CN116925519A - Low-dielectric high-temperature high-modulus polyphenyl ether composition - Google Patents
Low-dielectric high-temperature high-modulus polyphenyl ether composition Download PDFInfo
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- CN116925519A CN116925519A CN202310772658.3A CN202310772658A CN116925519A CN 116925519 A CN116925519 A CN 116925519A CN 202310772658 A CN202310772658 A CN 202310772658A CN 116925519 A CN116925519 A CN 116925519A
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- parts
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- dielectric
- polyphenyl ether
- temperature high
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- 239000000203 mixture Substances 0.000 title claims abstract description 23
- 229920013636 polyphenyl ether polymer Polymers 0.000 title claims abstract description 21
- 229920006393 polyether sulfone Polymers 0.000 claims abstract description 28
- 239000000463 material Substances 0.000 claims abstract description 16
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 11
- 239000004695 Polyether sulfone Substances 0.000 claims abstract description 10
- 239000011256 inorganic filler Substances 0.000 claims abstract description 6
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 6
- 239000002994 raw material Substances 0.000 claims abstract description 6
- 238000001816 cooling Methods 0.000 claims abstract description 5
- 239000003365 glass fiber Substances 0.000 claims description 13
- 239000002131 composite material Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 229920001955 polyphenylene ether Polymers 0.000 claims description 6
- 229920000147 Styrene maleic anhydride Polymers 0.000 claims description 4
- 230000003014 reinforcing effect Effects 0.000 claims description 3
- PYSRRFNXTXNWCD-UHFFFAOYSA-N 3-(2-phenylethenyl)furan-2,5-dione Chemical compound O=C1OC(=O)C(C=CC=2C=CC=CC=2)=C1 PYSRRFNXTXNWCD-UHFFFAOYSA-N 0.000 claims description 2
- 238000000034 method Methods 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 claims 1
- 239000006082 mold release agent Substances 0.000 claims 1
- 229920000728 polyester Polymers 0.000 claims 1
- 238000001746 injection moulding Methods 0.000 abstract description 4
- 239000004721 Polyphenylene oxide Substances 0.000 description 16
- 230000000052 comparative effect Effects 0.000 description 13
- 238000012360 testing method Methods 0.000 description 8
- 238000002360 preparation method Methods 0.000 description 6
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 4
- 229920012287 polyphenylene sulfone Polymers 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 239000011668 ascorbic acid Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 101100257124 Caenorhabditis elegans sma-10 gene Proteins 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 239000005003 food packaging material Substances 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- 235000021478 household food Nutrition 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a low-dielectric high-temperature high-modulus polyphenyl ether composition, which is prepared by premixing raw materials, extruding the raw materials by a double-screw extruder, air-cooling, granulating to obtain the composition, and performing injection molding to obtain a finished product. The low-dielectric high-temperature high-modulus polyphenyl ether composition comprises the following components in parts by weight: 30-90 parts of polyphenyl ether (PPO); polyether sulfone (PESU), 5-40 parts; 0-40 parts of inorganic filler; 0-15 parts of compatilizer; 0-0.5 parts of release agent; according to the invention, proper polyphenyl ether and polyether sulfone are selected for combination, so that the fluidity and high-temperature high-modulus performance of the obtained material can be greatly improved, and meanwhile, the dielectric performance of the material is better.
Description
Technical Field
The invention relates to the field of polyphenyl ether composite materials and preparation thereof, in particular to a low-dielectric high-temperature high-modulus polyphenyl ether composition and a preparation method thereof.
Background
PPO has excellent mechanical strength, stress relaxation resistance, creep resistance, heat resistance, water resistance, dimensional stability, flame retardancy, and self-extinguishing property. The dielectric constant and dielectric loss of the material are one of the smallest varieties in engineering plastics, are hardly influenced by temperature and humidity, and can be used in the fields of low, medium and high frequency electric fields. The main disadvantages are poor melt fluidity, difficult processing and forming, poor inorganic acid and alkali resistance, aromatic hydrocarbon resistance, halogenated hydrocarbon resistance, oil resistance and other performances.
PESU is widely used in the fields of electronics and electrical industry, automobile industry, medical and health, household food packaging materials and the like because of its excellent mechanical properties, heat resistance, flame retardance, creep resistance, chemical stability, transparency and the like. However, PESU has poor dielectric properties and high water absorption limits the application of PESU in certain fields.
In order to solve the fluidity problem of PPO, authors in the literature of polyphenylene sulfone/polyphenyl ether blend and glass fiber reinforced material preparation and performance research thereof improve fluidity by adding polyphenylene sulfone, but the compatibility of the polyphenylene sulfone and the polyphenyl ether blend is poor, so that the performance is poor, injection molded parts are easy to delaminate, the literature does not mention adding a corresponding compatilizer, and meanwhile, the polyphenylene sulfone has a biphenyl structure, and has strong rigidity and extremely limited fluidity improvement effect. The PESU introduced by the method has no biphenyl structure, can effectively solve the problem of fluidity of PPO by adding a small amount of PESU, and also maintains the high temperature and high modulus of the composition, so that the material still has good rebound resilience at high temperature, and the new application field of the material is expanded.
Disclosure of Invention
The invention discloses a low-dielectric high-temperature high-modulus polyphenyl ether composition, which is prepared by premixing raw materials, extruding the raw materials by a double-screw extruder, air-cooling, granulating to obtain the composition, and performing injection molding to obtain a finished product.
The specific technical scheme is as follows:
the low-dielectric high-temperature high-modulus polyphenyl ether composition comprises the following components in parts by weight:
30-90 parts of polyphenyl ether (PPO)
5-40 parts of Polyethersulfone (PESU)
0-40 parts of inorganic filler
0-15 parts of compatilizer
And 0-0.5 part of release agent.
Preferably, the low-dielectric high-temperature high-modulus polyphenyl ether composition comprises the following raw materials in parts by mass:
30-80 parts of polyphenyl ether (PPO)
10-30 parts of polyether sulfone (PESU)
0-30 parts of inorganic filler
5-15 parts of compatilizer
And 0.1-0.3 part of release agent.
According to the present invention, in order to obtain a better effect of the invention, the following is preferable:
the polyphenyl ether polymer preferably has viscosity number of (30-40) ml/g, and specifically adopts PPO LXR035 of Nantong star.
The polyethersulfone polymer preferably has a melt index of (24-30) g/10min (360 ℃,5 kg), and is specifically PESU E300, which is a Shandong source.
All inorganic fillers are glass fibers subjected to surface treatment, the diameter is 10 mu m, and specifically T435N short fibers of Mount Taishan glass fibers and 309A-3-K/HL short fibers of Chongqing international composite materials are adopted.
The compatilizer is PPO-g-GMA, and the preferable grafting rate is 0.5%, wherein LXR035 is adopted for PPO. The compatilizer can also be styrene maleic anhydride copolymer SMA, and the content of maleic anhydride is 5-22%; or both may be added at the same time.
The release agent is preferably silicone, and particularly morning light GM-100 is adopted.
The invention also discloses a preparation method of the low-dielectric high-temperature high-modulus polyphenyl ether composition composite material, which specifically comprises the following steps: uniformly mixing the dried PPO resin and PESU resin with a certain proportion of compatilizer and release agent in a high-speed stirrer to obtain a premix, adding the premix from a main feed inlet of a double-screw extruder, adding reinforcing components into a side feed inlet according to the proportion, extruding the materials through the double-screw extruder, air-cooling, granulating to obtain a PPO/PESU composite material, and performing injection molding to obtain a finished product.
Compared with the prior art, the invention has the following advantages:
(1) According to the invention, proper polyphenyl ether and polyether sulfone are selected for combination, so that the fluidity and high-temperature high-modulus performance of the obtained material can be greatly improved, and meanwhile, the dielectric performance of the material is better.
(2) The preparation method of the PPO/PESU composite reinforced material is simple, the subsequent mass production is easy to control, and the PPO/PESU composite reinforced material has good economic benefit.
Detailed Description
Examples and comparative examples are further described below in connection with the present invention.
The specific preparation method of the low-dielectric high-temperature high-modulus polyphenyl ether composition composite material comprises the following steps:
uniformly mixing the dried PPO resin and PESU resin with a certain proportion of compatilizer and release agent in a high-speed stirrer to obtain a premix, adding the premix from a main feed inlet of a double-screw extruder, adding reinforcing components in a side feed inlet according to the proportion, extruding the materials through the double-screw extruder, air-cooling and granulating to obtain the PPO/PESU composite material. The temperatures of the zones 1 to 10 of the twin-screw extruder are 330 ℃, 340 ℃ and 340 ℃ respectively 340 c, 330 c, the die temperature was 340 ℃.
The low dielectric high temperature high modulus polyphenylene ether composition composite materials obtained in examples and comparative examples were processed into test bars by an injection molding machine, and subjected to mechanical properties and dielectric property tests. The specific test method is as follows:
tensile properties were tested according to ISO 527-2; bending performance test was performed according to ISO 178; the heat distortion temperature test was performed according to ISO 75-2; the dielectric property test is carried out according to IEC60250, and the test specifically adopts a resonant cavity mode.
The formulations of the comparative examples and examples are shown in Table 1, and the results of the tests of the corresponding mechanical properties and dielectric properties of the comparative examples and examples are shown in Table 2:
table 1, formulation tables of examples and comparative examples, wt%
| Sequence number component | Comparative example 1 | Comparative example 2 | Comparative example 3 | Example 1 | Example 2 | Example 3 | Example 4 | Example 5 | Example 6 |
| PPO LXR035 | 79.8 | 69.8 | 49.8 | 59.8 | 49.8 | 39.8 | 59.8 | 49.8 | 59.8 |
| PESU E300 | 20 | 20 | 20 | 20 | 30 | 20 | 20 | 20 | 20 |
| Compatibilizing agent PPO-g-GMA | 0 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | |
| Compatibilizer SMA | 10 | ||||||||
| Glass fiber T435N | - | - | 20 | 10 | 10 | 30 | - | - | |
| Glass fiber 309A-3-K/HL | - | - | - | - | - | - | 10 | 20 | 10 |
| Release agent GM-100 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 |
Table 2 test results for examples and comparative examples
| Sequence number performance | Comparative example 1 | Comparative example 2 | Comparative example 3 | Example 1 | Example 2 | Example 3 | Example 4 | Example 5 | Example 5 |
| Tensile Strength (MPa) | 70.6 | 73.5 | 110 | 91.2 | 93.5 | 132 | 85.7 | 104 | 94.0 |
| Flexural Strength (23 ℃ C.) (MPa) | 98.4 | 117 | 172 | 135 | 142 | 205 | 131 | 163 | 150 |
| Flexural modulus (23 ℃ C.) (MPa) | 2573 | 2637 | 6628 | 4632 | 4853 | 8556 | 4744 | 6783 | 5310 |
| Flexural Strength (180 ℃ C.) (MPa) | 16.3 | 21.5 | 72.3 | 58.7 | 62.2 | 86.5 | 55.8 | 69.0 | 72.5 |
| Flexural modulus (180 ℃ C.) (MPa) | 1914 | 1993 | 5135 | 3907 | 4103 | 7166 | 4122 | 5212 | 4387 |
| Heat distortion temperature (1.80 MPa) (. Degree.C.) | 185 | 185 | 204 | 201 | 202 | 206 | 201 | 203 | 204 |
| Dielectric constant (10 GHz) | 2.68 | 2.70 | 3.23 | 2.90 | 2.95 | 3.63 | 2.86 | 3.10 | 2.75 |
| Dielectric loss 10 -3 （10GHz） | 3.63 | 3.02 | 5.13 | 4.37 | 4.60 | 5.78 | 4.06 | 4.85 | 3.88 |
From the test results of the examples and the comparative examples, it can be seen that the addition of the compatilizer PPO-g-GM and the SMA can improve the performance to a larger extent, and the dielectric loss is reduced more. The mechanical properties of PESU are better than those of PPO, but the dielectric constant and dielectric loss are higher than those of PPO, so specific application fields need to be considered for the usage amount of PESU. The higher the glass fiber content, the more the tensile strength, flexural modulus and heat distortion temperature of the material are increased, with an concomitant increase in the high temperature modulus of the material. Compared with the common alkali-free glass fiber, the low-dielectric glass fiber has low dielectric constant and dielectric loss, but higher dielectric loss than resin; meanwhile, the bending modulus is higher than that of common alkali-free glass fiber, but the bending strength is slightly lower than that of alkali-free glass fiber, so that the type and the content of the glass fiber are considered in the use environment.
The above examples are only preferred embodiments of the present invention and not limiting thereof, and it should be noted that it will be appreciated by those skilled in the art that various changes and modifications can be made without departing from the scope of the invention as defined in the appended claims.
Claims (5)
1. The low-dielectric high-temperature high-modulus polyphenyl ether composition is characterized by comprising the following raw materials in parts by weight:
30-90 parts of polyphenyl ether (PPO)
5-40 parts of Polyethersulfone (PESU)
0-40 parts of inorganic filler
0-15 parts of compatilizer
And 0-0.5 part of release agent.
2. The low dielectric high temperature high modulus polyphenylene ether composition according to claim 1, wherein the inorganic filler is selected from the group consisting of alkali-free glass fiber and low dielectric glass fiber.
3. The low dielectric temperature high modulus polyphenylene ether composition according to claim 1, wherein the compatibilizing agent is a polyphenylene ether grafted glycidyl methacrylate and/or styrene maleic anhydride copolymer.
4. The low dielectric high temperature high modulus polyphenylene ether composition according to claim 1, wherein the mold release agent is silicone or polyester.
5. The method for preparing a low dielectric high temperature high modulus polyphenylene ether composition according to any one of claims 1 to 4, comprising the steps of: uniformly mixing the dried PPO resin and PESU resin with a certain proportion of compatilizer and release agent in a high-speed stirrer to obtain a premix, adding the premix from a main feed inlet of a double-screw extruder, adding reinforcing components in a side feed inlet according to the proportion, extruding the materials through the double-screw extruder, air-cooling and granulating to obtain the PPO/PESU composite material. The obtained material has the characteristics of low dielectric property, high temperature and high modulus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310772658.3A CN116925519A (en) | 2023-06-28 | 2023-06-28 | Low-dielectric high-temperature high-modulus polyphenyl ether composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310772658.3A CN116925519A (en) | 2023-06-28 | 2023-06-28 | Low-dielectric high-temperature high-modulus polyphenyl ether composition |
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| Publication Number | Publication Date |
|---|---|
| CN116925519A true CN116925519A (en) | 2023-10-24 |
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| CN202310772658.3A Pending CN116925519A (en) | 2023-06-28 | 2023-06-28 | Low-dielectric high-temperature high-modulus polyphenyl ether composition |
Country Status (1)
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| CN (1) | CN116925519A (en) |
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- 2023-06-28 CN CN202310772658.3A patent/CN116925519A/en active Pending
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