CN116876064A - Notch-adjustable wafer single-chip electroplating machine - Google Patents
Notch-adjustable wafer single-chip electroplating machine Download PDFInfo
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- CN116876064A CN116876064A CN202311146112.3A CN202311146112A CN116876064A CN 116876064 A CN116876064 A CN 116876064A CN 202311146112 A CN202311146112 A CN 202311146112A CN 116876064 A CN116876064 A CN 116876064A
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- electroplating
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- 238000009713 electroplating Methods 0.000 title claims abstract description 93
- 235000012431 wafers Nutrition 0.000 claims abstract description 75
- 238000007747 plating Methods 0.000 claims abstract description 42
- 230000007246 mechanism Effects 0.000 claims abstract description 32
- 239000004065 semiconductor Substances 0.000 claims abstract description 32
- 230000033001 locomotion Effects 0.000 claims abstract description 23
- 239000007788 liquid Substances 0.000 claims description 31
- 238000001914 filtration Methods 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 6
- 230000008093 supporting effect Effects 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 3
- 230000008569 process Effects 0.000 claims description 3
- 230000001105 regulatory effect Effects 0.000 abstract description 11
- 230000000694 effects Effects 0.000 abstract description 5
- 238000005406 washing Methods 0.000 abstract description 3
- 230000002457 bidirectional effect Effects 0.000 description 12
- 239000013043 chemical agent Substances 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/004—Sealing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
Abstract
The invention belongs to the technical field of semiconductor wafers, in particular to a wafer single-chip electroplating machine with an adjustable notch. This notch adjustable wafer monolithic electroplating machine through setting up flexible stretching mechanism, realizes the regulation to the notch aperture size in the plating bath, avoids different plating solutions to take place to mix, adapts to the semiconductor wafer of equidimension not simultaneously and carries out the plating solution washing, servo motor output shaft's rotation drives the connecting axle of being connected rather than rotating, the rotation of this connecting axle drives the gear rotation rather than being connected, the rotation of this gear makes its surface removal along the ring gear, thereby drive another gear rotation, the rotation of this gear drives the connecting axle rotation simultaneously, and then be convenient for drive two arc regulating plates through the connecting axle and carry out relative motion along the recess inner wall, reach the effect of adjusting the notch.
Description
Technical Field
The invention relates to the technical field of semiconductor wafers, in particular to a wafer single-chip electroplating machine with an adjustable notch.
Background
In the current process flow of electroplating a semiconductor wafer by using an electroplating machine, a single wafer is mostly transported into an electroplating tank by a mechanical arm, and different electroplating liquids are sequentially injected to flush the surface of the wafer, but the electroplating machines with different calibers are required to be selected for electroplating according to the sizes of the wafers because the sizes of the wafers are different.
If a large-caliber wafer inlet and outlet is adopted, the internal environment and the external environment are easy to be mutually communicated in the electroplating process, the electroplating liquid in the electroplating machine is used for electroplating the surface of the wafer after being electrified by chemical agents, the chemical agents have strict requirements on components, proportion, temperature and volatility, once the chemical agents are mutually communicated with the external environment, the volatilization of chemical liquid medicine can be accelerated, the internal temperature environment is easily damaged, the wafer can not be kept at the due constant temperature and other constant states in the electroplating time, and tiny particles in the external environment can be easily introduced into the core electroplating area of the electroplating machine, so that the efficiency and qualification rate of electroplating the wafer are reduced, and the electroplating machine is required to be designed for being suitable for electroplating machines of wafers with different sizes.
Disclosure of Invention
Based on the technical problems that the prior electroplating machine cannot adjust the aperture of an electroplating tank when the electroplating liquid is used for flushing the semiconductor wafer, thereby being not suitable for the semiconductor wafers with different sizes and further reducing the electroplating efficiency of the semiconductor wafer, the invention provides a wafer single-chip type electroplating machine with an adjustable notch.
The invention provides a wafer single-chip electroplating machine with an adjustable notch, which comprises a rack, a multi-layer electroplating bath body arranged on the rack, a protection mechanism arranged on two sides of the rack, a telescopic stretching mechanism arranged at the notch of the electroplating bath body and a positioning and adjusting mechanism arranged on the bottom wall in the electroplating bath body.
The protection mechanism comprises semicircular closing plates which are symmetrically distributed on the upper surface of the electroplating bath body, and the two closing plates are close to or far away from each other to close or open the feeding notch of the electroplating bath body, so that the inside of the electroplating bath body is clean.
The telescopic stretching mechanism comprises arc-shaped regulating plates which are symmetrically distributed and arranged at the notch of the electroplating bath body, the two arc-shaped regulating plates are both positioned inside the notch of the electroplating bath body, and the relative movement of the two arc-shaped regulating plates is used for realizing the regulation action of the aperture size of the notch in the electroplating bath body.
The positioning adjusting mechanism comprises a clamping table which is arranged on the bottom wall in the electroplating tank body through a bearing, and a positioning disc is arranged on the upper part of the clamping table so as to realize clamping and supporting actions on semiconductor wafers with different sizes.
Preferably, the protection mechanism further comprises a support located at two sides of the frame, the upper surfaces of the two supports are fixedly provided with sliding rails, the two supports are connected through a mounting groove body, the mounting groove body is located at the upper surface of the frame, a driving motor is fixedly mounted on the inner wall of the mounting groove body, one end of an output shaft of the driving motor extends to the outer surface of the mounting groove body and is fixedly sleeved with a bidirectional screw, two ends of the bidirectional screw are respectively mounted on the supports through bearings, two ends of the surface of the bidirectional screw are respectively sleeved with a sliding block in a threaded manner, and the lower surface of the sliding block is in sliding connection with the surface of the sliding rails.
Through above-mentioned technical scheme, the rotation of driving motor output shaft drives two-way lead screw and rotates, and two sliders are carried out relative motion on two-way lead screw along the surface of slide rail respectively to the rotation of two-way lead screw.
Preferably, the surface of another slide rail and the lower surface slip joint of two other sliders, the upper surface fixedly connected with L type pole of slider, the one end fixedly connected with connecting block of L type pole, one side of connecting block with one side fixed connection of closure plate, simultaneously the spout has been seted up respectively to the surface both sides of plating bath body, the surface of closure plate with the inner wall slip joint of spout.
Through the technical scheme, the movement of the sliding block drives the L-shaped rod to move, the movement of the L-shaped rod drives the closing plate to move along the inner wall of the sliding groove through the connecting block, and meanwhile, the other sliding block is driven to move on the corresponding sliding rail through the other L-shaped rod, and the upper notch of the electroplating bath body is sealed along with the relative movement of the two closing plates, so that the inside of the electroplating bath body is kept clean when the electroplating bath is not used.
Preferably, the other sides of the two closing plates are respectively fixedly connected with a sealing strip.
Through the technical scheme, the sealing strip seals the folding of the two closing plates, and prevents dust from entering the electroplating tank.
Preferably, the telescopic stretching mechanism further comprises a groove formed in the notch of the electroplating tank body, the inner wall of the groove is fixedly provided with a toothed ring, the surface of the arc-shaped adjusting plate is in sliding clamping connection with the inner wall of the groove, two ends of the arc-shaped adjusting plate are hinged through connecting shafts, gears are fixedly sleeved at the middle ends of the connecting shafts, and the surfaces of the gears are meshed with the surfaces of the toothed ring.
Through above-mentioned technical scheme, through the meshing of gear and ring gear and recess to the spacing of arc regulating plate for two arc regulating plates carry out relative movement.
Preferably, a servo motor is fixedly installed in the electroplating bath body, and an output shaft of the servo motor is fixedly sleeved with one end of one connecting shaft.
Through above-mentioned technical scheme, the rotation of servo motor output shaft drives the connecting axle rotation of being connected with it, and the rotation of connecting axle drives the gear and rotates, and the rotation of gear makes its surface along the ring gear remove, and the rotation of gear drives the connecting axle rotation simultaneously to drive two arc regulating plates and carry out relative motion.
Preferably, the positioning adjusting mechanism further comprises a telescopic hydraulic cylinder fixedly installed inside the clamping table, one end of a piston rod of the telescopic hydraulic cylinder extends out of the clamping table and is fixedly connected with the lower surface of the positioning disc, a rotating motor is fixedly installed on the inner wall of the frame, one end of an output shaft of the rotating motor extends into the electroplating bath body and is fixedly sleeved with the lower surface of the clamping table, and meanwhile, the bottom of the clamping table is installed on the inner bottom wall of the electroplating bath body through a bearing.
Through above-mentioned technical scheme, the flexible positioning disk that drives of flexible pneumatic cylinder piston rod reciprocates, and the rotation of rotation motor output shaft drives the gripping platform and rotates.
Preferably, servo motor is fixed to the inside fixed mounting of positioning disk, the driving gear has been cup jointed to servo motor's output shaft one end fixed, simultaneously driven gear is installed through the bearing to the inside of positioning disk, the surface of driving gear with driven gear's surface engagement, driven gear's surface is annular array distribution and runs through and offer the arc wall, just driven gear's lower surface fixed mounting has the fixed disk, the upper surface of fixed disk is annular array distribution and has offered the spacing groove, the inner wall slip joint of spacing groove has L type slide bar, the upper surface fixedly connected with traveller of L type slide bar, the surface of traveller with the inner wall sliding connection of arc wall groove.
Through the technical scheme, the rotation of the output shaft of the servo motor drives the driving gear to rotate, the rotation of the driving gear drives the driven gear to rotate through the engagement with the driven gear, the rotation of the driven gear drives the sliding column to move in the arc-shaped groove, and the L-shaped sliding rod is driven to move along the inner wall of the limiting groove along with the movement of the sliding column.
Preferably, the upper surface of the positioning disk is provided with bearing columns in annular array distribution, and the upper end of the L-shaped sliding rod is fixedly provided with a clamping column.
Through the technical scheme, the supporting columns are used for positioning and placing the semiconductor wafer, and the clamping columns are used for clamping the edge of the semiconductor wafer.
Preferably, the lower surface of plating bath body is fixed in proper order and is linked together according to the distribution of its inside cavity has a drain pipe, the one end of drain pipe is in the inside fixed intercommunication of frame has a filtration collecting box, the fixed intercommunication of one side of filtration collecting box has a drain pipe, the one end of drain pipe extends the frame.
Through the technical scheme, the electroplating solution flows out of the electroplating bath body through the liquid outlet pipeline and enters the filtering liquid collecting box, and is discharged through the liquid discharge pipeline after being filtered by the filter screen in the filtering liquid collecting box.
The beneficial effects of the invention are as follows:
1. through setting up protection machanism, be convenient for guarantee the inside cleanness of plating bath body, reduce the dust and pile up, the rotation of driving motor output shaft drives two-way lead screw and rotates, two sliders are drawn close each other on two-way lead screw along the surface of slide rail respectively to the rotation of two-way lead screw, the removal of slider drives L type pole and removes, the removal of L type pole drives the closure plate through the connecting block and removes along the inner wall of spout, the removal of closure plate drives another slider through another L type pole simultaneously and moves on corresponding slide rail, gather together the notch on to the plating bath body along with two closure plates and seal, thereby reach the effect of protection.
2. Through setting up flexible mechanism that stretches out and draws back, realize the regulation to the internal notch aperture size of plating bath, avoid different plating solutions to take place to mix, adapt to the semiconductor wafer of equidimension not simultaneously and carry out plating solution washing, servo motor output shaft's rotation drives the connecting axle rotation rather than being connected, the rotation of this connecting axle drives the gear rotation rather than being connected, the rotation of this gear makes its surface along the ring gear remove, thereby drive another gear rotation, the rotation of this gear drives the connecting axle rotation simultaneously, and then be convenient for drive two arc regulating plates through the connecting axle and carry out relative motion along the recess inner wall, reach the effect of adjusting the notch.
3. Through setting up location adjustment mechanism to the realization is to the semiconductor wafer centre gripping bearing of equidimension not, and servo motor output shaft's rotation drives the driving gear and rotates, and the rotation of driving gear drives driven gear through the meshing with driven gear and rotates, and driven gear's rotation drives the traveller and removes in the arc inslot, and along with the removal of traveller drives L type slide bar along the inner wall of spacing groove and remove, and the removal of L type slide bar drives the grip post and removes, and then is convenient for grip post adaptation semiconductor wafer of equidimension not radiused, thereby reaches location centre gripping effect.
Drawings
FIG. 1 is a schematic diagram of a notch-adjustable wafer monolithic electroplating machine according to the present invention;
FIG. 2 is a perspective view of a slide rail structure of a wafer monolithic electroplating machine with an adjustable notch according to the present invention;
FIG. 3 is a perspective view of a mounting slot structure of a wafer monolithic electroplating machine with an adjustable slot according to the present invention;
FIG. 4 is a perspective view of a closed plate structure of a notch adjustable wafer monolithic electroplating machine according to the present invention;
FIG. 5 is a perspective view showing a structure of a plating tank of a notch-adjustable wafer monolithic plating machine according to the present invention;
FIG. 6 is a perspective view of a chute structure of a notch-adjustable wafer monolithic electroplating machine according to the present invention;
FIG. 7 is a perspective view showing a groove structure of a notch-adjustable wafer monolithic electroplating machine according to the present invention;
FIG. 8 is a perspective view of an arc-shaped adjusting plate structure of a notch-adjustable wafer monolithic electroplating machine according to the present invention;
FIG. 9 is a perspective view of a gear structure of a notch-adjustable wafer monolithic electroplating machine according to the present invention;
FIG. 10 is a perspective view of a clamping post structure of a notch-adjustable wafer monolithic electroplating machine according to the present invention;
FIG. 11 is a perspective view showing a structure of a clamping table of a wafer monolithic electroplating machine with an adjustable notch according to the present invention;
FIG. 12 is a perspective view of a telescopic hydraulic cylinder of a wafer monolithic electroplating machine with an adjustable notch;
FIG. 13 is a perspective view of a support column structure of a notch adjustable wafer monolithic electroplating machine according to the present invention;
FIG. 14 is a perspective view of a driven gear structure of a notch-adjustable wafer monolithic electroplating machine according to the present invention;
fig. 15 is a perspective view of a rotating motor structure of a notch-adjustable wafer monolithic electroplating machine according to the present invention.
In the figure: 1. a frame; 2. a plating bath body; 3. a closing plate; 301. a bracket; 302. a slide rail; 303. installing a groove body; 304. a driving motor; 305. a bidirectional screw rod; 306. a slide block; 307. an L-shaped rod; 308. a connecting block; 309. a chute; 310. a sealing strip; 4. an arc-shaped adjusting plate; 41. a groove; 42. a toothed ring; 43. a connecting shaft; 44. a gear; 45. a servo motor; 5. a clamping table; 51. a positioning plate; 511. a servo motor; 512. a drive gear; 513. a driven gear; 514. an arc-shaped groove; 515. a fixed plate; 516. a limit groove; 517. an L-shaped slide bar; 518. a spool; 519. a support column; 520. a clamping column; 52. a telescopic hydraulic cylinder; 53. a rotating motor; 6. a liquid outlet pipe; 7. a filtering liquid collecting box; 8. and a liquid discharge pipeline.
Description of the embodiments
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
Referring to fig. 1-15, a wafer monolithic electroplating machine with an adjustable notch comprises a rack 1, a plurality of layers of electroplating bath bodies 2 arranged on the rack 1, protection mechanisms arranged on two sides of the rack 1, a telescopic stretching mechanism arranged at the notch of the electroplating bath bodies 2 and a positioning and adjusting mechanism arranged on the inner bottom wall of the electroplating bath bodies 2.
As can be seen from fig. 1-2 and 15, in order to prevent different types of plating solutions from mixing and sequentially discharging the plating solutions from the plating tank body 2, a liquid outlet pipe 6 is sequentially and fixedly connected to the lower surface of the plating tank body 2 according to the distribution of the internal cavities of the plating tank body, a filtering liquid collecting tank 7 is fixedly connected to one end of the liquid outlet pipe 6 in the frame 1, a liquid outlet pipe 8 is fixedly connected to one side of the filtering liquid collecting tank 7, and one end of the liquid outlet pipe 8 extends out of the frame 1.
As can be seen from fig. 2 to fig. 4, in order to prevent the plating tank body 2 from depositing ash therein when not in use, the protection mechanism includes semicircular closing plates 3 symmetrically disposed on the upper surface of the plating tank body 2, and the two closing plates 3 close or open the feeding slot of the plating tank body 2 when approaching or separating from each other, thereby ensuring the cleaning of the inside of the plating tank body 2.
In order to drive the two closing plates 3 to gather together or keep away from each other, the protection mechanism further comprises supports 301 positioned on two sides of the frame 1, sliding rails 302 are fixedly arranged on the upper surfaces of the two supports 301, the two supports 301 are connected through a mounting groove 303, a driving motor 304 is fixedly arranged on the inner wall of the mounting groove 303, the mounting groove 303 is used for mounting the driving motor 304, meanwhile, one end of an output shaft of the driving motor 304 extends to the outer surface of the mounting groove 303 and is fixedly sleeved with a bidirectional screw 305, two ends of the bidirectional screw 305 are respectively arranged on the supports 301 through bearings, sliding blocks 306 are in threaded sleeve connection with two ends of the surface of the bidirectional screw 305, the lower surface of the sliding blocks 306 are in sliding clamping connection with the surface of the sliding rails 302, the bidirectional screw 305 is driven to rotate through rotation of an output shaft of the driving motor 304, and the two sliding blocks 306 are respectively driven to move relatively along the surfaces of the sliding rails 302 at two ends of the bidirectional screw 305.
In order to stabilize the movement of the closing plate 3, the surface of the other sliding rail 302 is in sliding clamping connection with the lower surfaces of the other two sliding blocks 306, the upper surfaces of the four sliding blocks 306 are fixedly connected with L-shaped rods 307, one end of each L-shaped rod 307 is fixedly connected with a connecting block 308, one side of each connecting block 308 is fixedly connected with one side of the closing plate 3, sliding grooves 309 are respectively formed in two sides of the outer surface of the electroplating bath body 2 in order to limit the movement of the closing plate 3, and the surface of the closing plate 3 is in sliding clamping connection with the inner walls of the sliding grooves 309.
In order to facilitate sealing of the closure plates 3, sealing strips 310 are fixedly connected to the other sides of the two closure plates 3, respectively.
Through setting up protection machanism, be convenient for guarantee the inside cleanness of plating bath body 2, reduce the dust and pile up, the rotation of driving motor 304 output shaft drives bi-directional lead screw 305 and rotates, bi-directional lead screw 305's rotation drives two sliders 306 and draws close each other on bi-directional lead screw 305 along the surface of slide rail 302 respectively, slider 306's removal drives L type pole 307 and removes, L type pole 307's removal drives closure plate 3 through connecting block 308 and removes along the inner wall of spout 309, simultaneously closure plate 3's removal drives another slider 306 through another L type pole 307 and removes on corresponding slide rail 302, along with the gathering of two closure plates 3 go up the notch to plating bath body 2 airtight.
As can be seen from fig. 3 and fig. 5-9, in order to facilitate adjustment of the caliber of the notch in the plating tank body 2 to accommodate the ingress and egress of wafers of different sizes and prevent the mixing of plating solutions, the telescopic stretching mechanism comprises arc-shaped adjusting plates 4 symmetrically distributed at the notch in the plating tank body 2, the two arc-shaped adjusting plates 4 are both positioned in the notch in the plating tank body 2, and the adjustment of the aperture of the notch in the plating tank body 2 is realized along with the relative movement of the two arc-shaped adjusting plates 4.
In order to enable the two arc-shaped adjusting plates 4 to move relatively, the telescopic stretching mechanism further comprises a groove 41 formed in the inner groove opening of the electroplating bath body 2, the inner wall of the groove 41 is fixedly provided with a toothed ring 42, meanwhile, the surface of the arc-shaped adjusting plates 4 is in sliding clamping connection with the inner wall of the groove 41, the groove 41 is convenient for limiting the movement of the arc-shaped adjusting plates 4, two ends of the two arc-shaped adjusting plates 4 are hinged through connecting shafts 43, the middle ends of the two connecting shafts 43 are fixedly sleeved with gears 44, the surfaces of the gears 44 are meshed with the surface of the toothed ring 42, and the connecting shafts 43 are driven to rotate through the meshing of the gears 44 and the toothed ring 42.
In order to drive the connecting shaft 43 to rotate, a servo motor 45 is fixedly arranged in the electroplating bath body 2, a protective shell is arranged on the outer surface of the servo motor 45, damage to the servo motor 45 caused by electroplating liquid is avoided, an output shaft of the servo motor 45 is fixedly sleeved with one end of one connecting shaft 43, the connecting shaft 43 connected with the output shaft of the servo motor 45 is driven to rotate through rotation of the output shaft of the servo motor 45, a gear 44 connected with the connecting shaft 43 is driven to rotate through rotation of the connecting shaft 43, the gear 44 is driven to move along the surface of the toothed ring 42, the other gear 44 is driven to rotate, and meanwhile rotation of the gear 44 drives the connecting shaft 43 to rotate, so that two arc-shaped adjusting plates 4 are driven to perform relative motion along the inner wall of the groove 41 through the connecting shaft 43.
Through setting up flexible mechanism that stretches out and draws back, realize the regulation to plating bath body 2 inside groove mouth aperture size, avoid different plating baths to take place to mix, simultaneously adapt to the semiconductor wafer of equidimension not and carry out plating bath washing, servo motor 45 output shaft's rotation drives the connecting axle 43 rotation rather than being connected, this connecting axle 43's rotation drives the gear 44 rotation rather than being connected, this gear 44's rotation makes its surface along the ring gear 42 remove, thereby drive another gear 44 rotation, this gear 44's rotation drives connecting axle 43 rotation simultaneously, and then be convenient for drive two arc regulating plates 4 through connecting axle 43 and carry out relative motion along recess 41 inner wall.
As can be seen from fig. 10 to 14, in order to hold and clamp semiconductor wafers of different sizes, and further facilitate the plating solution to rinse the semiconductor wafers, the positioning adjustment mechanism includes a clamping table 5 mounted on the inner bottom wall of the plating tank body 2 through a bearing, and a positioning plate 51 is provided on the upper portion of the clamping table 5 to clamp and hold the semiconductor wafers of different sizes.
In order to be convenient for stretch out and draw back and rotate positioning disk 51, positioning adjustment mechanism still includes the flexible pneumatic cylinder 52 of fixed mounting in clamping bench 5 inside, the piston rod one end of flexible pneumatic cylinder 52 extends outside clamping bench 5 and with the lower fixed surface of positioning disk 51, the flexible positioning disk 51 that drives of piston rod through flexible pneumatic cylinder 52 reciprocates, in order to drive the semiconductor wafer and be in different heights, the inner wall fixed mounting of frame 1 has rotating motor 53, the output shaft one end of rotating motor 53 extends to in the plating bath body 2 and cup joints with the lower fixed surface of clamping bench 5, the bottom of clamping bench 5 passes through the bearing simultaneously and installs at the interior diapire of plating bath body 2, the rotation through the output shaft of rotating motor 53 drives clamping bench 5 and rotates, the rotation of clamping bench 5 drives positioning disk 51 and rotates, thereby drive the semiconductor wafer and be in rotatory state.
In order to facilitate the positioning disc 51 to adapt to semiconductor wafers with different sizes, a servo motor 511 is fixedly arranged in the positioning disc 51, one end of an output shaft of the servo motor 511 is fixedly sleeved with a driving gear 512, meanwhile, a driven gear 513 is arranged in the positioning disc 51 through a bearing, the surface of the driving gear 512 is meshed with the surface of the driven gear 513, arc grooves 514 are formed in an annular array distribution penetrating mode on the surface of the driven gear 513, a fixed disc 515 is fixedly arranged on the lower surface of the driven gear 513, limit grooves 516 are formed in an annular array distribution on the upper surface of the fixed disc 515, L-shaped sliding rods 517 are connected to the inner walls of the limit grooves 516 in a sliding clamping mode, sliding columns 518 are fixedly connected to the upper surfaces of the L-shaped sliding rods 517, the surfaces of the sliding columns 518 are connected with the inner walls of the arc grooves 514 in a sliding mode, the rotation of the output shaft of the servo motor 511 drives the driving gear 512 to rotate, the rotation of the driving gear 512 drives the driven gear 513 to rotate through the meshing with the driven gear 513, the rotation of the driven gear 513 drives the sliding columns 518 to move in the arc grooves 514, and along with the movement of the sliding columns 518.
In order to support and clamp the semiconductor wafer, support posts 519 are distributed on the upper surface of the positioning plate 51 in an annular array, and clamping posts 520 are fixedly arranged at the upper ends of the L-shaped sliding rods 517.
Through setting up location adjustment mechanism to realize the semiconductor wafer centre gripping bearing to equidimension not, the rotation of servo motor 511 output shaft drives driving gear 512 and rotates, and the rotation of driving gear 512 drives driven gear 513 through the meshing with driven gear 513 and rotates, and driven gear 513's rotation drives the slide column 518 and removes in arc groove 514, and along with the removal of slide column 518 drive L type slide bar 517 along the inner wall of spacing groove 516, the removal of L type slide bar 517 drives clamping column 520 and removes, and then the semiconductor wafer of the equidimension of clamping column 520 adaptation different radius of being convenient for, thereby reaches the location centre gripping effect.
Working principle: when the semiconductor wafer is used, the manipulator transports the semiconductor wafer to the upper part of the electroplating bath body 2, a proper electroplating height and a proper liquid discharge cavity are selected in the electroplating bath body 2 according to the radius of the transported semiconductor wafer, a hydraulic cylinder is started, a piston rod of the hydraulic cylinder stretches to drive the positioning disc 51 to move to a proper height, then the servo motor 511 is started, the rotation of an output shaft of the servo motor 511 drives the driving gear 512 to rotate, the rotation of the driving gear 512 drives the driven gear 513 to rotate through the engagement with the driven gear 513, the rotation of the driven gear 513 drives the sliding column 518 to move in the arc-shaped groove 514, the movement of the sliding column 518 drives the L-shaped sliding rod 517 to move along the inner wall of the limiting groove 516, meanwhile, the movement of the L-shaped sliding rod 517 drives the clamping column 520 to move until the clamping column 520 moves to a proper position, then the manipulator places the semiconductor wafer on the positioning disc 51, and clamps and supports the semiconductor wafer through the supporting column 519 and the clamping column 520;
after the clamping is completed, the caliber of a notch in the electroplating bath body 2 below the wafer is reduced according to the requirement, a servo motor 45 is started, the rotation of an output shaft of the servo motor 45 drives a connecting shaft 43 connected with the servo motor to rotate, the rotation of the connecting shaft 43 drives a gear 44 connected with the connecting shaft to rotate, the rotation of the gear 44 drives the gear 44 to move along the surface of a toothed ring 42, so that the other gear 44 is driven to rotate, and meanwhile, the rotation of the gear 44 drives the connecting shaft 43 to rotate, so that the two arc-shaped regulating plates 4 are driven by the connecting shaft 43 to relatively move along the inner wall of the groove 41;
after the caliber is regulated, the swing arm drives the liquid outlet of the electroplating liquid to move to the upper part of the electroplating bath body 2, and moves the liquid outlet downwards to be aligned with the semiconductor wafer, meanwhile, the rotating motor 53 is started and starts the liquid outlet, the rotating motor 53 selects the rotation with proper frequency according to the height of the semiconductor wafer, the rotation of the output shaft of the rotating motor 53 drives the clamping table 5 to rotate, and the rotation of the clamping table 5 drives the positioning disc 51 to rotate, so that the electroplating liquid enters the cavity of the electroplating bath body 2 under the centrifugal action when the semiconductor wafer is washed, the electroplating liquids in different cavities are prevented from being mixed, and the subsequent work is reduced;
the electroplating solution accumulated in the cavity flows into the filtering liquid collecting box 7 along the liquid outlet pipeline 6, is filtered by a filter screen in the filtering liquid collecting box 7 and is discharged through the liquid discharge pipeline 8;
when the plating bath is not needed to be used, the rotation of the output shaft of the driving motor 304 drives the bidirectional screw 305 to rotate, the rotation of the bidirectional screw 305 drives the two sliding blocks 306 to be close to each other on the bidirectional screw 305 along the surface of the sliding rail 302, the movement of the sliding blocks 306 drives the L-shaped rod 307 to move, the movement of the L-shaped rod 307 drives the closing plate 3 to move along the inner wall of the sliding groove 309 through the connecting block 308, and meanwhile, the movement of the closing plate 3 drives the other sliding block 306 to move on the corresponding sliding rail 302 through the other L-shaped rod 307, and the upper notch of the plating bath body 2 is sealed along with the gathering of the two closing plates 3.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (10)
1. The utility model provides a wafer monolithic electroplating machine with adjustable notch, includes frame (1) and sets up multilayer plating bath body (2) on frame (1), its characterized in that: the electroplating bath further comprises protection mechanisms arranged on two sides of the rack (1), a telescopic stretching mechanism arranged at the notch of the electroplating bath body (2) and a positioning and adjusting mechanism arranged on the inner bottom wall of the electroplating bath body (2);
the protection mechanism comprises semicircular closing plates (3) which are symmetrically distributed on the upper surface of the electroplating bath body (2), and the two closing plates (3) close or open the feeding notch of the electroplating bath body (2) in the process of approaching or separating from each other, so that the inside of the electroplating bath body (2) is ensured to be clean;
the telescopic stretching mechanism comprises arc-shaped adjusting plates (4) which are symmetrically distributed at the inner notch of the electroplating bath body (2), the two arc-shaped adjusting plates (4) are both positioned inside the notch of the electroplating bath body (2), and the size of the aperture of the inner notch of the electroplating bath body (2) is adjusted along with the relative movement of the two arc-shaped adjusting plates (4);
the positioning adjusting mechanism comprises a clamping table (5) arranged on the inner bottom wall of the electroplating bath body (2) through a bearing, and a positioning disc (51) is arranged on the upper part of the clamping table (5) so as to realize the clamping and supporting actions of semiconductor wafers with different sizes.
2. The notch adjustable wafer monolithic processor of claim 1, wherein: the protection mechanism further comprises supports (301) located on two sides of the frame (1), sliding rails (302) are fixedly installed on the upper surfaces of the supports (301), the two supports (301) are connected through mounting groove bodies (303), the mounting groove bodies (303) are located on the upper surfaces of the frame (1), driving motors (304) are fixedly installed on the inner walls of the mounting groove bodies (303), one end of an output shaft of each driving motor (304) extends to the outer surfaces of the corresponding mounting groove body (303) and fixedly sleeved with two-way screw rods (305), two ends of each two-way screw rod (305) are installed on the corresponding support (301) through bearings, sliding blocks (306) are sleeved on two ends of each surface of each two-way screw rod (305) in a threaded mode, and the lower surfaces of the sliding blocks (306) are in sliding clamping connection with the surfaces of the sliding rails (302).
3. The notch adjustable wafer monolithic processor of claim 2, wherein: the surface of another slide rail (302) and the lower surface slip joint of two other slider (306), the upper surface fixedly connected with L type pole (307) of slider (306), the one end fixedly connected with connecting block (308) of L type pole (307), one side of connecting block (308) with one side fixed connection of closure board (3), simultaneously spout (309) have been seted up respectively to the surface both sides of plating bath body (2), the surface of closure board (3) with the inner wall slip joint of spout (309).
4. The notch adjustable wafer monolithic processor of claim 1, wherein: the other sides of the two closing plates (3) are respectively and fixedly connected with sealing strips (310).
5. The notch adjustable wafer monolithic processor of claim 1, wherein: the telescopic stretching mechanism further comprises a groove (41) formed in the inner groove opening of the electroplating bath body (2), a toothed ring (42) is fixedly mounted on the inner wall of the groove (41), the surface of the arc-shaped adjusting plate (4) is in sliding clamping connection with the inner wall of the groove (41), two ends of the arc-shaped adjusting plate (4) are hinged through connecting shafts (43), gears (44) are fixedly sleeved at the middle ends of the connecting shafts (43), and the surfaces of the gears (44) are meshed with the surfaces of the toothed ring (42).
6. The notch adjustable wafer monolithic processor of claim 5, wherein: the inside fixed mounting of plating bath body (2) has servo motor (45), the output shaft of servo motor (45) with one of them (43) one end fixed sleeve joint.
7. The notch adjustable wafer monolithic processor of claim 1, wherein: the positioning adjusting mechanism further comprises a telescopic hydraulic cylinder (52) fixedly installed inside the clamping table (5), one end of a piston rod of the telescopic hydraulic cylinder (52) extends out of the clamping table (5) and is fixedly connected with the lower surface of the positioning disc (51), a rotating motor (53) is fixedly installed on the inner wall of the frame (1), one end of an output shaft of the rotating motor (53) extends into the electroplating bath body (2) and is fixedly sleeved with the lower surface of the clamping table (5), and meanwhile the bottom of the clamping table (5) is installed on the inner bottom wall of the electroplating bath body (2) through a bearing.
8. The notch adjustable wafer monolithic processor of claim 1, wherein: the inside fixed mounting of positioning disk (51) has servo motor (511), the fixed cover of output shaft one end of servo motor (511) has been cup jointed driving gear (512), simultaneously driven gear (513) are installed through the bearing to the inside of positioning disk (51), the surface of driving gear (512) with the surface engagement of driven gear (513), arc wall (514) have been seted up in annular array distribution throughout to the surface of driven gear (513), just the lower surface fixed mounting of driven gear (513) has fixed disk (515), limit groove (516) have been seted up in annular array distribution to the upper surface of fixed disk (515), the inner wall slip joint of limit groove (516) has L type slide bar (517), the upper surface fixedly connected with slide column (518) of L type slide bar (517), the surface of slide column (518) with the inner wall sliding connection of arc wall (514).
9. The notch adjustable wafer monolithic processor of claim 8, wherein: the upper surface of the positioning disc (51) is provided with supporting columns (519) in annular array distribution, and the upper end of the L-shaped sliding rod (517) is fixedly provided with a clamping column (520).
10. The notch adjustable wafer monolithic processor of claim 1, wherein: the lower surface of plating bath body (2) is fixed intercommunication in proper order according to the distribution of its inside cavity has liquid pipeline (6), the one end of liquid pipeline (6) is in the inside fixed intercommunication of frame (1) has filtration collecting box (7), the fixed intercommunication in one side of filtration collecting box (7) has fluid-discharge tube (8), the one end of fluid-discharge tube (8) extends frame (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311146112.3A CN116876064A (en) | 2023-09-07 | 2023-09-07 | Notch-adjustable wafer single-chip electroplating machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311146112.3A CN116876064A (en) | 2023-09-07 | 2023-09-07 | Notch-adjustable wafer single-chip electroplating machine |
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| CN116876064A true CN116876064A (en) | 2023-10-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202311146112.3A Pending CN116876064A (en) | 2023-09-07 | 2023-09-07 | Notch-adjustable wafer single-chip electroplating machine |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117512750A (en) * | 2024-01-05 | 2024-02-06 | 苏州智程半导体科技股份有限公司 | Wafer notch calibration baffle of wafer electroplating machine and calibration method |
-
2023
- 2023-09-07 CN CN202311146112.3A patent/CN116876064A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117512750A (en) * | 2024-01-05 | 2024-02-06 | 苏州智程半导体科技股份有限公司 | Wafer notch calibration baffle of wafer electroplating machine and calibration method |
| CN117512750B (en) * | 2024-01-05 | 2024-03-19 | 苏州智程半导体科技股份有限公司 | Wafer electroplating machine |
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