CN116847695A

CN116847695A - Display module assembly and electronic equipment

Info

Publication number: CN116847695A
Application number: CN202310762058.9A
Authority: CN
Inventors: 周清旭; 张书环; 刘欣; 田雨宸
Original assignee: Yungu Guan Technology Co Ltd
Current assignee: Yungu Guan Technology Co Ltd
Priority date: 2023-06-26
Filing date: 2023-06-26
Publication date: 2023-10-03

Abstract

The application provides a display module and electronic equipment, wherein the display module comprises a screen body, the screen body is provided with a display surface and a non-display surface which are arranged in a back-to-back mode, the non-display surface is provided with a plurality of bonding pads, the screen body comprises a plurality of wires, and the wires extend from the side edge of the screen body to the plurality of bonding pads to be electrically connected with the plurality of bonding pads. The bonding pads are arranged on the non-display surface, so that the frame of the screen body can be effectively reduced, the overall flatness of the display module is improved, and meanwhile, a plurality of wires are arranged to extend from the side edge of the screen body to the plurality of bonding pads to be electrically connected with the plurality of bonding pads, so that the uniformity and the reliability of wiring of the screen body are ensured.

Description

Display module assembly and electronic equipment

Technical Field

The application relates to the field of display, in particular to a display module and electronic equipment.

Background

In the prior art, the inventor finds through long-term research that part of the wiring of the display screen body extends from the frame area at the periphery of the display area to the terminal area at one side of the display screen and is electrically connected to an external circuit through a bonding pad at the terminal area, however, the arrangement of the terminal area obviously increases the display frame of the display screen, and influences the experience.

Disclosure of Invention

In view of this, the present application provides a display module and an electronic device, which can effectively reduce the size of the lower frame of the display module and ensure the uniformity of the screen wiring.

In order to solve the above problems, the present application provides a display module, comprising: the screen body is provided with a display surface and a non-display surface which are arranged in a back-to-back mode, the non-display surface is provided with a plurality of bonding pads, the screen body comprises a plurality of wires, and the wires extend from the side edge of the screen body to the plurality of bonding pads to be electrically connected with the plurality of bonding pads. The terminal area of the display module in the prior art can be canceled by the design, the frame of the screen body is reduced, and the flatness of the display module is improved.

The orthographic projections of the plurality of wires on the display surface are distributed on two sides of orthographic projections of the plurality of bonding pads on the display surface.

The plurality of wires comprise a plurality of first wires and a plurality of second wires, orthographic projections of the first wires on the display surface are located on first sides of orthographic projections of the plurality of bonding pads on the display surface, orthographic projections of the second wires on the display surface are located on second sides of orthographic projections of the plurality of bonding pads on the display surface, and the number of the first wires is equal to the number of the second wires. The design can lead the distribution of the wiring to be more uniform, and improve the problems of stress, signal interference, heat dissipation and the like caused by the transition concentration of the wiring.

The screen body comprises a display area, and the wiring comprises a plurality of sub-wiring sections which are electrically connected; the plurality of sub-line segments are all located in the display area. The design can further reduce the frame area of the screen body to approach to no frame.

The screen body further comprises a frame area surrounding the display area, and the plurality of sub-wiring sections are partially located in the display area and partially located in the frame area. Thus, the number of the through holes can be reduced, and the influence of punching is reduced.

Wherein, the display module assembly further includes: the support piece is arranged on one side of the non-display surface of the screen body, an opening is formed in the support piece, and the bonding pads are exposed in the opening. The support piece can increase the structural strength of the display module, and the opening is arranged to be favorable for bonding of the electronic element.

Wherein, the display module assembly further includes: the bonding piece is at least partially positioned in the opening and is electrically connected with the bonding pad. Preferably, the bonding element comprises a driving chip or a flexible circuit board. Preferably, the number of the bonding pieces is multiple, the bonding pieces include a driving chip and a flexible circuit board, and the driving chip and the flexible circuit board are respectively and independently electrically connected to the bonding pads. Preferably, the bonding member is electrically connected with the bonding pad in a manner including at least one of bonding connection, contact welding and laser welding of an anisotropic conductive film. Thus, the bonding piece is bonded to provide the functions of power supply, driving and the like for the screen body.

The bonding piece is a driving chip, and the driving chip is arranged in the opening and is electrically connected with the bonding pad. And/or, the bonding piece is a flexible circuit board, one end of the flexible circuit board is arranged in the open hole and is electrically connected with the bonding pad, and the other end of the flexible circuit board extends to the outside of the open hole, wherein the surface of the flexible circuit board is attached to the wall of the open hole. The design can play a role in protection, and meanwhile, the reliability of the display module is improved.

Wherein, the display module assembly further includes: and the adhesive layer is at least filled in the opening and covers the bonding piece in the opening. The glue film can promote the intensity of trompil to prevent steam and impurity invasion.

Preferably, the material of the glue layer comprises at least one of shadowless glue, silicone glue, polyurethane glue and epoxy glue.

Preferably, the surface of the adhesive layer facing away from the screen body is flush with the surface of the support piece facing away from the screen body. Thus, the supporting force of the screen body can be more uniform.

Wherein the support comprises: the support film is arranged on one side of the non-display surface of the screen body; the composite adhesive tape is arranged on one side of the support film, which is away from the screen body, and is bonded with the support film. This provides better protection to the screen.

Wherein, the display module assembly further includes: the polaroid is arranged on one side of the display surface of the screen body; and the cover plate is arranged on one side of the polaroid, which is away from the screen body.

Preferably, the display module is an OLED display module.

The application also provides electronic equipment comprising the display module of any embodiment. The effect achieved by the display module is as described in any one of the above embodiments, and will not be described herein.

The beneficial effects are that: compared with the prior art, the application has the advantages that the plurality of bonding pads are arranged on the back surface of the display screen, the terminal area is not required to be arranged, the size of the lower frame is effectively reduced, the orthographic projections of the plurality of wires on the display surface are arranged on the two sides of the orthographic projections of the plurality of bonding pads on the display surface, the wires on the sides can be dispersed, the uniformity of the wiring of the screen body is ensured, meanwhile, the support piece is further arranged, the support piece is provided with the opening, the driving chip and/or the flexible circuit board are arranged in the opening, compared with the prior art, the support of the driving chip is not required to be specially designed to protect the driving chip, the cost is reduced, the occupation of space is reduced, the bonding piece is arranged in the opening and has the effect of protecting the bonding piece, meanwhile, the opening is filled with glue, the invasion of water vapor, sweat, other impurities and the like can be prevented, the reliability of the display module is improved, the flatness of the back surface is ensured, the display module is applied to the display terminal, no local bulge exists, the display terminal is not required to be avoided in the design, and the size of the display terminal is favorable for reducing the display terminal.

The foregoing description is only an overview of the present application, and is intended to be implemented in accordance with the teachings of the present application in order that the same may be more clearly understood and to make the same and other objects, features and advantages of the present application more readily apparent.

Drawings

Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the application. Also, like reference numerals are used to designate like parts throughout the accompanying drawings. In the drawings:

FIG. 1 is a schematic diagram of a display module according to the present application;

fig. 2 is a schematic top view of a first application scenario of the display module of fig. 1;

FIG. 3 is a schematic top view of a second application scenario of the display module of FIG. 1;

fig. 4 is a schematic top view of a third application scenario of the display module of the present application;

FIG. 5 is a schematic cross-sectional view of FIG. 4 taken along the aperture;

fig. 6 is a schematic top view of a fourth application scenario of the display module of the present application;

FIG. 7 is a schematic cross-sectional view of FIG. 6 taken along the opening;

FIG. 8 is a schematic diagram of a cross-sectional structure of a fifth application scenario of the present application;

FIG. 9 is a schematic diagram of a cross-sectional structure of a sixth application scenario of the present application;

fig. 10 is a schematic diagram of a cross-sectional structure of a seventh application scenario of the present application;

FIG. 11 is a schematic view of an eighth application scenario of the present application;

fig. 12 is a schematic structural diagram of an embodiment of the electronic device of the present application.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

Referring to fig. 1 and 2, in an embodiment of the application, a display module 10 includes a panel 100, the panel 100 is provided with a display surface a and a non-display surface B disposed opposite to each other, the non-display surface B is provided with a plurality of pads 102, the panel 100 includes a plurality of wires 104, and the plurality of wires 104 extend from a side 100a of the panel 100 to the plurality of pads 102 to be electrically connected with the plurality of pads 102.

Specifically, the screen body 100 generally includes a substrate, a driving circuit layer, a light emitting layer, a packaging layer, a touch layer, and other film layers. The light emitting layer includes a plurality of pixel units, and the pixel units are used for light emitting display, and the pixel units can be red sub-pixel units, green sub-pixel units, blue sub-pixel units, or the like. In the present application, the display surface a of the screen body 100 is a surface of the screen body 100 emitting light, and the light emitted by the pixel unit is emitted through the display surface a, and the non-display surface B is opposite to the display surface a. Meanwhile, the display surface a of the screen body 100 is an area for displaying a picture, and the pixel units are located on the display surface a. The non-display surface B is provided with a plurality of pads 102, and specifically, the plurality of pads 102 may be formed by a laser lift-off process or a photolithography process during the preparation process, where the plurality of pads 102 are electrically connected to the plurality of traces 104. The plurality of pads 102 may be used to bond various electronic components, such as chips or flexible circuit boards.

In the prior art, in order to bond an electronic component to the panel 100, a terminal area is generally disposed at the lower side of the panel 100, a bonding pad 102 is formed at the terminal area, and the terminal area is bent, so that the bonding pad 102 and the electronic component bonded to the bonding pad 102 are bent to the back surface of the panel 100. The terminal area is easy to crack and break in the bending process, so that the product yield is reduced, and the existence of the terminal area also causes the lower frame of the screen body 100 to be larger in size and thicker in overall size.

However, as can be seen from the above description, the bonding pads 102 are bonded on the non-display surface B, so that the electronic component can be directly bonded on the non-display surface B without setting any terminal area, thereby effectively reducing the frame of the screen body 100 and improving the flatness of the display module assembly 10.

With continued reference to fig. 2, the plurality of traces 104 extend from the same side 100a of the panel 100 to the plurality of pads 102 and are electrically connected to the plurality of pads 102. Meanwhile, the orthographic projection of the plurality of wires 104 on the display surface a is distributed on two sides of the orthographic projection of the plurality of bonding pads 102 on the display surface a, namely, the plurality of wires 104 are distributed on two sides relative to the plurality of bonding pads 102, and compared with the arrangement of the plurality of wires 104 on one side of the plurality of bonding pads 102, the application can reduce wiring pressure and ensure the uniformity of the wiring of the screen 100.

The plurality of pads 102 may be disposed in the middle or near-middle area of the non-display surface B, so that the plurality of pads 102 may be kept as close to the trace 104 as possible, so that the distance between the trace 104 may be reduced, the resistance of the trace 104 may be reduced, and the problem of IR Drop may be improved. In addition, the bonding pads 102 are positioned in the middle or near-middle area of the non-display surface B, so that the number of wires on two sides of the bonding pads tends to be equal, and the uniformity of the wires is further improved.

Referring to fig. 2, the plurality of traces 104 includes a plurality of first traces 1041 and a plurality of second traces 1042, wherein orthographic projections of the first traces 1041 on the display surface a are located on a first side of orthographic projections of the plurality of pads 102 on the display surface a, orthographic projections of the second traces 1042 on the display surface a are located on a second side of orthographic projections of the plurality of pads 102 on the display surface a, and the number of the first traces 1041 is equal to the number of the second traces 1042.

Specifically, the number of the first traces 1041 and the number of the second traces 1042 are set to be equal, that is, the number of the traces 104 distributed on both sides of the plurality of pads 102 is equal.

By the design, the distribution of the wires 104 on the screen body 100 is relatively uniform, the stress of the film layer is also relatively uniform, and the problems of stress, signal interference, heat dissipation and the like caused by the transition concentration of the wires 104 are solved.

Of course, in some other embodiments, the number of traces 104 distributed on both sides of the plurality of pads 102 may be unequal, so long as it is ensured that the traces 104 are distributed on both sides of the plurality of pads 102.

Referring to fig. 2, the screen body 100 includes a display area D, and the trace 104 includes a plurality of sub-trace segments 1043 electrically connected to each other; the plurality of sub-track segments 1043 are all located in the display area D.

Specifically, the plurality of sub-line segments 1043 are all disposed in the display area D, so that the frame area of the screen body 100 can be significantly reduced, and the approach to no frame is achieved.

The panel 100 generally includes a plurality of stacked layers, the plurality of sub-trace segments 1043 included in the trace 104 may be formed in different layers, and the plurality of sub-trace segments 1043 formed in different layers may be electrically connected through vias on the layers.

Referring to fig. 3, in another embodiment, the screen body 100 further includes a frame area E surrounding the display area D, and the plurality of sub-line segments 1043 are partially located in the display area D and partially located in the frame area E.

Specifically, the frame area E is disposed around the display area D, where the frame area E has no display function, and is generally used for arranging wiring and packaging structures. Compared with fig. 2, in fig. 3, a plurality of sub-line segments 1043 included in the line 104 are partially disposed in the display area D and partially disposed in the frame area E, and the via holes connecting the two sub-line segments 1043 can be disposed in the frame area E, that is, compared with fig. 2, the manner of fig. 3 can reduce the number of via holes disposed in the display area D, thereby reducing the adverse effect of punching in the display area D.

Referring to fig. 4 and 5, the display module 10 further includes a supporting member 200, where the supporting member 200 is disposed on the non-display surface B side of the screen body 100, and has an opening 202, and the plurality of pads 102 are disposed in the opening 202 in an exposed manner.

Specifically, the supporting member 200 is mainly used for supporting the screen body 100 to strengthen the structural strength of the display module 10, wherein the supporting member 200 is provided with an opening 202 and exposes the plurality of bonding pads 102, so that the electronic component can be bonded on the exposed plurality of bonding pads 102. Wherein the size of the openings 202 is related to the size and number of the plurality of pads 102.

The number of the openings 202 may be one or more, and when the number of the openings 202 is one, all the pads 102 are exposed in the openings 202.

Referring to fig. 6, the display module 10 further includes a bonding member 300, where the bonding member 300 is at least partially located in the opening 202 and is electrically connected to the bonding pad 102.

Specifically, bonding element 300 may be located entirely within aperture 202, or may be located partially within aperture 202 and partially outside of aperture 202. In addition, bonding element 300 is electrically connected to bonding pad 102 for power supply, driving, etc. of panel 100.

The number of bonding members 300 may be one or more. When the number of bonding members 300 is one, the bonding members 300 may be driving chips 302 or flexible circuit boards 304. When the number of bonding members 300 is plural, the plurality of bonding members 300 may include both the driver chip 302 and the flexible circuit board 304. And when the number of the plurality of bonding pieces 300 is plural, the plurality of bonding pieces 300 are electrically connected to the bonding pads 102 independently.

In other embodiments, the driver chip 302 may be electrically connected to the flexible circuit board 304, and then the flexible circuit board 304 may be electrically connected to the plurality of pads 102, such that the aperture 202 may be reduced.

The bonding element 300 is electrically connected to the bonding pad 102 by at least one of anisotropic conductive film bonding, contact welding, and laser welding. Specifically, the bonding connection of the anisotropic conductive film is that a layer of anisotropic conductive adhesive is added between the bonding pad 102 and the bonding piece 300, and the bonding pad 102 and the bonding piece 300 are fixedly connected together through the anisotropic conductive adhesive; the contact welding is to electrically connect the bonding pad 102 and the bonding member 300 by resistance heating or the like; laser welding is the application of heat energy to bond pad 102 and bonding element 300 by a laser, such that bond pad 102 and bonding element 300 are welded together. In summary, the present application is not limited to the electrical connection between bonding element 300 and bonding pad 102.

Referring to fig. 6, bonding element 300 includes a driver chip 302, and driver chip 302 is disposed in opening 202 and electrically connected to bonding pad 102.

Specifically, the driving chip 302 is disposed in the opening 202, which can protect the driving chip 302.

Referring to fig. 7, the bonding member 300 includes a flexible circuit board 304, one end 304a of the flexible circuit board 304 is disposed in the opening 202 and electrically connected to the bonding pad 102, and the other end 304b extends to the outside of the opening 202, wherein a surface of the flexible circuit board 304 is adhered to a wall of the opening 202.

Specifically, the size of the flexible circuit board 304 is generally large, and one function of the flexible circuit board 304 is to be electrically connected to an external device, so that one end 304a of the flexible circuit board 304 is disposed in the opening 202 to be electrically connected to the pad 102, and the other end 304b extends to the outside of the opening 202 to be electrically connected to the external device. In addition, the surface of the flexible circuit board 304 is attached to the wall of the opening 202, so that the structures are more compact, and the reliability of the electrical connection part of the flexible circuit board 304 is improved.

Referring to fig. 8, the display module 10 further includes a glue layer 400, and the glue layer 400 at least fills the opening 202 and covers the bonding member 300 located in the opening 202.

Specifically, glue layer 400 fills at least in opening 202, covering bonding element 300 located in opening 202. On the one hand, this can fill the openings 202 provided in the support 200, so as to strengthen the strength of the support 200 and the openings 202; on the other hand, the adhesive layer 400 can protect the bonding member 300, prevent moisture and impurities from entering, affect the performance of the bonding member 300 and the panel 100, and save the cost of protecting the bonding member 300 (in the prior art, the bonding member 300 disposed in the terminal area generally needs to be added with a protecting bracket to protect the bonding member 300).

Of course, in some other embodiments, glue layer 400 may be disposed outside of aperture 202, covering the portion of bonding element 300 outside of aperture 202, which may protect bonding element 300 outside of aperture 202.

Wherein, the material of the glue layer 400 includes at least one of shadowless glue, silicone glue, polyurethane glue and epoxy glue.

Specifically, the above-exemplified materials may be cured by light, room temperature, heat, etc., which facilitates control of the filling effect of the glue layer.

In an application scenario, please refer to fig. 9, the surface 400a of the adhesive layer 400 facing away from the screen body 100 is flush with the surface 200a of the support 200 facing away from the screen body 100.

Specifically, the design that the surface 400a of the adhesive layer 400 is flush with the surface 200a of the support member 200 may make the entire surface more flat, so that the adhesive layer 400 and the support member 200 exert more uniform force when supporting the screen body 100.

Referring to fig. 10, the support 200 includes a support film 210 and a composite adhesive tape 220; the support film 210 is disposed on the non-display surface B side of the screen body 100; the composite tape 220 is disposed on a side of the support film 210 facing away from the screen body 100 and is bonded to the support film 210.

Specifically, the support film 210 is mainly used for supporting the screen body 100 and buffering external force, and the composite adhesive tape 220 is mainly used for radiating heat, electromagnetic shielding, buffering external force and preventing light leakage of the screen body 100, so that the screen body 100 can be better protected by the design.

Referring to fig. 11, the display module 10 further includes a polarizer 500 and a cover 600; the polarizer 500 is disposed on the display surface a side of the screen body 100; the cover plate 600 is disposed on a side of the polarizer facing away from the panel 100.

Specifically, the polarizer 500 is mainly used for filtering external light, improving the contrast of the light emitted by the panel 100, and the cover 600 is mainly used for protecting the display surface a of the panel 100.

In an application scenario, the display module 10 is an OLED (Organic Light-Emitting Diode) display module. Of course, the display module 10 may also be an LCD (Liquid Crystal Display ) display module, a Micro LED (Micro Light Emitting Diode ) display module, or the like.

Referring to fig. 12, the present application further provides an electronic device 900, where the electronic device 900 includes a display module 910, and the display module 910 has the same structure as the display module 10 in any of the foregoing embodiments, and the detailed structure can be referred to the foregoing embodiments and will not be repeated herein.

Specifically, the electronic device 900 may be any electronic device such as a notebook, a desktop, a tablet, a mobile phone, a smart watch, a virtual display terminal, and the like, which is not limited herein.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and not for limiting the same; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the application, and are intended to be included within the scope of the appended claims and description. In particular, the technical features mentioned in the respective embodiments may be combined in any manner as long as there is no structural conflict. The present application is not limited to the specific embodiments disclosed herein, but encompasses all technical solutions falling within the scope of the claims.

Claims

1. A display module, comprising:

the screen body is provided with a display surface and a non-display surface which are arranged in a back-to-back mode, the non-display surface is provided with a plurality of bonding pads, the screen body comprises a plurality of wires, and the wires extend from the side edge of the screen body to the plurality of bonding pads to be electrically connected with the plurality of bonding pads.

2. The display module assembly of claim 1, wherein the display module assembly comprises,

orthographic projections of the plurality of wires on the display surface are distributed on two sides of orthographic projections of the plurality of bonding pads on the display surface;

preferably, the plurality of wires includes a plurality of first wires and a plurality of second wires, orthographic projections of the first wires on the display surface are located on a first side of orthographic projections of the plurality of bonding pads on the display surface, orthographic projections of the second wires on the display surface are located on a second side of orthographic projections of the plurality of bonding pads on the display surface, wherein the number of the first wires is equal to the number of the second wires.

3. The display module of claim 1, wherein the screen includes a display area, and the trace includes a plurality of sub-trace segments electrically connected;

the plurality of sub-line segments are all located in the display area, or the screen body further comprises a frame area surrounding the display area, and the plurality of sub-line segments are partially located in the display area and partially located in the frame area.

4. The display module of claim 1, wherein the display module further comprises:

the support piece is arranged on one side of the non-display surface of the screen body, an opening is formed in the support piece, and the bonding pads are exposed in the opening.

5. The display module of claim 4, wherein the display module further comprises:

the bonding piece is at least partially positioned in the opening and is electrically connected with the bonding pad;

preferably, the bonding piece comprises a driving chip or a flexible circuit board;

preferably, the number of the bonding pieces is multiple, the plurality of bonding pieces comprise a driving chip and a flexible circuit board, and the driving chip and the flexible circuit board are respectively and independently electrically connected to the bonding pads;

preferably, the bonding member is electrically connected with the bonding pad in a manner including at least one of bonding connection, contact welding and laser welding of an anisotropic conductive film.

6. The display module of claim 5, wherein the bonding member is a driver chip disposed in the opening and electrically connected to the bonding pad;

and/or, the bonding piece is a flexible circuit board, one end of the flexible circuit board is arranged in the open hole and is electrically connected with the bonding pad, and the other end of the flexible circuit board extends to the outside of the open hole, wherein the surface of the flexible circuit board is attached to the wall of the open hole.

7. The display module of claim 5, wherein the display module further comprises:

a glue layer at least filled in the opening and covering the bonding piece in the opening;

preferably, the material of the glue layer comprises at least one of shadowless glue, silicone glue, polyurethane glue and epoxy glue;

preferably, the surface of the adhesive layer facing away from the screen body is flush with the surface of the support piece facing away from the screen body.

8. The display module of claim 4, wherein the support comprises:

the support film is arranged on one side of the non-display surface of the screen body;

the composite adhesive tape is arranged on one side of the support film, which is away from the screen body, and is bonded with the support film.

9. The display module of claim 1, wherein the display module further comprises:

the polaroid is arranged on one side of the display surface of the screen body;

the cover plate is arranged on one side of the polaroid, which is away from the screen body;

preferably, the display module is an OLED display module.

10. An electronic device comprising a display module according to any one of claims 1-9.