CN116892056A - Thermal insulation structure for silicon carbide single crystal growth and manufacturing method and application thereof - Google Patents

Thermal insulation structure for silicon carbide single crystal growth and manufacturing method and application thereof Download PDF

Info

Publication number
CN116892056A
CN116892056A CN202310991407.4A CN202310991407A CN116892056A CN 116892056 A CN116892056 A CN 116892056A CN 202310991407 A CN202310991407 A CN 202310991407A CN 116892056 A CN116892056 A CN 116892056A
Authority
CN
China
Prior art keywords
heat
insulating
single crystal
silicon carbide
carbide single
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202310991407.4A
Other languages
Chinese (zh)
Other versions
CN116892056B (en
Inventor
张永伟
袁振洲
丁同悦
刘欣宇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu Super Core Star Semiconductor Co ltd
Original Assignee
Jiangsu Super Core Star Semiconductor Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu Super Core Star Semiconductor Co ltd filed Critical Jiangsu Super Core Star Semiconductor Co ltd
Priority to CN202310991407.4A priority Critical patent/CN116892056B/en
Publication of CN116892056A publication Critical patent/CN116892056A/en
Application granted granted Critical
Publication of CN116892056B publication Critical patent/CN116892056B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B23/00Single-crystal growth by condensing evaporated or sublimed materials
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/36Carbides
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

The invention provides a thermal insulation structure for silicon carbide single crystal growth, a manufacturing method and application thereof, wherein the thermal insulation structure comprises a side thermal insulation unit, a top thermal insulation unit and a bottom thermal insulation unit which are surrounded outside a silicon carbide single crystal growth device; the side heat preservation unit is formed by winding a rectangular heat preservation strip, and two connecting end parts of the rectangular heat preservation strip are respectively and independently provided with a slope structure, wherein the slope structure comprises an outer end slope and an inner end slope; the outer end slope is positioned at the connecting end part far away from the silicon carbide single crystal growing device, and the inner end slope is positioned at the connecting end part close to the silicon carbide single crystal growing device; setting the hypotenuse length of the outer end slope to be L1, and setting the hypotenuse length of the inner end slope to be L2, the heat insulation structure meets the following conditions: l1> L2. The heat insulation structure provided by the invention improves the heat insulation performance and the heat insulation uniformity, prolongs the service life, improves the crystal quality, reduces the manufacturing cost and is beneficial to large-scale popularization and application.

Description

Thermal insulation structure for silicon carbide single crystal growth and manufacturing method and application thereof
Technical Field
The invention belongs to the technical field of semiconductor preparation, relates to a heat preservation structure, and in particular relates to a heat preservation structure for silicon carbide single crystal growth, and a manufacturing method and application thereof.
Background
Silicon carbide (SiC) is a third-generation semiconductor material with wide forbidden band, high critical electric field and high saturation mobility, has great advantages in power devices, and is widely applied to various fields of new energy automobiles, photovoltaic power generation, railway traffic, power systems and the like.
Because the physical and chemical properties of SiC are extremely stable, making the growth of SiC crystals extremely difficult, the requirements on the temperature and insulation structure of single crystal growth equipment are also very stringent. At present, a main stream of single crystal growth equipment heat preservation parts are graphite carbon felts, wherein the soft carbon felts are one of common heat preservation materials, and the manufacturing process of the soft carbon felt heat preservation layer, the heat conductivity and the heat preservation uniformity of the heat preservation layer have obvious influence on the radial uniformity, the axial gradient control and the energy consumption of a growth temperature field.
The conventional manufacturing method of the soft carbon felt heat insulation structure is to manually wind the carbon felt with the same specification in a concentric core winding way and match with a graphite felt for up-and-down covering. The operation mode has poor control on the tightness degree and the thermal conductivity uniformity of the heat-insulating structure, the SiC monocrystal is mainly prepared by a Physical Vapor Transport (PVT) method at present, silicon-containing gas is generated in the growth process, the silicon-containing gas is easy to deposit and react in gaps of the heat-insulating structure, the heat-insulating structure is easily layered, embrittled, pulverized and the like, the heat-insulating property and the heat-insulating uniformity are accordingly reduced, the service life is prolonged, the crystal quality and the manufacturing cost are further affected, the influence has unrepeatability in the technological process, and great difficulty is brought to the improvement of the crystal quality.
Therefore, how to provide a thermal insulation structure for silicon carbide single crystal growth and a manufacturing method thereof, which improve the thermal insulation performance and the thermal insulation uniformity, prolong the service life, improve the crystal quality, and reduce the manufacturing cost at the same time, is an urgent problem to be solved by the current technicians in the field.
Disclosure of Invention
The invention aims to provide a thermal insulation structure for silicon carbide single crystal growth, and a manufacturing method and application thereof.
In order to achieve the aim of the invention, the invention adopts the following technical scheme:
in a first aspect, the present invention provides a thermal insulation structure for silicon carbide single crystal growth, the thermal insulation structure comprising a side thermal insulation unit, a top thermal insulation unit, and a bottom thermal insulation unit surrounding an exterior of a silicon carbide single crystal growth apparatus.
The side heat preservation unit is formed by winding a rectangular heat preservation strip, and two connecting end parts of the rectangular heat preservation strip are respectively and independently provided with a slope structure, and the slope structure comprises an outer end slope and an inner end slope.
The outer end slope is located at a connection end far from the silicon carbide single crystal growth device, and the inner end slope is located at a connection end near the silicon carbide single crystal growth device.
Setting the hypotenuse length of the outer end slope to be L1, and setting the hypotenuse length of the inner end slope to be L2, the heat insulation structure meets the following conditions: l1> L2.
Compared with the traditional heat-insulating structure with only side heat-insulating units, the heat-insulating structure provided by the invention has the advantages that the side heat-insulating units, the top heat-insulating unit and the bottom heat-insulating unit which are matched with each other wrap the silicon carbide single crystal growing device in an omnibearing manner, so that the heat-insulating performance and the heat-insulating uniformity are obviously improved, and the growth quality of the silicon carbide single crystal is improved.
In addition, the slope structure is arranged at the connecting end part of the side heat preservation unit, so that the gap between the heat preservation unit and the silicon carbide single crystal growing device is reduced, the consistency of heat preservation performance is ensured, and meanwhile, the phenomena of layering, embrittlement, pulverization and the like of the heat preservation structure caused by deposition reaction of silicon-containing gas in the gap of the heat preservation structure are avoided, so that the service life of the heat preservation structure is prolonged.
Further, the invention ensures that the thick edge of the outer end slope and the thick edge of the inner end slope and the thick edge of the outer end slope and the thin edge of the inner end slope are mutually overlapped in the radial direction by controlling the length of the inclined edge of the outer end slope to be larger than the length of the inclined edge of the inner end slope, thereby meeting the thickness consistency of the side heat preservation unit in the circumferential direction and improving the heat insulation performance and the heat preservation uniformity to the greatest extent.
Preferably, the material of the thermal insulation structure comprises a graphite soft felt, and the graphite soft felt comprises an adhesive-based graphite soft felt or a polyacrylonitrile-based graphite soft felt.
Preferably, the thickness of the graphite soft felt is 2-20mm, for example, 2mm, 4mm, 6mm, 8mm, 10mm, 12mm, 14mm, 16mm, 18mm or 20mm, but is not limited to the recited values, and other non-recited values within the range of values are equally applicable.
Preferably, the density of the graphite soft felt is 0.8-1.3g/cm 3 For example, it may be 0.8g/cm 3 、0.85g/cm 3 、0.9g/cm 3 、0.95g/cm 3 、1g/cm 3 、1.05g/cm 3 、1.1g/cm 3 、1.15g/cm 3 、1.2g/cm 3 、1.25g/cm 3 Or 1.3g/cm 3 But are not limited to, the recited values, and other non-recited values within the range of values are equally applicable.
Preferably, the ash content of the graphite soft felt is less than or equal to 50ppm, and for example, 5ppm, 10ppm, 15ppm, 20ppm, 25ppm, 30ppm, 35ppm, 40ppm, 45ppm or 50ppm can be used, but the ash content is not limited to the recited values, and other non-recited values in the range of the values are equally applicable.
Preferably, the material of the thermal insulation structure comprises graphite soft felt and auxiliary sheets which are alternately laminated.
Preferably, the auxiliary sheet layer comprises any one or a combination of at least two of graphite paper, graphite cloth or carbon fiber cloth, and typical but non-limiting combinations include a combination of graphite paper and graphite cloth, a combination of graphite cloth and carbon fiber cloth, a combination of graphite paper and carbon fiber cloth, or a combination of graphite paper, graphite cloth and carbon fiber cloth.
Preferably, the thickness of the auxiliary sheet is 0.1 to 1mm, for example, 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm or 1mm, but not limited to the recited values, and other non-recited values within the range of values are equally applicable.
Preferably, the ash content of the auxiliary sheet is less than or equal to 100ppm, and may be, for example, 10ppm, 20ppm, 30ppm, 40ppm, 50ppm, 60ppm, 70ppm, 80ppm, 90ppm, or 100ppm, but is not limited to the recited values, and other values not recited in the range of values are equally applicable.
Preferably, the thickness of the side thermal insulation unit is 20-150mm, for example, 20mm, 30mm, 40mm, 50mm, 60mm, 70mm, 80mm, 90mm, 100mm, 110mm, 120mm, 130mm, 140mm or 150mm, but not limited to the recited values, and other non-recited values within the range of values are equally applicable.
Preferably, the side heat insulating unit is divided into an outer heat insulating member and an inner heat insulating member.
Preferably, the thickness of the outer layer heat-insulating member is 10-40mm, for example, 10mm, 15mm, 20mm, 25mm, 30mm, 35mm or 40mm, but not limited to the recited values, and other non-recited values within the range are equally applicable.
Preferably, the thickness of the inner layer insulation member is 10-110mm, for example, 10mm, 20mm, 30mm, 40mm, 50mm, 60mm, 70mm, 80mm, 90mm, 100mm or 110mm, but not limited to the recited values, and other non-recited values within the range of values are equally applicable.
Preferably, the height of the outer layer heat-insulating member is set to H1, and the height of the inner layer heat-insulating member is set to H2, then the side heat-insulating unit satisfies: 10 mm.ltoreq.H 1-H2.ltoreq.50 mm, for example, H1-H2=10 mm, 15mm, 20mm, 25mm, 30mm, 35mm, 40mm, 45mm or 50mm, but not limited to the values recited, other values not recited in the range of values being equally applicable.
Preferably, a graphite soft felt ring is transversely paved at the top of the inner-layer heat-insulating part, the inner diameter of the graphite soft felt ring is consistent with the inner diameter of the inner-layer heat-insulating part, and the outer diameter of the graphite soft felt ring is consistent with the outer diameter of the inner-layer heat-insulating part.
Preferably, the graphite felt ring has a thickness of 10-50mm, for example, 10mm, 15mm, 20mm, 25mm, 30mm, 35mm, 40mm, 45mm or 50mm, but is not limited to the recited values, and other non-recited values within the range of values are equally applicable.
Preferably, the length of the hypotenuse of the ramp structure is 50-300mm, for example, 50mm, 60mm, 80mm, 100mm, 120mm, 140mm, 160mm, 180mm, 200mm, 220mm, 240mm, 260mm, 280mm or 300mm, but is not limited to the recited values, and other non-recited values within the range of values are equally applicable.
Preferably, the included angle between the oblique side and the right-angle side of the slope structure is 1-15 °, for example, 1 °, 2 °, 3 °, 4 °, 5 °, 6 °, 7 °, 8 °, 9 °, 10 °, 11 °, 12 °, 13 °, 14 ° or 15 °, but is not limited to the recited values, and other non-recited values within the range of values are equally applicable.
Preferably, the difference between the hypotenuse length L1 of the outer end ramp and the hypotenuse length L2 of the inner end ramp satisfies: 0mm < (L1-L2) < 200mm, for example, L1-L2=1 mm, 10mm, 20mm, 40mm, 60mm, 80mm, 100mm, 120mm, 140mm, 160mm, 180mm or 200mm, but not limited to the values listed, the other non-listed values within the range of values are equally applicable.
Preferably, the top and bottom insulation units each independently comprise a circular insulation sheet.
Preferably, the diameter of the circular heat-insulating sheet is consistent with the outer diameter of the silicon carbide single crystal growth device.
In a second aspect, the present invention provides a method for manufacturing the insulation structure according to the first aspect, the method comprising the steps of:
(1) Selecting a rectangular heat preservation bar suitable for the height of a silicon carbide single crystal growing device, and correspondingly cutting an outer end slope and an inner end slope at two connecting ends of the rectangular heat preservation bar respectively;
(2) And winding the rectangular heat preservation strip to obtain a side heat preservation unit, and combining the cut top heat preservation unit and the cut bottom heat preservation unit to obtain the heat preservation structure for silicon carbide single crystal growth.
Preferably, the rectangular heat-insulating strip in the step (1) is made of graphite soft felt.
Preferably, in the step (2), an auxiliary sheet layer is further attached to the rectangular heat-insulating strip in the winding process, and the auxiliary sheet layer includes any one or a combination of at least two of graphite paper, graphite cloth or carbon fiber cloth, and typical but non-limiting combinations include a combination of graphite paper and graphite cloth, a combination of graphite cloth and carbon fiber cloth, a combination of graphite paper and carbon fiber cloth, or a combination of graphite paper, graphite cloth and carbon fiber cloth.
Preferably, the winding process in step (2) is performed in a felt rolling machine, and the felt rolling tension is 1-100N, for example, 1N, 10N, 20N, 30N, 40N, 50N, 60N, 70N, 80N, 90N or 100N, but not limited to the recited values, and other non-recited values within the range are equally applicable.
In a third aspect, the present invention provides the use of an insulating structure as described in the first aspect for surrounding a silicon carbide single crystal growth apparatus, the silicon carbide single crystal growth apparatus comprising a crucible or a heating element.
Compared with the prior art, the invention has the following beneficial effects:
(1) Compared with the traditional heat-insulating structure with only side heat-insulating units, the heat-insulating structure provided by the invention has the advantages that the side heat-insulating units, the top heat-insulating unit and the bottom heat-insulating unit which are matched with each other wrap the silicon carbide single crystal growing device in an omnibearing manner, so that the heat-insulating performance and heat-insulating uniformity are obviously improved, and the growth quality of the silicon carbide single crystal is improved;
(2) According to the invention, the slope structure is arranged at the connecting end part of the side heat-insulating unit, so that the gap between the heat-insulating unit and the silicon carbide single crystal growing device is reduced, the consistency of heat-insulating performance is ensured, and the phenomena of layering, embrittlement, pulverization and the like of the heat-insulating structure caused by deposition reaction of silicon-containing gas in the gap of the heat-insulating structure are avoided, thereby prolonging the service life of the heat-insulating structure;
(3) According to the invention, by controlling the length of the inclined edge of the outer end slope to be larger than that of the inclined edge of the inner end slope, the thick edge of the outer end slope and the thick edge of the inner end slope are ensured to be mutually overlapped in the radial direction, so that the thickness consistency of the side heat preservation unit in the circumferential direction is met, and the heat insulation performance and the heat preservation uniformity are improved to the greatest extent.
Drawings
Fig. 1 is a schematic view of a thermal insulation structure provided by the invention.
Wherein: 10-a side thermal insulation unit; 11-an outer layer heat preservation part; 12-an inner layer heat preservation component; 20-a top insulation unit; 30-a bottom insulation unit; 40-graphite soft felt ring; a 50-silicon carbide single crystal growth apparatus; 60-induction coil.
Detailed Description
The technical scheme of the invention is further described by the following specific embodiments. It will be apparent to those skilled in the art that the examples are merely to aid in understanding the invention and are not to be construed as a specific limitation thereof.
The present invention provides a thermal insulation structure for silicon carbide single crystal growth, which comprises a side thermal insulation unit 10, a top thermal insulation unit 20 and a bottom thermal insulation unit 30, which are surrounded on the outside of a silicon carbide single crystal growth apparatus 50, as shown in fig. 1. The side heat-insulating unit 10 is formed by winding a rectangular heat-insulating strip, and two connecting end parts of the rectangular heat-insulating strip are respectively and independently provided with a slope structure, wherein the slope structure comprises an outer end slope and an inner end slope; the outer end slope is located at a connection end portion distant from the silicon carbide single crystal growth apparatus 50, and the inner end slope is located at a connection end portion close to the silicon carbide single crystal growth apparatus 50; setting the hypotenuse length of the outer end slope to be L1, and setting the hypotenuse length of the inner end slope to be L2, the heat insulation structure meets the following conditions: l1> L2.
In the invention, the material of the heat insulation structure comprises a graphite soft felt and an auxiliary sheet layer which are alternately laminated, and the graphite soft felt comprises a viscose-based graphite soft felt or a polyacrylonitrile-based graphite soft felt; the auxiliary sheet layer comprises any one or a combination of at least two of graphite paper, graphite cloth or carbon fiber cloth; the thickness of the graphite soft felt is 2-20mm, and the density is 0.8-1.3g/cm 3 Ash content less than or equal to 50ppm; the thickness of the auxiliary sheet layer is 0.1-1mm, and ash content is less than or equal to 100ppm.
In the invention, the thickness of the side heat preservation unit 10 is 20-150mm; the side heat preservation unit 10 is divided into an outer heat preservation part 11 and an inner heat preservation part 12, wherein the thickness of the outer heat preservation part 11 is 10-40mm, and the thickness of the inner heat preservation part 12 is 10-110mm; setting the height of the outer layer heat-insulating member 11 to be H1 and the height of the inner layer heat-insulating member 12 to be H2, the side heat-insulating unit 10 satisfies: the thickness of H1-H2 is less than or equal to 10mm and less than or equal to 50mm.
In the invention, a graphite soft felt ring 40 is transversely paved on the top of the inner-layer heat-insulating part 12, the inner diameter of the graphite soft felt ring 40 is consistent with the inner diameter of the inner-layer heat-insulating part 12, and the outer diameter of the graphite soft felt ring 40 is consistent with the outer diameter of the inner-layer heat-insulating part 12; the graphite felt ring 40 has a thickness of 10-50mm.
In the invention, the length of the inclined edge of the slope structure is 50-300mm, and the included angle between the inclined edge and the right-angle edge is 1-15 degrees; the difference between the hypotenuse length L1 of the outer end slope and the hypotenuse length L2 of the inner end slope satisfies the following conditions: the diameter of the L1-L2 is less than or equal to 0mm and less than or equal to 200mm. The top thermal insulation unit 20 and the bottom thermal insulation unit 30 each independently include a circular thermal insulation sheet, and the diameter of the circular thermal insulation sheet is identical to the outer diameter of the silicon carbide single crystal growth apparatus 50.
In addition, the invention also provides a manufacturing method of the heat insulation structure, which comprises the following steps:
(1) Selecting a rectangular heat preservation bar suitable for the height of the silicon carbide single crystal growing device 50, and correspondingly cutting an outer end slope and an inner end slope at two connecting ends of the rectangular heat preservation bar respectively; the rectangular heat preservation strip is made of graphite soft felt;
(2) And (3) attaching the rectangular heat preservation strip to an auxiliary sheet layer, wherein the auxiliary sheet layer comprises any one or a combination of at least two of graphite paper, graphite cloth or carbon fiber cloth, winding the graphite paper, the graphite cloth or the carbon fiber cloth in a felt rolling machine with the felt rolling tension of 1-100N to obtain a side heat preservation unit 10, and combining the cut top heat preservation unit 20 and the cut bottom heat preservation unit 30 to obtain the heat preservation structure for the growth of the silicon carbide single crystal.
The heat-insulating structure provided by the invention is used for surrounding the silicon carbide single crystal growth device 50, and the silicon carbide single crystal growth device 50 comprises a crucible or a heating body (such as an induction coil 60).
Compared with the traditional heat-insulating structure with only side heat-insulating units, the heat-insulating structure provided by the invention has the advantages that the side heat-insulating units, the top heat-insulating unit and the bottom heat-insulating unit which are matched with each other wrap the silicon carbide single crystal growing device in an omnibearing manner, so that the heat-insulating performance and the heat-insulating uniformity are obviously improved, and the growth quality of the silicon carbide single crystal is improved.
In addition, the slope structure is arranged at the connecting end part of the side heat preservation unit, so that the gap between the heat preservation unit and the silicon carbide single crystal growing device is reduced, the consistency of heat preservation performance is ensured, and meanwhile, the phenomena of layering, embrittlement, pulverization and the like of the heat preservation structure caused by deposition reaction of silicon-containing gas in the gap of the heat preservation structure are avoided, so that the service life of the heat preservation structure is prolonged.
Further, the invention ensures that the thick edge of the outer end slope and the thick edge of the inner end slope and the thick edge of the outer end slope and the thin edge of the inner end slope are mutually overlapped in the radial direction by controlling the length of the inclined edge of the outer end slope to be larger than the length of the inclined edge of the inner end slope, thereby meeting the thickness consistency of the side heat preservation unit in the circumferential direction and improving the heat insulation performance and the heat preservation uniformity to the greatest extent.
Example 1
The present embodiment provides a thermal insulation structure for silicon carbide single crystal growth, which includes a side thermal insulation unit 10, a top thermal insulation unit 20, and a bottom thermal insulation unit 30, which surround the outside of a silicon carbide single crystal growth apparatus 50, as shown in fig. 1. The side heat-insulating unit 10 is formed by winding a rectangular heat-insulating strip, two connecting end parts of the rectangular heat-insulating strip are respectively and independently provided with a slope structure, the slope structure comprises an outer end slope and an inner end slope, and an included angle between the inclined side of the slope structure and the right-angle side is 8 degrees; the outer end slope is located at a connection end portion distant from the silicon carbide single crystal growth apparatus 50, and the inner end slope is located at a connection end portion close to the silicon carbide single crystal growth apparatus 50; the length of the inclined edge of the outer end slope is 200mm, and the length of the inclined edge of the inner end slope is 175mm.
In this embodiment, the heat insulation structure is made of alternate laminated polyacrylonitrile-based graphite soft felt and graphite paper; the thickness of the polyacrylonitrile-based graphite soft felt is 10mm, and the density is 1.0g/cm 3 Ash content 40ppm; the thickness of the graphite paper is 0.5mm, and the ash content is 80ppm.
In this embodiment, the thickness of the side thermal insulation unit 10 is 85mm; the side heat-insulating unit 10 is divided into an outer heat-insulating part 11 and an inner heat-insulating part 12, wherein the thickness of the outer heat-insulating part 11 is 25mm, and the thickness of the inner heat-insulating part 12 is 60mm; setting the height of the outer layer heat-insulating member 11 to be H1 and the height of the inner layer heat-insulating member 12 to be H2, the side heat-insulating unit 10 satisfies: h1-h2=20 mm.
In this embodiment, a graphite flexible felt ring 40 is transversely laid on top of the inner layer heat insulation member 12, and the inner diameter of the graphite flexible felt ring 40 is consistent with the inner diameter of the inner layer heat insulation member 12, and the outer diameter of the graphite flexible felt ring 40 is consistent with the outer diameter of the inner layer heat insulation member 12; the graphite felt ring 40 has a thickness of 30mm.
In this embodiment, the top thermal insulation unit 20 and the bottom thermal insulation unit 30 each independently include a circular thermal insulation sheet, and the diameter of the circular thermal insulation sheet is consistent with the outer diameter of the silicon carbide single crystal growth apparatus 50.
Example 2
The embodiment provides a method for manufacturing a heat insulation structure as described in embodiment 1, the method comprises the following steps:
(1) Selecting a rectangular heat preservation bar suitable for the height of the silicon carbide single crystal growing device 50, and correspondingly cutting an outer end slope and an inner end slope at two connecting ends of the rectangular heat preservation bar respectively; the rectangular heat-insulating strip is made of polyacrylonitrile-based graphite soft felt;
(2) And (3) attaching the rectangular heat preservation strips to graphite paper, winding the graphite paper in a felt winding machine under the felt winding tension of 50N to obtain a side heat preservation unit 10, and combining the cut top heat preservation unit 20 and bottom heat preservation unit 30 to obtain the heat preservation structure for silicon carbide monocrystal growth.
Comparative example 1
The comparative example provides a thermal insulation structure for silicon carbide single crystal growth, and the other structures and conditions are the same as those of example 1 except that the length of the hypotenuse of the inner end slope is changed to 200mm, so that the description thereof will not be repeated here.
Compared with the embodiment 1, the comparative example changes the length of the inclined edge of the inner end slope to be consistent with that of the outer end slope, so that the thick edge of the outer end slope and the thick edge of the inner end slope and the thick edge of the outer end slope and the thin edge of the inner end slope cannot be completely overlapped in the radial direction, the thickness consistency of the side heat preservation unit in the circumferential direction is lower than that of the embodiment 1, and the heat insulation performance and the heat preservation uniformity of the heat preservation structure are further reduced.
Comparative example 2
The comparative example provides a heat-insulating structure for silicon carbide single crystal growth, and the other structures and conditions are the same as those of example 1 except that the slope structure of the connecting end part of the rectangular heat-insulating strip is changed to a conventional flat end surface, so that the description thereof is omitted.
Compared with the embodiment 1, the slope structure is not arranged at the connecting end part of the side heat preservation unit in the comparative example, so that an obvious gap exists between the heat preservation unit and the silicon carbide single crystal growing device, the consistency of heat preservation performance is reduced, and the silicon-containing gas is easy to generate deposition reaction in the gap of the heat preservation structure, so that the heat preservation structure is layered, embrittled, pulverized and the like, and finally the service life of the heat preservation structure is shortened.
Comparative example 3
This comparative example provides a thermal insulation structure for silicon carbide single crystal growth, which is identical to that of example 1 except that the top thermal insulation unit and the bottom thermal insulation unit are removed, and only the side thermal insulation units are left, so that the description thereof will be omitted.
Compared with the embodiment 1, the heat insulation structure provided by the comparative example only has the side heat insulation units, so that the heat insulation structure cannot wrap the silicon carbide single crystal growth device in an omnibearing manner, the heat insulation performance and the heat insulation uniformity are further remarkably reduced, and finally the growth quality of the silicon carbide single crystal is lower than that of the embodiment 1.
Therefore, compared with the traditional heat-insulating structure with only side heat-insulating units, the heat-insulating structure provided by the invention has the advantages that the side heat-insulating units, the top heat-insulating unit and the bottom heat-insulating unit which are matched with each other wrap the silicon carbide single crystal growing device in an omnibearing manner, so that the heat-insulating performance and the heat-insulating uniformity are obviously improved, and the growth quality of the silicon carbide single crystal is improved.
In addition, the slope structure is arranged at the connecting end part of the side heat preservation unit, so that the gap between the heat preservation unit and the silicon carbide single crystal growing device is reduced, the consistency of heat preservation performance is ensured, and meanwhile, the phenomena of layering, embrittlement, pulverization and the like of the heat preservation structure caused by deposition reaction of silicon-containing gas in the gap of the heat preservation structure are avoided, so that the service life of the heat preservation structure is prolonged.
Further, the invention ensures that the thick edge of the outer end slope and the thick edge of the inner end slope and the thick edge of the outer end slope and the thin edge of the inner end slope are mutually overlapped in the radial direction by controlling the length of the inclined edge of the outer end slope to be larger than the length of the inclined edge of the inner end slope, thereby meeting the thickness consistency of the side heat preservation unit in the circumferential direction and improving the heat insulation performance and the heat preservation uniformity to the greatest extent.
The applicant declares that the above is only a specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and it should be apparent to those skilled in the art that any changes or substitutions that are easily conceivable within the technical scope of the present invention disclosed by the present invention fall within the scope of the present invention and the disclosure.

Claims (10)

1. The heat-insulating structure for the growth of the silicon carbide single crystal is characterized by comprising a side heat-insulating unit, a top heat-insulating unit and a bottom heat-insulating unit which are surrounded outside the silicon carbide single crystal growth device;
the side heat preservation unit is formed by winding a rectangular heat preservation strip, and two connecting end parts of the rectangular heat preservation strip are respectively and independently provided with a slope structure, wherein the slope structure comprises an outer end slope and an inner end slope;
the outer end slope is positioned at the connecting end part far away from the silicon carbide single crystal growing device, and the inner end slope is positioned at the connecting end part close to the silicon carbide single crystal growing device;
setting the hypotenuse length of the outer end slope to be L1, and setting the hypotenuse length of the inner end slope to be L2, the heat insulation structure meets the following conditions: l1> L2.
2. The insulation structure of claim 1, wherein the insulation structure comprises a graphite felt, and the graphite felt comprises a viscose-based graphite felt or a polyacrylonitrile-based graphite felt;
the thickness of the graphite soft felt is 2-20mm, and the density is 0.8-1.3g/cm 3 Ash content is less than or equal to 50ppm.
3. The insulation structure of claim 2, wherein the insulation structure comprises alternating layers of graphite felt and auxiliary sheets;
the auxiliary sheet layer comprises any one or a combination of at least two of graphite paper, graphite cloth or carbon fiber cloth;
the thickness of the auxiliary sheet layer is 0.1-1mm, and ash content is less than or equal to 100ppm.
4. The insulation structure of claim 1, wherein the side insulation units have a thickness of 20-150mm;
the side heat-insulating unit is divided into an outer heat-insulating part and an inner heat-insulating part, wherein the thickness of the outer heat-insulating part is 10-40mm, and the thickness of the inner heat-insulating part is 10-110mm;
setting the height of the outer-layer heat-insulating part as H1, setting the height of the inner-layer heat-insulating part as H2, and enabling the side heat-insulating unit to meet the following conditions: the thickness of H1-H2 is less than or equal to 10mm and less than or equal to 50mm.
5. The insulation structure according to claim 4, wherein a graphite felt ring is transversely laid on top of the inner insulation member, and an inner diameter of the graphite felt ring is consistent with an inner diameter of the inner insulation member, and an outer diameter of the graphite felt ring is consistent with an outer diameter of the inner insulation member;
the thickness of the graphite soft felt ring is 10-50mm.
6. The insulation structure of claim 1, wherein the slope structure has a hypotenuse length of 50-300mm and an included angle between the hypotenuse and the right angle side of 1-15 °;
the difference between the hypotenuse length L1 of the outer end slope and the hypotenuse length L2 of the inner end slope satisfies the following conditions: the diameter of the L1-L2 is less than or equal to 0mm and less than or equal to 200mm.
7. The insulating structure of claim 1, wherein the top insulating unit and the bottom insulating unit each independently comprise a circular insulating sheet;
the diameter of the round heat-insulating sheet is consistent with the outer diameter of the silicon carbide single crystal growing device.
8. A method of making a thermal insulation structure according to any one of claims 1 to 7, comprising the steps of:
(1) Selecting a rectangular heat preservation bar suitable for the height of a silicon carbide single crystal growing device, and correspondingly cutting an outer end slope and an inner end slope at two connecting ends of the rectangular heat preservation bar respectively;
(2) And winding the rectangular heat preservation strip to obtain a side heat preservation unit, and combining the cut top heat preservation unit and the cut bottom heat preservation unit to obtain the heat preservation structure for silicon carbide single crystal growth.
9. The method of claim 8, wherein the rectangular insulating strip of step (1) comprises a graphite felt;
an auxiliary sheet layer is attached to the rectangular heat-insulating strip in the winding treatment process, and the auxiliary sheet layer comprises any one or a combination of at least two of graphite paper, graphite cloth and carbon fiber cloth;
the winding treatment in the step (2) is carried out in a felt rolling machine, and the felt rolling tension is 1-100N.
10. Use of an insulating structure as claimed in any one of claims 1 to 7 for surrounding a silicon carbide single crystal growth apparatus, wherein the silicon carbide single crystal growth apparatus comprises a crucible or a heating body.
CN202310991407.4A 2023-08-07 2023-08-07 Thermal insulation structure for silicon carbide single crystal growth and manufacturing method and application thereof Active CN116892056B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310991407.4A CN116892056B (en) 2023-08-07 2023-08-07 Thermal insulation structure for silicon carbide single crystal growth and manufacturing method and application thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310991407.4A CN116892056B (en) 2023-08-07 2023-08-07 Thermal insulation structure for silicon carbide single crystal growth and manufacturing method and application thereof

Publications (2)

Publication Number Publication Date
CN116892056A true CN116892056A (en) 2023-10-17
CN116892056B CN116892056B (en) 2024-04-16

Family

ID=88310752

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310991407.4A Active CN116892056B (en) 2023-08-07 2023-08-07 Thermal insulation structure for silicon carbide single crystal growth and manufacturing method and application thereof

Country Status (1)

Country Link
CN (1) CN116892056B (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2533371Y (en) * 2001-07-25 2003-01-29 四川中嘉玻璃钢有限公司 Heat insulation layer assembly for composite heat insulation pipe
CN105525342A (en) * 2015-12-22 2016-04-27 英利集团有限公司 Method and monocrystal furnace for preparing large-size monocrystal silicon rod through Czochralski method
CN105712730A (en) * 2014-12-04 2016-06-29 航天睿特碳材料有限公司 Method for preparing net-size C/C composite heat-preservation hard felt
KR101760030B1 (en) * 2016-03-02 2017-08-01 한국세라믹기술원 The method of Variable scale SiC ingot growth using large scale SiC ingot growing apparatus
CN108130593A (en) * 2017-12-20 2018-06-08 中国科学院上海硅酸盐研究所 A kind of crystal growing furnace attemperator
CN109280977A (en) * 2018-11-02 2019-01-29 山东天岳先进材料科技有限公司 The method of comprehensive utilization of the long brilliant surplus material of silicon carbide
CN219059209U (en) * 2023-01-30 2023-05-23 湖南三安半导体有限责任公司 Silicon carbide growing device
CN116234948A (en) * 2020-09-28 2023-06-06 艾伯纳工业炉公司 Device for growing crystals with a thermal covering unit

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2533371Y (en) * 2001-07-25 2003-01-29 四川中嘉玻璃钢有限公司 Heat insulation layer assembly for composite heat insulation pipe
CN105712730A (en) * 2014-12-04 2016-06-29 航天睿特碳材料有限公司 Method for preparing net-size C/C composite heat-preservation hard felt
CN105525342A (en) * 2015-12-22 2016-04-27 英利集团有限公司 Method and monocrystal furnace for preparing large-size monocrystal silicon rod through Czochralski method
KR101760030B1 (en) * 2016-03-02 2017-08-01 한국세라믹기술원 The method of Variable scale SiC ingot growth using large scale SiC ingot growing apparatus
CN108130593A (en) * 2017-12-20 2018-06-08 中国科学院上海硅酸盐研究所 A kind of crystal growing furnace attemperator
CN109280977A (en) * 2018-11-02 2019-01-29 山东天岳先进材料科技有限公司 The method of comprehensive utilization of the long brilliant surplus material of silicon carbide
CN116234948A (en) * 2020-09-28 2023-06-06 艾伯纳工业炉公司 Device for growing crystals with a thermal covering unit
CN219059209U (en) * 2023-01-30 2023-05-23 湖南三安半导体有限责任公司 Silicon carbide growing device

Also Published As

Publication number Publication date
CN116892056B (en) 2024-04-16

Similar Documents

Publication Publication Date Title
CN107829134B (en) Aluminum nitride single crystal growth device and method without seed crystal bonding technology
US6406539B1 (en) Process for producing silicon carbide single crystal and production apparatus therefor
CN102296362B (en) Single-crystal diamond growth base material and method for manufacturing single-crystal diamond substrate
CN116892056B (en) Thermal insulation structure for silicon carbide single crystal growth and manufacturing method and application thereof
KR101897062B1 (en) Silicon carbide epi wafer and method of fabricating the same
KR20120109355A (en) Film forming apparatus and film forming method
CN108130593A (en) A kind of crystal growing furnace attemperator
WO2011105122A1 (en) Component-adjustment member and monocrystal growth device provided therewith
KR20200044729A (en) Large size high purity silicon carbide single crystal, substrate and its manufacturing method and manufacturing device
JP2006273592A (en) Diamond substrate and its manufacturing method
JP2008110907A (en) Method for producing silicon carbide single crystal ingot, and silicon carbide single crystal ingot
CN103556219B (en) A kind of Device for epitaxial growth of silicon carbide
CN114717651A (en) Manufacturing method and manufacturing device of silicon carbide composite substrate
JP6685258B2 (en) Silicon carbide epitaxial growth apparatus, silicon carbide epitaxial wafer manufacturing method, and silicon carbide semiconductor device manufacturing method
CN110662314B (en) Heater and preparation method thereof
US20130143173A1 (en) Furnaces, parts thereof, and methods of making same
JP5143159B2 (en) Single crystal manufacturing equipment
CN111218716B (en) Method for producing SiC single crystal ingot
JP2000319098A (en) Method and apparatus for producing silicon carbide single crystal
CN218089894U (en) Silicon carbide single crystal growth device
CN115386957A (en) High-quality silicon carbide crystal growth crucible
CN116240520A (en) Silicon carbide-boron nitride-pyrolytic graphite composite heating sheet and preparation method and application thereof
KR20130006841A (en) Apparatus for fabricating ingot
CN107740183A (en) A kind of high temperature clean chamber system and method suitable for AlN crystal growths
CN210262076U (en) Crucible assembly for crystal growth

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant