CN116909047A - CTP and TFT laminated liquid crystal module and manufacturing process thereof - Google Patents

Abstract

The application provides a CTP and TFT laminating liquid crystal module and a manufacturing process thereof, wherein the CTP and TFT laminating liquid crystal module comprises: s10: manufacturing a first ITO pattern layer on the working surface of the glass substrate; s20: manufacturing an insulating layer on the working surface of the glass substrate, wherein a silk-screen space is reserved between the insulating layer and the first ITO pattern layer; s30: manufacturing a second ITO pattern layer on the insulating layer; s40: screen printing silver wires and insulating oil on the first ITO pattern layer and the second ITO pattern layer on the working surface of the glass substrate; s50: the working surface of the glass substrate is bonded with the glass cover plate through optical cement to obtain a CTP and TFT bonded liquid crystal module; according to the application, the ITO pattern layers on two sides are innovatively manufactured on the same side, and after being attached to the glass cover plate, all silver wires can be protected, so that the yield is effectively improved; and in the process of executing silver wire screen printing and insulating oil screen printing, only unified operation is required on the working surface, and no turn-over treatment is required, so that the process flow is effectively simplified.

Description

CTP and TFT laminated liquid crystal module and manufacturing process thereof

Technical Field

The application relates to the technical field of manufacturing of CTP and TFT (thin film transistor) laminated liquid crystal modules, in particular to a CTP and TFT laminated liquid crystal module and a manufacturing process thereof.

Background

In the manufacturing process of the liquid crystal module with the CTP and the TFT attached, double-sided ITO is required to be manufactured on a transparent glass substrate, the conventional manufacturing mode is shown in figure 1, after a photosensitive material on one side is manufactured and a pattern is developed through exposure, PET or photoresist or other films are used for protecting the back surface, and etching and demolding are carried out to obtain an ITO pattern required by the first side; after the photosensitive material of the second surface is patterned by exposure and development, the front surface is protected by PET or photoresist or other film, and then the ITO pattern required by the second surface is obtained by etching and stripping. And after the operation is finished, performing a silk-screen process, wherein the silk-screen process needs to perform silk-screen on the ITO pattern, and the first surface and the second surface respectively need silk-screen one-time silver wires and silk-screen one-time insulating oil.

However, the product structure enables silver wires to be bound and positioned on two opposite sides of the glass, the binding times of the silver wires are more than or equal to 2 times, and after the glass cover plate is attached to one side of the glass cover plate, the silver wires on the other side are exposed and unprotected, so that the glass cover plate is easy to damage. In addition, the manufacturing process is complex and tedious in flow, operation is required to be performed on two surfaces of the glass substrate, appearance defects such as scratches are easy to generate in the processing process, the product yield is difficult to control, and the production cost is high.

Disclosure of Invention

The application aims to provide a CTP and TFT laminating liquid crystal module and a manufacturing process thereof, and aims to solve the problems that the process flow is complex and the yield of products is difficult to control.

In order to achieve the above object, the present application has the following technical scheme:

the application provides a manufacturing process of a CTP and TFT laminating liquid crystal module, which comprises the following steps:

s10: manufacturing a first ITO pattern layer on the working surface of the glass substrate;

s20: manufacturing an insulating layer on the working surface of the glass substrate, wherein the insulating layer covers the first ITO pattern layer, and a silk screen space communicated with the first ITO pattern layer is reserved in the insulating layer;

s30: manufacturing a second ITO pattern layer on the insulating layer;

s40: screen-printing silver wires and insulating oil on the screen-printing space and the second ITO pattern layer on the working surface of the glass substrate;

s50: and the working surface of the glass substrate is bonded with the glass cover plate through optical cement, so that the CTP and TFT bonded liquid crystal module is obtained.

Compared with the prior art, the application innovatively makes two ITO pattern layers on the working surface (namely the same surface) of the glass substrate, and after the ITO pattern layers are attached to the glass cover plate, all silver wires can be protected, so that the yield is effectively improved; in addition, in the process of executing silver wire screen printing and insulating oil screen printing, only unified operation is needed on the working surface of the glass substrate, no turn-over treatment is needed, and the process flow is effectively simplified; and the operation is carried out on the same surface, so that the rubberizing protection of the other surface before etching can be reduced, and the process flow is further simplified.

In one embodiment, the S10 includes:

s110: coating an ITO film on the working surface of the glass substrate, and then coating photoresist;

s120, performing operation; and pre-baking, exposing, developing, etching and stripping the working surface of the glass substrate to form a first ITO pattern layer on the ITO film.

In one embodiment, the fabricating the insulating layer on the working surface of the glass substrate in S20 specifically includes:

and (3) carrying out doctor blade OC (on a working surface of the glass substrate), exposing, developing and curing to obtain an insulating layer, wherein a silk screen space is reserved in the doctor blade OC process so as to facilitate silver wire silk screen printing of S40.

In one embodiment, the silk-screen space is disposed corresponding to an outgoing line end at one end of the first ITO pattern layer.

In one embodiment, the S30 includes:

s310: coating photoresist after coating an ITO film on the insulating layer;

s320: and pre-baking, exposing, developing, etching and stripping the working surface of the glass substrate to form a second ITO pattern layer on the ITO film.

In one embodiment, the S40 includes:

s410: silk-screen printing silver paste with conductive characteristics on a silk-screen printing space and an outlet end at one end of the second pattern layer on the working surface of the glass substrate, and solidifying to obtain a first silver wire and a second silver wire respectively;

s420: and (3) silk-screen printing a layer of insulating oil on the cured first silver wire and the cured second silver wire, and curing to obtain an insulating oil layer.

The application provides a CTP and TFT laminating liquid crystal module, which comprises:

a glass substrate provided with a working surface;

the first ITO pattern layer is arranged on the working surface and is provided with first silver wires;

an insulating layer disposed on an upper side of the first ITO pattern layer;

the second ITO pattern layer is arranged on the upper side surface of the insulating layer, and a second silver wire is arranged on the second ITO pattern layer;

the glass cover plate is attached to the second ITO pattern layer through an optical adhesive layer;

the first silver wire and the second silver wire are arranged on opposite sides, and insulating oil layers are arranged on the first silver wire and the second silver wire.

In one embodiment, the insulating layer is reserved with a silk-screen space, and the silk-screen space is communicated with the first ITO pattern layer so as to set the first silver wires.

In one embodiment, the silk-screen space is disposed corresponding to an outgoing line end at one end of the first ITO pattern layer.

In one embodiment, the positions of the silver glue points of the first silver wire and the first ITO pattern layer are positioned on the left side of the first ITO pattern layer;

and the positions of the silver glue points of the second silver wire and the second ITO pattern layer are positioned at the front side of the second ITO pattern layer.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute a limitation on the application. In the drawings:

FIG. 1 is a schematic illustration of a prior art process flow;

FIG. 2 is a schematic process flow diagram of the present application;

FIG. 3 is a cross-sectional view of a CTP-TFT bonded liquid crystal module of the present disclosure;

FIG. 4 is a front view of a CTP-TFT-attached liquid crystal module according to the application;

FIG. 5 is a second front view of a CTP-TFT bonded liquid crystal module according to the application;

fig. 6 is a third front view of a CTP and TFT bonded liquid crystal module according to the present application.

Detailed Description

In order to better illustrate the present application, the present application will be described in further detail below with reference to the accompanying drawings.

It should be understood that the described embodiments are merely some, but not all embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the application, are intended to be within the scope of the embodiments of the present application.

The terminology used in the embodiments of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of embodiments of the application. As used in this application and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any or all possible combinations of one or more of the associated listed items.

When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the application as detailed in the accompanying claims. In the description of the present application, it should be understood that the terms "first," "second," "third," and the like are used merely to distinguish between similar objects and are not necessarily used to describe a particular order or sequence, nor should they be construed to indicate or imply relative importance. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

Furthermore, in the description of the present application, unless otherwise indicated, "a plurality" means two or more. "and/or", describes an association relationship of the association object, and indicates that there may be three relationships, for example, a and/or 41 or B, and may indicate: a exists alone, A and B exist together, and B exists alone. The character "/" generally indicates that the context-dependent object is an "or" relationship.

In order to facilitate understanding of the difference between the present application and the prior art, and thus to better understand the advantages of the present application in terms of simplification of the process flow, the following description will be made of the prior art of manufacturing double-sided ITO on a transparent glass substrate. In a conventional manner of preparation, as shown in connection with figure 1,

step 1: performing double-sided ITO coating treatment on the first surface and the second surface of the glass substrate, and cleaning and drying the glass;

step 2: coating photoresist on the first surface of the glass substrate, and performing pre-baking, exposure and development treatment;

step 3: PET or photoresist is carried out on the second surface of the glass substrate, so that etching damage of the ITO film on the second surface in the subsequent process is avoided;

step 4: etching the glass substrate, and performing film stripping treatment on the glass substrate after etching to obtain a glass substrate with a first ITO pattern layer on a first surface;

step 5: the glass substrate in the step 4 is thrown and cleaned again, photoresist is coated on the second surface, and pre-baking, exposure and development treatment are carried out;

step 6: PET or photoresist is carried out on the second surface of the glass substrate, so that the etching damage of the first ITO pattern layer on the first surface in the subsequent process is avoided;

step 7: etching the glass substrate, and performing film stripping treatment on the glass substrate after etching to obtain a glass substrate with an ITO pattern layer on two surfaces;

step 8: carrying out silver wire silk-screen printing and curing on the first surface of the glass substrate, and then carrying out insulating oil silk-screen printing and curing on the silver wire;

step 9: and turning over the glass substrate, carrying out silver wire silk screen printing and curing on the second surface, and then carrying out insulating oil silk screen printing and curing on the silver wire.

The manufacturing process needs to operate two sides of the glass substrate, when one side is operated, the other side needs to be protected, the ITO film on the other side is prevented from being damaged during etching, the turning-over treatment is needed, the process is complex and complicated, in addition, the appearance defects such as scratches are easily generated in the treatment process, the yield of products is difficult to control, and the production cost is high. Besides, the silver wire binding positions are distributed on two opposite sides of the glass through the product structure, the binding times of the silver wire are more than or equal to 2 times, and after the glass cover plate is attached to one side of the glass cover plate, the silver wire on the other side is exposed and unprotected, so that the glass cover plate is easy to damage.

In order to solve the technical problems, as shown in fig. 2 to 6, the application provides a CTP-TFT bonded liquid crystal module and a manufacturing process thereof, wherein two ITO pattern layers are innovatively manufactured on the working surface (i.e. the same surface) of the glass substrate, and after bonding with a glass cover plate, all silver wires can be protected, thereby effectively improving the yield; in addition, in the process of executing silver wire screen printing and insulating oil screen printing, only unified operation is needed on the working face, no turn-over treatment is needed, and the process flow is effectively simplified; and the operation is carried out on the same surface, so that the rubberizing protection of the other surface before etching can be reduced, and the process flow is further simplified.

Referring to fig. 2 to 6, the present application provides a process for manufacturing a CTP-TFT bonded liquid crystal module, which includes:

s10: manufacturing a first ITO pattern layer on the working surface of the glass substrate 10 as shown in FIG. 4; the S10 includes:

s110: coating a photoresist after coating an ITO film on the working surface of the glass substrate 10;

s120, performing operation; the working surface of the glass substrate 10 is prebaked, exposed, developed, etched, and stripped to form a first ITO pattern layer on the ITO film.

S20: manufacturing an insulating layer 30 on the working surface of the glass substrate 10, wherein the insulating layer 30 covers the first ITO pattern layer 20, and a screen space 310 communicating with the first ITO pattern layer 20 is reserved in the insulating layer 30, as shown in fig. 5; specifically, an operator performs doctor blade OC, exposure, development and curing on the working surface of the glass substrate 10 to obtain the insulating layer 30, wherein a silk-screen space 310 is reserved in the process of doctor blade OC, so that silver wires are silk-screened in S40. And during the doctor blade process, OC is coated over the first ITO pattern layer in preparation for subsequent low temperature plating of an ITO film on the insulating layer 30.

It should be noted that OC is an acronym of an overcoater, belongs to an insulating material, is widely applied to LCD manufacturing, and is a material familiar to those skilled in the art, and the present application will not be described in detail. The present application can prevent the contact of the first ITO pattern layer with the second ITO pattern layer mentioned later by using OC as the insulating layer 30, preventing short circuit.

Preferably, the silk-screen space 310 is disposed corresponding to an outgoing line end at one end of the first ITO pattern layer; according to the application, the silk-screen space 310 is arranged at the wire outlet end at one end of the first ITO pattern layer, so that in the subsequent S40 silk-screen silver wire process, after the silver paste with the conductive characteristic is filled into the silk-screen space 310, the silver paste can be fully contacted and conducted with the wire outlet end at one end of the first ITO pattern layer, and electric connection is realized.

S30: fabricating a second ITO pattern layer on the insulating layer 30; after the operation of S20 is completed, the operator continues to manufacture a second ITO pattern layer on the working surface of the glass substrate 10, specifically, S30 includes:

s310: coating a photoresist after coating an ITO film on the insulating layer 30; preferably, the present application employs a low temperature plating method to plate an ITO film on the insulating layer 30 so that the ITO film can form the second ITO pattern layer 40 on the subsequent operation; preferably, the temperature of the low-temperature coating is 160-180 ℃, and the working surface of the glass substrate can be effectively prevented from being stripped due to high-temperature embrittlement of the insulating layer by means of the low-temperature coating.

S320: the working surface of the glass substrate 10 is prebaked, exposed, developed, etched, and stripped to form a second ITO pattern layer 40 on the ITO film.

S40: screen-printing silver wires and insulating oil on the screen-printed space 310 and the second ITO pattern layer on the working surface of the glass substrate 10, as shown in fig. 6; the S40 includes:

s410: an operator performs screen printing on the screen printing space 310 and the wire outlet end of one end of the second pattern layer on the working surface of the glass substrate 10, and solidifies the silver paste with conductive properties to obtain a first silver wire 610 and a second silver wire 620 respectively; compared with the double-sided silk-screen silver wire in the prior art, the method can simply and quickly perform the operation on the same side without performing the turn-over action of the glass substrate, and effectively reduces the operation time and the production risk generated by the turn-over action.

The first silver wire 610 and the second silver wire 620 are arranged on different sides (for example, the first silver wire 610 is arranged on the left side of the liquid crystal module bonded by the CTP and the TFT, the second silver wire 620 is arranged on the front side of the liquid crystal module bonded by the CTP and the TFT), so that the first silver wire 610 and the second silver wire 620 can be prevented from being in contact and short circuit, and the space position of the liquid crystal module bonded by the CTP and the TFT is effectively utilized;

s420: a layer of insulating oil is silk-screened on the first and second silver wires 610 and 620 that have been cured and cured, resulting in an insulating oil layer 630. The application innovatively completes silk screen printing of silver wires and silk screen printing of insulating oil on the working surface (same surface) of the glass substrate 10, and does not need to be carried out separately as in the prior art, thereby simplifying the procedures.

S50: the working surface of the glass substrate 10 is bonded to the glass cover plate 50 by optical cement to obtain a CTP-TFT bonded liquid crystal module.

Through the above description of the process flow of the present application, compared with the prior art,

1. two steps (namely, the steps 3 and 6 in the prior art) of carrying out PET or photosensitive adhesive film pasting protection on the other surface of the glass substrate 10 before etching one surface are omitted; in the prior art, as the ITO is plated on two sides, in the process of manufacturing the first ITO pattern layer, PET or photoresist treatment is required to be carried out on the second surface in order to protect the ITO film on the second surface, so that the ITO film on the second surface is prevented from being damaged in the etching process; similarly, in the process of manufacturing the second ITO pattern layer, PET or photoresist treatment is also required to be performed on the first surface, so as to prevent the first ITO pattern layer on the first surface from being damaged during etching.

In the application, the glass substrate is adopted to coat the film on one side before the first ITO pattern layer is manufactured, so that PET or photoresist treatment is not required on the second side; before the second ITO pattern layer is manufactured, the insulating layer is used for protecting the first ITO pattern layer, and PET or photoresist treatment is not needed.

2. The secondary feeding (namely, the step 5 in the prior art) is omitted;

3. the steps of the first surface and the second surface which are needed when the silver wires and the insulating oil are subjected to screen printing are omitted, and the steps of the screen printing procedure are reduced to half of the original steps only by carrying out the screen printing on the same surface; in the prior art, after silver wire silk-screen printing and curing are carried out on a first ITO pattern layer on a first surface, insulating oil silk-screen printing and curing are carried out on silver wires; then, turning the glass substrate to the second surface, carrying out silver wire silk screen printing and curing on the second ITO pattern layer of the second surface again by silver wires, and then carrying out insulating oil silk screen printing and curing on the silver wires; namely, twice silver wire silk printing and insulating oil silk printing;

in the application, the first ITO pattern layer and the second ITO pattern layer are both arranged on the working surface (the same surface), so that silver wire silk-screen printing of the first ITO pattern layer and the second ITO pattern layer can be synchronously carried out, insulating oil can be synchronously carried out in the same way, and the use of the insulating oil is reduced under the condition of reducing working procedures.

4. According to the application, the glass substrate 10 is not subjected to turn-over treatment, so that the possibility of scratching is reduced, and the yield of products is improved.

The application provides a CTP and TFT laminating liquid crystal module, which comprises:

a glass substrate 10 provided with a working surface;

a first ITO pattern layer 20 provided on the work surface, the first ITO pattern layer being provided with first silver lines 610;

an insulating layer 30 disposed on an upper side of the first ITO pattern layer;

a second ITO pattern layer 40 disposed on the upper side of the insulating layer 30, the second ITO pattern layer being provided with a second silver wire 620;

a glass cover plate 50 attached to the second ITO pattern layer via an optical adhesive layer 70;

the first silver wire 610 and the second silver wire 620 are disposed on opposite sides, and an insulating oil layer 630 is disposed on each of the first silver wire 610 and the second silver wire 620.

The first ITO pattern layer and the second ITO pattern layer of the CTP and TFT laminating liquid crystal module are arranged on the working surface of the glass substrate 10, so that subsequent FPC binding is facilitated, the process flow is simplified, the product binding production period is shortened to 1/2 of the original period, the productivity is doubled, and the binding yield is improved; after the glass substrate 10 and the glass cover plate 50 are attached, the silver wires are prevented from being exposed, and the probability of damaging the silver wires is reduced; and the performance of the functional sheet which is detached back after full lamination is not destroyed.

In one embodiment, the insulating layer 30 is reserved with a silk-screen space 310, and the silk-screen space 310 is in communication with the first ITO pattern layer 20, so as to dispose the first silver wires 610.

In one embodiment, the silk-screen space 310 is disposed corresponding to an outgoing line end of one end of the first ITO pattern layer.

In one embodiment, the positions of the silver glue points of the first silver wire and the first ITO pattern layer are positioned on the left side of the first ITO pattern layer; the silver glue point positions of the second silver wire and the second ITO pattern layer are located on the front side of the second ITO pattern layer, and the space positions of the CTP and the TFT attached to the liquid crystal module are effectively utilized.

In the description of the present application, it should be understood that the terms "vertical," "transverse," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, merely to facilitate description of the present application and simplify the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the protection of the present application.

If the terms "first," "second," etc. are used herein to define a part, those skilled in the art will recognize that: the use of "first" and "second" is for convenience only as well as for simplicity of description, and nothing more than a particular meaning of the terms is intended to be used unless otherwise stated.

The present application is not limited to the above-described embodiments, but, if various modifications or variations of the present application are not departing from the spirit and scope of the present application, the present application is intended to include such modifications and variations as fall within the scope of the claims and the equivalents thereof.

Claims (10)

1. A manufacturing process of a CTP and TFT laminating liquid crystal module is characterized by comprising the following steps:

s10: manufacturing a first ITO pattern layer on the working surface of the glass substrate;

s20: manufacturing an insulating layer on the working surface of the glass substrate, wherein the insulating layer covers the first ITO pattern layer, and a silk screen space communicated with the first ITO pattern layer is reserved in the insulating layer;

s30: manufacturing a second ITO pattern layer on the insulating layer;

s40: screen-printing silver wires and insulating oil on the screen-printing space and the second ITO pattern layer on the working surface of the glass substrate;

s50: and the working surface of the glass substrate is bonded with the glass cover plate through optical cement, so that the CTP and TFT bonded liquid crystal module is obtained.

2. The process for manufacturing a CTP-TFT bonded liquid crystal module according to claim 1, wherein S10 comprises:

s110: coating an ITO film on the working surface of the glass substrate, and then coating photoresist;

s120, performing operation; and pre-baking, exposing, developing, etching and stripping the working surface of the glass substrate to form a first ITO pattern layer on the ITO film.

3. The process for manufacturing a CTP-TFT bonded liquid crystal module according to claim 1, wherein the step S20 of manufacturing an insulating layer on the working surface of the glass substrate is specifically:

and (3) carrying out doctor blade OC (on a working surface of the glass substrate), exposing, developing and curing to obtain an insulating layer, wherein a silk screen space is reserved in the doctor blade OC process so as to facilitate silver wire silk screen printing of S40.

4. The process for manufacturing the CTP-TFT laminated liquid crystal module according to claim 3, wherein: the silk screen space is arranged corresponding to the wire outlet end at one end of the first ITO pattern layer.

5. The process for manufacturing a CTP-TFT bonded liquid crystal module according to claim 1, wherein S30 comprises:

s310: coating photoresist after coating an ITO film on the insulating layer;

s320: and pre-baking, exposing, developing, etching and stripping the working surface of the glass substrate to form a second ITO pattern layer on the ITO film.

6. The process for manufacturing a CTP-TFT bonded liquid crystal module according to claim 1, wherein S40 comprises:

s410: silk-screen printing silver paste with conductive characteristics on a silk-screen printing space and an outlet end at one end of the second pattern layer on the working surface of the glass substrate, and solidifying to obtain a first silver wire and a second silver wire respectively;

s420: and (3) silk-screen printing a layer of insulating oil on the cured first silver wire and the cured second silver wire, and curing to obtain an insulating oil layer.

7. CTP and TFT laminating liquid crystal module, its characterized in that includes:

a glass substrate provided with a working surface;

the first ITO pattern layer is arranged on the working surface and is provided with first silver wires;

an insulating layer disposed on an upper side of the first ITO pattern layer;

the second ITO pattern layer is arranged on the upper side surface of the insulating layer, and is provided with a second silver wire;

the glass cover plate is attached to the second ITO pattern layer through an optical adhesive layer;

the first silver wire and the second silver wire are arranged on opposite sides, and insulating oil layers are arranged on the first silver wire and the second silver wire.

8. The CTP-to-TFT-attached liquid crystal module of claim 7, wherein:

the insulation layer is reserved with a silk screen space, and the silk screen space is communicated with the first ITO pattern layer so as to set the first silver wires.

9. The CTP-to-TFT-attached liquid crystal module of claim 8, wherein:

the silk screen space is arranged corresponding to the wire outlet end at one end of the first ITO pattern layer.

10. The CTP-to-TFT-attached liquid crystal module of claim 7, wherein:

the positions of the silver glue points of the first silver wire and the first ITO pattern layer are positioned at the left side of the first ITO pattern layer;

and the positions of the silver glue points of the second silver wire and the second ITO pattern layer are positioned at the front side of the second ITO pattern layer.