CN116908978A - Core wire, preparation method thereof and cable - Google Patents
Core wire, preparation method thereof and cable Download PDFInfo
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- CN116908978A CN116908978A CN202310873987.7A CN202310873987A CN116908978A CN 116908978 A CN116908978 A CN 116908978A CN 202310873987 A CN202310873987 A CN 202310873987A CN 116908978 A CN116908978 A CN 116908978A
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- 238000002360 preparation method Methods 0.000 title abstract description 11
- 239000000203 mixture Substances 0.000 claims abstract description 80
- 239000013307 optical fiber Substances 0.000 claims abstract description 62
- -1 diamine compound Chemical class 0.000 claims abstract description 53
- 239000003960 organic solvent Substances 0.000 claims abstract description 38
- 239000010410 layer Substances 0.000 claims description 82
- 239000012792 core layer Substances 0.000 claims description 65
- 238000005253 cladding Methods 0.000 claims description 53
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 45
- 238000000034 method Methods 0.000 claims description 32
- 238000004321 preservation Methods 0.000 claims description 22
- 239000000377 silicon dioxide Substances 0.000 claims description 22
- 230000000994 depressogenic effect Effects 0.000 claims description 19
- 239000011858 nanopowder Substances 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 17
- 239000002270 dispersing agent Substances 0.000 claims description 15
- 238000000576 coating method Methods 0.000 claims description 14
- 239000011248 coating agent Substances 0.000 claims description 13
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 12
- 229910052710 silicon Inorganic materials 0.000 claims description 12
- 239000010703 silicon Substances 0.000 claims description 12
- 235000012239 silicon dioxide Nutrition 0.000 claims description 12
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 11
- 230000008018 melting Effects 0.000 claims description 11
- 238000002844 melting Methods 0.000 claims description 11
- 238000000151 deposition Methods 0.000 claims description 10
- 239000007789 gas Substances 0.000 claims description 9
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 8
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 6
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 6
- 238000000137 annealing Methods 0.000 claims description 6
- 239000002808 molecular sieve Substances 0.000 claims description 6
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 238000005229 chemical vapour deposition Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 claims description 4
- XUBKCXMWPKLPPK-UHFFFAOYSA-N 4-(4-amino-2,6-dimethylphenyl)-3,5-dimethylaniline Chemical compound CC1=CC(N)=CC(C)=C1C1=C(C)C=C(N)C=C1C XUBKCXMWPKLPPK-UHFFFAOYSA-N 0.000 claims description 4
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 4
- 239000001301 oxygen Substances 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- 238000007740 vapor deposition Methods 0.000 claims description 4
- 229910052786 argon Inorganic materials 0.000 claims description 3
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 claims description 3
- 238000001914 filtration Methods 0.000 claims description 3
- 239000001307 helium Substances 0.000 claims description 3
- 229910052734 helium Inorganic materials 0.000 claims description 3
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 3
- 239000011148 porous material Substances 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 3
- 238000007665 sagging Methods 0.000 claims description 3
- AJFDBNQQDYLMJN-UHFFFAOYSA-N n,n-diethylacetamide Chemical compound CCN(CC)C(C)=O AJFDBNQQDYLMJN-UHFFFAOYSA-N 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 12
- 230000008054 signal transmission Effects 0.000 abstract description 4
- 230000002238 attenuated effect Effects 0.000 abstract 1
- 230000003287 optical effect Effects 0.000 description 18
- 230000005540 biological transmission Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 4
- 239000011241 protective layer Substances 0.000 description 4
- 238000005491 wire drawing Methods 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- ZDZHCHYQNPQSGG-UHFFFAOYSA-N binaphthyl group Chemical group C1(=CC=CC2=CC=CC=C12)C1=CC=CC2=CC=CC=C12 ZDZHCHYQNPQSGG-UHFFFAOYSA-N 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 239000004408 titanium dioxide Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/44—Mechanical structures for providing tensile strength and external protection for fibres, e.g. optical transmission cables
- G02B6/4401—Optical cables
- G02B6/4429—Means specially adapted for strengthening or protecting the cables
- G02B6/4436—Heat resistant
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/44—Mechanical structures for providing tensile strength and external protection for fibres, e.g. optical transmission cables
- G02B6/4401—Optical cables
- G02B6/4429—Means specially adapted for strengthening or protecting the cables
- G02B6/443—Protective covering
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/44—Mechanical structures for providing tensile strength and external protection for fibres, e.g. optical transmission cables
- G02B6/4479—Manufacturing methods of optical cables
- G02B6/4486—Protective covering
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A30/00—Adapting or protecting infrastructure or their operation
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Surface Treatment Of Glass Fibres Or Filaments (AREA)
Abstract
The application provides a core wire, a preparation method thereof and a cable, and relates to the field of signal transmission. The core wire includes an optical fiber structure and a heat resistant layer; the heat-resistant layer covers the surface of the optical fiber structure, and the heat-resistant layer is configured to: the heat-resistant layer is formed by curing a heat-resistant mixture, and the heat-resistant mixture comprises an organic solvent, and a diamine compound and a dianhydride compound dissolved in the organic solvent. The application solves the problems that the optical fiber structure in the core wire is highly attenuated and the core wire has poor use effect in the working environment where the core wire is at high temperature.
Description
Technical Field
The application relates to the field of signal transmission, in particular to a core wire, a preparation method thereof and a cable.
Background
The cable is a common transmission device and is widely applied to the fields of power transmission, signal transmission and the like. The core wire is an important component of the cable and comprises an optical fiber structure so as to realize the transmission process of optical signals through the optical fiber structure; however, when the optical fiber structure in the core wire transmits an optical signal, the energy attenuation of the optical signal is large, and the use effect of the core wire is poor.
Disclosure of Invention
The embodiment of the application provides a core wire, a preparation method thereof and a cable, which are used for solving the problems of large energy attenuation of an optical signal and poor core wire use effect when the optical fiber structure in the core wire transmits the optical signal.
The embodiment of the application provides a core wire, which comprises an optical fiber structure and a heat-resistant layer;
the heat-resistant layer covers the surface of the optical fiber structure, and the heat-resistant layer is configured to: the heat-resistant layer is formed by curing a heat-resistant mixture including an organic solvent, and a diamine compound and a dianhydride compound dissolved in the organic solvent.
Through adopting above-mentioned technical scheme, through setting up the heat-resisting layer at the surface of optical fiber structure, and the heat-resisting layer is formed by heat-resisting mixture solidification, and heat-resisting mixture includes diamine class compound and dianhydride class compound to can play certain thermal-insulated effect through the heat-resisting layer, reduce the decay of optical fiber structure, improve the result of use of heart yearn.
In some possible embodiments, the heat resistant mixture further comprises a nanopowder and a dispersant;
the mass fraction of the sum of the diamine compound and the dianhydride compound is more than or equal to 11 percent and less than or equal to 21 percent; the mass fraction of the organic solvent is more than or equal to 74% and less than or equal to 86%; the mass fraction of the nano powder is more than or equal to 0.2% and less than or equal to 1.4%; the mass fraction of the dispersing agent is more than or equal to 0.1% and less than or equal to 0.6%.
In some possible embodiments, the diamine compound comprises one or more of 2,2', 6' -tetrafluorobenzidine, 2,6,2',6' -tetramethylbenzidine, 4 '-diaminobinaphthyl, 3' -diphenoxybenzidine, and benzoguanamine;
the dianhydride compound comprises one or more of p-phenylene bis, binaphthyl dianhydride, 4'- (3, 3' -diphenylmethane) diether dianhydride and 2,3,2',3' -diphenyl sulfide dianhydride;
the organic solvent comprises one of N, N-dimethylformamide, N-diethyl acetamide and N-methylpyrrolidone; the nanopowder comprises one or more of silica, titania, and zirconia.
In some possible embodiments, the optical fiber structure includes a core layer, an inner cladding layer, a depressed layer, and an outer cladding layer disposed in sequence from inside to outside;
the relative refractive index difference between the core layer and the silicon dioxide is greater than or equal to 0.55% and less than or equal to 0.7%; the relative refractive index difference between the inner cladding and the silicon dioxide is more than or equal to 0 and less than or equal to 0.1 percent; the relative refractive index difference between the depressed layer and the silicon dioxide is more than or equal to-0.8 percent and less than or equal to-0.6 percent; the relative refractive index difference of the overcladding and silica is 0.
In some possible embodiments, the material of the core layer is germanium-doped silica, and the diameter of the core layer is greater than or equal to 3.9 microns and less than or equal to 4.8 microns;
the material of the inner cladding is silicon, and the thickness of the inner cladding is more than or equal to 3 microns and less than or equal to 5 microns;
the material of the sinking layer is fluorine-doped silicon, and the thickness of the sinking layer is more than or equal to 4 microns and less than or equal to 6 microns;
the material of the outer cladding is silicon, and the thickness of the outer cladding is larger than or equal to 62 microns and smaller than or equal to 63 microns.
The embodiment of the application also provides a preparation method of the core wire, which comprises the following steps:
providing an optical fiber structure;
coating a heat-resistant mixture on the surface of the optical fiber structure; the heat-resistant mixture comprises an organic solvent, and a diamine compound and a dianhydride compound which are dissolved in the organic solvent;
the heat resistant mixture is cured to form the heat resistant layer.
Through adopting above-mentioned technical scheme, through forming the heat-resisting layer on the surface of optical fiber structure, and the heat-resisting layer is formed by heat-resisting mixture solidification, and heat-resisting mixture includes organic solvent to and the diamine class compound and the dianhydride class compound that dissolve in organic solvent, thereby can play certain thermal-insulated effect through the heat-resisting layer, reduce the decay of optical fiber structure, improve the result of use of heart yearn.
In some possible embodiments, before the surface of the optical fiber structure is coated with the heat-resistant mixture, further comprising:
dissolving the diamine compound, the dianhydride compound, the nano powder and the dispersing agent in the organic solvent to form the heat-resistant mixture;
baking the heat-resistant mixture; the baking temperature is greater than or equal to 45 ℃ and less than or equal to 65 ℃; the baking temperature time is more than or equal to 4 hours and less than or equal to 24 hours;
filtering the heat resistant mixture with a molecular sieve; the pore size of the molecular sieve is less than or equal to 5 microns.
In some possible embodiments, the curing the heat resistant mixture comprises:
heating the heat-resistant mixture sequentially through a plurality of holding furnaces to remove part of the organic solvent; the temperature of the plurality of heat preservation furnaces is sequentially increased, wherein the temperature of the first heat preservation furnace is higher than or equal to 120 ℃ and lower than or equal to 200 ℃, and the temperature of the last heat preservation furnace is higher than or equal to 320 ℃ and lower than or equal to 400 ℃.
In some possible embodiments, after heating the heat-resistant mixture sequentially through a plurality of holding furnaces, further comprising:
baking the heat-resistant mixture; the baking temperature is greater than or equal to 45 ℃ and less than or equal to 65 ℃; the baking temperature time is more than or equal to 10 hours and less than or equal to 30 hours;
heating the heat-resistant mixture sequentially through a plurality of heat preservation furnaces; the temperature of the plurality of heat preservation furnaces is sequentially increased, wherein the temperature of the first heat preservation furnace is higher than or equal to 200 ℃ and lower than or equal to 250 ℃, and the temperature of the last heat preservation furnace is higher than or equal to 350 ℃ and lower than or equal to 400 ℃;
secondary baking the heat-resistant mixture; the baking temperature is greater than or equal to 45 ℃ and less than or equal to 65 ℃; the baking time is more than or equal to 4 hours and less than or equal to 8 hours.
In some possible embodiments, there is provided an optical fiber structure comprising:
forming a core layer;
forming an inner cladding layer by a vapor axial deposition method; the inner cladding layer covers the surface of the core layer;
forming a sagging layer by a modified chemical vapor deposition method; the depressed layer covers the surface of the inner cladding facing away from the core layer;
forming an outer cladding by an external vapor deposition method; the outer cladding covers a surface of the depressed layer facing away from the inner cladding.
In some possible embodiments, forming the core layer includes:
forming an initial core layer by a vapor axial deposition method; the diameter of the initial core layer is larger than or equal to 20 mm and smaller than or equal to 80 mm;
melting the initial core layer to form a molten core layer; the melting temperature is greater than or equal to 1700 ℃ and less than or equal to 2100 ℃;
stretching the molten core layer in a protective gas environment; in the shielding gas environment, the shielding gas comprises one or more of argon and helium, and the content of oxygen is less than or equal to 100ppm;
single-section annealing the molten core layer to form the core layer; the temperature of the heat preservation furnace is greater than or equal to 1000 ℃ and less than or equal to 1400 ℃, and the difference between the melting temperature and the temperature of the heat preservation furnace is greater than or equal to 600 ℃ and less than or equal to 1000 ℃.
The embodiment of the application also provides a cable which comprises the core wire.
Since the cable includes the core wire according to any one of the above, the advantage of the cable including the core wire according to any one of the above is specifically described in the above related description, and will not be repeated here.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description, serve to explain the principles of the application.
FIG. 1 is a schematic view of a core wire according to an embodiment of the present application;
FIG. 2 is a schematic diagram of the relative refractive index difference between an optical fiber structure and silica according to an embodiment of the present application;
FIG. 3 is a schematic illustration of attenuation of a core wire provided in an embodiment of the present application within 30 days of use;
FIG. 4 is a schematic flow chart of a method for preparing a core wire according to an embodiment of the present application;
FIG. 5 is a schematic flow chart of an embodiment of the present application for providing an optical fiber structure;
FIG. 6 is a schematic structural diagram of a preparation apparatus according to an embodiment of the present application;
fig. 7 is a schematic structural diagram of a collecting device according to an embodiment of the present application.
100. An optical fiber structure;
110. a core layer; 120. an inner cladding; 130. a sagging layer; 140. an outer cladding;
200. a heat-resistant layer;
300. a preparation device;
310. a rod feeding unit; 320. a wire drawing furnace unit; 330. a holding furnace; 340. a core layer measurement unit; 350. a tension control unit; 360. a coating unit; 370. a curing unit; 380. an optical fiber measurement unit; 390. a wire winding unit;
400. a collecting device;
410. a pay-off reel; 420. a guide wheel; 430. a wire winding device.
Specific embodiments of the present application have been shown by way of the above drawings and will be described in more detail below. The drawings and the written description are not intended to limit the scope of the inventive concepts in any way, but rather to illustrate the inventive concepts to those skilled in the art by reference to the specific embodiments.
Detailed Description
As described in the background art, a cable is a common transmission device, and is widely used in the fields of power transmission, signal transmission and the like. The core wire is an important component of the cable, and when the core wire is used for transmitting the optical signal, the core wire comprises an optical fiber structure so as to realize the transmission process of the optical signal through the optical fiber structure; in addition, the surface of the core wire is usually provided with a protective layer, so that the core wire is protected to a certain extent through the protective layer;
however, in the process of transmitting the optical signal by the optical fiber structure of the core wire, the temperature of the working environment where the core wire is located and the material of the protection layer influence the use effect of the optical fiber structure; for example, when the material of the protective layer on the surface of the core wire is acrylic resin, the core wire is suitable for a working environment of-60 ℃ to 80 ℃; when the working environment temperature of the core wire is higher than or equal to 120 ℃, the protective layer made of acrylic resin is easy to carbonize, so that the normal use of the core wire is affected, the energy attenuation of the optical signal transmitted by the optical fiber structure is large, and the use effect of the core wire is poor.
In order to solve the technical problems, the embodiment of the application provides a core wire, a preparation method thereof and a cable, wherein the core wire is formed by setting a heat-resistant layer on the surface of an optical fiber structure and solidifying a heat-resistant mixture, and the heat-resistant mixture comprises an organic solvent, and a diamine compound and a dianhydride compound which are dissolved in the organic solvent, so that a certain heat insulation effect can be achieved through the heat-resistant layer, the attenuation of the optical fiber structure is reduced, and the use effect of the core wire is improved.
Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the application. Rather, they are merely examples of apparatus and methods consistent with aspects of the application as detailed in the accompanying claims.
The following describes the technical scheme of the present application and how the technical scheme of the present application solves the above technical problems in detail with specific embodiments. The following embodiments may be combined with each other, and the same or similar concepts or processes may not be described in detail in some embodiments. Embodiments of the present application will be described below with reference to the accompanying drawings.
Referring to fig. 1-3, an embodiment of the present application provides a core wire including an optical fiber structure 100 and a heat resistant layer 200; the heat-resistant layer 200 covers the surface of the optical fiber structure 100 to perform a certain heat insulation function through the heat-resistant layer 200; the heat-resistant layer 200 is configured to: the heat-resistant layer 200 is formed by curing a heat-resistant mixture including an organic solvent, and a diamine compound and a dianhydride compound dissolved in the organic solvent.
Referring to fig. 1 and 2, in some possible embodiments, the optical fiber structure 100 includes a core layer 110, an inner cladding layer 120, a depressed layer 130, and an outer cladding layer 140 disposed in that order from the inside out; the material of the core layer 110 may be germanium-doped silica, the diameter of the core layer 110 may be greater than or equal to 3.9 microns and less than or equal to 4.8 microns, the diameter of the core layer 110 may be one of 3.9 microns, 4.1 microns, 4.3 microns, 4.5 microns, 4.7 microns, and 4.8 microns, the abscissa in fig. 2 is set to the radius of the optical fiber structure 100, the ordinate is set to the relative refractive index difference between each structure and silica, and the relative refractive index difference between the core layer 110 and silica may be greater than or equal to 0.55% and less than or equal to 0.7%;
the material of the inner cladding 120 may be set to silicon, the thickness of the inner cladding 120 is greater than or equal to 3 microns, less than or equal to 5 microns, the thickness of the inner cladding 120 may be set to one of 3 microns, 3.5 microns, 4 microns, 4.5 microns, and 5 microns, and the relative refractive index difference of the inner cladding 120 and silicon dioxide may be greater than or equal to 0, less than or equal to 0.1%;
the material of the depressed layer 130 may be set to fluorine-doped silicon, the thickness of the depressed layer 130 is greater than or equal to 4 micrometers and less than or equal to 6 micrometers, and the thickness of the depressed layer 130 may be set to one of 4 micrometers, 4.5 micrometers, 5 micrometers, 5.5 micrometers, and 6 micrometers; the relative refractive index difference of the depressed layer 130 and silicon dioxide may be greater than or equal to-0.8% and less than or equal to-0.6%;
the material of the overclad 140 is set to silicon, the thickness of the overclad 140 is greater than or equal to 62 microns and less than or equal to 63 microns, the thickness of the overclad 140 may be set to one of 62 microns, 62.2 microns, 62.4 microns, 62.6 microns, 62.8 microns, and 63 microns, and the relative refractive index difference of the overclad 140 and silicon dioxide may be set to 0.
In some possible embodiments, the heat resistant mixture further comprises a nanopowder and a dispersant to make the mixing of the diamine compound and the dianhydride compound more uniform by the nanopowder and the dispersant;
in the heat-resistant mixture, the diamine compound comprises one or more of 2,2', 6' -tetrafluorobenzidine, 2,6,2',6' -tetramethyl benzidine, 4 '-diamino binaphthyl, 3' -diphenoxybenzidine and benzidine; the dianhydride compound comprises one or more of p-phenylene bis, binaphthyl dianhydride, 4'- (3, 3' -diphenyl methane) diether dianhydride and 2,3,2',3' -diphenyl sulfide dianhydride; the sum of mass fractions of the diamine compound and the dianhydride compound is 11% or more and 21% or less, for example, the sum of mass fractions of the diamine compound and the dianhydride compound may be set to one of 11%, 13%, 15%, 17%, 19% and 21%;
the organic solvent includes one of N, N-dimethylformamide, N-dimethylacetamide, and N-methylpyrrolidone, and the mass fraction of the organic solvent is 74% or more and 86% or less, for example, the mass fraction of the organic solvent may be set to one of 74%, 76%, 78%, 80%, 82%, 84%, and 86%;
the nano powder comprises one or more of silicon dioxide, titanium dioxide and zirconium dioxide, the mass fraction of the nano powder is more than or equal to 0.2 percent and less than or equal to 1.4 percent, and the mass fraction of the nano powder can be set to be one of 0.2 percent, 0.4 percent, 0.6 percent, 0.8 percent, 1.0 percent, 1.2 percent and 1.4 percent; the mass fraction of the dispersant is greater than or equal to 0.1%, less than or equal to 0.6%, and the mass fraction of the dispersant may be set to one of 0.1%, 0.2%, 0.3%, 0.4%, 0.5%, and 0.6%.
In some possible embodiments, the heat-resistant mixture may be applied to the surface of the optical fiber structure 100 by coating or the like, and then the heat-resistant mixture is transformed into the heat-resistant layer 200 by curing or the like to form the heat-resistant layer 200 on the surface of the optical fiber structure 100.
In summary, the heat-resistant layer 200 is disposed on the surface of the optical fiber structure 100, and the heat-resistant layer 200 is formed by curing a heat-resistant mixture, wherein the heat-resistant mixture comprises an organic solvent, and a diamine compound and a dianhydride compound dissolved in the organic solvent, so that the heat-resistant layer 200 can play a certain role in heat insulation, reduce the attenuation of the optical fiber structure 100, and improve the use effect of the core.
As shown in fig. 3, fig. 3 is a schematic diagram illustrating energy attenuation of an optical signal transmitted by a core wire in a process of transmitting the optical signal in a working environment with a temperature of 300 ℃ in the core wire provided by the application; the abscissa in fig. 3 represents the time of use of the core wire, and the ordinate in fig. 3 represents the energy attenuation of the optical signal transmitted by the core wire; of the two curves, the upper curve represents the core for transmission at 1550 nm and the lower curve represents the core for transmission at 1310 nm.
Illustratively, in transmitting an optical signal with a core having a transmission wavelength of 1550 nm, the energy attenuation of the optical signal transmitted by the core is less than 0.12; in the process of transmitting the optical signal by the core wire with the transmission wavelength of 1310 nanometers, the energy attenuation of the optical signal transmitted by the core wire is smaller than 0.10, and compared with the energy of the optical signal transmitted by the core wire in the related technology which is generally larger than 0.2, the core wire provided by the embodiment of the application can reduce the attenuation of the energy of the optical signal and improve the using effect of the core wire.
The embodiment of the application also provides a cable, which comprises the core wire in any of the above embodiments.
Since the cable includes the core wire according to any of the above embodiments, the cable includes the advantages of the core wire according to any of the above embodiments, and the description thereof will be omitted herein.
Referring to fig. 1 and 4, an embodiment of the present application further provides a method for preparing a core wire, including: providing an optical fiber structure 100; applying a heat-resistant mixture to the surface of the optical fiber structure 100; the heat-resistant mixture comprises an organic solvent, and diamine compounds and dianhydride compounds dissolved in the organic solvent; the heat-resistant mixture is cured to form the heat-resistant layer 200. The preparation method specifically comprises the following steps:
s101, providing an optical fiber structure;
referring to fig. 1, 4-6, in some possible embodiments, the manufacturing process of the optical fiber structure 100 may be implemented by the manufacturing apparatus 300, for example, the manufacturing apparatus 300 may include a rod feeding unit 310, a drawing furnace unit 320, a holding furnace 330, a core 110 measuring unit, a tension control unit 350, a coating unit 360, a curing unit 370, an optical fiber measuring unit 380, and a take-up unit 390; providing an optical fiber structure 100 comprising:
s1011, forming a core layer;
illustratively, forming the core layer 110 includes: forming an initial core layer by a vapor axial deposition method (vapour phase axial deposition technique, abbreviated as VAD), wherein the material of the initial core layer can be germanium-doped silicon dioxide, the diameter of the initial core layer is larger than or equal to 20 mm and smaller than or equal to 80 mm, for example, the diameter of the initial core layer can be one of 20 mm, 30 mm, 40 mm, 50 mm, 60 mm, 70 mm and 80 mm, so that the forming process of the initial core layer is more convenient, and the initial core layer is more convenient to process and form the core layer 110;
after forming the initial core layer by the vapor axial deposition method, conveying the initial core layer to a wire drawing furnace unit 320 by a rod feeding unit 310, and melting the initial core layer by the wire drawing furnace unit 320 to form a molten core layer; the melting temperature is greater than or equal to 1700 degrees celsius and less than or equal to 2100 degrees celsius, for example, the melting temperature may be set to one of 1700 degrees celsius, 1800 degrees celsius, 1900 degrees celsius, 2000 degrees celsius, and 2100 degrees celsius to soften the initial core layer to form a molten core layer;
stretching the molten core layer by the wire drawing furnace unit 320 in a protective gas environment so that the length of the molten core layer increases and the diameter of the molten core layer decreases; illustratively, in a shielding gas environment, the shielding gas comprises one or more of argon and helium, and the amount of oxygen is less than or equal to 100ppm, thereby reducing the likelihood of the molten core layer contacting the oxygen;
after stretching the molten core, a single section of annealing the molten core to form core 110; wherein the temperature of the holding furnace 330 is greater than or equal to 1000 degrees celsius, less than or equal to 1400 degrees celsius, the temperature of the holding furnace 330 may be set to one of 1000 degrees celsius, 1100 degrees celsius, 1200 degrees celsius, 1300 degrees celsius, and 1400 degrees celsius, and the difference between the melting temperature and the holding furnace temperature is greater than or equal to 600 degrees celsius, less than or equal to 1000 degrees celsius.
In the process of single-section annealing of the molten core, the length of the single section of the holding furnace 330 (annealing zone) is greater than or equal to 1 meter and less than or equal to 3 meters, and nitrogen gas flows from top to bottom in the holding furnace 330, and the distance between the upper part of the holding furnace 330 and the initial core melting cone is greater than or equal to 20 cm and less than or equal to 50 cm, so as to achieve single-section annealing of the molten core, and form the core 110.
After the preparation process of the core layer 110 is achieved, the quality of the core layer 110 may be detected by the core layer measuring unit 340 and a constant tension may be provided to the core layer 110 by the tension control unit 350, so that the structure of the core layer 110 may be more stable.
S1012, forming an inner cladding layer by a vapor phase axial deposition method; the inner cladding covers the surface of the core layer;
illustratively, the inner cladding layer 120 may be formed by the coating unit 360 using a vapor axial deposition method such that the inner cladding layer 120 covers the surface of the core layer 110, the material of the inner cladding layer 120 may be set to silicon, and the thickness of the inner cladding layer 120 may be greater than or equal to 3 micrometers and less than or equal to 5 micrometers.
S1013, forming a sunken layer by a modified chemical vapor deposition method; the depressed layer covers the surface of the inner cladding facing away from the core layer;
forming a depressed layer 130 by the coating unit 360 using a modified chemical vapor deposition method (Modified Chemical Vapor Deposition, abbreviated as MVCD), the depressed layer 130 covering a surface of the inner cladding 120 facing away from the core layer 110; the material of the sinker layer 130 may be provided as fluorine-doped silicon, and the thickness of the sinker layer 130 is greater than or equal to 4 microns and less than or equal to 6 microns.
S1014, forming an outer cladding layer by an external vapor deposition method; the outer cladding covers the surface of the depressed layer facing away from the inner cladding;
the outer cladding 140 is formed by the coating unit 360 using an external vapor deposition method (Outside Vapour Deposition, abbreviated as OVD) with the outer cladding 140 covering the surface of the depressed layer 130 facing away from the inner cladding 120, the material of the outer cladding 140 being set to silicon, the thickness of the outer cladding 140 being greater than or equal to 62 microns and less than or equal to 63 microns.
It is easily understood that after the formation process of the outer cladding 140 is completed, the curing process of the inner cladding 120, the depressed layer 130, and the outer cladding 140 may be performed by the curing unit 370, and the quality of the optical fiber structure 100 may be measured by the optical fiber measuring unit 380, and thus the collection process of the optical fiber structure 100 may be performed by the wire collecting unit 390.
S102, coating a heat-resistant mixture on the surface of the optical fiber structure; the heat-resistant mixture comprises an organic solvent, and diamine compounds and dianhydride compounds dissolved in the organic solvent;
in some possible embodiments, the heat resistant mixture further comprises a nanopowder and a dispersant to make the mixing of the diamine compound and the dianhydride compound more uniform by the nanopowder and the dispersant;
before the surface of the optical fiber structure 100 is coated with the heat-resistant mixture, dissolving diamine compounds, dianhydride compounds, nano powder and dispersing agent in an organic solvent to form the heat-resistant mixture;
in the heat-resistant mixture, the diamine compound comprises one or more of 2,2', 6' -tetrafluorobenzidine, 2,6,2',6' -tetramethyl benzidine, 4 '-diamino binaphthyl, 3' -diphenoxybenzidine and benzidine; the dianhydride compound comprises one or more of p-phenylene bis, binaphthyl dianhydride, 4'- (3, 3' -diphenyl methane) diether dianhydride and 2,3,2',3' -diphenyl sulfide dianhydride; the sum of mass fractions of the diamine compound and the dianhydride compound is 11% or more and 21% or less, for example, the sum of mass fractions of the diamine compound and the dianhydride compound may be set to one of 11%, 13%, 15%, 17%, 19% and 21%;
the organic solvent includes one of N, N-dimethylformamide, N-dimethylacetamide, and N-methylpyrrolidone, and the mass fraction of the organic solvent is 74% or more and 86% or less, for example, the mass fraction of the organic solvent may be set to one of 74%, 76%, 78%, 80%, 82%, 84%, and 86%;
the nano powder comprises one or more of silicon dioxide, titanium dioxide and zirconium dioxide, the mass fraction of the nano powder is more than or equal to 0.2 percent and less than or equal to 1.4 percent, and the mass fraction of the nano powder can be set to be one of 0.2 percent, 0.4 percent, 0.6 percent, 0.8 percent, 1.0 percent, 1.2 percent and 1.4 percent; the mass fraction of the dispersant is greater than or equal to 0.1%, less than or equal to 0.6%, and the mass fraction of the dispersant may be set to one of 0.1%, 0.2%, 0.3%, 0.4%, 0.5%, and 0.6%.
After forming the heat-resistant mixture, baking the heat-resistant mixture; the baking temperature is greater than or equal to 45 degrees celsius and less than or equal to 65 degrees celsius, and the baking temperature can be set to one of 45 degrees celsius, 50 degrees celsius, 55 degrees celsius, 60 degrees celsius and 65 degrees celsius; the baking temperature time is greater than or equal to 4 hours and less than or equal to 24 hours, and the baking temperature time can be set to one of 4 hours, 8 hours, 12 hours, 16 hours, 20 hours and 24 hours;
filtering the heat-resistant mixture with a molecular sieve after baking the heat-resistant mixture; the molecular sieve has a pore size of less than or equal to 5 μm to make the structure of the heat-resistant mixture more uniform, so that the heat-resistant mixture is more uniformly coated on the surface of the optical fiber structure 100, thereby improving the molding quality of the heat-resistant layer 200.
Illustratively, applying a heat-resistant compound to the surface of the optical fiber structure 100 includes:
coating the heat-resistant mixture for a plurality of times in a water bath environment; the water temperature is greater than or equal to 25 degrees celsius and less than or equal to 65 degrees celsius, for example, the water temperature may be set to one of 25 degrees celsius, 35 degrees celsius, 45 degrees celsius, 55 degrees celsius, and 65 degrees celsius.
It should be noted that, during the coating, the surface of the optical fiber structure 100 may be coated with the heat-resistant mixture by a two-layer secondary coating method, and the viscosity of the heat-resistant mixture is ensured to be greater than or equal to 2000cps and less than or equal to 4000cps at the water temperature setting, for example, the cured optical fiber structure 100 may be coated with the heat-resistant mixture having a viscosity of greater than or equal to 3000cps and less than or equal to 3500cps, so that the diameter of the outer layer of the heat-resistant mixture is greater than or equal to 145 micrometers and less than or equal to 165 micrometers, for example, the diameter of the outer layer of the heat-resistant mixture may be set to 155 micrometers.
S103, curing the heat-resistant mixture to form a heat-resistant layer;
referring to fig. 1, 4-7, in some possible embodiments, the refractory mixture may be heated sequentially through a plurality of holding ovens 330 to remove a portion of the organic solvent; the temperatures of the plurality of holding furnaces 330 are sequentially increased, and the temperatures of the plurality of holding furnaces 330 may be set according to a function t=t0+kn (T0 is a correction coefficient, k is a slope, and n is the number of digits of the holding furnaces 330); for example, among the plurality of holding ovens 330, the temperature of the first holding oven 330 may be greater than or equal to 120 degrees celsius, less than or equal to 200 degrees celsius, and the temperature of the last holding oven 330 may be greater than or equal to 320 degrees celsius, less than or equal to 400 degrees celsius.
After heating the heat-resistant mixture sequentially through the plurality of holding furnaces 330, it further includes:
baking the heat-resistant mixture; the baking temperature is greater than or equal to 45 degrees celsius and less than or equal to 65 degrees celsius, and the baking temperature can be set to one of 45 degrees celsius, 50 degrees celsius, 55 degrees celsius, 60 degrees celsius and 65 degrees celsius; the baking temperature time is greater than or equal to 10 hours and less than or equal to 30 hours, and the baking temperature time can be set to one of 10 hours, 15 hours, 20 hours, 25 hours and 30 hours;
after the heat-resistant mixture is baked, the heat-resistant mixture is sequentially heated by passing through a plurality of holding furnaces 330; the temperatures of the plurality of heat preservation furnaces 330 are sequentially increased, wherein the temperature of the first heat preservation furnace 330 is higher than or equal to 200 ℃ and lower than or equal to 250 ℃ in the plurality of heat preservation furnaces 330, and the temperature of the last heat preservation furnace 330 is higher than or equal to 350 ℃ and lower than or equal to 400 ℃;
for example, the traveling speed of the optical fiber structure 100 may be set to be greater than or equal to 5m/min, less than or equal to 25m/min, and the length of the single-section holding furnace 330 may be set to be greater than or equal to 0.5 m, less than or equal to 1.5 m, to improve the curing effect of the heat-resistant mixture.
After heating the heat-resistant mixture through the plurality of holding furnaces 330, secondarily baking the heat-resistant mixture; the baking temperature is greater than or equal to 45 ℃ and less than or equal to 65 ℃; the baking time is greater than or equal to 4 hours and less than or equal to 8 hours, so that the heat-resistant mixture forms the heat-resistant layer 200, thereby realizing the process of preparing the core wire.
In some possible embodiments, the core wire receiving process may be implemented by the collecting device 400, where the collecting device 400 includes a pay-off reel 410, guide wheels 420, and a wire takeup 430, and at least part of the guide wheels 420 are disposed on both sides of the holding furnace 330, respectively, so that the optical fiber structure 100 and the heat-resistant mixture stably pass through the holding furnace 330.
In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application.
In the description of the present application, it should be understood that the terms "comprises" and "comprising," and any variations thereof, as used herein, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements that are expressly listed or inherent to such process, method, article, or apparatus.
Unless specifically stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally formed; can be directly connected or indirectly connected through an intermediate medium, and can lead the connection between the two elements or the interaction relationship between the two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and not for limiting the same; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the application.
Claims (13)
1. A core wire comprising an optical fiber structure and a heat resistant layer;
the heat-resistant layer covers the surface of the optical fiber structure, and the heat-resistant layer is configured to: the heat-resistant layer is formed by curing a heat-resistant mixture including an organic solvent, and a diamine compound and a dianhydride compound dissolved in the organic solvent.
2. The core wire of claim 1, wherein the heat resistant mixture further comprises a nanopowder and a dispersant;
the mass fraction of the sum of the diamine compound and the dianhydride compound is more than or equal to 11 percent and less than or equal to 21 percent; the mass fraction of the organic solvent is more than or equal to 74% and less than or equal to 86%; the mass fraction of the nano powder is more than or equal to 0.2% and less than or equal to 1.4%; the mass fraction of the dispersing agent is more than or equal to 0.1% and less than or equal to 0.6%.
3. The core wire of claim 2, wherein the diamine compound comprises one or more of 2,2', 6' -tetrafluorobenzidine, 2,6,2',6' -tetramethylbenzidine, 4 '-diaminobinaphthyl, 3' -diphenoxybenzidine, and benzidine;
the dianhydride compound comprises one or more of p-phenylene bis, binaphthyl dianhydride, 4'- (3, 3' -diphenylmethane) diether dianhydride and 2,3,2',3' -diphenyl sulfide dianhydride;
the organic solvent comprises one of N, N-dimethylformamide, N-diethyl acetamide and N-methylpyrrolidone; the nanopowder comprises one or more of silica, titania, and zirconia.
4. The core wire according to any one of claims 1-3, wherein the optical fiber structure comprises a core layer, an inner cladding layer, a depressed layer, and an outer cladding layer disposed in that order from inside to outside;
the relative refractive index difference between the core layer and the silicon dioxide is greater than or equal to 0.55% and less than or equal to 0.7%; the relative refractive index difference between the inner cladding and the silicon dioxide is more than or equal to 0 and less than or equal to 0.1 percent; the relative refractive index difference between the depressed layer and the silicon dioxide is more than or equal to-0.8 percent and less than or equal to-0.6 percent; the relative refractive index difference of the overcladding and silica is 0.
5. The core wire of claim 4, wherein the core layer is formed of germanium-doped silica, and the core layer has a diameter of 3.9 microns or more and 4.8 microns or less;
the material of the inner cladding is silicon, and the thickness of the inner cladding is more than or equal to 3 microns and less than or equal to 5 microns;
the material of the sinking layer is fluorine-doped silicon, and the thickness of the sinking layer is more than or equal to 4 microns and less than or equal to 6 microns;
the material of the outer cladding is silicon, and the thickness of the outer cladding is larger than or equal to 62 microns and smaller than or equal to 63 microns.
6. A method of making a core wire comprising:
providing an optical fiber structure;
coating a heat-resistant mixture on the surface of the optical fiber structure; the heat-resistant mixture comprises an organic solvent, and a diamine compound and a dianhydride compound which are dissolved in the organic solvent;
the heat resistant mixture is cured to form the heat resistant layer.
7. The method of producing a core wire according to claim 6, further comprising, before the surface of the optical fiber structure is coated with the heat-resistant mixture:
dissolving the diamine compound, the dianhydride compound, the nano powder and the dispersing agent in the organic solvent to form the heat-resistant mixture;
baking the heat-resistant mixture; the baking temperature is greater than or equal to 45 ℃ and less than or equal to 65 ℃; the baking temperature time is more than or equal to 4 hours and less than or equal to 24 hours;
filtering the heat resistant mixture with a molecular sieve; the pore size of the molecular sieve is less than or equal to 5 microns.
8. The method of producing a core wire according to claim 6, wherein coating the surface of the optical fiber structure with a heat-resistant mixture comprises:
coating the heat-resistant mixture multiple times in a water bath environment; the water temperature is greater than or equal to 25 ℃ and less than or equal to 65 ℃; the viscosity of the heat resistant mixture is greater than or equal to 2000cps and less than or equal to 4000cps.
9. The method of producing a core wire according to any one of claims 6 to 8, characterized in that curing the heat-resistant mixture comprises:
heating the heat-resistant mixture sequentially through a plurality of holding furnaces to remove part of the organic solvent; the temperature of the plurality of heat preservation furnaces is sequentially increased, wherein the temperature of the first heat preservation furnace is higher than or equal to 120 ℃ and lower than or equal to 200 ℃, and the temperature of the last heat preservation furnace is higher than or equal to 320 ℃ and lower than or equal to 400 ℃.
10. The method for producing a core wire according to claim 9, further comprising, after heating the heat-resistant mixture sequentially through a plurality of holding furnaces:
baking the heat-resistant mixture; the baking temperature is greater than or equal to 45 ℃ and less than or equal to 65 ℃; the baking temperature time is more than or equal to 10 hours and less than or equal to 30 hours;
heating the heat-resistant mixture sequentially through a plurality of heat preservation furnaces; the temperature of the plurality of heat preservation furnaces is sequentially increased, wherein the temperature of the first heat preservation furnace is higher than or equal to 200 ℃ and lower than or equal to 250 ℃, and the temperature of the last heat preservation furnace is higher than or equal to 350 ℃ and lower than or equal to 400 ℃;
secondary baking the heat-resistant mixture; the baking temperature is greater than or equal to 45 ℃ and less than or equal to 65 ℃; the baking time is more than or equal to 4 hours and less than or equal to 8 hours.
11. The method of preparing a core wire according to claim 6, wherein providing an optical fiber structure comprises:
forming a core layer;
forming an inner cladding layer by a vapor axial deposition method; the inner cladding layer covers the surface of the core layer;
forming a sagging layer by a modified chemical vapor deposition method; the depressed layer covers the surface of the inner cladding facing away from the core layer;
forming an outer cladding by an external vapor deposition method; the outer cladding covers a surface of the depressed layer facing away from the inner cladding.
12. The method of producing a core wire according to claim 11, wherein forming the core layer comprises:
forming an initial core layer by a vapor axial deposition method; the diameter of the initial core layer is larger than or equal to 20 mm and smaller than or equal to 80 mm;
melting the initial core layer to form a molten core layer; the melting temperature is greater than or equal to 1700 ℃ and less than or equal to 2100 ℃;
stretching the molten core layer in a protective gas environment; in the shielding gas environment, the shielding gas comprises one or more of argon and helium, and the content of oxygen is less than or equal to 100ppm;
single-section annealing the molten core layer to form the core layer; the temperature of the heat preservation furnace is greater than or equal to 1000 ℃ and less than or equal to 1400 ℃, and the difference between the melting temperature and the temperature of the heat preservation furnace is greater than or equal to 600 ℃ and less than or equal to 1000 ℃.
13. A cable comprising the core wire according to any one of claims 1-5.
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