CN116825694A - Semiconductor diode forming device - Google Patents
Semiconductor diode forming device Download PDFInfo
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- CN116825694A CN116825694A CN202310807341.9A CN202310807341A CN116825694A CN 116825694 A CN116825694 A CN 116825694A CN 202310807341 A CN202310807341 A CN 202310807341A CN 116825694 A CN116825694 A CN 116825694A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 60
- 238000005192 partition Methods 0.000 claims abstract description 71
- 238000007599 discharging Methods 0.000 claims abstract description 20
- 238000006243 chemical reaction Methods 0.000 claims abstract description 14
- 238000011010 flushing procedure Methods 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 23
- 230000008569 process Effects 0.000 claims description 18
- 230000003139 buffering effect Effects 0.000 claims description 9
- 230000003247 decreasing effect Effects 0.000 claims description 4
- 239000002344 surface layer Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000009471 action Effects 0.000 abstract description 4
- 238000005457 optimization Methods 0.000 abstract description 3
- 238000004804 winding Methods 0.000 abstract description 2
- 230000002265 prevention Effects 0.000 abstract 1
- 239000004519 grease Substances 0.000 description 15
- 238000010586 diagram Methods 0.000 description 7
- 230000033001 locomotion Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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Abstract
The invention provides a semiconductor diode forming device, which belongs to the technical field of semiconductor manufacturing and comprises a forming device, wherein a feeding limit rod, a blanking sheet, a discharging limit rod, a first partition plate and a second partition plate are respectively arranged in the forming device; the driving conversion assembly is arranged on the side wall of the forming device. The invention is driven by the feeding motor, and the optimization functions of anti-collision, damp-proof, short-circuit prevention and slow-delivery collection of the discharging of the semiconductor diode are further realized by the double traction actions of the driving rod and the first retaining ring on the winding and dragging of the traction rope and the cooperation of the buffer film and the air-cushion component under the condition of low consumption.
Description
Technical Field
The invention relates to the field of semiconductor manufacturing, in particular to a semiconductor diode forming device.
Background
In the current production process of semiconductor diode molding, the manufacture of the semiconductor diode needs to be performed in a clean dust-free environment, high-precision automatic manufacturing equipment is needed, and the temperature, the humidity and the illumination need to be strictly controlled in the manufacturing process.
See in detail a semiconductor diode forming device in publication number CN115172239a, the device can guarantee the steady transportation to the diode material area under the cooperation of stock guide and feeder through the setting of stock guide and feeder, is provided with the guide at the feed end of stock guide, can prevent that the diode material area from blocking at the stock guide feed end, has ensured the anti-migration function of semiconductor diode in the transportation process, has ensured the stability of follow-up semiconductor diode processing shaping.
In the above-mentioned solutions, and in the processing steps of semiconductor diodes in the prior art, there are the following problems:
1. when the semiconductor diode is separated from the diode material belt, most of the semiconductor diode is ejected into the plastic box for storage, and the semiconductor diode is in direct contact with the wall end of the plastic box in the process to generate certain damage risk.
2. Based on the collision phenomenon in the problem 1, a layer of sponge cushion is paved at the wall end of the plastic box in part of the process to be used as buffer, but if plastic objects exist in the plastic box, an electrostatic phenomenon can occur, so that the electrostatic damage phenomenon is caused to part of the diodes; in addition, even in a room with strict temperature control, especially in a rainy season, the sponge pad still absorbs moisture in the air, so that the semiconductor diode is damaged by moisture.
3. After the semiconductor diode is formed, a part of devices adopt one more channel to transport and collect the semiconductor diode, and the overall energy consumption of the devices is high.
How to develop a semiconductor diode forming apparatus to improve these problems is a urgent problem for those skilled in the art.
Disclosure of Invention
In order to make up for the defects, the invention provides a semiconductor diode forming device, which aims to solve the problems that the whole energy consumption of the device is high, and the semiconductor diode can be impacted, damped and electrostatically damaged to a certain extent in the discharging and collecting processes.
The invention is realized by the following optimization:
the invention provides a semiconductor diode forming device, comprising:
the forming device is internally provided with a feeding limit rod, a blanking sheet, a discharging limit rod, a first partition plate and a second partition plate respectively, the side wall of the forming device is provided with a motor control box, the top end of the motor control box is embedded with a feeding motor, the buffer film is arranged between the second partition plate and the first partition plate, and the collecting box is arranged on the side wall of one end, far away from the first partition plate, of the second partition plate;
the driving conversion assembly is arranged on the side wall of the forming device and is used for converting driving force to generate secondary driving force required by subsequent procedures;
the pushing component is arranged in the forming device and is used for receiving the secondary driving force generated by the driving conversion component and buffering the formed semiconductor diode in discharging by matching with the buffer film, and the discharged semiconductor diode is buffered and collected;
the air flushing assembly is arranged in the second inner cavity, the air flushing assembly is matched with the pushing assembly, and the buffer film end is subjected to reciprocating air pressure impact to drive the buffering, buffering and collecting of the semiconductor diode.
Preferably, the motor control box is in signal connection with the feeding motor, the feeding limiting rod, the blanking sheet and the discharging limiting rod are all arranged at the upper end of the buffer film, the side walls of the buffer film are respectively and fixedly connected with the side walls of the forming device, the first partition plate and the second partition plate, the surface layer of the buffer film is stretched, and the density of the buffer film gradually rises from the first partition plate end to the second partition plate section.
Preferably, the drive conversion assembly comprises a connecting shaft, a rotating shaft, a meshing wheel, a limiting slide block, a driving rod and a first retaining ring, wherein the connecting shaft is connected with the side wall of the forming device in a rotating mode, the rotating shaft is fixedly connected with one end, close to the motor control box, of the connecting shaft, the rotating shaft is fixedly connected with an output shaft of the feeding motor, the meshing wheel is mounted on the side wall of the connecting shaft, the limiting slide block is symmetrically arranged on the side wall of the forming device relative to the middle section of the discharging limiting rod, the driving rod is connected with the limiting slide block in a sliding mode, and the first retaining ring is mounted at one end, close to the limiting slide block, of the driving rod.
Preferably, the pushing assembly comprises a pushing plate, a return spring, a traction rod, a traction rope and a second retaining ring, wherein the pushing plate is arranged between the first partition plate and the second partition plate, a first inner cavity is formed between the pushing plate and the second partition plate, a second inner cavity is formed between the pushing plate and the first partition plate, the return spring is fixedly installed between the first partition plate and the pushing plate, the traction rod is fixedly connected with one side, close to the first inner cavity, of the pushing plate, the traction rod penetrates through the second partition plate and extends towards the end of the second partition plate, the traction rope is fixedly connected with the extending end of the traction rod, the second retaining ring is symmetrically arranged inside the forming device relative to the middle section of the pushing plate, and the traction rope penetrates through the second retaining ring and is fixedly connected between the first retaining ring.
Preferably, the air-flushing assembly comprises an air-flushing pipe, a sliding inner cavity, a pushing rod, a limiting block, an air outlet and an air suction port, wherein the air-flushing pipe is fixedly installed at the bottom end of the second inner cavity, the sliding inner cavity is formed in the air-flushing pipe, the pushing rod is fixedly connected with the pushing plate, the pushing rod is in sliding connection with the sliding inner cavity, the limiting block is arranged on one side, far away from the pushing plate, of the pushing rod, a plurality of air outlets are arranged at one end, facing the buffer film, of the air-flushing pipe, the air suction port is arranged on the side wall of the air-flushing pipe, the air outlets are distributed at equal intervals relative to the side wall of the air-flushing pipe, and the aperture of the air outlet is gradually decreased from the first baffle end to the pushing plate end.
Preferably, the side wall of one end of the driving rod, which is close to the connecting shaft, is provided with a reciprocating screw rod structure, the driving rod is meshed with the meshing wheel, and the driving rod is attached to the side wall of the limit sliding block to slide in the moving process.
Preferably, the push plate is respectively in sliding connection with the side walls of the forming device, the push plate is attached to the bottom end of the buffer film, the traction rod is in sliding connection with the second partition plate, and the return spring is in a stretching state when the feeding motor is not started.
Preferably, the limiting block is in sliding connection with the sliding inner cavity, and the air outlet and the air suction port are both arranged in a one-way valve port structure.
The beneficial effects of the invention are as follows:
1. through the molecular structure characteristics of grease and the structural arrangement of the buffer film, the buffer function of discharging the semiconductor diode is realized under the rapid reciprocating motion along with the power action required by the molding of the semiconductor diode, and the semiconductor diode on the buffer film is subjected to the slow pushing process and push collection.
2. Along with the drive of pay-off motor, through driving the dual traction effect that pole and first buckle were restrainted and drag to the reel of haulage rope, the buffer membrane and the air cushion subassembly of cooperation have further realized crashproof, dampproofing, prevent short circuit and the optimization function of slowly sending the collection when the semiconductor diode ejection of compact under the low consumption condition.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some examples of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of an overall structure of a semiconductor diode forming device according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a first split structure of a semiconductor diode forming device according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a second split structure of a semiconductor diode forming device according to an embodiment of the present invention;
fig. 4 is a schematic diagram of a third split structure of a semiconductor diode forming device according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of an air-blast assembly of a semiconductor diode forming device according to an embodiment of the present invention;
fig. 6 is a schematic operation diagram of a semiconductor diode forming device according to an embodiment of the present invention;
fig. 7 is an illustration showing an exemplary semiconductor diode forming apparatus according to an embodiment of the present invention;
fig. 8 is a diagram illustrating an embodiment of a semiconductor diode forming apparatus according to an embodiment of the present invention.
In the figure: 100. a molding device; 101. a feed limit rod; 102. cutting a material sheet; 103. a discharging limiting rod; 104. a first separator; 105. a second separator; 106. a motor control box; 107. a feeding motor; 200. a drive conversion assembly; 201. a connecting shaft; 202. a rotating shaft; 203. a meshing wheel; 204. a limit sliding block; 205. a drive rod; 206. a first clasp; 300. a pushing assembly; 301. a push plate; 302. a first lumen; 303. a second lumen; 304. a return spring; 305. a traction rod; 306. a traction rope; 307. a second clasp; 400. an air flushing assembly; 401. an air flushing pipe; 402. a sliding inner cavity; 403. a push rod; 404. a limiting block; 405. an air outlet; 406. an air suction port; 500. a buffer film; 600. and a collection box.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, based on the embodiments of the invention, which are apparent to those of ordinary skill in the art without inventive faculty, are intended to be within the scope of the invention.
Example 1
Referring to fig. 1, 2 and 4, a semiconductor diode forming apparatus includes:
the forming device 100, the inside of the forming device 100 is respectively provided with a feeding limit rod 101, a blanking sheet 102, a discharging limit rod 103, a first partition board 104 and a second partition board 105, the side wall of the forming device 100 is provided with a motor control box 106, the top end of the motor control box 106 is embedded with a feeding motor 107, a buffer film 500 is arranged between the second partition board 105 and the first partition board 104, and a collecting box 600 is arranged on the side wall of one end, far away from the first partition board 104, of the second partition board 105;
the driving conversion assembly 200 is arranged on the side wall of the forming device 100, and the driving conversion assembly 200 is used for converting driving force to generate secondary driving force required by subsequent procedures;
the pushing component 300, the pushing component 300 is disposed inside the forming device 100, and the pushing component 300 is configured to receive the secondary driving force generated by the driving conversion component 200, and cooperate with the buffer film 500 to buffer the formed semiconductor diode during discharging, and buffer and collect the semiconductor diode after discharging.
With reference to fig. 2, further explanation is given:
the motor control box 106 is in signal connection with the feeding motor 107, the feeding limiting rod 101, the blanking piece 102 and the discharging limiting rod 103 are arranged at the upper end of the buffer film 500, the side walls of the buffer film 500 are respectively and fixedly connected with the side walls of the forming device 100, the first partition 104 and the second partition 105, the surface layer of the buffer film 500 is tightly tightened, and the density of the buffer film 500 gradually rises from the end of the first partition 104 to the end of the second partition 105.
It should be noted that: the feeding limit rod 101, the blanking piece 102 and the discharging limit rod 103 are arranged at the upper end of the buffer film 500, so that the semiconductor diode can stably fall to the upper end of the buffer film 500 for buffering and slow-sending collection procedures for ensuring the normal operation of the device.
With reference to fig. 2 and 3, further explanation is given:
the drive conversion assembly 200 comprises a connecting shaft 201, a rotating shaft 202, a meshing wheel 203, a limit slide block 204, a driving rod 205 and a first retaining ring 206, wherein the connecting shaft 201 is rotationally connected with the side wall of the forming device 100, the rotating shaft 202 is fixedly connected with one end, close to the motor control box 106, of the connecting shaft 201, the rotating shaft 202 is fixedly connected with an output shaft of the feeding motor 107, the meshing wheel 203 is arranged on the side wall of the connecting shaft 201, the limit slide block 204 is symmetrically arranged on the side wall of the forming device 100 with respect to the middle section of the discharging limit rod 103, the driving rod 205 is in sliding connection with the limit slide block 204, and the first retaining ring 206 is arranged at one end, close to the limit slide block 204, of the driving rod 205.
With reference to fig. 3-4, further explanation is provided:
the pushing assembly 300 comprises a pushing plate 301, a return spring 304, a traction rod 305, a traction rope 306 and a second retaining ring 307, wherein the pushing plate 301 is arranged between the first partition plate 104 and the second partition plate 105, a first inner cavity 302 is formed between the pushing plate 301 and the second partition plate 105, a second inner cavity 303 is formed between the pushing plate 301 and the first partition plate 104, the return spring 304 is fixedly arranged between the first partition plate 104 and the pushing plate 301, the traction rod 305 is fixedly connected with one side, close to the first inner cavity 302, of the pushing plate 301, the traction rod 305 penetrates through the second partition plate 105 and extends towards the end of the second partition plate 105, the traction rope 306 is fixedly connected with the extending end of the traction rod 305, the second retaining ring 307 is symmetrically arranged inside the forming device 100 with respect to the middle section of the pushing plate 301, and the traction rope 306 penetrates through the second retaining ring 307 and is fixedly connected with the first retaining ring 206.
With reference to fig. 2 and 3, further explanation is given:
the side wall of one end of the driving rod 205, which is close to the connecting shaft 201, adopts a reciprocating screw rod structure, the driving rod 205 is meshed with the meshing wheel 203, and the driving rod 205 is attached to the side wall of the limit sliding block 204 to slide in the moving process.
It should be noted that: the end of the driving rod 205 far away from the limit sliding block 204 adopts the structure of a reciprocating screw rod, and can be meshed with the meshing wheel 203, so that the driving conversion function of the driving conversion assembly 200 in the design is realized, the driving rod 205 is attached to the side wall of the limit sliding block 204 and slides in the moving process, and the phenomenon that the driving rod 205 is separated from the limit sliding block 204 in the moving process is not caused.
With reference to fig. 3-4, further explanation is provided:
the push plate 301 is slidably connected with the side wall of the forming device 100, the push plate 301 is attached to the bottom end of the buffer film 500, the traction rod 305 is slidably connected with the second partition 105, and the return spring 304 is in a stretched state when the feeding motor 107 is not started.
The working principle of the embodiment is specifically as follows:
the points to be noted in advance in the present invention are: the feeding motor 107 adopts a variable frequency motor, the feeding motor 107 is in signal connection with the motor control box 106, and the feeding motor 107 is subjected to variable speed regulation and control through a control panel of the motor control box 106 to select the optimal operation rate;
in addition, the buffer film 500 adopts a PVC film added with static electricity eliminator, the film is a flexible and plastic film material, and the PVC film is formed by splicing and cutting a high-density PVC film and a low-density PVC film by a heat sealing or gluing method, wherein the density of the buffer film 500 gradually increases from the first baffle 104 to the second baffle 105, namely, the stronger the toughness of the buffer film 500 is near one end of the second baffle 105, the lower the deformation degree is.
As can be seen from fig. 4, the buffer film 500 covers the first cavity 302 and the second cavity 303, and the second cavity 303 is filled with grease.
As can be seen from fig. 1, fig. 3 and fig. 4, when the operation starts, the motor control box 106 controls the feeding motor 107 to start, the output end of the feeding motor 107 drives the rotation shaft 202 fixedly connected with the feeding motor 107 to coaxially rotate, the engagement wheel 203 mounted on the side wall of the connection shaft 201 rotates along with the rotation shaft, the engagement wheel 203 is engaged with the driving rod 205, one end of the driving rod 205, which is close to the connection shaft 201, is provided with a reciprocating screw rod structure, in the process of rotating the feeding motor 107 in one direction, the driving rod 205 can reciprocate in the horizontal direction under the limit of the limit slider 204, when the driving rod 205 moves in the direction of the connection shaft 201, the driving rod 205 moves and rotates at the same time, the first buckle 206 fixedly connected with the driving rod 205 can reel the pulling rope 306, and the pulling rope 306 is dragged by the driving rod 205 and the first buckle 206 reels, the structure can reel the pulling rope 306 faster, and the pulling rope 306 can be wound up through the length setting of the first buckle 206, so that the pulling rope 306 can be quickly coiled by the first buckle 206 to be stretched in the direction, and the pulling rod 205 starts moving in the direction of the first buckle 206;
as can be seen from fig. 4, when the hauling cable 306 is reeled, the hauling cable 306 pulls the hauling rod 305 to drive the push plate 301 to move toward the first inner cavity 302, and the grease level in the second inner cavity 303 begins to drop; when the hauling rope 306 is paid off, the hauling rope 306 starts to loosen, the return spring 304 starts to drive the push plate 301 to return due to the self elastic force, grease in the second inner cavity 303 is extruded in the process, the grease liquid level starts to rise, the double pulling functions of rolling and dragging of the hauling rope 306 by the driving rod 205 and the first retaining ring 206 can be rapidly carried out, and the grease liquid level also rises and falls in a reciprocating manner;
according to the three curves X, Y and Z shown in fig. 7, the buffer film 500 undulation condition and the semiconductor diode running track (the circle is the semiconductor diode) under different pushing plate 301 running conditions are shown;
because of the rapid reciprocating motion, and the side wall between the buffer film 500 and the push plate 301 is attached, the buffer film 500 is in a tight state, the instantaneously lifted hydraulic pressure preferentially extrudes the PVC film near one end of the first partition plate 104, the PVC film near the end of the first partition plate 104 is easier to deform because the density of the PVC film from the end of the first partition plate 104 to the end of the second partition plate 105 is gradually increased, the PVC film near the end of the second partition plate 105 is more flexible and harder to deform, so that when the grease liquid level rises, the swelling amplitude of the section of the buffer film 500 near the first partition plate 104 is larger, a downward sliding ramp is formed, the semiconductor diode falls on the upper end of the buffer film 500 after being ejected, and because the semiconductor diode has smaller mass, even though pins exist, the pressure in falling cannot puncture the buffer film 500, under the alternate reciprocating motion of a flat channel and a curve, the semiconductor diode is continuously conveyed into the collecting box 600 for storage.
In the process of extruding grease by the push plate 301, the quantity of the grease permeated between the buffer film 500 and the push plate 301 is small (the grease molecules are larger than the water molecules, and the stability of the grease molecules is guaranteed to a certain extent by matching with the strict temperature control of the device in the implementation process, so that the grease is more difficult to permeate), but a small quantity of the grease is still permeated, and the subsequent process of periodically supplementing the oil in the second inner cavity 303 is needed.
Example two
In the first embodiment, although the semiconductor diode has a lighter weight and the buffer film 500 has better toughness, but the occurrence of accidental accidents cannot be guaranteed, if the accidental accidents occur, the oil seepage condition occurs at the end of the buffer film 500, the contact between the grease and the diode can cause the adhesion of dust to the diode, and in addition, if the contact between the grease and the pins of the semiconductor diode occurs, the short circuit phenomenon occurs, which has a certain risk, according to the further improvement of the first embodiment, the invention further comprises:
the air-flushing assembly 400, the air-flushing assembly 400 is disposed inside the second inner cavity 303, and the air-flushing assembly 400 is matched with the pushing assembly 300 to perform reciprocating air-pressure impact on the end of the buffer film 500 to drive buffering, buffering and collecting of the semiconductor diode.
With reference to fig. 2 and 5, further explanation is made:
the air-flushing assembly 400 comprises an air-flushing pipe 401, a sliding inner cavity 402, a push rod 403, a limiting block 404, an air outlet 405 and an air suction port 406, wherein the air-flushing pipe 401 is fixedly arranged at the bottom end of the second inner cavity 303, the sliding inner cavity 402 is arranged in the air-flushing pipe 401, the push rod 403 is fixedly connected with the push plate 301, the push rod 403 is in sliding connection with the sliding inner cavity 402, the limiting block 404 is arranged on one side, far away from the push plate 301, of the push rod 403, a plurality of air outlets 405 are arranged at one end, facing the buffer film 500, of the air suction port 406, arranged on the side wall of the air-flushing pipe 401, the air outlets 405 are distributed at equal intervals with respect to the side wall of the air-flushing pipe 401, and the apertures of the air outlets 405 are sequentially decreased from the end of the first partition 104 to the end of the push plate 301.
It should be noted that: the diameters of the air outlets 405 decrease from the end of the first partition board 104 to the end of the push board 301 in sequence, that is, the smaller the diameter of the air outlet 405 closer to the end of the push board 301 is, the harder the buffer film 500 is deformed when being closer to the end of the push board 301, under the condition that the air pressure is small and the toughness of the buffer film 500 is strong, the smaller the fluctuation degree of the buffer film 500 is when being closer to the end of the push board 301, otherwise, the larger the air pressure is when the buffer film 500 is closer to the end of the first partition board 104, the weaker the toughness of the buffer film 500 is, and the larger the fluctuation degree is when the buffer film 500 is closer to the end of the first partition board 104.
With reference to fig. 5, further explanation is given:
the limiting block 404 is in sliding connection with the sliding inner cavity 402, and the air outlet 405 and the air suction port 406 are both arranged in a one-way valve port structure.
It should be noted that: the air outlet 405 and the air suction port 406 are arranged in a one-way valve port structure, so as to ensure that the air pressure at the end of the air flushing pipe 401 can act on the bottom end of the buffer film 500 in a reciprocating way.
The working principle of the embodiment is specifically as follows:
as can be seen from fig. 4 and 8, when the hauling rope 306 is wound, the hauling rope 306 pulls the hauling rod 305 to drive the push plate 301 to move toward the first inner cavity 302, the push rod 403 performs an outward pulling process along with the movement of the push plate 301, and at this time, the air inlet 406 starts to perform an air inlet operation, and the buffer film 500 slightly sags downward due to the reduced air pressure in the second inner cavity 303;
when the hauling rope 306 is paid off, the hauling rope 306 starts to relax, the return spring 304 starts to drive the push plate 301 to return under the action of self elasticity, in the process, the push rod 403 extrudes the gas in the gas flushing pipe 401, the gas in the gas flushing pipe 401 is discharged through the gas outlet 405, and as the aperture of the gas outlet 405 is gradually decreased from the end of the first partition board 104 to the end of the push plate 301, the smaller the aperture of the gas outlet 405 near the end of the push plate 301 is, the harder the buffer film 500 deforms is matched with the characteristic that the closer the buffer film 500 is to the end of the push plate 301, and under the conditions that the wind pressure is small and the toughness of the buffer film 500 is strong, the fluctuation degree of the buffer film 500 near the end of the push plate 301 is smaller;
on the contrary, the wind pressure of the buffer film 500 near the end of the first partition board 104 is larger, the toughness of the buffer film 500 is weak, the fluctuation degree of the buffer film 500 near the end of the first partition board 104 is larger, so that a buffer ramp from high to low from the first partition board 104 to the second partition board 105 is formed, the buffer process is carried out on the semiconductor diode entering the end of the buffer film 500 under the condition that the buffer film 500 continuously fluctuates, the reciprocating motion can be rapidly carried out through the double pulling functions of the driving rod 205 and the first retaining ring 206 on the winding and dragging of the pulling rope 306, and the functions of anti-collision, damp-proof, anti-static and buffer collection during discharging of the semiconductor diode are realized under the condition of low consumption along with the driving action of the feeding motor 107.
In the description of the present invention, it should be noted that, specific model specifications of the motor need to be determined according to actual specifications of the device, and the like, and specific model selection calculation methods are adopted in the prior art, so detailed descriptions are not needed, and it should be understood that terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counter-clockwise", "axial", "radial", "circumferential", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are merely for convenience in describing the present invention and brief description, and are not intended to indicate or imply that the indicated positions or elements must have specific orientations, be configured and operated in specific directions, and should not be construed as limiting the present invention. Furthermore, features defining "first", "second" may include one or more such features, either explicitly or implicitly. In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present invention, it should also be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
Claims (8)
1. A semiconductor diode forming apparatus, comprising:
the forming device is internally provided with a feeding limit rod, a blanking sheet, a discharging limit rod, a first partition plate and a second partition plate respectively, the side wall of the forming device is provided with a motor control box, the top end of the motor control box is embedded with a feeding motor, the buffer film is arranged between the second partition plate and the first partition plate, and the collecting box is arranged on the side wall of one end, far away from the first partition plate, of the second partition plate;
the driving conversion assembly is arranged on the side wall of the forming device and is used for converting driving force to generate secondary driving force required by subsequent procedures;
the pushing component is arranged in the forming device and is used for receiving the secondary driving force generated by the driving conversion component and buffering the formed semiconductor diode in discharging by matching with the buffer film, and the discharged semiconductor diode is buffered and collected;
the air flushing assembly is arranged in the second inner cavity, the air flushing assembly is matched with the pushing assembly, and the buffer film end is subjected to reciprocating air pressure impact to drive the buffering, buffering and collecting of the semiconductor diode.
2. The semiconductor diode forming device according to claim 1, wherein the motor control box is in signal connection with the feeding motor, the feeding limit rod, the blanking plate and the discharging limit rod are all arranged at the upper end of the buffer film, the side walls of the buffer film are respectively and fixedly connected with the forming device, the first partition plate and the side walls of the second partition plate, the surface layer of the buffer film is stretched, and the density of the buffer film gradually rises from the end of the first partition plate to the end of the second partition plate.
3. The device for forming the semiconductor diode according to claim 1, wherein the driving conversion assembly comprises a connecting shaft, a rotating shaft, a meshing wheel, a limiting slide block, a driving rod and a first retaining ring, the connecting shaft is in rotating connection with the side wall of the forming device, the rotating shaft is fixedly connected with one end, close to a motor control box, of the connecting shaft, the rotating shaft is fixedly connected with an output shaft of the feeding motor, the meshing wheel is mounted on the side wall of the connecting shaft, the limiting slide block is symmetrically arranged on the side wall of the forming device with respect to the middle section of the discharging limiting rod, the driving rod is in sliding connection with the limiting slide block, and the first retaining ring is mounted on one end, close to the limiting slide block, of the driving rod.
4. The device of claim 3, wherein the pushing assembly comprises a pushing plate, a return spring, a traction rod, a traction rope and a second retaining ring, the pushing plate is arranged between the first partition plate and the second partition plate, a first inner cavity is formed between the pushing plate and the second partition plate, a second inner cavity is formed between the pushing plate and the first partition plate, the return spring is fixedly arranged between the first partition plate and the pushing plate, the traction rod and one side, close to the first inner cavity, of the pushing plate are fixedly connected, the traction rod penetrates through the second partition plate and extends towards the end of the second partition plate, the traction rope and the extending end of the traction rod are fixedly connected, the second retaining ring is symmetrically arranged inside the forming device with respect to the middle section of the pushing plate, and the traction rope penetrates through the second retaining ring and is fixedly connected with the first retaining ring.
5. The device for forming the semiconductor diode according to claim 4, wherein the air-flushing assembly comprises an air-flushing pipe, a sliding inner cavity, a pushing rod, a limiting block, air outlets and an air suction port, the air-flushing pipe is fixedly arranged at the bottom end of the second inner cavity, the sliding inner cavity is arranged in the air-flushing pipe, the pushing rod is fixedly connected with the pushing plate, the pushing rod is in sliding connection with the sliding inner cavity, the limiting block is arranged on one side, away from the pushing plate, of the pushing rod, a plurality of air outlets are arranged at one end, facing the buffer film, of the air-flushing pipe, the air suction port is arranged on the side wall of the air-flushing pipe, the air outlets are distributed at equal intervals with respect to the side wall of the air-flushing pipe, and the aperture of the air outlets is sequentially decreased from the first baffle end to the pushing plate end.
6. The device for forming semiconductor diode according to claim 3, wherein the side wall of the end of the driving rod, which is close to the connecting shaft, is provided with a reciprocating screw rod structure, the driving rod is meshed with the meshing wheel, and the driving rod is attached to the side wall of the limit sliding block and slides in the moving process.
7. The device of claim 4, wherein the pushing plates are slidably connected with the side walls of the forming device, the pushing plates are attached to the bottom ends of the buffer films, the traction rods are slidably connected with the second partition plates, and the return springs are in a stretched state when the feeding motor is not started.
8. The device of claim 5, wherein the stopper is slidably connected to the sliding cavity, and the air outlet and the air inlet are both configured as unidirectional valve ports.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310807341.9A CN116825694B (en) | 2023-07-03 | 2023-07-03 | Semiconductor diode forming device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310807341.9A CN116825694B (en) | 2023-07-03 | 2023-07-03 | Semiconductor diode forming device |
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| CN116825694B CN116825694B (en) | 2024-03-19 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107275274A (en) * | 2017-07-27 | 2017-10-20 | 重庆平伟实业股份有限公司 | Diode automatic feed mechanism |
| US20200219854A1 (en) * | 2017-07-18 | 2020-07-09 | Lumens Co., Ltd. | Apparatus and method for manufacturing light-emitting diode module |
| CN115172239A (en) * | 2022-07-14 | 2022-10-11 | 先之科半导体科技(东莞)有限公司 | Semiconductor diode forming device |
| CN115180253A (en) * | 2022-08-02 | 2022-10-14 | 苏州查斯特电子有限公司 | Discharging boxing device for diode processing |
-
2023
- 2023-07-03 CN CN202310807341.9A patent/CN116825694B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20200219854A1 (en) * | 2017-07-18 | 2020-07-09 | Lumens Co., Ltd. | Apparatus and method for manufacturing light-emitting diode module |
| CN107275274A (en) * | 2017-07-27 | 2017-10-20 | 重庆平伟实业股份有限公司 | Diode automatic feed mechanism |
| CN115172239A (en) * | 2022-07-14 | 2022-10-11 | 先之科半导体科技(东莞)有限公司 | Semiconductor diode forming device |
| CN115180253A (en) * | 2022-08-02 | 2022-10-14 | 苏州查斯特电子有限公司 | Discharging boxing device for diode processing |
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| CN116825694B (en) | 2024-03-19 |
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