CN116924319A

CN116924319A - Sensor packaging structure and forming method thereof

Info

Publication number: CN116924319A
Application number: CN202210365162.XA
Authority: CN
Inventors: 李景明; 马硕
Original assignee: Suzhou In Situ Chip Technology Co ltd
Current assignee: Suzhou In Situ Chip Technology Co ltd
Priority date: 2022-04-07
Filing date: 2022-04-07
Publication date: 2023-10-24

Abstract

The embodiment of the invention provides a sensor packaging structure, which comprises: the sensor assembly comprises a substrate, a groove positioned on the substrate and a chip arranged in the groove, wherein the chip is electrically connected with the substrate through a bonding element; a runner housing positioned above one side of the substrate provided with the chip; the flow passage shell comprises a main flow passage shell, a first flow passage shell and a second flow passage shell, wherein the first flow passage shell and the second flow passage shell are positioned at two sides of the main flow passage shell, a closed cavity is formed between the main flow passage shell and the substrate and used as a main flow passage, a first flow passage is formed in the first flow passage shell and used for guiding liquid to be tested into the main flow passage, a second flow passage is formed in the second flow passage shell and used for guiding the liquid to be tested out of the main flow passage; wherein a window is formed on the main runner housing for exposing the bonding piece when the main runner housing is fixed to the substrate to form a closed cavity.

Description

Sensor packaging structure and forming method thereof

Technical Field

The invention relates to the technical field of sensors, in particular to a sensor packaging structure and a forming method thereof.

Background

The sensor is a device for converting an external physical quantity or chemical quantity signal into a measurable electric signal, and is one of important means for human to acquire information. Micro sensors based on MEMS (micro electro mechanical systems) processing technology are widely applied in fields of automobile electronics, medical equipment, household appliances, environmental monitoring, aerospace and the like by virtue of the advantages which are incomparable with the traditional sensors, such as small volume, low power consumption, quick response and the like.

However, the sensor packaging structure in the related art has the problems of complex packaging structure, complex process, difficult mass production, night leakage, difficult measurement of special liquid and the like. Therefore, how to optimize the sensor packaging structure becomes an important research direction in the sensor technical field.

Disclosure of Invention

Accordingly, embodiments of the present invention provide a sensor package and a method for forming the same to solve at least one of the problems in the prior art.

In order to achieve the above purpose, the technical scheme of the invention is realized as follows:

In the above scheme, the package structure further includes: a window seal positioned within the window to seal the window.

In the above scheme, a first inclined runner is further arranged in the first runner housing, a second inclined runner is further arranged in the second runner housing, the first inclined runner is communicated with the first runner and the main runner, and the second inclined runner is communicated with the second runner and the main runner; the cross-sectional area of the joint of the first inclined flow channel and the first flow channel is larger than that of the joint of the first inclined flow channel and the main flow channel, and the cross-sectional area of the joint of the second inclined flow channel and the second flow channel is larger than that of the joint of the second inclined flow channel and the main flow channel.

In the above scheme, the package structure further includes: a coating layer including a first coating layer covering a substrate plane other than the groove and a second coating layer covering a bottom and a sidewall of the groove; wherein, the orthographic projection of the coating layer on the substrate plane covers the orthographic projection of the main runner on the substrate plane.

In the above scheme, the package structure further includes: a housing seal between the base plate and the flow channel housing such that the sensor assembly and the flow channel housing are bonded to one another to form a closed cavity;

in the above scheme, the method further comprises: and the protective layer wraps the surface of the bonding piece.

In the above aspects, the materials of the coating layer, the protective layer, the housing seal member, and/or the window seal member include biocompatible materials.

In the above scheme, a groove is further formed in the region, which is in contact with the substrate, of the main runner housing, and the extending direction of the groove is the same as the extending direction of the main runner.

The embodiment of the invention also provides a method for forming the sensor packaging structure, which comprises the following steps: providing a sensor assembly, wherein the sensor assembly comprises a substrate, a groove positioned on the substrate and a chip arranged in the groove, and the chip and the substrate are electrically connected through a bonding component; providing a runner housing, wherein the runner housing comprises a main runner housing, a first runner housing and a second runner housing, wherein the first runner housing and the second runner housing are positioned on two sides of the main runner housing, a first runner is formed in the first runner housing, a second runner is formed in the second runner housing, and a window is formed in the main runner housing; the runner shell is fixed on a substrate provided with one side of a chip, the bonding piece is exposed from the window, so that the main runner shell and the substrate form a closed cavity to serve as a main runner, one end of the main runner is communicated with the first runner, the other end of the main runner is communicated with the second runner, the first runner is used for guiding liquid to be tested into the main runner, and the second runner is used for guiding the liquid to be tested out of the main runner.

In the above aspect, before the runner housing is fixed to the side of the substrate provided with the chip, the method further includes: depositing a coating layer above one side of the substrate provided with the groove, wherein the coating layer comprises a first coating layer and a second coating layer, the first coating layer is positioned on the substrate plane outside the groove, and the second coating layer is positioned on the bottom and the side wall of the groove; wherein, the orthographic projection of the coating layer on the substrate plane covers the orthographic projection of the main runner on the substrate plane.

In the above-mentioned scheme, fix the runner shell to the base plate and be equipped with on one side of chip, include: and fixing the runner shell and the substrate by adopting a shell sealing piece, wherein the shell sealing piece is positioned between the substrate and the runner shell, so that the main runner shell and the substrate form a closed cavity structure.

In the above aspect, after the chip and the substrate are electrically connected by the bonding member, before the runner housing is fixed to the side of the substrate provided with the chip, the method further includes: and forming a protective layer on the surface of the bonding piece, wherein the protective layer wraps the surface of the bonding piece.

In the above aspect, after the runner housing is fixed to the side of the substrate provided with the chip, the bonding member is exposed from the window, so that the main runner housing and the substrate form a closed cavity as a main runner, the method further includes: the window is sealed with a window seal. In the above aspects, the materials of the coating layer, the protective layer, the housing seal member, and/or the window seal member include biocompatible materials.

The embodiment of the invention provides a sensor packaging structure, which comprises: the sensor assembly comprises a substrate, a groove positioned on the substrate and a chip arranged in the groove, wherein the chip is electrically connected with the substrate through a bonding element; a runner housing positioned above one side of the substrate provided with the chip; the flow passage shell comprises a main flow passage shell, a first flow passage shell and a second flow passage shell, wherein the first flow passage shell and the second flow passage shell are positioned at two sides of the main flow passage shell, a closed cavity is formed between the main flow passage shell and the substrate and used as a main flow passage, a first flow passage is formed in the first flow passage shell and used for guiding liquid to be tested into the main flow passage, a second flow passage is formed in the second flow passage shell and used for guiding the liquid to be tested out of the main flow passage; wherein a window is formed on the main runner housing for exposing the bonding piece when the main runner housing is fixed to the substrate to form a closed cavity. The window is formed on the main runner housing of the sensor packaging structure and is used for exposing the bonding piece when the runner housing is fixed to the substrate to form a closed cavity, so that the problems of sealing untight, cavity generation, night leakage and the like caused by the resistance of the bonding piece when the runner housing is fixed to the substrate are avoided. In addition, the packaging technology provided by the invention is simple, can realize mass production, and has high processing efficiency and lower cost.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

Fig. 1 is a schematic structural diagram of a sensor package structure according to an embodiment of the present invention;

FIG. 2 is an exploded view of the sensor package structure shown in FIG. 1;

FIG. 3 is a schematic view of the flow channel housing of the sensor package structure shown in FIG. 1;

FIG. 4 is a block diagram of a sensor assembly of the sensor package structure shown in FIG. 1;

FIG. 5 is a cross-sectional view of the sensor package structure shown in FIG. 1;

FIG. 6 is a cross-sectional view of a sensor package structure according to an embodiment of the present invention;

FIG. 7 is a flow chart of a method for forming a sensor package structure according to an embodiment of the present invention;

fig. 8a-8c are schematic structural diagrams of a sensor package structure according to an embodiment of the present invention in a forming process.

Reference numerals:

101-a substrate; 102-chip; 103-a main flow channel housing; 104-grooves; 105-a first inclined flow path; 106-a second inclined flow path; 107-a first flow path housing; 108-a second flow path housing; 109-grooves; 110-a sensor assembly; 111-a runner housing; 201-a first flow channel; 202-a second flow channel; 203-a main runner; 204-window.

Detailed Description

Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the invention are shown in the drawings, it should be understood that the invention may be embodied in various forms and should not be limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the invention may be practiced without one or more of these details. In other instances, well-known features have not been described in detail so as not to obscure the invention; that is, not all features of an actual implementation are described in detail herein, and well-known functions and constructions are not described in detail.

In the drawings, the size of layers, regions, elements and their relative sizes may be exaggerated for clarity. Like numbers refer to like elements throughout.

It will be understood that when an element or layer is referred to as being "on" … …, "" adjacent to "… …," "connected to" or "coupled to" another element or layer, it can be directly on, adjacent to, connected to or coupled to the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on" … …, "" directly adjacent to "… …," "directly connected to" or "directly coupled to" another element or layer, there are no intervening elements or layers present. It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present invention. When a second element, component, region, layer or section is discussed, it does not necessarily mean that the first element, component, region, layer or section is present.

Spatially relative terms, such as "under … …," "under … …," "below," "under … …," "above … …," "above," and the like, may be used herein for ease of description to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use and operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements or features described as "under" or "beneath" other elements would then be oriented "on" the other elements or features. Thus, the exemplary terms "under … …" and "under … …" may include both an upper and a lower orientation. The device may be otherwise oriented (rotated 90 degrees or other orientations) and the spatially relative descriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. As used herein, the term "and/or" includes any and all combinations of the associated listed items.

In medical application, some liquids such as liquid medicine, blood, urine and the like need to be accurately monitored in flow, and an MEMS flow sensor is a relatively effective method. However, the traditional MEMS flow sensor has complex packaging structure, complex process and difficult mass production. In addition, the flow sensor packaging structure of the traditional structure is unstable, and the problems of liquid leakage and the like are easy to generate.

Based on this, the embodiment of the invention provides a sensor package structure, and fig. 1 is a schematic structural diagram of the sensor package structure provided by the embodiment of the invention; FIG. 2 is an exploded view of the sensor package structure shown in FIG. 1; FIG. 3 is a schematic view of the flow channel housing of the sensor package structure shown in FIG. 1;

fig. 4 is a structural view of a sensor assembly of the sensor package structure shown in fig. 1.

Referring to fig. 1-4, the sensor package structure includes: a sensor assembly 110, which includes a substrate 101, a recess 104 on the substrate 101, and a chip 102 disposed in the recess 104, wherein the chip 102 is electrically connected to the substrate 101 through a bonding member (not shown); a flow path housing 111 located above a side of the substrate 101 where the chip 102 is provided; the flow channel housing 111 comprises a main flow channel housing 103, a first flow channel housing 107 and a second flow channel housing 108, wherein the first flow channel housing 107 and the second flow channel housing 108 are positioned on two sides of the main flow channel housing 103, the main flow channel housing 103 and the substrate 101 form a closed cavity as a main flow channel 203, a first flow channel 201 is formed in the first flow channel housing 107, the first flow channel 201 is used for guiding liquid to be tested into the main flow channel 203, a second flow channel 202 is formed in the second flow channel housing 108, and the second flow channel 202 is used for guiding the liquid to be tested out of the main flow channel 203; wherein a window 204 is formed on the main channel housing 103, and the window 204 is used for exposing the bonding piece (not shown in the figure) when the main channel housing 103 is fixed to the substrate 101 to form a closed cavity.

The window is formed on the main runner housing of the sensor packaging structure and is used for exposing the bonding piece when the runner housing is fixed to the substrate to form a closed cavity, so that the problems of sealing untight, cavity generation, night leakage and the like caused by the resistance of the bonding piece when the runner housing is fixed to the substrate are avoided. In addition, the packaging technology provided by the invention is simple, can realize mass production, and has high processing efficiency and lower cost.

Here, the chip 102 may be a sensor chip that satisfies one or more functions of measuring flow, temperature, humidity, bubbles, and the like. The liquid to be detected can be a fluid medium, and the chip is directly immersed in the fluid medium and has good signal sensitivity. Illustratively, during the flow of the fluid medium, the fluid medium may contact the chip, and the sensor chip calculates the corresponding flow rate from the voltage value, the flow rate, etc., obtained by testing the fluid medium with which it is in contact.

In some embodiments, the surface of the chip facing the side of the primary flow channel comprises a coating layer comprising a biocompatible material, which may be gold, titanium, medical alloy, or the like, for example. Specifically, gold can be plated on the surface of the chip facing the main flow channel, gold has biocompatibility, and liquid medicine such as physiological saline can be introduced into the sensor packaging structure, so that medical requirements are met.

The substrate 101 may be a Printed Circuit Board (PCB), and the side of the substrate not provided with a chip may include a circuit interface for connecting an external amplifying circuit, and the circuit interface may be a plug-in connector. Specifically, a female head is arranged on the substrate, a male head is arranged on the external amplifying circuit board, after the male head and the female head are inserted, two corresponding resistors in the sensor chip on the substrate are communicated, and after the power is on, a voltage value is displayed through the amplifying circuit.

Here, the material of the runner housing 111 includes a biocompatible material, for example, PVC, PE, PP, PS, TPU, PEEK, PA, PC, PTFE, PMMA or the like. Thus, the application scene of the sensor packaging structure can be increased.

In some embodiments, the main channel housing 103 may be secured to the substrate 101 by an adhesive means to form a closed cavity, the adhesive glue comprising a biocompatible material, such as silicone, epoxy, or other biocompatible glue.

In some embodiments, the bonding element may be a wire, and the substrate 101 and the chip 102 are electrically connected by the wire. The leads include, but are not limited to, gold wires, copper wires, aluminum wires, or combinations thereof. Wire bonding is preferred for cost effectiveness and flexibility.

In some embodiments, referring to fig. 4, the substrate 101 includes a recess 104, and the chip 102 is fixed in the recess 104, wherein at least a portion of the orthographic projection of the chip 102 on the plane of the substrate 101 overlaps with the orthographic projection of the main channel 203 on the plane of the substrate 101. In one embodiment, the chip 102 is secured within the recess 104 by an adhesive, and the adhesive glue comprises a biocompatible material. In actual operation, the grooves on the substrate are manufactured through multiple machining procedures such as drilling, milling, grinding and the like. The grooves may be rectangular in shape, for example 9.12mm long, 5.52mm wide and 0.6mm deep, and the chip may be sized to fit the sensor chip, for example 50um larger than the chip length and width and 50um deeper than the chip thickness. The conforming dimensions may increase the stability of the chip 102 within the recess 104. The orthographic projection of a part of the chips 102 on the plane of the substrate 101 overlaps with the orthographic projection of the main flow channel 203 on the plane of the substrate 101, and a part of the chips in the orthographic projection overlapping area are used for contacting with a fluid medium, and corresponding flow rates are calculated through voltage values, flow rates and the like obtained through testing the contacted fluid medium. A portion of the die in the orthographic projection non-overlapping region may be used to provide a bond pad for electrical connection to the substrate via the bond.

In some embodiments, the sensor package structure further comprises: the coating layer comprises a first coating layer and a second coating layer, the first coating layer is positioned on the substrate plane outside the groove, and the second coating layer is positioned on the bottom and the side wall of the groove; wherein, the orthographic projection of the coating layer on the substrate plane covers the orthographic projection of the main runner on the substrate plane. Thus, the surface of the substrate, on which the chip is arranged, in contact with the fluid medium, and the bottom and the side walls of the groove are covered with the coating layer. The coating layer comprises a biocompatible material, and the coating layer material can be gold, titanium, medical alloy and other biocompatible materials. Therefore, liquid medicine such as physiological saline can be introduced into the sensor packaging structure, and medical requirements are met.

Fig. 5 shows a cross-sectional view of the sensor package structure shown in fig. 1.

In some embodiments, referring to fig. 5, a first inclined flow channel 105 is further disposed inside the first flow channel housing 107, a second inclined flow channel 106 is further disposed inside the second flow channel housing 108, the first inclined flow channel 105 communicates with the first flow channel 201 and the main flow channel 203, and the second inclined flow channel 106 communicates with the second flow channel 202 and the main flow channel 203; wherein, the cross-sectional area of the junction of the first inclined flow channel 105 and the first flow channel 201 is larger than the cross-sectional area of the junction of the first inclined flow channel 105 and the main flow channel 203, and the cross-sectional area of the junction of the second inclined flow channel 106 and the second flow channel 202 is larger than the cross-sectional area of the junction of the second inclined flow channel 106 and the main flow channel 203. The first inclined flow channel and the second inclined flow channel are arranged, so that the fluid medium can smoothly pass through the surface of the chip in a transition manner, and the unstable flow velocity caused by abrupt shape change is reduced. In actual operation, the first inclined flow channel is inclined from the first flow channel to the main flow channel and is respectively communicated with the first flow channel and the main flow channel; the second inclined flow passage is inclined from the second flow passage to the main flow passage and is respectively communicated with the second flow passage and the main flow passage. The cross sections of the outer parts of the first runner shell and the second runner shell are circular, the cross section of the middle runner shell is semicircular, the middle runner shell and the first runner shell are communicated with the second runner shell to form a straight line, the plane end of the semi-cylindrical structure penetrates through the whole runner, the first runner and the third runner incline towards the main runner, after the main runner shell and the base plate form a closed cavity, the main runner is narrowed, and the main runner shell is in a trapezoid table shape.

In some embodiments, the axes of the first and second flow path housings are collinear. Thus, the manufacturing process of the runner shell can be simplified.

In some embodiments, the first inclined flow channel and/or the second inclined flow channel may also be a spiral channel.

In some embodiments, the sensor package structure further comprises: and the protective layer wraps the surface of the bonding piece. The material of the protective layer comprises a biocompatible material, such as silica gel, epoxy resin or other biocompatible glue. The protective layer wraps the bonding member to prevent flushing of the fluid medium from causing a short circuit. In actual operation, the chip and the substrate can be connected through gold wires, the gold wires are softer and have a certain radian, the substrate and the runner shell can be bonded after the glue is solidified and the glue is protected. Because the chip and the gold thread are on the same side, the gold thread area after glue sealing is raised, and because the glue has slight fluidity and irregularity, a window slightly larger than the gold thread area needs to be reserved on the runner shell, and the gold thread after glue sealing protection is exposed through the window, so that the substrate and the runner shell are tightly adhered together.

In some embodiments, the sensor package structure further comprises: a housing seal between the substrate 101 and the flow channel housing 111 such that the sensor assembly 110 and the flow channel housing 111 form a closed cavity structure. The housing seal may be a biocompatible glue, such as a photo-curable glue, a flexible polymer, etc., and the runner housing 111 may be adhesively secured to the substrate 101 to form a closed cavity therein. The housing seal prevents leakage of the fluid medium as it passes through the flow passage.

In some embodiments, the sensor package structure further comprises: a window seal positioned within the window to seal the window. The material of the window seal comprises a biocompatible material, which may be, for example, silicone or other biocompatible glue. In actual operation, the bonding piece wrapping the protective layer is exposed through the window, and after the runner shell and the substrate are fixed, window sealing piece coating and sealing are needed to be carried out on the window to prevent liquid leakage. The window sealing member is used for sealing the window, so that leakage of fluid medium can be prevented, and invasion of external moisture to the inside of the packaging structure can be prevented.

In some embodiments, the material of the protective layer and the window seal is a biocompatible glue having a viscosity in the range of 1000cps to 40000cps. For example, it may be 13000-25000cps, and in particular, the viscosity of the glue may be 15000cps, 17000cps. In actual operation, both the protective layer and the window seal may be realized by an automatic dispenser. The viscosity is too large, the fluidity is small, the production efficiency is low, and the uniformity of wrapping and sealing is poor; too low viscosity will result in large deformation that will not achieve the wrapping and sealing effect. In actual operation, different dispensing heads can be selected for different types and viscosities of glue, corresponding programs are set on an automatic dispensing machine, and packaging of the bonding piece by the protective layer and sealing of the window by the window sealing piece can be achieved.

Fig. 6 shows a cross-sectional view of a sensor package structure according to an embodiment of the present invention.

In some embodiments, referring to fig. 6, a groove 109 is further provided on the main channel housing 103 in a region contacting the substrate 101, and the extending direction of the groove 109 is the same as the extending direction of the main channel 203. In actual operation, the grooves can be glue drainage grooves, so that excessive overflow of glue into the flow channels can be prevented.

In some embodiments, the material of the coating layer, the protective layer, the housing seal member, and/or the window seal member comprises a biocompatible material. Therefore, the application scene of the sensor packaging structure can be increased, and the requirement standard of special liquid such as liquid medicine, blood and the like can be met. In some embodiments, the biocompatible material may be not only glue, but also solid state paste.

It should be understood that in the sensor package structure provided by the present invention, the area of the substrate 101 is large, and there is enough space for fixing two or more chips 102 in the form of surface mounting. The chip 102 is not just one chip shown in the figure, but may be a plurality of chips. Therefore, the integration level of the packaging structure can be increased, and the increasing demands of clients are met.

The embodiment of the invention also provides a method for forming the sensor packaging structure, as shown in fig. 7, wherein the forming method comprises the following steps:

step 701, providing a sensor assembly, wherein the sensor assembly comprises a substrate, a groove positioned on the substrate and a chip arranged in the groove, and the chip and the substrate are electrically connected through a bonding piece;

step 702, providing a runner housing, wherein the runner housing comprises a main runner housing, a first runner housing and a second runner housing, wherein the first runner housing and the second runner housing are positioned on two sides of the main runner housing, a first runner is formed in the first runner housing, a second runner is formed in the second runner housing, and a window is formed in the main runner housing;

step 703, fixing the runner housing to a side of the substrate, on which the chip is provided, and exposing the bonding piece from the window, so that the main runner housing and the substrate form a closed cavity as a main runner, one end of the main runner is communicated with the first runner, the other end of the main runner is communicated with the second runner, the first runner is used for guiding the liquid to be tested into the main runner, and the second runner is used for guiding the liquid to be tested out of the main runner.

The main runner housing of the sensor packaging structure is provided with a window, and the window is used for exposing the bonding piece when the main runner housing is fixed to the substrate to form a closed cavity. The interconnection of the substrate and the chip can be ensured without influencing the sensor assembly and the runner housing to form a main runner, and the packaging volume is not influenced. The packaging structure has the characteristics of biocompatibility, small volume, accurate flow and the like, is simple to package, can realize mass production, and has low cost.

The following describes in detail the embodiments of the present invention with reference to fig. 8a-8 c.

The method starts in step 701 with providing a sensor assembly 110, as shown in fig. 8a, the sensor assembly 110 comprising a substrate 101, a recess 104 on the substrate 101, and a chip 102 disposed within the recess 104, the substrate 101 and the chip 102 being electrically connected by a bond (not shown).

Here, the chip 102 may be a sensor chip, where the sensor chip is capable of measuring one or more of flow, temperature, humidity, bubbles, etc., and is directly immersed in a fluid medium, and has good signal sensitivity. Illustratively, during the flow of the fluid medium, the fluid medium may contact the chip, and the sensor chip calculates the corresponding flow rate from the voltage value, the flow rate, etc., obtained by testing the fluid medium with which it is in contact.

The substrate 101 may be a Printed Circuit Board (PCB), and the side of the substrate not provided with a chip includes a circuit interface for connecting an external amplifying circuit, and the circuit interface is a plug-in connector. Specifically, a female head is arranged on the substrate, a male head is arranged on the external amplifying circuit board, after the male head and the female head are inserted, two corresponding resistors in the sensor chip on the substrate are communicated, and after the power is on, a voltage value is displayed through the amplifying circuit.

In some embodiments, a sensor assembly is provided, comprising: providing a substrate 101; forming a groove 104 on one side of the substrate 101; providing a chip 102; securing the chip 102 within the recess 104; the chip 102 and the substrate 101 are electrically connected by a bonding member. In one embodiment, the chip 102 is secured within the recess 104 by an adhesive, and the adhesive glue comprises a biocompatible material. In actual operation, the grooves on the substrate are manufactured through multiple machining procedures such as drilling, milling, grinding and the like. The grooves may be rectangular in shape, for example 9.12mm long, 5.52mm wide and 0.6mm deep, and the chip may be sized to fit the sensor chip, for example 50um larger than the chip length and width and 50um deeper than the chip thickness. The conforming dimensions may increase the stability of the chip 102 within the recess 104. The bonding element may be a lead, and the substrate 101 and the chip 102 are electrically connected through the lead. The leads include, but are not limited to, gold wires, copper wires, aluminum wires, or combinations thereof. Wire bonding is preferred for cost effectiveness and flexibility.

In some embodiments, prior to securing the runner housing to the side of the substrate on which the chip is disposed, the method further comprises: depositing a coating layer above one side of the substrate provided with the groove, wherein the coating layer comprises a first coating layer and a second coating layer, the first coating layer is positioned on the substrate plane outside the groove, and the second coating layer is positioned on the bottom and the side wall of the groove; wherein, the orthographic projection of the coating layer on the substrate plane covers the orthographic projection of the main runner on the substrate plane. Thus, the surface of the substrate, on which the chip is arranged, in contact with the fluid medium, and the bottom and the side walls of the groove are covered with the coating layer. The coating layer comprises a biocompatible material, and the coating layer material can be gold, titanium, medical alloy and other biocompatible materials. Therefore, liquid medicine such as physiological saline can be introduced into the sensor packaging structure, and medical requirements are met.

Next, as shown in fig. 8b, step 702 is performed, providing a flow path housing 111, where the flow path housing 111 includes a main flow path housing 103, and a first flow path housing 107 and a second flow path housing 108 located at both sides of the main flow path housing 103, where the first flow path housing 107 has a first flow path 201 (see fig. 3) formed therein, and the second flow path housing 108 has a second flow path 202 (see fig. 3) formed therein, and where the main flow path housing 103 has a window 204 formed therein. Here, the material of the runner housing 111 includes a biocompatible material, for example, PVC, PE, PP, PS, TPU, PEEK, PA, PC, PTFE, PMMA or the like. Thus, the application scene of the sensor packaging structure can be increased.

Finally, as shown in fig. 8c, step 703 is performed, fixing the runner housing 111 to the side of the substrate provided with the chip 102, and exposing the bonding member from the window 204, so that the main runner housing 103 and the substrate 101 form a closed cavity as a main runner 203 (see fig. 3), the first runner 201 (see fig. 3) is used for introducing the liquid to be measured into the main runner 203 (see fig. 3), the second runner housing 108 is internally formed with a second runner 202 (see fig. 3), and the second runner 202 (see fig. 3) is used for guiding the liquid to be measured into the main runner 203 (see fig. 3).

In some embodiments, securing the runner housing to a substrate provided with a side of a chip includes: and fixing the runner shell and the substrate by adopting a shell sealing piece, wherein the shell sealing piece is positioned between the substrate and the runner shell, so that the main runner shell and the substrate form a closed cavity structure. The housing seal may be a biocompatible glue such as silicone, epoxy, photo-curable glue, or flexible polymer, etc., and the main channel housing 103 may be adhesively secured to the substrate 101 to form a closed cavity therein. The housing seal prevents leakage of the fluid medium as it passes through the flow passage. In some embodiments, after electrically connecting the chip and the substrate by a bonding element, before fixing the runner housing to the side of the substrate provided with the chip, the method further comprises: and forming a protective layer on the surface of the bonding piece, wherein the protective layer wraps the surface of the bonding piece. The protective layer wraps the bonding member to prevent flushing of the fluid medium from causing a short circuit.

In some embodiments, after the runner housing is fixed to the substrate provided with the chip side, the bonding member is exposed from the window, so that the main runner housing and the substrate form a closed cavity as a main runner, the method further includes: the window is sealed with a window seal. The window sealing member is used for sealing the window, so that leakage of fluid medium can be prevented, and invasion of external moisture to the inside of the packaging structure can be prevented.

In some embodiments, the materials of the protective layer and the window seal may be biocompatible glue having a viscosity in the range of 1000cps to 40000cps. For example, it may be 13000-25000cps, and in particular, the viscosity of the glue may be 15000cps, 17000cps. In actual operation, both the protective layer and the window seal may be realized by an automatic dispenser. The viscosity is too large, the fluidity is small, the production efficiency is low, and the uniformity of wrapping and sealing is poor; too low viscosity will result in large deformation that will not achieve the wrapping and sealing effect. In actual operation, different dispensing heads can be selected for different types and viscosities of glue, corresponding programs are set on an automatic dispensing machine, and packaging of the bonding piece by the protective layer and sealing of the window by the window sealing piece can be achieved.

In some embodiments, the material of the coating layer, the protective layer, the housing seal member, and/or the window seal member comprises a biocompatible material. Therefore, the application scene of the sensor packaging structure can be increased, and the requirement standard of special liquid such as liquid medicine, blood and the like can be met.

It can be seen that the main runner housing of the sensor package structure provided by the invention is formed with a window for exposing the bonding piece when the main runner housing is fixed to the substrate to form a closed cavity. The interconnection of the substrate and the chip can be ensured without influencing the sensor assembly and the runner housing to form a main runner, and the packaging volume is not influenced. The packaging structure has the characteristics of biocompatibility, small volume, accurate flow and the like, is simple to package, can realize mass production, and has low cost.

It should be noted that a person skilled in the art could make possible variations between the above sequence of steps without departing from the scope of the invention.

The above description is not intended to limit the scope of the invention, but is intended to cover any modifications, equivalents, and improvements within the spirit and principles of the invention.

Claims

1. A sensor package structure, comprising:

the sensor assembly comprises a substrate, a groove positioned on the substrate and a chip arranged in the groove, wherein the chip is electrically connected with the substrate through a bonding element;

a runner housing positioned above a side of the substrate provided with the chip; the flow passage shell comprises a main flow passage shell, a first flow passage shell and a second flow passage shell, wherein the first flow passage shell and the second flow passage shell are positioned at two sides of the main flow passage shell, a closed cavity is formed between the main flow passage shell and the substrate and used as a main flow passage, a first flow passage is formed in the first flow passage shell and used for guiding liquid to be tested into the main flow passage, a second flow passage is formed in the second flow passage shell and used for guiding the liquid to be tested out of the main flow passage; wherein a window is formed on the main runner housing for exposing the bonding piece when the main runner housing is fixed to the substrate to form a closed cavity.

2. The package structure of claim 1, further comprising:

a window seal positioned within the window to seal the window.

3. The package structure of claim 1, wherein,

the first runner shell is internally provided with a first inclined runner, the second runner shell is internally provided with a second inclined runner, the first inclined runner is communicated with the first runner and the main runner, and the second inclined runner is communicated with the second runner and the main runner; wherein, the liquid crystal display device comprises a liquid crystal display device,

the cross-sectional area of the junction of the first inclined flow channel and the first flow channel is larger than that of the junction of the first inclined flow channel and the main flow channel,

the cross-sectional area of the joint of the second inclined flow channel and the second flow channel is larger than that of the joint of the second inclined flow channel and the main flow channel.

4. The package structure of claim 2, further comprising:

a coating layer including a first coating layer covering a substrate plane other than the groove and a second coating layer covering a bottom and a sidewall of the groove; wherein, the liquid crystal display device comprises a liquid crystal display device,

the orthographic projection of the coating layer on the substrate plane covers the orthographic projection of the main runner on the substrate plane.

5. The package structure of claim 4, further comprising:

and the shell sealing piece is positioned between the base plate and the runner shell, so that the base plate and the runner shell are mutually bonded to form a closed cavity.

6. The package structure of claim 5, further comprising:

and the protective layer wraps the surface of the bonding piece.

7. The package structure of claim 6, wherein,

the materials of the coating layer, the protective layer, the housing seal member, and/or the window seal member comprise biocompatible materials.

8. The package structure of claim 6, wherein,

and a groove is further formed in the region, which is in contact with the substrate, of the main runner shell, and the extending direction of the groove is the same as the extending direction of the main runner.

9. A method of forming a sensor package, comprising:

providing a sensor assembly, wherein the sensor assembly comprises a substrate, a groove positioned on the substrate and a chip arranged in the groove, and the chip and the substrate are electrically connected through a bonding component;

providing a runner housing, wherein the runner housing comprises a main runner housing, a first runner housing and a second runner housing, wherein the first runner housing and the second runner housing are positioned on two sides of the main runner housing, a first runner is formed in the first runner housing, a second runner is formed in the second runner housing, and a window is formed in the main runner housing;

the runner shell is fixed on one side of the substrate, provided with the chip, the bonding piece is exposed from the window, so that the main runner shell and the substrate form a closed cavity as a main runner, one end of the main runner is communicated with the first runner, the other end of the main runner is communicated with the second runner, the first runner is used for guiding liquid to be tested into the main runner, and the second runner is used for guiding the liquid to be tested out of the main runner.

10. The forming method according to claim 9, wherein before fixing the flow path housing to the side of the substrate provided with the chip, the method further comprises:

depositing a coating layer above one side of the substrate provided with the groove, wherein the coating layer comprises a first coating layer and a second coating layer, the first coating layer is positioned on the substrate plane outside the groove, and the second coating layer is positioned on the bottom and the side wall of the groove; wherein, the liquid crystal display device comprises a liquid crystal display device,

11. The forming method according to claim 10, wherein fixing the flow path housing to a side of the substrate provided with the chip includes:

and fixing the runner shell and the substrate by adopting a shell sealing piece, wherein the shell sealing piece is positioned between the substrate and the runner shell, so that the main runner shell and the substrate form a closed cavity structure.

12. The forming method according to claim 11, wherein after the chip and the substrate are electrically connected by a bonding member, before the runner housing is fixed to the substrate provided with the chip side, the method further comprises:

and forming a protective layer on the surface of the bonding piece, wherein the protective layer wraps the surface of the bonding piece.

13. The forming method according to claim 12, wherein after fixing the flow path housing to a side of a substrate provided with a chip, the bonding member is exposed from the window so that the main flow path housing and the substrate form a closed cavity as a main flow path, the method further comprises:

the window is sealed with a window seal.

14. The method of forming as claimed in claim 13, wherein,