CN110858634B - Outer packaging material for power storage device, and power storage device - Google Patents
Outer packaging material for power storage device, and power storage device Download PDFInfo
- Publication number
- CN110858634B CN110858634B CN201910753066.0A CN201910753066A CN110858634B CN 110858634 B CN110858634 B CN 110858634B CN 201910753066 A CN201910753066 A CN 201910753066A CN 110858634 B CN110858634 B CN 110858634B
- Authority
- CN
- China
- Prior art keywords
- layer
- storage device
- adhesive
- heat
- power storage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000003860 storage Methods 0.000 title claims abstract description 77
- 239000005022 packaging material Substances 0.000 title claims description 13
- 239000003999 initiator Substances 0.000 claims abstract description 96
- 239000010410 layer Substances 0.000 claims abstract description 89
- 239000000853 adhesive Substances 0.000 claims abstract description 81
- 230000001070 adhesive effect Effects 0.000 claims abstract description 79
- 229920005989 resin Polymers 0.000 claims abstract description 78
- 239000011347 resin Substances 0.000 claims abstract description 78
- 230000031700 light absorption Effects 0.000 claims abstract description 59
- 239000012790 adhesive layer Substances 0.000 claims abstract description 45
- 239000011888 foil Substances 0.000 claims abstract description 45
- 239000000463 material Substances 0.000 claims abstract description 38
- 229910052751 metal Inorganic materials 0.000 claims abstract description 33
- 239000002184 metal Substances 0.000 claims abstract description 33
- 229920006015 heat resistant resin Polymers 0.000 claims abstract description 30
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 28
- 239000003505 polymerization initiator Substances 0.000 claims description 31
- 238000010538 cationic polymerization reaction Methods 0.000 claims description 10
- 239000007870 radical polymerization initiator Substances 0.000 claims description 9
- 238000010539 anionic addition polymerization reaction Methods 0.000 claims description 8
- 238000000016 photochemical curing Methods 0.000 claims description 6
- 238000012856 packing Methods 0.000 claims description 5
- 238000003475 lamination Methods 0.000 abstract description 11
- -1 isocyanate compound Chemical class 0.000 description 37
- 239000011342 resin composition Substances 0.000 description 26
- 239000011248 coating agent Substances 0.000 description 21
- 238000000576 coating method Methods 0.000 description 21
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 18
- 239000004925 Acrylic resin Substances 0.000 description 16
- 229910052782 aluminium Inorganic materials 0.000 description 15
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 15
- 239000006087 Silane Coupling Agent Substances 0.000 description 12
- 238000006243 chemical reaction Methods 0.000 description 12
- 239000000203 mixture Substances 0.000 description 12
- 239000000126 substance Substances 0.000 description 12
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 10
- 239000012965 benzophenone Substances 0.000 description 10
- 238000001723 curing Methods 0.000 description 10
- 239000000178 monomer Substances 0.000 description 10
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 9
- 238000000465 moulding Methods 0.000 description 9
- 238000007789 sealing Methods 0.000 description 9
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 8
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 8
- 230000001678 irradiating effect Effects 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 229920000178 Acrylic resin Polymers 0.000 description 7
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 7
- 239000004952 Polyamide Substances 0.000 description 7
- 238000001035 drying Methods 0.000 description 7
- 229910001416 lithium ion Inorganic materials 0.000 description 7
- 229920002647 polyamide Polymers 0.000 description 7
- 239000003990 capacitor Substances 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 230000001186 cumulative effect Effects 0.000 description 6
- 238000013007 heat curing Methods 0.000 description 6
- 150000003839 salts Chemical class 0.000 description 6
- YIKSHDNOAYSSPX-UHFFFAOYSA-N 1-propan-2-ylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C(C)C YIKSHDNOAYSSPX-UHFFFAOYSA-N 0.000 description 5
- 238000010030 laminating Methods 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 4
- 238000000862 absorption spectrum Methods 0.000 description 4
- 150000008065 acid anhydrides Chemical class 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 125000002091 cationic group Chemical group 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 229920001155 polypropylene Polymers 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- LWNGJAHMBMVCJR-UHFFFAOYSA-N (2,3,4,5,6-pentafluorophenoxy)boronic acid Chemical compound OB(O)OC1=C(F)C(F)=C(F)C(F)=C1F LWNGJAHMBMVCJR-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- 238000004378 air conditioning Methods 0.000 description 3
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000007739 conversion coating Methods 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N desyl alcohol Natural products C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 3
- 229920006284 nylon film Polymers 0.000 description 3
- 238000010526 radical polymerization reaction Methods 0.000 description 3
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 2
- QLZJUIZVJLSNDD-UHFFFAOYSA-N 2-(2-methylidenebutanoyloxy)ethyl 2-methylidenebutanoate Chemical compound CCC(=C)C(=O)OCCOC(=O)C(=C)CC QLZJUIZVJLSNDD-UHFFFAOYSA-N 0.000 description 2
- 229920001661 Chitosan Polymers 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical class [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- 230000010748 Photoabsorption Effects 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- BFGKITSFLPAWGI-UHFFFAOYSA-N chromium(3+) Chemical class [Cr+3] BFGKITSFLPAWGI-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 2
- 239000005042 ethylene-ethyl acrylate Substances 0.000 description 2
- 229920006225 ethylene-methyl acrylate Polymers 0.000 description 2
- 239000005043 ethylene-methyl acrylate Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 150000002222 fluorine compounds Chemical class 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical class I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- RMVRSNDYEFQCLF-UHFFFAOYSA-O phenylsulfanium Chemical compound [SH2+]C1=CC=CC=C1 RMVRSNDYEFQCLF-UHFFFAOYSA-O 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 238000010248 power generation Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 125000005409 triarylsulfonium group Chemical group 0.000 description 2
- LFRDHGNFBLIJIY-UHFFFAOYSA-N trimethoxy(prop-2-enyl)silane Chemical compound CO[Si](OC)(OC)CC=C LFRDHGNFBLIJIY-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- NJMCHQONLVUNAM-UHFFFAOYSA-N (2-nitrophenyl)methyl n-cyclohexylcarbamate Chemical compound [O-][N+](=O)C1=CC=CC=C1COC(=O)NC1CCCCC1 NJMCHQONLVUNAM-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- DZZAHLOABNWIFA-UHFFFAOYSA-N 2-butoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCCCC)C(=O)C1=CC=CC=C1 DZZAHLOABNWIFA-UHFFFAOYSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical class Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-N Hydrogen bromide Chemical class Br CPELXLSAUQHCOX-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- KLJLQTJYNGGTIU-FOWTUZBSSA-N [(e)-1-phenylethylideneamino] benzoate Chemical compound C=1C=CC=CC=1C(/C)=N/OC(=O)C1=CC=CC=C1 KLJLQTJYNGGTIU-FOWTUZBSSA-N 0.000 description 1
- ANCHPZQGZBCDBK-UHFFFAOYSA-N [PH2](O)=O.C1(=CC=CC=C1)C=1C(=C(C(=O)[Li])C(=CC1C)C)C Chemical compound [PH2](O)=O.C1(=CC=CC=C1)C=1C(=C(C(=O)[Li])C(=CC1C)C)C ANCHPZQGZBCDBK-UHFFFAOYSA-N 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000012663 cationic photopolymerization Methods 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- AUELWJRRASQDKI-UHFFFAOYSA-N cyclohexyl carbamate Chemical compound NC(=O)OC1CCCCC1 AUELWJRRASQDKI-UHFFFAOYSA-N 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000012954 diazonium Substances 0.000 description 1
- 150000001989 diazonium salts Chemical class 0.000 description 1
- OZLBDYMWFAHSOQ-UHFFFAOYSA-N diphenyliodanium Chemical compound C=1C=CC=CC=1[I+]C1=CC=CC=C1 OZLBDYMWFAHSOQ-UHFFFAOYSA-N 0.000 description 1
- LTYMSROWYAPPGB-UHFFFAOYSA-O diphenylsulfanium Chemical compound C=1C=CC=CC=1[SH+]C1=CC=CC=C1 LTYMSROWYAPPGB-UHFFFAOYSA-O 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- VKLYZBPBDRELST-UHFFFAOYSA-N ethene;methyl 2-methylprop-2-enoate Chemical compound C=C.COC(=O)C(C)=C VKLYZBPBDRELST-UHFFFAOYSA-N 0.000 description 1
- HGVPOWOAHALJHA-UHFFFAOYSA-N ethene;methyl prop-2-enoate Chemical compound C=C.COC(=O)C=C HGVPOWOAHALJHA-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- JEBJWDVJFHBDTC-UHFFFAOYSA-M lithium phenyl-(2,4,6-trimethylphenyl)phosphinate Chemical compound [Li+].CC1=CC(C)=CC(C)=C1P([O-])(=O)C1=CC=CC=C1 JEBJWDVJFHBDTC-UHFFFAOYSA-M 0.000 description 1
- JUYQFRXNMVWASF-UHFFFAOYSA-M lithium;phenyl-(2,4,6-trimethylbenzoyl)phosphinate Chemical compound [Li+].CC1=CC(C)=CC(C)=C1C(=O)P([O-])(=O)C1=CC=CC=C1 JUYQFRXNMVWASF-UHFFFAOYSA-M 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- HYIMSNHJOBLJNT-UHFFFAOYSA-N nifedipine Chemical compound COC(=O)C1=C(C)NC(C)=C(C(=O)OC)C1C1=CC=CC=C1[N+]([O-])=O HYIMSNHJOBLJNT-UHFFFAOYSA-N 0.000 description 1
- 229960001597 nifedipine Drugs 0.000 description 1
- 229910052755 nonmetal Chemical class 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical compound C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 description 1
- 239000012953 triphenylsulfonium Substances 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/10—Primary casings; Jackets or wrappings
- H01M50/116—Primary casings; Jackets or wrappings characterised by the material
- H01M50/124—Primary casings; Jackets or wrappings characterised by the material having a layered structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/052—Li-accumulators
- H01M10/0525—Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/10—Primary casings; Jackets or wrappings
- H01M50/116—Primary casings; Jackets or wrappings characterised by the material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Sealing Battery Cases Or Jackets (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention relates to an exterior material for an electric storage device and an electric storage device. The following constitution is adopted: the heat-resistant adhesive comprises a heat-resistant resin layer as an outer layer, a heat-fusible resin layer as an inner layer, and a metal foil layer disposed between the two layers, wherein the metal foil layer (4) and the heat-resistant resin layer (2) are bonded via an outer adhesive layer (5), the metal foil layer and the heat-fusible resin layer (3) are bonded via an inner adhesive layer (6), at least one of the outer adhesive layer and the inner adhesive layer is formed of a photo-curable resin adhesive containing a main agent and at least 2 photopolymerization initiators, and part or all of the light absorption wavelength band of one photopolymerization initiator has a wavelength region that does not overlap with the light absorption wavelength band of the other photopolymerization initiator. An exterior material for an electric storage device which has excellent productivity, does not overflow an adhesive, and can obtain sufficient high-temperature lamination strength can be provided.
Description
Technical Field
The present invention relates to an exterior material for a battery or a capacitor (capacitor) used in a portable device such as a smart phone or a tablet pc, and an electrical storage device such as a battery or a capacitor used in a hybrid vehicle, an electric vehicle, wind power generation, solar power generation, or night power storage.
In the claims and the specification of the present application, the term "light" is used in the sense of including not only visible light and ultraviolet light but also X-rays.
In the claims and the specification of the present application, the term "photopolymerization initiator" means a compound that generates any one of radicals, cations, and anions by light irradiation.
In the claims and the specification of the present application, the term "phosphoric acid-containing (meth) acrylate" means "phosphoric acid-containing acrylate or/and phosphoric acid-containing methacrylate".
Background
Lithium ion secondary batteries are widely used as power sources for, for example, notebook computers, video cameras, cellular phones, and electric vehicles. As the lithium ion secondary battery, a battery is used in which a battery body (body including a positive electrode, a negative electrode, and an electrolyte) is surrounded by a case. As a material (outer packaging material) for the case, a material is known in which an outer layer formed of a heat-resistant resin film, an aluminum foil layer, and an inner layer formed of a thermoplastic resin film are bonded and integrated in this order.
For example, the following packaging materials are known: the packaging material is a laminated packaging material comprising an inner layer formed of a resin film, a first adhesive layer, a metal layer, a second adhesive layer, and an outer layer formed of a resin film, wherein at least one of the first adhesive layer and the second adhesive layer is formed of an adhesive composition containing a resin having an active hydrogen group in a side chain, a polyfunctional isocyanate compound, and a polyfunctional amine compound as essential components (patent document 1).
However, in the technique described in patent document 1, since heat curing (heat curing) at 50 ℃ for 7 days is required to obtain the desired adhesive strength as an adhesive, there is a problem of poor productivity and a problem of a large-scale apparatus for performing heat curing. Further, since a solvent is used, if the drying is insufficient, the solvent is liable to remain, and it is difficult to obtain a sufficient adhesive force.
Therefore, as a technique for solving the above-described problems of productivity and the like, a technique is known in which a UV curable resin adhesive is used, thereby greatly shortening the curing time and eliminating the need for designing a heat curing step.
Patent document 1: japanese patent laid-open No. 2008-287971
Disclosure of Invention
Problems to be solved by the invention
However, in the latter technique using a UV curable resin adhesive, the adhesive is dissolved in a solvent and applied in order to form a uniform adhesive layer, and thus a drying step for volatilizing the solvent after the application of the adhesive is required. In addition, there is also a problem that when the resin film is attached to the application surface of the adhesive, the adhesive (photo-curable resin adhesive) is liable to overflow due to receiving pressure from a roller or the like.
The present invention has been made in view of the above-described technical background, and an object thereof is to provide an exterior material for an electric storage device and an exterior case for an electric storage device, which are excellent in productivity, free from adhesive overflow, and capable of obtaining sufficient high-temperature lamination strength. Further, it is an object of the present invention to provide a power storage device that is externally packed with the above-described external packing material and/or external packing case.
Means for solving the problems
In order to achieve the above object, the present invention provides the following means.
[1] An exterior material for a power storage device, comprising a heat-resistant resin layer as an outer layer, a heat-fusible resin layer as an inner layer, and a metal foil layer disposed between the two layers,
the metal foil layer and the heat-resistant resin layer are bonded via an outer adhesive layer, the metal foil layer and the heat-fusible resin layer are bonded via an inner adhesive layer,
the adhesive layer of at least one of the outer adhesive layer and the inner adhesive layer is formed of a photo-curable resin adhesive containing a main agent and at least 2 photo-polymerization initiators,
of the 2 types of photopolymerization initiators, part or all of the light absorption band of one photopolymerization initiator has a wavelength region that does not overlap with the light absorption band of the other photopolymerization initiator.
[2] The exterior material for a power storage device according to the aforementioned item 1, wherein the content of one of the 2 photopolymerization initiators in the photocurable resin adhesive is 0.2 to 3 mass%.
[3] The exterior material for a power storage device according to the above 2, wherein the content of the other one of the 2 photopolymerization initiators in the photocurable resin adhesive is 9 to 20% by mass.
[4] The exterior material for a power storage device according to any one of the above 1 to 3, wherein among the 2 types of photopolymerization initiators, a peak value of a light absorption wavelength of one type of photopolymerization initiator is in a range of 200nm or more and less than 300nm, and a peak value of a light absorption wavelength of the other type of photopolymerization initiator is in a range of 300nm or more and 400nm or less.
[5] The outer packaging material for an electrical storage device according to any one of the preceding claims 1 to 4, wherein,
the photo-curing resin adhesive contains more than 2 main agents,
of the 2 types of photopolymerization initiators, one type of photopolymerization initiator (X) and the other type of photopolymerization initiator (Y) are any one of the following combinations of 3 types, namely, the first type to the third type:
first..(X) is an anionic polymerization initiator/(Y) is a radical polymerization initiator
The second type (X) is an anionic polymerization initiator/(Y) is a cationic polymerization initiator
third..(X) is a cationic polymerization initiator/(Y) is a radical polymerization initiator.
[6] An exterior case for a power storage device, which is formed from the molded body of the exterior material according to any one of the foregoing items 1 to 5.
[7] The power storage device is characterized by comprising:
a power storage device main body portion; and
an outer package member formed of the outer package material according to any one of the preceding claims 1 to 5 and/or the outer package case according to claim 6,
the power storage device main body is externally packed with the outer packing member.
[8] The method for producing an exterior material for an electrical storage device is characterized by comprising the following steps:
a step of coating a photocurable resin composition containing a main agent and at least 2 photopolymerization initiators on one surface of a metal foil;
a step of irradiating light from the coating side of the metal foil;
a step of laminating a resin film on the coated surface after the irradiation with light to obtain a laminate; and
a step of irradiating the laminate with light from the resin film side,
of the 2 types of photopolymerization initiators, part or all of the light absorption band of one photopolymerization initiator has a wavelength region that does not overlap with the light absorption band of the other photopolymerization initiator.
[9] The method for producing an exterior material for an electrical storage device is characterized by comprising the following steps:
a first coating step of coating a photocurable resin composition containing a main agent and at least 2 photopolymerization initiators on one surface of a metal foil;
a step of irradiating light from the coating side of the metal foil;
a step of laminating a first resin film on the coated surface after the light irradiation to obtain a first laminate; and
a step of irradiating the first laminate with light from the first resin film side, and comprising the steps of:
a second coating step of coating a photocurable resin composition containing a main agent and at least 2 photopolymerization initiators on the other surface of the metal foil of the first laminate after the irradiation with light;
a step of irradiating light from the coating side of the first laminate;
a step of laminating a second resin film on the coated surface of the first laminate after the light irradiation to obtain a second laminate;
a step of irradiating the second laminate with light from the second resin film side,
of the 2 types of photopolymerization initiators in the first coating step, part or all of the light absorption band of one of the photopolymerization initiators has a wavelength region that does not overlap with the light absorption band of the other of the photopolymerization initiators,
Among the 2 types of photopolymerization initiators in the second coating step, part or all of the light absorption band of one of the photopolymerization initiators has a wavelength region that does not overlap with the light absorption band of the other of the photopolymerization initiators.
Effects of the invention
[1] In the invention, the following constitution is adopted: at least one of the outer adhesive layer and the inner adhesive layer is formed of a photo-curable resin adhesive containing a main agent and at least 2 photo-polymerization initiators, and among the 2 photo-polymerization initiators, a part or all of the photo-absorption band of one photo-polymerization initiator has a wavelength region that does not overlap with the photo-absorption band of the other photo-polymerization initiator, and the adhesive is formed by stepwise photo-curing the adhesive to form a photo-curable resin adhesive layer, so that the viscosity of the adhesive can be changed by the steps thereof, and therefore, for example, an exterior material for an electric storage device can be provided that does not overflow the adhesive when the outer layer or the inner layer is bonded (laminated) to the adhesive (layer) that has been subjected to the first light irradiation, and that can obtain sufficient lamination strength after bonding. In addition, the coating can be performed under the solvent-free condition, and the adhesive performance is not reduced due to the residual solvent.
[2] In the invention of (2), the content of one of the above-mentioned 2 photopolymerization initiators in the above-mentioned photocurable resin adhesive is in the range of 0.2 to 3 mass%, and by first irradiating the photopolymerization initiator having such a low content with light including a part or all of a wavelength region which does not overlap with the light absorption band of the other photopolymerization initiator, a part of the main agent is polymerized to have a moderate viscosity (gel) and even when receiving pressure from a roll or the like at the time of attaching a resin film, the adhesive (photocurable resin adhesive) does not overflow, and an adhesive layer having a uniform thickness can be formed.
[3] In the present invention, since the content of the other photopolymerization initiator in the photocurable resin adhesive is in the range of 9 to 20 mass%, the resin adhesive can be sufficiently cured by subsequent light irradiation, and thus sufficient adhesive strength can be ensured.
[4] In the present invention, since 200nm to 400nm are in the ultraviolet light range, curing reaction (photopolymerization reaction) by visible light does not occur, and therefore, it is possible to easily gel light in one wavelength range, sufficiently cure light in the other wavelength range, and secure sufficient adhesive strength without overflowing of an adhesive (photocurable resin adhesive).
[5] In the present invention, since the composition is composed of a combination of different polymerization systems (for example, a cationic polymerization initiator and a main agent/radical polymerization initiator and a main agent), only one of the polymerization initiators (for example, radical system) reacts with the main agent (for example, radical system), and therefore, by first irradiating light having a light absorption wavelength including one of the polymerization initiators (and light having a wavelength range that does not overlap with the light absorption wavelength band of the other of the polymerization initiators), a part of the main agent is polymerized to have a proper viscosity (gel), and even when receiving pressure from a roll or the like at the time of attaching a resin film, an adhesive (photocurable resin adhesive) is not overflowed, and an adhesive layer having a uniform thickness can be formed. Since the main agent (for example, a cationic system) of the polymerization system reacts by irradiation with light of the other polymerization initiator (for example, a cationic system), the main agents can be polymerized separately, and the adhesive can be made to have a desired hardness in each step by using the mixing ratio thereof.
[6] In the invention, the outer case for the power storage device can be provided which has excellent productivity, does not overflow the adhesive, and can obtain sufficient lamination strength.
[7] In the present invention, an electric storage device can be provided in which the electric storage device is externally coated with an outer coating material for an electric storage device, which has excellent productivity, does not overflow an adhesive, and can obtain sufficient lamination strength.
[8] In the present invention, at least one adhesive layer (inner adhesive layer or outer adhesive layer) can be formed by light irradiation, and a curing step is not required, so that productivity can be improved. Further, since the pre-curing of the photocurable resin composition is performed before the resin films are laminated, the composition has a moderate viscosity (gel), and therefore, even when the pressure from a roll or the like is applied during the lamination of the resin films, the adhesive (photocurable resin adhesive) does not overflow. In addition, by performing the photo-curing in 2 stages as described above, the curing strain is also relaxed, and as a result, the adhesive strength is also improved. That is, it is possible to produce an exterior material for a power storage device that has excellent productivity, does not overflow an adhesive, and can obtain sufficient high-temperature lamination strength.
[9] In the present invention, since the inner adhesive layer and the outer adhesive layer can be formed by light irradiation, productivity can be further improved, and an outer package material for an electric storage device can be produced which can obtain sufficient high-temperature lamination strength without adhesive overflow.
Drawings
Fig. 1 is a cross-sectional view showing an embodiment of an exterior material for an electric storage device according to the present invention.
Fig. 2 is a cross-sectional view showing an embodiment of the power storage device of the invention.
Fig. 3 is a perspective view showing an outer package material (a planar object), a power storage device main body, and an outer package case (a molded body molded into a three-dimensional shape) constituting the power storage device of fig. 2 in a separated state before heat sealing.
Fig. 4 is a diagram showing an example of the correlation between the light absorption spectrum of 2 photopolymerization initiators and the wavelength of the first irradiation light and the wavelength of the second irradiation light.
Fig. 5 is a diagram showing another example of the above-described correlation.
Fig. 6 is a diagram showing another example of the above-described correlation.
Fig. 7 is a diagram showing another example of the above-described correlation.
Description of the reference numerals
Outer packaging material for power storage device
Heat resistant resin layer (outer layer)
Third, heat-fusible resin layer (inner layer)
Metal foil layer
Outside adhesive layer
Inner adhesive layer
External packing case (formed case)
Outer packaging member
Power storage device
Power storage device main body
Detailed Description
Fig. 1 shows an embodiment of an outer package 1 for an electric storage device according to the present invention. The outer package 1 is used as an outer package for a battery such as a lithium ion secondary battery. The outer package 1 may be used as the outer package 1 without molding (see fig. 3), or may be used as the molded case 10 by molding such as deep drawing, bulging, or the like (see fig. 3).
The outer package 1 for the power storage device has the following structure: the heat-resistant resin layer (outer layer) 2 is laminated and integrated on one surface (upper surface) of the metal foil layer 4 via an outer adhesive layer (first adhesive layer) 5, and the heat-fusible resin layer (inner layer) 3 is laminated and integrated on the other surface (lower surface) of the metal foil layer 4 via an inner adhesive layer (second adhesive layer) 6 (see fig. 1).
In the present invention, the outer layer 2 is formed of a heat-resistant resin layer. As the heat-resistant resin constituting the heat-resistant resin layer 2, a heat-resistant resin which does not melt at the heat-sealing temperature at the time of heat-sealing the outer packaging material 1 is used. The heat-resistant resin is preferably a heat-resistant resin having a melting point higher than the melting point of the heat-fusible resin constituting the heat-fusible resin layer 3 by at least 10 ℃, and particularly preferably a heat-resistant resin having a melting point higher than the melting point of the heat-fusible resin by at least 20 ℃.
The heat-resistant resin layer (outer layer) 2 is a member mainly responsible for ensuring good formability as the outer package material 1, that is, it mainly plays a role of preventing breakage of the aluminum foil due to necking at the time of forming.
The heat-resistant resin layer (outer layer) 2 is not particularly limited, and examples thereof include a stretched polyamide film such as a stretched nylon film, a stretched polyester film, and the like. Among them, as the heat-resistant resin layer 2, a biaxially stretched polyamide film such as a biaxially stretched nylon film, a biaxially stretched polybutylene terephthalate (PBT) film, a biaxially stretched polyethylene terephthalate (PET) film, or a biaxially stretched polyethylene naphthalate (PEN) film, each having a hot water shrinkage of 1.5% to 12%, is particularly preferably used. Further, as the heat-resistant resin layer 2, a heat-resistant resin biaxially stretched film stretched by a simultaneous biaxial stretching method is preferably used. The nylon is not particularly limited, and examples thereof include nylon 6, and nylon MXD. The heat-resistant resin film layer 2 may be formed of a single layer (single stretched film), or may be formed of, for example, a plurality of layers including a stretched polyester film/a stretched polyamide film (a plurality of layers including a stretched PET film/a stretched nylon film, or the like).
The thickness of the heat-resistant resin layer 2 is preferably 10 μm to 25. Mu.m. By setting the lower limit value or more, a sufficient strength as an outer package material can be ensured, and by setting the upper limit value or less, stress at the time of bulge forming and at the time of drawing forming can be reduced, and formability can be further improved.
In the present invention, the metal foil layer 4 plays a role of imparting gas barrier properties (preventing invasion of oxygen and moisture) to the outer package 1. The metal foil layer 4 is not particularly limited, and examples thereof include aluminum foil, copper foil, and iron foil, and aluminum foil is generally used. The thickness of the metal foil layer 4 is preferably 10 μm to 80 μm. By setting the thickness to 10 μm or more, pinholes can be prevented from being generated during rolling in the production of a metal foil, and by setting the thickness to 80 μm or less, stress during molding such as bulge molding and drawing can be reduced, and moldability can be improved. Among them, the thickness of the metal foil layer 4 is particularly preferably 10 μm to 40 μm.
In the metal foil layer 4, it is preferable that at least the inner surface (inner pressure-sensitive adhesive layer 6 side surface) is subjected to a chemical conversion treatment. By performing such chemical conversion treatment, corrosion of the metal foil surface due to the content (electrolyte of the battery or the like) can be sufficiently prevented. For example, the metal foil is subjected to a chemical conversion treatment by performing the following treatment. That is, for example, the surface of the metal foil after degreasing is coated with an aqueous solution of any one of the following 1) to 3), and then dried, and then subjected to chemical conversion treatment:
1) Comprising phosphoric acid;
chromic acid; a kind of electronic device with high-pressure air-conditioning system
An aqueous solution of a mixture of at least one compound selected from the group consisting of a metal salt of a fluoride and a non-metal salt of a fluoride,
2) Comprising phosphoric acid;
at least 1 resin selected from the group consisting of acrylic resins, chitosan derivative resins, and phenolic resins; a kind of electronic device with high-pressure air-conditioning system
An aqueous solution of a mixture of at least one compound selected from the group consisting of chromic acid and chromium (III) salts,
3) Comprising phosphoric acid;
at least 1 resin selected from the group consisting of acrylic resins, chitosan derivative resins, and phenolic resins;
at least one compound selected from the group consisting of chromic acid and chromium (III) salts; a kind of electronic device with high-pressure air-conditioning system
An aqueous solution of a mixture of at least one compound selected from the group consisting of metal salts of fluorides and nonmetallic salts of fluorides.
The chemical conversion coating preferably has a chromium deposit amount (per one surface) of 0.1mg/m 2 ～50mg/m 2 Particularly preferably 2mg/m 2 ～20mg/m 2 。
The heat-fusible resin layer (inner layer) 3 plays the following roles: the electrolyte solution and the like having high corrosiveness used in lithium ion secondary batteries and the like are provided with excellent chemical resistance, and heat sealability is provided to the outer packaging material.
The resin constituting the heat-fusible resin layer 3 is not particularly limited, and examples thereof include polyethylene, polypropylene, ionomer, ethylene Ethyl Acrylate (EEA), ethylene methyl acrylate (EAA), ethylene methyl methacrylate resin (EMMA), ethylene-vinyl acetate copolymer resin (EVA), maleic anhydride-modified polypropylene, and maleic anhydride-modified polyethylene.
The thickness of the heat-fusible resin layer 3 is preferably 10 μm to 100 μm. By setting the thickness to 10 μm or more, sufficient heat seal strength can be ensured, and by setting the thickness to 100 μm or less, film formation and weight reduction can be facilitated. Among them, the thickness of the heat-fusible resin layer 3 is more preferably set to 10 μm to 80 μm. The heat-fusible resin layer 3 is preferably formed of a heat-fusible resin unstretched film layer, and the heat-fusible resin layer 3 may be a single layer or a plurality of layers.
In the present invention, at least one of the outer adhesive layer 5 and the inner adhesive layer 6 is formed of a photocurable resin adhesive (cured film of a photocurable resin composition). As the above-mentioned photocurable resin adhesive, a photocurable resin adhesive containing a main agent and at least 2 photopolymerization initiators can be used. Of the above 2 types of photopolymerization initiators, part or all of the light absorption band of one photopolymerization initiator has a wavelength region that does not overlap with the light absorption band of the other photopolymerization initiator.
The main agent is not particularly limited, and examples thereof include an acrylate resin, a vinyl ether resin, and an epoxy resin. The acrylic resin is not particularly limited, and for example, at least 1 resin selected from the group consisting of urethane acrylic resins, epoxy acrylic resins, and polyester acrylic resins is preferably used. The viscosity (25 ℃) of the main agent before curing is preferably 500 to 10000cP. The viscosity (25 ℃) was measured by using a digital viscometer DV-E manufactured by Ying Hongjing Co., ltd.) according to JISZ 8803-2011. The content of the main agent in the photocurable resin adhesive is preferably 70 to 90 mass%, and in this case, the adhesive strength can be further improved.
The absolute value of the difference between the peak value of the light absorption wavelength of one photopolymerization initiator and the peak value of the light absorption wavelength of the other photopolymerization initiator is preferably 50nm or more, more preferably 100nm or more, as the above 2 photopolymerization initiators (2 photopolymerization initiators satisfying the following relationship: part or all of the light absorption band of one photopolymerization initiator has a wavelength region that does not overlap with the light absorption band of the other photopolymerization initiator).
The above-mentioned 2 photopolymerization initiators (2 photopolymerization initiators satisfying the following relationship: part or all of the light absorption band of one photopolymerization initiator has a wavelength region that does not overlap with the light absorption band of the other photopolymerization initiator) are preferably used: the peak value of the light absorption wavelength of the photopolymerization initiator is in the range of 200nm or more and less than 300nm, and the peak value of the light absorption wavelength of the other photopolymerization initiator is in the range of 300nm or more and 400nm or less. In this case, since 200nm to 400nm are in the ultraviolet light region, curing reaction (photopolymerization reaction) by visible light does not occur, and therefore gelation can be easily performed by light in one wavelength range, sufficient curing can be performed by light in the other wavelength range, and sufficient adhesive strength can be ensured without overflow of an adhesive (photocurable resin adhesive). In this case, the absolute value of the difference between the peak value of the light absorption wavelength of one photopolymerization initiator and the peak value of the light absorption wavelength of the other photopolymerization initiator is preferably 50nm to 150nm.
The photopolymerization initiator is not particularly limited, and examples thereof include radical polymerization initiators, cationic polymerization initiators, and anionic polymerization initiators. The radical polymerization initiator is not particularly limited, and examples thereof include benzophenone, benzoin alkyl ether (benzoin diethyl ether, benzoin butyl ether, etc.), and benzildimethyl ketal.
The cationic polymerization initiator is not particularly limited, and examples thereof include onium salts and the like. The onium salts are not particularly limited, and examples thereof include sulfonium salts, iodonium salts, bromonium salts, diazonium salts, and chloronium salts.
Examples of the sulfonium salt include, but are not particularly limited to, triphenylsulfonium hexafluorophosphate, triphenylsulfonium hexafluoroantimonate, triphenylsulfonium tetrakis (pentafluorophenyl) borate, 4 '-bis [ diphenylsulfonium ] diphenylsulfide-bis hexafluorophosphate, 4' -bis [ di (. Beta. -hydroxyethoxy) phenylsulfonium ] diphenylsulfide-bis hexafluoroantimonate, 4 '-bis [ di (. Beta. -hydroxyethoxy) phenylsulfonium ] diphenylsulfide-bis hexafluorophosphate, 7- [ bis (p-methylphenyl) sulfonium ] -2-isopropylthioxanthone hexafluoroantimonate, 7- [ bis (p-methylphenyl) sulfonium ] -2-isopropylthioxanthone tetrakis (pentafluorophenyl) borate, 4-phenylcarbonyl-4' -diphenylsulfonium-diphenylsulfide-hexafluorophosphate, 4- (p-tert-butylphenylcarbonyl) -4 '-diphenylsulfonium-diphenylsulfide-hexafluoroantimonate, 4- (p-tert-butylphenylcarbonyl) -4' -di (p-methylphenyl) thioxanthone tetrakis (pentafluorophenyl) sulfide-triphenylsulfonium bromide, and the like. Examples of the iodonium salt include, but are not particularly limited to, diphenyliodonium tetrakis (pentafluorophenyl) borate, diphenyliodonium hexafluorophosphate, diphenyliodonium hexafluoroantimonate, bis (4-nonylphenyl) iodonium hexafluorophosphate, and the like.
The anionic polymerization initiator is not particularly limited, and examples thereof include acetophenone-o-benzoyl oxime, 1, 2-bis (4-methoxyphenyl) -2-oxoethyl ester of cyclohexylcarbamate, nifedipine, 2-nitrobenzyl cyclohexylcarbamate, and 1,5, 7-triazabicyclo [4.4.0] -5-decenyl 2- (9-oxoxanthen-2-yl) propionate.
The photocurable resin adhesive preferably contains 1 or 2 or more compounds selected from the group consisting of a silane coupling agent, an acid anhydride and a (meth) acrylate containing phosphoric acid, in addition to the main agent and the photopolymerization initiator. In this case, the bonding force (adhesive strength) between the metal foil 4 and the resin films 2 and 3 can be improved.
The silane coupling agent is not particularly limited, and examples thereof include methyltrimethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, allyltrimethoxysilane, and 3- (methacryloyloxy) propyltrimethoxysilane. Among them, as the silane coupling agent, a silane coupling agent having a carbon-carbon double bond such as vinyltriethoxysilane or allyltrimethoxysilane is preferably used, and in this case, in particular, the bonding with an adhesive by radical polymerization can be enhanced (the adhesive strength of the adhesive layers 5 and 6 can be improved).
The acid anhydride is not particularly limited, and examples thereof include maleic anhydride, methyl maleic anhydride, itaconic anhydride, humic anhydride, methyl humic anhydride, and the like. Among them, an acid anhydride having a carbon-carbon double bond such as maleic anhydride is preferably used, and the radical polymerization reaction can be further promoted by using the acid anhydride having a double bond.
The phosphoric acid-containing (meth) acrylate (monomer) is not particularly limited, and examples thereof include monomers such as acryloyloxyethyl acid phosphate and bis (2- (meth) acryloyloxyethyl) acid phosphate.
The thickness of the outer adhesive layer 5 and the inner adhesive layer 6 (thickness after drying) is preferably set to 1 μm to 6 μm.
By molding (deep drawing, bulging, etc.) the exterior material 1 for a power storage device of the present invention, an exterior case 10 for a power storage device can be obtained (see fig. 3). The outer package 1 of the present invention may be used as it is without being molded (see fig. 3).
Fig. 2 shows an embodiment of an electric storage device 30 configured using the outer package 1 of the present invention. The power storage device 30 is a lithium ion secondary battery. In the present embodiment, as shown in fig. 2 and 3, the outer package member 15 is composed of the case 10 obtained by molding the outer package 1, and the planar outer package 1 which is not subjected to molding. Further, the power storage device 30 of the present invention is configured by housing a power storage device main body portion (electrochemical element or the like) 31 having a substantially rectangular parallelepiped shape in a housing recess of a molded case 10 obtained by molding the outer package 1 of the present invention, disposing the outer package 1 of the present invention above the power storage device main body portion 31 so that the inner layer 3 side thereof is the inner side (lower side), and sealing the peripheral edge portion of the inner layer 3 of the planar outer package 1 and the inner layer 3 of a flange portion (sealing peripheral edge portion) 29 of the outer package case 10 by heat sealing through sealing (see fig. 2 and 3). The surface of the outer case 10 inside the housing recess is an inner layer (heat-fusible resin layer) 3, and the outer surface of the housing recess is an outer layer (heat-resistant resin layer) 2 (see fig. 3).
In fig. 2, 39 is a heat seal portion formed by joining (welding) a peripheral edge portion of the outer package 1 and a flange portion (sealing peripheral edge portion) 29 of the outer package case 10. In the power storage device 30, the tip portion of the tab connected to the power storage device main body 31 is led out of the outer package member 15, which is not shown in the drawings.
The power storage device main body 31 is not particularly limited, and examples thereof include a battery main body, a capacitor main body, and a capacitor main body.
The width of the heat seal portion 39 is preferably set to 0.5mm or more. When the thickness is 0.5mm or more, sealing can be performed reliably. The width of the heat seal portion 39 is preferably set to 3mm to 15mm.
In the above embodiment, the outer package member 15 is formed of the outer package case 10 obtained by molding the outer package material 1 and the planar outer package material 1 (see fig. 2 and 3), but the outer package member 15 is not particularly limited to such a combination, and may be formed of a pair of outer package materials 1, or may be formed of a pair of outer package cases 10, for example.
Next, a preferred example of the method for producing the outer package material 1 for a power storage device according to the present invention will be described. First, the photocurable resin composition containing a main agent and at least 2 photopolymerization initiators (wherein the 2 photopolymerization initiators are constituted such that part or all of the light absorption band of one photopolymerization initiator has a wavelength region which does not overlap with the light absorption band of the other photopolymerization initiator) is applied to one surface of the metal foil 4. Next, the metal foil 4 is irradiated with light from the composition-coated side. In this case, it is preferable to irradiate light of a wavelength which is "non-overlapping with the light absorption band of the other photopolymerization initiator" in the light absorption band of one photopolymerization initiator. Then, the heat-resistant resin film 2 was laminated on the composition-coated surface after the light irradiation to obtain a first laminate. Next, the first laminate is irradiated with light from the side of the heat-resistant resin film 2, and the photocurable resin composition is sufficiently cured to form the outer adhesive layer 5. In this case, it is preferable to irradiate light including light having a wavelength of a part of the light absorption band of the other photopolymerization initiator.
Next, a photocurable resin composition containing a main agent and at least 2 photopolymerization initiators (wherein the 2 photopolymerization initiators are constituted such that part or all of the light absorption band of one photopolymerization initiator has a wavelength region which does not overlap with the light absorption band of the other photopolymerization initiator) is applied to the other surface of the metal foil of the first laminate after the light irradiation, and then the first laminate is irradiated with light from the composition application side thereof. In this case, it is preferable to irradiate light of a wavelength which is "non-overlapping with the light absorption band of the other photopolymerization initiator" in the light absorption band of one photopolymerization initiator. Then, the heat-fusible resin film 3 was laminated on the composition-coated surface after the light irradiation to obtain a second laminate. Then, the second laminate is irradiated with light from the side of the heat-fusible resin film 3, and the photocurable resin composition is sufficiently cured to form the inner adhesive layer 6. In this case, it is preferable to irradiate light including light having a wavelength of a part of the light absorption band of the other photopolymerization initiator.
The light is not particularly limited, and examples thereof include ultraviolet light, visible light, and X-ray.
In the manufacturing method according to the above embodiment, the order of first laminating the heat-resistant resin film 2 and then laminating the heat-fusible resin film 3 is adopted, but the order may be reversed. That is, the heat-fusible resin film 3 may be laminated first, and then the heat-resistant resin film 2 may be laminated.
In the above production method, the content of one of the 2 photopolymerization initiators in the photocurable resin composition is preferably in the range of 0.2 to 3 mass%. In the above range, light having a wavelength "not overlapping with the light absorption band of the other photopolymerization initiator" in the light absorption band of the photopolymerization initiator having a low content is first irradiated, so that a part of the main agent is polymerized to have a proper viscosity (gel), and even if pressure from a roll or the like at the time of attaching the resin film is received in the subsequent step, no adhesive (photocurable resin adhesive) overflows.
The content of the other one of the 2 photopolymerization initiators in the photocurable resin composition is preferably in the range of 9 to 20 mass%. In the above range, the light irradiation (irradiation of light including light having a wavelength of a part of the light absorption band of the other photopolymerization initiator) in the subsequent step can sufficiently perform the photocuring, and thus a sufficient adhesive strength can be ensured.
The photocurable resin composition preferably has the following composition: the composition contains 2 or more main agents having different polymerization systems (for example, one is a radical polymerization system and the other is a cationic polymerization system), and one of the 2 photopolymerization initiators (X) and the other photopolymerization initiator (Y) is any one of the following combinations of 3 types, namely, the first type to the third type:
(X) is an anionic polymerization initiator/(Y) is a radical polymerization initiator;
(X) is an anionic polymerization initiator/(Y) is a cationic polymerization initiator; and
third..(X) is a cationic polymerization initiator/(Y) is a radical polymerization initiator. In this case, since only the main agent (for example, radical system) of one polymerization initiator (for example, radical system) is polymerized, light of a wavelength "not overlapping with the light absorption band of the other photopolymerization initiator" in the light absorption band of one polymerization initiator is first irradiated, and a part of the main agent is polymerized to have a proper viscosity (gel), so that even when receiving pressure from a roll or the like at the time of attaching a resin film, the adhesive agent (photocurable resin adhesive agent) does not overflow, and an adhesive layer having a uniform thickness can be formed. The polymerization-based main agent (for example, a cationic system) is polymerized by irradiation of light (irradiation of light including light having a wavelength of a part of the light absorption band of the other photopolymerization initiator) to the other polymerization initiator (for example, a cationic system), and therefore, sufficient photocuring can be performed, and sufficient adhesive strength can be ensured.
Examples of correlations between the light absorption spectra of the 2 photopolymerization initiators, the wavelength of the first irradiation light, and the wavelength of the second irradiation light in the present invention are shown in fig. 4 to 7. In the examples of fig. 4 to 6, the photopolymerization initiator a has a "non-overlapping wavelength region" with the light absorption band of the other photopolymerization initiator B in a part (low wavelength side) of the light absorption band. The first irradiation light irradiates light of a part of the wavelength bands in the "non-overlapping wavelength region". In addition, as the second irradiation light, light having a wavelength close to the peak wavelength of the light absorption spectrum of the photopolymerization initiator B is irradiated.
In the example of fig. 7, each of the photopolymerization initiators A, B has 2 light absorption peaks, and the photopolymerization initiator B has a "non-overlapping wavelength region" with the light absorption band of the other photopolymerization initiator a in a part (high wavelength side) of the light absorption band. The first irradiation light irradiates light of a part of the wavelength bands in the "non-overlapping wavelength region". Further, as the second irradiation light, light having a wavelength close to the peak wavelength on the low wavelength side (and a wavelength deviated from the light absorption band of the photopolymerization initiator B to the low wavelength side) among the 2 peak wavelengths of the light absorption spectrum of the photopolymerization initiator B is irradiated (see fig. 7).
In fig. 4 to 7, the second irradiation light may be the "first irradiation light" and the first irradiation light may be the "second irradiation light", so that the same effects as those described above can be obtained. The examples shown in fig. 4 to 7 show only one example of the correspondence relationship, but are not particularly limited to the relational example.
The above-described production method is merely a preferred example, and the outer package 1 for a power storage device of the present invention is not particularly limited to the outer package for a power storage device produced by the above-described production method.
Examples
Next, specific examples of the present invention will be described, but the present invention is not particularly limited to these examples.
[ polymerization initiator used ]
Isopropyl thioxanthone. 320nm to 460nm
Triarylsulfonium tetrakis- (pentafluorophenyl) borate..cationic photopolymerization initiator, light absorption band: 350nm to 420nm
Benzophenone. 250nm to 360nm
Phenyl (2, 4, 6-trimethylbenzoyl) lithium phosphinate (LithiumPhenyl (2, 4, 6-trimethylphenyl) phosphinate.. Radical-based photopolymerization initiator, light absorption band: 350nm to 500nm
Benzoin isopropyl ether. 250nm to 360nm
Example 1 ]
A chemical conversion coating film was formed by applying a chemical conversion treatment solution containing phosphoric acid, polyacrylic acid (acrylic resin), a chromium (III) salt compound, water and an alcohol to both surfaces of an aluminum foil (aluminum foil of A8079 defined in JIS H4160) 4 having a thickness of 35. Mu.m, and drying the resultant film at 180 ℃. The chromium adhesion amount of the chemical conversion coating is 10mg/m per one side 2 。
Then, on one surface of the aluminum foil 4 subjected to the above chemical conversion treatment, the dried aluminum foil was dried to a mass of 4g/m 2 90.0 parts by mass of a urethane acrylate resin having 2 acryl groups, 0.5 parts by mass of isopropyl thioxanthone, 7.5 parts by mass of benzophenone, and 1.5 parts by mass of pentaerythritol triacrylate (polymerizable monomer)0.5 part by mass of a silane coupling agent, and the total light quantity to the coated surface was 300mJ/cm 2 Light having a wavelength of 405nm (first light irradiation) was irradiated to perform preliminary curing of the photocurable resin composition. Then, a biaxially stretched polyamide film 2 having a thickness of 15 μm was bonded to the coating surface after the preliminary curing. Next, the laminate was laminated from the side of the polyamide film 2 to a cumulative light amount of 300mJ/cm 2 Light having a wavelength of 254nm (second light irradiation) was applied to sufficiently cure the photocurable resin composition to obtain a first laminate.
Then, an acid-modified polyolefin adhesive (thermosetting inside adhesive) was applied to the other surface of the aluminum foil 4 in the first laminate, and after drying, an unstretched polypropylene film 3 having a thickness of 30 μm was bonded to the applied surface to obtain a second laminate, and then the second laminate was left to stand at 40 ℃ for 9 days and subjected to heat curing treatment, and the thermosetting inside adhesive was cured to form an inside adhesive layer 6, whereby the outer package 1 for an electric storage device having the structure shown in fig. 1 was obtained.
Example 2 ]
An outer package 1 for an electric storage device having a structure shown in fig. 1 was obtained in the same manner as in example 1, except that a photocurable resin composition containing 90.0 parts by mass of a urethane acrylate resin having 2 acryl groups, 2.0 parts by mass of isopropyl thioxanthone, 6.0 parts by mass of benzophenone, 1.5 parts by mass of pentaerythritol triacrylate (polymerizable monomer), and 0.5 parts by mass of a silane coupling agent was used as the outer adhesive.
Example 3 ]
An outer package 1 for an electric storage device having a structure shown in fig. 1 was obtained in the same manner as in example 1, except that a photocurable resin composition containing 90.0 parts by mass of a urethane acrylate resin having 2 acryl groups, 0.1 parts by mass of isopropyl thioxanthone, 7.9 parts by mass of benzophenone, 1.5 parts by mass of pentaerythritol triacrylate (polymerizable monomer), and 0.5 parts by mass of a silane coupling agent was used as the outer adhesive.
Example 4 ]
An outer package 1 for an electric storage device having a structure shown in fig. 1 was obtained in the same manner as in example 1, except that a photocurable resin composition containing 90.0 parts by mass of a urethane acrylate resin having 2 acryl groups, 3.5 parts by mass of isopropyl thioxanthone, 4.5 parts by mass of benzophenone, 1.5 parts by mass of pentaerythritol triacrylate (polymerizable monomer), and 0.5 parts by mass of a silane coupling agent was used as the outer adhesive.
Example 5 ]
As the outside adhesive, a photocurable resin composition containing 80.0 parts by mass of a urethane acrylate resin having 2 acryl groups, 10.0 parts by mass of a vinyl ether resin, 6.0 parts by mass of triarylsulfonium tetrakis- (pentafluorophenyl) borate, 2.0 parts by mass of benzophenone, 1.5 parts by mass of pentaerythritol triacrylate (polymerizable monomer), and 0.5 parts by mass of a silane coupling agent was used, and the first irradiation was performed so that the cumulative light amount became 300mJ/cm 2 The light with a wavelength of 254nm was irradiated with the light of the second irradiation so that the cumulative light amount became 300mJ/cm 2 An outer package 1 for a power storage device having the structure shown in fig. 1 was obtained in the same manner as in example 1 except that light having a wavelength of 365nm was irradiated.
Example 6 ]
As the outside adhesive, a photocurable resin composition containing 90.0 parts by mass of a urethane acrylate resin having 2 acryl groups, 6.0 parts by mass of benzophenone, 2.0 parts by mass of lithium phenyl (2, 4, 6-trimethylbenzoyl) phosphinate, 1.5 parts by mass of pentaerythritol triacrylate (polymerizable monomer), and 0.5 parts by mass of a silane coupling agent was used, and the first irradiation with light was carried out so that the cumulative light amount became 300mJ/cm 2 The light having a wavelength of 500nm was irradiated with the light of 300mJ/cm as the cumulative light amount 2 An outer package 1 for a power storage device having the structure shown in fig. 1 was obtained in the same manner as in example 1 except that light having a wavelength of 254nm was irradiated.
Comparative example 1 ]
An exterior package for an electric storage device was obtained in the same manner as in example 5, except that a photocurable resin composition containing 90.0 parts by mass of a urethane acrylate resin having 2 acryl groups, 6.0 parts by mass of benzophenone, 2.0 parts by mass of benzoin isopropyl ether, 1.5 parts by mass of pentaerythritol triacrylate (polymerizable monomer), and 0.5 parts by mass of a silane coupling agent was used as the outside adhesive.
Comparative example 2 ]
An aluminum foil subjected to chemical conversion treatment was obtained in the same manner as in example 1. Then, on one surface of the aluminum foil 4 subjected to the above chemical conversion treatment, the dried aluminum foil was dried to a mass of 4g/m 2 90.0 parts by mass of a urethane acrylate resin having 2 acryl groups, 8.0 parts by mass of benzophenone, 1.5 parts by mass of pentaerythritol triacrylate (polymerizable monomer), and 0.5 parts by mass of a silane coupling agent (outside adhesive) were applied, and then a biaxially stretched polyamide film 2 having a thickness of 15 μm was bonded to the coated surface (without light irradiation). Next, the laminate was laminated from the polyamide film 2 side to a cumulative light amount of 350mJ/cm 2 Light having a wavelength of 254nm was irradiated to sufficiently cure the photocurable resin composition, thereby obtaining a first laminate.
Then, an acid-modified polyolefin adhesive (thermosetting inside adhesive) was applied to the other surface of the aluminum foil 4 in the first laminate, and after drying, an unstretched polypropylene film 3 having a thickness of 30 μm was bonded to the applied surface to obtain a second laminate, and then the second laminate was left to stand at 40 ℃ for 9 days to heat cure, and the thermosetting inside adhesive was cured to form an inside adhesive layer 6, to obtain an exterior material for an electric storage device.
The outer packaging material for each power storage device obtained as described above was evaluated based on the following measurement method and evaluation method.
< method for evaluating laminate Strength >
From the obtained outer package, a test piece having a width of 15mm×a length of 150mm was cut, and the aluminum foil 4 and the heat-resistant resin layer 2 were peeled from each other in a region extending from one end in the longitudinal direction of the test piece to a position 10mm inward.
The laminate containing the aluminum foil was held and fixed by one of the chucks in accordance with JIS K6854-3 (1999), and the peeled heat-resistant resin layer was held and fixed by the other chuck, and the peel strength at the time of T-peeling was measured at a tensile speed of 100 mm/min in this state, and the value obtained by stabilizing the measured value was regarded as "lamination strength (N/15 mm width)". The measurement results were evaluated based on the following determination criteria.
(determination criterion)
"very good". Laminated strength of "1.5N/15mm wide" or more (acceptable)
"" the laminate strength was "1.0N/15mm wide" or more and less than "1.5N/15mm wide" (acceptable)
"×". Lamination strength was less than "1.0N/15mm wide" (failed).
< method for evaluating coatability >
The coatability of the photocurable resin composition was evaluated. Specifically, uniformity of a coating film of the photocurable resin composition was examined, and variation in thickness of the coating film was measured and evaluated based on the following determination criteria.
(determination criterion)
"verygood". The coating film has no uncoated portion, and has excellent uniformity, and the variation in coating film thickness is + -20% or less
"". The coating film has no uncoated portion, has good uniformity, and has a variation in thickness of the coating film of more than.+ -. 20% and not more than.+ -. 30%
"×". Coating film has uncoated portions thereon, or the variation in thickness of coating film is greater than ±30%.
< method for evaluating overflow prevention Property >
In the obtained exterior material for the power storage device, whether or not the cured product of the photocurable resin composition overflowed from the edge portion of the exterior material to the outside was examined, and evaluation was performed based on the following determination criteria.
(determination criterion)
No spillage of the cured product of the resin composition from the outer package edge portion to the outside was observed (good appearance).
"×". A cured product of the resin composition was observed to overflow outward from the outer package edge (appearance failure).
As is clear from the table, the outer packaging materials for power storage devices according to examples 1 to 6 of the present invention are excellent in productivity without the need for a step of drying the outside adhesive, and are also excellent in coatability while sufficiently obtaining lamination strength.
In contrast, in comparative examples 1 and 2, at least one of which was outside the scope of the claims of the present invention was evaluated as "x" (poor).
Industrial applicability
The exterior material for an electric storage device of the present invention can be used as exterior materials for various electric storage devices, and specific examples of the electric storage device include:
power storage devices such as lithium secondary batteries (lithium ion batteries, lithium polymer batteries, etc.);
lithium ion capacitor;
an electric double layer capacitance; etc.
The power storage device according to the present invention includes not only the above-described power storage device but also an all-solid-state battery.
The present application claims priority from japanese patent application 2018-155961 filed on date 8-23, the disclosure of which forms a part of the present application directly.
The terminology and descriptions used herein are for the purpose of describing embodiments of the invention only, and are not intended to be limiting. The invention is susceptible to any design modification within the scope of the claims without exceeding the gist thereof.
Claims (6)
1. An exterior material for a power storage device, comprising a heat-resistant resin layer as an outer layer, a heat-fusible resin layer as an inner layer, and a metal foil layer disposed between the two layers,
the metal foil layer and the heat-resistant resin layer are bonded via an outer adhesive layer, the metal foil layer and the heat-fusible resin layer are bonded via an inner adhesive layer,
The adhesive layer of at least one of the outer adhesive layer and the inner adhesive layer is formed of a photo-curable resin adhesive containing a main agent and at least 2 photo-polymerization initiators,
of the 2 types of photopolymerization initiators, part or all of the light absorption band of one photopolymerization initiator has a wavelength region which does not overlap with the light absorption band of the other photopolymerization initiator,
wherein the peak value of the light absorption wavelength of one of the 2 photopolymerization initiators is in the range of 200nm or more and less than 300nm, and the peak value of the light absorption wavelength of the other photopolymerization initiator is in the range of 300nm or more and 400nm or less.
2. The exterior material for a power storage device according to claim 1, wherein a content of one of the 2 photopolymerization initiators in the photocurable resin adhesive is 0.2 to 3 mass%.
3. The exterior material for a power storage device according to claim 2, wherein the content of the other one of the 2 photopolymerization initiators in the photocurable resin adhesive is 9 to 20% by mass.
4. The outer packaging material for an electrical storage device according to any one of claim 1 to 3, wherein,
The photo-curing resin adhesive contains more than 2 main agents,
of the 2 types of photopolymerization initiators, one type of photopolymerization initiator (X) and the other type of photopolymerization initiator (Y) are any one of the following combinations of 3 types, namely, the first type to the third type:
the first type … (X) is an anionic polymerization initiator/(Y) is a radical polymerization initiator;
the second type … (X) is an anionic polymerization initiator/(Y) is a cationic polymerization initiator; and
the third type … (X) is a cationic polymerization initiator/(Y) is a radical polymerization initiator.
5. An exterior case for a power storage device, which is formed from the molded body of the exterior material according to any one of claims 1 to 3.
6. The power storage device is characterized by comprising:
a power storage device main body portion; and
an outer package member formed from the outer package material according to any one of claims 1 to 3 and/or the outer package case according to claim 5,
the power storage device main body is externally packed with the outer packing member.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018-155961 | 2018-08-23 | ||
| JP2018155961A JP7126405B2 (en) | 2018-08-23 | 2018-08-23 | Exterior material for power storage device and power storage device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110858634A CN110858634A (en) | 2020-03-03 |
| CN110858634B true CN110858634B (en) | 2023-04-21 |
Family
ID=69622711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910753066.0A Active CN110858634B (en) | 2018-08-23 | 2019-08-14 | Outer packaging material for power storage device, and power storage device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7126405B2 (en) |
| CN (1) | CN110858634B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023157391A1 (en) * | 2022-02-16 | 2023-08-24 | 株式会社クレハ | Outer package material for all-solid-state secondary batteries, and all-solid-state secondary battery |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0824276A1 (en) * | 1996-08-14 | 1998-02-18 | Three Bond Co., Ltd. | Visible-light or near-infrared-light curing resin for battery-insulating seal |
| JP2001143665A (en) * | 1999-11-18 | 2001-05-25 | Matsushita Electric Ind Co Ltd | Cylindrical cell |
| JP2001196033A (en) * | 2000-01-07 | 2001-07-19 | Fuji Seal Inc | Label for battery case |
| CN105210210A (en) * | 2013-06-18 | 2015-12-30 | 株式会社Lg化学 | Cell packaging material and preparation method therefor |
| JP2016167417A (en) * | 2015-03-10 | 2016-09-15 | 東洋インキＳｃホールディングス株式会社 | Protective paint for packaging material for power storage device and use thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002271001A (en) | 2001-03-07 | 2002-09-20 | Sekisui Chem Co Ltd | Transfer material for forming circuit and method of manufacturing circuit board |
| JP4989000B2 (en) * | 2001-09-12 | 2012-08-01 | 株式会社フジシールインターナショナル | Battery exterior label |
| EP2996170B1 (en) * | 2013-03-25 | 2019-05-08 | Dai Nippon Printing Co., Ltd. | Packaging material for batteries |
| JP6935991B2 (en) * | 2016-06-24 | 2021-09-15 | 昭和電工パッケージング株式会社 | Exterior materials for power storage devices and power storage devices |
-
2018
- 2018-08-23 JP JP2018155961A patent/JP7126405B2/en active Active
-
2019
- 2019-08-14 CN CN201910753066.0A patent/CN110858634B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0824276A1 (en) * | 1996-08-14 | 1998-02-18 | Three Bond Co., Ltd. | Visible-light or near-infrared-light curing resin for battery-insulating seal |
| JP2001143665A (en) * | 1999-11-18 | 2001-05-25 | Matsushita Electric Ind Co Ltd | Cylindrical cell |
| JP2001196033A (en) * | 2000-01-07 | 2001-07-19 | Fuji Seal Inc | Label for battery case |
| CN105210210A (en) * | 2013-06-18 | 2015-12-30 | 株式会社Lg化学 | Cell packaging material and preparation method therefor |
| JP2016167417A (en) * | 2015-03-10 | 2016-09-15 | 東洋インキＳｃホールディングス株式会社 | Protective paint for packaging material for power storage device and use thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110858634A (en) | 2020-03-03 |
| JP7126405B2 (en) | 2022-08-26 |
| JP2020030975A (en) | 2020-02-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5774139B2 (en) | Molding packaging material and manufacturing method thereof | |
| CN117096510A (en) | Outer packaging material for power storage device, and power storage device | |
| CN106328834B (en) | Outer packaging material for electricity storage device and electricity storage device | |
| CN107768553B (en) | Outer packaging material for electricity storage device and electricity storage device | |
| JP5704289B1 (en) | Resin composition | |
| JP2015143107A (en) | Packaging material and molded case | |
| US20190344541A1 (en) | Packaging material and method of producing same | |
| CN110858634B (en) | Outer packaging material for power storage device, and power storage device | |
| CN110857366A (en) | Method for manufacturing outer packaging material for electricity storage device | |
| CN108630833A (en) | Housing material diaphragm seal, electric energy storage device housing material and its manufacturing method of electric energy storage device | |
| KR101854487B1 (en) | Battery exterior laminated body and secondary battery | |
| CN117885367A (en) | Method for producing packaging material | |
| JP7303160B2 (en) | Method for manufacturing exterior material for power storage device | |
| JP7257568B2 (en) | Exterior materials for power storage devices | |
| JP6948776B2 (en) | Manufacturing method of packaging material | |
| CN212625804U (en) | Outer packaging material for electricity storage device, outer packaging case, and electricity storage device | |
| JP2023093511A (en) | Exterior materials for power storage devices |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: Shiga Applicant after: Lesonac Packaging Co.,Ltd. Address before: Kanagawa County Applicant before: SHOWA DENKO PACKAGING Co. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Shiga Patentee after: Lishennoco Packaging Co.,Ltd. Address before: Shiga Patentee before: Lesonac Packaging Co.,Ltd. |