CN116875030B - POK diffusion plate and preparation method thereof - Google Patents
POK diffusion plate and preparation method thereof Download PDFInfo
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- CN116875030B CN116875030B CN202311019841.2A CN202311019841A CN116875030B CN 116875030 B CN116875030 B CN 116875030B CN 202311019841 A CN202311019841 A CN 202311019841A CN 116875030 B CN116875030 B CN 116875030B
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- 238000009792 diffusion process Methods 0.000 title claims abstract description 46
- 238000002360 preparation method Methods 0.000 title claims description 8
- 229920005989 resin Polymers 0.000 claims abstract description 64
- 239000011347 resin Substances 0.000 claims abstract description 64
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 45
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 45
- 239000010703 silicon Substances 0.000 claims abstract description 45
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims abstract description 34
- 239000004327 boric acid Substances 0.000 claims abstract description 34
- 239000004611 light stabiliser Substances 0.000 claims abstract description 25
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 20
- 239000002250 absorbent Substances 0.000 claims abstract description 18
- 230000002745 absorbent Effects 0.000 claims abstract description 18
- 239000004088 foaming agent Substances 0.000 claims abstract description 18
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 17
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 17
- 239000002480 mineral oil Substances 0.000 claims abstract description 16
- 235000010446 mineral oil Nutrition 0.000 claims abstract description 16
- 239000002270 dispersing agent Substances 0.000 claims abstract description 15
- 238000005282 brightening Methods 0.000 claims abstract description 11
- 239000000203 mixture Substances 0.000 claims description 27
- 239000004005 microsphere Substances 0.000 claims description 17
- 238000010438 heat treatment Methods 0.000 claims description 11
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 claims description 9
- 239000000843 powder Substances 0.000 claims description 9
- 230000002087 whitening effect Effects 0.000 claims description 9
- 229920000642 polymer Polymers 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 7
- 239000006097 ultraviolet radiation absorber Substances 0.000 claims description 7
- HZAWHDJKNZWAAR-YHARCJFQSA-N 1-methoxy-2-[(e)-2-[4-[4-[(e)-2-(2-methoxyphenyl)ethenyl]phenyl]phenyl]ethenyl]benzene Chemical compound COC1=CC=CC=C1\C=C\C1=CC=C(C=2C=CC(\C=C\C=3C(=CC=CC=3)OC)=CC=2)C=C1 HZAWHDJKNZWAAR-YHARCJFQSA-N 0.000 claims description 6
- 238000005187 foaming Methods 0.000 claims description 6
- 229920001296 polysiloxane Polymers 0.000 claims description 6
- 125000005587 carbonate group Chemical group 0.000 claims description 5
- 238000004049 embossing Methods 0.000 claims description 5
- 238000006116 polymerization reaction Methods 0.000 claims description 5
- 229920002545 silicone oil Polymers 0.000 claims description 5
- 238000003756 stirring Methods 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 229940057995 liquid paraffin Drugs 0.000 claims description 4
- HCILJBJJZALOAL-UHFFFAOYSA-N 3-(3,5-ditert-butyl-4-hydroxyphenyl)-n'-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyl]propanehydrazide Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)NNC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 HCILJBJJZALOAL-UHFFFAOYSA-N 0.000 claims description 3
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 claims description 3
- 239000006081 fluorescent whitening agent Substances 0.000 claims description 2
- 229920001470 polyketone Polymers 0.000 description 42
- 230000000052 comparative effect Effects 0.000 description 12
- 239000000463 material Substances 0.000 description 5
- 238000002834 transmittance Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 230000002195 synergetic effect Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 239000012792 core layer Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 206010003591 Ataxia Diseases 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229910001125 Pa alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000003889 chemical engineering Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000010835 comparative analysis Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012770 industrial material Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229940124543 ultraviolet light absorber Drugs 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/32—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof from compositions containing microballoons, e.g. syntactic foams
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/0061—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof characterized by the use of several polymeric components
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2203/00—Foams characterized by the expanding agent
- C08J2203/22—Expandable microspheres, e.g. Expancel®
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2373/00—Characterised by the use of macromolecular compounds obtained by reactions forming a linkage containing oxygen or oxygen and carbon in the main chain, not provided for in groups C08J2359/00 - C08J2371/00; Derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2483/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2483/04—Polysiloxanes
- C08J2483/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
Abstract
The invention discloses a POK diffusion plate, which comprises the following components: 100 parts of POK resin, 3-8 parts of organic silicon light dispersing agent, 3-8 parts of boric acid modified organic silicon resin, 0.5-1.2 parts of antioxidant, 0.015-0.03 parts of mineral oil, 0.5-0.8 parts of light stabilizer, 0.4-0.8 parts of ultraviolet absorbent, 0.015-0.035 parts of brightening agent and 0.2-1.0 parts of foaming agent.
Description
Technical Field
The invention relates to the technical field of diffusion plate production, in particular to a POK diffusion plate and a preparation method thereof.
Background
The diffusion plate is widely applied to liquid crystal display, LED illumination, imaging and other systems, and has the main function of fully scattering incident light and realizing softer and uniform irradiation effect. However, the conventional GPPS material for manufacturing an optical diffusion plate generally has the problems of poor heat resistance and poor impact resistance, and the diffusion plate is easy to deform due to heating of a light source when used for a long time, so that the service life is influenced, and the diffusion plate is easy to damage due to impact in the transportation process, so that the diffusion plate is bad.
Polyketone (POK) is used as a novel crystalline engineering plastic, has impact resistance 3 times stronger than that of nylon materials and surface hardness better than that of POM, has excellent chemical resistance, wear resistance and high barrier property, and is widely applied to parts of automobile, electronic and industrial materials. CN107189420a is a high wear-resistant antistatic low-warpage POK-PA alloy material, patent document CN107189306a discloses a high heat conduction insulating AS material for motor fan blades and a preparation method thereof, but no report is available at present about a POK diffusion plate and a preparation method thereof.
Disclosure of Invention
In order to solve the problems, the invention provides a POK diffusion plate which comprises the following components in parts by mass: 100 parts of POK resin, 3-8 parts of organic silicon light dispersing agent, 3-8 parts of boric acid modified organic silicon resin, 0.5-1.2 parts of antioxidant, 0.015-0.03 part of mineral oil, 0.5-0.8 part of light stabilizer, 0.4-0.8 part of ultraviolet absorbent, 0.015-0.035 part of brightening agent and 0.2-1.0 part of foaming agent.
Further, the organic silicon light dispersing agent is polymethyl silsesquioxane organic silicon microsphere powder.
Further, the antioxidant is at least one of antioxidant 1024, antioxidant 1010 or antioxidant 1076.
Further, the mineral oil is silicone oil or liquid paraffin.
Further, the light stabilizer is selected from light stabilizer 770 and/or light stabilizer 622.
Further, the ultraviolet absorber is selected from ultraviolet absorber UV-329 and/or ultraviolet absorber UV-531.
Further, the brightening agent is fluorescent brightening agent CBS-127.
Further, the foaming agent is carbonate polymer foaming microsphere.
The invention also designs a preparation method of the POK diffusion plate, which comprises the following steps:
preparing boric acid modified organic silicon resin;
uniformly stirring the boric acid modified organic silicon resin, POK resin, organic silicon light dispersing agent, antioxidant, ultraviolet absorbent, light stabilizer, mineral oil, whitening agent and foaming agent to obtain a mixture a, and putting the mixture a into a single screw extruder; then heating the single-screw extruder to melt the mixture a, extruding the mixture a by the single-screw extruder, and embossing the mixture to obtain a finished product;
wherein, the temperature of each zone of the single screw extruder is as follows: the first area temperature is 180-190 ℃, the second area temperature is 190-200 ℃, the third area temperature is 210-220 ℃, the fourth area temperature is 210-220 ℃, the fifth area temperature is 225-235 ℃, the sixth area temperature is 215-225 ℃, the seventh area temperature is 210-220 ℃, and the die head temperature is 205-215 ℃.
Further, silicone, boric acid and water were mixed according to 1: (4-6): mixing (5-20) in mass ratio, and then carrying out polymerization reaction at 100-120 ℃ for 2-3 h, and then heating at 250-380 ℃ for 4-5 h to obtain the boric acid modified organic silicon resin.
The beneficial effects are that: the invention provides a POK diffusion plate which has good heat resistance and impact resistance while maintaining proper light transmittance and haze; the friction-resistant and impact-resistant POK resin is added into the diffusion plate to serve as matrix resin, so that the service life of the diffusion plate is greatly prolonged; the boric acid modified organic silicon resin has excellent heat resistance and good synergistic effect with the POK resin, the heat resistance and the impact resistance of the diffusion plate can be effectively improved by mixing the boric acid modified organic silicon resin and the POK resin in a certain proportion, and meanwhile, a certain amount of foaming agent is added into the diffusion plate to form air holes in the diffusion plate core layer, so that the use amount of the POK resin can be reduced, the weight of the diffusion plate is reduced, and the diffusion plate is helpful for timely heat dissipation; the invention has the advantages of easily obtained raw materials, simple molding process, no need of changing the original production equipment and easy industrialized production.
Detailed Description
The present invention will be described in further detail with reference to specific examples so as to more clearly understand the present invention by those skilled in the art.
The following examples are given for illustration of the invention only and are not intended to limit the scope of the invention. All other embodiments obtained by those skilled in the art without creative efforts are within the protection scope of the present invention based on the specific embodiments of the present invention.
In the examples of the present invention, all raw material components are commercially available products well known to those skilled in the art unless specified otherwise; in the embodiments of the present invention, unless specifically indicated, all technical means used are conventional means well known to those skilled in the art.
The raw material sources are as follows:
POK resin is Korean dawn group model M330A, purchased from Korean dawn group;
polymethylsilsesquioxane organosilicon microsphere powder purchased from new materials science and technology limited of Ming Yu, dongguan;
silicone, available from Qingdao cabinet Senmao new materials Co., ltd;
boric acid, purchased from the company gallery Pengchi fine chemical Co., ltd;
antioxidant, available from Shandong Xup chemical Co., ltd;
silicone oil, available from ataxia chou chemical engineering, inc;
liquid paraffin, available from Fenghuang energy Co., ltd;
light stabilizers, available from Shanghai Ten New Material Co., ltd;
ultraviolet light absorber, purchased from Jinan Xiangfeng chemical industry Co., ltd;
fluorescent whitening agent CBS-127, available from Guangzhou Yuanzha New Material Co., ltd;
carbonate polymer expanded microspheres, available from eastern chemistry, korea;
the remaining reagents are all commercially available as usual.
Example 1
In order to solve the technical problems of poor heat resistance and impact resistance and short service life of the existing optical diffusion plate, the embodiment provides a POK diffusion plate, which comprises the following components in parts by mass: 100 parts of POK resin, 6 parts of organic silicon light dispersing agent, 6 parts of boric acid modified organic silicon resin, 0.9 part of antioxidant, 0.025 part of mineral oil, 0.7 part of light stabilizer, 0.6 part of ultraviolet absorbent, 0.025 part of whitening agent and 0.6 part of foaming agent;
the POK resin is Korean dawn group model M330A, the melt flow rate of the POK resin under the condition of 240 ℃/2.16kg is 60g/10min, the organosilicon light dispersing agent is polymethyl silsesquioxane organosilicon microsphere powder, the antioxidant is antioxidant 1024, the mineral oil is silicone oil, the light stabilizer is a mixture of light stabilizer 770 and light stabilizer 622 according to the mass ratio of 1:1, the ultraviolet absorbent is a mixture of ultraviolet absorbent UV-329 and ultraviolet absorbent UV-531 according to the mass ratio of 1:1, the brightening agent is fluorescent brightening agent CBS-127, and the foaming agent is carbonate polymer foaming microsphere;
the POK diffusion plate is prepared according to the following steps:
preparing boric acid modified organic silicon resin, and mixing the silicon resin, boric acid and water according to a ratio of 1:4:5, carrying out polymerization reaction at 100 ℃ for 2 hours, and then heating at 250 ℃ for 4 hours to obtain boric acid modified organic silicon resin;
uniformly stirring the boric acid modified organic silicon resin, POK resin, organic silicon light dispersing agent, antioxidant, ultraviolet absorbent, light stabilizer, mineral oil, whitening agent and foaming agent to obtain a mixture a, and putting the mixture a into a single screw extruder; heating the single-screw extruder to melt the mixture a, extruding the mixture a by the single-screw extruder, and embossing the mixture to obtain a finished product;
wherein, the temperature of each zone of the single screw extruder is as follows: the first zone temperature was 185 ℃, the second zone temperature was 195 ℃, the third zone temperature was 215 ℃, the fourth zone temperature was 215 ℃, the fifth zone temperature was 230 ℃, the sixth zone temperature was 220 ℃, the seventh zone temperature was 215 ℃, and the die temperature was 210 ℃.
Example two
The embodiment provides a POK diffusion plate, which comprises the following components in parts by mass: 100 parts of POK resin, 8 parts of organic silicon light dispersing agent, 3 parts of boric acid modified organic silicon resin, 0.5 part of antioxidant, 0.015 part of mineral oil, 0.5 part of light stabilizer, 0.4 part of ultraviolet absorbent, 0.015 part of whitening agent and 0.2 part of foaming agent;
the POK resin is of Korean dawn group model M730R, the melt flow rate of the POK resin under the condition of 240 ℃/2.16kg is 30g/10min, the organosilicon light dispersing agent is polymethyl silsesquioxane organosilicon microsphere powder, the antioxidant is antioxidant 1010, the mineral oil is liquid paraffin, the light stabilizer is light stabilizer 770, the ultraviolet absorbent is ultraviolet absorbent UV-329, the brightening agent is fluorescent brightening agent CBS-127, and the foaming agent is carbonate polymer foaming microsphere;
the POK diffusion plate is prepared according to the following steps:
preparing boric acid modified organic silicon resin, and mixing the silicon resin, boric acid and water according to a ratio of 1:5:15, carrying out polymerization reaction at 110 ℃ for 2.5 hours, and then heating at 315 ℃ for 4.5 hours to obtain boric acid modified organic silicon resin;
uniformly stirring the boric acid modified organic silicon resin, POK resin, organic silicon light dispersing agent, antioxidant, ultraviolet absorbent, light stabilizer, mineral oil, whitening agent and foaming agent to obtain a mixture a, and putting the mixture a into a single screw extruder; heating the single-screw extruder to melt the mixture a, extruding the mixture a by the single-screw extruder, and embossing the mixture to obtain a finished product;
wherein, the temperature of each zone of the single screw extruder is as follows: the first zone temperature was 180 ℃, the second zone temperature was 190 ℃, the third zone temperature was 210 ℃, the fourth zone temperature was 210 ℃, the fifth zone temperature was 225 ℃, the sixth zone temperature was 215 ℃, the seventh zone temperature was 210 ℃, and the die temperature was 205 ℃.
Example III
The embodiment provides a POK diffusion plate, which comprises the following components in parts by mass: 100 parts of POK resin, 3 parts of organic silicon light dispersing agent, 8 parts of boric acid modified organic silicon resin, 1.2 parts of antioxidant, 0.03 part of mineral oil, 0.8 part of light stabilizer, 0.8 part of ultraviolet absorbent, 0.035 part of whitening agent and 1 part of foaming agent;
wherein the POK resin is Korean dawn group model M640A, the melt flow rate under the conditions of 255 ℃/2.16kg is 6.0g/10min, the organosilicon light dispersing agent is polymethyl silsesquioxane organosilicon microsphere powder, the antioxidant is antioxidant 1076, the mineral oil is silicone oil, the light stabilizer is light stabilizer 622, the ultraviolet absorbent is ultraviolet absorbent UV-531, the brightening agent is fluorescent brightening agent CBS-127, and the foaming agent is carbonate polymer foaming microsphere;
the POK diffusion plate is prepared according to the following steps:
preparing boric acid modified organic silicon resin, and mixing the silicon resin, boric acid and water according to a ratio of 1:6:20, carrying out polymerization reaction at 120 ℃ for 3 hours, and then heating at 380 ℃ for 5 hours to obtain boric acid modified organic silicon resin;
uniformly stirring the boric acid modified organic silicon resin, POK resin, organic silicon light dispersing agent, antioxidant, ultraviolet absorbent, light stabilizer, mineral oil, whitening agent and foaming agent to obtain a mixture a, and putting the mixture a into a single screw extruder; heating the single-screw extruder to melt the mixture a, extruding the mixture a by the single-screw extruder, and embossing the mixture to obtain a finished product;
wherein, the temperature of each zone of the single screw extruder is as follows: the first zone temperature was 190 ℃, the second zone temperature was 200 ℃, the third zone temperature was 220 ℃, the fourth zone temperature was 220 ℃, the fifth zone temperature was 235 ℃, the sixth zone temperature was 225 ℃, the seventh zone temperature was 220 ℃, and the die temperature was 215 ℃.
Comparative example one
This comparative example differs from example one in that 100 parts of GPPS was substituted for 100 parts of POK resin in example one, and the other components and experimental procedures were the same as example one.
Comparative example two
This comparative example differs from example one in that 100 parts of POK resin was added to 103 parts, and boric acid-modified silicone resin was not added, and the other components and experimental procedure were the same as example one.
Comparative example three
This comparative example differs from example one in that 8 parts of silica was substituted for 8 parts of polymethylsilsesquioxane silicone microsphere powder in example one, and the other components and experimental procedures were the same as example one.
Comparative example four
This comparative example differs from example one in that 100 parts of POK resin was added to 103.2 parts, and boric acid-modified silicone resin and carbonate-based polymer foam microspheres were not added, and the other components and experimental procedure were the same as example one.
The diffusion plates produced in examples 1 to 3 and comparative examples 1 to 4 were examined.
The testing method comprises the following steps:
heat distortion temperature is tested according to ASTM D648;
impact strength was tested according to ASTM D256;
light transmittance and haze were tested according to ASTM D1003;
density was tested according to ASTM D792;
center brightness and average brightness were tested according to GY/T326-2019 standard, and the test results are shown in Table 1.
TABLE 1 diffuser plate Performance test results Table
From the experimental data, each performance index of the first to third embodiments is better than that of the comparative examples, and each thermal deformation temperature, impact strength, light transmittance and haze index of the first embodiment are better than those of the first and third embodiments, and the comparative analysis of each data of the first and fourth comparative examples shows that the thermal deformation temperature and impact strength data of the first embodiment are greatly improved when the first embodiment uses POK resin compared with the diffusion plate prepared by GPPS, which means that the diffusion plate prepared by GPPS material is beneficial to improving the heat resistance and impact resistance of the diffusion plate; compared with the comparative example, the thermal deformation temperature and impact strength data of the diffusion plate are greatly improved after the boric acid modified organic silicon resin is added, which shows that the boric acid modified organic silicon resin and the POK resin have good synergistic effect, and the heat resistance and impact resistance of the diffusion plate can be effectively improved; in the first embodiment, compared with the third embodiment, the use of the polymethylsilsesquioxane organosilicon microsphere powder has improved data of light transmittance, haze, center brightness and average brightness, which indicates that the polymethylsilsesquioxane organosilicon microsphere powder is more beneficial to improving the diffusion effect of the diffusion plate compared with the silicon dioxide; compared with the first embodiment, the fourth embodiment has the advantage that the diffusion plate has reduced light scattering effect and heat dissipation performance after the foaming microspheres of the organic silicon resin and the carbonate polymer are not added.
Thus, the POK diffusion plate provided by the invention has good heat resistance and impact resistance while maintaining proper light transmittance and haze; the friction-resistant and impact-resistant POK resin is added into the diffusion plate to serve as matrix resin, so that the service life of the diffusion plate is greatly prolonged; the boric acid modified organic silicon resin has excellent heat resistance and good synergistic effect with the POK resin, the heat resistance and the impact resistance of the diffusion plate can be effectively improved by mixing the boric acid modified organic silicon resin and the POK resin in a certain proportion, and meanwhile, a certain amount of foaming agent is added into the diffusion plate to enable air bubbles to be formed in the diffusion plate core layer, so that the consumption of the POK resin can be reduced, the weight of the diffusion plate is reduced, and timely heat dissipation is facilitated.
The above is merely an embodiment of the present invention, and is not intended to limit the present invention. Various modifications and variations of the present invention will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, or the like, which is within the spirit and principles of the present invention, should be included in the scope of the claims of the present invention.
Claims (8)
1. The POK diffusion plate is characterized by comprising the following components in parts by weight: 100 parts of POK resin, 3-8 parts of organic silicon light dispersing agent, 3-8 parts of boric acid modified organic silicon resin, 0.5-1.2 parts of antioxidant, 0.015-0.03 part of mineral oil, 0.5-0.8 part of light stabilizer, 0.4-0.8 part of ultraviolet absorbent, 0.015-0.035 part of brightening agent and 0.2-1.0 part of foaming agent; the foaming agent is carbonate polymer foaming microsphere;
the boric acid modified organic silicon resin is prepared by adopting the following preparation method, wherein the preparation method comprises the following steps: silicone, boric acid and water were mixed according to 1: (4-6): mixing (5-20) in mass ratio, and then carrying out polymerization reaction at 100-120 ℃ for 2-3 h, and then heating at 250-380 ℃ for 4-5 h to obtain the boric acid modified organic silicon resin.
2. The POK diffuser plate of claim 1, wherein the silicone light diffuser is polymethylsilsesquioxane silicone microsphere powder.
3. The POK diffuser plate of claim 1, wherein the antioxidant is at least one of antioxidant 1024, antioxidant 1010, or antioxidant 1076.
4. The POK diffuser plate of claim 1, wherein the mineral oil is silicone oil or liquid paraffin.
5. The POK diffuser plate of claim 1, wherein the light stabilizer is selected from the group consisting of light stabilizer 770 and/or light stabilizer 622.
6. The POK diffuser plate of claim 1, wherein the ultraviolet absorber is selected from ultraviolet absorber UV-329 and/or ultraviolet absorber UV-531.
7. The POK diffuser plate of claim 1, wherein the whitening agent is fluorescent whitening agent CBS-127.
8. The method for preparing a POK diffusion plate according to claim 1, comprising the steps of:
preparing boric acid modified organic silicon resin;
uniformly stirring the boric acid modified organic silicon resin, POK resin, organic silicon light dispersing agent, antioxidant, ultraviolet absorbent, light stabilizer, mineral oil, whitening agent and foaming agent to obtain a mixture a, and putting the mixture a into a single screw extruder; heating the single-screw extruder to melt the mixture a, extruding the mixture a by the single-screw extruder, and embossing the mixture to obtain a finished product;
wherein, the temperature of each zone of the single screw extruder is as follows: the first area temperature is 180-190 ℃, the second area temperature is 190-200 ℃, the third area temperature is 210-220 ℃, the fourth area temperature is 210-220 ℃, the fifth area temperature is 225-235 ℃, the sixth area temperature is 215-225 ℃, the seventh area temperature is 210-220 ℃, and the die head temperature is 205-215 ℃.
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| JPH11349801A (en) * | 1998-06-12 | 1999-12-21 | Shikoku Chem Corp | Thermoplastic resin composition |
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| EP3168252A1 (en) * | 2015-11-13 | 2017-05-17 | Ems-Patent Ag | Polyketone moulding materials with improved properties, moulded parts produced therefrom and method for its manufacture |
| CN107513262A (en) * | 2016-06-18 | 2017-12-26 | 合肥杰事杰新材料股份有限公司 | Polyketone composition |
| CN109354857A (en) * | 2018-11-09 | 2019-02-19 | 晋江瑞碧科技有限公司 | Fretting map POK composite material and preparation method and purposes |
| CN114524984A (en) * | 2020-11-23 | 2022-05-24 | 中国石油化工股份有限公司 | Diffuse-scattering high-light-transmittance resin composition, resin composition pellet, application of resin composition pellet and film |
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2023
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| JPH11349801A (en) * | 1998-06-12 | 1999-12-21 | Shikoku Chem Corp | Thermoplastic resin composition |
| CN104212347A (en) * | 2014-09-17 | 2014-12-17 | 江苏海晟涂料有限公司 | Boron-modified organic silicon resin high-temperature-resistant coating and preparation method thereof |
| EP3168252A1 (en) * | 2015-11-13 | 2017-05-17 | Ems-Patent Ag | Polyketone moulding materials with improved properties, moulded parts produced therefrom and method for its manufacture |
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| CN109354857A (en) * | 2018-11-09 | 2019-02-19 | 晋江瑞碧科技有限公司 | Fretting map POK composite material and preparation method and purposes |
| CN114524984A (en) * | 2020-11-23 | 2022-05-24 | 中国石油化工股份有限公司 | Diffuse-scattering high-light-transmittance resin composition, resin composition pellet, application of resin composition pellet and film |
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