CN116810215A - Solder composition, and method for manufacturing electronic substrate - Google Patents
Solder composition, and method for manufacturing electronic substrate Download PDFInfo
- Publication number
- CN116810215A CN116810215A CN202310267430.9A CN202310267430A CN116810215A CN 116810215 A CN116810215 A CN 116810215A CN 202310267430 A CN202310267430 A CN 202310267430A CN 116810215 A CN116810215 A CN 116810215A
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- mass
- solder
- flux composition
- composition
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- 229910000679 solder Inorganic materials 0.000 title claims description 111
- 239000000758 substrate Substances 0.000 title claims description 51
- 238000000034 method Methods 0.000 title claims description 26
- 238000004519 manufacturing process Methods 0.000 title claims description 18
- 230000004907 flux Effects 0.000 claims abstract description 76
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- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims abstract description 37
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- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 150000003628 tricarboxylic acids Chemical class 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000003911 water pollution Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3618—Carboxylic acids or salts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention relates to a flux composition comprising (A) a rosin resin, (B) an activator, (C) a solvent, and (D) an imidazole compound, wherein the component (B) comprises (B1) 1,2, 3-tricarballylic acid, and the component (D) comprises (D1) an imidazole compound having a molecular weight of 70 to 120.
Description
Technical Field
The present invention relates to a flux composition, a solder composition, and a method for manufacturing an electronic substrate,
background
The solder composition is a paste-like mixture obtained by kneading a solder powder with a flux composition (rosin-based resin, an activator, a solvent, etc.) (see document 1: japanese patent No. 5887330).
When soldering is performed using the solder composition, a flux residue remains around the joint after soldering. The residue contains an activator component and the like, and particularly, moisture may be introduced into the residue distributed across the electrodes due to dew condensation or the like, which may cause ion migration. In addition, there are cases where a flux residue exists on the surface, which may cause a defect in the molding step or the coating step or a poor bonding of wire bonding. It is therefore desirable to remove this residue by washing after bonding.
Conventionally, cleaning using a cleaning agent or the like containing an organic solvent having a high cleaning ability as a main component has been performed. However, since the solvent component is large, restrictions are increasing from the viewpoint of preventing water pollution, fire and air pollution, and the like, and from the viewpoint of production hygiene.
Therefore, in recent years, the amount of solvent used has been reduced, and aqueous cleaning agents containing water as a main component have been used. Therefore, as the composition of the cleaning agent changes, the cleaning property of the flux residue tends to be deteriorated, which is a problem.
In addition, from the viewpoint of equipment cost and the like, the need for soldering by reflow soldering under air conditions increases. In the case of air reflow soldering, oxidation of solder powder proceeds, and solder meltability decreases. The smaller the printing amount of the solder composition, the smaller the joint portion of the parts, and the more remarkable the tendency. In addition, in the air reflow soldering, the metal salt contained in the flux residue after soldering increases due to the influence of metal oxidation, and the cleanability of the flux residue also tends to be deteriorated.
Disclosure of Invention
The purpose of the present invention is to provide a flux composition, a solder composition, and a method for manufacturing an electronic substrate, wherein the flux composition is excellent in cleaning performance of flux residues based on an aqueous cleaning agent and excellent in solder meltability in air reflow.
According to one embodiment of the present invention, there is provided a flux composition comprising (a) a rosin-based resin, (B) an activator, (C) a solvent, and (D) an imidazole compound, wherein the component (B) contains (B1) 1,2, 3-propanetricarboxylic acid, and the component (D) contains (D1) an imidazole compound having a molecular weight of 70 to 120.
According to one embodiment of the present invention, there can be provided a solder composition containing the flux composition according to one embodiment of the present invention described above and (G) a solder powder.
According to one aspect of the present invention, there is provided a method for manufacturing an electronic substrate by soldering using the solder composition according to one aspect of the present invention, the method comprising: a step of coating the solder composition on an electronic substrate; disposing an electronic component on the solder composition; a step of mounting the electronic component on the electronic substrate by heating the electronic substrate under a predetermined condition in a reflow oven; and a step of cleaning the flux residue on the electronic substrate using an aqueous cleaning agent.
According to the present invention, a flux composition, a solder composition, and a method for manufacturing an electronic substrate, each of which has excellent cleaning properties of a flux residue by an aqueous cleaning agent and excellent solder meltability in air reflow soldering, can be provided.
Detailed Description
[ flux composition ]
First, the flux composition of the present embodiment will be described. The flux composition of the present embodiment is a component other than the solder powder in the solder composition, and contains (a) a rosin-based resin, (B) an activator, (C) a solvent, and (D) an imidazole compound, which are described below. The component (B) is required to contain (B1) 1,2, 3-tricarballylic acid, and the component (D) is required to contain (D1) an imidazole compound having a molecular weight of 70 to 120.
The reason why the flux composition of the present embodiment is excellent in the cleaning property of the flux residue based on the aqueous cleaning agent and excellent in the solder meltability in the air reflow is not yet defined, but the present inventors speculate as follows.
That is, the (B) activator has a high activation effect of the organic acid, and is effective for improving the solder melting property in the air reflow soldering. In addition, the imidazole compound is also effective for improving the solder meltability in air reflow soldering. However, it is known that the higher the molecular weight of the organic acid and the imidazole compound, the lower the cleaning property of the flux residue. Further, according to the combination of (B1) 1,2, 3-propanetricarboxylic acid which is a low-molecular tricarboxylic acid and (D1) an imidazole compound having a molecular weight of 70 to 120, the cleanability of the flux residue can be maintained and the solder meltability in the air reflow can be sufficiently improved. The inventors speculated that the effects of the present invention described above can be achieved thereby.
[ (A) component ]
The rosin-based resin (a) used in the present embodiment includes rosin-based and rosin-based modified resins. Examples of the rosin include gum rosin, wood rosin, and tall oil rosin. Examples of the rosin-based modified resin include disproportionated rosin, polymerized rosin, hydrogenated rosin, and derivatives thereof. Examples of the hydrogenated rosin include fully hydrogenated rosin, partially hydrogenated rosin, and hydrogenated products of unsaturated organic acid-modified rosin (also referred to as "hydrogenated acid-modified rosin") which is modified rosin with an unsaturated organic acid (e.g., aliphatic unsaturated monobasic acid such as (meth) acrylic acid, aliphatic unsaturated dibasic acid such as (fumaric acid) or (maleic acid), or unsaturated carboxylic acid having an aromatic ring such as (cinnamic acid). These rosin-based resins may be used alone in an amount of 1 or in an amount of 2 or more. Among these rosin-based resins, polymerized rosin and hydrogenated acid-modified rosin are preferably used, and more preferably, polymerized rosin and hydrogenated acid-modified rosin are used in combination.
The amount of component (a) to be blended is preferably 30% by mass or more and 70% by mass or less, more preferably 35% by mass or more and 60% by mass or less, particularly preferably 40% by mass or more and 50% by mass or less, relative to 100% by mass of the flux composition. When the amount of component (a) is not less than the lower limit, solderability, which is a property of preventing oxidation of the copper foil surface of the solder pad and making the molten solder easily wet the surface thereof, can be improved and solder balls can be sufficiently suppressed. When the amount of component (a) is not more than the upper limit, the flux residue can be sufficiently suppressed.
[ (B) component ]
The (B) activator used in the present embodiment is required to contain (B1) 1,2, 3-propanetricarboxylic acid. The component (B1) has little adverse effect on the cleaning property of the weld residue.
The amount of the component (B1) to be blended is preferably 0.5% by mass or more and 10% by mass or less, more preferably 1% by mass or more and 7% by mass or less, and particularly preferably 1.5% by mass or more and 4% by mass or less, relative to 100% by mass of the flux composition. (B1) When the amount of the component is not less than the lower limit, the melting property of the solder tends to be improved, and when the amount is not more than the upper limit, the insulating property of the flux composition tends to be maintained.
In addition to the component (B1), the component (B) may further contain other activators (hereinafter, also referred to as component (B2)) within a range in which the object of the present invention can be achieved. Examples of the component (B2) include an organic acid, a halogen-based activator, an amine-based activator, and the like other than the component (B1). However, the component (B1) is preferably used from the viewpoint that the cleaning property of the flux residue may be adversely affected by an organic acid other than the component (B1). The blending amount of the component (B1) is preferably 50% by mass or more, more preferably 70% by mass or more, and particularly preferably 90% by mass or more, based on 100% by mass of the component (B).
The amount of the component (B) to be blended is preferably 0.5% by mass or more and 12% by mass or less, more preferably 1% by mass or more and 8% by mass or less, and particularly preferably 1.5% by mass or more and 5% by mass or less, relative to 100% by mass of the flux composition. When the amount of component (B) is not less than the lower limit, the activation effect tends to be improved, while when it is not more than the upper limit, the insulation property of the flux composition tends to be maintained.
[ (C) component ]
As the solvent (C) used in the present embodiment, a known solvent can be suitably used. As such a solvent, a solvent having a boiling point of 170℃or higher is preferably used.
Examples of such solvents include: diethylene glycol, dipropylene glycol, triethylene glycol, hexylene glycol, 1, 5-pentanediol, methyl carbitol, butyl carbitol, diethylene glycol-2-ethylhexyl ether, octanediol, ethylene glycol phenyl ether, diethylene glycol monohexyl ether (DEH), tetraethylene glycol dimethyl ether, dibutyl maleate, and the like. These solvents may be used alone or in combination of 1 or more than 2.
The amount of component (C) to be blended is preferably 10% by mass or more and 60% by mass or less, more preferably 20% by mass or more and 50% by mass or less, relative to 100% by mass of the flux composition. When the blending amount of the solvent is within the above range, the viscosity of the obtained solder composition can be adjusted to an appropriate range.
[ (D) component ]
The imidazole compound (D) used in the present embodiment is an imidazole compound having a molecular weight of (D1) 70 to 120. The component (D1) has little adverse effect on the cleaning property of the weld residue.
Examples of the component (D1) include 2-methylimidazole (molecular weight 82.1), 2-ethylimidazole (molecular weight 96.1), 2-ethyl-4-methylimidazole (molecular weight 110.2), and 1, 2-dimethylimidazole (molecular weight 96.1).
The amount of component (D1) to be blended is preferably 0.5% by mass or more and 10% by mass or less, more preferably 1% by mass or more and 7% by mass or less, and particularly preferably 2% by mass or more and 5% by mass or less, relative to 100% by mass of the flux composition. (D1) When the amount of the component is not less than the lower limit, the melting property of the solder tends to be improved, and when the amount is not more than the upper limit, the cleaning property of the flux residue tends to be maintained.
In addition to the component (D1), the component (D) may further contain other imidazole compounds (hereinafter, also referred to as the component (D2)) within a range in which the object of the present invention can be achieved. Examples of the component (D2) include imidazole compounds other than the component (D1). However, the component (D1) is preferably used in view of the adverse effect of the component (D2) on the cleaning property of the flux residue. The blending amount of the component (D1) is preferably 90 mass% or more, more preferably 95 mass% or more, based on 100 mass% of the component (D).
The amount of component (D) to be blended is preferably 0.5% by mass or more and 10% by mass or less, more preferably 1% by mass or more and 7% by mass or less, and particularly preferably 2% by mass or more and 5% by mass or less, relative to 100% by mass of the flux composition. (D) When the amount of the component is not less than the lower limit, the melting property of the solder tends to be improved, and when the amount is not more than the upper limit, the cleaning property of the flux residue tends to be maintained.
[ (E) component ]
From the viewpoint of solder meltability and the like, the flux composition of the present embodiment preferably further contains (E) a hindered phenol antioxidant.
Examples of the hindered phenol antioxidant include: pentaerythritol tetrakis [3- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionate ], triethylene glycol ether-bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionate ], N '-bis [2- [2- (3, 5-di-tert-butyl-4-hydroxyphenyl) ethylcarbonyloxy ] ethyl ] oxamide, N' -bis [3- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionyl ] hydrazine, and the like.
The amount of the component (E) to be blended is preferably 0.1% by mass or more and 5% by mass or less, more preferably 0.5% by mass or more and 4% by mass or less, particularly preferably 1% by mass or more and 3% by mass or less, relative to 100% by mass of the flux composition. (E) When the amount of the component is not less than the lower limit, the melting property of the solder tends to be improved, and when the amount is not more than the upper limit, the insulating property of the flux composition tends to be maintained.
[ (F) component ]
The flux composition of the present embodiment preferably further contains (F) a hindered amine antioxidant. The component (F) has a structure represented by the following general formula (F1). The component (F) can improve the solder melting property in the air reflow soldering.
In the general formula (F1), R 1 Independently methyl or ethyl, preferably methyl.
X is hydrogen, alkyl having 1 to 12 carbon atoms, or alkoxy having 1 to 12 carbon atoms. When X is hydrogen, the structure is represented by the following general formula (F1-1). When X is an alkyl group having 1 to 12 carbon atoms, the structure is represented by the following general formula (F1-2). When X is an alkoxy group having 1 to 12 carbon atoms, the structure is represented by the following general formula (F1-3).
In the component (F), the structure of the portion preceding the wavy line is not particularly limited.
(F) The number of structures represented by the general formula (F1) in 1 molecule of the component is preferably 1 to 10, more preferably 2 to 4.
In the general formula (F1-1), R 1 Independently methyl or ethyl, preferably methyl.
As the compound having a structure represented by the general formula (F1-1), examples thereof include bis (2, 6-tetramethyl-4-piperidinyl) sebacate, tetrakis (2, 6-tetramethyl-4-piperidinyl) 1,2,3, 4-butanetetracarboxylate 2, 6-tetramethyl-4-piperidinyl methacrylate and the like.
In the general formula (F1-2), R 1 Independently methyl or ethyl, preferably methyl.
R 2 The alkyl group having 1 to 12 carbon atoms is preferably an alkyl group having 1 to 8 carbon atoms, more preferably an alkyl group having 1 to 3 carbon atoms, and particularly preferably a methyl group.
As the compound having a structure represented by the general formula (F1-2), examples thereof include bis (1, 2, 6-pentamethyl-4-piperidinyl) bis [ [3, 5-bis (1, 1-dimethylethyl) -4-hydroxyphenyl ] ethyl ] butylmalonate, bis (1, 2, 6-pentamethyl-4-piperidinyl) sebacate, bis (ethyl) malonate, bis (ethyl) sebacate, and bis (ethyl) sebacate. Sebacic acid 1- (methyl) -8- (1, 2, 6-pentamethyl-4-piperidinyl) ester, 1,2,3, 4-butanetetracarboxylic acid tetrakis (1, 2, 6-pentamethyl-4-piperidinyl) ester 1,2, 6-pentamethyl-4-piperidinyl methacrylate and the like.
In the general formula (F1-3), R 1 Independently methyl or ethyl, preferably methyl.
R 3 The alkyl group having 1 to 12 carbon atoms is preferably an alkyl group having 4 to 11 carbon atoms, more preferably an alkyl group having 8 to 11 carbon atoms, and particularly preferably an octyl group or an undecyl group.
Examples of the compound having a structure represented by the general formula (F1-3) include bis (1-octyloxy-2, 6-tetramethyl-4-piperidinyl) sebacate and bis (1-undecyloxy-2, 6-tetramethylpiperidin-4-yl) carbonate.
The amount of the component (F) to be blended is preferably 0.1% by mass or more and 5% by mass or less, more preferably 0.5% by mass or more and 3% by mass or less, particularly preferably 1% by mass or more and 2% by mass or less, relative to 100% by mass of the flux composition. (F) When the amount of the component is not less than the above lower limit, particularly when the time to reach the melting temperature at the time of reflow soldering is long, there is a tendency that the melting property of the solder at the time of air reflow soldering can be improved, and when it is not more than the above upper limit, there is a tendency that the insulating property of the flux composition can be maintained.
[ thixotropic agent ]
The flux composition of the present embodiment preferably further contains a thixotropic agent from the viewpoint of printability and the like. Examples of the thixotropic agent used herein include cured castor oil, amides, kaolin, colloidal silica, organobentonite, and glass frit. These thixotropic agents may be used alone or in combination of 1 or more than 2.
The amount of the thixotropic agent to be blended is preferably 1 mass% or more and 20 mass% or less, more preferably 2 mass% or more and 12 mass% or less, relative to 100 mass% of the flux composition. If the blending amount is less than the lower limit, thixotropic properties are not obtained and sagging tends to occur easily, while if it exceeds the upper limit, thixotropic properties are too high and printing defects tend to occur easily.
[ other Components ]
In the flux composition used in the present embodiment, other additives and other resins may be added as necessary in addition to the component (a), the component (B), the component (C), the component (D), the component (E), the component (F) and the thixotropic agent. Examples of the other additives include antioxidants, defoamers, modifiers, matting agents, and foaming agents other than the component (E) and the component (F). The amount of these additives is preferably 0.01% by mass or more and 5% by mass or less relative to 100% by mass of the flux composition. Examples of the other resin include an acrylic resin and polybutadiene.
[ solder composition ]
Next, the solder composition according to the present embodiment will be described. The solder composition of the present embodiment contains the flux composition of the present embodiment described above and (G) solder powder described below.
The amount of the flux composition to be blended is preferably 5% by mass or more and 35% by mass or less, more preferably 7% by mass or more and 18% by mass or less, particularly preferably 8% by mass or more and 15% by mass or less, relative to 100% by mass of the solder composition. When the amount of the flux composition to be blended is less than 5 mass% (when the amount of the solder powder to be blended exceeds 95 mass%), the flux composition as a binder is insufficient, and therefore, it tends to be difficult to mix the flux composition with the solder powder, whereas when the amount of the flux composition to be blended exceeds 35 mass% (when the amount of the solder powder to be blended is less than 65 mass%), it tends to be difficult to form a sufficient solder joint when the obtained solder composition is used.
[ (G) component ]
The solder powder (G) used in the present invention preferably contains only lead-free solder powder, and may be lead-containing solder powder. The solder alloy In the solder powder preferably contains at least 1 selected from tin (Sn), copper (Cu), zinc (Zn), silver (Ag), antimony (Sb), lead (Pb), indium (In), bismuth (Bi), nickel (Ni), gold (Au), cobalt (Co), and germanium (Ge).
As the solder alloy in the solder powder, an alloy containing tin as a main component is preferable. The solder alloy more preferably contains tin, silver, and copper. In addition, the solder alloy may contain at least 1 of antimony, bismuth, and nickel as an additive element. According to the flux composition of the present embodiment, even when a solder alloy containing easily oxidizable additive elements such as antimony, bismuth, and nickel is used, the occurrence of voids can be suppressed.
Here, the lead-free solder powder refers to a powder of a solder metal or alloy to which no lead is added. Wherein lead is allowed to exist as an unavoidable impurity in the lead-free solder powder, in which case the amount of lead is preferably 300 mass ppm or less.
As an alloy system of the lead-free solder powder, specific examples thereof include Sn-Ag-Cu system, sn-Ag system, sn-Bi system, sn-Ag-Cu-Bi system Sn-Ag-Cu-Ni, sn-Ag-Cu-Bi-Sb, sn-Ag-Bi-In, sn-Ag-Cu-Bi-In-Sb, and the like.
(G) The average particle diameter of the component is usually 1 μm or more and 40 μm or less, more preferably 1 μm or more and 35 μm or less, still more preferably 2 μm or more and 35 μm or less, particularly preferably 3 μm or more and 32 μm or less, from the viewpoint of an electronic substrate having a narrow pitch capable of corresponding to the pads. The average particle diameter can be measured by a dynamic light scattering type particle diameter measuring device.
[ method for producing solder composition ]
The solder composition of the present embodiment can be produced by mixing the flux composition described above with the (G) solder powder described above in the above-described given ratio and stirring and mixing.
[ method for manufacturing electronic substrate ]
Next, a method for manufacturing an electronic substrate according to the present embodiment will be described. The method for manufacturing an electronic substrate according to the present embodiment is characterized by using the solder composition described above. According to the method for manufacturing an electronic substrate of the present embodiment, an electronic substrate (a printed wiring substrate or the like) can be manufactured by mounting an electronic component on the electronic substrate using the above solder composition.
The solder composition of the present embodiment described above is excellent in the cleaning property of the flux residue based on the aqueous cleaning agent, and in the solder melting property in the air reflow soldering. Therefore, after the soldering is performed, the flux residue can be easily cleaned by an aqueous cleaning agent.
In the method for manufacturing an electronic substrate according to the present embodiment, first, a solder composition is applied to an electronic substrate by a coating apparatus.
Examples of the coating device used herein include a screen printer, a metal mask printer, a dispenser, and a jet dispenser.
The electronic component may be mounted on the electronic substrate by a reflow process of disposing the electronic component on the solder composition applied by the application device and heating the electronic component under predetermined conditions by a reflow oven to mount the electronic component on the printed wiring substrate.
In the reflow process, the electronic component is placed on the solder composition, and the solder composition is heated in a reflow oven under predetermined conditions. By this reflow process, sufficient solder bonding can be performed between the electronic component and the printed wiring board. As a result, the electronic component can be mounted on the printed wiring board. The gas atmosphere at the time of reflow soldering may be a nitrogen atmosphere, and the solder composition of the present embodiment described above may be performed directly in air because of its excellent solder meltability in air reflow soldering.
The reflow soldering member may be appropriately set according to the melting point of the solder. For example, the preheating temperature is preferably 140 ℃ to 200 ℃, more preferably 150 ℃ to 160 ℃. The preheating time is preferably 60 seconds to 120 seconds. The peak temperature is preferably 230 ℃ to 270 ℃, more preferably 240 ℃ to 255 ℃. The holding time at a temperature of 220 ℃ or higher is preferably 20 seconds or more and 60 seconds or less.
After the reflow process, the flux residue on the electronic substrate is cleaned using an aqueous cleaning agent.
As a method of cleaning, a dipping method, a jet method, or the like can be used.
For example, in the dipping method, the electronic substrate may be dipped in an aqueous cleaning agent. In this case, ultrasonic waves may be applied.
As the aqueous cleaning agent, a known aqueous cleaning agent for flux residue can be used. Here, the aqueous property means that water is the main component (water is 50 mass% or more). As a commercial product, there may be mentioned "VIGON US" manufactured by Zestron Japan company.
The aqueous cleaning agent is used at a temperature of, for example, 30 ℃ to 70 ℃.
The cleaning time is, for example, 1 minute to 10 minutes.
The washing may be performed after the washing using the aqueous cleaning agent. The conditions for washing are not particularly limited, and the washing may be performed with water at 20 ℃ or higher and 50 ℃ or lower for about 0.5 minutes or higher and 5 minutes or lower. In addition, the flushing may be performed 2 times or more.
The solder composition and the electronic substrate according to the present embodiment are not limited to the above embodiments, and modifications, improvements, and the like within a range that can achieve the object of the present invention are included in the present invention.
For example, in the above-described method for manufacturing an electronic substrate, the printed wiring substrate and the electronic component are bonded together by the reflow process, but the method is not limited thereto. For example, instead of the reflow step, a step of heating the solder composition by using a laser (laser heating step) may be used to bond the printed wiring board and the electronic component together. In this case, the laser light source is not particularly limited, and may be appropriately used according to a wavelength suitable for an absorption band of the metal. Examples of the laser light source include solid laser (ruby, glass, YAG, etc.), semiconductor laser (GaAs, inGaAsP, etc.), liquid laser (pigment, etc.), and gasBulk laser (He-Ne, ar, CO) 2 An excimer, etc.).
Examples
The present invention will be described in further detail with reference to examples and comparative examples, but the present invention is not limited to these examples. The materials used in examples and comparative examples are shown below.
Component (A)
Rosin resin a: polymerized rosin, trade name "China polymerized rosin 140", manufactured by Kabushiki Kaisha
Rosin resin B: acrylic acid modified hydrogenated rosin, trade name "PINECRYSTAL KE-604", manufactured by Sonchaka chemical Co., ltd
((B1) component)
1,2, 3-propanetricarboxylic acid: trade name "RIKACID TCR-100", manufactured by Xin Japanese chemical Co., ltd
((B2) component)
Organic acid a: glutaric acid
Organic acid B: isobehenic acid, trade name "IPU-22", organic acid C manufactured by okamuranus oil corporation: dodecanedioic acid
((C) component)
Solvent: diethylene glycol monohexyl ether (DEH, hexyl Diglycol)
((D1) component)
Imidazole compound a: 2-methylimidazole (molecular weight 82.1), trade name "2MZ", manufactured by Kagaku Kogyo Co., ltd
Imidazole compound B: 2-ethylimidazole (molecular weight 86.1), trade name "2EZ", manufactured by Kagaku Kogyo Co., ltd
Imidazole compound C: 2-ethyl-4-methylimidazole (molecular weight 110.2), trade name "2E4MZ", manufactured by Kagaku Kogyo Co., ltd
((D2) component)
Imidazole compound D: 2-undecylimidazole (molecular weight 222.4), trade name "C11Z", manufactured by Kagaku Kogyo Co., ltd.)
Imidazole compound E: 2-heptadecylimidazole (molecular weight 306.5), trade name "C17Z", manufactured by Kagaku Kogyo Co., ltd.)
Imidazole compound F: 2-pentyl-1H-imidazole (molecular weight: 188.3)
((E) component)
Hindered phenol antioxidant: triethylene glycol ether-bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propanoate ] ester, trade name "IRGANOX 245", manufactured by BASF corporation
((F) component)
Hindered amine antioxidant: 1 Compound having 2 structures represented by the general formula (F1-2) in the molecule, [ [3, 5-bis (1, 1-dimethylethyl) -4-hydroxyphenyl ] ethyl ] butylmalonate bis (1, 2, 6-pentamethyl-4-piperidinyl) ester, trade name "Tinuvin PA144", manufactured by BASF corporation
(other Components)
Thixotropic agent A: trade name "SLIPACKS H", manufactured by Japanese chemical Co., ltd
Thixotropic agent B: trade names "HIMAKO", manufactured by KF tracking Co., ltd
Additive A: polybutadiene, trade name "BI-2000", manufactured by Nippon Caddy
Additive B: benzotriazole compounds
((G) component)
Solder powder: the alloy composition is Sn-3.0Ag-0.5Cu, the grain size distribution is 20-38 mu m, and the melting point of the solder is 217-220 DEG C
Example 1
37 mass% of rosin-based resin a, 10 mass% of rosin-based resin B, 2 mass% of 1,2, 3-tricarballylic acid, 34.2 mass% of solvent, 2.5 mass% of imidazole compound a, 2 mass% of hindered phenol antioxidant, 3 mass% of additive a, 0.3 mass% of additive B, 8 mass% of thixotropic agent a, and 1 mass% of thixotropic agent B were put into a container and mixed with a planetary mixer to obtain a flux composition.
Then, 12 mass% of the obtained flux composition and 88 mass% (total of 100 mass%) of the solder powder were charged into a container, and mixed by a planetary mixer, thereby preparing a solder composition.
Examples 2 to 8
Solder compositions were obtained in the same manner as in example 1, except that the respective materials were blended in accordance with the compositions shown in table 1.
Comparative examples 1 to 9
Solder compositions were obtained in the same manner as in example 1, except that the respective materials were blended in accordance with the compositions shown in table 1.
< evaluation of solder composition >
The solder composition was evaluated (solder meltability (air reflow), cleanability, ball between leads, wetting efficacy, copper mirror corrosion, insulation resistance) by the method described below. The results obtained are shown in Table 1.
(1) Solder melting (air reflow soldering)
A substrate on which a chip component was mounted was printed with a solder composition, and a 0603 chip component (size: 0.6 mm. Times.0.3 mm) was mounted, and the solder composition was melted in a reflow oven (manufactured by field manufacturing company) to be soldered, whereby an evaluation substrate was obtained. The reflow conditions were as follows: the preheating temperature was 130 to 180 ℃ (about 190 seconds), the time at 220 ℃ or higher was about 55 seconds, the peak temperature was 243 ℃ and the time to peak temperature was about 250 seconds by air reflow.
Then, the number of unmelted portions was counted for the die-bonding portions of the evaluation substrate, and the solder meltability (air reflow) was evaluated according to the following criteria.
A: the unmelted ratio is less than 30%.
B: the unmelted ratio is 30% or more and less than 50%.
C: the unmelted ratio is 50% or more.
(2) Cleaning property
The solder composition was printed on a substrate on which a chip component was mounted (size: 1.6 mm. Times.0.8 mm), and the chip component was mounted, and the solder composition was melted in a reflow oven (manufactured by Takara Shuzo Co., ltd.) and soldered to obtain a substrate for evaluation. The reflow conditions were the same as those of (1) the reflow soldering member in the solder melting property.
Next, the substrate for evaluation obtained was immersed in a container to which an aqueous cleaning agent (VIGON US, 20% strength, manufactured by Zestron Japan Co., ltd.) was added, and the substrate was cleaned while applying ultrasonic waves (liquid temperature: 60 ℃ C., cleaning time: 5 minutes). Then, after the removal of the liquid by an air knife, the vessel was immersed in pure water at room temperature, and then rinsed 1 st time (rinsing time: 1 to 2 minutes), and further immersed in pure water at 45℃for 2 nd time (rinsing time: 1 to 2 minutes). Then, the liquid was removed by an air gun, and then dried in a hot air drying oven (in-oven temperature: 70 ℃ C.) for 10 minutes.
All chips were removed from the evaluation substrate after cleaning with the aqueous cleaning agent, and the presence or absence of flux residue under the chips and the presence or absence of flux residue beside the chips were observed. Then, the number of chips with flux residue remaining and the ratio (remaining ratio) to the number of all chips were measured, and based on the remaining ratio, the cleanability (under chip, side chip) was evaluated according to the following criteria.
A: the residual ratio is less than 10%.
C: the residual ratio is 20% or more and less than 30%.
D: the residual ratio is 30% or more.
(3) Ball between leads
The solder composition was printed on a substrate using a metal mask having a thickness of 0.08mm, and QFP (Quad Flat Package) was attached to the substrate at a pitch of 0.8mm, and the solder composition was melted in a reflow oven (manufactured by field manufacturing Co., ltd.) and soldered to the substrate, thereby producing a substrate for evaluation. The reflow conditions were the same as those of (1) the reflow soldering member in the solder melting property.
The slit portion of the QFP was observed with a magnifying glass with respect to the obtained evaluation substrate, and the number of solder balls generated between slits was counted. Then, the solder balls were evaluated according to the following criteria.
AA: the number of balls produced per 1 lead is 1 or less on average.
A: the number of ball generation per 1 lead is more than 1 and 5 or less on average.
B: the number of ball generation per 1 lead is more than 5 and 10 or less on average.
C: the average ball production per 1 lead exceeds 10.
(4) Wetting efficacy
The wettability (dewetting) of the solder was tested according to the method described in JIS Z3284 (2014). Specifically, 2 kinds of metal plates A (brass, size: 30 mm. Times.30 mm, thickness: 0.3 mm) and B (42 Alloy (Alloy 42), size: 30 mm. Times.30 mm, thickness: 0.3 mm) were prepared, and polished with a polishing agent, respectively. For this metal plate, a solder composition was printed using a metal mask having a thickness of 0.2mm with circular pattern holes having a diameter of 6.5mm phi, to obtain a test plate. The test plate was subjected to a heat treatment under the same heating conditions as those of the reflow soldering member in (1) solder melting property. The test plate was observed by a microscope, the wet spreading area ratio was measured, and the wetting efficacy (brass, 42 alloy) was evaluated according to the following criteria.
Classification 1: the wet spreading area ratio is 80% or more and 100% or less.
Classification 2: the wet spreading area ratio is 60% or more and less than 80%.
Classification 3: the wet spreading area ratio is 40% or more and less than 60%.
Classification 4: the wet spreading area ratio is 20% or more and less than 40%.
Classification 5: the wet spreading area ratio is 0% or more and less than 20%.
(5) Copper mirror corrosion
Copper corrosion was tested and evaluated based on the method described in IPC TM650 2.3.32D. Then, copper mirror corrosion was evaluated according to the following criteria.
A: there was no peeling of the copper mirror film.
C: peeling off the film with copper mirror.
(6) Insulation resistor
The insulation resistance value of the substrate for evaluation was measured based on the insulation resistance test described in JIS Z3197 (2012). The evaluation substrates were (2) substrates before the test (non-cleaning) and (2) substrates after the test (after the cleaning test), which were the substrates before the test (2) for cleaning. Then, the insulation resistance was evaluated according to the following criteria.
A: insulation resistance value is 1.0X10 10 The above.
B: insulation resistance value is 1.0X10 8 The above and less than 1.0X10 10 。
C: an insulation resistance value of less than 1.0X10 8 。
As is clear from the results shown in Table 1, the solder compositions of the present invention (examples 1 to 8) were excellent in all of the solder meltability (air reflow), cleanability, ball-between-leads, wetting efficiency, copper mirror corrosion, and insulation resistance.
Therefore, it was confirmed that the solder composition according to the present invention was excellent in the cleaning property of the flux residue based on the aqueous cleaning agent and excellent in the solder meltability in the air reflow.
Claims (10)
1. A flux composition comprising (A) a rosin-based resin, (B) an activator, (C) a solvent, and (D) an imidazole compound,
the component (B) contains (B1) 1,2, 3-propanetricarboxylic acid,
the component (D) contains an imidazole compound (D1) having a molecular weight of 70 to 120.
2. The flux composition of claim 1 further comprising (E) a hindered phenolic antioxidant.
3. The flux composition of claim 1 or 2, further comprising (F) a hindered amine antioxidant.
4. The flux composition according to claim 1 or 2, wherein,
the component (A) contains polymerized rosin and hydrogenated acid-modified rosin.
5. The flux composition according to claim 1 or 2, wherein,
the component (D1) is at least 1 selected from the group consisting of 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, and 1, 2-dimethylimidazole.
6. The flux composition according to claim 1 or 2, wherein,
the component (A) is contained in an amount of 30 to 70 mass% based on 100 mass% of the flux composition,
the component (B) is contained in an amount of 0.5 to 12 mass% inclusive relative to 100 mass% of the flux composition,
the amount of the component (C) is 10 to 60 mass% based on 100 mass% of the flux composition,
the amount of the component (D) is 0.5 to 10 mass% based on 100 mass% of the flux composition.
7. A solder composition comprising the flux composition according to any one of claims 1 to 6 and (G) a solder powder.
8. The solder composition according to claim 7, wherein,
the solder alloy in the component (G) contains at least 1 selected from tin, copper, zinc, silver, antimony, lead, indium, bismuth, nickel, gold, cobalt and germanium.
9. A method for manufacturing an electronic substrate by soldering using the solder composition according to claim 7 or 8, comprising:
a step of applying the solder composition on an electronic substrate;
a step of disposing an electronic component on the solder composition;
a step of mounting the electronic component on the electronic substrate by heating the electronic substrate under a predetermined condition in a reflow oven; and
and cleaning the flux residue on the electronic substrate by using an aqueous cleaning agent.
10. The method for manufacturing an electronic substrate according to claim 9, wherein,
the given conditions of the reflow oven are:
the gas atmosphere during reflow soldering is air reflow soldering,
the preheating temperature is 140 ℃ to 200 ℃,
the preheating time is 60 seconds to 120 seconds,
the peak temperature is 230 ℃ to 270 ℃,
the holding time of 220 ℃ or higher is 20 seconds or more and 60 seconds or less.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022-051620 | 2022-03-28 | ||
| JP2023-028579 | 2023-02-27 | ||
| JP2023028579A JP7536926B2 (en) | 2022-03-28 | 2023-02-27 | Flux composition, solder composition, and method for manufacturing electronic board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116810215A true CN116810215A (en) | 2023-09-29 |
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ID=88111606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310267430.9A Pending CN116810215A (en) | 2022-03-28 | 2023-03-20 | Solder composition, and method for manufacturing electronic substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116810215A (en) |
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2023
- 2023-03-20 CN CN202310267430.9A patent/CN116810215A/en active Pending
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