with the thickness of 10 mu m on the surface of the aluminum alloy coil obtained in the step (1), wherein the procedure of the tin plating process on the surface of the aluminum alloy coil is as follows:
chemical degreasing of the surface of an aluminum alloy coil, hot water washing, cold water washing, strong alkali etching, water washing, light emitting, water washing, zinc dipping, water washing, nickel electroplating, water washing, tin electroplating, water washing, drying, inspection, tinning of the aluminum alloy coil, segmentation and aluminum alloy photovoltaic solder strip. The composition of the tin-plated aluminum alloy is shown in table 1;
(3) The zinc dipping process conditions in the step (2) are as follows:
190g/L NaOH, 32g/L ZnO, 52g/L sodium potassium tartrate and FeCI 3 ·6H 2 O 18g/L，NaNO 3 18g/L, under the condition of room temperature, the time is 6min;
(4) The bright nickel electroplating process in the step (2) comprises the following steps:
NiSO 4 ·6H 2 O 410g/L，NiCl 2 ·6H 2 O 160g/L，H 3 BO 4 82g/L saccharin 20g/L, 1.4-butynediol 6.5g/L, coumarin 1.2g/L, sodium dodecyl sulfate 2g/L, pH 3.6g/L, D k 6.5A/dm 2 The temperature is 41 ℃ and the time is 13min;
(5) The tin electroplating process in the step (2) is as follows:
SnSO 4 145g/L，H 2 SO 4 250mL/L, SS-820 56mL/L (for cylinder opening). SS-821 6mL/L (additive), temperature 23 ℃, D k 8A/dm 2 The time is 9min. The other ingredients are added in the form of chlorides.
The properties of the aluminum alloy photovoltaic solder strips prepared according to the above method were tested, and the results are shown in table 2.
Example 5
(1) Putting an aluminum-alloy ingot into a smelting furnace, and manufacturing an aluminum alloy coil through smelting, casting and rolling procedures;
(2) Electroplating a layer of tin with the thickness of 100 mu m on the surface of the aluminum alloy wire rod obtained in the step (1), wherein the tin plating process flow of the surface of the aluminum alloy coil is as follows:
chemical degreasing of the surface of an aluminum alloy coil, hot water washing, cold water washing, strong alkali etching, water washing, light emitting, water washing, zinc dipping, water washing, nickel electroplating, water washing, tin electroplating, water washing, drying, inspection, tinning of the aluminum alloy coil, segmentation and aluminum alloy photovoltaic solder strip. The composition of the tin-plated aluminum alloy is shown in table 1;
(3) The zinc dipping process conditions in the step (2) are as follows:
250g/L NaOH, 38g/L ZnO, 58g/L potassium sodium tartrate and FeCI 3 ·6H 2 O 23g/L，NaNO 3 24 g/L, under the condition of room temperature, the time is 9min;
(4) The bright nickel electroplating process in the step (2) comprises the following steps:
NiSO 4 ·6H 2 O 440g/L，NiCl 2 ·6H 2 O 170g/L，H 3 BO 4 88g/L saccharin 40g/L, 1.4-butynediol 7.5g/L, coumarin 1.8g/L, sodium dodecyl sulfate 4g/L, pH 3.8g/L, D k 8A/dm 2 The temperature is 44 ℃ and the time is 14min;
(5) The tin electroplating process in the step (2) is as follows:
SnSO 4 160g/L，H 2 SO 4 260mL/L, SS-820 58mL/L (for cylinder opening). SS-821 8mL/L (additive), temperature 28 ℃, D k 8A/dm 2 The time is 10min. The other ingredients are added in the form of chlorides.
The properties of the aluminum alloy photovoltaic solder strips prepared according to the above method were tested, and the results are shown in table 2.
Example 6
(1) Putting an aluminum-alloy ingot into a smelting furnace, and manufacturing an aluminum alloy coil through smelting, casting and rolling procedures;
(2) Electroplating a layer of tin with the thickness of 50 mu m on the surface of the aluminum alloy coil obtained in the step (1), wherein the procedure of the tin plating process on the surface of the aluminum alloy coil is as follows:
chemical degreasing of the surface of an aluminum alloy coil, hot water washing, cold water washing, strong alkali etching, water washing, light emitting, water washing, zinc dipping, water washing, nickel electroplating, water washing, tin electroplating, water washing, drying, inspection, tinning of the aluminum alloy coil, segmentation and aluminum alloy photovoltaic solder strip. The composition of the tin-plated aluminum alloy is shown in table 1;
(3) The zinc dipping process conditions in the step (2) are as follows:
180g/L NaOH, 30g/L ZnO, 50g/L potassium sodium tartrate and FeCI 3 ·6H 2 O 16g/L，NaNO 3 16g/L, under the condition of room temperature, the time is 5min;
(4) The process for electroplating the dark nickel in the step (2) comprises the following steps:
NiSO 4 ·6H 2 O 300g/L，NaCl 40g/L，Na 2 SO 4 85g/L，D k 8A/dm 2 the temperature is 35 ℃ and the time is 15min；
(5) The tin electroplating process in the step (2) is as follows:
SnSO 4 140g/L，H 2 SO 4 240mL/L, SS-820 55mL/L (for cylinder opening). SS-821 5mL/L (additive), temperature 20 ℃, D k 6A/dm 2 Time 11min. The other ingredients are added in the form of chlorides. The other ingredients are added in the form of chlorides.
The properties of the aluminum alloy photovoltaic solder strips prepared according to the above method were tested, and the results are shown in table 2.
Example 7
(1) Putting an aluminum-alloy ingot into a smelting furnace, and manufacturing an aluminum alloy coil through smelting, casting and rolling procedures;
(2) Electroplating a layer of tin with the thickness of 40 mu m on the surface of the aluminum alloy coil obtained in the step (1), wherein the tin process flow on the surface of the aluminum alloy coil is as follows:
chemical degreasing of the surface of an aluminum alloy coil, hot water washing, cold water washing, strong alkali etching, water washing, light emitting, water washing, zinc dipping, water washing, nickel electroplating, water washing, tin electroplating, water washing, drying, inspection, tinning of the aluminum alloy coil, segmentation and aluminum alloy photovoltaic solder strip. The composition of the tin-plated aluminum alloy is shown in table 1;
(3) The zinc dipping process conditions in the step (2) are as follows:
260g/L NaOH, 40g/L ZnO, 60g/L potassium sodium tartrate and FeCI 3 ·6H 2 O 25g/L，NaNO 3 25g/L, under the condition of room temperature, the time is 15min;
(4) The process for electroplating the dark nickel in the step (2) comprises the following steps:
NiSO 4 ·6H 2 O 350g/L，NaCl 45g/L，Na 2 SO 4 95g/L，D k 10A/dm 2 the temperature is 40 ℃ and the time is 12min;
(5) The tin electroplating process in the step (2) is as follows:
SnSO 4 170g/L，H 2 SO 4 270mL/L, SS-820 60mL/L (for cylinder opening). SS-821L 0mL/L (additive), temperature 30 ℃, D k 10A/dm 2 The time is 8min. The other ingredients are added in the form of chlorides.
The properties of the aluminum alloy photovoltaic solder strips prepared according to the above method were tested, and the results are shown in table 2.
Example 8
(1) Putting an aluminum-alloy ingot into a smelting furnace, and manufacturing an aluminum alloy coil through smelting, casting and rolling procedures;
(2) Electroplating a layer of tin with the thickness of 60 mu m on the surface of the aluminum alloy coil obtained in the step (1), wherein the procedure of the tin plating process on the surface of the aluminum alloy coil is as follows:
chemical degreasing of the surface of an aluminum alloy coil, hot water washing, cold water washing, strong alkali etching, water washing, light emitting, water washing, zinc dipping, water washing, nickel electroplating, water washing, tin electroplating, water washing, drying, inspection, tinning of the aluminum alloy coil, segmentation and aluminum alloy photovoltaic solder strip. The composition of the tin-plated aluminum alloy is shown in table 1;
(3) The zinc dipping process conditions in the step (2) are as follows:
NaOH 220/L, znO 35g/L, potassium sodium tartrate 55g/L, feCI 3 ·6H 2 O 20g/L，NaNO 3 20g/L, under the condition of room temperature, the time is 7min;
(4) The process for electroplating the dark nickel in the step (2) comprises the following steps:
NiSO 4 ·6H 2 O 320g/L，NaCl43g/L，Na 2 SO 4 90g/L，D k 9A/dm 2 the temperature is 38 ℃ and the time is 14min;
(5) The tin electroplating process in the step (2) is as follows:
SnSO 4 155g/L，H 2 SO 4 255mL/L, SS-820 57mL/L (for cylinder opening). SS-821 7mL/L (additive), temperature 25 ℃, D k 8A/dm 2 Time 13min. The other ingredients are added in the form of chlorides.
The properties of the aluminum alloy photovoltaic solder strips prepared according to the above method were tested, and the results are shown in table 2.
Example 9
(1) Putting an aluminum-alloy ingot into a smelting furnace, and manufacturing an aluminum alloy coil through smelting, casting and rolling procedures;
(2) Electroplating a layer of tin with the thickness of 85 mu m on the surface of the aluminum alloy coil obtained in the step (1), wherein the tin plating process flow of the aluminum alloy coil surface is as follows:
chemical degreasing of the surface of an aluminum alloy coil, hot water washing, cold water washing, strong alkali etching, water washing, light emitting, water washing, zinc dipping, water washing, nickel electroplating, water washing, tin electroplating, water washing, drying, inspection, tinning of the aluminum alloy coil, segmentation and aluminum alloy photovoltaic solder strip. The composition of the tin-plated aluminum alloy is shown in table 1;
(3) The zinc dipping process conditions in the step (2) are as follows:
190g/L NaOH, 33g/L ZnO, 52g/L potassium sodium tartrate and FeCI 3 ·6H 2 O 18g/L，NaNO 3 18g/L, under the condition of room temperature, the time is 6min;
(4) The process for electroplating the dark nickel in the step (2) comprises the following steps:
NiSO 4 ·6H 2 O 320g/L，NaCl42g/L，Na 2 SO 4 88g/L，D k 8A/dm 2 the temperature is 36 ℃ and the time is 13min;
(5) The tin electroplating process in the step (2) is as follows:
SnSO 4 150g/L，H 2 SO 4 245mL/L, SS-820 mL/L (for cylinder opening). SS-821 6mL/L (additive), temperature 23 ℃, D k 7A/dm 2 The time was 14min. The other ingredients are added in the form of chlorides.
The properties of the aluminum alloy photovoltaic solder strips prepared according to the above method were tested, and the results are shown in table 2.
Example 10
(1) Putting an aluminum-alloy ingot into a smelting furnace, and manufacturing an aluminum alloy coil through smelting, casting and rolling procedures;
(2) Electroplating a layer of tin with the thickness of 35 mu m on the surface of the aluminum alloy coil obtained in the step (1), wherein the procedure of the tin plating process on the surface of the aluminum alloy coil is as follows:
chemical degreasing of the surface of an aluminum alloy coil, hot water washing, cold water washing, strong alkali etching, water washing, light emitting, water washing, zinc dipping, water washing, nickel electroplating, water washing, tin electroplating, water washing, drying, inspection, tinning of the aluminum alloy coil, segmentation and aluminum alloy photovoltaic solder strip. The composition of the tin-plated aluminum alloy is shown in table 1;
(3) The zinc dipping process conditions in the step (2) are as follows:
250g/L NaOH, 38g/L ZnO, 58g/L potassium sodium tartrate and FeCI 3 ·6H 2 O 23g/L，NaNO 3 23g/L, under the room temperature condition, the time is 8min;
(4) The process for electroplating the dark nickel in the step (2) comprises the following steps:
NiSO 4 ·6H 2 O 340g/L，NaCl 44g/L，Na 2 SO 4 92g/L，D k 10A/dm 2 the temperature is 39 ℃ and the time is 10min;
(5) The tin electroplating process in the step (2) is as follows:
SnSO 4 160g/L，H 2 SO 4 260mL/L, SS-820 58mL/L (for cylinder opening). SS-821 9mL/L (additive), temperature 28 ℃, D k 9A/dm 2 The time is 15min. The other ingredients are added in the form of chlorides.
The properties of the aluminum alloy photovoltaic solder strips prepared according to the above method were tested, and the results are shown in table 2.
TABLE 1
| Group of | Sn | Ni | Pb | Zn | C | O | N | Al and impurities |
| Example 1 | 1.52 | 30.0 | — | — | — | — | — | Allowance of |
| Example 2 | 39.80 | 1.21 | 0.12 | — | — | — | — | Allowance of |
| Example 3 | 5.00 | 3.63 | 15.80 | 0.02 | 29.80 | — | — | Allowance of |
| Example 4 | 3.21 | 2.56 | 19.80 | 0.95 | 0.01 | 23.50 | — | Allowance of |
| Example 5 | 12.55 | 8.66 | 13.55 | 5.0 | 0.5 | — | 18.56 | Allowance of |
| Example 6 | 16.08 | 12.63 | 8.88 | 0.15 | 3.0 | 18.23 | 8.86 | Allowance of |
| Example 7 | 20.55 | 6.50 | 5.56 | 0.088 | 0.08 | 6 | 13.34 | Allowance of |
| Example 8 | 28.02 | 1.150 | 1.33 | 3.58 | 2.29 | 13 | 5.55 | Allowance of |
| Example 9 | 30.25 | 19.68 | 0.95 | 1.60 | 0.55 | 8.07 | 6.06 | Allowance of |
| Example 10 | 8.06 | 25.13 | 0.58 | 9.90 | 1.23 | 1.09 | 2.27 | Allowance of |
TABLE 2
Referring to Table 3, table 3 is a table of performance test data for aluminum alloys prepared according to comparative examples of the present invention without any surface treatment.
Among these, the aluminum alloy wires in comparative examples 1 to 10 are the same as those in examples 1 to 10, respectively.
TABLE 3 Table 3
Referring to table 4, table 4 is a table of performance test data of the nickel-plated surface-treated aluminum alloy alone prepared in the comparative example of the present invention.
The aluminum alloy wires in comparative examples 11 to 20 were the same as those in examples 1 to 10, respectively, and the nickel plating process and the corresponding parameters were also the same as those in examples 1 to 10, respectively.
TABLE 4 Table 4
According to the comparison of examples, the aluminum alloy materials are subjected to tinning treatment, the aluminum alloy which is not subjected to any surface treatment and the aluminum alloy material which is subjected to only surface nickel plating treatment are basically not greatly different in tensile strength and elongation at break, the aluminum alloy material which is subjected to only surface nickel plating treatment is reduced in electrical performance compared with the aluminum alloy material which is not subjected to any treatment, the electrical performance of the tinned aluminum alloy material is greatly improved compared with that of the aluminum alloy material which is not subjected to any treatment, the aluminum alloy which is not subjected to tinning treatment is obviously inferior to that of the tinned aluminum alloy material in corrosion resistance, the aluminum alloy material which is not subjected to any treatment is worst in corrosion resistance, the aluminum alloy material which is subjected to only surface nickel plating treatment is improved in corrosion resistance, and the aluminum alloy after tinning has corrosion rate of less than or equal to 0.03mm/a, has better corrosion resistance and can meet the operation requirement of photovoltaic 25 years. The aluminum alloy strips of the examples and the comparative examples are tested according to the standard of GB/T31985 photovoltaic tin-coated solder strip, the aluminum alloy strips which are not subjected to any surface treatment have no weldability, the weldability of the aluminum alloy strips subjected to surface nickel plating is extremely poor, the standard test requirements cannot be passed, the tin-plated aluminum alloy solder strip of the examples has weldability, the welding performance is extremely good, the welding is realized in extremely short time, the requirements of the GB/T31985 standard are met, the tin-plated aluminum alloy photovoltaic solder strip prepared by the examples can be used as a bus bar and an interconnecting bar, the connection effect between the battery pieces of the photovoltaic component is achieved, and the consumption of the tin-plated copper solder strip can be greatly saved.
The invention has been described in detail with respect to a tin-plated aluminum alloy for photovoltaic solder strips, a method of making and using the same, and specific examples of which are provided herein to facilitate an understanding of the principles and embodiments of the invention, including the best mode, and to enable any person skilled in the art to practice the invention, including making and using any devices or systems, and performing any incorporated methods. It should be noted that it will be apparent to those skilled in the art that various modifications and adaptations of the invention can be made without departing from the principles of the invention and these modifications and adaptations are intended to be within the scope of the invention as defined in the following claims. The scope of the patent protection is defined by the claims and may include other embodiments that occur to those skilled in the art. Such other embodiments are intended to be within the scope of the claims if they have structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements with insubstantial differences from the literal language of the claims.
Claims (10)
1. The tinned aluminum alloy for the photovoltaic solder strip is characterized by comprising the following components in percentage by mass:
Sn：1％～40％；
Ni：0.1％～25％；
the balance of Al and impurities;
a tinning layer is arranged on the surface of the tinned aluminum alloy;
the thickness of the tin plating layer is 1-100 mu m.
2. The tin-plated aluminum alloy according to claim 1, wherein the tin-plated aluminum alloy further comprises 0.1 to 20wt% Pb;
the tinned aluminum alloy comprises an aluminum alloy substrate, a nickel plating layer compounded on the substrate and a tinned layer compounded on the nickel plating layer;
the aluminum alloy matrix comprises an aluminum alloy wire and/or an aluminum alloy strip.
3. Tin-plated aluminum alloy according to claim 2, wherein the thickness of the aluminum alloy base is 0.1 to 8mm;
the tin-plated aluminum alloy further comprises one or more of Zn, C, O, N in an amount of 1-40 wt%;
in the tin-plated aluminum alloy, the mass content of a tin-plated layer is 1% -50%;
in the tin-plated aluminum alloy, the thickness of the nickel plating layer is 100 nm-10 mu m.
4. A method for producing a tin-plated aluminum alloy for a photovoltaic solder strip according to any one of claims 1 to 3, comprising the steps of:
1) After pretreatment, zinc dipping and nickel plating are carried out on the aluminum alloy coil, and then the aluminum alloy coil compounded with the nickel plating layer is obtained;
2) And (3) tinning the aluminum alloy coil compounded with the nickel plating layer obtained in the steps, and then performing aftertreatment to obtain the tinned aluminum alloy coil.
5. The method of manufacturing as claimed in claim 4, wherein the process of manufacturing the aluminum alloy coil comprises the steps of:
after the aluminum alloy raw materials are subjected to smelting, casting and rolling procedures, an aluminum alloy coil is obtained;
the pretreatment step comprises one or more of surface chemical degreasing, hot water washing, cold water washing, strong alkali etching, water washing and light emitting;
and after the tinned aluminum alloy coil is segmented, the tinned aluminum alloy photovoltaic solder strip is obtained.
6. The method according to claim 4, wherein the zincating treatment liquid comprises:
the zinc dipping time is 5-10 min.
7. The method according to claim 4, wherein the nickel plating method comprises plating bright nickel;
the treatment fluid for electroplating bright nickel comprises the following components:
the pH value of the electroplated bright nickel is 3.5-4.0;
d of the electroplated bright nickel k Is 6 to 8A/dm 2 ；
The temperature of the electroplated bright nickel is 40-45 ℃;
the time for electroplating the bright nickel is 10-15 min.
8. The method of claim 4, wherein the nickel plating comprises plating dark nickel;
The treatment fluid for electroplating the dark nickel comprises the following components:
NiSO 4 ·6H 2 O 300～350g/L；
NaCl40～45g/L；
Na 2 SO 4 85～95g/L；
d of the electroplated dark nickel k Is 8-10A/dm 2 ；
The temperature of the electroplated dark nickel is 35-40 ℃;
the time for electroplating the dark nickel is 10-15 min.
9. The method according to claim 4, wherein the tinning comprises electroplating tin;
the treatment solution for electroplated tin comprises the following components:
d of the electroplated tin k Is 6 to 10A/dm 2 ；
The temperature of the electrotinning is 20-30 ℃;
the time of the electrotinning is 6-15 min.
10. Use of the tin-plated aluminum alloy according to any one of claims 1 to 3 or the tin-plated aluminum alloy prepared by the preparation method according to any one of claims 4 to 9 in the field of photovoltaic solder strips.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311001475.8A CN116926518A (en) | 2023-08-09 | 2023-08-09 | Tinned aluminum alloy conductor material for photovoltaic solder strip, and preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311001475.8A CN116926518A (en) | 2023-08-09 | 2023-08-09 | Tinned aluminum alloy conductor material for photovoltaic solder strip, and preparation method and application thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116926518A true CN116926518A (en) | 2023-10-24 |
Family
ID=88379045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311001475.8A Pending CN116926518A (en) | 2023-08-09 | 2023-08-09 | Tinned aluminum alloy conductor material for photovoltaic solder strip, and preparation method and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116926518A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020088717A1 (en) * | 2000-11-08 | 2002-07-11 | Wittebrood Adrianus Jacobus | Brazing product having a low melting point |
| CN202054913U (en) * | 2011-03-01 | 2011-11-30 | 无锡新大中薄板有限公司 | Weldable tin plating aluminum alloy strip |
| CN102881756A (en) * | 2012-09-14 | 2013-01-16 | 上海华友金镀微电子有限公司 | Photovoltaic solder strip of aluminum material and manufacturing method for photovoltaic solder strip |
| CN107268049A (en) * | 2017-08-07 | 2017-10-20 | 尼尔金属(苏州)有限公司 | A kind of tin plating method on aluminium and aluminum alloy coiled materials |
| CN111403490A (en) * | 2018-12-28 | 2020-07-10 | 泰州隆基乐叶光伏科技有限公司 | Preparation method of solar cell interconnection structure |
| CN115198150A (en) * | 2022-06-24 | 2022-10-18 | 一汽解放汽车有限公司 | Aluminum-silicon alloy and preparation method and application thereof |
-
2023
- 2023-08-09 CN CN202311001475.8A patent/CN116926518A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020088717A1 (en) * | 2000-11-08 | 2002-07-11 | Wittebrood Adrianus Jacobus | Brazing product having a low melting point |
| CN202054913U (en) * | 2011-03-01 | 2011-11-30 | 无锡新大中薄板有限公司 | Weldable tin plating aluminum alloy strip |
| CN102881756A (en) * | 2012-09-14 | 2013-01-16 | 上海华友金镀微电子有限公司 | Photovoltaic solder strip of aluminum material and manufacturing method for photovoltaic solder strip |
| CN107268049A (en) * | 2017-08-07 | 2017-10-20 | 尼尔金属(苏州)有限公司 | A kind of tin plating method on aluminium and aluminum alloy coiled materials |
| CN111403490A (en) * | 2018-12-28 | 2020-07-10 | 泰州隆基乐叶光伏科技有限公司 | Preparation method of solar cell interconnection structure |
| CN115198150A (en) * | 2022-06-24 | 2022-10-18 | 一汽解放汽车有限公司 | Aluminum-silicon alloy and preparation method and application thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109957822B (en) | Copper alloy electroplating process | |
| WO2014156638A1 (en) | All-solid-state secondary battery | |
| CN101922024B (en) | Light composite electro-catalysis energy-saving anode for non-ferrous metal electro-deposition and preparation method thereof | |
| CN1171325C (en) | Battery sheath made of formed cold-rolled sheet and method for producing battery sheaths | |
| CN202088562U (en) | Tin-soldering aluminum tape with high-corrosion resistance | |
| CN107245729B (en) | Manganese electrodeposition carbon fiber-based graded composite anode material and preparation method thereof | |
| CN109137050B (en) | Graphene-doped modified interconnection belt or bus belt and preparation method thereof | |
| WO2024160246A1 (en) | Nickel-plated aluminum alloy conductor material for cable and preparation method therefor | |
| CN110629252B (en) | Method for preparing metal copper by electrolytic refining | |
| CN116926518A (en) | Tinned aluminum alloy conductor material for photovoltaic solder strip, and preparation method and application thereof | |
| CN113293411B (en) | Gradient composite lead dioxide anode plate and preparation method and application thereof | |
| CN105525317B (en) | Battery steel shell made from a kind of three layers of nickel plating technology of battery steel shell and the technique | |
| US3206382A (en) | Electrodeposition of platinum or palladium | |
| CN116844754B (en) | Tinned aluminum alloy conductor material for cables and preparation method and application thereof | |
| CN117182382A (en) | Aluminum-based composite conductor material capable of being used for fast welding photovoltaic solder strips, and preparation method and application thereof | |
| CN116936155A (en) | Tin-plated Al-Fe-Cu aluminum alloy conductor material for photovoltaic cable and preparation method and application thereof | |
| CN102071444A (en) | High-efficiency zinc die casting copper pre-plating electroplating solution | |
| CN117051452A (en) | Tin-plated Al-Fe aluminum alloy conductor material for wires and cables, and preparation method and application thereof | |
| CN220450333U (en) | Plating layer structure of tin-plated cobalt alloy chromium substitution | |
| CN1928160A (en) | Method for electrically plating Ti-Cu-Zn three alloys meeting three-prevention demand | |
| CN117038142A (en) | Tinned aluminum alloy electric power fitting and preparation method and application thereof | |
| CN113943954B (en) | Preparation method of 2-3 micron pinhole-free carrier electrolytic copper foil | |
| CN116875851A (en) | Nickel-plated Al-Fe-Zn alloy conductor material for photovoltaic cable and preparation method thereof | |
| CN116875850A (en) | Nickel-plated Al-Fe alloy conductor material for photovoltaic cable and preparation method thereof | |
| CN116875852A (en) | Nickel-plated Al-Fe-Zn alloy conductor material and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |