CN116926340A - Bottom blowing immersion type melting separation device and method for circuit board - Google Patents
Bottom blowing immersion type melting separation device and method for circuit board Download PDFInfo
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- CN116926340A CN116926340A CN202310836412.8A CN202310836412A CN116926340A CN 116926340 A CN116926340 A CN 116926340A CN 202310836412 A CN202310836412 A CN 202310836412A CN 116926340 A CN116926340 A CN 116926340A
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- burner
- bath
- sedimentation tank
- molten pool
- circuit board
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- 238000000926 separation method Methods 0.000 title claims abstract description 36
- 238000007664 blowing Methods 0.000 title claims abstract description 31
- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000002844 melting Methods 0.000 title description 30
- 230000008018 melting Effects 0.000 title description 30
- 238000007654 immersion Methods 0.000 title description 9
- 238000004062 sedimentation Methods 0.000 claims abstract description 89
- 239000002893 slag Substances 0.000 claims abstract description 49
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 claims abstract description 45
- 239000003546 flue gas Substances 0.000 claims abstract description 45
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 43
- 229910052802 copper Inorganic materials 0.000 claims abstract description 42
- 239000010949 copper Substances 0.000 claims abstract description 42
- 238000002485 combustion reaction Methods 0.000 claims abstract description 25
- 230000000149 penetrating effect Effects 0.000 claims abstract description 3
- 239000002826 coolant Substances 0.000 claims description 48
- 239000007789 gas Substances 0.000 claims description 38
- 239000007788 liquid Substances 0.000 claims description 38
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 32
- 238000007599 discharging Methods 0.000 claims description 19
- 239000000446 fuel Substances 0.000 claims description 16
- 229910052757 nitrogen Inorganic materials 0.000 claims description 16
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 15
- 239000001301 oxygen Substances 0.000 claims description 15
- 229910052760 oxygen Inorganic materials 0.000 claims description 15
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 14
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 claims description 10
- 239000010410 layer Substances 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 claims description 7
- 239000011261 inert gas Substances 0.000 claims description 7
- 239000003345 natural gas Substances 0.000 claims description 7
- 239000011229 interlayer Substances 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 5
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 claims description 5
- 239000001273 butane Substances 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 5
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 claims description 5
- 239000003502 gasoline Substances 0.000 claims description 5
- 239000003915 liquefied petroleum gas Substances 0.000 claims description 5
- 239000000155 melt Substances 0.000 claims description 5
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 claims description 5
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 claims description 5
- 239000001294 propane Substances 0.000 claims description 5
- 238000004891 communication Methods 0.000 claims description 3
- 239000012809 cooling fluid Substances 0.000 claims description 3
- 239000002737 fuel gas Substances 0.000 claims description 3
- 230000004927 fusion Effects 0.000 claims description 3
- 238000003723 Smelting Methods 0.000 abstract description 9
- 239000002699 waste material Substances 0.000 description 18
- 239000011819 refractory material Substances 0.000 description 12
- 230000008569 process Effects 0.000 description 11
- 239000012535 impurity Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 230000001276 controlling effect Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 229910000831 Steel Inorganic materials 0.000 description 5
- 239000003034 coal gas Substances 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- 238000006722 reduction reaction Methods 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- HGUFODBRKLSHSI-UHFFFAOYSA-N 2,3,7,8-tetrachloro-dibenzo-p-dioxin Chemical compound O1C2=CC(Cl)=C(Cl)C=C2OC2=C1C=C(Cl)C(Cl)=C2 HGUFODBRKLSHSI-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000008033 biological extinction Effects 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 238000005485 electric heating Methods 0.000 description 2
- 239000010793 electronic waste Substances 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000779 smoke Substances 0.000 description 2
- 238000009270 solid waste treatment Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 239000002918 waste heat Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- OMZSGWSJDCOLKM-UHFFFAOYSA-N copper(II) sulfide Chemical compound [S-2].[Cu+2] OMZSGWSJDCOLKM-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000009853 pyrometallurgy Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002910 solid waste Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B21/00—Obtaining aluminium
- C22B21/0084—Obtaining aluminium melting and handling molten aluminium
- C22B21/0092—Remelting scrap, skimmings or any secondary source aluminium
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacture And Refinement Of Metals (AREA)
Abstract
A bottom-blowing immersed type smelting separation device and method for circuit board are disclosed, in which the bath body includes a feed pipe penetrating through the upper middle part of one side to guide in the circuit board and a combustion hole at the bottom, at least one bath burner is arranged at the bottom of the bath to provide heat source, the bath burner has burner nozzle extending into the combustion hole at the bottom of the bath, the sedimentation tank is communicated with the bath body, the bottom of the sedimentation tank is higher than the bottom of the bath body, the sedimentation tank includes copper discharge opening and slag discharge opening at one side far from the bath body, a flue gas channel for guiding out flue gas from the bath body at the upper part of the other side near the bath body and a circulation channel for circulation at the lower part of the other side near the bath body, a baffle extends from the other side near the bath body toward the bath body, the flue gas outlet is arranged at the top of the sedimentation tank and at one side far from the bath body, and the flue gas outlet is communicated with the flue gas channel. The device has high heat efficiency.
Description
Technical Field
The application relates to the technical field of solid waste treatment, in particular to a bottom blowing immersion type melting separation device and method for a circuit board.
Background
In the process of continuously updating electronic products, a large amount of waste printed circuit boards can be generated. The waste printed circuit board has complex components, namely contains various harmful substances, such as polyvinyl chloride, brominated combustion improver, lead, cadmium and other heavy metals; meanwhile, the alloy also contains a large amount of recoverable valuable metals such as copper, tin, gold, silver and the like. Therefore, the waste printed circuit board is not only an electronic waste, but also a precious resource, and the clean and efficient recycling treatment of the waste printed circuit board is receiving a great deal of attention in the technical field of solid waste treatment.
Copper in the copper ore raw material is mainly in the form of copper sulfide or copper oxide, and a series of chemical reactions such as oxidation and reduction are needed in the copper pyrometallurgy process to obtain blister copper. Copper in the waste circuit board exists in a simple substance form, oxidation and reduction reactions are not needed, and copper is only needed to be melted at a high temperature so as to be enriched. Therefore, unlike the smelting method of copper from ore, when waste circuit boards are treated by using the molten bath smelting technology, the process operation mode should be optimized according to the characteristics of the waste circuit boards, so that a better copper smelting effect is obtained. The prior molten pool smelting technology mainly comprises a blast furnace, a kardol furnace, a side-blown furnace and a top-blown furnace, and the smelting technologies have the problems of higher recovery rate of copper and other noble metals, higher energy consumption, small reaction intensity, poor raw material applicability, risk of dioxin pollution and the like.
The above information disclosed in the background section is only for enhancement of understanding of the background of the application and therefore may contain information that does not form the prior art that is already known to a person of ordinary skill in the art.
Disclosure of Invention
The application aims to provide a bottom blowing immersed type melting separation device and method for a circuit board, wherein a molten pool burner is directly inserted into the bottom of a molten pool and is divided into a molten pool and a sedimentation tank, waste circuit board materials roll and boil in the molten pool under the severe stirring and high-temperature influence of the molten pool burner, most of combustion heat release is absorbed by the melt, heat and mass transfer are greatly improved, heat efficiency is remarkably improved, smelting intensity is high, treatment scale is adjustable, and raw material applicability is strong. The temperature in the furnace is about 1300 ℃, the organic matters of the circuit board are thoroughly decomposed, the quenching control of a smoke outlet is realized, and the generation of dioxin is greatly reduced.
In order to achieve the above object, the present application provides the following technical solutions:
the application relates to a bottom blowing immersion type melting separation device of a circuit board, which comprises:
the molten pool body is of a hollow double-layer containing structure, cooling fluid circulates in an interlayer of the double-layer containing structure, the molten pool body comprises a feed pipe penetrating through the middle upper part of one side to guide a circuit board to be treated and a combustion hole arranged at the bottom,
at least one bath burner arranged at the bottom of the bath to provide a source of heat, the bath burner having burner ports extending into the combustion holes at the bottom of the bath,
a sedimentation tank communicated with the bath body, wherein the bottom of the sedimentation tank is higher than the bottom of the bath body, the sedimentation tank comprises a copper discharge port and a slag discharge port which are positioned at one side far from the bath body, a flue gas channel which is positioned at the upper part of the other side close to the bath body and is used for guiding out flue gas from the bath body, and a circulating channel which is positioned at the lower part of the other side close to the bath body and is used for circulating, a baffle plate extends from the sedimentation tank to the other side close to the bath body and towards the bath body,
and the flue gas outlet is arranged at the top end of the sedimentation tank and is far away from one side of the molten pool body, and the flue gas outlet is in gas communication with the flue gas channel.
In the bottom blowing immersed type melting separation device of the circuit board, the nozzle of the molten pool burner extends into the bottom of the molten pool and has an extending length of-5 cm to 10cm.
In the bottom blowing immersed type melting separation device of the circuit board, the lower part of the molten pool burner is connected with the molten pool body in a sealing way through a flange.
In the bottom blowing immersed type melt separation device of the circuit board, the molten pool burner comprises a fuel inlet, a combustion improver inlet, a coolant inlet and a coolant outlet, wherein fuel entering the fuel inlet comprises combustible gas or combustible liquid, the combustible gas comprises natural gas, liquefied petroleum gas, coal gas, ethane, propane, butane or acetylene, the combustible liquid comprises diesel, gasoline or alcohol, the combustion improver entering the combustion improver inlet comprises air or oxygen, the coolant inlet is communicated with the coolant outlet, and the coolant therein comprises liquid water, gaseous air or inert gas.
In the bottom blowing immersed type melting separation device of the circuit board, the molten pool burner further comprises an electromagnetic valve for switching a fuel inlet and a remote control device, and the electromagnetic valve responds to the remote control device to switch the combustible gas into nitrogen.
In the bottom blowing immersed type melting separation device of the circuit board, the inclination angle of the feeding pipe is 60-80 degrees, the length of the feeding pipe is 0.1-1.5m, and the height of the lower port of the feeding pipe from the bottom of the molten pool is 0.5-2m.
In the bottom blowing immersion type fusion separation device of the circuit board, the baffle is a hollow horizontal plate.
In the bottom blowing immersed type melting separation device of the circuit board, a melting pool slag discharging port is arranged at the bottom of the melting pool body.
In the bottom blowing immersed type melting separation device of the circuit board, a sedimentation tank burner is arranged at the top of the sedimentation tank.
The processing method of the bottom blowing immersion type melting separation device of the circuit board comprises the following steps of,
the interlayer between the bath body and the sedimentation tank establishes a cooling circulation, and the bath body and the sedimentation tank are in a negative pressure state;
starting a molten pool burner to enable the temperature of the molten pool and the temperature of a sedimentation tank to reach 1300 ℃, inputting a feeding pipe into a circuit board to be treated, controlling the opening of a valve of a copper discharge port, keeping the feeding and copper liquid discharge to reach dynamic balance, and periodically opening a valve of a slag port to discharge slag;
and (3) keeping the opening states of the copper discharge port and the slag discharge port valve, gradually reducing the load of a molten pool burner, automatically switching the molten pool burner to quickly switch fuel gas and oxygen into nitrogen after molten pool and slag in a sedimentation tank are exhausted, keeping the gas quantity and back pressure of the molten pool burner to prevent residual molten liquid in the molten pool from entering the molten pool burner, closing the nitrogen of the molten pool burner when the temperature of the molten pool is reduced to below 600 ℃, keeping the flow of a coolant inlet, and closing the coolant inlet when the temperature of the molten pool is reduced to below 100 ℃.
In the technical scheme, the bottom blowing immersion type melting separation device and method for the circuit board provided by the application have the following beneficial effects: the burner is directly inserted into the bottom of the molten pool and is divided into two parts of the molten pool and a sedimentation tank, waste circuit board materials roll and boil in the molten pool under the severe stirring and high temperature influence of the burner, most of combustion heat release is absorbed by the melt, heat and mass transfer are greatly improved, heat efficiency is obviously improved, smelting intensity is high, treatment scale is adjustable, and raw material applicability is strong. The smelting cost and carbon emission of the waste circuit board are effectively reduced, and the method has remarkable promotion effect on the solid waste disposal requirements of 'reduction, harmlessness, reclamation and high value'.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments described in the present application, and other drawings may be obtained according to these drawings for a person having ordinary skill in the art.
Fig. 1 is a schematic structural diagram of a bottom-blowing immersion type melt separation device for a circuit board according to an embodiment of the present application.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, based on the embodiments of the application, which are apparent to those of ordinary skill in the art without inventive faculty, are intended to be within the scope of the application.
Thus, the following detailed description of the embodiments of the application, as presented in the figures, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, based on the embodiments of the application, which are apparent to those of ordinary skill in the art without inventive faculty, are intended to be within the scope of the application.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
In order to make the technical scheme of the present application better understood by those skilled in the art, the present application will be further described in detail with reference to the accompanying drawings.
Referring to fig. 1, in one embodiment, a bottom-blowing submerged type melt separation apparatus for a circuit board of the present application includes,
a molten pool body 1 which is a hollow double-layer containing structure, wherein a cooling fluid circulates in an interlayer of the double-layer containing structure, the molten pool body 1 comprises a feed pipe 3 which penetrates through the middle upper part of one side to guide a circuit board to be treated and a combustion hole which is arranged at the bottom,
at least one bath burner 2 arranged at the bottom of the bath to provide a source of heat, the bath burner 2 having burner ports extending into the combustion holes at the bottom of the bath,
a sedimentation tank 4 communicating with the bath body 1, the bottom of the sedimentation tank 4 being higher than the bottom of the bath body 1, the sedimentation tank 4 comprising a copper tap 9 and a slag tap 10 located on one side away from the bath body 1, a flue gas channel 6 located near the upper part of the other side of the bath body 1 for guiding out flue gas from the bath body 1, and a circulation channel located near the lower part of the other side of the bath body 1 for circulation,
a baffle 5 extending from the other side of the sedimentation tank 4 adjacent to the bath body 1 toward the bath body 1,
and a flue gas outlet 8 which is arranged at the top end of the sedimentation tank 4 and is far away from one side of the molten pool body 1, wherein the flue gas outlet 8 is in gas communication with the flue gas channel 6.
In the preferred embodiment of the bottom blowing immersed type melting separation device of the circuit board, the nozzle of the melting pool burner 2 extends into the bottom of the melting pool and has an extending length of-5 cm to 10cm. The wall surface of the molten pool has a thickness of more than 20cm due to the existence of the refractory material, and the wall surface of the molten pool is slightly deeper than a part of the refractory material (namely-5 cm) relative to the bottom of the molten pool, so that the burner body is protected.
In the preferred embodiment of the bottom-blowing immersed type melt separation device for the circuit board, the lower part of the bath burner 2 is in sealing connection with the bath body 1 through a flange.
In the preferred embodiment of the circuit board bottom-blowing submerged type melt separation apparatus, the bath burner 2 includes a fuel inlet, a combustion improver inlet, a coolant inlet and a coolant outlet, the fuel entering the fuel inlet includes a combustible gas or a combustible liquid, the combustible gas includes natural gas, liquefied petroleum gas, ethane, propane, butane or acetylene, the combustible liquid includes diesel, gasoline or alcohol, the combustion improver entering the combustion improver inlet includes air or oxygen, the coolant inlet communicates with the coolant outlet, and the coolant therein includes liquid water, gaseous air or inert gas.
In the preferred embodiment of the circuit board bottom-blowing submerged melt separation apparatus, the bath burner 2 further comprises a fuel inlet switching solenoid valve and a remote control device, the solenoid valve being responsive to the remote control device to switch the combustible gas to nitrogen.
In the preferred embodiment of the bottom blowing immersed type melt separation device for the circuit board, the inclination angle of the feeding pipe 3 is 60 degrees to 80 degrees, the length of the feeding pipe 3 is 0.1 m to 1.5m, and the height of the lower port of the feeding pipe 3 from the bottom of the molten pool is 0.5 m to 2m.
In the preferred embodiment of the bottom-blowing immersed type melt separation device for a circuit board, the baffle 5 is a hollow horizontal plate.
In the preferred embodiment of the bottom-blowing immersed type melting separation device of the circuit board, the melting bath body 1 is provided with a melting bath slag discharge port 11 at the bottom of the melting bath.
In the preferred embodiment of the bottom blowing immersed type melting separation device of the circuit board, a sedimentation tank burner 7 is arranged at the top of the sedimentation tank 4.
In one embodiment, the molten pool body 1 and the sedimentation tank 4 are integrally formed, and further, the molten pool body 1 and the sedimentation tank 4 are integrally formed into a double-layer structure.
In one embodiment, the flue gas channel 6 is an inverted L-shaped channel, which is favorable for introducing high-temperature flue gas in the molten pool body 1 into the sedimentation tank 4, and preserving heat of the sedimentation tank 4 by utilizing flue gas waste heat so as to ensure that slag in the sedimentation tank 4 keeps good fluidity, and further, the baffle 5 is located below the flue gas channel 6, so that the flue gas channel 6 is located at one side of the molten pool body 1 and has a larger caliber. Further, the flue gas channel 6 is of a tapered structure extending from the melting tank body 1 to the sedimentation tank 4, which is beneficial to the flue gas discharging effect of the melting tank body 1.
In one embodiment, the molten pool body 1 is made of double-layer steel, is welded and sealed, is hollow in the interior and is provided with a flow guide pipe, and can be filled with liquid water, gaseous air, water vapor, other inert gas and other mediums, so as to cool the steel molten pool body 1 and protect the molten pool body 1. Refractory material is sprayed on the inner side of the furnace wall of the bath body 1, so that the bath body 1 is further protected. The bath burner 2 is arranged at the bottom of the bath to provide a source of heat for the bath. The bottom of the molten pool is provided with a hole, a burner nozzle extends into the bottom of the molten pool, the extending length of the upper edge of the refractory material at the bottom of the relative molten pool can be 5-10cm, the burner body is wound with a refractory fiber blanket, the lower part of the burner is connected with the molten pool body 1 through a flange, and the melt in the molten pool is prevented from leaking. The number of burners at the bottom of the bath may be set to vary from 1 to 16 sets depending on the scale of the process. The burner power may be set to 10-200 kW/mantle depending on the process intensity. The burner is provided with a fuel inlet, a combustion improver inlet, a coolant inlet and a coolant outlet. The fuel mainly refers to combustible gas or liquid, wherein the gas comprises, but is not limited to, natural gas, liquefied petroleum gas, coal gas, ethane, propane, butane, acetylene and the like, preferably natural gas, coal gas and ethane, and the liquid comprises, but is not limited to, diesel, gasoline, alcohol and the like. The combustion improver comprises, but is not limited to, air, pure oxygen, or oxygen-enriched air. The coolant includes, but is not limited to, liquid water, gaseous air, inert gas, and the like. The burner system is provided with the electromagnetic valve and the remote control device, can rapidly switch the gas at the inlet of the burner, is used for switching the gas under emergency conditions, and avoids the occurrence of safety accidents or the occurrence of damage to the burner. If the oxygen or air of the burner suddenly flows down or stops flowing, the gas flowing can be stopped rapidly, the gas concentration is prevented from being too high, or in emergency, the gas and air in the burner can be switched into nitrogen rapidly, and slag in a molten pool is prevented from entering the cavity of the burner to damage the burner.
In one embodiment, the feed port is positioned at the upper part of the molten pool, so that the function of smoothly feeding the waste circuit board into the furnace is realized. The angle of the horizontal included angle of the feeding pipe 3 is 60 degrees to 80 degrees, the length of the feeding pipe 3 is 0.1 m to 1.5m, and the height of the lower port of the feeding pipe 3 from the bottom of the molten pool is 0.5 m to 2m. The specific horizontal angle, length and height of the feeding pipe 3 from the bottom of the molten pool are determined according to the arrangement of the burners in the molten pool, so that the vicinity of the disturbance center of the material burner in the furnace is ensured, and the material reaction rate is improved. The baffle 5 is used for preventing the melt from splashing into the flue gas channel 6 and further blocking the flue gas channel 6. The baffle 5 can be made of steel, is hollow, is provided with a guide plate, and is filled with coolant to prevent the baffle 5 body from being deformed or melted under the influence of high temperature. The baffle 5 can also adopt full refractory material and is designed integrally with the molten pool body 1, so that breakage and falling off are avoided. The flue gas channel 6 is used for introducing high-temperature flue gas in the molten pool into the sedimentation tank 4, and preserving heat for the sedimentation tank 4 by utilizing flue gas waste heat so as to ensure that slag in the sedimentation tank 4 keeps good fluidity. The flue gas channel 6 is a hole for the refractory material of the sedimentation tank 4 body, and has the functions of high temperature resistance and corrosion resistance. The diameter of the flue gas channel 6 is 0.2-1.0m, and the specific diameter is determined according to the melting treatment scale and the generated flue gas amount. The slag discharge port 11 of the molten pool is arranged at the bottom of the molten pool and is used for discharging slag of the molten pool under the condition of emergency furnace stopping so as to avoid solidification of slag in the molten pool. The slag discharge port 11 of the molten pool is made of a refractory material of the body of the sedimentation tank 4, has high temperature resistance and corrosion resistance, and has a thickness of 5-20cm.
In one embodiment, the sedimentation tank 4 is made of double-layer steel, welded and sealed, hollow inside and provided with a flow guide pipe, and can be filled with liquid water, gaseous air, water vapor, other inert gas and other mediums, so as to cool the steel sedimentation tank 4 body and protect the sedimentation tank 4 body. Refractory material is sprayed on the inner side of the furnace wall of the sedimentation tank 4, so that the bath body 1 is further protected. The sedimentation tank burner 7 is arranged at the upper part of the sedimentation tank 4 to supplement heat for the sedimentation tank 4. The upper part of the sedimentation tank 4 is provided with a hole, a burner nozzle extends into the upper part of the sedimentation tank 4, the extending length of the lower edge of the refractory material at the upper part of the sedimentation tank 4 can be 0-50cm, a burner body is wound with a refractory fiber blanket, the upper part of the burner is connected with the sedimentation tank 4 body through a flange, and the leakage of smoke in the sedimentation tank 4 is prevented. The number of burners at the bottom of the bath may be set to 15 sets according to the treatment scale. The burner power may be set to 10-200 kW/mantle depending on the process intensity. The burner is provided with a fuel inlet, a combustion improver inlet, a coolant inlet and a coolant outlet. The fuel mainly refers to combustible gas or liquid, wherein the gas comprises, but is not limited to, natural gas, liquefied petroleum gas, coal gas, ethane, propane, butane, acetylene and the like, preferably natural gas, coal gas and ethane, and the liquid comprises, but is not limited to, diesel, gasoline, alcohol and the like. The combustion improver comprises, but is not limited to, air, pure oxygen, or oxygen-enriched air. The coolant includes, but is not limited to, liquid water, gaseous air, inert gas, and the like. The flue gas outlet 8 is positioned at the top of the sedimentation tank 4, and the flue gas is discharged from the flue gas outlet 8 after passing through the sedimentation tank 4. The flue gas outlet 8 is a hole for the refractory material of the sedimentation tank 4 body, and has the functions of high temperature resistance and corrosion resistance. The diameter of the flue gas outlet 8 is 0.2-1.0m, and the specific diameter is determined according to the melting treatment scale and the generated flue gas amount. The copper discharge port 9 is positioned at the bottom of the sedimentation tank 4 and is used for discharging copper liquid. And impurity slag and copper liquid in the sedimentation tank 4 are layered due to density difference, so that the copper liquid and impurities are separated conveniently, and the copper liquid is discharged from the bottom of the sedimentation tank 4 for recycling. The copper placing port 9 is made of a sedimentation tank 4 body refractory material, has high temperature resistance and corrosion resistance, and has a thickness of 5-20cm. In order to avoid excessive temperature reduction, excessive viscosity and unsmooth slag discharge in the process of discharging copper liquid from the copper discharge port 9, electric heating wires can be arranged in the copper discharge port 9, and the temperature of the copper discharge port 9 is increased by resistance heating. The slag discharging port 10 is positioned near a slag line in the sedimentation tank 4 and is used for discharging impurity slag periodically, wherein the impurities are metal oxides such as silicon aluminum and the like, the density of the impurities is smaller than that of copper liquid, and the impurities float on the upper part of the sedimentation tank 4. The slag discharging port 10 is made of a main body refractory material of the sedimentation tank 4, has high temperature resistance and corrosion resistance, and has a thickness of 5-20cm. In order to avoid excessive temperature reduction, excessive viscosity and unsmooth slag discharge in the slag discharging process of slag from the slag discharging port 10, an electric heating wire can be arranged in the slag discharging port 10, and the temperature of the slag discharging port 10 is increased by resistance heating.
The processing method of the bottom blowing immersion type melting separation device of the circuit board comprises the following steps of,
the interlayer between the bath body 1 and the sedimentation tank 4 establishes a cooling circulation, and the bath body 1 and the sedimentation tank 4 are in a negative pressure state;
starting a molten pool burner 2 to enable the temperature of the molten pool and the temperature of a sedimentation tank 4 to reach 1300 ℃, inputting a circuit board to be treated into a feed pipe 3, controlling the opening of a valve of a copper discharge port 9, keeping the feeding and copper liquid discharge to reach dynamic balance, and periodically opening a valve of a slag port 10 to discharge slag;
the copper discharge port 9 and the slag discharge port 10 are kept in an open state, the load of the bath burner 2 is gradually reduced, after slag in the bath and the sedimentation tank 4 is discharged, the bath burner 2 is automatically switched to quickly switch fuel gas and oxygen into nitrogen, the gas quantity and the back pressure of the bath burner 2 are kept to prevent residual molten liquid in the bath from entering the bath burner 2, the nitrogen of the bath burner 2 is closed when the temperature of the bath is reduced to below 600 ℃, the flow of a coolant inlet is kept, and the coolant inlet is closed when the temperature of the bath is reduced to below 100 ℃.
In one embodiment, the method, in a method,
1) Preparation before start-up
The pool burner 2 and the sedimentation tank burner 7 are arranged in place, coolant inlet and outlet valves of the pool and the sedimentation tank 4 are opened, and cooling circulation is established. And opening a valve of a flue gas outlet 8, opening a flue gas fan, and controlling the molten pool and the sedimentation tank 4 to be in micro negative pressure.
2) Melting furnace start-up
(1) Opening air valves of each burner, introducing air, opening gas valves of each burner, introducing gas, opening starting devices of each burner, and igniting the burner. According to the steps of different oxygen concentrations, the burner air is gradually switched into pure oxygen, the furnace is baked for about 5 hours, and when the temperature of a molten pool and the temperature of a sedimentation tank reach about 1300 ℃, feeding is started.
(2) Waste circuit board materials enter a molten pool from a feed inlet, the liquid level of the molten pool is gradually established, the condition of a burner is observed in the process, the load and the back pressure of the burner are gradually increased, the coolant loop temperature of the molten pool and a sedimentation tank 4 is observed, the flow rate of a coolant inlet is regulated or the temperature is reduced in time, and the volatilization of the coolant due to the boiling point is avoided.
(3) After the depth of the molten liquid reaches above the slag discharging port 10 of the sedimentation tank 4, the normal production process is started.
3) Normal production
And (3) maintaining the feeding process, opening the copper opening 9, and controlling the opening of the copper opening 9 according to the material components of the waste circuit board, so as to maintain the feeding and copper liquid discharge to achieve basic dynamic balance.
The slag hole 10 is opened periodically to discharge a proper amount of impurity slag.
The normal production process keeps observing the condition of the burner and the temperature of the coolant loop, and avoids the extinction of the burner or the overtemperature of the coolant.
4) Furnace shutdown
Stopping feeding, keeping the opening state of the copper discharge port 9 and the slag discharge port 10, gradually reducing the load of the burner, starting the burner to automatically switch the gas function after the molten pool and slag in the sedimentation tank 4 are discharged, rapidly switching the gas and oxygen in the burner into nitrogen, keeping the gas quantity and the back pressure of the burner, and preventing the residual molten liquid in the molten pool from entering the burner.
After the bath temperature was reduced below 600 ℃, the burner nitrogen was turned off. The coolant inlet flow is maintained.
After the bath temperature has fallen below 100 ℃, the coolant inlet valve is closed.
After the temperature of each system was lowered to room temperature, the conditions of each part of the burner, the bath and the sedimentation tank 4 were checked.
5) Emergency furnace-stopping device
Under the condition of emergency furnace shutdown, the burner is started to automatically switch gas functions, gas and oxygen in the burner are quickly switched into nitrogen, the gas quantity and the back pressure of the burner are maintained, and residual molten liquid in a molten pool is prevented from entering the burner. And opening an emergency slag discharging port valve, a copper discharging port 9 valve and a slag discharging port 10 valve of the molten pool to rapidly discharge slag.
After the bath temperature was reduced below 600 ℃, the burner nitrogen was turned off. The coolant inlet flow is maintained.
After the bath temperature has fallen below 100 ℃, the coolant inlet valve is closed.
After the temperature of each system was lowered to room temperature, the conditions of each part of the burner, the bath and the sedimentation tank 4 were checked.
Example 1:
and selecting a waste circuit board of an electronic waste dismantling enterprise as a raw material. And 8 100kW power burners are respectively arranged on the molten pool, 4x2 of the power burners are distributed, 1 100kW burner is arranged on the sedimentation tank 4, and the cooling circulation is established by opening the coolant inlet and outlet valves of the molten pool and the sedimentation tank 4. And opening a valve of a flue gas outlet 8, opening a flue gas fan, and controlling the molten pool and the sedimentation tank 4 to be in micro negative pressure.
Opening air valves of each burner, introducing air, opening gas valves of each burner, introducing gas, opening starting devices of each burner, and igniting the burner. According to the steps of different oxygen concentrations, the burner air is gradually switched into pure oxygen, then the oxygen and the gas flow are gradually increased, and the burner load is adjusted to be about 50%. The furnace is baked for about 5 hours, and when the temperature of the molten pool and the temperature of the sedimentation tank 4 reach about 1300 ℃, the feeding is started.
Waste circuit board materials enter a molten pool from a feed inlet, the liquid level of the molten pool is gradually established, the condition of a burner is observed in the process, the load and the back pressure of the burner are gradually increased, the coolant loop temperature of the molten pool and a sedimentation tank 4 is observed, the coolant inlet flow or the coolant outlet temperature is timely adjusted, the coolant outlet temperature is kept to be lower than 50 ℃, and the coolant is prevented from volatilizing when reaching the boiling point.
After the depth of the molten liquid reaches above the slag discharging port 10 of the sedimentation tank 4, the normal production process is started.
And (3) maintaining the feeding process, opening a copper opening 9, controlling the opening of a valve of the copper opening 9 according to the material composition of the waste circuit board, maintaining the feeding and copper liquid discharge to achieve basic dynamic balance, and collecting the high-purity copper ingot above 2t/d at the waste circuit board treatment rate of about 20 t/d. In the production process, the waste circuit board contains about 25% of organic matters, so that the combustion releases heat, the load of the burner can be properly reduced, and the energy consumption and the cost are reduced.
The slag hole 10 is opened periodically to discharge a proper amount of impurity slag.
The normal production process keeps observing the condition of the burner and the temperature of the coolant loop, and avoids the extinction of the burner or the overtemperature of the coolant.
Example 2:
the melting furnace was operating normally with a burner load of about 80% and a feed rate of about 850kg/h. After the molten pool and the slag in the sedimentation tank 4 are exhausted, the burner is started to automatically switch the gas function, the gas and the oxygen in the burner are quickly switched into nitrogen, the gas quantity and the back pressure of the burner are maintained, and the residual molten liquid in the molten pool is prevented from entering the burner.
After the bath temperature was reduced below 600 ℃, the burner nitrogen was turned off. The coolant inlet flow is maintained.
After the bath temperature has fallen below 100 ℃, the coolant inlet valve is closed.
After the temperature of each system was lowered to room temperature, the burner and each part of the bath and the sedimentation tank 4 were inspected.
Finally, it should be noted that: the described embodiments are intended to be illustrative of only some, but not all, of the embodiments of the present application and, based on the embodiments herein, all other embodiments that may be made by those skilled in the art without the benefit of the present disclosure are intended to be within the scope of the present application.
While certain exemplary embodiments of the present application have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that modifications may be made to the described embodiments in various different ways without departing from the spirit and scope of the application. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive of the scope of the application, which is defined by the appended claims.
Claims (10)
1. A bottom-blowing submerged fusion separation device for a circuit board, comprising:
the molten pool body is of a hollow double-layer containing structure, cooling fluid circulates in an interlayer of the double-layer containing structure, the molten pool body comprises a feed pipe penetrating through the middle upper part of one side to guide a circuit board to be treated and a combustion hole arranged at the bottom,
at least one bath burner arranged at the bottom of the bath to provide a source of heat, the bath burner having burner ports extending into the combustion holes at the bottom of the bath,
a sedimentation tank communicated with the bath body, wherein the bottom of the sedimentation tank is higher than the bottom of the bath body, the sedimentation tank comprises a copper discharging opening and a slag discharging opening which are positioned at one side far away from the bath body, a flue gas channel which is positioned at the upper part of the other side close to the bath body and is used for guiding out flue gas from the bath body, and a circulating channel which is positioned at the lower part of the other side close to the bath body and is used for circulating,
a baffle extending from the other side of the sedimentation tank adjacent to the bath body toward the bath body,
and the flue gas outlet is arranged at the top end of the sedimentation tank and is far away from one side of the molten pool body, and the flue gas outlet is in gas communication with the flue gas channel.
2. The circuit board bottom-submerged type melt separation apparatus of claim 1, wherein said melt pool burner nozzles extend into the bottom of the melt pool along an extension of-5-10 cm.
3. The apparatus of claim 1 wherein the lower portion of the bath burner is sealingly connected to the bath body by a flange.
4. The circuit board bottom-submerged melt separation apparatus of claim 1, wherein the bath burner comprises a fuel inlet, a combustion improver inlet, a coolant inlet, and a coolant outlet, wherein the fuel entering the fuel inlet comprises a combustible gas or a combustible liquid, the combustible gas comprises natural gas, liquefied petroleum gas, ethane, propane, butane, or acetylene, the combustible liquid comprises diesel, gasoline, or alcohol, the combustion improver entering the combustion improver inlet comprises air or oxygen, the coolant inlet communicates with the coolant outlet, and wherein the coolant comprises liquid water, gaseous air, or an inert gas.
5. The circuit board bottom-submerged melt separation apparatus of claim 4, wherein the bath burner further comprises a solenoid valve that switches the fuel inlet and a remote control, the solenoid valve being responsive to the remote control to switch the combustible gas to nitrogen.
6. The bottom-blowing submerged type melt separation device for circuit boards according to claim 1, wherein the inclination angle of the feeding pipe is 60 degrees to 80 degrees, the length of the feeding pipe is 0.1 m to 1.5m, and the height of a lower port of the feeding pipe from the bottom of a molten pool is 0.5 m to 2m.
7. The bottom-blowing submerged fusion separation apparatus of claim 1, wherein said baffle is a hollow horizontal plate.
8. The bottom-submerged molten separation apparatus of claim 1, wherein the bath body is provided with a bath tap at the bottom of the bath.
9. The bottom-blowing submerged type melt separation device of claim 1, wherein a sedimentation tank burner is arranged at the top of the sedimentation tank.
10. A method for treating a bottom-submerged type melt separation apparatus for circuit boards according to any one of claims 1 to 9, characterized in that it comprises the steps of,
the interlayer between the bath body and the sedimentation tank establishes a cooling circulation, and the bath body and the sedimentation tank are in a negative pressure state;
starting a molten pool burner to enable the temperature of the molten pool and the temperature of a sedimentation tank to reach 1300 ℃, inputting a feeding pipe into a circuit board to be treated, controlling the opening of a valve of a copper discharge port, keeping the feeding and copper liquid discharge to reach dynamic balance, and periodically opening a valve of a slag port to discharge slag;
and (3) keeping the opening states of the copper discharge port and the slag discharge port valve, gradually reducing the load of a molten pool burner, automatically switching the molten pool burner to quickly switch fuel gas and oxygen into nitrogen after molten pool and slag in a sedimentation tank are exhausted, keeping the gas quantity and back pressure of the molten pool burner to prevent residual molten liquid in the molten pool from entering the molten pool burner, closing the nitrogen of the molten pool burner when the temperature of the molten pool is reduced to below 600 ℃, keeping the flow of a coolant inlet, and closing the coolant inlet when the temperature of the molten pool is reduced to below 100 ℃.
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