CN116810160A

CN116810160A - Full-automatic wafer laser marking device and method

Info

Publication number: CN116810160A
Application number: CN202310756954.4A
Authority: CN
Inventors: 江建新
Original assignee: Wuhan Lingyun Photoelectronic System Co ltd
Current assignee: Wuhan Lingyun Photoelectronic System Co ltd
Priority date: 2023-06-26
Filing date: 2023-06-26
Publication date: 2023-09-29

Abstract

The invention discloses a full-automatic wafer laser marking device and method, comprising a loading and unloading station, a CCD (charge coupled device) identification system, a carrying system, a wafer carrying platform and a laser marking system; the device also comprises a CCD positioning system and an adjusting mechanism, wherein the P-axis linear module is provided with a hollow rotating platform, the hollow rotating platform comprises 1 wafer carrying platform, and when the rotor part of the hollow rotating platform rotates around the rotating center of the rotor part, the wafer carrying platform and the wafer can be driven to rotate around the rotating center together. The three groups of CCD image collectors are uniformly distributed around the circumference of the rotation center of the rotor part of the hollow rotating platform and are fixed and used for collecting data information of the outer contour (or edge) of the wafer. The invention has the advantages of simple structure, economy, practicability and high degree of automation, can firstly adjust the position of the straight edge of the wafer to the correct position in a CCD visual recognition mode, then calculate the position of the circle center of the wafer, and finally control the vibrating mirror to automatically adjust the laser beam based on the position of the circle center of the wafer so as to realize accurate marking of the wafer.

Description

Full-automatic wafer laser marking device and method

Technical Field

The invention belongs to the technical field of wafer laser marking, and particularly discloses a full-automatic wafer laser marking device and method.

Background

Laser marking is a marking method that uses high energy density laser to locally irradiate a workpiece, so that the surface material is vaporized or undergoes a chemical reaction of color change, thereby leaving a permanent mark. The laser marking can be used for marking various characters, symbols, patterns and the like on the surface of the workpiece, and the character size can be from millimeter to micrometer, so that the laser marking has special significance for tracing inquiry, production classification and anti-counterfeiting marking of products. The laser marking is advanced in that the marking process is non-contact processing, mechanical extrusion or mechanical stress is not generated, and the damage to the processed object is very small. The laser has small focused size, small heat affected zone and fine machining, so that some processes which cannot be realized by the conventional methods can be completed.

The traditional wafer laser marking machine mainly adopts an inductor to detect the reference straight edge of the wafer, if the reference straight edge is not in the correct direction, the position of the wafer is adjusted in a transverse-longitudinal translation-rotation mode in a plane until the position of the wafer is correct, a very complex mechanical structure is required for achieving the purpose, and the operation is complicated, time-consuming and relatively high in cost.

The specification of Chinese patent No. CN104385786A discloses a full-automatic wafer laser marking machine, comprising: the manipulator system is used for taking, placing and transferring the wafer and sending a wafer in-place signal to the CCD system; the CCD system is used for receiving the wafer in-place signal, scanning and processing the real-time image information of the wafer and comprises a CCD positioning system which is used for detecting the position deviation of the wafer and transmitting the deviation signal to the laser marking system; and the laser marking system is used for adjusting the laser beam to mark according to the deviation signal of the CCD positioning system. The CCD system also comprises a CCD identification system for identifying the front and back sides of the wafer and judging whether the front and back side information of the wafer is consistent with the required marking surface information. The wafer overturning system is used for controlling wafer overturning according to signals sent by the CCD identification system. The laser marking system comprises a vibrating mirror for adjusting the position of the laser beam. The invention realizes accurate marking of the wafer by detecting and positioning the characteristic position of the wafer and automatically adjusting the laser beam. Compared with the prior art, the invention does not need a complex mechanical structure of an X-Y-theta platform, and can accurately print on the characteristic position of the wafer only by directly placing the wafer on a common marking platform, and has the advantages of simple structure, convenient operation and lower cost. The technical scheme disclosed by the invention discloses that: the CCD positioning system is used for detecting the position deviation of the wafer and transmitting a deviation signal to the laser marking system; and the laser marking system is used for adjusting the laser beam to mark according to the deviation signal of the CCD positioning system. The laser marking system needs to compensate for X, Y and theta degrees of freedom of the wafer, so that the design requirement on the vibrating mirror structure is high, the laser marking system is usually an outsourcing standard part, and the processing and the transformation of the laser marking system are time-consuming and labor-consuming large projects, so that the technical scheme only has the uneconomic defect of marking by adjusting laser beams according to deviation signals of the CCD positioning system based on the laser marking system.

Further, in the specification of chinese patent No. CN114695226a, a full-automatic wafer backside laser marking device is disclosed, which includes: the mechanical system comprises a frame and a clamp assembly arranged on the frame and used for fixing and leveling a wafer to be marked; the loading and unloading system is used for placing the wafer to be marked and the marked wafer; the manipulator system is used for taking, placing and transferring the wafer to be marked and the marked wafer; the wafer automatic edge searching system is used for carrying out automatic edge searching calibration on the wafer to be marked which is transferred by the manipulator system; and the vision system is used for detecting the wafer to be marked after edge searching calibration to obtain positioning data of the test marking, and measuring the actual marking position to determine whether the actual marking position exceeds the standard. And the double-laser system is used for performing trial marking according to the positioning data, and finishing marking the wafer to be marked when the actual marking position is not out of tolerance. The invention also discloses a full-automatic wafer back laser marking method, which comprises the following steps: the manipulator system grabs a wafer to be marked from a wafer material box on the loading and unloading system and places the wafer to be marked on the wafer automatic edge searching system; carrying out automatic edge searching calibration on a wafer to be marked, and sending a signal to the upper visual detection assembly after the edge searching is finished; the upper visual detection component automatically identifies an edge bar code or WAFER ID of the WAFER to be marked; judging whether the wafer to be marked can be marked, if so, executing the next step; if the marking can not be performed, taking the marking out and putting the marking out into an NG material box; the wafer to be marked is taken and placed on a wafer clamp, the electric rotating assembly drives the wafer to be marked to rotate, and the electric lifting table drives the wafer pressing plate to flatten the wafer to be marked; and the two-dimensional linear platform module drives the visual positioning component to position the feature points on the front surface of the wafer to be marked, so as to obtain positioning data of the test marking. The laser of the laser light path component performs trial marking on the wafer to be marked according to the positioning data; the lower visual detection assembly measures the actual marking position, judges whether the marking position is out of tolerance, and if so, takes the marking position into the NG material box; if the error is not exceeded, continuing to mark; marking all units of the wafer by a laser light path component until marking is completed; the electric lifting assembly drives the wafer pressing plate to loosen the marked wafer, and the mechanical arm system takes and places the marked wafer into the material box. The comparison document discloses: the visual positioning assembly comprises a lifting table base plate, a Z-axis electric platform arranged on the lifting table base plate and a lifting table connecting plate arranged on the Z-axis electric platform, wherein a second CCD assembly is arranged on the lifting table connecting plate through visual installation, and the second CCD assembly is aligned to the front surface of the wafer to be marked. The Z-axis electric platform drives the lifting platform connecting plate to move, so that the second CCD assembly is driven to move, the second CCD assembly is convenient to grasp the feature points on the front surface of the wafer to be marked, and reliable positioning data can be obtained. It should be noted that the reference document has only one second CCD element, and although the feature points on the front surface of the wafer can be obtained, the precondition that the laser marking is achieved only by the feature points on the front surface of the wafer obtained by the one second CCD element is that: the laser marking system needs to compensate for X, Y and theta degrees of freedom of a wafer, so that the design requirement on a vibrating mirror structure is high, the laser marking system is usually an outsourcing standard part, and the processing and the transformation of the laser marking system are time-consuming and labor-consuming large projects, so that the technical scheme has the disadvantage that the laser marking system only adjusts laser beams to mark according to deviation signals of a CCD positioning system, and is uneconomical.

Further, the specification of chinese patent No. CN204504509U discloses a laser marking machine for marking wafers, which is characterized in that: including marking machine body, holding in control module in the marking machine body, install in feeding structure subassembly, angle correction structure subassembly, marking position detection subassembly, install in on the marking machine body and with marking position detection subassembly mutually supporting laser marking mechanism, laser marking mechanism including install in laser generator on the marking machine body, install in the light path structure that is used for carrying out the laser that laser generator sent, install in on the light path structure be used for right the wafer is beaten the mark head of marking, angle correction structure subassembly can be for marking machine body along X axle round trip movement and circumference rotation, marking position detection subassembly including be used for detecting the wafer beat the mark location detection mechanism and with the corresponding laser marking bearing structure that is used for placing the wafer of waiting to beat the mark, beat the mark structure install in on the marking machine body, the light path structure is including being used for carrying out laser beam, to beat the laser beam to carry out the correction mirror, can be used for correcting the angle correction mirror, be located the laser beam correction mirror, can be used for correcting the wafer and the angle correction mirror is beaten the laser beam on the wafer transmission mirror. In the utility model, a wafer to be marked is placed on an angle correction platform by a clamping structure, the angle of the wafer to be marked is corrected by a second CCD detection structure, then the wafer with the corrected angle is clamped by the clamping structure and placed on a marking table, the wafer is pressed by a pressing plate, the marking position of the wafer is detected by a first CCD detection structure on a linear motion mechanism and is transmitted to a control component, the position data of the wafer is transmitted to a marking head by the control component, and the wafer is marked by the marking head. The method is characterized in that a wafer which is rotated by combining a second CCD detection structure with an angle correction component is transferred to a marking table, then a first CCD detection structure on the marking table detects the marking position of the wafer and transmits the marking position to a control component, the control component transmits the position data of the wafer to a marking head, so that the problem of offset still possibly exists due to errors of a manipulator in the transferring process, and meanwhile, the comparison file is provided with only one first CCD detection structure, although the feature point of the front surface of the wafer can be obtained, the premise that the laser marking is realized only by the feature point of the front surface of the wafer which is obtained by the one first CCD detection structure is that: the laser marking system needs to compensate for X, Y and theta degrees of freedom of a wafer, so that the design requirement on a vibrating mirror structure is high, the laser marking system is usually an outsourcing standard part, and the processing and the transformation of the laser marking system are time-consuming and labor-consuming large projects, so that the technical scheme has the disadvantage that the laser marking system only adjusts laser beams to mark according to deviation signals of a CCD positioning system, and is uneconomical.

Disclosure of Invention

Aiming at the technical problems in the prior art, the invention provides a full-automatic wafer laser marking device which is simple in structure, economical, practical and high in automation degree, the position of the straight edge of a wafer can be adjusted to the correct position firstly by a CCD visual identification mode, then the position of the circle center of the wafer is calculated, and finally the laser beam is automatically adjusted by controlling a galvanometer based on the position of the circle center of the wafer, so that the accurate marking of the wafer is realized. Compared with the prior art, the invention can accurately mark the wafer by a mechanical structure with simple structure and convenient operation without a very complex mechanical mechanism.

The invention discloses a full-automatic wafer laser marking device, which comprises an upper blanking station and a lower blanking station, wherein the upper blanking station is used for placing and positioning a wafer material box; the CCD recognition system is used for controlling the carrying system to acquire the wafer from the wafer material box; the conveying system is used for conveying the wafer to the wafer carrying platform; the wafer carrier is used for carrying the wafer; the laser marking system is used for marking the wafer positioned on the wafer carrier by adjusting the laser beam through the galvanometer mechanism; the system also comprises a CCD positioning system, which comprises a CCD image collector for acquiring the straight-edge coordinate parameters of the wafer positioned on the wafer carrier and two CCD image collectors for acquiring the arc coordinate parameters of the wafer positioned on the wafer carrier, wherein the three CCD image collectors are uniformly arranged relative to the Z axis; the adjusting mechanism comprises a P-axis linear module arranged between the CCD positioning system and the laser marking system, a hollow rotating platform capable of rotating around a Z axis is arranged on the P-axis linear module, a wafer carrying platform is fixed on a rotor part of the hollow rotating platform, the wafer carrying platform can bear and absorb wafers, when the rotor part of the hollow rotating platform rotates around the rotating center of the rotor part, the wafer carrying platform and the wafers can be driven to rotate around the rotating center together, three groups of CCD image collectors are uniformly distributed around the rotating center circumference of the rotor part of the hollow rotating platform and are fixed and used for collecting data information of the outer contour (or edge) of the wafers, the connecting lines of two end points of the wafer straight edge on the wafer carrying platform and the center of the hollow rotating platform are equal, namely, the connecting lines of the two end points of the wafer straight edge of the wafers and the center three of the hollow rotating platform are isosceles triangles, the wafer straight edge of the wafers forms a virtual circle, and the positions of the strings can be adjusted, and the strings are ensured to be parallel to or coincide with the predefined theoretical straight edge of the wafers. In the invention, only one wafer is placed in each marking, and the wafer carrier is fastened on the rotor part of the hollow rotary platform through the screws. Three groups of light source lamps are fixed on the periphery of the hollow rotary platform, and the light source lamps are in one-to-one correspondence with three CCD image collectors in the CCD positioning system, so that environmental conditions are provided for the work of the CCD image collectors. The other idea is to directly adopt an annular light source lamp, the center of the annular light source lamp is hollow, and the wafer carrier can pass through the annular light source lamp, so that the effect is the same as that of using three square light source lamps, and the environment condition is provided for the work of the CCD image collector.

In a preferred embodiment of the present invention, the working steps of the CCD positioning system after the wafer is transferred to the wafer stage by the handling system include

S1, a CCD image collector photographs the wafer to obtain the straight-edge coordinate parameters of the wafer, and judges whether the preset requirements are met or not, wherein the preset requirements are as follows: the wafer straight edge is parallel or coincident with the predefined theoretical wafer straight edge, if the requirements are not met, the position deviation information of the coordinate parameters of the wafer straight edge and the predefined theoretical wafer straight edge is transmitted to an adjusting mechanism, and the adjusting mechanism rotates by a corresponding angle to realize the parallel or coincident of the wafer straight edge and the predefined theoretical wafer straight edge;

s2, simultaneously photographing the wafer again by the three CCD image collectors to obtain coordinate information of the wafer edge in the visual field corresponding to each CCD image collector, analyzing and obtaining the actual circle center coordinate of the wafer, and sending the obtained actual circle center coordinate of the wafer to a laser marking system;

s3, the P-axis linear module translates the hollow rotary platform, the wafer carrying platform and the wafer to the laser marking system, the galvanometer mechanism of the laser marking system corrects the deviation based on the actual circle center coordinates of the wafer, performs laser marking action, and outputs marking content to the correct position on the wafer.

In a preferred embodiment of the invention, the loading and unloading station comprises a bearing platform A, wherein a limiting sink groove capable of compatibly positioning a plurality of size material box jig plates is arranged on the bearing platform A, and a rectangular light source is fixedly connected beside the bearing platform A.

In a preferred embodiment of the invention, the handling system comprises a multi-axis motion unit, the moving end of which is provided with a vacuum suction finger and a CCD recognition system comprising a CCD image collector a.

In a preferred embodiment of the invention, the moving end of the multi-axis motion unit is provided with an anti-collision buffer alarm mechanism, the anti-collision buffer alarm mechanism comprises a base plate fixedly connected with the moving end of the multi-axis motion unit, the base plate is connected with a finger support plate through a rotating shaft, the finger support plate is fixedly connected with a finger cover plate through a threaded connection, the vacuum adsorption finger is pressed between the finger support plate and the finger cover plate, and a tension spring is connected between the finger support plate and the base plate.

In a preferred embodiment of the invention, the upper end surface of the base plate is provided with a groove which is perpendicular to the central axis of the rotating shaft, the lower end surface of the finger support plate is provided with an epitaxial cylinder platform, and the diameter of the cylinder platform corresponds to the width of the groove; the finger support plate is characterized in that the upper end face of the finger support plate is provided with a sinking groove feature for positioning a vacuum adsorption finger, the lower end face of the finger cover plate is provided with a boss feature for sinking groove matching, the groove depth of the sinking groove feature is larger than the height of the boss feature, the groove bottom of the sinking groove feature and the end face of the boss feature are provided with sealing gaskets, and the upper end face of the finger cover plate is provided with a pneumatic connector and a proximity sensor.

In a preferred embodiment of the present invention, the CCD positioning system includes a CCD mounting plate, and the CCD mounting plate is connected to 3 CCD mounting brackets B, and an included angle of any 2 CCD mounting brackets B is 120 °, and each CCD mounting bracket B is connected to a CCD image collector B extending along the Z axis.

In a preferred embodiment of the invention, the device further comprises a compressed air system, wherein the compressed air system comprises a hand slide valve, an air filter, an oil mist separator and a pressure reducing valve which are sequentially connected in series, the hand slide valve is communicated with an air source through a pipe joint and a hose, and the pressure reducing valve is communicated with a first vacuum generator positioned in the conveying system and a second vacuum generator positioned in the adjusting mechanism through the pipe joint and the hose.

In a preferred embodiment of the invention, the dust extraction and purification system further comprises a dust extraction and purification system, wherein the dust extraction and purification system comprises a dust extraction cover, the dust extraction cover is a sheet metal part in a horn mouth shape, one end of the dust extraction cover is connected with a nonmetal corrugated pipe in a sealing way, the other end of the dust extraction cover is connected with external independent purification equipment or a negative pressure dust removal pipeline of a production area, the dust extraction cover is connected with a dust extraction support with adjustable upper and lower heights, and the dust extraction support is fixed through a support mounting plate.

The invention also discloses a full-automatic wafer laser marking method, which uses a full-automatic wafer laser marking device to mark a wafer with a straight edge, and comprises the following steps:

s1, placing a wafer material box on a material box jig plate of an upper and lower material loading station;

s2, the conveying system acts, the CCD recognition system is moved to a proper position, the position information of each layer of wafers in the wafer material box is recognized, a plurality of pieces of wafers are processed, and the information record of the material shortage layer is archived and fed back to the conveying system.

S3, the carrying system acts to drive the vacuum adsorption fingers to go to the feeding station for wafer taking, and after successful adsorption, the first vacuum generator sends a completion signal to the carrying system;

s4: the carrying system acts to transfer the wafer to the wafer carrying platform, the first vacuum generator breaks vacuum, the vacuum adsorption fingers are separated from the wafer, the second vacuum generator sucks vacuum, and after the wafer carrying platform successfully adsorbs the wafer, the second vacuum generator sends a completion signal to the CCD positioning system;

s5, acquiring the position information of the straight edge of the wafer by a CCD image acquisition device B, comparing the position information with the position of the straight edge of the predefined theoretical wafer, and judging whether the preset requirement is met or not, wherein the preset requirement is as follows: the straight edge of the wafer is parallel to or coincides with the straight edge of the predefined theoretical wafer, and if the requirement is not met, the position deviation information of the coordinate parameters of the straight edge of the wafer and the straight edge of the predefined theoretical wafer is sent to an adjusting mechanism;

And S6, after receiving the deviation information of the straight edge position of the wafer sent by the CCD positioning system, the adjusting mechanism starts the hollow rotating platform to rotate by a small angle to adjust the straight edge position of the wafer.

S7, continuously acquiring the position information of the straight edge of the wafer by using the CCD image acquisition device B, analyzing, judging and judging that the actual direction of the straight edge of the wafer is coincident with or parallel to the predefined direction, and repeating the S6 until the actual direction of the straight edge of the wafer is coincident with or parallel to the predefined direction;

s8, three CCD image collectors B collect the arc position information of the wafer at the same time, calculate the actual circle center position of the wafer, and send the circle center position to a laser marking system;

s9, the P-axis linear module in the adjusting mechanism acts to transfer the wafer from the CCD positioning station to the laser marking station;

s10, after the wafer is transferred to a laser marking station, a laser marking system performs galvanometer deviation correction according to the actual circle center position of the wafer sent by a CCD positioning system, performs laser marking action, and outputs marking content to the correct position on the wafer;

s11, after laser marking is completed, the carrying system acts, the vacuum adsorption fingers are moved to a marking station to take the wafer, the second vacuum generator breaks vacuum, the wafer is separated from the wafer carrying platform, meanwhile, the first vacuum generator sucks vacuum, the vacuum adsorption fingers adsorb the wafer, and then the carrying system acts, and the wafer is moved from the marking work to the current material taking layer of the wafer material box;

S12, according to the material shortage position information recorded by the CCD identification system, automatically skipping a material shortage layer, sequentially taking wafers from the next layer, and repeatedly executing the steps 3 to 12 until all the wafers are marked;

s13, returning the conveying system to a safe position;

s14, removing the wafer material box and the marked wafer from the material box jig plate of the loading and unloading work station

The beneficial effects of the invention are as follows: the invention not only can realize that wafer products with various sizes can be subjected to full-automatic laser marking on one set of device through the design of the material box jig plate, but also has strong practicability; meanwhile, a CCD positioning system and an adjusting mechanism are creatively introduced, the position of the straight edge of the wafer is firstly adjusted to the correct position in a CCD visual recognition mode, then the position of the circle center of the wafer is calculated in a CCD visual recognition mode, finally, a vibrating mirror is controlled to automatically adjust a laser beam, so that the wafer is accurately marked, and compared with the prior art disclosed in the background art, the adjusting mechanism can accurately position the wafer only by controlling the rotation angle of the hollow rotating platform by 1 degree of freedom; furthermore, the invention also discloses an anti-collision buffer alarm mechanism which effectively solves the problem that vacuum adsorption fingers and wafers are damaged due to faults or misoperation.

Drawings

FIG. 1 is a schematic view of a wafer processed by a fully automatic wafer laser marking apparatus according to the present invention;

FIG. 2 is a front isometric view of a fully automatic wafer laser marking apparatus according to the present invention;

FIG. 3 is a rear isometric view of a fully automatic wafer laser marking apparatus of the present invention;

FIG. 4 is a top view of a fully automated wafer laser marking apparatus according to the present invention;

FIG. 5 is an isometric view of a loading and unloading station of a fully automatic wafer laser marking apparatus according to the present invention;

FIG. 6 is an isometric view of a CCD identification system of a fully automatic wafer laser marking device according to the present invention;

FIG. 7 is an isometric view of a handling system of a fully automated wafer laser marking apparatus according to the present invention;

FIG. 8 is an isometric view of an anti-collision buffer alarm mechanism of a fully automatic wafer laser marking device of the present invention;

FIG. 9 is a schematic diagram of an anti-collision buffer alarm mechanism of a full-automatic wafer laser marking device according to the present invention;

FIG. 10 is an isometric view of a CCD positioning system of a fully automatic wafer laser marking device according to the present invention;

FIG. 11 is an isometric view of an adjustment mechanism of a fully automatic wafer laser marking apparatus according to the present invention;

FIG. 12 is an isometric cross-sectional view of an adjustment mechanism of a fully automatic wafer laser marking apparatus according to the present invention;

FIG. 13 is an isometric view of a laser marking system of a fully automated wafer laser marking apparatus of the present invention;

FIG. 14 is a schematic diagram of a compressed air system of a fully automated laser marking apparatus for wafers according to the present invention;

FIG. 15 is a schematic diagram of a dust extraction and purification system of a fully automated laser marking apparatus for wafers according to the present invention;

FIG. 16 is a schematic view of a magazine jig plate of a full-automatic wafer laser marking apparatus according to the present invention;

FIG. 17 is a schematic diagram of the present invention without wafer conditioning;

FIG. 18 is a schematic view of a 1 st embodiment of the invention in which a wafer is rotated;

FIG. 19 is a schematic view of a 2 nd embodiment of the invention requiring rotation of a wafer;

FIG. 20 is a schematic view of a 3 rd wafer requiring rotation adjustment according to the present invention;

in the figure, a 10-loading and unloading station and a 101-wafer material box are shown; 102-a material box jig plate, 103-a bearing platform A, 20-a CCD identification system, 201-a CCD image collector A, 202-a CCD mounting bracket A, 203-a rectangular light source, 204-a rectangular light source mounting plate, 30-a carrying system, 301-an X-axis linear module, 302-a Y-axis linear module, 303-a Z-axis linear module, 304-an anti-collision buffer alarm mechanism, 305-a vacuum adsorption finger, 40-a CCD positioning system, 401-a CCD image collector B (with the number of B1/B2/B3), 402-a CCD mounting bracket B, 403-a CCD mounting plate, 404-a square light source, 405-a square light source mounting plate, 406-a sheet metal bracket and 50-an adjusting mechanism, 501-P axis straight line module, 502-hollow rotary flat 503-wafer carrier, 504-fluid slip ring, 505-wafer carrier mounting seat, 60-laser marking system, 601-field lens, 602-vibrating lens, 603-light path module, 604-lifting slip table, 605 carrying platform B, 606-laser, 70-compressed air system, 701-hand slide valve, 702-air filter, 703-oil mist separator, 704-pressure reducing valve, 705-pipe joint and hose, 706-first vacuum generator, 707-second vacuum generator, 80-dust extraction purifying system, 801-dust hood, 802-nonmetal corrugated pipe, 803-dust absorption bracket, 804-bracket mounting plate.

Description of the embodiments

The following describes the invention in further detail, including preferred embodiments, by way of the accompanying drawings and by way of examples of some alternative embodiments of the invention. It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to fall within the scope of the invention.

As shown in FIGS. 1-6, the invention discloses a full-automatic wafer laser marking device, which comprises

The loading and unloading station 10 is used for placing and positioning the wafer material box, sending a material to the conveying system to a material position signal for the conveying system to take out the original unlabeled wafer product from the wafer material box and put in the labeled wafer product. The device mainly comprises a wafer material box and a material box jig, wherein limit sinking grooves (used for placing and positioning the wafer material box) with different shapes (compatible with the design of the wafer material box with different sizes) and a bearing platform A (used for supporting the wafer material box jig and other parts) are arranged on the material box jig;

the CCD recognition system 20 is used for recognizing which layer of the wafer material box is in shortage, archiving the information record of the shortage layer and feeding back to the conveying system, guiding the conveying system to take materials from the wafer material box, and automatically skipping when the shortage layer is executed. The device mainly comprises a group of CCD image collectors, a CCD mounting seat, a rectangular light source, a backlight source provided by a CCD identification system and a rectangular light source mounting plate;

And a handling system 30 for picking, placing and transferring wafers. The device mainly comprises a X, Y, Z axis linear module which is used for translational movement in three directions when the wafer is taken and placed; the anti-collision buffer alarm mechanism is used for solving the problem of collision, breakage and damage of vacuum adsorption fingers and wafers caused by faults or misoperation; vacuum adsorbing fingers, wherein ventilation slots are arranged in the vacuum adsorbing fingers and used for supporting wafers during carrying actions;

a wafer carrier 503 for carrying a wafer;

the laser marking system 60 is used for marking the wafer on the wafer carrier by adjusting the laser beam through the galvanometer mechanism;

and also comprises

The CCD positioning system 40 is used for collecting the position information of the wafer edge, feeding back the position information to the adjusting mechanism, adjusting the direction of the wafer straight edge to be consistent with (coincident with or parallel to) the preset direction with the aid of the adjusting mechanism, and finally analyzing and calculating the actual circle center position of the wafer. The device mainly comprises three groups of CCD image collectors, a CCD mounting bracket, a CCD mounting plate, a square light source mounting plate and a metal plate bracket;

an adjusting mechanism 50; after receiving the position information of the straight edge of the wafer, the hollow rotary platform acts to rotate at a small angle, the direction of the straight edge of the wafer is adjusted until the straight edge of the wafer is positioned in the correct direction, then the wafer is moved to a marking station from a CCD positioning work position through a P-axis linear module, and a moving-in-place signal is sent to a laser marking system. The device mainly comprises a P-axis linear module which is used for the translation motion of the wafer between a CCD positioning station and a marking station; the hollow rotating platform is used for rotating and adjusting the position of the wafer; the wafer carrier is used for supporting the wafer to position and mark; the fluid slip ring is used for communicating compressed air with the wafer carrier; wafer carrier mount.

The CCD positioning system 40 comprises a CCD image collector B for acquiring the straight-edge coordinate parameters of a wafer positioned on the wafer carrier 503 and two CCD image collectors B for acquiring the arc coordinate parameters of the wafer positioned on the wafer carrier 503, wherein the three CCD image collectors B are uniformly arranged relative to the Z axis;

the adjusting mechanism 50 comprises a P-axis linear module 501 arranged between the CCD positioning system 40 and the laser marking system 60, wherein a hollow rotating platform 502 capable of rotating around a Z axis is arranged on the P-axis linear module 501, 1 wafer carrying platform 503 is arranged on the hollow rotating platform 502, the wafer carrying platform 503 can bear and adsorb wafers, when a rotor part of the hollow rotating platform 502 rotates around the rotating center, the wafer carrying platform 503 and the wafers can be driven to rotate around the rotating center together, three groups of CCD image collectors B are uniformly distributed around the rotating center circumference of the rotor part of the hollow rotating platform and are fixed, and are used for collecting data information of the outer contour (or edge) of the wafers, and two end points of the wafer straight edge of the wafers on the wafer carrying platform 503 are equal to the connecting line of the center of the hollow rotating platform 502. Only one wafer is placed in each marking, and the wafer carrier is fastened on the rotor part of the hollow rotary platform through screws. Three groups of light source lamps are fixed on the periphery of the hollow rotary platform, and the light source lamps are in one-to-one correspondence with three CCD image collectors in the CCD positioning system, so that environmental conditions are provided for the work of the CCD image collectors. (the other thinking is that an annular light source lamp is adopted, the center of the annular light source lamp is hollow, and the wafer carrier can pass through the annular light source lamp, so that the effect is the same as that of using three square light source lamps, and the environment condition is provided for the work of the CCD image collector.

And the laser marking system 60 receives the actual circle center position information of the wafer sent by the CCD positioning system, and combines the predefined relative position deviation between marking content and the straight edge of the theoretical wafer, and the galvanometer mechanism automatically corrects the deviation and adjusts the laser beam to mark. Mainly comprises a field lens; vibrating mirror; an optical path module; lifting the sliding table; a bearing platform B; a laser.

Compressed air system 70: is used for generating vacuum adsorption force for adsorbing the wafer by the finger and the wafer carrier. Mainly comprises a hand slide valve; an air filter; an oil mist separator; a pressure reducing valve; a plurality of pipe joints and hoses; a vacuum generator 1 for providing a vacuum suction force to the vacuum suction finger; and an air generator 2 for providing vacuum adsorption force to the wafer stage.

Dust extraction purification system 80: the device is used for purifying smoke dust generated in the laser marking process and avoiding the smoke dust from polluting the wafer and the working environment. Mainly comprises a dust extraction cover; a non-metallic bellows; a dust collection bracket; bracket mounting plate

The method for acquiring the wafer parameters based on the CCD positioning system 40 comprises the following steps: three groups of CCD image collectors B (respectively given with numbers B1/B2/B3) in the CCD positioning system construct a coordinate system according to the installation position of the actual mechanical part, wherein B1 is used for acquiring the straight-edge direction parameters of the wafer, and B2/B3 is used for acquiring the arc parameters of the wafer in the corresponding direction of the wafer. Firstly, when a wafer is placed on a wafer carrying platform 503 of a CCD positioning station, a CCD image collector B1 starts photographing for the first time to obtain a wafer edge coordinate parameter, judges whether the straight edge of the wafer is consistent with the straight edge direction of a set standard state, if not, the position deviation information is transmitted to an adjusting mechanism, then the hollow rotating platform rotates at a small angle, after the rotation is completed, the CCD image collector B1 photographs for the second time to obtain the wafer edge coordinate parameter, and judges whether the straight edge of the wafer is consistent with the straight edge direction of the set standard state again, if not, the hollow rotating platform continues rotating at a small angle, and reciprocates until the direction of the straight edge of the wafer is consistent with the straight edge direction of the set standard state (straight edge is coincident or parallel). When the straight edge of the wafer reaches the required state, the three groups of CCD image collectors B (B1/B2/B3) start photographing, obtain coordinate information of the wafer edge in the respective fields, analyze and calculate the center coordinates of the actual wafer.

The method how the CCD positioning system and the adjusting mechanism are combined to realize the adjustment of the wafer is as follows: the CCD positioning system realizes the direction adjustment of the straight edge of the wafer under the assistance of the hollow rotary platform of the adjusting mechanism until the position requirement is met. And the CCD positioning system sends the coordinate information of the wafer center to the laser marking system, and meanwhile, the P-axis linear module of the adjusting mechanism acts to transfer the wafer from the CCD recognition station to the laser marking station. After the laser marking system receives the wafer center position obtained by the CCD positioning system, the marking content is actually corrected relative to the wafer center positioning position through the correction function of the galvanometer mechanism, so that the marking content can be ensured to be output at the correct position.

Preferably, the working steps of the CCD positioning system 40 after the wafer is transferred to the wafer stage 503 by the handling system 30 include

S1, a CCD image collector B shoots the wafer to obtain the wafer straight-edge coordinate parameters of the wafer, and judges whether the preset requirements are met or not, wherein the preset requirements are as follows: the straight edge of the wafer is parallel or coincident with the straight edge of the predefined theoretical wafer, if the requirement is not met, the position deviation information of the coordinate parameters of the straight edge of the wafer and the straight edge of the predefined theoretical wafer is transmitted to the adjusting mechanism 50, and the adjusting mechanism 50 rotates by a corresponding angle to realize the parallel or coincident of the straight edge and the straight edge of the predefined theoretical wafer;

S2, simultaneously photographing the wafer again by the three CCD image collectors B to obtain coordinate information of the wafer edge in the visual field corresponding to each CCD image collector B, analyzing and obtaining the actual circle center coordinate of the wafer, and sending the obtained actual circle center coordinate of the wafer to the laser marking system 60;

s3, the P-axis linear module 501 translates the hollow rotary platform 502 to the laser marking system 60, and the galvanometer mechanism of the laser marking system 60 corrects the deviation based on the actual circle center coordinates of the wafer, performs laser marking action, and outputs marking content to the correct position on the wafer.

17-20, various conditions of wafer rotation adjustment are disclosed:

in fig. 17, the initial state of the wafer is consistent with the ideal state of the wafer, so that the wafer can be directly marked without adjustment;

in fig. 18, the wafer initial state and the wafer ideal state are related as follows: the theoretical wafer center position of the wafer center is not coincident, but the straight edge of the wafer is parallel to the theoretical straight edge, so that the wafer needs to rotate around the center of the wafer carrier, and marking is carried out;

in fig. 19, the wafer initial state and the wafer ideal state are related as follows: the wafer center theory has the advantages that the wafer center positions coincide, but the straight sides are not parallel, so that the wafer does not need to rotate around the center of the wafer carrier, only the actual circle center positions of the wafer are identified and obtained, and marking is carried out;

In fig. 20, the wafer initial state and the wafer ideal state are related as follows: the theoretical wafer center position of the wafer center is not coincident, and the wafer straight edge is not parallel to the theoretical straight edge, so that the wafer needs to rotate around the center of the wafer carrier for a certain angle to analyze and judge whether the wafer is parallel to the theoretical wafer straight edge, the second step is shown to be that the wafer is not parallel after rotating, and the wafer needs to rotate around the center of the wafer carrier again for a certain angle to ensure that 2 straight edges are parallel, and marking is carried out.

Preferably, the loading and unloading station 10 comprises a bearing platform A103, a limiting sink groove capable of compatibly positioning the material box jig plates 102 with various sizes is arranged on the bearing platform A103, a rectangular light source 203 is fixedly connected beside the bearing platform A103, as shown in FIG. 16, the limiting sink groove with different shapes can be compatible with the positioning installation of the 4 inch/5 inch/6 inch wafer material boxes, and a rectangular light source installation plate 204 is installed at a proper distance on the back of the wafer material box 101 and used for fixing the rectangular light source 203. The rectangular light source 203 provides a backlight illumination function for the CCD recognition system 20 in the process of providing the wafer material box 101, and assists the CCD image collector A201 in recognizing the wafer. The rectangular light source mounting plate is provided with an adjustable hole site, so that the position of the rectangular light source 203 can be conveniently adjusted.

Preferably, the handling system 30 comprises a multi-axis motion unit, the moving end of which is provided with a vacuum suction finger 305 and a CCD recognition system 20, and the CCD recognition system 20 comprises a CCD image collector a201.

Preferably, the multi-axis motion unit comprises an X-axis linear module 301, a Y-axis linear module 302 and a Z-axis linear module 303, and the X-axis linear module 301, the Y-axis linear module 302, the Z-axis linear module 303 and the P-axis linear module 501 are all high-precision dustproof linear modules with servo motors, so that the pollution to the working environment is avoided. The X/Y/Z/P indication azimuth mark is used for distinguishing the action direction of the sliding table on the linear module. The anti-collision buffer alarm mechanism 304 is installed on the sliding table of the Y-axis linear module 302 in a pin positioning screw locking mode. The anti-collision buffer alarm mechanism 304 is provided with extension springs on two sides, so that the functions of preventing wafers from being crashed and sending alarm signals and controlling the Z-axis linear module to stop in time can be realized. The vacuum adsorption finger 305 is provided with a tiny annular air groove, and the inside of the vacuum adsorption finger is provided with a vent hole, so that compressed air can be guided from the head end to the tail end for adsorbing and supporting a wafer. The second vacuum generator 707 is connected to the anti-collision buffer alarm mechanism 304 through an air pipe and a pipe joint, and an air inlet hole at the head end of the vacuum adsorption finger 305 is connected with the anti-collision buffer alarm mechanism 304 in a sealing way to prevent air leakage. The surface of vacuum chuck finger 305 is coated with a conductive teflon material to release static electricity that may be generated on the wafer. When the vacuum chuck finger 305 collides with the wafer stage 503 due to malfunction, the finger rest 30404, the finger cover plate 3009 and the vacuum chuck finger deflect, the tension spring 30403 is further elongated, the distance between the proximity sensor 3041 and the base plate 30401 increases, and then an alarm signal is output to the conveying system 30 to stop the motion of the Z-axis linear module 303, so as to prevent the vacuum chuck finger 305 from breaking due to hard impact and damaging the wafer. After the reset operation, the finger rest 30404, the finger cover plate 3009, the vacuum suction finger 305 and the proximity sensor 3041 can be returned to the original state under the action of the tension spring 30403, and the alarm signal is released.

Preferably, the moving end of the multi-axis motion unit is provided with an anti-collision buffer alarm mechanism 304, the anti-collision buffer alarm mechanism 304 comprises a base plate 30101 fixedly connected to the moving end of the multi-axis motion unit, a finger support plate 30404 is connected to the base plate 30101 through a rotating shaft 30406, a finger cover plate 3009 is fixedly connected to the finger support plate 30404 through a threaded connection, a vacuum adsorption finger 305 is in pressure contact between the finger support plate 30404 and the finger cover plate 3009, and a tension spring 30503 is connected between the finger support plate 30404 and the base plate 30101.

Preferably, the upper end surface of the base plate 30101 is provided with a groove which is arranged perpendicular to the central axis of the rotary shaft 30406, the lower end surface of the finger rest 30404 is provided with an epitaxial cylinder table, and the diameter of the cylinder table corresponds to the width of the groove; the upper end face of the finger supporting plate 30404 is provided with a sinking groove feature for positioning the vacuum adsorption finger 305, the lower end face of the finger cover plate 3009 is provided with a boss feature for sinking groove matching, the groove depth of the sinking groove feature is larger than the height of the boss feature, sealing gaskets are arranged on the groove bottom of the sinking groove feature and the end face of the boss feature, and the upper end face of the finger cover plate 3009 is provided with a pneumatic connector 30410 and a proximity sensor 3041.

Specifically, the base plate 30401 is provided with a groove, the width of which is matched with the diameter of the cylinder at the bottom of the finger support plate 30404 to form a small clearance fit, and the groove is used for limiting the left-right movement of the finger support plate when the finger support plate rotates around 30404 and can only move vertically along the groove. The top of the finger supporting plate 30404 is provided with a sinking groove, the lower part of the finger cover plate 3009 is provided with a protruding block, the protruding block and the sinking groove are fixed through a locating pin and a screw, and a certain space is reserved between the protruding block and the sinking groove and used for clamping the vacuum adsorption finger 305. The vacuum suction finger 305 is provided with a sealing gasket between the finger cover plate 3009 and the finger rest 30404, ensuring good airway sealing. The top of the finger cover plate 3009 is provided with a threaded interface for installing a pneumatic connector 30410 to achieve compressed air input. The base plate 30401 and the finger rest 30404 are provided with support posts 30402 for the extension spring at corresponding positions on both sides thereof, and are provided with the extension spring 30403. The finger rest 30404 and the finger cover plate 3009 are provided with through round holes, so that the proximity sensor 3041 can be conveniently locked and installed by means of a thin hexagon nut. The sensing side of the proximity sensor 3041 is close to the top surface of the base plate 30401.

Under normal working conditions, the cylinder at the bottom of the finger supporting plate 30104 is attached to the groove of the base plate 30401, the stretching spring 30403 is in a pre-stretching state, the vacuum adsorption finger 305 is normally available and cannot deflect, the distance between the proximity sensor 3041 and the base plate is within a set induction range, and an alarm signal cannot be output.

When the vacuum chuck finger 305 collides with the wafer stage 503 due to malfunction, the finger rest 30404, the finger cover plate 3009 and the vacuum chuck finger 305 deflect, the tension spring 30403 is further elongated, the distance between the proximity sensor 3041 and the base plate 30401 increases, and then an alarm signal is output to the conveying system 30 to stop the motion of the Z-axis linear module 303, so as to prevent the vacuum chuck finger 305 from breaking due to hard impact and damaging the wafer. After the reset operation, the finger rest 30404, the finger cover plate 3009, the vacuum suction finger 305 and the proximity sensor 3041 can be returned to the original state under the action of the tension spring 30403, and the alarm signal is released.

Preferably, the CCD positioning system 40 comprises a CCD mounting plate 403, wherein the CCD mounting plate 403 is connected with 3 CCD mounting brackets B402, the included angle of any 2 CCD mounting brackets B402 is 120 degrees, and each CCD mounting bracket B402 is connected with a CCD image collector B extending along the Z axis.

Preferably, the system further comprises a compressed air system 70, wherein the compressed air system 70 comprises a hand slide valve 701, an air filter 702, an oil mist separator 703 and a pressure reducing valve 704 which are sequentially connected in series, the hand slide valve 701 is communicated with a gas source through a pipe joint and a hose 705, and the pressure reducing valve 704 is communicated with a first vacuum generator 706 positioned in the carrying system 30 and a second vacuum generator 707 positioned in the adjusting mechanism 50 through the pipe joint and the hose 705.

Preferably, the dust extraction and purification system 80 is further included, the dust extraction and purification system 80 comprises a dust absorption cover 801, the dust absorption cover 801 is a sheet metal part in a horn mouth shape, one end of the dust absorption cover 801 is connected with a nonmetal corrugated pipe 802 in a sealing manner, the other end of the dust absorption cover 801 is connected to external independent purification equipment or a production area negative pressure dust collection pipeline, a dust absorption bracket 803 with adjustable upper and lower heights is connected to the dust absorption cover 801, and the dust absorption bracket 803 is fixed through a bracket mounting plate 804.

Preferably, the hollow rotating platform 502 of the adjusting mechanism 50 is fixed on the slide block of the P-axis linear module 501 through screws, and a through hole penetrating up and down is arranged at the center of the turntable of the hollow rotating platform 502 and can accommodate the compressed air hose to penetrate. The wafer stage mount 505 also has a center through hole in the middle and is screwed to the hollow rotation stage 502. The bottom of the wafer carrier 503 is provided with a boss, and the boss is provided with a threaded hole which is used for connecting with a rotor end of the fluid slip ring 504. The other end of fluid slip ring 504 is the stator end that connects to the air pipe running from the vacuum port of vacuum generator 2, opposite the air pipe connection. Fluid slip ring 504 has a through-hole in the middle for free passage of compressed air. The mover end of fluid slip ring 504 may rotate relative to the center of the stator end. The middle of the wafer carrier 503 is provided with a hole with a larger diameter, and the top of the wafer carrier 503 is provided with a plurality of small holes which are regularly distributed and are used for increasing the contact area between the wafer carrier 503 and the wafer. The wafer stage 503 is made of 316L material, and the top surface is subjected to a bright surface treatment.

Preferably, in the laser marking system 60 of the present invention, the field lens 601 is screwed with the galvanometer 602. The optical path module 603 is a series of assemblies through which the laser light passes in the delivery process after being emitted from the laser 606. The light path module 603 is installed on the layer board of lift slip table 604, and lift slip table 604 mainly used adjusts the working distance of field lens 601 to the wafer marking surface, and it installs on loading platform B605, through the screw fastening.

Preferably, the purpose of the compressed air system 70 of the present invention is to provide clean positive pressure gas to the first vacuum generator 706 and the second vacuum generator 707 to create a vacuum negative pressure to adsorb wafers when needed. The hand slide valve 701 is used to control the on-off of compressed air input from the air source. The air filter 702 and the oil mist separator 703 are used to filter the compressed air. The pressure reducing valve 704 is used to regulate the pressure of the compressed air input. The nipple and hose 705 are common air path connection elements. The first vacuum generator 706 and the second vacuum generator 707 are integrated vacuum generators, and are small in size and complete in function.

The dust hood 801 is a sheet metal part in a horn mouth shape and is made of stainless steel. One end of the nonmetal corrugated pipe 802 is sleeved on the small end pipe of the bell mouth of the dust hood, and is provided with sealing treatment for preventing air leakage. The other end is connected to an external independent purifying device or a negative pressure dust removing pipeline of the production area. The dust collection bracket 803 can be vertically adjusted in height and is mounted on a bracket mounting plate 804.

s1, placing a wafer material box 101 on a material box jig plate 102 of an upper and lower material station 10;

s2, the conveying system 30 acts, the CCD recognition system 20 is moved to a proper position, the position information of each layer of wafers in the wafer material box 101 is recognized, a plurality of pieces of wafers are processed, and the information of the material shortage layer is recorded, archived and fed back to the conveying system 30;

s3, the carrying system 30 acts to drive the vacuum adsorption finger 305 to go to the feeding station 10 for wafer taking, and after successful adsorption, the first vacuum generator 706 sends a completion signal to the carrying system 30;

s4: the carrying system 30 acts to transfer the wafer to the wafer carrier 503, the first vacuum generator 706 breaks vacuum, the vacuum adsorption finger 305 breaks away from the wafer, the second vacuum generator 707 sucks vacuum, and after the wafer carrier 503 successfully adsorbs the wafer, the second vacuum generator 707 sends a completion signal to the CCD positioning system 40;

s5, acquiring the position information of the straight edge of the wafer by a CCD image acquisition device B, comparing the position information with the position of the straight edge of the predefined theoretical wafer, and judging whether the preset requirement is met or not, wherein the preset requirement is as follows: the straight edge of the wafer is parallel or coincident with the straight edge of the predefined theoretical wafer, and if the requirement is not met, the deviation information is sent to the adjusting mechanism;

S6, after receiving the deviation information of the straight edge position of the wafer sent by the CCD positioning system, the adjusting mechanism 50 starts the hollow rotating platform to rotate by a small angle to adjust the straight edge position of the wafer;

s9, the P-axis linear module 501 in the adjusting mechanism 50 acts to transfer the wafer from the CCD positioning station to the laser marking station;

s10, after the wafer is transferred to a laser marking station, the laser marking system 60 performs galvanometer deviation correction according to the actual circle center position of the wafer sent by the CCD positioning system, performs laser marking action, and outputs marking content to the correct position on the wafer;

s11, after laser marking is completed, the conveying system 30 acts, the vacuum adsorption finger 305 is moved to a marking station to take the wafer, the second vacuum generator 707 breaks vacuum, the wafer is separated from the wafer carrying table 503, meanwhile, the first vacuum generator 706 sucks vacuum, the vacuum adsorption finger 305 adsorbs the wafer, and then the conveying system acts, and the wafer is moved from the marking station to the current material taking layer of the wafer material box 101;

s13, returning the conveying system to a safe position;

s14, removing the wafer material box 101 and the marked wafer from the material box jig plate 102 of the loading and unloading station.

The CCD is an abbreviation of English name Charge-couple Device, called image sensor, and is a semiconductor Device capable of directly converting optical signal into analog current signal, amplifying and analog-digital converting the current signal, and obtaining, storing, transmitting, processing and reproducing image. The CCD identification system 20 and the CCD positioning system 40 are named differently, mainly because the purpose that the CCD ultimately achieves is different. The CCD image collector a201 and the CCD image collector B401 are one type of CCD image sensor, and may be the same type in practical application. The CCD mounting bracket A202 has the Y-direction adjustable function, so that the focal length of the CCD image collector A201 can be conveniently adjusted to a proper position after being mounted. In this example, three sets of CCD image collectors B401 are used, each mounted on 3 CCD mounting brackets B402. The three sets of CCD mounting brackets B402 are uniformly distributed on the CCD mounting plate 403 at 120 degrees, and can be adjusted in a small range along the circumferential direction around the center of the CCD mounting plate 403. The CCD positioning system 40 is mounted beside the laser marking system 60 in paraxial relationship with the field lens 601 thereon. Three square light sources 404 are opposite to three groups of CCD image collectors B401 one by one, are arranged on a square light source mounting plate 405 at an included angle of 120 degrees, and provide backlight for the CCD image collectors B401. The metal plate support 406 is used for connecting the P-axis linear module 501 and the square light source mounting plate 405.

It will be readily understood by those skilled in the art that the foregoing is merely illustrative of the preferred embodiments of the present invention and that no limitations are intended to the scope of the invention, except insofar as modifications, combinations, substitutions, improvements or the like may be made within the spirit and principles of the invention.

Claims

1. A full-automatic wafer laser marking device comprises

The loading and unloading work station (10) is used for placing and positioning the wafer material box;

a CCD recognition system (20) for controlling the carrying system (30) to acquire the wafer from the wafer material box;

a transfer system (30) for transferring the wafer to the wafer stage;

a wafer carrier (503) for carrying a wafer;

the laser marking system (60) is used for marking the wafer on the wafer carrier by adjusting the laser beam through the galvanometer mechanism;

the method is characterized in that:

and also comprises

The CCD positioning system (40) comprises a CCD image collector B for acquiring straight-edge coordinate parameters of a wafer positioned on the wafer carrier (503) and two CCD image collectors B for acquiring arc coordinate parameters of the wafer positioned on the wafer carrier (503), wherein the three CCD image collectors B are uniformly distributed around the rotation center circumference of the rotor part of the hollow rotating platform (502);

The adjusting mechanism (50) comprises a P-axis linear module (501) arranged between the CCD positioning system (40) and the laser marking system (60), a hollow rotating platform (502) capable of rotating around a Z axis is arranged on the P-axis linear module (501), a wafer carrying platform (503) is arranged on the hollow rotating platform (502), and when a rotor part of the hollow rotating platform (502) rotates around the rotating center of the rotor part, the wafer carrying platform (503) and a wafer positioned on the wafer carrying platform (503) can be driven to rotate around the rotating center of the hollow rotating platform (502) together.

2. The fully automatic wafer laser marking device according to claim 1, wherein:

after the wafer is transferred to the wafer stage (503) by the transfer system (30), the CCD positioning system (40) comprises the following working steps

S1, a CCD image collector (B) photographs the outline of the wafer to obtain the straight-edge coordinate parameters of the wafer, and whether the preset requirement is met or not is judged, wherein the preset requirement is as follows: the straight edge of the wafer is parallel or coincident with the straight edge of the predefined theoretical wafer, if the requirement is not met, the position deviation information of the coordinate parameters of the straight edge of the wafer and the straight edge of the predefined theoretical wafer is transmitted to an adjusting mechanism (50), and the adjusting mechanism (50) rotates by a corresponding angle to realize the parallel or coincident of the straight edge and the straight edge of the theoretical wafer;

S2, simultaneously photographing the wafer again by the three CCD image collectors (B) to obtain coordinate information of the wafer edge in the field of view corresponding to each CCD image collector (B), analyzing and obtaining the actual circle center coordinate of the wafer, and sending the obtained actual circle center coordinate of the wafer to a laser marking system (60);

s3, the P-axis linear module (501) translates the hollow rotary platform (502), the wafer carrying platform (503) and the wafer to the laser marking system (60), and the galvanometer mechanism of the laser marking system (60) corrects the deviation based on the actual circle center coordinates of the wafer, performs laser marking action and outputs marking content to the correct position on the wafer.

3. The fully automatic wafer laser marking device according to claim 1, wherein: the loading and unloading workstation (10) comprises a bearing platform A (103), a limiting sink which can be used for compatibly positioning a plurality of material box jig plates (102) with different sizes is arranged on the bearing platform A (103), and a rectangular light source (203) is fixedly connected beside the bearing platform A (103).

4. The fully automatic wafer laser marking device according to claim 1, wherein: the carrying system (30) comprises a multi-axis motion unit, a vacuum adsorption finger (305) and a CCD identification system (20) are arranged at the moving end of the multi-axis motion unit, and the CCD identification system (20) comprises a CCD image collector A (201).

5. The fully automatic wafer laser marking device according to claim 4, wherein: the anti-collision buffer alarm mechanism (304) is arranged at the moving end of the multi-axis movement unit, the anti-collision buffer alarm mechanism (304) comprises a base plate (30101) fixedly connected to the moving end of the multi-axis movement unit, a finger supporting plate (30404) is connected to the base plate (30101) through a rotating shaft (30406), a finger cover plate (3009) is fixedly connected to the finger supporting plate (30404) through threaded connection, a vacuum adsorption finger (305) is in press connection between the finger supporting plate (30404) and the finger cover plate (3009), and an extension spring (30503) is connected between the finger supporting plate (30404) and the base plate (30101).

6. The fully automatic wafer laser marking device according to claim 5, wherein: the upper end face of the base plate (30101) is provided with a groove which is perpendicular to the central axis of the rotating shaft (30406), the lower end face of the finger supporting plate (30404) is provided with an epitaxial cylinder table, and the diameter of the cylinder table corresponds to the width of the groove; the finger support plate (30404) is characterized in that a sinking groove feature for positioning a vacuum adsorption finger (305) is arranged on the upper end face of the finger support plate, a boss feature for sinking groove matching is arranged on the lower end face of the finger cover plate (3009), the groove depth of the sinking groove feature is larger than the height of the boss feature, a sealing gasket is arranged on the groove bottom of the sinking groove feature and the end face of the boss feature, and a pneumatic connector (30410) and a proximity sensor (30111) are arranged on the upper end face of the finger cover plate (3009).

7. The fully automatic wafer laser marking device according to claim 1, wherein: the CCD positioning system (40) comprises CCD mounting plates (403), wherein the CCD mounting plates (403) are connected with 3 CCD mounting supports B (402), the included angle of any 2 CCD mounting supports B (402) is 120 degrees, and each CCD mounting support B (402) is connected with a CCD image collector (B) extending along the Z axis.

8. The fully automatic wafer laser marking device according to claim 1, wherein: the automatic oil mist separator comprises a conveying system, and is characterized by further comprising a compressed air system (70), wherein the compressed air system (70) comprises a hand slide valve (701), an air filter (702), an oil mist separator (703) and a pressure reducing valve (704) which are sequentially connected in series, the hand slide valve (701) is communicated with an air source through a pipe joint and a hose (705), and the pressure reducing valve (704) is communicated with a first vacuum generator (706) located in the conveying system (30) and a second vacuum generator (707) located in the adjusting mechanism (50) through the pipe joint and the hose (705).

9. The fully automatic wafer laser marking device according to claim 1, wherein: still include dust extraction clean system (80), dust extraction clean system (80) include suction hood (801), suction hood (801) are the sheet metal component of horn mouth shape, the one end sealing connection of suction hood (801) has nonmetal bellows (802), the other end of suction hood (801) then is connected to outside independent clarification plant or production zone negative pressure dust removal pipeline, be connected with high adjustable dust absorption support (803) from top to bottom on suction hood (801), dust absorption support (803) are fixed through support mounting panel (804).

10. A full-automatic wafer laser marking method is characterized in that: a full-automatic wafer laser marking device according to any one of claims 1-9 for marking a wafer with a straight edge, comprising the following steps:

s1, placing a wafer material box (101) on a material box jig plate (102) of an upper and lower material working station (10);

s2, the conveying system (30) acts, the CCD recognition system (20) is moved to a proper position, position information of each layer of wafers in the wafer material box (101) is recognized, a plurality of pieces of wafers are performed, and the material shortage layer information is recorded, archived and fed back to the conveying system (30).

S3, the carrying system (30) acts to drive the vacuum adsorption fingers (305) to go to the feeding station (10) to take the wafer, and after successful adsorption, the first vacuum generator (706) sends a completion signal to the carrying system (30);

s4: the carrying system (30) acts to transfer the wafer to the wafer carrying platform (503), the first vacuum generator (706) breaks vacuum, the vacuum adsorption finger (305) is separated from the wafer, the second vacuum generator (707) adsorbs vacuum, and after the wafer carrying platform (503) adsorbs the wafer successfully, the second vacuum generator (707) sends a completion signal to the CCD positioning system (40);

s5, a CCD image collector B (401) collects the position information of the straight edge of the wafer, compares the position information with the position of the straight edge of the wafer in a predefined theory, judges that the actual direction of the straight edge of the wafer is coincident with or parallel to the predefined direction, and sends deviation information to an adjusting mechanism if the actual direction of the straight edge of the wafer is not coincident with the predefined direction;

And S6, after receiving the deviation information of the straight edge position of the wafer sent by the CCD positioning system, the adjusting mechanism (50) starts the hollow rotating platform to rotate by a small angle to adjust the straight edge position of the wafer.

S7, continuously acquiring the position information of the straight edge of the wafer by a CCD image acquisition device B (401), analyzing and judging that the actual direction of the straight edge of the wafer is coincident with or parallel to a predefined direction, and repeating the action S6 until the actual direction of the straight edge of the wafer is coincident with or parallel to the predefined direction;

s8, three CCD image collectors B (401) collect the arc position information of the wafer at the same time, calculate the actual circle center position of the wafer, and send the circle center position to a laser marking system;

s9, the P-axis linear module (501) in the adjusting mechanism (50) acts to transfer the wafer from the CCD positioning station to the laser marking station;

s10, after the wafer is transferred to a laser marking station, a laser marking system (60) performs galvanometer deviation correction according to the actual circle center position of the wafer sent by a CCD positioning system, performs laser marking action, and outputs marking content to the correct position on the wafer;

s11, after laser marking is finished, a carrying system (30) acts, a vacuum adsorption finger (305) is moved to a marking station to take a wafer, a second vacuum generator (707) breaks vacuum, the wafer is separated from a wafer carrying table (503), meanwhile, a first vacuum generator (706) sucks vacuum, the vacuum adsorption finger (305) adsorbs the wafer, then the carrying system acts, and the wafer is moved from the marking station to a current material taking layer of a wafer material box (101);

s13, returning the conveying system to a safe position;

s14, removing the wafer material box (101) and the marked wafer from the material box jig plate (102) of the loading and unloading station.