CN116832741A - Photo reactor - Google Patents
Photo reactor Download PDFInfo
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- CN116832741A CN116832741A CN202310725881.2A CN202310725881A CN116832741A CN 116832741 A CN116832741 A CN 116832741A CN 202310725881 A CN202310725881 A CN 202310725881A CN 116832741 A CN116832741 A CN 116832741A
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- pcb
- photoreactor
- lamp bead
- temperature control
- heat dissipation
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- 238000005286 illumination Methods 0.000 claims abstract description 32
- 238000001816 cooling Methods 0.000 claims abstract description 18
- 239000011324 bead Substances 0.000 claims description 41
- 239000011521 glass Substances 0.000 claims description 37
- 230000017525 heat dissipation Effects 0.000 claims description 24
- 239000013307 optical fiber Substances 0.000 claims description 17
- 239000000835 fiber Substances 0.000 claims description 11
- 239000003638 chemical reducing agent Substances 0.000 claims description 4
- 238000004378 air conditioning Methods 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 abstract description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 8
- 230000010354 integration Effects 0.000 abstract description 4
- 239000007788 liquid Substances 0.000 abstract description 4
- 239000002699 waste material Substances 0.000 abstract description 4
- 230000000694 effects Effects 0.000 description 49
- MTLMVEWEYZFYTH-UHFFFAOYSA-N 1,3,5-trichloro-2-phenylbenzene Chemical compound ClC1=CC(Cl)=CC(Cl)=C1C1=CC=CC=C1 MTLMVEWEYZFYTH-UHFFFAOYSA-N 0.000 description 21
- 230000005855 radiation Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 5
- 230000000670 limiting effect Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 2
- 239000012295 chemical reaction liquid Substances 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000013032 photocatalytic reaction Methods 0.000 description 2
- 238000006552 photochemical reaction Methods 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000007036 catalytic synthesis reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000001012 protector Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J19/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
- B01J19/12—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electromagnetic waves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J19/0053—Details of the reactor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
- B01J2219/0873—Materials to be treated
- B01J2219/0892—Materials to be treated involving catalytically active material
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Abstract
The application discloses a photoreactor, and relates to the technical field of photochemistry. Wherein, this photoreactor includes: a housing; the hollow cavity is arranged on the shell; the PCB is arranged in the hollow cavity; the temperature control component is arranged in the hollow cavity and is positioned below the PCB; the illumination assembly is connected with the bottom of the shell along a first direction; wherein, the PCB board with the control by temperature change part integration set up in the cavity of casing, just the illumination subassembly integration set up in the casing bottom to make the integrated setting of photoreactor. The application solves the problems that the existing photoreaction generators are large in occupied area, heavy and difficult to move, water cooling or oil cooling is usually needed, so that not only is the waste of water or oil resources caused, but also the leakage of the liquids can cause pollution, and various potential safety hazards are increased; correspondingly, the cost of the reaction equipment is high, and the problem of popular use is difficult to meet.
Description
Technical Field
The application relates to the technical field of photochemistry, in particular to a photoreactor.
Background
The photoreaction is a reaction under the illumination condition, and compared with the traditional thermal reaction, the photochemical reaction is environment-friendly and pollution-free, and becomes a hot spot for the study of chemists in recent decades. Visible light catalytic systems have been successfully applied to the synthesis of a variety of complex and functional compounds, exhibiting excellent catalytic synthesis values and industrial application potential.
Most of the existing photoreaction generators occupy large area, are heavy and difficult to move, and generally need water cooling or oil cooling, so that not only is the waste of water or oil resources caused, but also pollution is caused by leakage of the liquids, and various potential safety hazards are increased; correspondingly, the cost of the reaction equipment is high, and the problem of popular use is difficult to meet. In view of the above-mentioned problems, no effective solution has been proposed yet.
Disclosure of Invention
The application aims to: a photoreactor is provided to solve the above-mentioned problems of the prior art.
The technical scheme is as follows: a photoreactor comprising: a housing; the hollow cavity is arranged on the shell; the PCB is arranged in the hollow cavity; the temperature control component is arranged in the hollow cavity and is positioned below the PCB; the illumination assembly is connected with the bottom of the shell along a first direction; wherein, the PCB board with the control by temperature change part integration set up in the cavity of casing, just the illumination subassembly integration set up in the casing bottom to make the integrated setting of photoreactor.
Preferably, the PCB board is electrically connected to the temperature control component and the illumination component respectively; and the temperature control component and the illumination component are respectively controlled to act by sending out control signals through the PCB.
Preferably, the illumination assembly adopts a light source interpolation structure so that the light source emits from inside to outside.
Preferably, the illumination assembly comprises: the lamp bead base is connected with the bottom of the shell, the lamp beads are arranged in the center of the lamp bead base along the first direction, the lamp beads are connected with the optical fiber bundles along the first direction, glass tubes are arranged at intervals on the peripheries of the optical fiber bundles, and the glass tubes are connected with the lamp bead base.
Preferably, the glass tube includes: the bottom of the first glass tube is connected with a glass reducing tube close to one side of the lamp bead base, and the bottom of the glass reducing tube is connected with a second glass tube.
Preferably, an optical fiber bundle base is arranged at the bottom of the lamp bead base, and the optical fiber bundle base is positioned among the first glass tube, the glass reducer and the optical fiber bundle.
Preferably, the temperature control component is a cooling fan, the cooling fan is adjacently arranged below the PCB, and the cooling fan and the PCB are connected with the top of the housing through a plurality of connectors arranged along the first direction.
Preferably, the temperature control component is a radiating fin, the radiating fin is adjacently arranged below the radiating fan, the connecting piece at least partially stretches into the radiating fin, and the bottom of the radiating fin is connected with the bottom of the shell through the locking piece.
Preferably, one side of the lamp bead base is perpendicular to the first direction, and at least one threaded hole is formed in the lamp bead base.
Preferably, the bottom of the shell is connected with the lamp bead base through a fastener.
Preferably, the shell is provided with a plurality of radiating holes, one side of the shell, which is far away from the radiating holes, is provided with a jack, and the jack is positioned between the PCB and the temperature control component.
The beneficial effects are that: in the embodiment of the application, the integrated arrangement mode is adopted, the PCB and the temperature control component are integrated and arranged in the hollow cavity of the shell, and the illumination component is integrated and arranged at the bottom of the shell, so that the integrated arrangement of the photoreactors is realized, the purposes of reducing the volume, saving the resources, improving the safety coefficient and reducing the cost are achieved, the technical effect suitable for multiphase photocatalytic reaction is realized, the problems that most of the existing photoreaction generators occupy large area, are heavy and difficult to move, and generally need water cooling or oil cooling, not only waste of water or oil resources is caused, but also leakage of the liquids causes pollution, and various potential safety hazards are increased; correspondingly, the cost of the reaction equipment is high, and the technical problem of popular use is difficult to be satisfied.
Drawings
FIG. 1 is a schematic perspective view of a photoreactor according to the present application;
FIG. 2 is a schematic view showing another perspective structure of the photoreactor of the present application;
FIG. 3 is a schematic view showing still another perspective structure of the photoreactor of the present application;
FIG. 4 is a schematic view showing the internal three-dimensional structure of a hollow chamber of the photoreactor of the present application;
FIG. 5 is a schematic view showing a perspective structure of an illumination assembly of the photoreactor of the present application;
FIG. 6 is a partial cross-sectional view of a photoreactor of the present application.
The reference numerals are: 10. a housing; 20. a hollow chamber; 30. a PCB board; 40. a temperature control component; 401. a heat radiation fan; 402. a connecting piece; 403. a heat radiation fin; 404. a locking member; 50. an illumination assembly; 501. a lamp bead base; 502. a lamp bead; 503. an optical fiber bundle; 504. a glass tube; 5041. a first glass tube; 5042. a glass reducer; 5043. a second glass tube; 505. a fiber optic bundle base; 506. a threaded hole; 507. a fastener; 60. a heat radiation hole; 70. and a jack.
Detailed Description
In order that those skilled in the art will better understand the present application, a technical solution in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present application without making any inventive effort, shall fall within the scope of the present application.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present application and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate in order to describe the embodiments of the application herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Furthermore, the terms "mounted," "configured," "provided," "connected," "coupled," and "sleeved" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; may be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements, or components. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other. The application will be described in detail below with reference to the drawings in connection with embodiments.
As shown in fig. 1-3 and 6, the present application relates to a photoreactor. The photoreactor comprises: a housing 10; the case 10 is a case-like protector, and can achieve a good protection and support effect. Preferably, the housing 10 is rectangular in shape, and provides sufficient longitudinal space to achieve the effects of multiple component mounting and accommodation. Of course, other shapes can be adopted according to the use requirement, and the application is not limited in the application. Further, a detachable upper cover is arranged at the top of the shell 10; the upper cover is detachably connected with the top of the housing 10 by means including but not limited to bolts or screws, so that the effect of easily opening or closing the space of the housing 10 can be achieved, the effect of easily installing other components inside the housing 10 can be achieved, and a good component matching effect can be achieved. Further, the upper cover is clamped with the shell 10; the effect of easy dismouting can be realized.
A hollow chamber 20 provided in the housing 10; by providing the hollow chamber 20 inside the housing 10, a sufficient accommodation space can be provided, thereby achieving the effect of facilitating installation and accommodating other components.
The PCB 30 is arranged in the hollow cavity 20; the PCB 30 is a printed circuit board, also called a printed circuit board, which is an important electronic component, is a support for electronic components, and is a carrier for electrically connecting the electronic components to each other; good accommodating and fixing effects of the PCB board 30 can be achieved. Preferably, the PCB board 30 is disposed on top of the hollow chamber 20; by installing the PCB 30 at the position of the hollow cavity 20 close to the top of the shell 10, the effect of distinguishing the PCB from other positions can be achieved, so that the condition that other components influence the normal operation or running of the PCB 30 is avoided; meanwhile, the high-temperature-resistant PCB board can be placed at the top, good heat dissipation effect can be achieved, and the precise components are sensitive to temperature, so that the influence of the temperature on the PCB board 30 is avoided. Further, a plurality of connecting pieces 402 are respectively arranged around the inner wall of the top of the shell 10, and the connecting pieces 402 respectively penetrate through the PCB 30; the degree of freedom of the PCB 30 in the left-right direction can be restrained, so that the effect of preliminary fixing the PCB 30 is achieved; preferably, the number of connectors 402 is four; a good fixing effect of the PCB board 30 can be ensured. Further, the PCB 30 is screwed with the stud on the inner wall of the casing 10 by a screw; through locking and fixing the PCB 30 from bottom to top, the effect of completely limiting the degree of freedom of the PCB 30 can be ensured, and therefore, the abnormal conditions such as displacement or movement of the PCB 30 in the using process can be avoided. Because the parallel light reactor can only realize room temperature reaction, low temperature reaction can not be performed, the application adopts the PCB 30 for control, can solve the problem that many chiral controlled reactions need low temperature control, the PCB 30 can realize high-precision temperature control effect, and comprises: room temperature to low temperature (minus 78 degrees).
The temperature control component 40 is arranged in the hollow cavity 20 and is positioned below the PCB 30; good radiating effect can be realized, thereby avoiding the situation that the service effect and the service life are influenced due to the too high temperature of the lamp beads 502. Since some photochemical reactions are severely affected by temperature, for example, some reactions are thermally accelerated photoreaction, some reactions are thermally suppressed photoreaction, and temperature control is more and more important, particularly in photoreaction with controlled chirality, it is required that the reaction is controlled at an extremely low temperature, and the chirality cannot be controlled at room temperature. Therefore, the temperature control type photoreaction is important, so the temperature control component 40 in the application can solve the problems that the existing air cooling is limited in temperature control capability and the service life of the LED lamp cannot be ensured. The temperature control part 40 reduces the temperature through the pure copper radiating fins and the fan, and the external switch for adjusting the rotating speed of the fan blade can effectively adjust and reduce the temperature of the lamp beads 502, so that the LED lamp beads 502 can work normally, and the hidden danger of a laboratory is avoided.
The illumination assembly 50 is connected with the bottom of the housing 10 along the first direction; the light source can provide good light source supply effect, and meanwhile, the light source is built-in, so that the light reaction can be carried out in the light reactor, and the efficiency of the light reaction can be improved. The first direction refers to a long-side extending direction of the housing 10, i.e., a Z-axis direction in a three-coordinate system. The illumination assembly 50 is arranged in the application, so that the problems of low light transmittance and poor light condensation of the traditional pipeline can be solved; poor light shielding and hurting eyes of experimenters.
The PCB board 30 and the temperature control component 40 are integrally disposed in the hollow chamber 20 of the housing 10, and the illumination assembly 50 is integrally disposed at the bottom of the housing 10, so that the photo-reactor is integrally disposed. By integrally mounting the PCB board 30 and the temperature control member 40 in the hollow chamber 20 of the housing 10, space utilization can be improved while an effect of integrating a plurality of members can be achieved; and the illumination assembly 50 is arranged at the bottom of the shell 10, so that the complete photoreactor can be integrally arranged on the shell 10, and the portable, small, exquisite, safe, clean and tidy structure is realized; meanwhile, the light source is built in, namely, an interpolation type mode is adopted, so that the utilization rate of the LED light source is improved, light is prevented from escaping, and the body of an experimenter is damaged. The problem that the existing instrument occupies a large area and is not beneficial to position transfer and carrying can be solved; and the instrument and the equipment are complex, which is not beneficial to maintenance or replacement of light sources with different wavelengths. The optical reactor is convenient to use, simple to operate and free to move due to the integrated arrangement.
From the above description, it can be seen that the following technical effects are achieved:
in the embodiment of the application, the integrated arrangement mode is adopted, the PCB 30 and the temperature control component 40 are integrated and arranged in the hollow cavity 20 of the shell 10, and the illumination component 50 is integrated and arranged at the bottom of the shell 10, so that the integrated arrangement of the photo-reactor achieves the purposes of reducing the volume, saving the resources, improving the safety coefficient and reducing the cost, thereby realizing the technical effect suitable for multi-phase photo-catalytic reaction, further solving the problems that the existing photo-reactor has large occupied area, is heavy and difficult to move, and usually needs water cooling or oil cooling, not only causes the waste of water or oil resources, but also causes pollution due to leakage of the liquid, and increases various potential safety hazards; correspondingly, the cost of the reaction equipment is high, and the technical problem of popular use is difficult to be satisfied.
Further, the PCB board 30 is electrically connected to the temperature control component 40 and the illumination component 50 respectively; control signals are sent out through the PCB 30 to respectively control the actions of the temperature control component 40 and the illumination component 50; the temperature control component 40 and the illumination component 50 are electrically connected through the PCB 30, so that a good electrical control effect can be achieved, and accordingly, a control signal can be sent out through the PCB to control the temperature control component 40 and the illumination component 50 to act, namely heat dissipation or illumination is conducted. Such as: the temperature sensor is arranged at the appointed position of the photo-reactor, wherein the temperature sensor can be an infrared sensor or a temperature sensing probe, and the specific model can be used according to the use requirement; the temperature sensor feeds back the real-time temperature signal detected to the PCB 30, and the PCB 30 sends out a control signal according to the temperature signal and adjusts the temperature according to the current temperature condition, so that the accurate temperature control effect is ensured, and the accurate completion experiment of the photoreactor is further ensured.
As shown in fig. 5, the illumination assembly 50 adopts a light source interpolation structure so that the light source emits from inside to outside; by adopting the light source interpolation structure, the light source can be led into the glass tube 504 from the light emitting part, and the reaction liquid can be irradiated from inside to outside; compared with an external light source, the light source utilization rate of the internal light is high. The interpolation type illumination assembly 50 in the application can solve the defect that the light source of the photo-reactor is outside, so that the utilization rate of the light source is low, and a certain distance exists between the light source and the reaction liquid, thereby influencing the reaction effect. Meanwhile, a single-layer light source design adopts a light source built-in strategy, light is guided into the interior by utilizing a light guide fiber bundle, a customized high-wattage single-wavelength LED lamp bead 502 is welded above the light guide bundle, a power supply is externally connected, and the convenient adjustment of different light reaction powers can be realized by adjusting the voltage or the current of the power supply. The light guide fiber bundle has high light guide rate, and has the advantages of low cost, less breakage and the like compared with a quartz light guide rod.
Further, the illumination assembly 50 includes: the lamp bead base 501 is connected with the bottom of the shell 10, the lamp bead 502 is arranged at the center of the lamp bead base 501 along the first direction, the lamp bead 502 is connected with the optical fiber bundle 503 along the first direction, the periphery of the optical fiber bundle 503 is provided with glass tubes 504 at intervals, and the glass tubes 504 are connected with the lamp bead base 501; through being provided with lamp pearl base 501 in the detachable of casing 10 bottom, can realize good lamp pearl base 501 fixed and installation effect to provide good basis for installing other parts. By providing the lamp beads 502 at the center of the top of the lamp bead base 501, an effect of stabilizing the light source can be generated; meanwhile, the lamp beads 502 are connected with the optical fiber bundles 503, so that a good longitudinal conduction effect of the light source can be realized, and a sufficient photoreaction effect is realized; preferably, the light bulb 502 is an LED light bulb. The optical fiber bundle 503 is an aggregate composed of a plurality of minute optical fibers, and typically contains hundreds or thousands of optical fibers having a diameter of several micrometers, and can transmit an optical signal from one port to another, thereby achieving a good optical signal transmission effect. And use of custom fiber bundles 503 with high light guide, use of fiber bundles 503, low cost, and low friability.
As shown in fig. 1, the glass tube 504 includes: the bottom of the first glass tube 5041 is connected with a glass reducing tube 5042 near one side of the lamp bead base 501, and the bottom of the glass reducing tube 5042 is connected with a second glass tube 5043; good protection effect on the optical fiber bundle 503 can be realized, and meanwhile, good photoreaction effect can be ensured; wherein, use glass reducing pipe 5042 to link to each other between first glass pipe 5041 and second glass pipe 5043, can realize reducing the effect that glass pipe 504 occupies the volume, simultaneously, can also realize good cooperation effect with other parts.
Further, a fiber bundle base 505 is arranged at the bottom of the lamp bead base 501, and the fiber bundle base 505 is positioned between the first glass tube 5041, the glass reducer 5042 and the fiber bundle 503; by providing the optical fiber bundle base 505 at the bottom center of the lamp bead base 501, the optical fiber bundle 503 can be well fixed and limited, thereby preventing the displacement thereof.
As shown in fig. 4, the temperature control component 40 is a heat dissipation fan 401, the heat dissipation fan 401 is adjacently arranged below the PCB board 30, and the heat dissipation fan 401 and the PCB board 30 are connected with the top of the casing 10 through a plurality of connecting pieces 402 arranged along the first direction; by providing the heat radiation fan 401 in the housing 10, good lamp bead heat radiation and ventilation effect of the hollow chamber 20 can be achieved; meanwhile, the connecting pieces 402 are respectively penetrated with the cooling fans 401, so that the effect of fixing the cooling fans 401 can be realized; preferably, the connecting piece 402 is four bolts, and the four bolts extend downwards after penetrating through the PCB board 30 and penetrate the periphery of the cooling fan 401, so that a good position limiting effect is achieved.
Further, the temperature control component 40 is a heat dissipation fin 403, the heat dissipation fin 403 is adjacently arranged below the heat dissipation fan 401, the connecting piece 402 at least partially stretches into the heat dissipation fin 403, and the bottom of the heat dissipation fin 403 is connected with the bottom of the shell 10 through a locking piece 404; the heat radiation fins 403 are positioned at the bottom of the shell 10, and the top of the heat radiation fins are propped against the bottom of the heat radiation fan 401, so that a plurality of components are installed in the hollow cavity; meanwhile, good matching effect of multiple parts can be achieved, and therefore good limiting and fixing effects are achieved. The locking member 404 is a screw, and is fixedly connected with the bottom of the heat dissipation fin 403 by drilling from the bottom outside of the housing 10 from bottom to top, so that a good limiting effect of the heat dissipation fin 403 can be achieved. Preferably, the number of locking members 404 is four, and four locking members 404 are respectively located around the heat dissipation fins 403. The effect of a stable connection can be ensured.
Further, at least one threaded hole 506 is formed on one side of the lamp bead base 501 perpendicular to the first direction; through offer at least one screw hole 506 on lamp pearl base 501, can realize with good cooperation effect of other parts, say: the temperature sensing probe or the infrared sensor can realize the effect of monitoring the temperature in real time.
Further, the bottom of the shell 10 is connected with the lamp bead base 501 through a fastener 507; by connecting the housing 10 with the bead mount 501 using the fastener 507, a good assembly fitting effect can be achieved; wherein, the fastener 507 may be a fixing nail, which can achieve an effect of easy fixation.
Further, a plurality of heat dissipation holes 60 are formed in the shell 10, insertion holes 70 are formed in one side of the shell 10 far away from the heat dissipation holes 60, and the insertion holes 70 are located between the PCB 30 and the temperature control component 40; by providing the housing 10 with the plurality of heat dissipation holes 60, the effect of discharging the excessive heat can be achieved, thereby ensuring a good air circulation effect and further achieving the effect of reducing the temperature in the hollow chamber 20; meanwhile, the jack 70 is formed on one side of the shell 10 far away from the discrete hot hole 60, so that a good plugging effect can be realized, and a good electric connection effect with external equipment is realized; preferably, the jack 70 is a power jack 70, which can achieve a good power transmission effect, so as to achieve the effect of driving the PCB 30, the heat dissipation component, and the illumination assembly 50 to work normally.
The preferred embodiments of the present application have been described in detail above with reference to the accompanying drawings, but the present application is not limited to the specific details of the above embodiments, and various equivalent changes can be made to the technical solutions of the present application within the scope of the technical concept of the present application, and these equivalent changes all fall within the scope of the present application.
Claims (11)
1. A photoreactor characterized by comprising:
a housing (10);
a hollow chamber (20) which is provided on the housing (10);
the PCB (30) is arranged in the hollow cavity (20);
the temperature control component (40) is arranged in the hollow cavity (20) and is positioned below the PCB (30); a kind of electronic device with high-pressure air-conditioning system
An illumination assembly (50) connected to the bottom of the housing (10) along a first direction;
wherein, PCB board (30) with control by temperature change part (40) integrated set up in cavity (20) of casing (10), just illumination subassembly (50) integrated set up in casing (10) bottom to make the integrated setting of photoreactor.
2. The photoreactor according to claim 1, characterized in that said PCB board (30) is electrically connected to said temperature control member (40) and to said illumination assembly (50), respectively;
and the temperature control component (40) and the illumination component (50) are respectively controlled to act by sending out control signals through the PCB (30).
3. The light reactor according to claim 1, wherein the illumination assembly (50) employs a light source interpolation structure such that the light source emits from inside to outside.
4. A photo reactor according to claim 3, characterized in that the illumination assembly (50) comprises: the lamp bead base (501) is connected with the bottom of the shell (10), the lamp bead (502) is arranged in the center of the lamp bead base (501) along the first direction, the lamp beads (502) are connected with the optical fiber bundle (503) along the first direction, glass tubes (504) are arranged at intervals on the periphery of the optical fiber bundle (503), and the glass tubes (504) are connected with the lamp bead base (501).
5. The photoreactor according to claim 4, characterized in that said glass tube (504) comprises: the lamp bead comprises a first glass tube (5041), wherein the bottom of the first glass tube (5041) is connected with a glass reducing tube (5042) close to one side of a lamp bead base (501), and the bottom of the glass reducing tube (5042) is connected with a second glass tube (5043).
6. The photoreactor according to claim 5, characterized in that the bottom of the lamp bead base (501) is provided with a fiber bundle base (505), the fiber bundle base (505) being located between the first glass tube (5041), the glass reducer (5042) and the fiber bundle (503).
7. The photoreactor according to claim 1, characterized in that the temperature control component (40) is a cooling fan (401), the cooling fan (401) is adjacently arranged below the PCB board (30), and the cooling fan (401) and the PCB board (30) are connected with the top of the casing (10) through a plurality of connecting pieces (402) arranged along the first direction.
8. The photoreactor according to claim 7, characterized in that the temperature control component (40) is a heat dissipation fin (403), the heat dissipation fin (403) is adjacently arranged below the heat dissipation fan (401), the connecting piece (402) extends into the heat dissipation fin (403) at least partially, and the bottom of the heat dissipation fin (403) is connected with the bottom of the casing (10) through a locking piece (404).
9. The reactor according to claim 4, wherein one side of the bead base (501) is provided with at least one threaded hole (506) perpendicular to the first direction.
10. The light reactor according to claim 4, wherein the bottom of the housing (10) is connected to the lamp bead base (501) by fasteners (507).
11. The photoreactor according to claim 1, characterized in that a plurality of heat dissipation holes (60) are formed in the housing (10), a jack (70) is formed in a side, away from the heat dissipation holes (60), of the housing (10), and the jack (70) is located between the PCB board (30) and the temperature control member (40).
Priority Applications (1)
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