CN116849688A - CT detector module and positioning and assembling method thereof - Google Patents
CT detector module and positioning and assembling method thereof Download PDFInfo
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- CN116849688A CN116849688A CN202310855495.5A CN202310855495A CN116849688A CN 116849688 A CN116849688 A CN 116849688A CN 202310855495 A CN202310855495 A CN 202310855495A CN 116849688 A CN116849688 A CN 116849688A
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- 238000000034 method Methods 0.000 title claims abstract description 19
- 238000001514 detection method Methods 0.000 claims description 24
- 238000009434 installation Methods 0.000 claims description 22
- 230000008054 signal transmission Effects 0.000 claims description 11
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 9
- 230000017525 heat dissipation Effects 0.000 description 6
- 239000000306 component Substances 0.000 description 4
- 238000002591 computed tomography Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 230000002035 prolonged effect Effects 0.000 description 3
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- 238000010146 3D printing Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
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- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
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- A61B6/00—Apparatus for radiation diagnosis, e.g. combined with radiation therapy equipment
- A61B6/02—Devices for diagnosis sequentially in different planes; Stereoscopic radiation diagnosis
- A61B6/03—Computerised tomographs
- A61B6/032—Transmission computed tomography [CT]
- A61B6/035—Mechanical aspects of CT
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B6/00—Apparatus for radiation diagnosis, e.g. combined with radiation therapy equipment
- A61B6/42—Apparatus for radiation diagnosis, e.g. combined with radiation therapy equipment with arrangements for detecting radiation specially adapted for radiation diagnosis
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Abstract
The invention provides a CT detector module and a positioning and assembling method thereof, wherein the CT detector module comprises a carrier plate, an anti-scattering grid, a main body structural member and a signal processing plate, the main body structural member comprises a bracket and two end blocks, and the end blocks are provided with mounting and positioning interfaces for mounting the detector module on a CT detector subsystem, so that the length of the detector module can be prevented from being increased, and the detector module is compact in structure. When the detector module is assembled, a first reference surface, a second reference surface and a third reference surface are firstly constructed in the detector module, then the reference surfaces are respectively converted into a detector subsystem and a second positioning tool, the CT detector module is assembled in the second positioning tool by using the reference surfaces, the detector module is positioned and assembled by using the uniform reference surfaces, a tolerance chain is shortened, error sources are reduced, positioning accuracy is improved, and therefore sufficient geometric accuracy is provided for image reconstruction.
Description
Technical Field
The invention relates to the technical field of computer tomography, in particular to a CT detector module and a positioning and assembling method thereof.
Background
The computer tomography (Computed Tomography, CT) technology uses X-ray beam to scan the layer of a certain thickness of human body, the detector receives X-ray transmitted through the layer, the detector converts the X-ray into visible light, the visible light is converted into electric signal, the electric signal is converted into digital signal by analog/digital converter (analog/digital converter), and the digital signal is reconstructed by computer to generate the section or stereo image of the checked part of human body, thus finding the potential tiny lesions in the human body.
The X-ray detector is one of the core components of the CT equipment and consists of a plurality of circuit boards, chips and a signal interconnection system, and a plurality of detectors arranged along the arc direction form a detector subsystem of the CT. Because the reconstruction of CT images depends on specific light path geometry, the assembly positioning accuracy of the detector has important influence on the imaging quality of CT. The detector module is usually assembled by Anti-scatter grid (Anti-scattering grating, ASG), carrier plate, main body structure, however, during the assembly process, unnecessary assembly errors are introduced due to the repeated use of multiple tools and conversion of assembly references, which affects the imaging quality.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, the present invention provides a CT detector module and a positioning assembly method thereof, where the CT detector module includes a carrier plate, an anti-scatter grid, a main body structure and a signal processing plate, the main body structure includes a support and two end blocks, and the end blocks are provided with mounting positioning interfaces for mounting the detector module on a CT detector subsystem, so that the length of the detector module can be prevented from being increased, and the structure of the detector module is compact. When the detector module is assembled, a first reference surface, a second reference surface and a third reference surface are firstly constructed in the detector module, then the reference surfaces are respectively converted into a detector subsystem and a second positioning tool, the end block and the anti-scattering grid are positioned and assembled by the reference surfaces in the second positioning tool, and the CT detector module is assembled.
To achieve the above and other related objects, the present invention provides a CT detector module comprising:
the carrier plate comprises a circuit board and a detection unit, wherein the detection unit is positioned in the middle of the surface of the circuit board, and first mounting holes are formed in two ends of the circuit board;
the anti-scattering grid is positioned above the carrier plate and is arranged opposite to the detection unit;
the main structural member comprises a bracket and two end blocks, wherein,
the two end blocks are positioned on the surface of the circuit board and are respectively connected with two ends of the anti-scattering grid, and the surface of each end block is provided with an installation positioning interface;
the support is positioned below the circuit board and comprises a top surface, a first side surface, a second side surface and a third side surface, the top surface is parallel to the circuit board, the first side surface is perpendicular to the top surface, the first side surface forms a concave part relative to the top surface, the second side surface is opposite to the first side surface, and the third side surface is connected with the first side surface and the second side surface;
and the signal processing plate is positioned on the first side surface and arranged in the concave part.
Optionally, the anti-scattering grid comprises a grid part and two connecting parts, and the grid part is opposite to the detection unit; the two connecting parts are respectively positioned at two opposite ends of the grid part and are respectively connected with the two end blocks.
Optionally, the circuit board further comprises a readout chip, wherein the readout chip is located on the bottom surface of the circuit board and is located right below the connection part.
Optionally, the top surface includes:
the first step surface is positioned in the middle of the top surface and is attached to the reading chip through a heat conducting medium;
the second step surfaces are positioned on two sides of the first step surface and are higher than the first step surface in height and used for placing the carrier plate, and second mounting holes are formed in the second step surface and are coaxial with the first mounting holes;
the third step surface is positioned on two sides of the second step surface, is higher than the second step surface in height and is used for placing the end block, and a third mounting hole is formed in the third step surface.
Optionally, a surface of the signal processing board facing away from the first side surface is provided with a plug connector; the signal processing chip is arranged on one surface of the signal processing plate, which is close to the first side surface, and is attached to the bracket through a heat conducting medium.
Optionally, the CT detector module further includes a signal transmission unit, where one end of the signal transmission unit is embedded in the circuit board, and the other end of the signal transmission unit is inserted into the plug connector.
Optionally, a heat dissipation structure is disposed on the second side, and the heat dissipation structure includes a plurality of heat dissipation fins disposed at intervals.
Optionally, the first side surface and the second side surface form an included angle of 1 ° to 7 °.
Optionally, a fourth mounting hole and a fifth mounting hole are formed in the end block, and the fourth mounting hole and the third mounting hole are coaxially arranged.
Optionally, the connecting portion is provided with a first positioning hole and a sixth mounting hole, and the sixth mounting hole and the fifth mounting hole are coaxially arranged.
Optionally, the mounting positioning interface is located between the fourth mounting hole and the fifth mounting hole, and includes a seventh mounting hole and a second positioning hole.
The invention also provides a positioning and assembling method of the CT detector module, which comprises the following steps:
s1: providing a detector module, wherein the detector module is any CT detector module, and a first reference surface, a second reference surface and a third reference surface are constructed in the detector module, wherein the first reference surface is a plane where the surface of the end block is located, the second reference surface is a plane formed by the axes of the second positioning holes, and the third reference surface is a plane where the third side surface is located;
s2: providing a detector subsystem, wherein the detector subsystem is provided with a plurality of installation bit groups which are arranged in parallel, a positioning structure matched with the installation positioning interface is arranged in the installation bit groups, so that the detector module is installed on the detector subsystem, when the detector module is installed on the detector subsystem, the bottom surface of the installation bit group is flush with the third side surface, the plane of the surface of the installation bit group is the first reference surface, the plane formed by the axes of the positioning structures is the second reference surface, and the plane of the bottom surface of the installation bit group is the third reference surface;
s3: placing the carrier plate on the second step surface, aligning the carrier plate with the bracket by using a first positioning tool, and then fixedly connecting the carrier plate with the bracket;
s4: providing a second positioning tool, wherein the second positioning tool is provided with a first positioning surface, a second positioning surface, a third positioning surface, two first positioning pins and two second positioning pins, the first positioning pins are positioned on the first positioning surface, the plane where the first positioning surface is positioned is the first reference surface, the plane formed by the axes of the two first positioning pins is the second reference surface, and the plane where the second positioning surface is positioned is the third reference surface;
s5: placing the two end blocks in the second positioning tool, enabling the surfaces of the end blocks to be attached to the first positioning surface, enabling the first positioning pins to pass through the second positioning holes, and enabling the side wall of one of the end blocks to be attached to the second positioning surface;
s6: placing the anti-scattering grid in the second positioning tool, enabling the second positioning pin to pass through the first positioning hole, and fixedly connecting the anti-scattering grid with the two end blocks;
s7: and (3) placing the bracket provided with the carrier plate and obtained in the step (S3) in a second positioning tool, enabling the bottom surface of the end block to be attached to the third step surface, attaching the side wall of the bracket to the second positioning surface, attaching the side edge of the detection unit to the third positioning surface, and fixedly connecting the bracket to the anti-scattering grid and the end block.
Optionally, the first positioning tool is provided with a fourth positioning surface, a fifth positioning surface, a sixth positioning surface, a seventh positioning surface and an eighth positioning surface.
Optionally, step S3 includes:
s31: the first positioning tool is buckled on the surface of the carrier plate, the fourth positioning surface is attached to the third step surface, the fifth positioning surface is attached to the second side surface, the sixth positioning surface is attached to the third side surface, and two adjacent side walls of the detection unit are attached to the seventh positioning surface and the eighth positioning surface respectively;
s32: and the carrier plate is fixedly connected with the bracket by penetrating the first mounting hole and the second mounting hole through the fastener.
Optionally, in step S6, the anti-scattering grid is fixedly connected to the end block by using fasteners passing through the fifth mounting hole and the sixth mounting hole.
Optionally, in step S7, a fastener is used to pass through the third mounting hole and the fourth mounting hole, so that the bracket is fixedly connected with the anti-scattering grid and the end block.
Optionally, step S7 further includes: the signal processing board is mounted in the recess.
The CT detector module and the positioning and assembling method thereof provided by the invention have at least the following beneficial effects:
the end block in the CT detector module is provided with the installation positioning interface which is used for installing the detector module on the CT detector subsystem, and meanwhile, the length of the detector module is prevented from being increased, so that the structure of the detector module is compact; in addition, the end block and the anti-scattering grid play a role in shielding rays of the signal processing plate together, so that the service life of the detector module is prolonged effectively; finally, the support is provided with a heat radiation structure, so that the detector module can radiate heat in time.
According to the positioning and assembling method of the CT detector module, the detector module is positioned and assembled by utilizing the unified reference system, so that a tolerance chain is shortened, error sources are reduced, positioning accuracy is improved, and therefore sufficient geometric accuracy is provided for image reconstruction.
Drawings
Fig. 1 is a schematic structural diagram of a CT detector module according to a first embodiment.
Fig. 2 is a schematic structural diagram of a carrier according to a first embodiment.
Fig. 3 is a schematic structural view of an anti-scattering grid according to a first embodiment.
Fig. 4a shows a schematic structural diagram of a stent according to the first embodiment.
Fig. 4b shows a side view of the stent provided for embodiment one.
Fig. 5 shows a schematic structural diagram of an end block according to the first embodiment.
Fig. 6 shows a schematic view of a first reference plane, a second reference plane and a third reference plane provided for the second embodiment in a detector module.
Fig. 7 shows a schematic view of the first reference plane, the second reference plane and the third reference plane provided for the second embodiment in the detector subsystem.
Fig. 8 is a schematic structural diagram of a first positioning tool according to a second embodiment.
Fig. 9 is a schematic diagram of a loading plate and a bracket using a first positioning tooling set in the second embodiment.
Fig. 10 is a schematic structural diagram of a second positioning tool according to the second embodiment.
Fig. 11 is a schematic diagram showing the assembly of the anti-scatter-grid and the end-block using the second positioning fixture in the second embodiment.
Fig. 12 is a schematic diagram of a CT detector module assembled in the second embodiment.
Description of element reference numerals
10. Second positioning tool for carrier plate 82
11. First positioning pin of circuit board 821
12. Second positioning pin of detection unit 822
120. Flash crystal 90 screw
20. First mounting hole of anti-scattering grid 101
21. Second mounting hole of grille part 102
210. Third mounting hole of grille 103
22. Fourth mounting hole of connecting portion 104
23. Fifth mounting hole of reinforcing rib 105
31. Sixth mounting hole of bracket 106
311. A seventh mounting hole of the first side 107
312. Second side 201 first positioning hole
313. Third side 202 second positioning hole
314. Top face 1000 mounting set of bits
300. Positioning structure for concave portion 1001
3120. First reference surface of heat sink fin 1111
3131. First step surface 1112 second reference surface
3132. Second step surface 1113 third reference surface
3133. Third step surface 801 first positioning surface
32. Second locating surface of end block 802
40. Third positioning surface of signal processing board 803
41. Fourth positioning surface of plug connector 804
50. Fifth positioning surface of read-out chip 805
60. Sixth positioning surface of heat conducting medium 806
70. Seventh positioning surface of signal transmission unit 807
81. Eighth locating surface of first locating tool 808
Detailed Description
Other advantages and effects of the present invention will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present invention with reference to specific examples. The invention may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present invention.
It should be noted that, the illustrations provided in the present embodiment only illustrate the basic concept of the present invention by way of illustration, but only the components related to the present invention are shown in the illustrations, rather than being drawn according to the number, shape and size of the components in actual implementation, and the form, number, positional relationship and proportion of each component in actual implementation may be changed at will on the premise of implementing the present technical solution, and the layout of the components may be more complex.
Example 1
The present embodiment provides a CT detector module, as shown in fig. 1, comprising a carrier plate 10, an anti-scatter grid 20, a main body structure comprising a support 31 and two end blocks 32, and a signal processing plate 40.
As shown in fig. 2, the carrier board 10 includes a circuit board 11 and a detection unit 12, and the detection unit 12 is located at a position intermediate the surface of the circuit board 11. As an example, the circuit board 11 is provided at both ends with first mounting holes 101 for fixing the carrier board 10 to the bracket 31. As an example, the detection unit 12 is composed of a scintillator crystal 120 in which a plurality of lattice arrays are arranged in a longitudinal and transverse direction, and a photodiode (not shown in the figure) located at the bottom of the scintillator crystal 120.
As shown in fig. 1, the anti-scatter grid 20 is located above the carrier plate 10 and opposite to the detection unit 12. As shown in fig. 3, the anti-scatter-grid 20 includes a grid part 21 and two connection parts 22, wherein the grid part 21 is disposed opposite to the detection unit 12; the two connection portions 22 are located at opposite ends of the grill portion 21, respectively. As an example, the grid part 21 is formed by a plurality of grids 210 arranged in a crisscross manner, and the positions of the grids 210 are matched with the positions of each subunit in the detection unit 12, and after the center of the grids 210 is reversely prolonged, the grids will intersect with the bulb focus of the CT system. As an example, the connection portion 22 is provided with a first positioning hole 201 and a sixth mounting hole 106, wherein the first positioning hole 201 is used for positioning the anti-scatter-grid during assembly, and the sixth mounting hole 106 is used for connecting the end block 32. In the present embodiment, the reinforcing ribs 23 are provided between the connection portion 22 and the grill portion 21 for increasing the stability of the anti-scatter-grid 20. In the present embodiment, the anti-scatter grid 20 is formed of a tungsten alloy by 3D printing.
As shown in fig. 2, the bottom surface of the circuit board 11 is provided with a readout chip 50 for converting analog signals into digital signals, and the readout chip 50 is located directly under the connection portion 22 to avoid damage to the readout chip 50 by excessive X-rays.
As shown in fig. 1, the body structure includes a bracket 31 and two end blocks 32, wherein the bracket 31 is located below the circuit board 11 and the two end blocks 32 are located on the surface of the circuit board 11.
As shown in fig. 4a and 4b, the bracket 31 includes a first side 311, a second side 312, and a third side 313, and a top surface 314, wherein the top surface 314 is parallel to the circuit board 11, the first side 311 is perpendicular to the top surface 314, and the first side 311 forms a recess 300 opposite to the top surface 314, and the recess 300 is used for placing the signal processing board 40; the second side 312 is disposed opposite to the first side 311, and the third side 313 connects the first side 311 and the second side 312.
As shown in fig. 4a, the top surface 314 includes a first step surface 3141, a second step surface 3142, and a third step surface 3143. As an example, the first step surface 3141 is located in the middle of the top surface 314, and as shown in fig. 2, the first step surface 3141 is attached to the readout chip 50 through the heat-conducting medium 60, so that heat of the readout chip 50 is transferred to the support 31, and in this embodiment, the heat-conducting medium 60 is a heat-conducting silicon sheet. As an example, the second step surface 3142 is located at both sides of the first step surface 3141 and has a height higher than the first step surface 3141 for placing the carrier plate 10, and the second step surface 3142 is provided with a second mounting hole 102, and the second mounting hole 102 is coaxially disposed with the first mounting hole 101 to fix the carrier plate 10 on the bracket 31. As an example, the third step surface 3143 is located at both sides of the second step surface 3142 and is higher than the second step surface 3142 for placing the end block 32, and the third step surface 3143 is provided with the third mounting hole 103.
As shown in fig. 1, the signal processing board 40 is located on the first side 311 and is disposed in the recess 300, and the signal processing board 400 is disposed in the recess 300, so that interference between adjacent CT detector modules arranged in the arc direction can be avoided, and the signal processing board 40 is located directly below the anti-scatter grid 20 and the detection unit 12, so that irradiation with a large dose of X-rays can be avoided. As an example, the side of the signal processing board 40 facing away from the first side 311 has a plug connector 41; the surface of the signal processing board 40 near the first side 311 is provided with a signal processing chip (not shown in the figure), and the signal processing chip is attached to the bracket 31 through a heat conducting medium (not shown in the figure), so that the heat of the signal processing chip is transferred to the bracket 31, and in this embodiment, the heat conducting medium is a heat conducting silica gel sheet.
As shown in fig. 1, the CT detector module further includes a signal transmission unit 70, and the signal transmission unit 70 is located directly under the connection portion 22, and one end of the signal transmission unit is embedded in the circuit board 11, and the other end of the signal transmission unit is inserted into the plug connector 41. The signal transmission unit 70 is used for connecting the carrier board 10 and the signal processing board 40, and transmitting the electrical signal to the signal processing board 40. As an example, the signal transmission unit 70 is a flexible line.
As shown in fig. 4a and 4b, the second side 312 is provided with a heat dissipation structure, which includes a plurality of heat dissipation fins 3120 disposed at intervals, and heat generated by the readout chip 50 and the signal processing chip is transferred to the bracket 31 and is heat exchanged with the cold air flow through the heat dissipation fins 3120. As shown in fig. 4b, the first side 311 is perpendicular to the top surface 314 and the second side 312 is not perpendicular to the top surface 314, so that the first side 311 and the second side 312 form an angle to leave a sufficient convection space for adjacent CT detector modules, which in this embodiment is between 1 ° and 7 °, preferably 3 °.
As shown in fig. 1, end blocks 32 are connected to both ends of the anti-scatter-grid 20, respectively. As shown in fig. 5, the surface of the end block 32 is provided with a fourth mounting hole 104, a fifth mounting hole 105 and a mounting and positioning interface, which includes a seventh mounting hole 107 and a second positioning hole 202. As an example, a fourth mounting hole 104 is provided coaxially with the third mounting hole 103 for securing the end block 32 to the bracket 31; the fifth mounting hole 105 is coaxially disposed with the sixth mounting hole 106 for connecting the end block 32 with the anti-scatter grid 20; the mounting positioning interface is an installation interface of the detector module and the CT detector subsystem, where the second positioning hole 202 is used for positioning the end block 32 during the assembly process and positioning the CT detector module when being installed to the CT detector subsystem, and the seventh mounting hole 107 is used for installing the CT detector module provided in the embodiment on the CT detector subsystem. In the CT detector module provided by the embodiment, the installation positioning interface is arranged on the end block of the main body structural member, so that the length of the detector module can be effectively shortened in the arrangement direction of the end block, and the whole CT detector module is compact in structure; in addition, the end block is arranged above the signal processing plate, and can play a certain role in shielding and protecting rays of the signal processing plate, so that the service life of the detector module is prolonged.
Example two
The embodiment provides a positioning and assembling method of a CT detector module, which comprises the following steps:
s1: providing a detector module, and constructing a first reference surface, a second reference surface and a third reference surface in the detector module;
as an example, the detector module is a CT detector module provided in the first embodiment, and the specific structure thereof is described with reference to the first embodiment and will not be described herein.
As shown in fig. 6, a first reference plane 1111, a second reference plane 1112, and a third reference plane 1113 are constructed in the detector module, where the first reference plane 1111 is a plane on which the surface of the end block 32 is located (a plane formed by an X axis and a Z axis in fig. 6), the second reference plane 1112 is a plane formed by an axis of the second positioning hole 202 and a Y axis and a Z axis in fig. 6), and the third reference plane 1113 is a plane on which the third side 313 is located (a plane formed by an X axis and a Y axis in fig. 6).
S2: providing a detector subsystem, wherein the detector subsystem is provided with a plurality of installation bit groups which are arranged in parallel, a positioning structure matched with the installation positioning interface is arranged in the installation bit groups, the plane of the surface of the installation bit group is the first reference plane, the plane formed by the axes of the positioning structure is the second reference plane, and the plane of the bottom surface of the installation bit group is the third reference plane;
as shown in fig. 7, a detector subsystem is provided, the detector subsystem has a plurality of mounting groups 1000 arranged in parallel, the mounting groups 1000 have positioning structures 1001 therein, the positioning structures 1001 cooperate with mounting positioning interfaces in the detector modules to enable the detector modules to be mounted on the detector subsystem, and when the detector modules are mounted on the detector subsystem, the bottom surfaces of the mounting groups are flush with the third side 313. In this embodiment, the locating structure 1001 is a locating pin that cooperates with the second locating hole 202 to mount the detector module to the detector subsystem.
As shown in fig. 7, the detector subsystem has the same reference frame as the detector modules, i.e., the detector subsystem has a first reference plane 1111, a second reference plane 1112, and a third reference plane 1113. As an example, the first reference plane 1111 is a plane on which the surface of the mounting bit set 1000 is located (a plane formed by the X axis and the Z axis in fig. 7), the second reference plane 1112 is a plane formed by the axis of the positioning structure 1001 (a plane formed by the Y axis and the Z axis in fig. 7), and the third reference plane 1113 is a plane on which the bottom surface of the mounting bit set 1000 is located (a plane formed by the X axis and the Y axis in fig. 7). The same reference system as the detector module is built in the detector subsystem, so that the assembly references can be unified, assembly errors can be reduced, and assembly accuracy can be improved.
S3: placing the carrier plate on the second step surface, aligning the carrier plate with the bracket by using a first positioning tool, and then fixedly connecting the carrier plate with the bracket;
as shown in fig. 8, a first positioning tool 81 is provided. As an example, the first positioning fixture 81 has a fourth positioning surface 804, a fifth positioning surface 805, a sixth positioning surface 806, a seventh positioning surface 807, and an eighth positioning surface 808, and further includes a plurality of screws 90.
As shown in fig. 9, the carrier 10 is placed on the second step surface 3142, and the first positioning tool 81 is fastened to the surface of the carrier 10. As an example, the fourth positioning surface 804 is abutted against the third step surface 3143, the fifth positioning surface 805 is abutted against the second side surface 312, the sixth positioning surface 806 is abutted against the third side surface 313, and the two adjacent side walls of the detection unit 12 are abutted against the seventh positioning surface 807 and the eighth positioning surface 808, respectively.
Next, screwing the plurality of screws 90 to tightly attach the carrier plate 10 to the first positioning tool 81; finally, the carrier plate 10 is fixedly connected to the bracket 31 by means of fasteners (not shown in the drawings) passing through the first mounting holes 101, the second mounting holes 102.
S4: providing a second positioning tool, wherein the second positioning tool is provided with a first positioning surface, a second positioning surface, a third positioning surface, two first positioning pins and two second positioning pins, the first positioning pins are positioned on the first positioning surface, the plane where the first positioning surface is positioned is the first reference surface, the plane formed by the axes of the two first positioning pins is the second reference surface, and the plane where the second positioning surface is positioned is the third reference surface;
as shown in fig. 10, a second positioning tool 82 is provided, in which the second positioning tool 82 has a first positioning surface 801, a second positioning surface 802, a third positioning surface 803, two first positioning pins 821, two second positioning pins 822, and a plurality of screws 90, the first positioning pins 821 are located on the first positioning surface 801, a plane on which the first positioning surface 801 is located is a first reference surface 1111 (a plane formed by an X axis and a Z axis in fig. 10), a plane formed by the two first positioning pin axes 821 is a second reference surface 1112 (a plane formed by a Y axis and a Z axis in fig. 10), and a plane on which the second positioning surface 802 is located is a third reference surface 1113 (a plane formed by an X axis and a Y axis in fig. 10). The second positioning tool 82 is used for positioning the anti-scattering grid 20, the end block 32 and the support 31 loaded with the carrier plate 10 in the assembly process, and the first reference surface 1111, the second reference surface 1112 and the third reference surface 1113 in the detector module are converted into the second positioning tool 82, so that the assembly references are unified, the assembly errors are reduced, and the assembly precision is improved.
S5: placing the two end blocks in the second positioning tool, enabling the surfaces of the end blocks to be attached to the first positioning surface, enabling the first positioning pins to pass through the second positioning holes, and enabling the side wall of one of the end blocks to be attached to the second positioning surface;
as shown in fig. 11, the two end blocks 32 are placed in the second positioning fixture 82, so that the surfaces of the end blocks 32 are attached to the first positioning surface 801, the first positioning pins 821 pass through the second positioning holes 202, and the side wall of one of the end blocks 32 is attached to the second positioning surface 802.
S6: placing the anti-scattering grid in the second positioning tool, enabling the second positioning pin to pass through the first positioning hole, and fixedly connecting the anti-scattering grid with the two end blocks;
as shown in fig. 11, the anti-scatter grid 20 is placed in the second positioning tool 82, and the second positioning pin 822 passes through the first positioning hole 201; next, anti-scatter grid 20 is tightly attached to end block 32 by tightening screw 90; finally, the anti-scatter-grid 20 is fixedly connected to the two end blocks 32 by means of fasteners (not shown in the figures) passing through the fifth mounting holes 105, the sixth mounting holes 106.
S7: and (3) placing the bracket provided with the carrier plate and obtained in the step (S3) in a second positioning tool, enabling the bottom surface of the end block to be attached to the third step surface, attaching the side wall of the bracket to the second positioning surface, attaching the side edge of the detection unit to the third positioning surface, and fixedly connecting the bracket to the anti-scattering grid and the end block.
As shown in fig. 12, the bracket 31 with the carrier plate 10 mounted thereon obtained in step S3 is placed in the second positioning tool 82, the bottom surface of the end block 32 is bonded to the third step surface 3143, the side wall of the bracket 31 is bonded to the second positioning surface 802, the side edge of the detection unit 12 is bonded to the third positioning surface 803, the contact surface is tightly bonded by screwing the screw 90, and then the second positioning tool 82 is turned over, and the bracket 31 is fixedly connected to the anti-scatter grid 20 and the end block 32 by passing fasteners (not shown in the drawings) through the third mounting hole 103 and the fourth mounting hole 104.
Finally, the signal processing board 40 is installed in the recess 300, so that the assembly of the whole CT detector module is completed.
In the positioning and assembling method of the CT detector module provided in this embodiment, the positioning accuracy of the anti-scatter grid 20 is only determined by the position of the second positioning pin 822 in the second positioning tool 82 and the machining accuracy of the second positioning hole 202 on the end block 32; the positioning accuracy of the detection unit 12 in the first reference plane 1111 depends on the profile degrees of the third positioning plane 803 and the eighth positioning plane 808. Therefore, the machining precision of the elements is controlled, so that the assembled CT detector module has extremely high optical path geometric precision.
The above embodiments are merely illustrative of the principles of the present invention and its effectiveness, and are not intended to limit the invention. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the invention. Accordingly, it is intended that all equivalent modifications and variations of the invention be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.
Claims (17)
1. A CT detector module comprising:
the carrier plate comprises a circuit board and a detection unit, wherein the detection unit is positioned in the middle of the surface of the circuit board, and first mounting holes are formed in two ends of the circuit board;
the anti-scattering grid is positioned above the carrier plate and is arranged opposite to the detection unit;
the main structural member comprises a bracket and two end blocks, wherein,
the two end blocks are positioned on the surface of the circuit board and are respectively connected with two ends of the anti-scattering grid, and the surface of each end block is provided with an installation positioning interface;
the support is positioned below the circuit board and comprises a top surface, a first side surface, a second side surface and a third side surface, the top surface is parallel to the circuit board, the first side surface is perpendicular to the top surface, the first side surface forms a concave part relative to the top surface, the second side surface is opposite to the first side surface, and the third side surface is connected with the first side surface and the second side surface;
and the signal processing plate is positioned on the first side surface and arranged in the concave part.
2. The CT detector module of claim 1, wherein the anti-scatter grid comprises a grid portion and two connection portions, the grid portion being disposed opposite the detection unit; the two connecting parts are respectively positioned at two opposite ends of the grid part and are respectively connected with the two end blocks.
3. The CT detector module of claim 2, further comprising a readout chip located on the bottom surface of the circuit board directly below the connection portion.
4. The CT detector module of claim 2, wherein the top surface comprises:
the first step surface is positioned in the middle of the top surface and is attached to the reading chip through a heat conducting medium;
the second step surfaces are positioned on two sides of the first step surface and are higher than the first step surface in height and used for placing the carrier plate, and second mounting holes are formed in the second step surface and are coaxial with the first mounting holes;
the third step surface is positioned on two sides of the second step surface, is higher than the second step surface in height and is used for placing the end block, and a third mounting hole is formed in the third step surface.
5. The CT detector module of claim 2, wherein a face of the signal processing board facing away from the first side has a plug connector; the signal processing chip is arranged on one surface of the signal processing plate, which is close to the first side surface, and is attached to the bracket through a heat conducting medium.
6. The CT detector module of claim 5, further comprising a signal transmission unit located directly below the connection portion, one end of which is embedded in the circuit board and the other end of which is inserted into the plug connector.
7. The CT detector module of claim 1, wherein the second side has a heat dissipating structure disposed thereon, the heat dissipating structure comprising a plurality of spaced apart heat dissipating fins.
8. The CT detector module of claim 1, wherein the first side and the second side form an included angle of between 1 ° and 7 °.
9. The CT detector module of claim 4, wherein the end block has a fourth mounting hole and a fifth mounting hole disposed thereon, wherein the fourth mounting hole is disposed coaxially with the third mounting hole.
10. The CT detector module of claim 9, wherein the connection portion is provided with a first positioning hole and a sixth mounting hole, the sixth mounting hole being coaxially disposed with the fifth mounting hole.
11. The CT detector module of claim 9, wherein the mounting location interface is located between the fourth mounting hole and the fifth mounting hole, including a seventh mounting hole and a second location hole.
12. A method of positioning and assembling a CT detector module, comprising the steps of:
s1: providing a detector module, wherein the detector module is a CT detector module as claimed in any one of claims 1 to 11, and a first reference surface, a second reference surface and a third reference surface are constructed in the detector module, wherein the first reference surface is a plane where the surface of the end block is located, the second reference surface is a plane formed by the axes of the second positioning holes, and the third reference surface is a plane where the third side surface is located;
s2: providing a detector subsystem, wherein the detector subsystem is provided with a plurality of installation bit groups which are arranged in parallel, a positioning structure matched with the installation positioning interface is arranged in the installation bit groups, so that the detector module is installed on the detector subsystem, when the detector module is installed on the detector subsystem, the bottom surface of the installation bit group is flush with the third side surface, the plane of the surface of the installation bit group is the first reference surface, the plane formed by the axes of the positioning structures is the second reference surface, and the plane of the bottom surface of the installation bit group is the third reference surface;
s3: placing the carrier plate on the second step surface, aligning the carrier plate with the bracket by using a first positioning tool, and then fixedly connecting the carrier plate with the bracket;
s4: providing a second positioning tool, wherein the second positioning tool is provided with a first positioning surface, a second positioning surface, a third positioning surface, two first positioning pins and two second positioning pins, the first positioning pins are positioned on the first positioning surface, the plane where the first positioning surface is positioned is the first reference surface, the plane formed by the axes of the two first positioning pins is the second reference surface, and the plane where the second positioning surface is positioned is the third reference surface;
s5: placing the two end blocks in the second positioning tool, enabling the surfaces of the end blocks to be attached to the first positioning surface, enabling the first positioning pins to pass through the second positioning holes, and enabling the side wall of one of the end blocks to be attached to the second positioning surface;
s6: placing the anti-scattering grid in the second positioning tool, enabling the second positioning pin to pass through the first positioning hole, and fixedly connecting the anti-scattering grid with the two end blocks;
s7: and (3) placing the bracket provided with the carrier plate and obtained in the step (S3) in a second positioning tool, enabling the bottom surface of the end block to be attached to the third step surface, attaching the side wall of the bracket to the second positioning surface, attaching the side edge of the detection unit to the third positioning surface, and fixedly connecting the bracket to the anti-scattering grid and the end block.
13. The method of positioning and assembling a CT detector module according to claim 12, wherein the first positioning fixture has a fourth positioning surface, a fifth positioning surface, a sixth positioning surface, a seventh positioning surface, and an eighth positioning surface.
14. The method of positioning and assembling a CT detector module according to claim 13, wherein step S3 comprises:
s31: the first positioning tool is buckled on the surface of the carrier plate, the fourth positioning surface is attached to the third step surface, the fifth positioning surface is attached to the second side surface, the sixth positioning surface is attached to the third side surface, and two adjacent side walls of the detection unit are attached to the seventh positioning surface and the eighth positioning surface respectively;
s32: and the carrier plate is fixedly connected with the bracket by penetrating the first mounting hole and the second mounting hole through the fastener.
15. The method of positioning and assembling a CT detector module according to claim 12, wherein in step S6, the anti-scatter grid is fixedly connected to the end-block by means of fasteners passing through the fifth mounting hole and the sixth mounting hole.
16. The method of positioning and assembling a CT detector module according to claim 12, wherein in step S7, the bracket is fixedly connected to the anti-scatter-grid and the end-block by means of fasteners passing through the third mounting hole and the fourth mounting hole.
17. The method of positioning and assembling a CT detector module according to claim 12, further comprising, after step S7: the signal processing board is mounted in the recess.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310855495.5A CN116849688A (en) | 2023-07-13 | 2023-07-13 | CT detector module and positioning and assembling method thereof |
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| CN202310855495.5A CN116849688A (en) | 2023-07-13 | 2023-07-13 | CT detector module and positioning and assembling method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117379071A (en) * | 2023-10-30 | 2024-01-12 | 赛诺威盛医疗科技(扬州)有限公司 | CT detector module support and ASG parallelism adjusting device and method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117379071A (en) * | 2023-10-30 | 2024-01-12 | 赛诺威盛医疗科技(扬州)有限公司 | CT detector module support and ASG parallelism adjusting device and method |
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