CN116884885B - Wafer finish-washing tool - Google Patents
Wafer finish-washing tool Download PDFInfo
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- CN116884885B CN116884885B CN202311141737.0A CN202311141737A CN116884885B CN 116884885 B CN116884885 B CN 116884885B CN 202311141737 A CN202311141737 A CN 202311141737A CN 116884885 B CN116884885 B CN 116884885B
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- cylinder
- wafer
- transmission
- fine
- side wall
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- 238000005406 washing Methods 0.000 title claims abstract description 114
- 230000005540 biological transmission Effects 0.000 claims abstract description 89
- 239000000463 material Substances 0.000 claims abstract description 71
- 238000001035 drying Methods 0.000 claims abstract description 19
- 238000011010 flushing procedure Methods 0.000 claims abstract description 13
- 238000000926 separation method Methods 0.000 claims abstract description 6
- 235000012431 wafers Nutrition 0.000 claims description 100
- 238000004140 cleaning Methods 0.000 claims description 67
- 238000007789 sealing Methods 0.000 claims description 37
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 34
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims description 27
- 235000017491 Bambusa tulda Nutrition 0.000 claims description 27
- 241001330002 Bambuseae Species 0.000 claims description 27
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims description 27
- 239000011425 bamboo Substances 0.000 claims description 27
- 230000000750 progressive effect Effects 0.000 claims description 24
- 238000007599 discharging Methods 0.000 claims description 18
- 244000309464 bull Species 0.000 claims description 9
- 230000008878 coupling Effects 0.000 claims description 6
- 238000010168 coupling process Methods 0.000 claims description 6
- 238000005859 coupling reaction Methods 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims 2
- 239000007921 spray Substances 0.000 description 23
- 239000007788 liquid Substances 0.000 description 19
- 239000003814 drug Substances 0.000 description 18
- 238000000034 method Methods 0.000 description 15
- 238000002955 isolation Methods 0.000 description 12
- 238000012546 transfer Methods 0.000 description 6
- 238000010981 drying operation Methods 0.000 description 5
- 230000014759 maintenance of location Effects 0.000 description 3
- 238000012827 research and development Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
Abstract
The application provides a wafer fine-washing tool, which relates to the technical field of wafer fine-washing tools and comprises a base, wherein three fine-washing rollers which are respectively used for washing, flushing and drying are sequentially arranged above the base, two ends of each fine-washing roller are respectively connected with a supporting cylinder in a rotating manner, four material conveying cylinders are arranged above each fine-washing roller at intervals, each supporting cylinder is fixedly communicated with each material conveying cylinder through a separation box, a material carrying short cylinder is sleeved on the inner side wall of each fine-washing roller in a threaded manner, a cylinder inner transmission structure for transmitting the material carrying short cylinder is arranged between the fine-washing rollers, a movable cover plate is hinged on the side wall of each material carrying short cylinder, and two limit transmission rods are connected onto the side wall of each material carrying short cylinder in a rotating manner.
Description
Technical Field
The application relates to the technical field of wafer finish-washing tools, in particular to a wafer finish-washing tool.
Background
The semiconductor cleaning technology can be divided into a wet method and a dry method, the wet method cleaning is a main current technical route, and accounts for more than 90% of the number of chip manufacturing cleaning steps, the wet method cleaning adopts specific chemical liquid and deionized water, the surface of a wafer is cleaned in a non-damaging manner, and when the wafer is washed in a fine manner, the cleaning, flushing and drying processes are completed through a fine cleaning tool.
The prior art provides a new direction for the research and development of diversity in industry, so the application provides a wafer fine-cleaning tool, which is used for carrying out double-sided efficient fine-cleaning on a wafer, improving fine efficiency, and avoiding secondary pollution in the processes of cleaning, flushing and drying.
Disclosure of Invention
The application aims to provide a double-sided efficient fine washing tool capable of carrying out double-sided efficient fine washing on a wafer and avoiding secondary pollution in the fine washing process in the direction of providing the double-sided efficient cleaning tool for the research and development of diversity in industry.
In order to achieve the above purpose, the present application adopts the following technical scheme: the utility model provides a wafer finish-washing frock, includes the base, the top of base is equipped with three finish-washing cylinder that is used for wasing respectively, washes, dries in proper order, the both ends of finish-washing cylinder all rotate and are connected with the support section of thick bamboo, the top interval of finish-washing cylinder is provided with four transfer cylinders, the support section of thick bamboo all passes through the fixed intercommunication of baffle box and transfer cylinder, all screw thread has cup jointed on the inside wall of finish-washing cylinder and has carried the short section of thick bamboo of thing, be provided with the transmission structure in the section of thick bamboo that is used for carrying the transmission of thing between the finish-washing cylinder, articulated on the lateral wall of carrying the short section of thick bamboo have movable cover plate, it is connected with two spacing transfer lines to rotate jointly on the lateral wall of carrying the short section of thick bamboo, the inside location structure that is provided with is used for synchronous centre gripping of wafer on the spacing transfer line, the movable cover plate opens and closes on the lateral wall of carrying the short section of thick bamboo, the inside of carrying the short section of thick bamboo is provided with the finish-washing structure that is used for wasing, washes, dries, install control baffle box and seal box and support between the barrel and the transmission structure in the section of thick bamboo, be provided with between the transmission assembly and the transmission between the transmission assembly is connected with one between the transmission assembly and the transmission assembly in the transmission between the two sides through the transmission between the closed section of thick bamboo.
In at least some embodiments, the retention structure includes the actuating lever that opens and shuts, the one end of actuating lever that opens and shuts runs through in proper order and rotates the lateral wall of connecting the support section of thick bamboo and extend to the outside of support section of thick bamboo, the articulated shaft of removable cover and carrying the short section of thick bamboo all slides and cup joints on the lateral wall of actuating lever that opens and shuts, the actuating lever that opens and shuts is located the outside one end of support section of thick bamboo and articulates there is the push pedal, the one end that the actuating lever was kept away from to the push pedal articulates there is the electric putter, the tail end of electric putter articulates on the lateral wall of support section of thick bamboo, install two top wheels on the inside wall of removable cover, install the return pulley on the inside wall of carrying the short section of thick bamboo, the shaft of return pulley all slides and cup joints on the lateral wall of spacing transfer line, top wheel and return pulley are used for centre gripping wafer jointly.
In at least some embodiments, the transmission structure in the section of thick bamboo is including rotating the transmission bull stick of connecting on the base, the rigid coupling has three drive gear on the lateral wall of transmission bull stick, all fixedly cup joint the transmission ring gear on the lateral wall of finish-washing cylinder, the transmission ring gear all is connected with drive gear meshing, the one end and the drive assembly of transmission bull stick are connected.
In at least some embodiments, the fine washing structure comprises three pairs of spray heads fixedly connected to the inner side walls of the carrying short cylinder respectively, the spray heads are fixedly connected through short pipes, a pair of cleaning brushes are arranged in the carrying short cylinder in the fine washing cylinder and used for cleaning, one end of the fine washing cylinder is fixedly connected with an inner storage pipe, a spiral pipe is fixedly connected to the side walls of the inner storage pipe, one end of the spiral pipe is fixedly connected with the spray heads, a water pipe and an air pump are respectively fixedly connected to the other end of the spiral pipe, a water pump is fixedly connected to the outer side walls of the water pipe, water valves are respectively arranged on the pipe walls of the two sides of the water pump, and the water inlet ends of the water pump can be fixedly connected with the adjacent inner storage pipes and used for circulating liquid medicine in the same fine washing cylinder.
In at least some embodiments, the seal structure includes six arc slide rails of rigid coupling respectively on supporting the section of thick bamboo, equal sliding connection has the arc shrouding between arc slide rail and the baffle box, the arc shrouding is used for shutoff baffle box and supporting the section of thick bamboo, all be provided with on the lateral wall of arc shrouding and seal the tooth of biting, the arc shrouding all is connected with the seal gear through the seal tooth meshing on the lateral wall, seal the sealed bull stick of fixed sleeve joint jointly of inside wall of seal gear, seal the bull stick and install on the lateral wall of passing the feed cylinder, the one end rigid coupling of seal the bull stick has driving motor.
In at least some embodiments, the progressive feeding and discharging assembly comprises a sliding rod and a threaded screw rod, one ends of the sliding rod and the threaded screw rod sequentially penetrate through the side wall of a fixed connection material conveying cylinder, the outer side wall of the sliding rod is fixedly connected with the material conveying cylinder, the outer side wall of the threaded screw rod is rotationally connected with the material conveying cylinder, a transmission motor is fixedly connected to the output end of the threaded screw rod, a frame plate is arranged in the material conveying cylinder, one end of the frame plate is slidably sleeved on the outer side wall of the sliding rod, the other end of the frame plate is threadably connected on the outer side wall of the threaded screw rod in a threaded manner, two transverse movable plates are slidably sleeved on the outer side wall of the frame plate, an air cylinder is fixedly connected between the transverse movable plates and the side wall of the transverse movable plates, a transverse movable rod is fixedly connected to the inner side wall of the vertical movable rod in the material conveying cylinder in a sliding manner, an electric telescopic rod is fixedly connected to the top of the frame plate, the output end of the electric telescopic rod is fixedly connected to the middle of the transverse rod, and a clamping plate is fixedly connected to the bottom of the vertical movable rod.
In at least some embodiments, the limit transmission rod is a polygonal cylinder, and the outer side walls of the limit transmission rod are rotationally connected with the side walls of the supporting cylinder through the sealing shaft sleeve.
In at least some embodiments, the open-close driving rod is a polygonal cylinder, and the outer side walls of the open-close driving rod are all rotationally connected with the side walls of the supporting cylinder through the sealing shaft sleeve.
In at least some embodiments, the top of the support cylinder is provided with a return opening for the wafer and the progressive loading and unloading assembly to pass through.
Compared with the prior art, the application has the advantages and positive effects that:
1. according to the application, the object carrying short cylinder, the movable cover plate, the limiting transmission rod, the bottom wheel, the in-cylinder transmission structure, the driving assembly and the retention structure are arranged, so that the fine washing roller rotates to drive the object carrying short cylinder to move in the interior of the object carrying short cylinder, the wafer is driven to synchronously rotate while being transmitted between the two supporting cylinders, the fine washing structure and the progressive feeding and discharging assembly are arranged, the wafer is alternately transmitted in the material conveying cylinder and the fine washing roller, and in the process of transmitting in the three fine washing rollers, the double-sided cleaning, washing and drying processes of the wafer are completed, and the cleaning, washing and drying processes are synchronously carried out, so that the wafer is subjected to high-efficiency fine washing.
2. According to the application, the material conveying cylinder, the isolation boxes and the sealing structures are arranged, so that the isolation boxes between two adjacent fine washing cylinders are blocked by the sealing structures in the internal transmission and fine washing processes of the fine washing cylinders, and the supporting cylinders at the two ends of the fine washing cylinders are sealed in the transmission process of the fine washing cylinders to the material carrying short cylinder through the internal transmission structure of the fine washing cylinders, so that the pollution of the washed liquid medicine in the fine washing process to the wafers in the washing and drying processes is avoided.
3. According to the application, by arranging the fine washing structure, the liquid medicine used in the washing and rinsing processes can be recycled through the water pump and the water pipe, and the liquid medicine used in the rinsing process, namely the liquid medicine in the rinsing fine washing roller, can be directly pumped into the liquid medicine in the washing process, and can be reused, so that the fine washing cost is reduced.
Drawings
FIG. 1 is a schematic perspective view of a wafer finishing tool according to the present application;
FIG. 2 is an exploded view of a finishing drum and a transfer drum in a wafer finishing tool according to the present application;
FIG. 3 is an exploded view of a wafer finishing tool finishing drum and support drum according to the present application;
fig. 4 is a schematic perspective view of a carrier short cylinder and a movable cover plate in a wafer finish-washing tool according to the present application;
FIG. 5 is a schematic view of a carrier short cylinder and a movable cover plate in a wafer finish cleaning tool according to the present application;
FIG. 6 is a schematic diagram showing a combination state of movable cover plates in a wafer finish cleaning tool according to the present application;
FIG. 7 is an exploded view of a feed cylinder and a progressive loading and unloading assembly in a wafer finishing tool according to the present application;
FIG. 8 is a partial perspective view of a closed structure in a wafer finish cleaning tool according to the present application;
fig. 9 is a schematic structural view showing a closed state of the arc-shaped sealing plate 82 in the wafer finish cleaning tool according to the present application;
FIG. 10 is a perspective view of a progressive loading and unloading assembly in a wafer finishing tool according to the present application
FIG. 11 is a schematic diagram of a portion of a fine cleaning structure in a wafer fine cleaning tool according to the present application;
fig. 12 is a schematic structural view of a retaining structure and a driving assembly in a wafer finishing tool according to the present application.
Legend description: 1. a fine washing roller; 11. a support cylinder; 12. a return port;
2. a material conveying cylinder; 21. an isolation box;
3. a short carrying cylinder; 31. a removable cover; 32. a limit transmission rod; 33. a bottom wheel;
4. a transmission structure in the cylinder; 41. a transmission rotating rod; 42. a transmission gear; 43. a drive ring gear;
5. a drive assembly;
6. a retention structure; 61. an opening and closing driving rod; 62. an electric push rod; 63. a push plate; 64. a top wheel;
7. a fine washing structure; 71. a cleaning brush; 72. a spray head; 73. a built-in pipe; 74. a spiral tube; 75. a water pump; 76. an air pump; 77. a water pipe;
8. a closed structure; 81. an arc-shaped slide rail; 82. arc-shaped sealing plates; 83. a closed gear; 84. closing the biting teeth; 85. closing the rotating rod;
9. progressive loading and unloading components; 91. a slide bar; 92. a threaded screw rod; 93. a frame plate; 94. a transverse movable plate; 95. an electric telescopic rod; 96. a cross bar; 97. a vertical movable rod; 98. and (3) clamping plates.
Detailed Description
In order that the above objects, features and advantages of the application will be more clearly understood, a further description of the application will be rendered by reference to the appended drawings and examples. It should be noted that, without conflict, the embodiments of the present application and features in the embodiments may be combined with each other.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application, however, the present application may be practiced otherwise than as described herein, and therefore the present application is not limited to the specific embodiments of the disclosure that follow.
Therefore, the embodiment of the application provides a wafer fine-washing tool, which aims at providing a fine-washing tool capable of carrying out double-sided efficient fine-washing on a wafer and avoiding secondary pollution in the fine-washing process in the direction that the double-sided efficient wafer cleaning tool is provided for the research and development of diversity in industry.
Example 1
According to fig. 1-12, as shown in fig. 1, a wafer fine washing tool provided by the embodiment of the application comprises a base, three fine washing drums 1 respectively used for cleaning, flushing and drying are sequentially arranged above the base, two ends of each fine washing drum 1 are respectively and rotatably connected with a supporting drum 11, each fine washing drum 1 is installed on the base through the supporting drum 11, four material conveying drums 2 are arranged above each fine washing drum 1 at intervals, each supporting drum 11 is fixedly communicated with each material conveying drum 2 through a separation box 21, two fine washing drums 1 are communicated with each other through the separation boxes 21 and the material conveying drums 2, carrier short drums 3 are respectively and spirally sleeved on inner side walls of each fine washing drum 1, movable cover plates 31 are hinged on side walls of the carrier short drums 3, two limit transmission rods 32 are jointly connected on side walls of the carrier short drums 3, four material conveying drums 3 are internally provided with limit transmission rods for synchronously clamping the wafers on the wafer short drums 3, the limit transmission rods are fixedly communicated with each material conveying drum 2 through the separation boxes 21, a seal assembly is arranged between the inner side walls of the carrier short drums 1 and the carrier short drums 3 through the separation boxes 2, the seal assembly is connected with the seal assembly 5, and the seal assembly is arranged between the seal assembly is connected with the seal assembly 5, and the seal assembly is arranged between the seal assembly is connected with the seal assembly 2, and the seal assembly is connected between the seal assembly is connected with the seal assembly through the seal assembly, and the seal assembly is by the seal assembly and has a seal assembly.
According to fig. 2, 3, 4, 6 and 12, as shown in fig. 3, the retaining structure 6 comprises an opening and closing driving rod 61, one end of the opening and closing driving rod 61 sequentially penetrates through the side wall of the rotary connection support cylinder 11 and extends to the outside of the support cylinder 11, as shown in fig. 4, the movable cover plate 31 and the hinge shaft of the short carrier cylinder 3 are both in sliding sleeve joint with the outer side wall of the opening and closing driving rod 61, as shown in fig. 12, one end of the opening and closing driving rod 61 positioned at the outside of the support cylinder 11 is hinged with a push plate 63, one end of the push plate 63 far away from the opening and closing driving rod 61 is hinged with an electric push rod 62, the tail end of the electric push rod 62 is hinged with the outer side wall of the support cylinder 11, as shown in fig. 5, two top wheels 64 are arranged on the inner side wall of the movable cover plate 31, a bottom wheel 33 is arranged on the inner side wall of the short carrier cylinder 3, the wheel shafts of the bottom wheel 33 are both in sliding sleeve joint with the outer side wall of the limit transmission rod 32, the top wheel 64 and the bottom wheel 33 are used for clamping a wafer together, the electric push rod 62 drives the tail of the electric push rod 62 to rotate on the supporting cylinder 11 by pushing the output end of the electric push rod 62, the top end pushes the push plate 63 to drive the opening and closing driving rod 61 to rotate, the movable cover plate 31 is driven to rotate on the short carrier 3 by the opening and closing driving rod 61, the side wall of the short carrier 3 is opened enough to place the wafer inwards, the opening and closing driving rod 61 can be driven to rotate reversely to drive the movable cover plate 31 to be combined on the short carrier 3, the short carrier 3 and the movable cover plate 31 are combined, the outer wall threads are driven to drive the inside of the fine washing roller 1, the two top wheels 64 are driven to abut against the wafer, the two top wheels 64 and the bottom wheels 33 on the two limit transmission rods 32 are clamped outside the wafer together, when the limit transmission rods 32 rotate, the wafer is driven to rotate in the carrier short cylinder 3 by the transmission structure 4 in the carrier short cylinder 3.
As shown in fig. 3, the top of the supporting cylinder 11 is provided with a return port 12 for the wafers and the progressive loading and unloading assembly 9 to pass through;
the opening and closing driving rod 61 is a polygonal cylinder, and the outer side walls of the opening and closing driving rod 61 are all in rotary connection with the side walls of the supporting cylinder 11 through sealing shaft sleeves; the limit transmission rod 32 is a polygonal cylinder, and the outer side walls of the limit transmission rod 32 are rotationally connected with the side walls of the supporting cylinder 11 through the sealing shaft sleeve.
According to fig. 2, fig. 3, fig. 7 and fig. 12, as shown in fig. 3, the in-cylinder transmission structure 4 comprises a transmission rotating rod 41 rotatably connected to the base, three transmission gears 42 are fixedly connected to the outer side wall of the transmission rotating rod 41, transmission toothed rings 43 are fixedly sleeved on the outer side wall of the finishing drum 1, the transmission toothed rings 43 are in meshed connection with the transmission gears 42, as shown in fig. 12, one end of the transmission rotating rod 41 is connected with the driving assembly 5, one end of the transmission rotating rod 41 is connected with one end of any limit transmission rod 32 through a chain belt and a chain wheel assembly, the outer side walls of two adjacent limit transmission rods 32 are connected through a chain belt and a chain wheel assembly, one end of the transmission rotating rod 41 is fixedly connected with a power motor to drive the transmission rotating rod 41 to rotate, so that the finishing drum 1 is driven to rotate between the two support drums 11 through meshed connection relation of the transmission gears 42 and the transmission toothed rings 43, and the object carrying short drum 3 limited by the limit transmission rod 32 is fed by threads to move inside the finishing drum 1;
as shown in fig. 3, 4, 6 and 11, as shown in fig. 11, the fine washing structure 7 comprises three spray heads 72 fixedly connected to the inner side walls of the carrying short cylinder 3 respectively, the spray heads 72 are fixedly communicated with each other through short pipes, as shown in fig. 3-6, a pair of washing brushes 71 are arranged in the carrying short cylinder 3 in the fine washing cylinder 1 for washing, as shown in fig. 11, one end of the fine washing cylinder 1 is fixedly communicated with a built-in pipe 73, the side walls of the built-in pipe 73 are fixedly connected with spiral pipes 74, one ends of the spiral pipes 74 are fixedly communicated with the spray heads 72, the other ends of the spiral pipes 74 are fixedly communicated with water pipes 77, water pipes 77 and air pumps 76 respectively, the outer side walls of the water pipes 77 are fixedly communicated with water pumps 75 respectively, the water through pipes 77 are provided with water valves on pipe walls on two sides of the water pump 75, the water inlet end of the water pump 75 can be fixedly communicated with the adjacent built-in pipes 73 for circulating the liquid medicine inside the same fine washing roller 1, when the cleaning fine washing roller 1 is used, the spray heads 72 on the inner carrying short cylinders 3 are communicated with the water pump 75 through the spiral pipes 74, the liquid medicine in the cleaning fine washing roller 1 is circulated, and the spray heads 72 spray the liquid medicine on two sides of a wafer, meanwhile, the cleaning brush 71 cleans the rotating wafer, when the cleaning fine washing roller 1 is used, the spray heads 72 on the inner carrying short cylinders 3 can spray the circulating liquid medicine to the wafer, and when the drying fine washing roller 1 is used, the spray heads 72 on the inner carrying short cylinders 3 are communicated with the air pump 76 through the spiral pipes 74 for spraying drying gas to two sides of the wafer;
as shown in fig. 7, fig. 10 and fig. 12, as in fig. 7, the progressive feeding and discharging assembly 9 comprises a slide bar 91 and a threaded screw rod 92, one ends of the slide bar 91 and the threaded screw rod 92 are sequentially connected with the side wall of the feed cylinder 2 in a penetrating manner, the outer side wall of the slide bar 91 is fixedly connected with the feed cylinder 2, the outer side wall of the threaded screw rod 92 is rotationally connected with the feed cylinder 2, as in fig. 12, a transmission motor is fixedly connected to the output end of the threaded screw rod 92, as in fig. 10, a frame plate 93 is arranged in the feed cylinder 2, one end of the frame plate 93 is slidably sleeved on the outer side wall of the slide bar 91, the other end of the frame plate 93 is threadably connected on the outer side wall of the threaded screw rod 92 in a sleeving manner, two transversely movable plates 94 are slidably sleeved on the outer side wall of the frame plate 93, a cylinder is fixedly connected between the transversely movable plate 94 and the frame plate 93, a vertical movable rod 97 is fixedly connected on the side wall of the transversely movable plate 94, a cross rod 96 is slidingly sleeved on the inner side wall of the vertical movable rod 97 in a common manner, a transmission motor is fixedly connected to the top of the frame plate 93, as in the same vertically movable rod 97, a transmission motor is fixedly connected with the top of the electric motor, as in the frame plate 95, the transmission rod 95 is rotatably connected with the two transversely movable rods 95 through the two transversely movable rods, and the two transversely movable rods are fixedly connected with the inner side plates 98, and the two transversely movable rods are respectively, and the inner side plates are respectively, and the two transversely movable rods are respectively, and movably connected with the frame plate 95 and the inner side rods and 95 are respectively, and the transversely movably and the frame plate 92 and the frame plate 92.
In this embodiment, three fine cleaning rollers 1 are sequentially used for cleaning, rinsing and drying respectively, a material transferring roller 2 at two ends is respectively connected with an isolation box 21 at one end and is respectively used for feeding and discharging at the other end, and is respectively provided with a material feeding frame and a material discharging frame (not shown in the figure), a progressive material feeding and discharging assembly 9 is controlled to clamp and lift the wafer of the material feeding frame, after the material transferring roller 2 is internally driven to the other end, the wafer passes through a supporting roller 11 on the cleaning fine cleaning roller 1 through a return opening 12 and is lowered into a material carrying short cylinder 3, after the wafer is placed on two bottom wheels 33, a threaded screw 92 is controlled to reversely rotate, a frame plate 93 is reset, an output end of an electric push rod 62 is controlled to shrink, a movable cover plate 31 is driven to rotate on the material carrying short cylinder 3 and is combined, the wafer is clamped together with two bottom wheels 33 on a limit transmission rod 32 through two top wheels 64 on the movable cover plate 31, starting a power motor on a transmission rotating rod 41, synchronously transmitting the transmission rotating rod 41 through a chain and a chain wheel assembly between the transmission rotating rod 41 and a limit transmission rod 32 and a chain and chain wheel assembly between the two limit transmission rods 32, driving the finishing washing roller 1 to rotate between two supporting cylinders 11 through a transmission gear 42 and a transmission toothed ring 43, after combining the carrying short cylinder 3 and the movable cover plate 31, as a spiral thread for transmitting the inside of the finishing washing roller 1 is arranged on the outer side wall of the combined carrying short cylinder 3, the carrying short cylinder 3 always keeps a threaded transmission relation with the finishing washing roller 1 through the spiral thread, both limit transmission rods 32 are rotationally connected with the carrying short cylinder 3 to limit the rotation of the carrying short cylinder 3, so that the carrying short cylinder 3 is transmitted into the supporting cylinder 11 on the other side from the supporting cylinder 11 on one side through the finishing washing roller 1, meanwhile, the limit transmission rod 32 is driven by the driving component 5 to drive the clamped wafer to rotate through the bottom wheel 33 in the transmission process, in the process, two spray heads 72 in the short carrying cylinder 3 in the fine washing roller 1 for cleaning are communicated with a water pump 75 through a spiral pipe 74, liquid medicine is sprayed on two sides of the wafer, the two side cleaning brushes 71 clean the rotating wafer, after the cleaning is finished, a sealing structure 8 on the isolation box 21 communicated with the supporting cylinder 11 is opened, the cleaned wafer is clamped and lifted into the material conveying cylinder 2 through the progressive feeding and discharging component 9, in the material conveying cylinder 2 at the other end of the fine washing roller 1 for cleaning, the progressive feeding and discharging component 9 synchronously clamps the wafer on the lifting feeding frame into the material conveying cylinder 2, the progressive feeding and discharging component 9 transmits the wafer to the other end of the material conveying cylinder 2, in the process, the fine washing roller 1 is controlled to reversely rotate, the carrying short cylinder 3 is reset through the transmission of the fine washing roller 1, the cleaned wafer is placed in the carrying short cylinder 3 in the fine washing roller 1 through the progressive feeding and discharging component 9, the wafer to be cleaned is synchronously placed in the carrying short cylinder 3 in the fine washing roller 1 for cleaning, then the progressive feeding and discharging component 9 is controlled to reset, the carrying short cylinder 3 is transmitted in the fine washing roller 1 through the driving component 5 again, the liquid medicine is sprayed to the rotating wafer on the carrying short cylinder 3 in the fine washing roller 1 through the spray head 72 for flushing, after the liquid medicine is transmitted into the supporting cylinder 11 at the other end of the fine washing roller 1, the sealing structure 8 is opened, the isolation box 21 is communicated with the supporting cylinder 11, the cleaned wafer is clamped and lifted into the conveying cylinders 2 through the progressive feeding and discharging component 9, the wafer to be cleaned is lifted in the first two conveying cylinders 2 respectively, and the cleaning wafer is lifted, the cleaned wafer is respectively transmitted to the other end of the material transmitting cylinder 2 through the progressive feeding and discharging component 9, the finish washing cylinder 1 is controlled to reversely rotate again in the transmission process, the material carrying short cylinder 3 is reset, the cleaned wafer is placed in the material carrying short cylinder 3 in the drying finish washing cylinder 1 through the isolation box 21, the progressive feeding and discharging component 9 places the wafer to be cleaned in the material carrying short cylinder 3 in the cleaning finish washing cylinder 1, the cleaned wafer is placed in the material carrying short cylinder 3 in the cleaning finish washing cylinder 1, then the cleaned wafer is reset, the material carrying short cylinder 3 is transmitted to the inner part of the supporting cylinder 11 at the other side through controlling the rotation of the drying finish washing cylinder 1, the spray head 72 on the material carrying short cylinder 3 is communicated with the air pump 76 through the spiral pipe 74, the air pump 76 sprays drying gas to the rotated wafer through the spray head 72, the method comprises the steps of drying a wafer, lifting the dried wafer into a material conveying cylinder 2 through a progressive material loading and unloading assembly 9, respectively lifting the wafer to be cleaned, the cleaned wafer and the cleaned wafer in the first three material conveying cylinders 2, controlling the finishing washing cylinder 1 to reversely rotate again to reset a material carrying short cylinder 3, moving the dried wafer in the material conveying cylinder 2 through the progressive material loading and unloading assembly 9 and placing the dried wafer on a material unloading frame, respectively placing the wafer to be cleaned in the material carrying short cylinder 3 in the cleaning finishing washing cylinder 1 through the progressive material loading and unloading assembly 9 in the first three material conveying cylinders 2, placing the cleaned wafer in the material carrying short cylinder 3 in the cleaning finishing washing cylinder 1, and placing the cleaned wafer in the material carrying short cylinder 3 in the drying finishing washing cylinder 1;
the method comprises the steps that a progressive feeding and discharging assembly 9 is used for progressively feeding and discharging a wafer in a material conveying cylinder 2, the wafer is alternately transmitted between the four material conveying cylinders 2 and three fine washing cylinders 1, cleaning, flushing and drying operations are respectively carried out on the wafer in the three fine washing cylinders 1, the wafer in the three material carrying short cylinders 3 is synchronously transmitted in the fine washing cylinders 1 and synchronously rotates under the driving of a bottom wheel 33, the material carrying short cylinders 3 between the material conveying cylinders 2 at two ends are respectively subjected to cleaning, flushing and drying operations, and the cleaning, flushing and drying operations are synchronously carried out, when the cleaning and flushing are carried out, the spray heads 72 (water spray heads) at two sides of the wafer spray liquid medicine to the rotating wafer, the material carrying short cylinders 3 with cleaning brushes 71 at one side carry out double-sided cleaning on the wafer, the spray heads 72 (air spray heads) in the material carrying short cylinders 3 at the other side are communicated with an air pump 76 through a spiral pipe 74, and the drying operations are carried out efficient cleaning and drying operations;
the water pump 75 can recycle the liquid medicine inside the cleaning fine washing roller 1 and the flushing fine washing roller 1, and when the liquid medicine for flushing is needed, the valve communicated with the cleaning fine washing roller 1 on the water pipe 77 can be opened, the liquid medicine for flushing is pumped into the cleaning fine washing roller 1 by the water pump 75, the liquid medicine is recycled, and the fine washing cost is reduced.
Example 2
As shown in fig. 7-9 and 12, based on the same concept of the above embodiment 1, as shown in fig. 7, the sealing structure 8 includes six arc sliding rails 81 respectively fixedly connected to the supporting cylinder 11, as shown in fig. 9, arc sealing plates 82 are slidably connected between the arc sliding rails 81 and the isolation box 21, the arc sealing plates 82 are used for sealing the isolation box 21 and the supporting cylinder 11, sealing teeth 84 are respectively arranged on the outer side walls of the arc sealing plates 82, the arc sealing plates 82 are respectively connected with sealing gears 83 in a meshed manner through the sealing teeth 84 on the outer side walls, sealing rotating rods 85 are fixedly sleeved on the inner side walls of the sealing gears 83, the sealing rotating rods 85 are mounted on the outer side walls of the material conveying cylinder 2, as shown in fig. 12, one ends of the sealing rotating rods 85 are fixedly connected with driving motors, the sealing rotating rods 85 are driven to rotate by the driving motors, the sealing gears 83 are driven by the sealing rotating gears 83, the sealing teeth 84 are driven by the sealing gears 83, and the sealing teeth 84 are driven by the sealing sliding plates 81 between the arc sliding rails 81 and the isolation box 21, and the sealing plates 11 are controlled to be sealed and communicated.
In this embodiment, the fine washing roller 1 drives the short carrying cylinder 3 through the driving component 5 in the internal transmission process, that is, in the process of cleaning, washing and drying the wafer, in the isolation box 21, the closed rotating rod 85 drives the arc-shaped sealing plate 82 to slide on the outer side wall of the arc-shaped sliding rail 81 through the closed gear 83 and the closed biting tooth 84 until the arc-shaped sliding rail 81 is completely blocked in the isolation box 21, the communication between the supporting cylinder 11 and the material conveying cylinder 2 is closed, and the cleaning fine washing roller 1, the rinsing fine washing roller 1 and the drying fine washing roller 1 are opened when the wafer is required to be transferred in the material conveying cylinder 2, the cleaning process, the rinsing process and the drying process are separated, and the wafer in the cleaning environment, the rinsing environment and the rinsing environment cannot be cross-polluted.
The present application is not limited to the above embodiments, and any equivalent embodiments which can be changed or modified by the technical disclosure described above can be applied to other fields, but any simple modification, equivalent changes and modification to the above embodiments according to the technical matter of the present application will still fall within the protection scope of the technical disclosure.
Claims (9)
1. The utility model provides a wafer finish-washing frock, includes base, its characterized in that: three fine washing rollers (1) which are respectively used for cleaning, flushing and drying are sequentially arranged above the base, two ends of each fine washing roller (1) are respectively and rotatably connected with a supporting cylinder (11), four material conveying cylinders (2) are arranged above each fine washing roller (1) at intervals, each supporting cylinder (11) is fixedly communicated with each material conveying cylinder (2) through a separation box (21), a material carrying short cylinder (3) is sleeved on the inner side wall of each fine washing roller (1) through threads, a cylinder inner transmission structure (4) which is used for transmitting the material carrying short cylinder (3) is arranged between the fine washing rollers (1), a movable cover plate (31) is hinged to the side wall of each material carrying short cylinder (3), two limit transmission rods (32) are jointly and rotatably connected to the side wall of each material carrying short cylinder (3), a fixing structure (6) which is used for clamping a wafer on the limit transmission rods (32) synchronously is arranged inside each material carrying short cylinder (3), a sealing structure (21) is arranged between each material carrying short cylinder (3) and the sealing structure (8) through the fixing structure (6), the automatic cleaning machine is characterized in that a progressive feeding and discharging assembly (9) for conveying wafers between the fine cleaning rollers (1) is arranged inside the conveying cylinder (2), a driving assembly (5) is connected between the inner cylinder driving structure (4) and the outer side wall of any one limit driving rod (32), and the two limit driving rods (32) are in transmission connection through the driving assembly (5).
2. The wafer finish cleaning tool of claim 1, wherein: the utility model provides a fixing structure (6) is including opening and shutting actuating lever (61), the one end of opening and shutting actuating lever (61) runs through the lateral wall of rotating connection support section of thick bamboo (11) in proper order and extends to the outside of support section of thick bamboo (11), articulated shaft that removable cover (31) and carrying thing short section of thick bamboo (3) all slide and cup joint on the lateral wall of opening and shutting actuating lever (61), the one end that opening and shutting actuating lever (61) is located support section of thick bamboo (11) outside articulates there is push pedal (63), the one end that opening and shutting actuating lever (61) was kept away from to push pedal (63) articulates there is electric putter (62), the tail end of electric putter (62) articulates on the lateral wall of support section of thick bamboo (11), install two top wheels (64) on the inside wall of removable cover (31), install return pulley (33) on the inside wall of carrying thing short section of thick bamboo (3), the shaft of return pulley (33) all slides and cup joints on the lateral wall of spacing actuating lever (32), top wheel (64) and return pulley (33) are used for centre gripping wafer jointly.
3. The wafer finish cleaning tool of claim 1, wherein: the inside transmission structure (4) of a barrel comprises a transmission rotating rod (41) which is rotationally connected to a base, three transmission gears (42) are fixedly connected to the outer side wall of the transmission rotating rod (41), transmission toothed rings (43) are fixedly sleeved on the outer side wall of the fine washing roller (1), the transmission toothed rings (43) are meshed with the transmission gears (42), and one end of the transmission rotating rod (41) is connected with a driving assembly (5).
4. The wafer finish cleaning tool of claim 1, wherein: the utility model provides a finish wash structure (7) is including three pair of shower nozzle (72) of respectively rigid coupling on carrying short section of thick bamboo (3) inside wall, with pair fixed intercommunication of nozzle (72) is used for abluent carrying short section of thick bamboo (3) in the finish wash cylinder (1) are equipped with a pair of cleaning brush (71), the one end of finish wash cylinder (1) all is fixed intercommunication and is hidden pipe (73), all be fixedly connected with spiral pipe (74) on the lateral wall of hiding pipe (73), the one end of spiral pipe (74) all is fixed intercommunication with shower nozzle (72), the other end of spiral pipe (74) is fixed intercommunication respectively has water pipe (77), air pump (76), all be fixed intercommunication on the lateral wall of water pipe (77) have water pump (75), all be provided with on the pipe wall of water pump (75) both sides, the water inlet end of water pump (75) can be used for circulating inside same finish wash cylinder (1) with adjacent water pipe (73) fixed intercommunication.
5. The wafer finish cleaning tool of claim 1, wherein: the utility model discloses a sealing structure, including seal structure (8), seal structure and material conveying cylinder (2), seal structure is including six arc slide rail (81) of rigid coupling respectively on supporting cylinder (11), equal sliding connection has arc shrouding (82) between arc slide rail (81) and the insulation box (21), arc shrouding (82) are used for shutoff insulation box (21) and supporting cylinder (11), all be provided with on the lateral wall of arc shrouding (82) and seal and bite tooth (84), arc shrouding (82) all are connected with seal gear (83) through seal bite tooth (84) meshing on the lateral wall, seal gear (83)'s inside wall is fixed jointly to cup joint and is sealed bull stick (85), seal bull stick (85) are installed on the lateral wall of material conveying cylinder (2), seal bull stick (85) one end rigid coupling has driving motor.
6. The wafer finish cleaning tool of claim 1, wherein: the progressive feeding and discharging assembly (9) comprises a sliding rod (91) and a threaded screw rod (92), one ends of the sliding rod (91) and the threaded screw rod (92) are sequentially penetrated through the side wall of a fixed connection feeding cylinder (2), the outer side wall of the sliding rod (91) is fixedly connected with the feeding cylinder (2), the outer side wall of the threaded screw rod (92) is rotationally connected with the feeding cylinder (2), a transmission motor is fixedly connected to the output end of the threaded screw rod (92), a frame plate (93) is arranged in the feeding cylinder (2), one end of the frame plate (93) is sleeved on the outer side wall of the sliding rod (91) in a sliding mode, the other end of the frame plate is sleeved on the outer side wall of the threaded screw rod (92) in a threaded mode, two transverse movable plates (94) are fixedly connected between the transverse movable plates (94) and the frame plate (93), vertical movable rods (97) are fixedly connected on the side walls of the transverse movable plates (94) in a sliding mode, the inner side walls of the vertical movable rods (97) in the same feeding cylinder (2) are fixedly connected with the middle portions of the electric rods (95) in a sliding mode, and the middle portions of the electric rods (95) are fixedly connected with the electric rods (95) in a sliding mode, the bottom ends of the vertical movable rods (97) are fixedly connected with clamping plates (98).
7. The wafer finish cleaning tool of claim 1, wherein: the limiting transmission rods (32) are polygonal, and the outer side walls of the limiting transmission rods (32) are rotationally connected with the side walls of the supporting cylinder (11) through sealing shaft sleeves.
8. The wafer finish cleaning tool of claim 2, wherein: the opening and closing driving rod (61) is a polygonal cylinder, and the outer side walls of the opening and closing driving rod (61) are all rotationally connected with the side walls of the supporting cylinder (11) through the sealing shaft sleeve.
9. The wafer finish cleaning tool of claim 1, wherein: the top of the supporting cylinder (11) is provided with a return opening (12) for the wafers to pass through with the progressive loading and unloading assembly (9).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311141737.0A CN116884885B (en) | 2023-09-06 | 2023-09-06 | Wafer finish-washing tool |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311141737.0A CN116884885B (en) | 2023-09-06 | 2023-09-06 | Wafer finish-washing tool |
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| CN116884885A CN116884885A (en) | 2023-10-13 |
| CN116884885B true CN116884885B (en) | 2023-11-14 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6588043B1 (en) * | 1999-05-27 | 2003-07-08 | Lam Research Corporation | Wafer cascade scrubber |
| CN202474005U (en) * | 2011-12-28 | 2012-10-03 | 广东爱康太阳能科技有限公司 | Silicon chip cleaning device for solar cell |
| CN112838030A (en) * | 2020-12-30 | 2021-05-25 | 江苏亚电科技有限公司 | Cleaning device for wafer |
| CN112864051A (en) * | 2020-12-30 | 2021-05-28 | 江苏亚电科技有限公司 | Wafer cleaning method |
| CN113042517A (en) * | 2019-12-27 | 2021-06-29 | 广州机械设计研究所 | Soil microwave processor |
-
2023
- 2023-09-06 CN CN202311141737.0A patent/CN116884885B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6588043B1 (en) * | 1999-05-27 | 2003-07-08 | Lam Research Corporation | Wafer cascade scrubber |
| CN202474005U (en) * | 2011-12-28 | 2012-10-03 | 广东爱康太阳能科技有限公司 | Silicon chip cleaning device for solar cell |
| CN113042517A (en) * | 2019-12-27 | 2021-06-29 | 广州机械设计研究所 | Soil microwave processor |
| CN112838030A (en) * | 2020-12-30 | 2021-05-25 | 江苏亚电科技有限公司 | Cleaning device for wafer |
| CN112864051A (en) * | 2020-12-30 | 2021-05-28 | 江苏亚电科技有限公司 | Wafer cleaning method |
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| CN116884885A (en) | 2023-10-13 |
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