CN116891618A - Resin molding material - Google Patents
Resin molding material Download PDFInfo
- Publication number
- CN116891618A CN116891618A CN202310350294.XA CN202310350294A CN116891618A CN 116891618 A CN116891618 A CN 116891618A CN 202310350294 A CN202310350294 A CN 202310350294A CN 116891618 A CN116891618 A CN 116891618A
- Authority
- CN
- China
- Prior art keywords
- molding material
- resin molding
- resin
- mold
- melt viscosity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012778 molding material Substances 0.000 title claims abstract description 101
- 229920005989 resin Polymers 0.000 title claims abstract description 87
- 239000011347 resin Substances 0.000 title claims abstract description 87
- 239000003365 glass fiber Substances 0.000 claims abstract description 42
- 239000005011 phenolic resin Substances 0.000 claims abstract description 41
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 38
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 36
- 239000000155 melt Substances 0.000 claims abstract description 26
- 238000005259 measurement Methods 0.000 claims abstract description 16
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 claims description 20
- 239000000835 fiber Substances 0.000 claims description 15
- 239000004312 hexamethylene tetramine Substances 0.000 claims description 10
- 235000010299 hexamethylene tetramine Nutrition 0.000 claims description 10
- 239000010680 novolac-type phenolic resin Substances 0.000 claims description 5
- 238000000465 moulding Methods 0.000 description 12
- -1 o-cresol Chemical class 0.000 description 11
- 238000011049 filling Methods 0.000 description 9
- 238000002156 mixing Methods 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 8
- 238000004898 kneading Methods 0.000 description 8
- 229960004011 methenamine Drugs 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 150000001299 aldehydes Chemical class 0.000 description 6
- 239000007822 coupling agent Substances 0.000 description 6
- 230000007547 defect Effects 0.000 description 6
- 229920003986 novolac Polymers 0.000 description 6
- 150000002989 phenols Chemical class 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 239000011134 resol-type phenolic resin Substances 0.000 description 5
- 239000000945 filler Substances 0.000 description 4
- 239000006082 mold release agent Substances 0.000 description 4
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 4
- 229920003987 resole Polymers 0.000 description 4
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical class CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 3
- HGINCPLSRVDWNT-UHFFFAOYSA-N Acrolein Chemical compound C=CC=O HGINCPLSRVDWNT-UHFFFAOYSA-N 0.000 description 3
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N butyric aldehyde Natural products CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 3
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 3
- 235000014113 dietary fatty acids Nutrition 0.000 description 3
- 239000000194 fatty acid Substances 0.000 description 3
- 229930195729 fatty acid Natural products 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- 238000001721 transfer moulding Methods 0.000 description 3
- 239000001993 wax Substances 0.000 description 3
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 2
- IXQGCWUGDFDQMF-UHFFFAOYSA-N 2-Ethylphenol Chemical class CCC1=CC=CC=C1O IXQGCWUGDFDQMF-UHFFFAOYSA-N 0.000 description 2
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 2
- HMNKTRSOROOSPP-UHFFFAOYSA-N 3-Ethylphenol Chemical compound CCC1=CC=CC(O)=C1 HMNKTRSOROOSPP-UHFFFAOYSA-N 0.000 description 2
- HXDOZKJGKXYMEW-UHFFFAOYSA-N 4-ethylphenol Chemical compound CCC1=CC=C(O)C=C1 HXDOZKJGKXYMEW-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- 229930040373 Paraformaldehyde Natural products 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 2
- RGCKGOZRHPZPFP-UHFFFAOYSA-N alizarin Chemical compound C1=CC=C2C(=O)C3=C(O)C(O)=CC=C3C(=O)C2=C1 RGCKGOZRHPZPFP-UHFFFAOYSA-N 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 2
- 239000000920 calcium hydroxide Substances 0.000 description 2
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- MIHINWMALJZIBX-UHFFFAOYSA-N cyclohexa-2,4-dien-1-ol Chemical group OC1CC=CC=C1 MIHINWMALJZIBX-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- HYBBIBNJHNGZAN-UHFFFAOYSA-N furfural Chemical compound O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 description 2
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 2
- JARKCYVAAOWBJS-UHFFFAOYSA-N hexanal Chemical compound CCCCCC=O JARKCYVAAOWBJS-UHFFFAOYSA-N 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 2
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 2
- DTUQWGWMVIHBKE-UHFFFAOYSA-N phenylacetaldehyde Chemical compound O=CCC1=CC=CC=C1 DTUQWGWMVIHBKE-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229940079877 pyrogallol Drugs 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical compound OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 description 2
- 239000012756 surface treatment agent Substances 0.000 description 2
- 230000002194 synthesizing effect Effects 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- BGJSXRVXTHVRSN-UHFFFAOYSA-N 1,3,5-trioxane Chemical compound C1OCOCO1 BGJSXRVXTHVRSN-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- UFBJCMHMOXMLKC-UHFFFAOYSA-N 2,4-dinitrophenol Chemical compound OC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O UFBJCMHMOXMLKC-UHFFFAOYSA-N 0.000 description 1
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 1
- VADKRMSMGWJZCF-UHFFFAOYSA-N 2-bromophenol Chemical compound OC1=CC=CC=C1Br VADKRMSMGWJZCF-UHFFFAOYSA-N 0.000 description 1
- ISPYQTSUDJAMAB-UHFFFAOYSA-N 2-chlorophenol Chemical compound OC1=CC=CC=C1Cl ISPYQTSUDJAMAB-UHFFFAOYSA-N 0.000 description 1
- HFHFGHLXUCOHLN-UHFFFAOYSA-N 2-fluorophenol Chemical compound OC1=CC=CC=C1F HFHFGHLXUCOHLN-UHFFFAOYSA-N 0.000 description 1
- KQDJTBPASNJQFQ-UHFFFAOYSA-N 2-iodophenol Chemical compound OC1=CC=CC=C1I KQDJTBPASNJQFQ-UHFFFAOYSA-N 0.000 description 1
- CRBJBYGJVIBWIY-UHFFFAOYSA-N 2-isopropylphenol Chemical compound CC(C)C1=CC=CC=C1O CRBJBYGJVIBWIY-UHFFFAOYSA-N 0.000 description 1
- IQUPABOKLQSFBK-UHFFFAOYSA-N 2-nitrophenol Chemical compound OC1=CC=CC=C1[N+]([O-])=O IQUPABOKLQSFBK-UHFFFAOYSA-N 0.000 description 1
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N 4-nonylphenol Chemical compound CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- NTDQQZYCCIDJRK-UHFFFAOYSA-N 4-octylphenol Chemical compound CCCCCCCCC1=CC=C(O)C=C1 NTDQQZYCCIDJRK-UHFFFAOYSA-N 0.000 description 1
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 description 1
- 229930188104 Alkylresorcinol Natural products 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003377 acid catalyst Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229950011260 betanaphthol Drugs 0.000 description 1
- YXVFYQXJAXKLAK-UHFFFAOYSA-N biphenyl-4-ol Chemical compound C1=CC(O)=CC=C1C1=CC=CC=C1 YXVFYQXJAXKLAK-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 150000001896 cresols Chemical class 0.000 description 1
- MLUCVPSAIODCQM-NSCUHMNNSA-N crotonaldehyde Chemical compound C\C=C\C=O MLUCVPSAIODCQM-NSCUHMNNSA-N 0.000 description 1
- MLUCVPSAIODCQM-UHFFFAOYSA-N crotonaldehyde Natural products CC=CC=O MLUCVPSAIODCQM-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000008098 formaldehyde solution Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229940015043 glyoxal Drugs 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- UCNNJGDEJXIUCC-UHFFFAOYSA-L hydroxy(oxo)iron;iron Chemical compound [Fe].O[Fe]=O.O[Fe]=O UCNNJGDEJXIUCC-UHFFFAOYSA-L 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000004206 montan acid ester Substances 0.000 description 1
- 235000013872 montan acid ester Nutrition 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- BTFQKIATRPGRBS-UHFFFAOYSA-N o-tolualdehyde Chemical compound CC1=CC=CC=C1C=O BTFQKIATRPGRBS-UHFFFAOYSA-N 0.000 description 1
- QBDSZLJBMIMQRS-UHFFFAOYSA-N p-Cumylphenol Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=CC=C1 QBDSZLJBMIMQRS-UHFFFAOYSA-N 0.000 description 1
- NKTOLZVEWDHZMU-UHFFFAOYSA-N p-cumyl phenol Natural products CC1=CC=C(C)C(O)=C1 NKTOLZVEWDHZMU-UHFFFAOYSA-N 0.000 description 1
- NRZWYNLTFLDQQX-UHFFFAOYSA-N p-tert-Amylphenol Chemical compound CCC(C)(C)C1=CC=C(O)C=C1 NRZWYNLTFLDQQX-UHFFFAOYSA-N 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 229940100595 phenylacetaldehyde Drugs 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- OXNIZHLAWKMVMX-UHFFFAOYSA-N picric acid Chemical compound OC1=C([N+]([O-])=O)C=C([N+]([O-])=O)C=C1[N+]([O-])=O OXNIZHLAWKMVMX-UHFFFAOYSA-N 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical class [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229940037312 stearamide Drugs 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- HFFLGKNGCAIQMO-UHFFFAOYSA-N trichloroacetaldehyde Chemical compound ClC(Cl)(Cl)C=O HFFLGKNGCAIQMO-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 229950002929 trinitrophenol Drugs 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
Abstract
A resin molding material comprising a phenolic resin and glass fibers, wherein the ratio n2/n1 of n1 to n2 is 2.0 or more and 8.0 or less when the melt viscosity of the resin molding material measured under conditions of a mold diameter of 1mm, a mold length of 1mm, a measurement temperature of 155 ℃ and a load of 200kgf is set to n1, and the melt viscosity of the resin molding material measured under conditions of a mold diameter of 3mm, a mold length of 3mm, a measurement temperature of 155 ℃ and a load of 200kgf is set to n2 by using a high-pressure rheometer.
Description
Technical Field
The present application relates to a resin molding material. And more particularly, to a resin molding material for preparing a commutator (commutator).
Background
Commutators (commutators) are one of the uses of phenolic resin molding materials for a wide range of fields. The commutator is one of the components of the motor, and is generally composed of a copper sheet (segment) and a molded article of a thermosetting resin molding material typified by a phenolic resin molding material as an insulator. The essential properties required for the material used for the insulator of the commutator include mechanical strength, heat resistance (in particular, mechanical strength and dimensional stability under heat), dimensional stability, and the like, and thus a glass fiber-reinforced phenolic resin molding material is often used (for example, patent document 1).
In order to maximize the characteristics of such a phenolic resin molding material, it is necessary to improve the filling performance and the filling density of the molded article in the molding stage. In order to enhance the filling property of the molding material, it is considered important to actively provide an air vent in the mold so as to effectively release the gas generated during the curing reaction of the resin material and the gas in the cavity. Thus, a molded article having a high packing density and having an attractive appearance without molding defects such as small bubbles, gas scorching, and flow marks can be obtained.
However, on the other hand, since the phenolic resin molding material is present in the mold at a moment when the melt viscosity is very low, the phenolic resin molding material may flow into a narrow gap such as a vent, and burrs may be generated. Further, such a thin burr is liable to remain in the exhaust port, and if molding is performed in a state where the burr remains, it may cause a significant decrease in filling performance, and thus it is necessary to perform subsequent molding after removing the burr adhering to the mold. If burrs cannot be easily removed in a short time, the productivity of the product is lowered. Further, since the molded product also requires a step of removing burrs, which is a cause of an increase in the steps, the molded product may be molded by using a mold having a structure without vent holes so as not to generate burrs. In this case, since a portion that becomes a dead zone is present in the mold, molding defects such as gas burning may occur when fluidity of the molding material is low.
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open No. 2017-226807
Disclosure of Invention
Problems to be solved by the application
The purpose of the present application is to provide a resin molding material which has excellent filling performance for narrow gaps and good curing moldability, and thus can obtain a molded article with reduced occurrence of molding defects.
Means for solving the problems
The inventors of the present application have intensively studied to solve the above problems, and as a result, found that: the above object can be achieved by adjusting the shear rate and melt viscosity under specific conditions in a resin molding material containing a phenolic resin and glass fibers as essential components and a curing agent as needed, and the present application has been completed.
According to the present application, there is provided a resin molding material as shown below.
[1] A resin molding material comprising a phenolic resin and glass fibers, wherein the ratio n2/n1 of n1 to n2 is 2.0 or more and 8.0 or less when the melt viscosity of the resin molding material measured under conditions of a mold diameter of 1mm, a mold length of 1mm, a measurement temperature of 155 ℃ and a load of 200kgf is set to n1 and the melt viscosity of the resin molding material measured under conditions of a mold diameter of 3mm, a mold length of 3mm, a measurement temperature of 155 ℃ and a load of 200kgf is set to n2 by using a high-pressure rheometer.
[2]According to [1]]The resin molding material of claim 1, wherein the resin molding material has a melt viscosity n1 of 500 Pa.s or more and a shear rate γ1 of 8000s as measured under conditions of a mold diameter of 1mm, a mold length of 1mm, a measurement temperature of 155 ℃ and a load of 200kgf using a high-pressure rheometer －1 The resin molding material has a melt viscosity n2 of 10000 Pa.s or less and a shear rate γ2 of 400s, as measured by a high-pressure rheometer under conditions of a die diameter of 3mm, a die length of 3mm, a measurement temperature of 155 ℃ and a load of 200kgf －1 The above.
[3] The resin molding material according to item [1] or [2], wherein the phenolic resin contains a novolac (novolak) type phenolic resin.
[4] The resin molding material according to any one of [1] to [3], wherein the phenolic resin has a number average molecular weight of 700 to 1100.
[5] The resin molding material according to any one of [1] to [4], wherein the glass fiber has a fiber length of 150 μm or more and 300 μm or less.
[6] The resin molding material according to any one of [1] to [5], wherein the glass fiber has an aspect ratio of 15 to 30.
[7] The resin molding material according to any one of [1] to [6], wherein the resin molding material further contains hexamethylenetetramine.
[8] The resin molding material according to any one of [1] to [7], wherein the content of the glass fiber is 40 parts by mass or more and 190 parts by mass or less relative to 100 parts by mass of the total amount of the phenolic resin and hexamethylenetetramine.
[9] The resin molding material according to any one of [1] to [8], wherein the resin molding material is a resin molding material for a commutator.
Effects of the application
According to the present application, a molding material having excellent filling performance in a narrow gap and good curing moldability can be provided.
Detailed Description
The following describes specific embodiments of the present application. In the present specification, the expression "a to b" means "a or more and b or less".
(resin Molding Material)
The resin molding material of the present embodiment is a molding material for manufacturing a commutator. The resin molding material of the present embodiment contains a phenolic resin and glass fibers, and when the melt viscosity of the resin molding material measured under conditions of a mold diameter of 1mm, a mold length of 1mm, a measurement temperature of 155 ℃ and a load of 200kgf is set to n1, and the melt viscosity of the resin molding material measured under conditions of a mold diameter of 3mm, a mold length of 3mm, a measurement temperature of 155 ℃ and a load of 200kgf is set to n2, n2/n1 is set to 2.0 or more and 8.0 or less.
The resin molding material of the present embodiment contains a phenolic resin and glass fibers as essential components and has a melt viscosity ratio n2/n1 defined by the above conditions, and therefore can improve the filling performance into a narrow gap and an end portion of a mold having a target shape, and can prevent or reduce voids caused by entrapment of air bubbles. Thus, a molded article free from molding defects or reduced in molding defects can be obtained.
(phenolic resin)
The phenolic resin used in the resin molding material of the present embodiment contains a novolac type phenolic resin. The novolak type phenol resin is a resin obtained by polycondensing phenols with aldehydes in the presence of an acid catalyst, and a novolak type phenol resin conventionally used for molding materials can be used. The molecular weight of the novolak type phenol resin is preferably in the range of 700 to 1100, more preferably in the range of 800 to 1000, from the viewpoint of moldability of the obtained resin molding material.
The phenolic resin used in the resin molding material of the present embodiment may contain a resol (resol) type phenolic resin. The resol is a resin obtained by reacting phenols with aldehydes in the presence of an alkaline catalyst. When the resol-type phenolic resin is contained, the number average molecular weight thereof is preferably in the range of 500 to 900, more preferably in the range of 600 to 800, from the viewpoint of moldability.
Examples of phenols used for synthesizing the phenolic resin include: phenol; cresols such as o-cresol, m-phenol and p-cresol; ethylphenols such as o-ethylphenol, m-ethylphenol and p-ethylphenol; butylphenols such as isopropyl phenol, butylphenol, and p-tert-butylphenol; alkylphenols such as p-tert-pentylphenol, p-octylphenol, p-nonylphenol and p-cumylphenol; halogenated phenols such as fluorophenol, chlorophenol, bromophenol and iodophenol; monohydric phenol substituents such as p-phenylphenol, aminophenol, nitrophenol, dinitrophenol, trinitrophenol, etc.: monohydric phenols such as 1-naphthol and 2-naphthol; resorcinol, alkyl resorcinol, pyrogallol, catechol, alkyl catechol, hydroquinone, alkyl hydroquinone, pyrogallol, bisphenol a, bisphenol F, bisphenol S, polyhydric phenols such as dihydroxynaphthalene, and the like. These phenols may be used singly or in combination of two or more.
Examples of aldehydes used for synthesizing the phenolic resin include formaldehyde, paraformaldehyde, trioxane, acetaldehyde, propionaldehyde, polyoxymethylene, chloral, hexamethylenetetramine, furfural, glyoxal, n-butyraldehyde, hexanal, allylaldehyde, benzaldehyde, crotonaldehyde, acrolein, tetraoxymethylene, phenylacetaldehyde, o-tolualdehyde, salicylaldehyde, and the like. These aldehydes may be used alone or in combination of two or more. In addition, precursors of these aldehydes or solutions of these aldehydes may also be used. Among them, an aqueous formaldehyde solution is preferably used from the viewpoint of manufacturing cost.
When the phenolic resin used in the resin molding material of the present embodiment contains a resol type phenolic resin in addition to a novolac type phenolic resin, the mass ratio of the phenolic resin to the resol type phenolic resin (novolac type phenolic resin/resol type phenolic resin) is preferably in the range of 90/10 to 60/40. This ensures heat resistance, mechanical strength and dimensional stability of the molded article obtained.
(curing agent)
The resin molding material containing a novolak-type phenol resin generally uses hexamethylenetetramine as a curing agent. When hexamethylenetetramine is used, the content thereof is preferably 10 to 30 parts by weight, particularly preferably 15 to 25 parts by weight, relative to 100 parts by weight of the novolak-type phenol resin. By setting the content of hexamethylenetetramine within the above range, the mechanical strength of the obtained molded article can be optimized.
(glass fiber)
The resin molding material of the present embodiment contains glass fibers. By containing glass fibers, the shear rate and melt viscosity of the resin molding material can be adjusted to desired levels. In addition, the use of glass fibers can impart mechanical strength, heat resistance, and dimensional stability to the commutator obtained by using the resin molding material.
The form of the glass fiber is not particularly limited as long as the fiber bundles can be opened when mixed with the phenolic resin component, and may be chopped strands (chopped strands), glass fibers (cut fibers), or the like. The glass fiber may be surface-treated with, for example, a coupling agent. As the silane coupling agent, known coupling agents can be used, and examples thereof include γ -glycidoxypropyl trimethoxysilane, β - (3, 4-epoxycyclohexyl) ethyl trimethoxysilane, N- β - (aminoethyl) - γ -aminopropyl methyldimethoxy silane, γ -aminopropyl triethoxy silane, N-phenyl- γ -aminopropyl trimethoxysilane, γ -mercaptopropyl trimethoxysilane, γ -chloropropyl trimethoxysilane, and the like. Among them, amino silanes or epoxy silanes are particularly preferred from the viewpoints of mechanical strength, heat resistance, operability in the production process of the molding material obtained, and the like.
The length (fiber length) of the glass fibers is preferably, for example, 150 μm or more and 300 μm or less, more preferably 180 μm or more and 300 μm or less, and still more preferably 200 μm or more and 300 μm or less. The fiber length of the glass fiber is in the above range, and the obtained resin molding material has the above range of shear rate and melt viscosity, and thus has excellent filling property and moldability. As a result, the molded article obtained from the resin molding material has no molding defect, and a high-quality product can be obtained. Further, by the fiber length of the glass fiber being in the above range, a finer molded article excellent in surface smoothness can be properly molded.
From the viewpoints of filling performance and moldability of the obtained resin molding material, the aspect ratio (fiber length/average diameter) of the glass fiber is preferably 15 to 30.
The diameter of the glass fiber is not particularly limited as long as it can be mixed with the phenolic resin component, and for example, glass fiber having a diameter of 5 μm to 20 μm can be used.
The content of the glass fiber is, for example, 40 to 190 parts by mass, preferably 50 to 180 parts by mass, more preferably 60 to 170 parts by mass, based on 100 parts by mass of the total of the phenolic resin and hexamethylenetetramine. Thus, not only the shear rate and melt viscosity of the obtained resin molding material can be controlled within desired ranges, but also mechanical strength and dimensional stability can be imparted to the molded article obtained by using the molding material.
(other additives)
The resin molding material of the present embodiment may contain other additives as necessary. Examples of the usable additives include inorganic fibers other than the glass fibers, inorganic fillers, curing aids, colorants, mold release agents, lubricants, flame retardants, and surface treatment agents for fillers.
As the inorganic filler, calcium carbonate, talc, mica, aluminum hydroxide, magnesium hydroxide, silica, diatomaceous earth, alumina, and the like are typically mentioned.
The curing aid is a curing aid for the phenolic resin component, and examples thereof include calcium hydroxide, calcium oxide, magnesium oxide, and the like.
Examples of the colorant include known pigments such as carbon black, titanium oxide, barium sulfate, iron black, and iron oxide red, and known dyes such as nigrosine and alizarin.
Examples of the release agent include known release agents such as synthetic polyethylene wax, silicone wax, carnauba wax, and montan acid wax.
Examples of the flame retardant include phosphorus and aluminum hydroxide.
Examples of the lubricant include fatty acid metal soaps such as zinc stearate, fatty acid esters, fatty acid amides, and the like.
Examples of the surface treatment agent for the filler include cationic ammonium salts and coupling agents, and as the coupling agent, a coupling agent having an unsaturated double bond such as an amino group, a mercapto group, a carboxyl group, or a vinyl group can be used, and among these, a coupling agent having an amino group is more preferable.
(method for producing resin Molding Material)
The resin molding material of the present embodiment can be produced by, for example, mixing the above-described components uniformly, then heating and melt-kneading the mixture by using a kneading apparatus such as a roll, a co-kneader, or a twin-screw extruder alone or in combination with other mixing apparatuses, and then granulating or pulverizing the mixture.
In the kneading step, a phenolic resin component is mixed with a filler component including glass fibers. Thus, the phenolic resin component was blended with the glass fibers, and the glass fiber bundles were opened. In the resin molding material of one embodiment, it is important to maintain the fiber length of the glass fiber at a predetermined length, for example, 150 μm or more. Therefore, in the kneading step, the resin component and the filler component are mixed so as not to exert excessive shear stress, so that the glass fibers are not broken to cause a reduction in the fiber length thereof. In the kneading step, a known mixing apparatus may be used, and for example, a twin roll type mixing apparatus or a single shaft type rotating blade type stirring apparatus may be used. The mixing conditions in the kneading apparatus can be appropriately designed in consideration of the scale of the apparatus and the mixing efficiency of the composition. The kneading may be performed, for example, using a heated roll at a resin temperature of 70 to 90℃for 2 to 10 minutes.
The index (n 2/n 1) of the resin molding material of the present embodiment obtained by the above method is 2.0 or more and 8.0 or less, preferably 3.0 or more and 7.0 or less, measured under the following conditions.
Conditions are as follows: the melt viscosity of the resin molding material measured using a high-pressure rheometer under conditions of a mold diameter of 1mm, a mold length of 1mm, a measured temperature of 155℃and a load of 200kgf was set to n1; similarly, the melt viscosity of the resin molding material measured using a high-pressure rheometer under conditions of a mold diameter of 3mm, a mold length of 3mm, a measurement temperature of 155℃and a load of 200kgf was set to n2.
In a preferred embodiment, the resin molding material of the present embodiment obtained by the above-described method has a shear rate γ1 of 8000s, measured under the following conditions －1 Hereinafter, 6000s are preferable －1 Hereinafter, 5500s is more preferable －1 Hereinafter, the melt viscosity n1 is 500 Pa.s or more, preferably 800 Pa.s or more, more preferably 900 Pa.s or more, and the shear rate γ2 is 400s －1 Above, preferably 600s －1 Above, more preferably 650s －1 As described above, the melt viscosity n2 is 10000pa·s or less, preferably 9000pa·s or less, and more preferably 8500pa·s or less.
Conditions are as follows: the shear rate of the resin molding material measured using a high-pressure rheometer under conditions of a mold diameter of 1mm, a mold length of 1mm, a measured temperature of 155 ℃ and a load of 200kgf was set to γ1 and the melt viscosity was set to n1; similarly, the shear rate of the resin molding material measured using a high-pressure rheometer under conditions of a mold diameter of 3mm, a mold length of 3mm, a measurement temperature of 155℃and a load of 200kgf was set to γ2 and the melt viscosity was set to n2.
The lower limit value of the shear rate γ1 of the resin molding material measured under the above conditions of the resin molding material of the present embodiment is, for example, 1000s －1 The upper limit of the melt viscosity n1 is, for example, 4000 Pa.s or less, and the upper limit of the shear rate γ2 is 5000s －1 The lower limit of the melt viscosity n2 is 500 pas or more.
(use)
The commutator can be manufactured by using the resin molding material of the present embodiment by various molding methods. In the molding process for manufacturing the commutator, the molded article may be molded by a known method such as compression molding, transfer molding, injection molding, extrusion molding, or the like, but it is preferable to mold the molded article by a method in which a shearing stress is not applied to the molding material. Accordingly, molding by compression molding is more preferable, and thus, when the molding material is filled in the mold, the molding material can be molded into a molded article while preventing breakage of the glass fibers. Therefore, the toughness of the molded article formed of the molding material can be prevented from being reduced by breakage of the glass fibers.
The embodiments of the present application have been described above, but these are merely examples of the present application, and various modes other than the above can be adopted.
Examples
Hereinafter, the present application is described by way of examples and comparative examples, but the present application is not limited thereto.
Examples 1 to 7 and comparative example 1
The components were mixed in the mixing amounts shown in table 1, and the obtained mixture was kneaded with heated rolls having different rotation speeds, molded into a sheet shape, and cooled. The obtained sheet-like resin molding material was pulverized to obtain a granular molding material. The kneading conditions of the heated rolls were as follows.
Rotational speed: 20rpm/14rpm (high speed side/low speed side)
Temperature: 70-80 deg.C/20 deg.C (high speed side/low speed side)
Mixing time: 5-10 minutes
Details of the components shown in table 1 are as follows.
Novolac type phenolic resin: number average molecular weight of PR-53194 (product name) manufactured by Sumitomo electric Co., ltd.): 700
Resol phenolic resin: PR-53529 (product name) manufactured by Sumitomo electric Wood Co., ltd
Glass fiber: nitto Boseki co., ltd. CS3E479S (product name), fiber length: 3000 μm, average diameter: 10 μm, aspect ratio: 300
Curing agent: hexamethylene tetramine
Curing auxiliary: calcium hydroxide
Mold release agent 1: montanic acid esters
Mold release agent 2: stearamide
Pigment: carbon black
The physical properties shown below of the resin molding materials obtained in examples and comparative examples were measured. The measurement results are shown in Table 1.
(residual glass fiber Length)
The fiber length of the glass fiber in the resin molding material obtained by the above method was measured by dissolving the resin molding material with a solvent, measuring the length of the extracted glass fiber, and calculating the volume average fiber length. Although all the glass fibers are the same product, the materials with different fiber lengths are manufactured by adjusting the production conditions and controlling the breakage of the fibers.
(shear Rate, melt viscosity)
The shear rate (. Gamma.1) and the melt viscosity (. N1) were measured using a high-pressure rheometer (CFT-500C manufactured by Shimadzu corporation) under conditions of a die diameter of 1mm, a die length of 1mm, a measurement temperature of 155℃and a load of 200 kgf. Similarly, the shear rate (. Gamma.2) and the melt viscosity (. Gamma.2) were measured under test conditions of a die diameter of 3mm, a die length of 3mm, a measurement temperature of 155℃and a load of 200kgf using a high-grade rheometer.
From the obtained values of the melt viscosity (n 1) and the melt viscosity (n 2), the value of n2/n1 was calculated.
Shear rate is in "s －1 The unit of melt viscosity is "Pa.s".
The resin molding materials obtained in examples and comparative examples were used for the following evaluation. The results obtained are shown in Table 1.
(formability)
The molded article was molded into a cylindrical molded article by transfer molding using a dish gate, and moldability was evaluated based on the presence or absence of air bubbles on the bottom surface of the molded article and the size of the air bubbles. As a standard, the case where there was no bubble was rated as "a", the case where there was a bubble of 1mm or less in size was rated as "B", and the case where there was a bubble exceeding 1mm in size was rated as "C".
TABLE 1
| <Composition of resin molding material> | Unit (B) | Example 1 | Example 2 | Example 3 | Example 4 | Example 5 | Example 6 | Example 7 | Comparative example 1 |
| Novolac phenolic resin | Parts by mass | 26 | 26 | 26 | 26 | 26 | 26 | 26 | 26 |
| Resol-type phenolic resin | Parts by mass | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Glass fiber | Parts by mass | 62 | 62 | 62 | 62 | 62 | 62 | 62 | 62 |
| Curing agent | Parts by mass | 4.5 | 4.5 | 4.5 | 4.5 | 4.5 | 4.5 | 4.5 | 4.5 |
| Curing auxiliary | Parts by mass | 0.5 | 0.5 | 0.5 | 05 | 05 | 05 | 05 | 05 |
| Release agent 1 | Parts by mass | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Mold release agent 2 | Parts by mass | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Pigment | Parts by mass | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| <Production conditions> | |||||||||
| Temperature (high-speed side) | ℃ | 80 | 80 | 80 | 80 | 70 | 70 | 70 | 80 |
| Mixing time | Minute (min) | 8 | 7 | 6 | 5 | 5 | 7 | 10 | 10 |
| <Physical Properties of resin Molding Material> | |||||||||
| Residual glass fiber length | μm | 150 | 200 | 250 | 300 | 300 | 200 | 100 | 100 |
| Melt viscosity ratio (n 2/n 1) | 3.3 | 3.9 | 5.6 | 4.5 | 7.1 | 4.3 | 2.3 | 1.8 | |
| Melt viscosity n1 at a die diameter of 1mm and a die length of 1mm | Pa·s | 1500 | 1550 | 1600 | 2000 | 1200 | 700 | 400 | 850 |
| Melt viscosity n2 at a die diameter of 3mm and a die length of 3mm | Pa·s | 5000 | 6000 | 9000 | 9000 | 8500 | 3000 | 900 | 1500 |
| Shear rate Y1 at a die diameter of 1mm and a die length of 1mm | s -1 | 3000 | 3500 | 3000 | 3500 | 3500 | 6000 | 9500 | 6000 |
| Shear rate Y2 at a die diameter of 3mm and a die length of 3mm | s -1 | 600 | 700 | 800 | 900 | 750 | 1500 | 3000 | 850 |
| <Evaluation of Performance of resin Molding Material> | |||||||||
| Moldability (formability) | - | B | A | A | A | A | B | B | C |
From the above, it can be confirmed that: the phenolic resin molding material of the present embodiment has good moldability when used for transfer molding.
The present application is based on the priority of Japanese patent application No. 2022-062821 filed on 5/4/2022, the contents of which are incorporated herein in their entirety.
Claims (9)
1. A resin molding material, characterized in that,
comprises phenolic resin and glass fiber, wherein the phenolic resin and the glass fiber are mixed,
when the melt viscosity of the resin molding material measured under the conditions of a mold diameter of 1mm, a mold length of 1mm, a measurement temperature of 155 ℃ and a load of 200kgf is set as n1, and the melt viscosity of the resin molding material measured under the conditions of a mold diameter of 3mm, a mold length of 3mm, a measurement temperature of 155 ℃ and a load of 200kgf is set as n2 using a high-pressure rheometer, the ratio n2/n1 of n1 to n2 is 2.0 or more and 8.0 or less.
2. The resin molding material according to claim 1, wherein,
the melt viscosity n1 of the resin molding material measured under conditions of a mold diameter of 1mm, a mold length of 1mm, a measurement temperature of 155 ℃ and a load of 200kgf by using a high-pressure rheometer is 500 Pa.s or more, and the shear rate gamma 1 is 8000s －1 Hereinafter, and
the melt viscosity n2 of the resin molding material measured under conditions of a mold diameter of 3mm, a mold length of 3mm, a measured temperature of 155 ℃ and a load of 200kgf using a high-pressure rheometer is 10000 Pa.s or less, and the shear rate gamma 2 is 400s －1 The above.
3. The resin molding material according to claim 1, wherein,
the phenolic resin contains a novolac type phenolic resin.
4. The resin molding material according to claim 1, wherein,
the number average molecular weight of the phenolic resin is more than 700 and less than 1100.
5. The resin molding material according to claim 1, wherein,
the fiber length of the glass fiber is more than 150 mu m and less than 300 mu m.
6. The resin molding material according to claim 1, wherein,
the glass fiber has an aspect ratio of 15 to 30.
7. The resin molding material according to claim 1, wherein,
the resin molding material further contains hexamethylenetetramine.
8. The resin molding material according to claim 7, wherein,
the content of the glass fiber is 40 to 190 parts by mass based on 100 parts by mass of the total amount of the phenolic resin and hexamethylenetetramine.
9. The resin molding material according to any one of claims 1 to 8, wherein,
the resin molding material is a resin molding material for a commutator.
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| JP2022062821A JP2023153505A (en) | 2022-04-05 | 2022-04-05 | resin molding material |
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