CN116922805A - Method for producing packaging material - Google Patents
Method for producing packaging material Download PDFInfo
- Publication number
- CN116922805A CN116922805A CN202310900825.8A CN202310900825A CN116922805A CN 116922805 A CN116922805 A CN 116922805A CN 202310900825 A CN202310900825 A CN 202310900825A CN 116922805 A CN116922805 A CN 116922805A
- Authority
- CN
- China
- Prior art keywords
- laminate
- resin film
- electron beam
- metal foil
- forming step
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 108
- 239000005022 packaging material Substances 0.000 title claims abstract description 92
- 229920005989 resin Polymers 0.000 claims abstract description 208
- 239000011347 resin Substances 0.000 claims abstract description 208
- 239000011888 foil Substances 0.000 claims abstract description 157
- 229910052751 metal Inorganic materials 0.000 claims abstract description 123
- 239000002184 metal Substances 0.000 claims abstract description 123
- 238000010894 electron beam technology Methods 0.000 claims abstract description 121
- 239000011342 resin composition Substances 0.000 claims abstract description 109
- 238000000034 method Methods 0.000 claims abstract description 60
- 238000001125 extrusion Methods 0.000 claims abstract description 43
- 230000001678 irradiating effect Effects 0.000 claims abstract description 26
- 229920006015 heat resistant resin Polymers 0.000 claims description 25
- 238000010030 laminating Methods 0.000 claims description 17
- 229920005672 polyolefin resin Polymers 0.000 claims description 16
- 238000001227 electron beam curing Methods 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 223
- -1 polybutylene terephthalate Polymers 0.000 description 42
- 239000000463 material Substances 0.000 description 39
- 238000003860 storage Methods 0.000 description 36
- 229910052782 aluminium Inorganic materials 0.000 description 34
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 34
- 238000000465 moulding Methods 0.000 description 26
- 239000000126 substance Substances 0.000 description 25
- 239000012790 adhesive layer Substances 0.000 description 23
- 238000003475 lamination Methods 0.000 description 23
- 238000006243 chemical reaction Methods 0.000 description 21
- 238000007789 sealing Methods 0.000 description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 20
- 239000004743 Polypropylene Substances 0.000 description 15
- 229920001155 polypropylene Polymers 0.000 description 15
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 12
- 239000000853 adhesive Substances 0.000 description 12
- 230000001070 adhesive effect Effects 0.000 description 12
- 230000032798 delamination Effects 0.000 description 11
- 239000000178 monomer Substances 0.000 description 11
- 229920006284 nylon film Polymers 0.000 description 10
- 238000013007 heat curing Methods 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 7
- 229910001416 lithium ion Inorganic materials 0.000 description 7
- 239000003505 polymerization initiator Substances 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 239000004698 Polyethylene Substances 0.000 description 6
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 6
- 238000001816 cooling Methods 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 6
- 150000003839 salts Chemical class 0.000 description 6
- 150000008065 acid anhydrides Chemical class 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 229920000573 polyethylene Polymers 0.000 description 5
- 239000006087 Silane Coupling Agent Substances 0.000 description 4
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 238000010538 cationic polymerization reaction Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 238000010924 continuous production Methods 0.000 description 4
- 150000002222 fluorine compounds Chemical class 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- LWNGJAHMBMVCJR-UHFFFAOYSA-N (2,3,4,5,6-pentafluorophenoxy)boronic acid Chemical compound OB(O)OC1=C(F)C(F)=C(F)C(F)=C1F LWNGJAHMBMVCJR-UHFFFAOYSA-N 0.000 description 3
- VUIWJRYTWUGOOF-UHFFFAOYSA-N 2-ethenoxyethanol Chemical compound OCCOC=C VUIWJRYTWUGOOF-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 229920001661 Chitosan Polymers 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 3
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 3
- 125000002091 cationic group Chemical group 0.000 description 3
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 3
- 238000007739 conversion coating Methods 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N desyl alcohol Natural products C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 3
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- 229920013716 polyethylene resin Polymers 0.000 description 3
- 239000007870 radical polymerization initiator Substances 0.000 description 3
- 238000010526 radical polymerization reaction Methods 0.000 description 3
- WULAHPYSGCVQHM-UHFFFAOYSA-N 2-(2-ethenoxyethoxy)ethanol Chemical compound OCCOCCOC=C WULAHPYSGCVQHM-UHFFFAOYSA-N 0.000 description 2
- QLZJUIZVJLSNDD-UHFFFAOYSA-N 2-(2-methylidenebutanoyloxy)ethyl 2-methylidenebutanoate Chemical compound CCC(=C)C(=O)OCCOC(=O)C(=C)CC QLZJUIZVJLSNDD-UHFFFAOYSA-N 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- HMBNQNDUEFFFNZ-UHFFFAOYSA-N 4-ethenoxybutan-1-ol Chemical compound OCCCCOC=C HMBNQNDUEFFFNZ-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- BFGKITSFLPAWGI-UHFFFAOYSA-N chromium(3+) Chemical class [Cr+3] BFGKITSFLPAWGI-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 239000003814 drug Substances 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 2
- 239000005042 ethylene-ethyl acrylate Substances 0.000 description 2
- 229920006225 ethylene-methyl acrylate Polymers 0.000 description 2
- 239000005043 ethylene-methyl acrylate Substances 0.000 description 2
- 238000007667 floating Methods 0.000 description 2
- 235000013305 food Nutrition 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- 238000009998 heat setting Methods 0.000 description 2
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical class I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- RMVRSNDYEFQCLF-UHFFFAOYSA-O phenylsulfanium Chemical compound [SH2+]C1=CC=CC=C1 RMVRSNDYEFQCLF-UHFFFAOYSA-O 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000010248 power generation Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- LFRDHGNFBLIJIY-UHFFFAOYSA-N trimethoxy(prop-2-enyl)silane Chemical compound CO[Si](OC)(OC)CC=C LFRDHGNFBLIJIY-UHFFFAOYSA-N 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical compound C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 description 1
- KNDQHSIWLOJIGP-UMRXKNAASA-N (3ar,4s,7r,7as)-rel-3a,4,7,7a-tetrahydro-4,7-methanoisobenzofuran-1,3-dione Chemical compound O=C1OC(=O)[C@@H]2[C@H]1[C@]1([H])C=C[C@@]2([H])C1 KNDQHSIWLOJIGP-UMRXKNAASA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- DZZAHLOABNWIFA-UHFFFAOYSA-N 2-butoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCCCC)C(=O)C1=CC=CC=C1 DZZAHLOABNWIFA-UHFFFAOYSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 235000018453 Curcuma amada Nutrition 0.000 description 1
- 241001512940 Curcuma amada Species 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical class Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-N Hydrogen bromide Chemical class Br CPELXLSAUQHCOX-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-O N-dimethylethanolamine Chemical compound C[NH+](C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-O 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000012954 diazonium Substances 0.000 description 1
- 150000001989 diazonium salts Chemical class 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- OZLBDYMWFAHSOQ-UHFFFAOYSA-N diphenyliodanium Chemical compound C=1C=CC=CC=1[I+]C1=CC=CC=C1 OZLBDYMWFAHSOQ-UHFFFAOYSA-N 0.000 description 1
- LTYMSROWYAPPGB-UHFFFAOYSA-O diphenylsulfanium Chemical compound C=1C=CC=CC=1[SH+]C1=CC=CC=C1 LTYMSROWYAPPGB-UHFFFAOYSA-O 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- VKLYZBPBDRELST-UHFFFAOYSA-N ethene;methyl 2-methylprop-2-enoate Chemical compound C=C.COC(=O)C(C)=C VKLYZBPBDRELST-UHFFFAOYSA-N 0.000 description 1
- HGVPOWOAHALJHA-UHFFFAOYSA-N ethene;methyl prop-2-enoate Chemical compound C=C.COC(=O)C=C HGVPOWOAHALJHA-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 229920005674 ethylene-propylene random copolymer Polymers 0.000 description 1
- 230000005251 gamma ray Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- DAZXVJBJRMWXJP-UHFFFAOYSA-N n,n-dimethylethylamine Chemical compound CCN(C)C DAZXVJBJRMWXJP-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 125000005440 p-toluyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1C(*)=O)C([H])([H])[H] 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical compound C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 description 1
- 239000012953 triphenylsulfonium Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0866—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using particle radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/10—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation for articles of indefinite length
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C69/00—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D65/00—Wrappers or flexible covers; Packaging materials of special type or form
- B65D65/38—Packaging materials of special type or form
- B65D65/40—Applications of laminates for particular packaging purposes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
- H01G11/04—Hybrid capacitors
- H01G11/06—Hybrid capacitors with one of the electrodes allowing ions to be reversibly doped thereinto, e.g. lithium ion capacitors [LIC]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0866—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using particle radiation
- B29C2035/0877—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using particle radiation using electron radiation, e.g. beta-rays
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/10—Batteries
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/16—Capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
- H01G11/78—Cases; Housings; Encapsulations; Mountings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/10—Primary casings; Jackets or wrappings
- H01M50/102—Primary casings; Jackets or wrappings characterised by their shape or physical structure
- H01M50/103—Primary casings; Jackets or wrappings characterised by their shape or physical structure prismatic or rectangular
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Thermal Sciences (AREA)
- Physics & Mathematics (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Mechanical Engineering (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Wrappers (AREA)
- Electric Double-Layer Capacitors Or The Like (AREA)
- Sealing Battery Cases Or Jackets (AREA)
Abstract
The application provides a method for manufacturing a packaging material, which can greatly shorten the lead time, improve the productivity and ensure excellent formability. The manufacturing method comprises the following steps: an inner layer forming step of adhering the heat-fusible resin film 3 to one surface of the metal foil 4 via the extrusion molten resin film 47 extruded from the extruder 40 to obtain a first laminate 48; and an outer layer forming step of adhering the resin film 2 for a base layer to the other surface of the metal foil 4 of the first laminate 48 via the resin composition 44 for an electron beam curing to obtain a second laminate 49, and then irradiating the second laminate 49 with an electron beam 46 from the resin film side for a base layer.
Description
The application is a divisional application of the application patent application with international application number of PCT/JP2017/025289, national application number of 201780057408.4, application date of 2017, 7 and 11, and the name of the application of "manufacturing method of packaging material".
Technical Field
The present application relates to a method for producing a packaging material usable as a packaging material comprising: external packaging materials (packaging materials) for power storage devices such as batteries and capacitors used in portable electronic devices such as smart phones and tablet personal computers, and batteries and capacitors used in hybrid vehicles, electric vehicles, wind power generation, solar power generation, and nighttime power storage; and, packaging materials for food; packaging material for pharmaceuticals; etc.
Background
Lithium ion secondary batteries are widely used as power sources for, for example, notebook computers, video cameras, cellular phones, electric vehicles, and the like. As the lithium ion secondary battery, a battery having a structure in which a case surrounds a battery body (a body including a positive electrode, a negative electrode, and an electrolyte) is used. As the material (outer packaging material) for the case, a structure is known in which an outer layer formed of a heat-resistant resin film, an aluminum foil layer, and an inner layer formed of a thermoplastic resin film are bonded and integrated in this order
For example, battery exterior materials having the following structures are known: a base material layer (outer layer), a first adhesive layer, a metal foil layer, a second adhesive layer, and a sealing layer (inner layer) are laminated in this order, and the first adhesive layer and the second adhesive layer are each formed by heat curing (heat curing) (see patent document 1).
Prior art literature
Patent literature
Patent document 1: japanese patent application laid-open No. 2015-144122
Disclosure of Invention
Problems to be solved by the invention
In order to form the first and second adhesive layers by the heat curing, it is necessary to apply the adhesive and then heat cure the adhesive at 40 ℃ for 5 days or 10 days (paragraph 0097 of patent document 1).
As described above, since the heat curing treatment is required for at least 5 days or more, there is a problem that a lead time (time required from the time when the material is put into the product to the time when the product is completed) is considerably long, that is, a problem that the productivity is poor.
The present invention has been made in view of the above-described technical background, and an object of the present invention is to provide a method for producing a packaging material, which can greatly shorten the lead time, improve productivity, and ensure excellent moldability.
Means for solving the problems
In order to achieve the above object, the present invention provides the following means.
[1] The method for manufacturing the packaging material is characterized by comprising the following steps:
an inner layer forming step of adhering a heat-fusible resin film to one surface of a metal foil via an extrusion molten resin film extruded from an extruder to obtain a first laminate; and
and an outer layer forming step of adhering a resin film for a base layer to the other surface of the metal foil of the first laminate via an electron beam-curable resin composition to obtain a second laminate, and irradiating the second laminate with electron beams from the resin film side for the base layer.
[2] The method for manufacturing the packaging material is characterized by comprising the following steps:
An inner layer forming step of laminating an extrusion molten resin film extruded from an extruder on one surface of a metal foil to form a heat-fusible resin layer on the one surface of the metal foil, thereby obtaining a first laminate; and
and an outer layer forming step of adhering a resin film for a base layer to the other surface of the metal foil of the first laminate via an electron beam-curable resin composition to obtain a second laminate, and irradiating the second laminate with electron beams from the resin film side for the base layer.
[3] The method for manufacturing the packaging material is characterized by comprising the following steps:
an outer layer forming step of adhering a resin film for a base layer to one surface of a metal foil via an electron beam curable resin composition to obtain a first laminate, and then irradiating the first laminate with an electron beam from the resin film side for the base layer; and
and an inner layer forming step of adhering the heat-fusible resin film to the other surface of the metal foil of the first laminate after the electron beam irradiation, via an extrusion molten resin film extruded from an extruder.
[4] The method for manufacturing the packaging material is characterized by comprising the following steps:
An outer layer forming step of adhering a resin film for a base layer to one surface of a metal foil via an electron beam curable resin composition to obtain a first laminate, and then irradiating the first laminate with an electron beam from the resin film side for the base layer; and
and an inner layer forming step of forming a heat-fusible resin layer on the other surface of the metal foil layer by laminating an extruded molten resin film extruded from an extruder on the other surface of the metal foil of the first laminate after the electron beam irradiation.
[5] The method for manufacturing the packaging material is characterized by comprising the following steps:
an inner layer forming step of adhering a heat-fusible resin film to one surface of a metal foil via an extrusion molten resin film extruded from an extruder to obtain a first laminate; and
and an outer layer forming step of applying an electron beam curable resin composition to the other surface of the metal foil of the first laminate to obtain a second laminate, and then irradiating the second laminate with an electron beam from the electron beam curable resin composition side.
[6] The method for manufacturing the packaging material is characterized by comprising the following steps:
An inner layer forming step of laminating an extrusion molten resin film extruded from an extruder on one surface of a metal foil to form a heat-fusible resin layer on the one surface of the metal foil, thereby obtaining a first laminate; and
and an outer layer forming step of applying an electron beam curable resin composition to the other surface of the metal foil of the first laminate to obtain a second laminate, and then irradiating the second laminate with an electron beam from the electron beam curable resin composition side.
[7] The method for manufacturing the packaging material is characterized by comprising the following steps:
an outer layer forming step of applying an electron beam-curable resin composition to one surface of a metal foil to obtain a first laminate, and then irradiating the first laminate with an electron beam from the electron beam-curable resin composition side; and
and an inner layer forming step of adhering the heat-fusible resin film to the other surface of the metal foil of the first laminate after the electron beam irradiation, via an extrusion molten resin film extruded from an extruder.
[8] The method for manufacturing the packaging material is characterized by comprising the following steps:
An outer layer forming step of applying an electron beam-curable resin composition to one surface of a metal foil to obtain a first laminate, and then irradiating the first laminate with an electron beam from the electron beam-curable resin composition side; and
and an inner layer forming step of forming a heat-fusible resin layer on the other surface of the metal foil layer by laminating an extruded molten resin film extruded from an extruder on the other surface of the metal foil of the first laminate after the electron beam irradiation.
[9] The method for producing a packaging material according to any one of the preceding items 1, 2, 5, and 6, wherein the inner layer forming step and the outer layer forming step are performed continuously.
[10] The method for producing a packaging material according to any one of the above items 1 to 4, wherein a heat-resistant resin film having a hot water shrinkage of 1.5% to 12% is used as the resin film for a base layer.
[11] The method for producing a packaging material according to any one of the above 1 to 10, wherein the extrusion molten resin film is an extrusion molten acid-modified polyolefin resin film.
ADVANTAGEOUS EFFECTS OF INVENTION
In the inventions of [1] to [8], since "adhesion by electron beam curing of an electron beam curable resin composition or formation of a base material layer by electron beam curing of an electron beam curable resin composition" and "adhesion by an extrusion molten resin film or formation of a heat-fusible resin layer by an extrusion molten resin film" can be significantly performed in a short time as compared with curing of a heat-curable resin requiring several days of heat curing, which is not using a heat-curable resin requiring several days of heat curing, for example, the lead time (time required from material input to completion of a product) can be significantly shortened, and cost reduction can be achieved. In addition, since the electron beam curable resin composition and the extruded molten resin film do not need to contain a solvent, the composition can be free of a solvent, and thus has an advantage that the composition can be completed with a small environmental load. In addition, since the thermosetting resin is not used, a drying furnace is not required, and thus the manufacturing equipment can be miniaturized. In addition, even when the obtained packaging material is molded deep by cold (normal temperature) molding such as deep drawing molding or bulging molding, pinholes and cracks do not occur, and excellent moldability can be ensured.
In the invention of item [9], since the inner layer forming step and the outer layer forming step are continuously performed, the productivity can be improved. In this way, since the inner layer forming step is performed before the outer layer forming step when the inner layer forming step and the outer layer forming step are continuously performed (since the inner layer is formed first and then the outer layer forming step is performed by irradiation with electron beam), there is an advantage that curling phenomenon is less likely to occur in the packaging material.
In the invention of [10], since the heat-resistant resin film having a hot water shrinkage of 1.5% to 12% is used as the resin film for the base layer, delamination (peeling) between the outer layer (base layer) and the metal foil layer can be sufficiently prevented even when molding is performed to a deep molding depth or when used in a severe environment such as high temperature and high humidity.
In the invention of item [11], since the extrusion molten resin film is an extrusion molten acid-modified polyolefin resin film, the adhesive strength between the metal foil layer and the heat-fusible resin layer can be improved.
Drawings
Fig. 1 is a schematic side view showing an example of a first manufacturing method according to the present invention.
Fig. 2 is a cross-sectional view showing an embodiment of a packaging material obtained by the first or second manufacturing method according to the present invention.
Fig. 3 is a cross-sectional view showing an embodiment of a packaging material obtained by the third or fourth manufacturing method according to the present invention.
Fig. 4 is a cross-sectional view showing an embodiment of a packaging material obtained by the fifth or sixth manufacturing method according to the present invention.
Fig. 5 is a cross-sectional view showing an embodiment of a packaging material obtained by the seventh or eighth manufacturing method according to the present invention.
Fig. 6 is a cross-sectional view showing an embodiment of the power storage device according to the present invention.
Fig. 7 is a perspective view showing a packaging material (planar shape), a power storage device main body portion, and a molded case (molded body molded into a three-dimensional shape) constituting the power storage device of fig. 6 in a separated state before heat sealing.
Detailed Description
A method of manufacturing a packaging material according to the present invention will be described. The production method of the present invention includes the following first to eighth production methods.
(first manufacturing method)
The method is characterized by comprising the following steps: an inner layer forming step of adhering the heat-fusible resin film 3 to one surface of the metal foil 4 via the extrusion molten resin film 47 extruded from the extruder 40 to obtain a first laminate 48; and an outer layer forming step of adhering the resin film 2 for a base layer to the other surface of the metal foil 4 of the first laminate 48 via the electron beam curable resin composition 44 to obtain a second laminate 49, and then irradiating the second laminate 49 with an electron beam 46 from the side of the resin film 2 for a base layer (see fig. 1). By this first manufacturing method, the packaging material 1 having the structure shown in fig. 2 is obtained.
(second manufacturing method)
The second manufacturing method is a manufacturing method in which the order of execution of the inner layer forming step and the outer layer forming step in the first manufacturing method is reversed. That is, the second manufacturing method is characterized by comprising the steps of: an outer layer forming step of adhering a resin film 2 for a base layer to one surface of a metal foil 4 via an electron beam curable resin composition to obtain a first laminate, and then irradiating the first laminate with an electron beam from the side of the resin film 2 for a base layer; and an inner layer forming step of adhering the heat-fusible resin film 3 to the other surface of the metal foil 4 of the first laminate after the electron beam irradiation via an extruded molten resin film extruded from an extruder. By this second manufacturing method, the packaging material 1 having the structure shown in fig. 2 is obtained.
The packaging material 1 shown in fig. 2 has the following structure: a base layer (outer layer) 2 including the resin film for a base layer is laminated and integrated on one surface (upper surface) of the metal foil layer 4 via an outer adhesive layer (first adhesive layer) 5 including a cured film of an electron beam curable resin composition, and a heat-fusible resin layer (inner layer) 3 is laminated and integrated on the other surface (lower surface) of the metal foil layer 4 via an inner adhesive layer (second adhesive layer) 6 including an extruded resin film 47.
(third manufacturing method)
The method is characterized by comprising the following steps: an inner layer forming step of laminating an extrusion molten resin film extruded from an extruder on one surface of a metal foil 4 to form a heat-fusible resin layer 3 on one surface of the metal foil 4, thereby obtaining a first laminate; and an outer layer forming step of adhering the resin film 2 for a base layer to the other surface of the metal foil 4 of the first laminate via the electron beam curable resin composition to obtain a second laminate, and then irradiating the second laminate with electron beams from the side of the resin film 2 for a base layer. By this third manufacturing method, the packaging material 1 having the structure shown in fig. 3 is obtained.
In the third manufacturing method, when the heat-fusible resin layer 3 is formed on one surface of the metal foil 4 by laminating the extrusion-melted resin film extruded from the extruder on one surface of the metal foil 4, 1 layer of extrusion-melted resin film extruded from 1 extruder may be laminated on one surface of the metal foil 4 (single lamination method), or a plurality of layers of extrusion-melted resin films extruded from a plurality of extruders may be laminated on one surface of the metal foil 4 (tandem lamination method).
(fourth manufacturing method)
The third manufacturing method is a fourth manufacturing method in which the order of execution of the inner layer forming step and the outer layer forming step is reversed. That is, the fourth manufacturing method is characterized by comprising the steps of: an outer layer forming step of adhering a resin film 2 for a base layer to one surface of a metal foil 4 via an electron beam curable resin composition to obtain a first laminate, and then irradiating the first laminate with an electron beam from the side of the resin film 2 for a base layer; and an inner layer forming step of forming a heat-fusible resin layer 3 on the other surface of the metal foil 4 by laminating an extruded molten resin film extruded from an extruder on the other surface of the metal foil 4 of the first laminate after the electron beam irradiation. By this fourth manufacturing method, the packaging material 1 having the structure shown in fig. 3 is obtained.
In the fourth manufacturing method, when the heat-fusible resin layer 3 is formed on the other surface of the metal foil 4 by laminating the extrusion-melted resin film extruded from the extruder on the other surface of the metal foil 4 of the first laminate after the electron beam irradiation, 1 layer of extrusion-melted resin film extruded from 1 extruder may be laminated on the other surface of the metal foil 4 (single lamination method), or a plurality of layers of extrusion-melted resin films extruded from a plurality of extruders may be laminated on the other surface of the metal foil 4 (tandem lamination method).
The packaging material 1 shown in fig. 3 has the following structure: a base layer (outer layer) 2 including a resin film for a base layer is laminated and integrated on one surface (upper surface) of the metal foil layer 4 via an outer adhesive layer (first adhesive layer) 5 including a cured film of an electron beam curable resin composition, and a heat-fusible resin layer (inner layer) 3 including an extruded resin film 47 is laminated and integrated on the other surface (lower surface) of the metal foil layer 4.
(fifth manufacturing method)
The method is characterized by comprising the following steps: an inner layer forming step of adhering the heat-fusible resin film 3 to one surface of the metal foil 4 via an extrusion molten resin film extruded from an extruder to obtain a first laminate; and an outer layer forming step of applying an electron beam-curable resin composition to the other surface of the metal foil 4 of the first laminate to obtain a second laminate, and then irradiating the second laminate with an electron beam from the electron beam-curable resin composition side. By this fifth manufacturing method, the packaging material 1 having the structure shown in fig. 4 is obtained.
(sixth manufacturing method)
The sixth manufacturing method is a manufacturing method in which the order of execution of the inner layer forming step and the outer layer forming step in the fifth manufacturing method is reversed. That is, the sixth manufacturing method is characterized by comprising the steps of: an outer layer forming step of applying an electron beam curable resin composition to one surface of the metal foil 4 to obtain a first laminate, and then irradiating the first laminate with an electron beam from the electron beam curable resin composition side; and an inner layer forming step of adhering the heat-fusible resin film 3 to the other surface of the metal foil 4 of the first laminate after the electron beam irradiation via an extruded molten resin film extruded from an extruder. By this sixth manufacturing method, the packaging material 1 having the structure shown in fig. 4 is obtained.
The packaging material 1 shown in fig. 4 has the following structure: a base layer (outer layer) 2 having a cured film containing an electron beam curable resin composition laminated and integrated on one surface (upper surface) of the metal foil layer 4, and a heat-fusible resin layer (inner layer) 3 having a heat-fusible resin film laminated and integrated on the other surface (lower surface) of the metal foil layer 4 via an inner adhesive layer (second adhesive layer) 6 having an extruded resin film 47.
(seventh manufacturing method)
The method is characterized by comprising the following steps: an inner layer forming step of laminating an extrusion molten resin film extruded from an extruder on one surface of a metal foil 4 to form a heat-fusible resin layer 3 on the one surface of the metal foil, thereby obtaining a first laminate; and an outer layer forming step of applying an electron beam-curable resin composition to the other surface of the metal foil 4 of the first laminate to obtain a second laminate, and then irradiating the second laminate with an electron beam from the electron beam-curable resin composition side. By this seventh manufacturing method, the packaging material 1 having the structure shown in fig. 5 is obtained.
In the seventh manufacturing method, when the heat-fusible resin layer 3 is formed on one surface of the metal foil 4 by laminating the extrusion-melted resin film extruded from the extruder on one surface of the metal foil 4, 1 layer of extrusion-melted resin film extruded from 1 extruder may be laminated on one surface of the metal foil 4 (single lamination method), or a plurality of layers of extrusion-melted resin films extruded from a plurality of extruders may be laminated on one surface of the metal foil 4 (tandem lamination method).
(eighth manufacturing method)
The seventh manufacturing method is an eighth manufacturing method in which the order of execution of the inner layer forming step and the outer layer forming step is reversed. That is, the eighth manufacturing method is characterized by comprising the steps of: an outer layer forming step of applying an electron beam curable resin composition to one surface of the metal foil 4 to obtain a first laminate, and then irradiating the first laminate with an electron beam from the electron beam curable resin composition side; and an inner layer forming step of forming a heat-fusible resin layer on the other surface of the metal foil 4 by laminating an extruded molten resin film extruded from an extruder on the other surface of the metal foil 4 of the first laminate after the electron beam irradiation. By this eighth manufacturing method, the packaging material 1 having the structure shown in fig. 5 is obtained.
In the eighth production method, when the heat-fusible resin layer 3 is formed on the other surface of the metal foil 4 by laminating the extrusion-melted resin film extruded from the extruder on the other surface of the metal foil 4 of the first laminate after the electron beam irradiation, 1 layer of extrusion-melted resin film extruded from 1 extruder may be laminated on the other surface of the metal foil 4 (single lamination method), or a plurality of layers of extrusion-melted resin films extruded from a plurality of extruders may be laminated on the other surface of the metal foil 4 (tandem lamination method).
The packaging material 1 shown in fig. 5 has the following structure: a base layer (outer layer) 2 having a cured film containing an electron beam curable resin composition laminated and integrated on one surface (upper surface) of the metal foil layer 4, and a heat-fusible resin layer (inner layer) 3 having an extruded resin film 47 laminated and integrated on the other surface (lower surface) of the metal foil layer 4.
In the first, second, fifth, and sixth manufacturing methods, when the heat-fusible resin film 3 is bonded to one surface of the metal foil 4 via the extruded molten resin film extruded from the extruder in the inner layer forming step, the method is not particularly limited, and for example, a sandwich lamination method or the like may be used.
In the third, fourth, seventh and eighth manufacturing methods, when the heat-fusible resin layer 3 including the extruded resin film is formed by laminating the extruded molten resin film extruded from the extruder on one surface of the metal foil 4 in the inner layer forming step, the method is not particularly limited, and for example, a single lamination method, a tandem lamination method or the like may be used.
The packaging material 1 obtained by the first to eighth manufacturing methods according to the present invention can be suitably used as an exterior material for batteries such as lithium ion secondary batteries, for example, but is not particularly limited to such use. The packaging material 1 may be used as the packaging material 1 without molding (see fig. 7), or may be used as the molded case 10 by molding such as deep drawing, bulging, or the like (see fig. 7).
In the present invention, the base material layer (outer layer) 2 mainly plays a role of ensuring good formability as the packaging material 1, that is, a role of preventing breakage of the aluminum foil due to necking during forming.
In the first to fourth production methods, the base layer resin film 2 is preferably formed of a heat-resistant resin film. As the heat-resistant resin constituting the heat-resistant resin film 2, a heat-resistant resin that does not melt at the heat-sealing temperature at the time of heat-sealing the packaging material 1 is used. As the heat-resistant resin, a heat-resistant resin having a melting point higher by 10 ℃ or more than the melting point of the heat-fusible resin constituting the heat-fusible resin layer 3 is preferably used, and a heat-resistant resin having a melting point higher by 20 ℃ or more than the melting point of the heat-fusible resin is particularly preferably used.
The heat-resistant resin film 2 is not particularly limited, and examples thereof include a stretched polyamide film such as a stretched nylon film, a stretched polyester film, and the like. Among them, as the heat-resistant resin film 2, a biaxially stretched polyamide film such as a biaxially stretched nylon film, a biaxially stretched polybutylene terephthalate (PBT) film, a biaxially stretched polyethylene terephthalate (PET) film, or a biaxially stretched polyethylene naphthalate (PEN) film is preferably used. As the heat-resistant resin film 2, a heat-resistant resin biaxially stretched film obtained by stretching by a simultaneous biaxial stretching method is preferably used. The nylon is not particularly limited, and examples thereof include nylon 6, nylon 66, nylon MXD, and the like. The heat-resistant resin film 2 may be formed as a single layer (single stretched film), or may be formed as a plurality of layers including, for example, a stretched polyester film/a stretched polyamide film (a plurality of layers including a stretched PET film/a stretched nylon film, or the like).
In the first to fourth production methods, the heat-resistant resin film 2 is preferably a heat-resistant resin film having a hot water shrinkage of 1.5% to 12%. By setting the hot water shrinkage ratio to 1.5% or more, cracking and cracking during molding can be further prevented, and by setting the hot water shrinkage ratio to 12% or less, delamination (peeling) between the outer layer 2 and the metal foil layer 4 can be further prevented. Among them, as the heat-resistant resin film 2, a heat-resistant resin film having a hot water shrinkage of 1.8 to 11% is more preferably used. Further, a heat-resistant resin film having a hot water shrinkage of 1.8% to 6% is preferably used. As the heat-resistant resin film, a heat-resistant resin stretched film is preferably used.
The "hot water shrinkage" refers to the dimensional change in the tensile direction of a test piece (10 cm. Times.10 cm) of a heat-resistant resin tensile film when the test piece was immersed in hot water at 95℃for 30 minutes, and can be determined by the following formula.
Hot water shrinkage (%) = { (X-Y)/X } ×100
X: dimension in the stretching direction before the immersion treatment
Y: dimension in the stretching direction after the dipping treatment.
In the case of using a biaxially stretched film, the hot water shrinkage ratio is an average value of dimensional change ratios in both stretching directions.
The hot water shrinkage rate of the heat-resistant resin stretched film can be controlled by adjusting the heat setting temperature at the time of stretching, for example.
In the first to fourth production methods, the resin film 2 for a base material layer is adhered to one surface of the metal foil 4 via the electron beam curable resin composition, and the following composition is used as the electron beam curable resin composition. In the fifth to eighth production methods, the electron beam curable resin composition is applied to one surface of the metal foil 4 and irradiated with an electron beam, whereby the base material layer (outer layer) 2 of the cured film containing the electron beam curable resin composition is laminated on one surface of the metal foil 4, and the following composition is used as the electron beam curable resin composition.
That is, in the first to eighth production methods according to the present invention, the electron beam curable resin composition is a composition containing a polymerizable oligomer and an electron beam polymerization initiator, and preferably contains a polymerizable oligomer, a polymerizable monomer and an electron beam polymerization initiator. The electron beam curable resin compositions may be radical polymerizable resin compositions, cationic polymerizable resin compositions, or cationic polymerizable resin compositions (radical polymerizable resin and cationic polymerizable resin are mixed), and are not particularly limited. Among them, an acrylic ultraviolet curable resin composition is preferably used as the electron beam curable resin composition.
The polymerizable oligomer is not particularly limited, and examples thereof include radical-polymerizable oligomers such as urethane acrylate oligomer, epoxy acrylate oligomer, and polyester acrylate oligomer, and cationic-polymerizable oligomers such as vinyl ether oligomer and alicyclic epoxy oligomer (resin).
The electron beam polymerization initiator is not particularly limited, and examples thereof include a photo radical polymerization initiator, a photo cation polymerization initiator, and the like. Examples of the photo-radical polymerization initiator include, but are not particularly limited to, benzophenone, benzoin alkyl ethers (benzoin diethyl ether, benzoin butyl ether, etc.), benzildimethyl ketal, acetophenone, thioxanthone, and the like.
The photo cation polymerization initiator is not particularly limited, and examples thereof include onium salts and the like. The onium salts are not particularly limited, and examples thereof include sulfonium salts, iodonium salts, bromonium salts, diazonium salts, and chloronium salts.
Examples of the sulfonium salt include, but are not particularly limited to, triphenylsulfonium hexafluorophosphate, triphenylsulfonium hexafluoroantimonate, triphenylsulfonium tetrakis (pentafluorophenyl) borate, 4 '-bis [ diphenylsulfonium ] diphenylsulfide-bis hexafluorophosphate, 4' -bis [ di (. Beta. -hydroxyethoxy) phenylsulfonium ] diphenylsulfide-bis hexafluoroantimonate, 4 '-bis [ di (. Beta. -hydroxyethoxy) phenylsulfonium ] diphenylsulfide-bis hexafluorophosphate, 7- [ bis (p-toluoyl) sulfonium ] -2-isopropylthioxanthone hexafluoroantimonate, 7- [ bis (p-toluoyl) sulfonium ] -2-isopropylthioxanthone tetrakis (pentafluorophenyl) borate, 4-phenylcarbonyl-4' -diphenylsulfonium-diphenylsulfide-hexafluorophosphate, 4- (p-tert-butylphenylcarbonyl) -4 '-diphenylsulfonium-diphenylsulfide-hexafluoroantimonate, 4- (p-tert-butylphenylcarbonyl) -4' -di (p-toluoyl) diphenylsulfonium-tetrakis (pentafluorophenyl) sulfide-triphenylsulfonium bromide, and the like.
Examples of the iodonium salt include, but are not particularly limited to, diphenyliodonium tetrakis (pentafluorophenyl) borate, diphenyliodonium hexafluorophosphate, diphenyliodonium hexafluoroantimonate, bis (4-nonylphenyl) iodonium hexafluorophosphate, and the like.
The polymerizable monomer is not particularly limited, and examples thereof include an acrylate monomer and a vinyl ether monomer. The acrylic acid ester monomer is not particularly limited, and examples thereof include pentaerythritol triacrylate, neopentyl glycol diacrylate, and phosphoric acid-containing (meth) acrylic acid ester. The phosphoric acid-containing (meth) acrylate is not particularly limited, and examples thereof include monomers such as acryloyloxyethyl acid phosphate and bis (2- (meth) acryloyloxyethyl) acid phosphate.
The vinyl ether monomer is not particularly limited, and examples thereof include 2-hydroxyethyl vinyl ether (HEVE), diethylene glycol monovinyl ether (DEGV), and 4-hydroxybutyl vinyl ether (HBVE).
The electron beam curable resin composition may contain a silane coupling agent, an acid anhydride, a sensitizer, various additives, and the like.
The silane coupling agent is not particularly limited, and examples thereof include methyltrimethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, allyltrimethoxysilane, and 3- (methacryloyloxy) propyltrimethoxysilane. Among them, as the silane coupling agent, a silane coupling agent having a carbon-carbon double bond such as vinyltriethoxysilane or allyltrimethoxysilane is preferably used, and in this case, particularly, the bonding with an adhesive by radical polymerization can be enhanced.
The acid anhydride is not particularly limited, and examples thereof include maleic anhydride, methyl maleic anhydride, itaconic anhydride, nadic anhydride, methyl nadic anhydride, and the like. Among them, an acid anhydride having a carbon-carbon double bond such as maleic anhydride is preferably used as the acid anhydride, and the radical polymerization reaction can be further promoted by such an acid anhydride having a double bond.
The sensitizer is not particularly limited, and examples thereof include tertiary amines and the like. The tertiary amine is not particularly limited, and examples thereof include N, N-dimethylethylamine, N-dimethylethanolamine, N,3, 5-tetramethylaniline, and the like.
In the electron beam curable resin composition, the content of the polymerizable monomer is preferably 0.01 to 5 mass%. In the electron beam curable resin composition, the content of the polymerizable oligomer is preferably 85 to 99 mass%. In the electron beam curable resin composition, the content of the electron beam polymerization initiator is preferably 0.1 to 10 mass%.
In the first to fourth production methods, the method of applying the electron beam curable resin composition to the metal foil 4 or the resin film 2 for the base layer is not particularly limited, and examples thereof include gravure roll coating, screen coating, coating by an inkjet method, die coating, and the like, and the most suitable application method can be selected depending on the material to be applied (electron beam curable resin composition). In this case, the electron beam curable resin composition may be applied to the metal foil 4, the electron beam curable resin composition may be applied to the resin film 2 for a base layer, or the electron beam curable resin composition may be applied to both the metal foil 4 and the resin film 2 for a base layer. In the fifth to eighth production methods according to the present invention, the method of applying the electron beam curable resin composition to the metal foil 4 is not particularly limited, and the same methods as those described in the above examples are exemplified.
In the first to fourth manufacturing methods, the thickness (thickness after drying) of the outer adhesive layer (first adhesive layer) 5 of the obtained packaging material 1 is preferably set to 1 μm to 6 μm.
In the present invention, the thickness of the base material layer 2 is preferably 10 μm to 50 μm. By setting the lower limit value to be equal to or higher than the above-described preferable lower limit value, sufficient strength as a packaging material can be ensured, and by setting the upper limit value to be equal to or lower than the above-described preferable upper limit value, stress at the time of bulge forming and at the time of drawing forming can be reduced, and formability can be improved.
In the present invention, the metal foil layer (metal foil) 4 functions to provide the packaging material 1 with gas barrier properties (prevent the invasion of oxygen and moisture). The metal foil 4 is not particularly limited, and examples thereof include aluminum foil, copper foil, SUS foil (stainless steel foil), nickel foil, titanium foil, and the like, and aluminum foil is generally used. The thickness of the metal foil 4 is preferably 10 μm to 200. Mu.m. By having a thickness of 10 μm or more, pinholes can be prevented from being formed during rolling in the production of a metal foil, and by having a thickness of 200 μm or less, stress during molding such as bulge molding and drawing molding can be reduced, and moldability can be improved. Among them, the thickness of the metal foil 4 is particularly preferably 20 μm to 100 μm.
In the metal foil 4, it is preferable that at least the inner surface (the surface on the inner layer 3 side) is subjected to a chemical conversion treatment. By performing such chemical conversion treatment, corrosion of the metal foil surface due to the content (electrolyte of the battery or the like) can be sufficiently prevented. The metal foil is subjected to a chemical conversion treatment by, for example, the following treatment. That is, for example, the surface of the metal foil after degreasing is coated with any one of the aqueous solutions of 1) to 3), and then dried, whereby the chemical conversion treatment is performed.
1) Containing phosphoric acid,
Chromic acid, and
an aqueous solution of a mixture of at least 1 compound selected from the group consisting of metal salts of fluorides and nonmetallic salts of fluorides;
2) Containing phosphoric acid,
At least 1 resin selected from the group consisting of acrylic resin, chitosan (chitosan) derivative resin, and phenolic resin, and
an aqueous solution of a mixture of at least 1 compound selected from the group consisting of chromic acid and chromium (III) salts;
3) Containing phosphoric acid,
At least 1 resin selected from the group consisting of acrylic resin, chitosan derivative resin, and phenolic resin,
At least one compound selected from the group consisting of chromic acid and chromium (III) salts, and
An aqueous solution of a mixture of at least 1 compound selected from the group consisting of metal salts of fluorides and nonmetallic salts of fluorides.
The amount of chromium attached to the chemical conversion coating (on each surface) is preferably 0.1mg/m 2 ～50mg/m 2 Particularly preferably 2mg/m 2 ～20mg/m 2 。
In the present invention, the heat-fusible resin layer (inner layer) 3 is excellent in chemical resistance against a highly corrosive electrolyte solution or the like used in a lithium ion secondary battery or the like, and also has a function of imparting heat sealability to a packaging material.
In the first, second, fifth and sixth production methods, the heat-fusible resin film 3 is bonded to one surface of the metal foil 4 via an extrusion molten resin film (inner adhesive 6) extruded from an extruder, and the following resins are used as the resins constituting the heat-fusible resin film and the extrusion molten resin film. In the third, fourth, seventh and eighth manufacturing methods, the extrusion molten resin film extruded from the extruder is laminated on one surface of the metal foil 4, whereby the heat-fusible resin layer (inner layer) 3 including the extrusion molten resin film is laminated on one surface of the metal foil 4, and the following resin is used as the resin constituting the extrusion molten resin film.
That is, in the first, second, fifth, and sixth manufacturing methods, the resin constituting the heat-fusible resin film 3 is not particularly limited, and examples thereof include polyethylene, polypropylene, an ionomer, ethylene Ethyl Acrylate (EEA), ethylene methyl acrylate (EAA), ethylene methyl methacrylate resin (EMMA), ethylene-vinyl acetate copolymer resin (EVA), maleic anhydride-modified polypropylene, maleic anhydride-modified polyethylene, and polyester resin. The heat-fusible resin film 3 is preferably formed of a heat-fusible resin unstretched film.
The resin constituting the extruded molten resin film is not particularly limited, and examples thereof include maleic anhydride-modified polypropylene, maleic acid-modified polypropylene, maleic anhydride-modified polyethylene, maleic acid-modified polyethylene, polypropylene resin, polyethylene resin, and the like. Among these, in the third, fourth, seventh and eighth production methods, as the resin constituting the extruded molten resin film, for example, a heat-fusible resin such as maleic anhydride-modified polypropylene, maleic acid-modified polypropylene, maleic anhydride-modified polyethylene, maleic acid-modified polyethylene, polypropylene resin, polyethylene resin or the like is preferably used.
In the first, second, fifth and sixth production methods, the thickness of the extruded molten resin film immediately before sandwiching (immediately before contact) between the metal foil 4 and the heat-fusible resin film 3 by the sandwich lamination method or the like is not particularly limited, and is preferably set to 5 μm to 40 μm. In the first, second, fifth and sixth manufacturing methods, the thickness (thickness after drying) of the inner adhesive layer (second adhesive layer) 6 of the obtained packaging material 1 is preferably set to 5 μm to 40 μm.
In the present invention, the thickness of the heat-fusible resin layer (inner layer) 3 is preferably set to 20 μm to 100 μm. By setting the thickness to 20 μm or more, sufficient heat seal strength can be ensured, and by setting the thickness to 100 μm or less, film formation and weight reduction can be facilitated. The heat-fusible resin layer 3 may be a single layer or a plurality of layers. When the heat-fusible resin layer 3 is formed of a plurality of layers, it is preferable that the innermost layer of the heat-fusible resin layer 3 is formed of an ethylene-propylene random copolymer or/and a propylene block copolymer (elastomer-modified propylene resin), and by adopting such a constitution, the sealing characteristics after heat-welding (after heat-sealing) (high heat-sealing strength and the like can be obtained) can be improved.
In the production method of the present invention, examples of the electron beam include ultraviolet light, visible light, X-ray, and γ -ray. In the case of irradiating the ultraviolet light or the visible light, the irradiation light amount is not particularly limited, and is preferably set to 50mJ/cm for each surface 2 ～1000mJ/cm 2 。
By molding (deep drawing, bulging, etc.) the packaging material 1 obtained by the manufacturing method of the present invention, an outer case (outer case for power storage device, etc.) 10 can be obtained (see fig. 7). The packaging material 1 obtained by the production method of the present invention may be used as it is without being molded (see fig. 7).
Fig. 6 shows an embodiment of an electric storage device 30 configured using the packaging material 1 obtained by the manufacturing method of the present invention. The power storage device 30 is a lithium ion secondary battery. In the present embodiment, as shown in fig. 6 and 7, the packaging member 15 includes a case 10 formed by molding the packaging material 1, and a planar packaging material 1 which is not molded. Then, in the housing recess of the molded case 10 obtained by molding the packaging material 1 obtained by the manufacturing method of the present invention, a storage device main body portion (electrochemical element or the like) 31 having a substantially rectangular parallelepiped shape is housed, and when the packaging material 1 obtained by the manufacturing method of the present invention is not molded, the storage device main body portion 31 is disposed on the inner side layer 3 side (lower side), and the peripheral edge portion of the inner layer 3 of the planar packaging material 1 and the inner layer 3 of the flange portion (sealing peripheral edge portion) 29 of the molded case 10 are sealed by heat sealing, thereby forming the storage device 30 of the present invention (see fig. 6 and 7). The inner surface of the receiving recess of the molded case 10 is an inner layer (heat-fusible resin layer) 3, and the outer surface of the receiving recess is an outer layer (base material layer) 2 (see fig. 7).
In fig. 6, 39 is a heat-sealed portion formed by joining (welding) a peripheral edge portion of the packaging material 1 and a flange portion (sealing peripheral edge portion) 29 of the molded case 10. In the above-described power storage device 30, the tip portion of the tab connected to the power storage device main body 31 is led out of the packaging member 15, but is not shown in the drawings.
The power storage device main body 31 is not particularly limited, and examples thereof include a battery main body, a capacitor main body, and a capacitor main body.
The width of the heat seal portion 39 is preferably set to 0.5mm or more. By setting the diameter to 0.5mm or more, sealing can be reliably performed. The width of the heat seal portion 39 is preferably set to 3mm to 15mm.
In the above embodiment, the packaging member 15 has a configuration including the molded case 10 obtained by molding the packaging material 1 and the planar packaging material 1 (see fig. 6 and 7), but is not particularly limited to such a combination, and for example, the packaging member 15 may have a configuration including a pair of the packaging materials 1 or may have a configuration including a pair of the molded cases 10.
Examples
Specific examples of the present invention will be described below, but the present invention is not limited to these examples.
Example 1 >
A chemical conversion treatment solution containing phosphoric acid, polyacrylic acid (acrylic resin), a chromium (III) salt compound, water and an alcohol was applied to both surfaces of an aluminum foil (aluminum foil of A8021H-O prescribed in JIS H4160) 4 having a thickness of 40 μm, and then dried at 180℃to form a chemical conversion coating. The chromium adhesion amount of the chemical conversion coating was 10mg/m per one surface 2 。
Next, as shown in fig. 1, an unstretched polypropylene film (heat-fusible resin film) 3 having a thickness of 40 μm supplied from a supply roll 52 is laminated on one surface of the aluminum foil 4, which has been subjected to the chemical conversion treatment, supplied from the supply roll 51 via an extrusion molten maleic acid-modified polyolefin resin film (extrusion molten resin film) 47 having a thickness of 15 μm extruded from an extruder 40, and then a nip is performed between a pair of rolls 41, 41 (by a sandwich lamination method), whereby a first laminate 48 is obtained (inner layer forming step).
Next, as shown in fig. 1, the coating roll 42 was used on the other surface of the metal foil 4 of the first laminate 48 continuously (in a continuous process) with the inner layer forming process, so that the mass after drying became 2.0g/m 2 In the form of (a) a photocurable resin composition A (electron beam curable resin composition) 44 containing 94 parts by mass of a urethane acrylate oligomer (polymerizable oligomer) having two acryl groups, 1 part by mass of pentaerythritol triacrylate (polymerizable monomer) and 5 parts by mass of benzophenone (photo radical polymerization initiator) was applied, a biaxially stretched nylon film (resin film for a base material layer) 2 having a hot water shrinkage of 5.0% and a thickness of 25 μm supplied from a supply roll 53 was laminated on the coated surface, and then a nip was performed between a pair of rolls 45 and 45 to obtain a second laminate 49, and the second laminate 49 was irradiated with 100mJ/cm from the base material layer resin film 2 side 2 Ultraviolet light (UV light; wavelength 365 nm) 46 (outside layer forming step), thereby obtaining the outer package 1 for the power storage device having the structure shown in fig. 2. In fig. 1, reference numeral 43 denotes a tank (container) containing an electron beam curable resin composition.
Example 2 >
An aluminum foil having undergone a chemical conversion treatment was obtained in the same manner as in example 1. Next, an extrusion molten maleic acid-modified polyolefin resin film (extrusion molten resin film) having a thickness of 55 μm extruded from an extruder was laminated on one surface of the aluminum foil 4 after the chemical conversion treatment, and then cooled and nipped between a cooling roll and a normal temperature roll (by a single lamination method), thereby obtaining a first laminate in which a heat-fusible resin layer 3 having a thickness of 55 μm formed of a maleic acid-modified polyolefin resin was laminated on one surface of the aluminum foil (inner layer forming step).
Next, the other surface of the metal foil 4 of the first laminate was dried to a mass of 2.0g/m using a coating roll continuously (in a continuous process) with the inner layer forming process 2 94 parts by mass of a urethane acrylate oligomer (polymerizable oligomer) having two acryl groups, 1 part by mass of pentaerythritol triacrylate (polymerizable monomer), and diphenyl 5 parts by mass of a ketone (photopolymerization initiator) was coated with 5 parts by mass of a photocurable resin composition A (electron beam curable resin composition), then a biaxially stretched nylon film (resin film for a base material layer) 2 having a hot water shrinkage of 5.0% and a thickness of 25 μm was bonded to the coated surface, and then a second laminate was obtained by nip-pressing between a pair of rolls, and then the second laminate was irradiated with 100mJ/cm from the resin film side for a base material layer 2 The outer package 1 for power storage devices having the structure shown in FIG. 3 was obtained by the step of forming an outer layer by ultraviolet light (UV light; wavelength 365 nm).
Example 3 >
An aluminum foil having undergone a chemical conversion treatment was obtained in the same manner as in example 1. Next, the mass of the aluminum foil 4 after the chemical conversion treatment was dried was set to 2.0g/m 2 The same photocurable resin composition A (electron-beam curable resin composition) as in example 1 was applied to the coated surface, a biaxially stretched nylon film (resin film for a base material layer) 2 having a hot water shrinkage of 5.0% and a thickness of 25 μm was then laminated between a pair of rolls to obtain a first laminate, and the first laminate was irradiated with 100mJ/cm from the resin film side for a base material layer 2 Ultraviolet light (wavelength 365nm; electron beam) (outer layer forming step).
Next, an unstretched polypropylene film (heat-fusible resin film) 3 having a thickness of 40 μm was laminated on the other surface of the aluminum foil 4 of the first laminate after the electron beam irradiation via an extruded molten maleic acid-modified polyolefin resin film (extruded molten resin film) having a thickness of 15 μm extruded from an extruder continuously to the outside layer forming step (in a continuous step), and then a nip was performed between a pair of rolls (by a sandwich lamination method) (inside layer forming step), whereby the outer package 1 for an electric storage device having the structure shown in fig. 2 was obtained.
Example 4 >
An aluminum foil having undergone a chemical conversion treatment was obtained in the same manner as in example 1. Next, the mass of the aluminum foil 4 after the chemical conversion treatment was dried was set to 2.0g/m 2 The same photocurable resin composition A (electron beam curable resin composition) as in example 1 was applied to the coated surface, a biaxially stretched nylon film (resin film for a base material layer) 2 having a hot water shrinkage of 5.0% and a thickness of 25 μm was then laminated on the coated surface, and a nip was performed between a pair of rolls to obtain a first laminate, and then the first laminate was irradiated with 100mJ/cm from the resin film side for a base material layer 2 Ultraviolet light (wavelength 365nm; electron beam) (outer layer forming step).
Next, an extruded molten maleic acid-modified polyolefin resin film (extruded molten resin film) having a thickness of 55 μm extruded from an extruder was laminated on the other surface of the aluminum foil 4 of the first laminate after the electron beam irradiation continuously (in a continuous step), and then cooled and pressed between a cooling roll and a normal temperature roll (by a single lamination method), and a heat-fusible resin layer 3 having a thickness of 55 μm formed of a maleic acid-modified polyolefin resin was laminated on the other surface of the aluminum foil 4 (an inner layer forming step), to obtain an exterior material 1 for an electric storage device having a structure shown in fig. 3.
Example 5 >
An aluminum foil having undergone a chemical conversion treatment was obtained in the same manner as in example 1. Next, an unstretched polypropylene film (heat-fusible resin film) 3 having a thickness of 40 μm was laminated on one surface of the aluminum foil 4, on which the chemical conversion treatment was completed, via an extrusion molten maleic acid-modified polyolefin resin film (extrusion molten resin film) having a thickness of 15 μm extruded from an extruder, and then a first laminate was obtained by nip-pressing between a pair of rolls (by a sandwich lamination method) (inner layer forming step).
Continuously (in a continuous process) with the inner layer forming process, the metal foil 4 of the first laminate was dried to a mass of 10g/m on the other surface 2 The same photocurable resin composition A (electron-beam curable resin composition) as in example 1 was applied to obtain a second laminate, and the second laminate was irradiated with 100mJ/cm from the electron-beam curable resin composition side 2 Ultraviolet light (wavelength 365nm; electron beam) (outer layer forming step), thereby obtainingTo the outer packaging material 1 for power storage devices having the structure shown in fig. 4.
Example 6 >
An aluminum foil having undergone a chemical conversion treatment was obtained in the same manner as in example 1. Next, an extrusion molten maleic acid-modified polyolefin resin film (extrusion molten resin film) having a thickness of 55 μm extruded from an extruder was laminated on one surface of the aluminum foil 4 after the chemical conversion treatment, and then cooled and nipped between a cooling roll and a normal temperature roll (by a single lamination method), thereby obtaining a first laminate in which a heat-fusible resin layer 3 having a thickness of 55 μm formed of a maleic acid-modified polyolefin resin was laminated on one surface of the aluminum foil 4 (inner layer forming step).
Continuously (in a continuous process) with the inner layer forming process, the metal foil 4 of the first laminate is dried to a mass of 10g/m on the other surface 2 In the same manner as in example 1, a photocurable resin composition A (electron-beam curable resin composition) was applied to obtain a second laminate, and the second laminate was irradiated with 100mJ/cm from the electron-beam curable resin composition side 2 The outer package 1 for the power storage device having the structure shown in FIG. 5 was obtained by the ultraviolet light (wavelength 365nm; electron beam) (outer layer forming step).
Example 7 >
An aluminum foil having undergone a chemical conversion treatment was obtained in the same manner as in example 1. Next, the dried aluminum foil 4 was formed on one surface thereof with a mass of 10g/m 2 The same photocurable resin composition A (electron-beam curable resin composition) as in example 1 was applied to obtain a first laminate, and the first laminate was irradiated with 100mJ/cm from the electron-beam curable resin composition side 2 Ultraviolet light (wavelength 365nm; electron beam) (outer layer forming step).
An unstretched polypropylene film (heat-fusible resin film) 3 having a thickness of 40 μm was laminated on the other surface of the metal foil 4 of the first laminate after the electron beam irradiation via an extrusion molten maleic acid-modified polyolefin resin film (extrusion molten resin film) having a thickness of 15 μm extruded from an extruder continuously to the outside layer forming step (in a continuous step), and then a nip was performed between a pair of rolls (by a sandwich lamination method) (inside layer forming step), whereby the outer packaging material 1 for an electric storage device having the structure shown in fig. 4 was obtained.
Example 8 >
An aluminum foil having undergone a chemical conversion treatment was obtained in the same manner as in example 1. Next, the dried aluminum foil 4 was formed on one surface thereof with a mass of 10g/m 2 The same photocurable resin composition A (electron-beam curable resin composition) as in example 1 was applied to obtain a first laminate, and the first laminate was irradiated with 100mJ/cm from the electron-beam curable resin composition side 2 Ultraviolet light (wavelength 365nm; electron beam) (outer layer forming step).
An extruded molten maleic acid-modified polyolefin resin film (extruded molten resin film) having a thickness of 55 μm extruded from an extruder was laminated on the other surface of the metal foil 4 of the first laminate after the electron beam irradiation continuously (in a continuous step), and then cooled and pressed between a cooling roll and a normal temperature roll (by a single lamination method), whereby a heat-fusible resin layer 3 having a thickness of 55 μm formed of a maleic acid-modified polyolefin resin was laminated on the other surface of the aluminum foil 4 (an inner layer forming step), to obtain the exterior material 1 for electric storage equipment having the structure shown in fig. 5.
Example 9 >
An exterior material 1 for an electric storage device having a structure shown in fig. 2 was obtained in the same manner as in example 1 except that a photocurable resin composition (electron beam-curable resin composition) 44 was used instead of the photocurable resin composition a, and a photocurable resin composition B comprising 96.0 parts by mass of a vinyl ether oligomer (polymerizable oligomer) having two vinyl groups, 3.0 parts by mass of a 2-hydroxyethyl vinyl ether (polymerizable monomer), and 1.0 parts by mass of triphenylsulfonium hexafluorophosphate (sulfonium salt; photo-cationic polymerization initiator) was used.
Example 10 >
An exterior material 1 for a power storage device having a structure shown in fig. 3 was obtained in the same manner as in example 2, except that the photocurable resin composition B used in example 9 was used as the photocurable resin composition (electron beam-curable resin composition) instead of the photocurable resin composition a.
Example 11 >
An exterior material 1 for a power storage device having a structure shown in fig. 4 was obtained in the same manner as in example 5, except that the photocurable resin composition B used in example 9 was used as the photocurable resin composition (electron beam-curable resin composition) instead of the photocurable resin composition a.
Example 12 >
An exterior material 1 for a power storage device having a structure shown in fig. 5 was obtained in the same manner as in example 6, except that the photocurable resin composition B used in example 9 was used as the photocurable resin composition (electron beam-curable resin composition) instead of the photocurable resin composition a.
Example 13 >
As the irradiation light (electron beam), instead of 100mJ/cm 2 250mJ/cm was used for ultraviolet light of (C) 2 Except for the ultraviolet light of (a), the outer package 1 for the power storage device having the structure shown in fig. 2 was obtained in the same manner as in example 1.
Example 14 >
As the irradiation light (electron beam), instead of 100mJ/cm 2 500mJ/cm was used for ultraviolet light of (C) 2 Except for the ultraviolet light of (a), the outer package 1 for the power storage device having the structure shown in fig. 2 was obtained in the same manner as in example 1.
Example 15 >
In the inner layer forming step of example 2, an outer packaging material 1 for an electric storage device having a structure shown in fig. 3 was obtained in the same manner as in example 2 except that an extruded molten maleic acid-modified polyolefin resin film (extruded molten resin film) having a thickness of 10 μm extruded from a first extruder was laminated on one surface of an aluminum foil 4 after the chemical conversion treatment, then cooled and pressed between a cooling roll and a normal temperature roll, then an extruded molten polypropylene resin film (extruded molten resin film) having a thickness of 45 μm extruded from a second extruder was further laminated on the resin film, then cooled and pressed between a cooling roll and a normal temperature roll (by a tandem lamination method), thereby obtaining a first laminate in which a heat-fusible resin layer 3 having a total thickness of 55 μm was laminated on one surface of an aluminum foil.
Reference example
An aluminum foil having undergone a chemical conversion treatment was obtained in the same manner as in example 1. Next, a urethane adhesive (outside adhesive) 5 was applied to one surface of the aluminum foil 4 after the chemical conversion treatment so that the thickness thereof became 2 μm after drying, and then a biaxially stretched nylon film 2 having a hot water shrinkage of 5.0% and a thickness of 25 μm was laminated on the outside adhesive-applied surface, thereby obtaining a first laminate. The first laminate was left standing at 60 ℃ for 7 days, and then subjected to heat curing treatment, whereby the outer adhesive was cured to form an outer adhesive layer.
Next, the other surface of the aluminum foil 4 of the first laminate was dried to a mass of 2.0g/m 2 An inner adhesive 6 made of a thermosetting acid-modified polypropylene adhesive was applied, and an unstretched polypropylene film 3 having a thickness of 40 μm was bonded to the inner adhesive-applied surface, whereby a second laminate was obtained.
The second laminate was left standing at 40 ℃ for 7 days, and then heat-cured, whereby the inner adhesive was cured to form an inner adhesive layer 6, thereby obtaining an outer package for an electric storage device having the structure shown in fig. 2.
In examples 1 to 4, 9, 10, 13, 14, and 15 and reference examples, the biaxially stretched nylon film having a hot water shrinkage of 5.0% was obtained by setting the heat setting temperature at 191℃in biaxially stretching the nylon film.
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In tables 1 and 2, in the column of the types of photocurable resin compositions, "a" represents a photo radical polymerization resin composition and "B" represents a photo cation polymerization resin composition.
Examples 1, 9, 13, and 14 are examples corresponding to the first manufacturing method, examples 2, 10, and 15 are examples corresponding to the third manufacturing method, example 3 is an example corresponding to the second manufacturing method, example 4 is an example corresponding to the fourth manufacturing method, examples 5 and 11 are examples corresponding to the fifth manufacturing method, examples 6 and 12 are examples corresponding to the seventh manufacturing method, example 7 is an example corresponding to the sixth manufacturing method, and example 8 is an example corresponding to the eighth manufacturing method.
The outer packaging material (packaging material) for each power storage device obtained in the above manner was evaluated based on the following measurement method and evaluation method.
< method for measuring lamination Strength at high temperature >
From the obtained outer package material, a test piece having a width of 15mm×a length of 150mm was cut, and the aluminum foil and the base material layer were peeled off from each other in a region from one end of the test piece in the longitudinal direction to a position inside 10 mm.
The laminate comprising aluminum foil was sandwiched and fixed by one chuck using a Stroggraph (AGS-5 kNX) manufactured by Shimadzu corporation in accordance with JIS K6854-3 (1999), the peeled base material layer was sandwiched and fixed by the other chuck, and after holding at 120℃for 1 minute, T-peeling was directly performed at a pulling rate of 100 mm/min at 120℃to measure the peeling strength at this time, and the value obtained by stabilizing the measured value was regarded as "lamination strength at high temperature (N/15 mm width)". The laminate strength was rated as "2.0N/15mm width" or more.
Method for evaluating moldability (maximum molding depth)
The outer package was deep-drawn into a substantially rectangular parallelepiped shape (a substantially rectangular parallelepiped shape with 1 surface open; see fig. 7) of each depth using a deep-drawing die manufactured by Amada, inc., to change the molding depth by 0.5mm, and the resultant molded article was inspected for the presence or absence of pinholes and cracks at the corners and for "maximum molding depth (mm)" at which such pinholes and cracks were not generated. Whether or not pinholes and cracks were present was checked in a darkroom by a light transmission method. The maximum molding depth was 5.0mm or more, which was regarded as acceptable.
< method for evaluating sealing Property > (evaluation of whether delamination occurs or not when deep molding is performed)
As the molding of the molding depth, the outer package material was deep-drawn into a substantially rectangular parallelepiped shape (a substantially rectangular parallelepiped shape with one face open; see fig. 7) of 55mm in the longitudinal direction and 35mm in the transverse direction and 5.0mm using the deep-drawing die. At this time, the molding is performed such that the base material layer 2 is outside the molded body. In each of the examples and comparative examples, two molded articles were produced, and flange portions (sealing peripheral edge portions; see fig. 7) 29 of the two molded articles (molded cases) 10 were brought into contact with each other and stacked, heat-sealed at 170 ℃.
(determination criterion)
"O" … did not confirm delamination (peeling) nor apparent floating (pass)
The slight delamination (peeling) of ". DELTA." … occurred rarely, but was virtually free of delamination (peeling) and did not appear to float (acceptable)
The "x" … was delaminated (peeled off), and also floated (failed) in appearance.
< method for evaluating hot Water resistance > (evaluation of delamination when used in severe environments such as high temperature and high humidity)
The outer package material was deep-drawn using the deep-drawing die, and thus formed into a substantially rectangular parallelepiped shape (a substantially rectangular parallelepiped shape with 1 surface open; see fig. 7) of 55mm in the longitudinal direction and 35mm in the transverse direction. At this time, the molding is performed such that the outer layer (base material layer) 2 is outside the molded body. In each example and each comparative example, two molded articles were produced, flange portions (sealing peripheral edge portions; see fig. 7) 29 of the two molded articles 10 were brought into contact with each other and superimposed, heat-sealing was performed at 170 ℃.
(determination criterion)
"O" … did not confirm delamination (peeling) nor apparent floating (pass)
The slight delamination (peeling) of ". DELTA." … occurred rarely, but was virtually free of delamination (peeling) and did not appear to float (acceptable)
The "x" … was delaminated (peeled off), and also floated (failed) in appearance.
< Heat seal Strength determination method >)
From the obtained outer package material, 2 pieces of test pieces having a width of 15mm×a length of 200mm were cut, and then, the 2 pieces of test pieces were stacked with their inner seal layers in contact with each other, and in this state, one face was heated under the conditions of a heat sealing temperature of 200 ℃, a sealing pressure of 0.2MPa (table display pressure), and a sealing time of 2 seconds using a heat sealing device (TP-701-a) manufactured by ltd.
Next, a pair of outer packaging materials obtained by heat-sealing the inner seal layers to each other in the manner described above were peeled off from each other at a pulling rate of 100 mm/min between the inner seal layers of the sealed portion of the outer packaging material (test body) using a straoggraph (AGS-5 kNX) manufactured by Shimadzu Access corporation according to JIS K7127-1998, and the peel strength at this time was measured as heat-sealing strength (N/15 mm width). The heat seal strength was determined to be at least 50N/15mm in width.
As is clear from the table, in examples 1 to 15 to which the production method of the present invention was applied, "adhesion by electron beam curing of an electron beam curable resin composition or formation of a base material layer by electron beam curing of an electron beam curable resin composition" and "adhesion by extrusion of a molten resin film or formation of a thermally fusible resin layer by extrusion of a molten resin film" were carried out without using a thermosetting resin which requires heating and curing for several days, and therefore, the lead time was greatly shortened and productivity was improved, and in the packaging materials (exterior materials for electric storage devices) of examples 1 to 15 obtained by the production method of the present invention, pinholes and cracks were not generated even when deep molding was carried out, and excellent moldability was provided, and delamination (peeling) was suppressed even when deep molding was carried out.
It is also clear from the comparison of examples 1 to 15 to which the production method of the present application is applied and the reference example that the packaging materials (exterior packaging material for electric storage devices) of examples 1 to 15 obtained by the production method of the present application can obtain performances equivalent to those of the packaging materials of the reference example using the conventional thermosetting resin as an adhesive.
Industrial applicability
The packaging material according to the present application can be suitably used as an exterior material for various power storage devices (exterior material for power storage devices), and specific examples thereof include:
power storage devices such as lithium secondary batteries (lithium ion batteries, lithium polymer batteries, etc.);
lithium ion capacitor;
an electric double layer capacitance; etc.
The packaging material according to the present application can be used as a packaging material for foods, a packaging material for pharmaceuticals, or the like.
The present application claims priority from Japanese patent application No. 2016-195469 filed on the date of 2016, 10 and 3, the disclosure of which forms a part of the present application.
The terminology and description used herein is for the purpose of describing the embodiments of the application, and the application is not limited thereto. The present application is also susceptible to any design change within the scope of the claims, as long as it does not deviate from the gist thereof.
Description of the reference numerals
1 … packaging material
2 … base layer (outer layer) (resin film for base layer, etc.)
3 … Heat-fusible resin layer (inner layer) (Heat-fusible resin film, etc.)
4 … Metal foil layer (Metal foil)
5 … outer adhesive layer (first adhesive layer)
6 … inner adhesive layer (second adhesive layer)
40 … extruder
44 … electron beam-curable resin composition
46 … electron beam (ultraviolet light etc)
47 … extrusion molten resin film
48 … first laminate
49 … second laminate
Claims (11)
1. The method for manufacturing the packaging material is characterized by comprising the following steps:
an inner layer forming step of adhering a heat-fusible resin film to one surface of a metal foil via an extrusion molten resin film extruded from an extruder to obtain a first laminate; and
and an outer layer forming step of adhering a resin film for a base layer to the other surface of the metal foil of the first laminate via an electron beam curable resin composition to obtain a second laminate, and then irradiating the second laminate with electron beams from the resin film side for the base layer.
2. The method for manufacturing the packaging material is characterized by comprising the following steps:
an inner layer forming step of forming a heat-fusible resin layer on one surface of a metal foil by laminating an extrusion molten resin film extruded from an extruder on the one surface of the metal foil, thereby obtaining a first laminate; and
And an outer layer forming step of adhering a resin film for a base layer to the other surface of the metal foil of the first laminate via an electron beam curable resin composition to obtain a second laminate, and then irradiating the second laminate with electron beams from the resin film side for the base layer.
3. The method for manufacturing the packaging material is characterized by comprising the following steps:
an outer layer forming step of adhering a resin film for a base layer to one surface of a metal foil via an electron beam curable resin composition to obtain a first laminate, and then irradiating the first laminate with an electron beam from the resin film side for the base layer; and
and an inner layer forming step of adhering a heat-fusible resin film to the other surface of the metal foil of the first laminate after the electron beam irradiation, via an extrusion molten resin film extruded from an extruder.
4. The method for manufacturing the packaging material is characterized by comprising the following steps:
an outer layer forming step of adhering a resin film for a base layer to one surface of a metal foil via an electron beam curable resin composition to obtain a first laminate, and then irradiating the first laminate with an electron beam from the resin film side for the base layer; and
And an inner layer forming step of forming a heat-fusible resin layer on the other surface of the metal foil layer by laminating an extruded molten resin film extruded from an extruder on the other surface of the metal foil of the first laminate after the electron beam irradiation.
5. The method for manufacturing the packaging material is characterized by comprising the following steps:
an inner layer forming step of adhering a heat-fusible resin film to one surface of a metal foil via an extrusion molten resin film extruded from an extruder to obtain a first laminate; and
and an outer layer forming step of applying an electron beam curable resin composition to the other surface of the metal foil of the first laminate to obtain a second laminate, and then irradiating the second laminate with an electron beam from the electron beam curable resin composition side.
6. The method for manufacturing the packaging material is characterized by comprising the following steps:
an inner layer forming step of forming a heat-fusible resin layer on one surface of a metal foil by laminating an extrusion molten resin film extruded from an extruder on the one surface of the metal foil, thereby obtaining a first laminate; and
And an outer layer forming step of applying an electron beam curable resin composition to the other surface of the metal foil of the first laminate to obtain a second laminate, and then irradiating the second laminate with an electron beam from the electron beam curable resin composition side.
7. The method for manufacturing the packaging material is characterized by comprising the following steps:
an outer layer forming step of applying an electron beam-curable resin composition to one surface of a metal foil to obtain a first laminate, and then irradiating the first laminate with an electron beam from the electron beam-curable resin composition side; and
and an inner layer forming step of adhering a heat-fusible resin film to the other surface of the metal foil of the first laminate after the electron beam irradiation, via an extrusion molten resin film extruded from an extruder.
8. The method for manufacturing the packaging material is characterized by comprising the following steps:
an outer layer forming step of applying an electron beam-curable resin composition to one surface of a metal foil to obtain a first laminate, and then irradiating the first laminate with an electron beam from the electron beam-curable resin composition side; and
And an inner layer forming step of forming a heat-fusible resin layer on the other surface of the metal foil layer by laminating an extruded molten resin film extruded from an extruder on the other surface of the metal foil of the first laminate after the electron beam irradiation.
9. The method for producing a packaging material according to claim 1, 2, 5, and 6, wherein the inner layer forming step and the outer layer forming step are performed continuously.
10. The method for producing a packaging material according to any one of claims 1 to 4, wherein a heat-resistant resin film having a heat shrinkage of 1.5% to 12% is used as the resin film for the base layer.
11. The method for producing a packaging material according to any one of claims 1 to 10, wherein the extrusion molten resin film is an extrusion molten acid-modified polyolefin resin film.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016195469A JP2018058230A (en) | 2016-10-03 | 2016-10-03 | Method for producing packaging material |
| JP2016-195469 | 2016-10-03 | ||
| CN201780057408.4A CN109715392A (en) | 2016-10-03 | 2017-07-11 | The manufacturing method of packaging material |
| PCT/JP2017/025289 WO2018066196A1 (en) | 2016-10-03 | 2017-07-11 | Method for producing packaging material |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780057408.4A Division CN109715392A (en) | 2016-10-03 | 2017-07-11 | The manufacturing method of packaging material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116922805A true CN116922805A (en) | 2023-10-24 |
Family
ID=61831669
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310900825.8A Pending CN116922805A (en) | 2016-10-03 | 2017-07-11 | Method for producing packaging material |
| CN202410031564.5A Pending CN117885367A (en) | 2016-10-03 | 2017-07-11 | Method for producing packaging material |
| CN201780057408.4A Pending CN109715392A (en) | 2016-10-03 | 2017-07-11 | The manufacturing method of packaging material |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410031564.5A Pending CN117885367A (en) | 2016-10-03 | 2017-07-11 | Method for producing packaging material |
| CN201780057408.4A Pending CN109715392A (en) | 2016-10-03 | 2017-07-11 | The manufacturing method of packaging material |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2018058230A (en) |
| CN (3) | CN116922805A (en) |
| WO (1) | WO2018066196A1 (en) |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS648036A (en) * | 1987-07-01 | 1989-01-12 | Nippon Foil Mfg | Thermally bondable laminate |
| JP2005053109A (en) * | 2003-08-05 | 2005-03-03 | Toyo Ink Mfg Co Ltd | Packaging material for blister pack and its manufacturing method |
| JP4957319B2 (en) * | 2006-03-27 | 2012-06-20 | 大日本印刷株式会社 | Decorative sheet for steel plate and decorative steel plate using the same |
| JP5287077B2 (en) * | 2007-09-28 | 2013-09-11 | 大日本印刷株式会社 | Decorative sheet for steel plate and decorative steel plate using the same |
| TWI501446B (en) * | 2010-09-08 | 2015-09-21 | Toppan Printing Co Ltd | Exterior material for lithium-ion battery |
| EP2980881B1 (en) * | 2013-03-25 | 2018-10-24 | Dai Nippon Printing Co., Ltd. | Battery packaging material |
| KR20140147041A (en) * | 2013-06-18 | 2014-12-29 | 주식회사 엘지화학 | Cell packing material and method for manufacturing the same |
| KR20160022815A (en) * | 2013-06-24 | 2016-03-02 | 다이니폰 인사츠 가부시키가이샤 | Resin composition |
| EP3043399B1 (en) * | 2013-09-03 | 2024-04-24 | Dai Nippon Printing Co., Ltd. | Resin composition for sealant layer of battery packaging material |
| CN109986855B (en) * | 2013-12-02 | 2020-12-29 | 大日本印刷株式会社 | Packaging material for battery |
| JP6287236B2 (en) * | 2014-01-16 | 2018-03-07 | 凸版印刷株式会社 | Power storage device exterior materials |
| US10396316B2 (en) * | 2015-03-25 | 2019-08-27 | Dai Nippon Printing Co., Ltd. | Cell packaging material and cell |
-
2016
- 2016-10-03 JP JP2016195469A patent/JP2018058230A/en active Pending
-
2017
- 2017-07-11 CN CN202310900825.8A patent/CN116922805A/en active Pending
- 2017-07-11 WO PCT/JP2017/025289 patent/WO2018066196A1/en active Application Filing
- 2017-07-11 CN CN202410031564.5A patent/CN117885367A/en active Pending
- 2017-07-11 CN CN201780057408.4A patent/CN109715392A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN117885367A (en) | 2024-04-16 |
| JP2018058230A (en) | 2018-04-12 |
| CN109715392A (en) | 2019-05-03 |
| WO2018066196A1 (en) | 2018-04-12 |
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