CN116907155A - Helium-free consumption evaporation refrigeration device - Google Patents
Helium-free consumption evaporation refrigeration device Download PDFInfo
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- CN116907155A CN116907155A CN202310870233.6A CN202310870233A CN116907155A CN 116907155 A CN116907155 A CN 116907155A CN 202310870233 A CN202310870233 A CN 202310870233A CN 116907155 A CN116907155 A CN 116907155A
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- 238000005057 refrigeration Methods 0.000 title claims abstract description 63
- 238000001704 evaporation Methods 0.000 title claims abstract description 54
- 230000008020 evaporation Effects 0.000 title claims abstract description 52
- 238000001816 cooling Methods 0.000 claims abstract description 34
- 230000002792 vascular Effects 0.000 claims abstract description 11
- 229910001220 stainless steel Inorganic materials 0.000 claims description 18
- 239000010935 stainless steel Substances 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 238000000605 extraction Methods 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- 230000000779 depleting effect Effects 0.000 claims 9
- 239000001307 helium Substances 0.000 description 37
- 229910052734 helium Inorganic materials 0.000 description 37
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 37
- 239000007788 liquid Substances 0.000 description 25
- 238000000034 method Methods 0.000 description 7
- 238000013461 design Methods 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
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- 229920000314 poly p-methyl styrene Polymers 0.000 description 1
- 206010063401 primary progressive multiple sclerosis Diseases 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 235000014347 soups Nutrition 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D3/00—Devices using other cold materials; Devices using cold-storage bodies
- F25D3/10—Devices using other cold materials; Devices using cold-storage bodies using liquefied gases, e.g. liquid air
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B41/00—Fluid-circulation arrangements
- F25B41/30—Expansion means; Dispositions thereof
- F25B41/37—Capillary tubes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B41/00—Fluid-circulation arrangements
- F25B41/40—Fluid line arrangements
- F25B41/42—Arrangements for diverging or converging flows, e.g. branch lines or junctions
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D23/00—General constructional features
- F25D23/006—General constructional features for mounting refrigerating machinery components
Abstract
The application provides a helium-free consumption evaporation refrigeration device, which comprises: the device comprises a supporting frame, a primary cooling disc, a secondary cooling disc, a refrigeration disc, an evaporation cavity, a vascular component and a circulating pump; a vacuum cavity is arranged in the supporting frame; the primary cooling disc is arranged in the vacuum cavity, a first heat sink is arranged at the top of the primary cooling disc, and a first accommodating cavity is arranged at the bottom of the primary cooling disc; the second-stage cold disc is arranged in the first accommodating cavity, the top of the second-stage cold disc is provided with a second heat sink, and the bottom of the second-stage cold disc is provided with a second accommodating cavity; the refrigeration disc is arranged in the second accommodating cavity; the evaporation cavity is arranged on the refrigeration disc, and a flow resistor is arranged on the evaporation cavity; the first-stage cold head of the vascular component extends into the vacuum cavity and is connected with the first-stage cold disk, and the second-stage cold head extends into the first accommodating cavity and is connected with the second-stage cold disk; the air suction end of the circulating pump is connected with the evaporation cavity through a pipeline, and the air inlet end of the circulating pump is sequentially connected with the first heat sink, the second heat sink, the flow resistor and the evaporation cavity through pipelines. The application can realize a low-temperature environment with the temperature below 2K.
Description
Technical Field
The application relates to the technical field of refrigeration, in particular to a helium-free consumption evaporation refrigeration technology.
Background
The experimental environment at the liquid helium temperature (temperature is near 4K; K is Kelvin and is a temperature unit in the process; 0K is an absolute zero degree which cannot be achieved) is usually obtained by liquid helium or a commercial compressor, and the experimental environment from 1K to 2K is obtained by adding a new design to the existing environment near 4K.
The pre-cooling mode of liquid helium to provide a liquid helium temperature environment is referred to as "wet" refrigeration. However, the wet liquid helium evaporation chamber needs continuous liquid helium supply, while domestic helium resources depend on import, only part of domestic cities have liquid helium supply, the price rises year by year and the supply is often unstable. In addition, due to the design of the liquid helium Dewar, the temperature environment below 2K provided by the wet refrigerator is greatly limited by the space size. In addition, since wet refrigerators require continuous consumption of liquid helium, liquid helium needs to be replenished at intervals during operation of the apparatus. The process of supplementing liquid helium needs to interrupt the experiment, thereby affecting the continuity of the experiment; moreover, the manual transmission and replenishment of liquid helium also makes the refrigerator incapable of being fully controlled remotely and automatically.
The manner of refrigeration that utilizes a compressor to compress and expand helium gas to provide a liquid helium temperature environment is referred to as "dry" refrigeration. The dry refrigeration does not need to consume liquid helium, so the cost is lower and the use is more convenient. In the prior art, pulse tube refrigeration technology is a commonly used dry refrigeration technology. However, this technique generally only provides a liquid helium temperature environment, and temperatures below 2K cannot be obtained.
Commercial devices with temperatures below 2K, which are widely used at present, include devices such as the comprehensive physical property measurement system (PPMS, physical Property Measurement System) of Quantum Design, the teslatron pt of oxford instruments, dilution refrigerators, and the like. However, the above-mentioned devices are almost monopolized by foreign markets, the price is far higher than the cost, and it is also difficult for users to autonomously design and modify such devices to obtain lower temperatures.
Disclosure of Invention
In view of the above, the present application provides a helium-free evaporation refrigeration device for realizing a low-temperature environment with a temperature below 2K.
The technical scheme of the application is specifically realized as follows:
a helium-free consumable evaporative cooling device, the helium-free consumable evaporative cooling device comprising: the device comprises a supporting frame, a primary cooling disc, a secondary cooling disc, a refrigeration disc, an evaporation cavity, a vascular component and a circulating pump;
a vacuum cavity is arranged in the supporting frame;
the primary cold disc is arranged in the vacuum cavity; the top of the primary cooling disc is connected with the top of the supporting frame through a first supporting rod; a first heat sink is arranged at the top of the primary cold disc; the bottom of the primary cold disc is provided with a first accommodating cavity;
the secondary cooling plate is arranged in the first accommodating cavity; the top of the secondary cold disc is connected with the bottom of the primary cold disc through a second supporting rod; a second heat sink is arranged at the top of the secondary cold disc; the bottom of the secondary cooling disc is provided with a second accommodating cavity;
the refrigeration disc is arranged in the second accommodating cavity; the top of the refrigeration disc is connected with the bottom of the secondary refrigeration disc through a third supporting rod;
the evaporation cavity is arranged on the refrigeration disc; a flow resistor is arranged on the evaporation cavity;
the primary cold head of the vascular component extends into the vacuum cavity and is connected with the primary cold disc; the secondary cold head of the vascular component extends into the first accommodating cavity and is connected with the secondary cold disc;
the air extraction end of the circulating pump is connected with the evaporation cavity through a pipeline; and the air inlet end of the circulating pump is sequentially connected with the first heat sink, the second heat sink, the flow resistor and the evaporation cavity through pipelines.
Preferably, the flow resistor comprises: capillary and wire;
the capillary tube is a metal tube with a preset first diameter;
the diameter of the wire is smaller than the first diameter; the metal wire is arranged inside the capillary tube along the extending direction of the capillary tube.
Preferably, the capillary tube is a stainless steel tube, and the metal wire is a stainless steel wire.
Preferably, the pipeline is wound on the first heat sink and the second heat sink for a preset number of turns respectively, and the pipeline, the first heat sink and the second heat sink are fixed by soldering tin.
Preferably, the pipeline is also provided with a first spiral section and a second spiral section respectively; the first spiral section and the second spiral section are pipelines wound into a spiral shape;
the first spiral section is arranged between the first heat sink and the top of the support frame; the second spiral section is disposed between the second heat sink and the bottom of the primary cold plate.
Preferably, the support frame includes: at least 4 support columns and 1 top plate;
the support column is arranged at the bottom of the top plate; the top of the support column is connected with the bottom of the top plate.
Preferably, the support column is made of an aluminum alloy material;
the top plate is made of stainless steel materials.
Preferably, the first support rod, the second support rod and the third support rod are made of stainless steel materials.
Preferably, the outer walls of the first accommodating cavity and the second accommodating cavity are made of pure aluminum;
the upper surface of the primary cold plate, the outer surface of the first accommodating cavity, the upper surface of the secondary cold plate and the outer surface of the second accommodating cavity are all wrapped with aluminum plating films.
Preferably, the pulse tube member is a pulse tube refrigerator.
As can be seen from the above, the helium-free evaporation refrigeration device of the application performs pre-cooling by a dry refrigeration mode to realize the temperature environment of liquid helium, and then realizes the refrigeration temperature lower than 2K by a circulation refrigeration mode under the condition of zero consumption of helium (i.e. no consumption of helium), thus realizing an evaporation refrigerator independent of liquid helium supply; in addition, the design of the thermal resistance of each component in the refrigerating device can effectively reduce external heat leakage, which is also a necessary condition for realizing a low-temperature environment below 2K.
Drawings
Fig. 1 is a schematic diagram of a helium-free evaporation refrigeration apparatus according to an embodiment of the present application.
Fig. 2 is a schematic diagram of a part of a helium-free evaporation refrigeration apparatus according to an embodiment of the present application.
Fig. 3 is a schematic structural view of a flow resistor in an embodiment of the present application.
Fig. 4 is a schematic structural diagram of a heat sink and a pipeline according to an embodiment of the present application.
Fig. 5 is a schematic structural view of a spiral segment in an embodiment of the present application.
Fig. 6 is a graph showing the cooling effect of the lowest temperature that can be achieved by the circulation cooling in the embodiment of the present application.
Detailed Description
In order to make the technical scheme and advantages of the present application more apparent, the present application will be described in further detail with reference to the accompanying drawings and specific embodiments.
Fig. 1 is a schematic diagram of a helium-free evaporation refrigeration apparatus according to an embodiment of the present application. As shown in fig. 1, the helium-free consumption evaporation refrigeration apparatus according to the embodiment of the present application includes: the device comprises a supporting frame, a primary cooling disc, a secondary cooling disc, a refrigeration disc, an evaporation cavity, a vascular component and a circulating pump;
a vacuum cavity is arranged in the supporting frame;
the primary cold disc is arranged in the vacuum cavity; the top of the primary cooling disc is connected with the top of the supporting frame through a first supporting rod; a first heat sink is arranged at the top of the primary cold disc; the bottom of the primary cold disc is provided with a first accommodating cavity;
the secondary cooling plate is arranged in the first accommodating cavity; the top of the secondary cold disc is connected with the bottom of the primary cold disc through a second supporting rod; a second heat sink is arranged at the top of the secondary cold disc; the bottom of the secondary cooling disc is provided with a second accommodating cavity;
the refrigeration disc is arranged in the second accommodating cavity; the top of the refrigeration disc is connected with the bottom of the secondary refrigeration disc through a third supporting rod;
the evaporation cavity is arranged on the refrigeration disc; a flow resistor is arranged on the evaporation cavity;
the primary cold head of the vascular component extends into the vacuum cavity and is connected with the primary cold disc; the secondary cold head of the vascular component extends into the first accommodating cavity and is connected with the secondary cold disc;
the air extraction end of the circulating pump is connected with the evaporation cavity through a pipeline; and the air inlet end of the circulating pump is sequentially connected with the first heat sink, the second heat sink, the flow resistor and the evaporation cavity through pipelines.
In the helium-free consumption evaporation refrigeration device, the supporting frame can play roles of supporting and heat insulation. The vacuum cavity is arranged in the supporting frame, and the primary cooling disc, the secondary cooling disc, the refrigeration disc and the evaporation cavity are all arranged in the vacuum cavity. The primary cold head of the pulse tube component is connected with the primary cold disk to provide refrigeration for the primary cold disk, so that the temperature of the primary cold disk can reach about 40K; the second-stage cold disk is arranged in the first accommodating cavity at the bottom of the first-stage cold disk, and the second-stage cold head of the pulse tube component is connected with the second-stage cold disk to provide refrigeration for the second-stage cold disk, so that the temperature of the second-stage cold disk can reach about 4K; the refrigeration disk is arranged in a second accommodating cavity at the bottom of the secondary refrigeration disk, and the evaporation cavity arranged on the refrigeration disk provides cold energy. Wherein, a closed loop is formed between the circulating pump and the evaporating cavity through a pipeline, and helium gas is precooled to a temperature close to the first-stage cold plate of about 40K when passing through a heat sink on the first-stage cold plate from the air inlet end of the circulating pump through the pipeline; then, when helium passes through a heat sink on the secondary cold plate through a pipeline, the helium is precooled to be close to the temperature of the secondary cold plate (namely, the temperature of liquid helium is about 4K); then, the helium gas and liquid helium mixture enters the flow resistor through a pipeline, is cooled down further by utilizing the principle of Jiao Shang expansion (Joule-Thompson expansion) refrigeration, and flows into an evaporation cavity on the refrigeration disc after liquefaction. Helium stored above the surface of liquid helium in the evaporation chamber will be pumped by a circulation pump from the return line through a pumping port, which results in a gas pressure in said evaporation chamber of about 20 millibar (mbar); the pumped gas will continue to enter the air inlet end of the circulating pump to form circulating refrigeration, so that the temperature of the evaporating cavity is reduced. Since the evaporation chamber is provided on the cooling plate, the temperature on the cooling plate can be brought to a temperature of 2K or less (for example, a cooling temperature of about 1.8K can be achieved) in the above-described manner.
In the above-described helium-consumption-free evaporation refrigeration apparatus according to the present application, the above-described circulation refrigeration method realizes a refrigeration temperature lower than 2K with zero consumption of helium, that is, an evaporation refrigerator independent of liquid helium supply.
In addition, the technical scheme of the application can realize the helium-free consumption evaporation refrigeration device in various modes. The technical solution of the present application will be described in detail below by taking several specific modes as examples.
For example, as an example, in one particular embodiment of the application, the support frame may comprise: at least 4 support columns and 1 top plate;
the support column is arranged at the bottom of the top plate; the top of the support column is connected with the bottom of the top plate.
Through the top plate and 4 support columns, a support frame can be formed.
In addition, in the technical scheme of the application, the support column and the top plate can be manufactured by using different materials according to the requirements of practical application conditions.
For example, as an example, in one particular embodiment of the present application, the support posts are made of an aluminum alloy material; the top plate is made of stainless steel materials.
In addition, in the technical scheme of the application, the flow resistor can be realized in different modes according to the requirements of practical application conditions.
For example, as an example, in one particular embodiment of the application, the flow resistor may comprise: a capillary tube, a wire;
the capillary tube is a metal tube with a preset first diameter;
the diameter of the wire is smaller than the first diameter; the metal wire is arranged in the middle of the capillary tube along the extending direction of the capillary tube.
In the technical scheme of the application, the value of the first diameter can be predetermined according to the requirement of an actual application scene.
For example, in one particular embodiment of the application, the first diameter may be 0.3 millimeters (mm).
When the helium gas and liquid helium mixture precooled to the liquid helium temperature flows into the flow resistor, the mixture expands, the temperature will drop continuously, the mixture is further liquefied and then enters the evaporation cavity, and the evaporation cavity is pumped by the circulating pump to realize evaporation refrigeration, so that the evaporation cavity can reach a lower temperature.
In addition, in the technical scheme of the application, as the metal wire is inserted into the capillary tube, the flow resistor with shorter length can be used on the premise of ensuring that the flow resistance is large enough to generate burnt soup expansion and achieve the same refrigeration effect, thereby effectively saving the space of the refrigerator.
Further, as an example, in one particular embodiment of the application, the capillary tube may be a stainless steel tube; the wire disposed in the capillary may be a stainless steel wire. The use of stainless steel pipes and wires can greatly reduce costs and are also more readily available than other materials.
Further, as an example, in a specific embodiment of the present application, the first heat sink and the second heat sink may be copper tubes; the first heat sink and the second heat sink are fixed on the first cold plate and the second cold plate through stainless steel bolts respectively so as to ensure full thermal contact.
Further, as an example, in a specific embodiment of the present application, the diameters of the first heat sink and the second heat sink may be 10mm, or may be any other suitable value.
Further, as an example, in one embodiment of the present application, the pipe is wound around the first heat sink and the second heat sink by a predetermined number of turns (for example, 15 turns, or other suitable number of turns), respectively, and the pipe is fixed to the heat sinks with solder so that the pipe can make a sufficient thermal contact with the first heat sink and the second heat sink as much as possible.
In addition, in the technical scheme of the application, better refrigerating effect can be realized by optimizing the diameters of pipelines at different positions.
For example, in one particular embodiment of the application, the diameter of the line (return line) between the suction end and the evaporation chamber may be 9mm; the diameter of the conduit between the inlet end and the flow resistor may be 3mm; wherein the diameter of the pipe wound around the first and second heat sinks may be 1.59mm.
Further, as an example, in a specific embodiment of the present application, the pipe may further be provided with a first spiral section and a second spiral section, respectively; the first spiral section and the second spiral section are pipelines wound into a spiral shape;
the first spiral section is arranged between the first heat sink and the top of the support frame; the second spiral section is disposed between the second heat sink and the bottom of the primary cold plate.
Through the first spiral section, the length of the pipeline can be effectively increased, and the heat leakage from the top of the support frame at room temperature to the first cold plate with low temperature is reduced; through the second spiral section, the length of the pipeline can be effectively increased, and heat leakage from the first cold plate with high temperature to the second cold plate with low temperature is reduced. In addition, the first spiral section and the second spiral section can effectively release stress generated by temperature change.
Further, by way of example, in one embodiment of the present application, the covers (i.e., outer walls) of the first and second receiving chambers may each be fabricated from pure aluminum; the upper surface of the first-stage cold plate, the outer surface of the first accommodating cavity, the upper surface of the second-stage cold plate and the outer surface of the second accommodating cavity are all wrapped with aluminum plating films, so that heat radiation and heat leakage can be further reduced.
Further, by way of example, in one particular embodiment of the application, the helical section of tubing may be stainless steel tubing and the tubing wound around the heat sink may be copper tubing.
In addition, as an example, in one embodiment of the present application, the first, second and third support bars may be made of stainless steel materials.
The stainless steel material has high strength and poor heat conductivity, so that the stainless steel material can play a role in supporting and heat insulation at the same time; the stainless steel material is cheap and easy to obtain, so that the cost can be effectively reduced while ensuring good refrigeration effect.
Further, by way of example, in one embodiment of the present application, the volume of the evaporation chamber may be about 110 cubic centimeters (cc); the evaporation chamber may be made of oxygen-free copper.
Further, as an example, in one specific embodiment of the present application, the first cold plate, the second cold plate, and the refrigeration plate may each be made of oxygen-free copper.
Further, as an example, in one particular embodiment of the application, the pulse tube member may be a pulse tube refrigerator, or other suitable refrigerator.
Further, as an example, in one embodiment of the present application, the circulation pump may be a scroll vacuum pump, or other suitable vacuum pump.
In summary, the solution precools by dry refrigeration to provide a temperature environment for liquid helium, and then realizes a refrigeration temperature lower than 2K by the above-mentioned circulation refrigeration method under the condition of zero consumption of helium, so that the solution can realize an evaporation refrigerator independent of liquid helium supply. In the technical scheme of the application, the design of the thermal resistance of each component in the refrigerating device can effectively reduce external heat leakage. For example, as shown in fig. 6, the minimum temperature of the circulating refrigeration that can be obtained in one cooling process is about 1.72K, and the experimental result can be obtained repeatedly in a plurality of cooling processes.
The helium-free consumption evaporation refrigeration device can provide a stable low-temperature environment of about 1.8K. Moreover, the helium-free consumption evaporation refrigeration device has expandability, can be developed later, and is additionally provided with more refrigeration units so as to obtain lower temperature.
The foregoing description of the preferred embodiments of the application is not intended to limit the application to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and scope of the application are intended to be included within the scope of the application.
Claims (10)
1. A helium-free consumable evaporative cooling device, comprising: the device comprises a supporting frame, a primary cooling disc, a secondary cooling disc, a refrigeration disc, an evaporation cavity, a vascular component and a circulating pump;
a vacuum cavity is arranged in the supporting frame;
the primary cold disc is arranged in the vacuum cavity; the top of the primary cooling disc is connected with the top of the supporting frame through a first supporting rod; a first heat sink is arranged at the top of the primary cold disc; the bottom of the primary cold disc is provided with a first accommodating cavity;
the secondary cooling plate is arranged in the first accommodating cavity; the top of the secondary cold disc is connected with the bottom of the primary cold disc through a second supporting rod; a second heat sink is arranged at the top of the secondary cold disc; the bottom of the secondary cooling disc is provided with a second accommodating cavity;
the refrigeration disc is arranged in the second accommodating cavity; the top of the refrigeration disc is connected with the bottom of the secondary refrigeration disc through a third supporting rod;
the evaporation cavity is arranged on the refrigeration disc; a flow resistor is arranged on the evaporation cavity;
the primary cold head of the vascular component extends into the vacuum cavity and is connected with the primary cold disc; the secondary cold head of the vascular component extends into the first accommodating cavity and is connected with the secondary cold disc;
the air extraction end of the circulating pump is connected with the evaporation cavity through a pipeline; and the air inlet end of the circulating pump is sequentially connected with the first heat sink, the second heat sink, the flow resistor and the evaporation cavity through pipelines.
2. The helium-free depleting vapor chilling unit according to claim 1, wherein:
the flow resistor comprises: capillary and wire;
the capillary tube is a metal tube with a preset first diameter;
the diameter of the wire is smaller than the first diameter; the metal wire is arranged inside the capillary tube along the extending direction of the capillary tube.
3. The helium-free depleting vapor chilling unit according to claim 2, wherein:
the capillary tube is a stainless steel tube, and the metal wire is a stainless steel wire.
4. The helium-free depleting vapor chilling unit according to claim 1, wherein:
the pipeline is wound on the first heat sink and the second heat sink respectively for a preset number of turns, and the pipeline, the first heat sink and the second heat sink are fixed by soldering tin.
5. The helium-free depleting vapor chilling device according to claim 1 or 4, wherein:
the pipeline is also provided with a first spiral section and a second spiral section respectively; the first spiral section and the second spiral section are pipelines wound into a spiral shape;
the first spiral section is arranged between the first heat sink and the top of the support frame; the second spiral section is disposed between the second heat sink and the bottom of the primary cold plate.
6. The helium-free depleting vapor chilling device according to claim 1, wherein said support frame comprises: at least 4 support columns and 1 top plate;
the support column is arranged at the bottom of the top plate; the top of the support column is connected with the bottom of the top plate.
7. The helium-free depleting vapor chilling unit according to claim 6, wherein:
the support column is made of an aluminum alloy material;
the top plate is made of stainless steel materials.
8. The helium-free depleting vapor chilling unit according to claim 1, wherein:
the first support rod, the second support rod and the third support rod are made of stainless steel materials.
9. The helium-free depleting vapor chilling unit according to claim 1, wherein:
the outer walls of the first accommodating cavity and the second accommodating cavity are made of pure aluminum;
the upper surface of the primary cold plate, the outer surface of the first accommodating cavity, the upper surface of the secondary cold plate and the outer surface of the second accommodating cavity are all wrapped with aluminum plating films.
10. The helium-free depleting vapor chilling unit according to claim 1, wherein:
the pulse tube component is a pulse tube refrigerator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310870233.6A CN116907155A (en) | 2023-07-14 | 2023-07-14 | Helium-free consumption evaporation refrigeration device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310870233.6A CN116907155A (en) | 2023-07-14 | 2023-07-14 | Helium-free consumption evaporation refrigeration device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116907155A true CN116907155A (en) | 2023-10-20 |
Family
ID=88352505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310870233.6A Pending CN116907155A (en) | 2023-07-14 | 2023-07-14 | Helium-free consumption evaporation refrigeration device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116907155A (en) |
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2023
- 2023-07-14 CN CN202310870233.6A patent/CN116907155A/en active Pending
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