CN116925546A - Resin composition and use thereof - Google Patents
Resin composition and use thereof Download PDFInfo
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- CN116925546A CN116925546A CN202310868852.1A CN202310868852A CN116925546A CN 116925546 A CN116925546 A CN 116925546A CN 202310868852 A CN202310868852 A CN 202310868852A CN 116925546 A CN116925546 A CN 116925546A
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- China
- Prior art keywords
- resin
- benzoxazine resin
- benzoxazine
- resin composition
- resin containing
- Prior art date
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- 239000011342 resin composition Substances 0.000 title claims abstract description 72
- 229920005989 resin Polymers 0.000 claims abstract description 181
- 239000011347 resin Substances 0.000 claims abstract description 181
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 claims abstract description 121
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims abstract description 46
- 239000000203 mixture Substances 0.000 claims abstract description 25
- 239000007787 solid Substances 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 24
- 238000006243 chemical reaction Methods 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 14
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims description 11
- 239000013067 intermediate product Substances 0.000 claims description 10
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 4
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 3
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 claims description 3
- 125000005504 styryl group Chemical group 0.000 claims description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 3
- 229920002554 vinyl polymer Polymers 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 10
- 238000010521 absorption reaction Methods 0.000 abstract description 9
- 238000004132 cross linking Methods 0.000 abstract description 4
- 230000009257 reactivity Effects 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 39
- 239000003063 flame retardant Substances 0.000 description 35
- 239000004744 fabric Substances 0.000 description 32
- 229920002725 thermoplastic elastomer Polymers 0.000 description 32
- 239000003054 catalyst Substances 0.000 description 25
- 239000000945 filler Substances 0.000 description 23
- 239000003365 glass fiber Substances 0.000 description 23
- 238000002360 preparation method Methods 0.000 description 23
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 20
- 229910052751 metal Inorganic materials 0.000 description 19
- 239000002184 metal Substances 0.000 description 19
- 239000011888 foil Substances 0.000 description 16
- 239000012779 reinforcing material Substances 0.000 description 16
- 239000006087 Silane Coupling Agent Substances 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 15
- 239000000243 solution Substances 0.000 description 15
- 239000003292 glue Substances 0.000 description 14
- 230000006872 improvement Effects 0.000 description 14
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 12
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- 150000002460 imidazoles Chemical class 0.000 description 12
- 239000000126 substance Substances 0.000 description 12
- 238000013461 design Methods 0.000 description 9
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 8
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 239000002994 raw material Substances 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
- 229920001296 polysiloxane Polymers 0.000 description 7
- 239000004593 Epoxy Substances 0.000 description 6
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 239000007822 coupling agent Substances 0.000 description 6
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 6
- 229910052698 phosphorus Inorganic materials 0.000 description 6
- 239000011574 phosphorus Substances 0.000 description 6
- 239000000377 silicon dioxide Substances 0.000 description 6
- BZQKBFHEWDPQHD-UHFFFAOYSA-N 1,2,3,4,5-pentabromo-6-[2-(2,3,4,5,6-pentabromophenyl)ethyl]benzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1CCC1=C(Br)C(Br)=C(Br)C(Br)=C1Br BZQKBFHEWDPQHD-UHFFFAOYSA-N 0.000 description 5
- IPJGAEWUPXWFPL-UHFFFAOYSA-N 1-[3-(2,5-dioxopyrrol-1-yl)phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC(N2C(C=CC2=O)=O)=C1 IPJGAEWUPXWFPL-UHFFFAOYSA-N 0.000 description 5
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 4
- VHYFNPMBLIVWCW-UHFFFAOYSA-N 4-Dimethylaminopyridine Chemical compound CN(C)C1=CC=NC=C1 VHYFNPMBLIVWCW-UHFFFAOYSA-N 0.000 description 4
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 4
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 4
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 4
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 4
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 4
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 4
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 125000001931 aliphatic group Chemical group 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- IYABWNGZIDDRAK-UHFFFAOYSA-N allene Chemical group C=C=C IYABWNGZIDDRAK-UHFFFAOYSA-N 0.000 description 4
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical group [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 4
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 239000012796 inorganic flame retardant Substances 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- GKTNLYAAZKKMTQ-UHFFFAOYSA-N n-[bis(dimethylamino)phosphinimyl]-n-methylmethanamine Chemical class CN(C)P(=N)(N(C)C)N(C)C GKTNLYAAZKKMTQ-UHFFFAOYSA-N 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- KJFMBFZCATUALV-UHFFFAOYSA-N phenolphthalein Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C(=O)O1 KJFMBFZCATUALV-UHFFFAOYSA-N 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 4
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 239000008096 xylene Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000007731 hot pressing Methods 0.000 description 3
- 150000002431 hydrogen Chemical class 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 125000002524 organometallic group Chemical group 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical group C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- BSYJHYLAMMJNRC-UHFFFAOYSA-N 2,4,4-trimethylpentan-2-ol Chemical compound CC(C)(C)CC(C)(C)O BSYJHYLAMMJNRC-UHFFFAOYSA-N 0.000 description 2
- KMRIWYPVRWEWRG-UHFFFAOYSA-N 2-(6-oxobenzo[c][2,1]benzoxaphosphinin-6-yl)benzene-1,4-diol Chemical compound OC1=CC=C(O)C(P2(=O)C3=CC=CC=C3C3=CC=CC=C3O2)=C1 KMRIWYPVRWEWRG-UHFFFAOYSA-N 0.000 description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 2
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 2
- XIRDTMSOGDWMOX-UHFFFAOYSA-N 3,4,5,6-tetrabromophthalic acid Chemical compound OC(=O)C1=C(Br)C(Br)=C(Br)C(Br)=C1C(O)=O XIRDTMSOGDWMOX-UHFFFAOYSA-N 0.000 description 2
- GXIPHHIBYMWSMN-UHFFFAOYSA-N 6-phenylbenzo[c][2,1]benzoxaphosphinine 6-oxide Chemical compound O1C2=CC=CC=C2C2=CC=CC=C2P1(=O)C1=CC=CC=C1 GXIPHHIBYMWSMN-UHFFFAOYSA-N 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- OWIKHYCFFJSOEH-UHFFFAOYSA-N Isocyanic acid Chemical class N=C=O OWIKHYCFFJSOEH-UHFFFAOYSA-N 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- 229920006465 Styrenic thermoplastic elastomer Polymers 0.000 description 2
- 125000003342 alkenyl group Chemical group 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 150000007973 cyanuric acids Chemical class 0.000 description 2
- WHHGLZMJPXIBIX-UHFFFAOYSA-N decabromodiphenyl ether Chemical group BrC1=C(Br)C(Br)=C(Br)C(Br)=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br WHHGLZMJPXIBIX-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- KTWOOEGAPBSYNW-UHFFFAOYSA-N ferrocene Chemical group [Fe+2].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 KTWOOEGAPBSYNW-UHFFFAOYSA-N 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 2
- 239000000347 magnesium hydroxide Substances 0.000 description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 2
- 239000012766 organic filler Substances 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 229950000688 phenothiazine Drugs 0.000 description 2
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical class O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 2
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 2
- 150000003016 phosphoric acids Chemical class 0.000 description 2
- LFGREXWGYUGZLY-UHFFFAOYSA-N phosphoryl Chemical class [P]=O LFGREXWGYUGZLY-UHFFFAOYSA-N 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 2
- 230000035484 reaction time Effects 0.000 description 2
- 102220043986 rs116134953 Human genes 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 150000003440 styrenes Chemical class 0.000 description 2
- 239000012209 synthetic fiber Substances 0.000 description 2
- 229920002994 synthetic fiber Polymers 0.000 description 2
- RERMPCBBVZEPBS-UHFFFAOYSA-N tris(2,6-dimethylphenyl)phosphane Chemical compound CC1=CC=CC(C)=C1P(C=1C(=CC=CC=1C)C)C1=C(C)C=CC=C1C RERMPCBBVZEPBS-UHFFFAOYSA-N 0.000 description 2
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 2
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
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- 239000012776 electronic material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- 238000004381 surface treatment Methods 0.000 description 1
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Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The application discloses a resin composition and application thereof, wherein the resin composition comprises the following components in terms of solid weight: 10-70 parts of benzoxazine resin containing unsaturated bonds and 20-100 parts of maleimide resin; wherein the benzoxazine resin containing unsaturated bonds is a mixture of benzoxazine resin containing double bonds and benzoxazine resin containing triple bonds. Compared with the prior art, the resin composition and the application thereof can control the reactivity between the maleimide resin and the benzoxazine resin through the combination of the maleimide resin, the benzoxazine resin containing double bonds and the benzoxazine resin containing triple bonds, improve the crosslinking network density, and are beneficial to controlling the production speed of the prepreg, so that the prepreg has better apparent quality, and simultaneously has excellent high heat resistance, high modulus, low water absorption, low thermal expansion coefficient and low curing shrinkage.
Description
Technical Field
The application belongs to the technical field of electronic materials, and relates to a resin composition and application of the resin composition in prepregs, laminated boards, insulating films, circuit substrates and electronic devices.
Background
Along with the development of communication technology, electronic products are smaller and smaller in size, diversified in functions and denser in circuit design, so that more chips and modules are carried on a Printed Circuit Board (PCB), and correspondingly, copper-clad plates are required to have higher modulus, higher heat resistance and lower thermal expansion coefficient.
Along with the smaller and denser electronic product size and denser circuit design, more and more design manufacturers adopt an HDI technology to design a printed circuit board, and the technology has higher requirements on the aspects of dimensional stability, multi-time cold and heat impact stability, long-time thermo-oxidative aging stability and the like of a substrate material, and has far exceeded various performances of a traditional resin composition formula system.
Therefore, development of a resin composition having a low thermal expansion coefficient, high heat resistance, high modulus, low water absorption, and low cure shrinkage is a problem to be solved in the current circuit substrate application.
Disclosure of Invention
In order to obtain a resin composition having a low thermal expansion coefficient, high heat resistance, high modulus, low water absorption, and low curing shrinkage, the present application provides a resin composition and a prepreg, a laminate, an insulating board, an insulating film, a circuit board, and an electronic device using the resin composition.
To achieve the above object, an embodiment of the present application provides a resin composition comprising, by solid weight:
benzoxazine resin containing unsaturated bond: 10-70 parts;
maleimide resin: 20-100 parts;
wherein the benzoxazine resin containing unsaturated bonds is a mixture of benzoxazine resin containing double bonds and benzoxazine resin containing triple bonds.
Through the combination of the maleimide resin, the benzoxazine resin containing double bonds and the benzoxazine resin containing triple bonds, the reactivity between the maleimide resin and the benzoxazine resin can be controlled, the crosslinking network density is improved, the production speed of the prepreg is favorably controlled, the prepreg has better apparent quality, and meanwhile, the prepreg has excellent high heat resistance, high modulus, low water absorption, low thermal expansion coefficient and low curing shrinkage rate.
To achieve the above object, the present application also provides a resin composition comprising a prepolymer prepared by the following preparation method:
step (1), reacting maleimide resin with benzoxazine resin containing double bonds to obtain an intermediate product;
and (2) adding a benzoxazine resin containing a triple bond into the intermediate product for reaction to prepare the prepolymer.
The pre-polymerization reaction between the maleimide resin and the benzoxazine resin containing double bonds and the benzoxazine resin containing triple bonds can improve the rheological property of the resin composition in the lamination process, and simultaneously, the glue solution can be well soaked in the glass fiber cloth, so that the lamination manufacturability is improved; on the other hand, the reactivity between the maleimide resin and the benzoxazine resin can be controlled, the cross-linking network density is improved, so that the prepreg has better apparent mass, and meanwhile, the prepreg has excellent high heat resistance, high modulus, low water absorption, low thermal expansion coefficient and low curing shrinkage.
As a further improvement of an embodiment of the present application, the reaction conditions in the preparation method of the prepolymer are: the reaction temperature is 60-170 ℃ and the reaction time is 10-120 min.
As a further improvement of one embodiment of the present application, the reaction temperature of the step (1) is 80 to 130 ℃ and the reaction temperature of the step (2) is 60 to 100 ℃.
As a further improvement of an embodiment of the present application, the resin composition further comprises a maleimide resin and an unsaturated bond-containing benzoxazine resin, which is a mixture of a double bond-containing benzoxazine resin and a triple bond-containing benzoxazine resin.
As a further improvement of an embodiment of the present application, the resin composition further comprises a benzoxazine resin free of unsaturated bonds.
As a further improvement of an embodiment of the present application, the benzoxazine resin without unsaturated bonds is one or a mixture of at least two of bisphenol A type benzoxazine resin, dicyclopentadiene type benzoxazine resin, bisphenol F type benzoxazine resin, phenolphthalein type benzoxazine resin, MDA type benzoxazine resin, ODA type benzoxazine resin or unsaturated bond-terminated benzoxazine resin.
As a further improvement of an embodiment of the present application, in the benzoxazine resin containing unsaturated bonds, the content of the benzoxazine resin containing triple bonds is 1 to 70wt% and the content of the benzoxazine resin containing double bonds is 30 to 99wt%.
Further preferably, the content of the benzoxazine resin containing a triple bond in the benzoxazine resin containing an unsaturated bond is 1%, 3%, 5%, 10%, 15%, 20%, 25%, 30%, 35%, 40%, 45%, 50%, 55%, 60%, 65% or 70%.
As a further improvement of one embodiment of the present application, the terminal end of the benzoxazine resin containing a triple bond contains a carbon-carbon triple bond.
As an alternative, the benzoxazine resin containing a triple bond is one or a mixture of at least two of the following structures:
structural formula (1);
structural formula (2);
structural formula (3);
structural formula (4);
structural formula (5);
structural formula (6);
structural formula (7).
As a further improvement of an embodiment of the present application, the benzoxazine resin containing a double bond contains a carbon-carbon double bond at least in a side chain.
As an alternative, the double bond containing benzoxazine resin is one or a mixture of at least two of the following structures:
structural formula (8);
a structural formula (9);
structure of theFormula (10);
a structural formula (11);
wherein R is Or no connecting bond; r is R 0 、R 1 And R is R 2 Identical or different, each independently selected from hydrogen, alkyl or alkenyl, and R 0 、R 1 And R is R 2 At least one of which is an unsaturated group; r is R 4 Is-> Or no connection.
As an alternative, the alkyl group is methyl, ethyl or tert-butyl.
As an alternative, the carbon-carbon double bond is vinyl, allyl, propenyl, methacrylate, acrylate, styryl, phenylallyl or phenylallyl.
As an alternative, the maleimide resin is one or a mixture of at least two of the following structures:
a structural formula (12);
a structural formula (13);
a structural formula (14);
formula (15), wherein R 2 Is hydrogen, methyl or ethyl, R 1 Is methylene, ethylene or +.>n is 0 or an integer of 1 to 10;
a structural formula (16);
a structural formula (17), wherein n is an integer of 1 to 10;
a structural formula (18), wherein n is an integer of 1 to 10;
a structural formula (19), wherein n is an integer of 1 to 10;
a structural formula (20), wherein n is an integer of 1 to 10;
a structural formula (21), wherein n is an integer of 1 to 10;
a structural formula (22), wherein n is an integer of 1 to 10, and m is an integer of 1 to 10;
a structural formula (23), wherein n is an integer of 1 to 10, and m is an integer of 1 to 10;
a structural formula (24), wherein n is an integer of 1 to 10;
structural formula (25).
Further preferably, the maleimide resin is a maleimide resin containing aliphatic long chain groups, so that the dielectric constant and dielectric loss value of the prepreg can be reduced when the resin composition is used for preparing the prepreg later.
As an alternative, the maleimide resin containing aliphatic long-chain groups is selected from the group consisting of BMI-3000, BMI-3000J, BMI-2500, BMI-1500, BMI-689, BMI-1400, BMI-1700, BMI-5000, and BMI-6100 of molecular design company, SLK-3000, SLK-2600, SLK-2500, SLK-1500, and SLK-6895 of Xin-Yue chemical.
As a further improvement of an embodiment of the present application, the resin composition further comprises a thermoplastic elastomer.
As an alternative, the thermoplastic elastomer is at least one of a styrene-based thermoplastic elastomer, a polybutadiene-based thermoplastic elastomer, a silicone-based thermoplastic elastomer, a methacrylate-based thermoplastic elastomer, or a butyl methacrylate-based thermoplastic elastomer.
As an alternative, the styrenic thermoplastic elastomer is selected from the group consisting of H1041, H1043, H1051, H1052, H1053, H1221, P1500, P2000, M1911 or M1913 of japan chemical, colali 8004, 8006, 8076, 8104, V9827, 2002, 2005, 2006, 2007, 2104, 7125, 4033, 4044, 4055, 4077 or 4099, usa koteng D1116A, D1118E, D1152E, D1170B, D1157A, D1171P, D1184A, A1535 or a1536.
As an alternative, the silicone-based thermoplastic elastomer is selected from the group consisting of X-40-2670, R-170S, X-40-2705, X-40-2701, KMP-600, KMP-605, and X-52-7030 of the more chemical, AY-42-119, EP-2600, EP-2601, EP-2720, TMS-2670, EXL-2315, and EXL-2655 of DOW.
As an alternative, the methacrylate thermoplastic elastomer is selected from M51, M52, M22 or D51N of amara, colali LA-2330, SG-P3 series or SG-80 series.
As a further improvement of an embodiment of the present application, the resin composition further includes a flame retardant.
As an alternative, the flame retardant is at least one of a brominated flame retardant, a phosphorus flame retardant, a nitrogen flame retardant, a silicone flame retardant, an organometallic flame retardant, and an inorganic flame retardant.
As an alternative, the brominated flame retardant is selected from decabromodiphenyl ether, decabromodiphenyl ethane, brominated styrene, or tetrabromophthalic acid amide.
As an alternative, the phosphorus-based flame retardant is selected from inorganic phosphorus, condensed phosphate compounds, phosphoric acid compounds, hypophosphorous acid compounds, phosphorus oxide compounds, 9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO), 10- (2, 5-dihydroxyphenyl) -9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide
(DOPO-HQ), 10-phenyl-9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, tris (2, 6-dimethylphenyl) phosphorus,(m is an integer of 1 to 5),
Phosphazenes or modified phosphazenes.
Further preferably, the modified phosphazene is a phosphazene containing an unsaturated double bond.
As an alternative, the nitrogen-based flame retardant is selected from triazine compounds, cyanuric acid compounds, isocyanic acid compounds, phenothiazine.
As an alternative, the silicone flame retardant is selected from silicone oils, silicone rubbers, silicone resins.
As an alternative, the organometallic flame retardant is selected from ferrocene, acetylacetonate metal complexes, organometallic carbonyls.
As an alternative, the inorganic flame retardant is selected from aluminum hydroxide, magnesium hydroxide, aluminum oxide, barium oxide.
As a further improvement of an embodiment of the present application, the resin composition further includes a catalyst.
As an alternative, the catalyst is at least one of imidazole catalyst, pyridine catalyst and organic metal salt catalyst.
As an alternative, the catalyst is at least one of 4-dimethylaminopyridine, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, modified imidazole and zinc octoate.
As an alternative, the modified imidazole is one or a mixture of at least two of the following structures:
a structural formula (26);
a structural formula (27);
wherein R is 3 、R 4 、R 5 And R is R 6 The same or different, each independently selected from methyl, ethyl or tert-butyl; a is methylene, ethylene,Or an aromatic hydrocarbon group; b is methylene, ethylene,
Specifically, modified imidazole of structural formula (26) may be modified imidazole of the trade designation G8009L of first industry, inc; the modified imidazole of the structural formula (27) may be modified imidazole having a name of P200F50, manufactured by JER Co.
As a further improvement of an embodiment of the present application, the resin composition further includes a filler.
As an alternative, the filler is at least one of an inorganic filler, an organic filler, and a composite filler.
Further preferably, the filler is selected from spherical silica, alumina or aluminum hydroxide, more preferably spherical silica.
As a further improvement of an embodiment of the present application, the filler is surface-treated with a silane coupling agent, which is at least one of an aminosilane coupling agent, a carbon-carbon double bond-containing silane coupling agent, or an epoxy silane coupling agent.
As an alternative, the silane coupling agent is selected from the following structures:
a structural formula (28);
structural formula (29);
structural formula (30).
The application also provides application of the resin composition in prepregs, laminated boards, insulating films, circuit substrates and electronic devices, and the application is specifically described as follows:
the application also provides a prepreg which comprises a reinforcing material and the resin composition; the resin composition is wrapped on the reinforcing material.
The preparation method of the prepreg comprises the following steps: dissolving the resin composition with a solvent to prepare a glue solution, coating the glue solution on the reinforcing material by an impregnation method, taking out the impregnated reinforcing material, and baking for 1-15 min at the temperature of 100-180 ℃; and drying to obtain the prepreg.
As an alternative, the solvent is at least one selected from the group consisting of acetone, butanone, methyl isobutyl ketone, N-dimethylformamide, N-dimethylacetamide, ethylene glycol methyl ether, propylene glycol methyl ether, benzene, toluene, xylene, and cyclohexane.
As an alternative, the reinforcing material is selected from at least one of natural fibers, organic synthetic fibers, organic fabrics, and inorganic fabrics.
Preferably, the reinforcing material is glass fiber cloth. The glass fiber cloth is preferably a split cloth or a flat cloth. More preferably, the glass fiber cloth is E glass fiber cloth, S glass fiber cloth or Q glass fiber cloth.
In addition, when the reinforcing material is a glass fiber cloth, the glass fiber cloth is chemically treated with a coupling agent to improve interfacial bonding between the resin composition and the glass fiber cloth. The coupling agent herein preferably employs an epoxy silane coupling agent or an amino silane coupling agent to provide good water resistance and heat resistance.
The application also provides a laminated board which comprises a piece of the prepreg and a metal foil arranged on at least one side surface of the prepreg; or comprises a combination sheet formed by mutually overlapping a plurality of prepregs, and a metal foil arranged on at least one side surface of the combination sheet.
By adopting the technical scheme, the laminated board has the advantages of low thermal expansion coefficient, high glass transition temperature, low dielectric constant and dielectric loss value.
The preparation method of the laminated board comprises the following steps: and coating metal foil on one side or two side surfaces of one prepreg, or laminating at least two prepregs to form a combined sheet, coating metal foil on one side or two side surfaces of the combined sheet, and performing hot press forming to obtain the metal foil laminated plate. Wherein, the pressing conditions of hot pressing are: the pressure is 0.2-2 MPa, the temperature is 150-250 ℃, and the pressing time is 2-4 h.
Preferably, the metal foil is selected from copper foil or aluminum foil. The thickness of the metal foil is 5 μm, 8 μm, 12 μm, 18 μm, 35 μm or 70 μm.
The application also provides an insulating board comprising the resin composition. By adopting the technical scheme, the thermal conductivity and the heat resistance of the insulating plate are obviously improved.
The present application also provides an insulating film comprising a carrier film and the aforementioned resin composition coated thereon. By adopting the technical scheme, the thermal index of the insulating film is obviously improved.
The insulating film is prepared by the following method: the resin composition is dissolved by a solvent to prepare a glue solution, the glue solution is coated on a carrier film, and the carrier film coated with the glue solution is heated and dried to obtain the insulating film.
As an alternative, the solvent is at least one selected from the group consisting of acetone, butanone, methyl isobutyl ketone, N-dimethylformamide, N-dimethylacetamide, ethylene glycol methyl ether, propylene glycol methyl ether, benzene, toluene, xylene, and cyclohexane.
As an alternative, the carrier film is at least one selected from PET film, PP film, PE film, PVC film.
The application also provides a circuit substrate which comprises at least one of the prepregs, the laminated plates, the insulating plates and the insulating films. By adopting the technical scheme, the heat resistance of the circuit substrate is greatly improved.
The application also provides an electronic device, which comprises the circuit substrate. Since the heat resistance of the circuit substrate is greatly improved, the safety of the electronic device is remarkably improved.
The beneficial technical effects of the application are as follows: a resin composition and its use in prepregs, laminates, insulating boards, insulating films, circuit substrates and electronic devices are provided.
Due to the application of the technical scheme, compared with the prior art, the application has the following advantages:
(1) Through the combination of the maleimide resin, the benzoxazine resin containing double bonds and the benzoxazine resin containing triple bonds, the reactivity between the maleimide resin and the benzoxazine resin can be controlled, the crosslinking network density is improved, the production speed of the prepreg is favorably controlled, the prepreg has better apparent quality, and meanwhile, the prepreg has excellent high heat resistance, high modulus, low water absorption, low thermal expansion coefficient and low curing shrinkage rate;
(2) By the prepolymerization reaction between the maleimide resin and the benzoxazine resin containing double bonds and the benzoxazine resin containing triple bonds, the rheological property of the resin composition in the lamination process can be improved, and the glue solution can be well soaked in glass fiber cloth, so that the lamination manufacturability is improved.
Detailed Description
The technical solution of the present application will be further described with reference to the specific embodiments, and the following examples are only illustrative, not limiting, and are not intended to limit the scope of the present application.
An embodiment of the present application provides a resin composition and the use of the resin composition in prepregs, laminates, insulating boards, insulating films, circuit substrates and electronic devices.
First embodiment
The present embodiment provides a resin composition comprising, by solid weight:
benzoxazine resin containing unsaturated bond: 10-70 parts;
maleimide resin: 20-100 parts;
wherein the benzoxazine resin containing unsaturated bonds is a mixture of benzoxazine resin containing double bonds and benzoxazine resin containing triple bonds.
Further, the resin composition further comprises 5 to 45 parts by weight of a benzoxazine resin free of unsaturated bonds.
Preferably, the resin composition comprises, by solid weight:
benzoxazine resin containing double bond: 10-40 parts;
benzoxazine resin containing triple bonds: 3-20 parts;
benzoxazine resin without unsaturated bond: 5-10 parts;
maleimide resin: 40-70 parts.
Further, the benzoxazine resin without unsaturated bond is one or a mixture of at least two of bisphenol A type benzoxazine resin, dicyclopentadiene type benzoxazine resin, bisphenol F type benzoxazine resin, phenolphthalein type benzoxazine resin, MDA type benzoxazine resin, ODA type benzoxazine resin or unsaturated bond end-capped benzoxazine resin.
Preferably, in the benzoxazine resin containing unsaturated bonds, the content of the benzoxazine resin containing triple bonds is 1-70 wt%, and the content of the benzoxazine resin containing double bonds is 30-99 wt%.
Further preferably, the content of the benzoxazine resin containing a triple bond in the benzoxazine resin containing an unsaturated bond is 1%, 3%, 5%, 10%, 15%, 20%, 25%, 30%, 35%, 40%, 45%, 50%, 55%, 60%, 65% or 70%.
Further, the terminal end of the benzoxazine resin containing a triple bond contains a carbon-carbon triple bond.
Optionally, the benzoxazine resin containing a triple bond is one or a mixture of at least two of the following structures:
structural formula (1);
structural formula (2);
structural formula (3);
structural formula (4);
structural formula (5);
structural formula(6)；
Structural formula (7).
Further, in the benzoxazine resin containing a double bond, at least a carbon-carbon double bond is contained in a side chain.
Optionally, the benzoxazine resin containing double bonds is one or a mixture of at least two of the following structures:
structural formula (8); />
A structural formula (9);
a structural formula (10);
a structural formula (11);
wherein R is Or no connecting bond; r is R 0 、R 1 And R is R 2 Identical or different, each independently selected from hydrogen, alkyl or alkenyl, and R 0 、R 1 And R is R 2 At least one of which is an unsaturated group; r is R 4 Is-> Or no connection.
Alternatively, the alkyl group is methyl, ethyl or tert-butyl.
Alternatively, the carbon-carbon double bond is vinyl, allyl, propenyl, methacrylate, acrylate, styryl, phenylallyl or phenylallyl.
Optionally, the maleimide resin is one or a mixture of at least two of the following structures:
a structural formula (12);
a structural formula (13); />
A structural formula (14);
formula (15), wherein R 2 Is hydrogen,
Methyl or ethyl, R 1 Is methylene, ethylene orn is 0 or an integer of 1 to 10;
a structural formula (16);
a structural formula (17), wherein n is an integer of 1 to 10;
a structural formula (18), wherein n is an integer of 1 to 10;
structure (19)Wherein n is an integer of 1 to 10;
a structural formula (20), wherein n is an integer of 1 to 10;
a structural formula (21), wherein n is an integer of 1 to 10;
a structural formula (22), wherein n is an integer of 1 to 10, and m is an integer of 1 to 10;
a structural formula (23), wherein n is an integer of 1 to 10, and m is an integer of 1 to 10;
a structural formula (24), wherein n is an integer of 1 to 10; />
Structural formula (25).
Further preferably, the maleimide resin is an aliphatic long-chain group-containing maleimide resin.
Alternatively, the maleimide resin containing aliphatic long chain groups is selected from the group consisting of BMI-3000, J, BMI-2500, BMI-1500, BMI-689, BMI-1400, BMI-1700, BMI-5000, and BMI-6100 of molecular design company, and SLK-3000, SLK-2600, SLK-2500, SLK-1500, and SLK-6895 of believed chemical.
Further, the resin composition further comprises a thermoplastic elastomer.
In the present embodiment, the thermoplastic elastomer is preferably 1 to 60 parts by weight based on 100 parts by weight of the total resin. The resin herein means a benzoxazine resin containing an unsaturated bond, a maleimide resin or a benzoxazine resin without an unsaturated bond. If the resin composition includes a benzoxazine resin containing unsaturated bonds and a maleimide resin, the total of 100 parts by weight of the resins means that the total of 100 parts by weight of the benzoxazine resin containing unsaturated bonds and the maleimide resin. If the resin composition includes a benzoxazine resin containing unsaturated bonds, a maleimide resin and a benzoxazine resin without unsaturated bonds, the total of the resins is 100 parts by weight, referring to the total of the benzoxazine resin containing unsaturated bonds, the maleimide resin and the benzoxazine resin without unsaturated bonds. The same applies hereinafter.
More preferably, the thermoplastic elastomer is 5 to 30 parts by weight relative to 100 parts by weight of the total resin.
Optionally, the thermoplastic elastomer is at least one of a styrene thermoplastic elastomer, a polybutadiene thermoplastic elastomer, a silicone thermoplastic elastomer, a methacrylate thermoplastic elastomer, or a butyl methacrylate thermoplastic elastomer.
Optionally, the styrenic thermoplastic elastomer is selected from the group consisting of H1041, H1043, H1051, H1052, H1053, H1221, P1500, P2000, M1911 or M1913 of japan chemical, colali 8004, 8006, 8076, 8104, V9827, 2002, 2005, 2006, 2007, 2104, 7125, 4033, 4044, 4055, 4077 or 4099, and usa koteng D1116A, D1118E, D1152E, D1170B, D A, D1171P, D1184A, A1535 or a1536.
Alternatively, the silicone-based thermoplastic elastomer is selected from the group consisting of X-40-2670, R-170S, X-40-2705, X-40-2701, KMP-600, KMP-605, and X-52-7030 of the more chemical, AY-42-119, EP-2600, EP-2601, EP-2720, TMS-2670, EXL-2315, and EXL-2655 of DOW.
Optionally, the methacrylate thermoplastic elastomer is selected from M51, M52, M22 or D51N of the Axma, colali LA-2330, the long-stick SG-P3 series or the long-stick SG-80 series.
Further, the resin composition further includes a flame retardant.
In the present embodiment, the flame retardant is preferably 1 to 50 parts by weight based on 100 parts by weight of the total resin.
Optionally, the flame retardant is at least one of a brominated flame retardant, a phosphorus flame retardant, a nitrogen flame retardant, an organosilicon flame retardant, an organic metal flame retardant and an inorganic flame retardant.
Optionally, the brominated flame retardant is selected from decabromodiphenyl ether, decabromodiphenyl ethane, brominated styrene, or tetrabromophthalic acid amide.
Optionally, the phosphorus-based flame retardant is selected from inorganic phosphorus, condensed phosphate compounds, phosphoric acid compounds, hypophosphorous acid compounds, phosphorus oxide compounds, 9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO), 10- (2, 5-dihydroxyphenyl) -9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO-HQ), 10-phenyl-9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, tris (2, 6-dimethylphenyl) phosphorus,
(m is an integer of 1 to 5),>phosphazenes or modified phosphazenes.
More preferably, the modified phosphazene is a phosphazene containing an unsaturated double bond.
Optionally, the nitrogen-based flame retardant is selected from triazine compounds, cyanuric acid compounds, isocyanic acid compounds, phenothiazine.
Optionally, the silicone flame retardant is selected from silicone oil, silicone rubber, silicone resin.
Optionally, the organometallic flame retardant is selected from ferrocene, acetylacetonate metal complexes, and organometallic carbonyls.
As an alternative, the inorganic flame retardant is selected from aluminum hydroxide, magnesium hydroxide, aluminum oxide, barium oxide.
Further, the resin composition further comprises a catalyst.
In the present embodiment, the catalyst is preferably 0.001 to 5 parts by weight based on 100 parts by weight of the total resin.
Optionally, the catalyst is at least one of imidazole catalyst, pyridine catalyst and organic metal salt catalyst.
Optionally, the catalyst is at least one of 4-dimethylaminopyridine, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, modified imidazole and zinc octoate.
Optionally, the modified imidazole is one or a mixture of at least two of the following structures:
a structural formula (26);
a structural formula (27);
wherein R is 3 、R 4 、R 5 And R is R 6 The same or different, each independently selected from methyl, ethyl or tert-butyl; a is methylene, ethylene,Or an aromatic hydrocarbon group; b is methylene, ethylene,/>
Specifically, modified imidazole of structural formula (26) may be modified imidazole of the trade designation G8009L of first industry, inc; the modified imidazole of the structural formula (27) may be modified imidazole having a name of P200F50, manufactured by JER Co.
Further, the resin composition further comprises a filler.
Preferably, in the present embodiment, the filler is 20 to 200 parts by weight based on 100 parts by weight of the total resin.
Optionally, the filler is at least one of an inorganic filler, an organic filler and a composite filler.
Further preferably, the filler is selected from spherical silica, alumina or aluminum hydroxide, more preferably spherical silica.
Further, the filler is subjected to surface treatment by using a silane coupling agent, wherein the silane coupling agent is at least one of an amino silane coupling agent, a silane coupling agent containing carbon-carbon double bonds or an epoxy silane coupling agent.
Optionally, the silane coupling agent is selected from the following structures:
the application also provides a prepreg which comprises a reinforcing material and the resin composition; the resin composition is wrapped on the reinforcing material.
The preparation method of the prepreg comprises the following steps: dissolving the resin composition with a solvent to prepare a glue solution, coating the glue solution on the reinforcing material by an impregnation method, taking out the impregnated reinforcing material, and baking for 1-15 min at the temperature of 100-180 ℃; and drying to obtain the prepreg.
Optionally, the solvent is at least one selected from acetone, butanone, methyl isobutyl ketone, N-dimethylformamide, N-dimethylacetamide, ethylene glycol methyl ether, propylene glycol methyl ether, benzene, toluene, xylene and cyclohexane.
Optionally, the reinforcing material is selected from at least one of natural fibers, organic synthetic fibers, organic fabrics, and inorganic fabrics.
Preferably, the reinforcing material is glass fiber cloth. The glass fiber cloth is preferably a split cloth or a flat cloth. More preferably, the glass fiber cloth is E glass fiber cloth, S glass fiber cloth or Q glass fiber cloth.
In addition, when the reinforcing material is glass fiber cloth, the glass fiber cloth is chemically treated with a coupling agent. The coupling agent is preferably an epoxy silane coupling agent or an aminosilane coupling agent.
The application also provides a laminated board which comprises a piece of the prepreg and a metal foil arranged on at least one side surface of the prepreg; or comprises a combination sheet formed by mutually overlapping a plurality of prepregs, and a metal foil arranged on at least one side surface of the combination sheet.
By adopting the technical scheme, the laminated board has the advantages of low thermal expansion coefficient, high glass transition temperature, low dielectric constant and dielectric loss value.
The preparation method of the laminated board comprises the following steps: and coating metal foil on one side or two side surfaces of one prepreg, or laminating at least two prepregs to form a combined sheet, coating metal foil on one side or two side surfaces of the combined sheet, and performing hot press forming to obtain the metal foil laminated plate. Wherein, the pressing conditions of hot pressing are: the pressure is 0.2-2 MPa, the temperature is 150-250 ℃, and the pressing time is 2-4 h.
Preferably, the metal foil is selected from copper foil or aluminum foil. The thickness of the metal foil is 5 μm, 8 μm, 12 μm, 18 μm, 35 μm or 70 μm.
The application also provides an insulating board comprising the resin composition.
The present application also provides an insulating film comprising a carrier film and the aforementioned resin composition coated thereon.
The insulating film is prepared by the following method: the resin composition is dissolved by a solvent to prepare a glue solution, the glue solution is coated on a carrier film, and the carrier film coated with the glue solution is heated and dried to obtain the insulating film.
Optionally, the solvent is at least one selected from acetone, butanone, methyl isobutyl ketone, N-dimethylformamide, N-dimethylacetamide, ethylene glycol methyl ether, propylene glycol methyl ether, benzene, toluene, xylene and cyclohexane.
Optionally, the carrier film is at least one selected from a PET film, a PP film, a PE film, and a PVC film.
The application also provides a circuit substrate which comprises at least one of the prepregs, the laminated plates, the insulating plates and the insulating films.
The application also provides an electronic device, which comprises the circuit substrate.
Second embodiment
This second embodiment differs from the first embodiment in that:
the present embodiment provides a resin composition comprising a prepolymer, which is prepared by the following preparation method:
step (1), reacting maleimide resin with benzoxazine resin containing double bonds to obtain an intermediate product;
and (2) adding a benzoxazine resin containing a triple bond into the intermediate product for reaction to prepare the prepolymer.
Further, the reaction conditions in the preparation method of the prepolymer are as follows: the reaction temperature is 60-170 ℃ and the reaction time is 10-120 min.
Further, the reaction temperature of the step (1) is 80-130 ℃, and the reaction temperature of the step (2) is 60-100 ℃.
In an example in which the present embodiment includes a thermoplastic elastomer, the thermoplastic elastomer is 1 to 60 parts by weight based on 100 parts by weight of the prepolymer.
In examples where the present embodiment includes a flame retardant, the flame retardant is 1 to 50 parts by weight per 100 parts by weight of the prepolymer.
In examples where the present embodiment includes a catalyst, the catalyst is present in an amount of 0.001 to 5 parts by weight based on 100 parts by weight of the prepolymer.
In examples where the present embodiment includes a filler, the filler is 20 to 200 parts by weight per 100 parts by weight of the prepolymer.
As a further improvement of the present embodiment, the resin composition further comprises a maleimide resin and an unsaturated bond-containing benzoxazine resin, which is a mixture of a double bond-containing benzoxazine resin and a triple bond-containing benzoxazine resin.
In an example further optimized in this embodiment and further including a resin, in an example including a thermoplastic elastomer, the thermoplastic elastomer content is: 1 to 60 parts by weight per 100 parts by weight of the total of the resin and the prepolymer; in embodiments including a flame retardant, the flame retardant is present in an amount of: 1 to 50 parts by weight per 100 parts by weight of the total of the resin and the prepolymer; in embodiments including a catalyst, the catalyst is present in an amount of: 0.001 to 5 parts by weight per 100 parts by weight of the total of the resin and the prepolymer; in embodiments including a filler, the filler is present in an amount of: 20 to 200 parts by weight based on 100 parts by weight of the total of the resin and the prepolymer.
The second embodiment is identical to the first embodiment except for the differences described above, and will not be described again here.
The technical scheme of the application is further described below by combining specific preparation examples, examples and comparative examples. Of course, these examples are only some, but not all, of the many variations encompassed by the present embodiments.
Preparation example 1
The preparation example discloses a preparation method of prepolymer, which comprises the following steps:
step (1), adding 75g of maleimide resin (bulk BMI-2300), 40g of benzoxazine resin (DFE 148 manufactured by Dongyao) with double bonds in side chains and 80g of acetone into a reaction bottle, stirring and mixing uniformly,
heating to 100 ℃ and then reacting for 40min to obtain an intermediate product;
and (2) adding 10g of benzoxazine resin containing triple bonds of the structural formula (1) into the intermediate product, and reacting for 20min after controlling the reaction temperature to be 80 ℃ to obtain a prepolymer A.
Preparation example 2
The preparation example discloses a preparation method of prepolymer, which comprises the following steps:
step (1), adding 70g of maleimide resin (BMI-2300), 35g of benzoxazine resin (DFE 156, manufactured by DONGYAN) with double bonds at the tail end and 70g of acetone into a reaction bottle, stirring and mixing uniformly,
heating to 100 ℃ and then reacting for 40min to obtain an intermediate product;
and (2) adding 15g of benzoxazine resin containing triple bonds of the structural formula (1) into the intermediate product, and reacting for 20min after controlling the reaction temperature to be 80 ℃ to prepare a prepolymer B.
Comparative preparation example 1
The preparation example discloses a preparation method of prepolymer, which comprises the following steps:
70g of maleimide resin (BMI-2300) was added to the reaction flask, 35g of benzoxazine resin (DFE 156, manufactured by DONGYAN) having a double bond at the end, and 70g of acetone were stirred and mixed uniformly, and the mixture was heated to 100℃and reacted for 50 minutes to obtain prepolymer C.
Comparative preparation example 2
The preparation example discloses a preparation method of prepolymer, which comprises the following steps:
70g of maleimide resin (bulk-formation BMI-2300), 20g of benzoxazine resin containing a triple bond of the structural formula (1) and 70g of acetone are added into a reaction bottle, stirred and mixed uniformly, heated to 80 ℃ and reacted for 40min to prepare a prepolymer D.
Example 1
The embodiment discloses a resin composition which is prepared by mixing the following raw materials: 30g of a benzoxazine resin containing double bonds, 8g of a benzoxazine resin containing triple bonds, 62g of a maleimide resin, 15g of a thermoplastic elastomer, 9g of a flame retardant, 0.1g of a catalyst, 120g of a filler.
Wherein the benzoxazine resin containing double bonds is DFE148 made of east material, the benzoxazine resin containing triple bonds is shown in a structural formula (1), the maleimide resin is BMI-2300 made of large sum chemical, the thermoplastic elastomer is H1052 made of Asahi chemical, the flame retardant is SPV-100 made of Otsuka chemical, the catalyst is 2-ethyl-4-methylimidazole made of Sichuang chemical, and the filler is spherical silica made of brocade.
The present embodiment also discloses a prepreg comprising a glass fiber cloth as a reinforcing material and a resin composition coated on the glass fiber cloth by a dipping method. The glass fiber cloth is a fiber opening cloth, and is pretreated by adopting an epoxy silane coupling agent;
the prepreg is prepared by the following steps:
diluting the resin composition with N, N-dimethylacetamide to obtain a glue solution with a solid content of 60 wt%;
e glass fiber cloth serving as a reinforcing material is pretreated by adopting an epoxy silane coupling agent, then is immersed in the glue solution, is taken out after being immersed, is placed in a blast drying oven at 160 ℃ and is baked for 3-6 min to obtain the prepreg.
The embodiment also discloses a laminated board, which is prepared by the following method:
cutting the prepreg to 300X 300mm, respectively placing an electrolytic copper foil with the thickness of 18 mu m at two sides of the prepreg, stacking to form a certain stack structure, placing the stack structure in a vacuum hot press, and hot-pressing for 4 hours under the conditions of the pressure of 1.5MPa and the temperature of 200 ℃ to obtain the copper-clad laminated board with the thickness of 1 mm.
The embodiment also discloses an insulating board, which comprises the prepreg, and is prepared by adopting a conventional preparation method in the prior art, and the description is omitted herein.
The embodiment also discloses a circuit substrate, which comprises the prepreg, and is prepared by adopting a conventional preparation method in the prior art, and the description is omitted herein.
Example 2
This embodiment is substantially the same as embodiment 1 except that:
in the raw material of the resin composition, the double bond-containing benzoxazine resin was DFE156 made of east material, the amount of the triple bond-containing benzoxazine resin was 10g, the maleimide resin was BMI-3000 made of molecular design company, and the flame retardant was 15g of decabromodiphenylethane.
Example 3
This embodiment is substantially the same as embodiment 1 except that:
the raw material of the resin composition contained 25g of a double bond-containing benzoxazine resin and 5g of an unsaturated bond-free benzoxazine resin as DFE127A made of east material.
Example 4
This embodiment is substantially the same as embodiment 1 except that: the composition of the raw materials of the resin composition is different.
The method comprises the following steps: 100g of prepolymer A, 15g of thermoplastic elastomer, 15g of flame retardant, 0.1g of catalyst and 120g of filler.
Wherein the thermoplastic elastomer is H1052 manufactured by Asahi chemical industry, the flame retardant is decabromodiphenylethane, the catalyst is 2-ethyl-4-methylimidazole manufactured by four-country chemical industry, and the filler is spherical silica manufactured by brocade.
Example 5
This embodiment is substantially the same as embodiment 4 except that: prepolymer B was substituted for prepolymer a.
Example 6
This embodiment is substantially the same as embodiment 1 except that: the composition of the raw materials of the resin composition is different.
The method comprises the following steps: 10g of a benzoxazine resin containing double bonds, 5g of a benzoxazine resin containing triple bonds, 25g of a maleimide resin, 60g of a prepolymer A, 15g of a thermoplastic elastomer, 9g of a flame retardant, 0.1g of a catalyst, 120g of a filler.
Among them, the maleimide resin was BMI-3000 manufactured by molecular design company.
Comparative example 1
The main difference between this comparative example and example 1 is that: the composition of the raw materials of the resin composition is different.
The method comprises the following steps: 38g of benzoxazine resin without unsaturated bonds, 62g of maleimide resin, 15g of thermoplastic elastomer, 9g of flame retardant, 0.1g of catalyst and 120g of filler.
Among them, the benzoxazine resin without unsaturated bonds was DFE127A made of east material.
Comparative example 2
This comparative example is substantially the same as example 4, except that: prepolymer C was used instead of prepolymer A.
Comparative example 3
This comparative example is substantially the same as example 4, except that: prepolymer D was used instead of prepolymer A.
Comparative example 4
The main difference between this comparative example and example 1 is that: the composition of the raw materials of the resin composition is different.
The method comprises the following steps: 40g of a double bond-containing benzoxazine resin, 60g of a maleimide resin, 15g of a thermoplastic elastomer, 15g of a flame retardant, 0.1g of a catalyst, and 120g of a filler.
Wherein, the benzoxazine resin containing double bonds is DFE156 made of east material, the maleimide resin is BMI-3000 made of molecular design company, and the flame retardant is decabromodiphenylethane.
Comparative example 5
The main difference between this comparative example and example 1 is that: the composition of the raw materials of the resin composition is different.
The method comprises the following steps: 38g of a benzoxazine resin containing a triple bond, 62g of a maleimide resin, 15g of a thermoplastic elastomer, 9g of a flame retardant, 0.1g of a catalyst, 120g of a filler.
The copper-clad laminates obtained in examples 1 to 6 and comparative examples 1 to 5 were subjected to performance test, and the test results are shown in Table 1. The performance test method comprises the following steps:
(1) Glass transition temperature (Tg): the test was performed by the method specified by IPC-TM-6502.4.25 using the DMA (thermal mechanical analysis) method, with a heating rate of 10℃per minute.
(2) Water absorption rate: the measurement was carried out according to the method of IPC-TM-6502.6.2.1, specifically: taking 3 samples of electrolytic copper foil with length x width of 10cm x 10cm, thickness of 0.4mm and removal of both sides, drying at 100deg.C for 2 hr, weighing, and recording weight as W 1 Then, the mixture was treated in an autoclave-type autoclave tester at 121℃under 2 atm for 2 hours, and weighed and the weight was recorded as W 2 The water absorption was measured as (W) 2 -W 1 )/W 1 ×100％。
(3) Coefficient of Thermal Expansion (CTE) in the X/Y axis: the temperature rise rate is 10 ℃/min and the test temperature range is 30-100 ℃ by adopting a TMA method and adopting an IPC-TM-650 method for measurement.
(4) Dk (10 GHz): the determination was performed according to the IPC-TM-650 method.
(5) Df (10 GHz): the determination was performed according to the IPC-TM-650 method.
(6) Cure shrinkage: the shrinkage of the cured product before and after the test is carried out in the circulation process of room temperature-260 ℃ to room temperature by adopting a TMA method and an IPC-TM-650 method.
TABLE 1
Wherein, in the appearance of the prepreg, defect-free is expressed as o, resin with slight defect is expressed as delta, and dry flower defect with larger area is expressed as i.
Referring to Table 1, the resin composition of the example of the present application further produced a copper-clad laminate not only excellent in apparent mass but also high in heat resistance, high in modulus, low in water absorption, low in thermal expansion coefficient and low in curing shrinkage, as compared with the comparative example
It should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is for clarity only, and that the skilled artisan should recognize that the embodiments may be combined as appropriate to form other embodiments that will be understood by those skilled in the art.
The above detailed description is merely illustrative of possible embodiments of the present application, which should not be construed as limiting the scope of the application, and all equivalent embodiments or modifications that do not depart from the spirit of the application are intended to be included in the scope of the application.
Claims (10)
1. A resin composition comprising, on a solids weight basis:
benzoxazine resin containing unsaturated bond: 10-70 parts;
maleimide resin: 20-100 parts;
wherein the benzoxazine resin containing unsaturated bonds is a mixture of benzoxazine resin containing double bonds and benzoxazine resin containing triple bonds.
2. A resin composition comprising a prepolymer, said prepolymer being prepared by a process comprising:
step (1), reacting maleimide resin with benzoxazine resin containing double bonds to obtain an intermediate product;
and (2) adding a benzoxazine resin containing a triple bond into the pre-intermediate product for reaction to obtain the prepolymer.
3. The resin composition according to claim 2, further comprising an unsaturated bond-containing benzoxazine resin and a maleimide resin, wherein the unsaturated bond-containing benzoxazine resin is a mixture of a double bond-containing benzoxazine resin and a triple bond-containing benzoxazine resin.
4. The resin composition according to any one of claims 1 to 3, further comprising a benzoxazine resin free of unsaturated bonds.
5. The resin composition according to any one of claims 1 to 3, wherein the content of the benzoxazine resin containing a triple bond is 1 to 70wt% and the content of the benzoxazine resin containing a double bond is 30 to 99wt% in the benzoxazine resin containing an unsaturated bond.
6. The resin composition according to any one of claims 1 to 3, wherein the terminal end of the benzoxazine resin containing a triple bond contains a carbon-carbon triple bond.
7. The resin composition of claim 6, wherein the benzoxazine resin containing a triple bond is one or a mixture of at least two of the following structures:
8. the resin composition according to any one of claims 1 to 3, wherein the benzoxazine resin containing a double bond contains a carbon-carbon double bond at least in a side chain.
9. The resin composition of claim 8, wherein the carbon-carbon double bond is vinyl, allyl, propenyl, methacrylate, acrylate, styryl, phenylallyl, or phenylallyl.
10. Use of the resin composition according to any one of claims 1 to 9 in prepregs, laminates, insulating boards, insulating films, circuit substrates and electronic devices.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310868852.1A CN116925546A (en) | 2023-07-14 | 2023-07-14 | Resin composition and use thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310868852.1A CN116925546A (en) | 2023-07-14 | 2023-07-14 | Resin composition and use thereof |
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