CN116801523A - Electronic equipment shell assembly, preparation method thereof and electronic equipment - Google Patents

Electronic equipment shell assembly, preparation method thereof and electronic equipment Download PDF

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Publication number
CN116801523A
CN116801523A CN202210253971.1A CN202210253971A CN116801523A CN 116801523 A CN116801523 A CN 116801523A CN 202210253971 A CN202210253971 A CN 202210253971A CN 116801523 A CN116801523 A CN 116801523A
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CN
China
Prior art keywords
magnesium
middle plate
outer frame
resin layer
electronic device
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Pending
Application number
CN202210253971.1A
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Chinese (zh)
Inventor
韩忠凯
尹斌
陈江
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority to CN202210253971.1A priority Critical patent/CN116801523A/en
Publication of CN116801523A publication Critical patent/CN116801523A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0017—Casings, cabinets or drawers for electric apparatus with operator interface units

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Signal Processing (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

The application discloses an electronic equipment shell assembly, a preparation method thereof and electronic equipment. Wherein, electronic equipment casing subassembly includes the center, the center includes: the surface of the magnesium middle plate is provided with a resin layer; the aluminum outer frame is arranged along the circumferential direction of the magnesium middle plate and is connected with the magnesium middle plate; and at least one part of the plastic part is arranged between the magnesium middle plate and the aluminum outer frame, and the plastic part is provided with an antenna groove. Therefore, the weight of the middle frame can be obviously reduced, the strength and the appearance surface texture of the middle frame are maintained, the processing efficiency and the optimizing cost are improved, and the competitiveness of electronic equipment products is improved.

Description

Electronic equipment shell assembly, preparation method thereof and electronic equipment
Technical Field
The application belongs to the technical field of materials, and particularly relates to an electronic equipment shell assembly, a preparation method thereof and electronic equipment.
Background
At present, the application of electronic devices such as smart phones, palm computers and the like is very popular, and becomes an important component in the work and life of people, and along with the continuous progress of technology, the requirements of people on electronic device products are also higher and higher. However, the existing electronic device housing generally adopts a metal middle frame or a plastic middle frame embedded with an aluminum alloy middle plate, and the dual requirements of appearance texture and light weight cannot be well met.
Disclosure of Invention
In one aspect, the present application provides an electronic device housing assembly. The electronic device housing assembly includes a center, the center including: the surface of the magnesium middle plate is provided with a resin layer; the aluminum outer frame is arranged along the circumferential direction of the magnesium middle plate and is connected with the magnesium middle plate; and at least one part of the plastic part is arranged between the magnesium middle plate and the aluminum outer frame, and the plastic part is provided with an antenna groove. Therefore, the weight of the middle frame can be obviously reduced, the strength and the appearance surface texture of the middle frame are maintained, the processing efficiency and the optimizing cost are improved, and the competitiveness of electronic equipment products is improved.
In another aspect of the application, a method of making an electronic device housing assembly is provided. The method comprises the following steps: providing a magnesium middle plate, and forming a resin layer on the surface of the magnesium middle plate; providing an aluminum outer frame, and enabling the aluminum outer frame to be arranged along the circumferential direction of the magnesium middle plate and connected with the magnesium middle plate; and filling a plastic part between the magnesium middle plate and the aluminum outer frame through a nano injection molding process, and arranging an antenna groove on the plastic part. Therefore, the method is high in processing efficiency, beneficial to optimizing cost, capable of reducing the overall weight of the shell assembly, and capable of keeping the strength of the middle frame and realizing better appearance and texture of the shell.
In yet another aspect of the present application, an electronic device is presented. The electronic device includes: an electronic device housing assembly as described above, or an electronic device housing assembly made using the method of making an electronic device housing assembly as described above; the display screen assembly is connected with the electronic equipment shell assembly, and an installation space is defined between the display screen assembly and the electronic equipment shell assembly; and the main board is arranged in the installation space and is electrically connected with the display screen assembly. Thus, the electronic device has all of the features and advantages of the electronic device housing assembly described above and the method of making the electronic device housing assembly described above, and are not described in detail herein. In general, the electronic device has lighter overall weight, high strength and good appearance surface texture.
Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.
Drawings
The foregoing and/or additional aspects and advantages of the application will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
fig. 1 is a schematic cross-sectional structure of a center frame of an electronic device housing assembly in a thickness direction thereof according to an embodiment of the present application.
Fig. 2 is a schematic diagram showing a metal middle frame in a disassembly manner in the related art.
FIG. 3 is a schematic diagram showing a plastic middle frame in a related art.
Fig. 4 is a schematic exploded view of a frame of an electronic device housing assembly according to one embodiment of the application.
Fig. 5 is a finished schematic view of a frame in an electronic device housing assembly according to one embodiment of the application.
Fig. 6 is a partial structural schematic diagram of a frame in an electronic device housing assembly according to one embodiment of the application.
Fig. 7 is a flow chart of a method of preparing an electronic device housing assembly according to one embodiment of the application.
Fig. 8 is an external structural schematic view of an electronic device housing assembly according to an embodiment of the present application.
Reference numerals illustrate:
electronic device housing assembly: 1000; middle frame: 100; magnesium middle plate: 10; aluminum outer frame: 20, a step of; resin layer: 11; plastic part: 30.
Detailed Description
Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present application and should not be construed as limiting the application.
In one aspect, the present application provides an electronic device housing assembly. As will be appreciated in connection with fig. 1, the electronic device housing assembly 1000 includes a center 100, the center 100 including: a magnesium middle plate 10, wherein a resin layer 11 is arranged on the surface of the magnesium middle plate 10; an aluminum outer frame 20, the aluminum outer frame 20 being disposed along a circumferential direction of the magnesium middle plate 10 and being connected to the magnesium middle plate 10 (connection position is not shown); and a plastic part 30, at least a part of the plastic part 30 is arranged between the magnesium middle plate 10 and the aluminum outer frame 20, and the plastic part 30 is provided with an antenna groove (not shown). Therefore, the weight of the middle frame can be obviously reduced, the strength and the appearance surface texture of the middle frame are maintained, the processing efficiency and the optimizing cost are improved, and the competitiveness of electronic equipment products is improved.
It can be understood that the aluminum outer frame 20 can flexibly select its shape, connection structure and connection angle with the magnesium middle plate 10 according to the actual shape of the housing and the actual requirements such as the size of the electronic device, wherein the connection mode of the two can be welding or riveting; alternatively, the aluminum frame 20 and the magnesium middle plate 10 may be combined by die casting magnesium/magnesium alloy in a die after machining the back-off structure with the aluminum frame. In addition, the resin layer 11 is formed on the entire surface of the magnesium board 10, including the surface on the side near the electronic-installation display screen assembly and the surface on the side far from the electronic-equipment display screen assembly. Furthermore, the number of antenna grooves and the specific structure thereof are not particularly limited, and can be flexibly selected by a person skilled in the art according to practical situations. In addition, it is to be understood that the electronic device housing assembly of the present application may be a composite board for manufacturing the housing, a back cover that is a part of the electronic device body, or an additional protective case that can be used separately for the electronic device, or the like, or may be a part of the housing of the electronic device.
According to the embodiments of the present application, the main trend of mobile phones in the market is to be light and thin. Most of the existing mobile phones adopt a structure of a middle frame and double-sided glass, for example, middle-high-end mobile phones comprise a folder mobile phone which adopts a scheme of a metal middle frame and double-sided glass. In order to achieve the purpose of light weight, most of the metal middle frames are made of aluminum alloy materials, and are mainly based on the high strength, low density, low price and easy machining of the aluminum alloy materials and the texture requirements of an appearance anodic oxidation process, typical disassembly parts of the metal middle frames are shown in fig. 2, the whole middle frames are divided into an aluminum alloy A and a plastic B, the aluminum alloy is formed by CNC (computer numerical control) processing of an internal structure and appearance of an aluminum plate profile, the plastic part is combined with the aluminum alloy through nano injection molding, and finally, subsequent processing and appearance processes are carried out. The model middle frame at the middle and low ends adopts a plastic middle frame and spraying process, the plastic appearance is made into a vacuum coating metal imitation effect by die casting aluminum alloy or magnesium alloy with an inner insert, the typical disassembling mode is shown in figure 3, the middle frame is divided into an aluminum alloy or magnesium alloy part C, and the molding is a die casting process; and then placing the formed hardware in a plastic mold for insert injection molding, and increasing the binding force between the hardware and the plastic D through the glue pulling holes.
The middle frame mainly provides metal texture and strength of the whole machine so as to improve the performance of mechanical test of the whole machine, and at present, the aluminum alloy middle frame is formed integrally, namely, the internal structure of the aluminum alloy is formed by all CNC (computerized numerical control) processing of aluminum extruded sections, so that the strength of the middle frame can be ensured, but the weight of the metal of the middle frame is large, the weight of the whole machine is heavy, and the use feeling of a user and the performance of reliability test of the whole machine are influenced. The appearance plastic of the plastic middle frame is poorer in texture than the aluminum alloy middle frame even if the vacuum coating technology for simulating the metal appearance is adopted, the product expressive force is insufficient, and the comprehensive strength is inferior to that of the pure aluminum alloy middle frame. To overcome the above problems, although magnesium alloy may be used instead of aluminum alloy to achieve both weight reduction and comprehensive strength (the density of aluminum alloy is 2.7g/cm 3 About, the density of the magnesium alloy which is also used as the metal is the density of the aluminum alloyAbout 1.8g/cm 3 Left and right), but because the activity of magnesium is stronger, the magnesium alloy cannot be machined to have an anodic oxidation effect like an aluminum alloy material, and can only be used on a non-appearance surface, and the strength of the magnesium alloy is generally poorer than that of the aluminum alloy, and the heat conductivity coefficient of the magnesium alloy is lower than that of the aluminum alloy, so that the heat dissipation performance of the whole machine is insufficient.
According to the embodiment of the application, the inventor finds that in order to reduce the weight of the aluminum alloy middle frame, a typical integrated aluminum alloy forming process can be changed into an aluminum magnesium alloy composite forming process; in addition, because the antenna clearance needs metal slotting and the plastic injection molding complex structure, the plastic part needs to be reserved, namely, the middle frame can be divided into an aluminum outer frame 20, a magnesium middle plate 10 and a plastic part 30 from the original aluminum alloy and plastic parts (understood by referring to fig. 4-5). Wherein, the aluminum outer frame mainly provides metal texture of appearance, is convenient for surface treatment process, ensures bending strength of the middle frame and improves the strength performance of the whole machine; the magnesium alloy middle plate and the aluminum alloy outer frame can be connected into a whole, so that the weight of part of aluminum alloy is reduced, the strength of the middle frame is ensured, and meanwhile, the problem of poor heat dissipation effect caused by singly adopting the magnesium alloy can be solved; the plastic part can be formed by combining nano injection molding with an aluminum-magnesium middle frame, and the middle frame structure is further fixed by a magnesium middle plate glue pulling structure and the like. In the actual operation process, the technical scheme has the difficulty that the magnesium middle plate is protected in the whole middle frame preparation process flow, because the magnesium/magnesium alloy has relatively active chemical property and is easy to react with acidic substances, the plastic part in the normal flow needs to be subjected to nano injection molding, the aluminum/aluminum alloy before nano injection molding needs to be subjected to T treatment (namely, small nano holes are etched on the surface of the aluminum/aluminum alloy) to form nano micropores so as to increase the binding force of the plastic and the aluminum alloy, and the acidic substances in the T treatment process can react, corrode and dissolve the magnesium/magnesium alloy; in addition, the subsequent aluminum/aluminum alloy part process needs to be anodized, and acidic substances such as high temperature, nitric acid, sulfuric acid and the like exist in the anodizing process, so that the aluminum/aluminum alloy part process can also generate chemical reaction with magnesium/magnesium alloy; therefore, the surface of the magnesium/magnesium alloy needs to be protected by a compact film layer before T treatment, and the protective film layer needs to resist high temperature, can bear high temperature of more than 150 ℃ in a nano injection mold and cannot fall off or wrinkle. In summary, the electronic equipment shell assembly of the application not only can remarkably reduce the weight of the middle frame, but also can maintain the strength and the appearance surface texture of the middle frame, and can shorten the process flow and time for CNC processing of the metal middle frame by plastic injection molding, further reduce the weight of the middle frame, be beneficial to improving the processing efficiency and optimizing the cost, and increase the competitiveness of electronic equipment products.
According to an embodiment of the present application, the thickness of the resin layer 11 may be 40 to 50 μm, and may be 41mm, 42 μm, 43mm, 44 μm, 45mm, 46 μm, 47mm, 48 μm, 49 μm, or the like, for example. The inventor finds that the corrosion resistance of the magnesium middle plate can be obviously improved along with the increase of the thickness of the resin layer, but the resin layer is expected to achieve better corrosion resistance on the premise of lower overall thickness in consideration of factors such as reduction of the thickness of the shell, light weight of the shell, reduction of the cost and the like, but if the thickness of the resin layer is too small, the magnesium middle plate is difficult to achieve better protection effect under the high temperature and acidic environment that the aluminum outer frame is subjected to T treatment and anodic oxidation and under the heat preservation environment of the injection mold; in addition, since the thickness of the resin layer formed by the end portions and the groove portions of the magnesium center plate (for example, the edges of the magnesium center plate and the connection regions thereof with the aluminum outer frame) is relatively thin as compared with other regions, when the thickness of the resin layer is too thin, it is also difficult to ensure effective protection of the end portions and the groove portions of the center plate. According to the application, the resin layer is controlled to be in the thickness range, so that not only can the omnibearing protection of the magnesium middle plate be realized, but also the resin layer can have a lower overall thickness on the premise of high corrosion resistance, and thus the comprehensive requirements of low thickness, light weight, high corrosion resistance of the middle plate body and the like of the shell can be further met.
According to the embodiment of the present application, the surface gloss of the resin layer 11 may be 30 to 36GU, for example, 31GU, 35GU, or the like, and the inventors have found and verified through a large number of experiments that the protective effect on the magnesium middle plate is relatively better when the gloss of the resin layer reaches the above range.
According to an embodiment of the present application, the resin layer 11 may be an epoxy resin layer. Compared with resin systems such as an acrylic acid system, a polyurethane system and the like, the epoxy resin has higher crosslinking degree, and the high crosslinking degree is more beneficial to improving the water-oxygen barrier capability of the resin layer and improving the anti-corrosion effect on the magnesium middle plate; further, the epoxy resin layer also has good insulation performance, and the insulation performance of the shell assembly can be improved. In addition, the epoxy resin layer can be dispersed with the colored paste, and if the epoxy resin has a certain shrinkage, the shrinkage and cracking easily occur at the end part of the middle plate and the groove part (such as the edge of the magnesium middle plate and the connecting area between the magnesium middle plate and the aluminum outer frame), and the cracking problem caused by the shrinkage of the resin can be effectively relieved by adding the colored paste into the epoxy resin layer, so that the secondary protection effect of the resin layer is ensured, and meanwhile, a certain color mixing effect is also achieved. It is understood that the kind of the paste is not particularly limited, and those skilled in the art can flexibly select the paste according to actual needs, so long as the paste achieves a better shrinkage cracking resistance effect, for example, the paste may include carbon powder or only select carbon powder.
According to the embodiment of the application, the resin layer can be formed by adopting an electrostatic spraying method or an electrophoresis method, for example, sand blasting treatment and electrophoresis method can be combined to obtain the resin layer with stronger adhesive force, wherein the electrophoresis liquid adopted by the electrophoresis method can comprise 17-23 wt% of epoxy resin emulsion and water, the mass ratio of the epoxy resin emulsion in the electrophoresis liquid can be 18-19 wt%, 20-21-22 wt% or the like, and the inventor finds that if the resin content in the electrophoresis liquid is too high, obvious shrinkage of the resin layer is caused, the problem of cracking caused by the shrinkage of the resin is easy to occur at the root part, the end part and the groove part of the supporting edge, for example, the edge of the magnesium middle plate and the connecting area of the magnesium middle plate and the aluminum outer frame can be easily caused. It will be appreciated that the epoxy resin emulsion may include an epoxy resin and an adjuvant, the adjuvant may include a co-solvent, the addition of the co-solvent may improve the dispersibility and solubility of the epoxy resin in the electrophoretic fluid, and no other resin material may be added other than the epoxy resin. Furthermore, the auxiliary agent can also comprise a cross-linking agent, and the cross-linking degree of the epoxy resin can be improved by adding the cross-linking agent, so that the water-oxygen resistance of the epoxy resin layer and the corrosion resistance of the magnesium middle plate are improved. It is understood that the epoxy resin used in the electrophoresis liquid may be an epoxy resin with a polyfunctional degree (for example, 3 or more, for example, 6 to 10 functional degrees may be selected), so that the crosslinking degree and the protection effect of the epoxy resin layer are more favorable to be improved. Further, the mass ratio of the epoxy resin to the auxiliary agent in the epoxy resin emulsion can be controlled to be about 6:4, for example, (5.5-6.5): (3.5 to 4.5) and the like; the electrophoretic fluid can also comprise a small amount of color paste, for example, the addition amount of the color paste can be 3-5 wt% based on the mass of the electrophoretic fluid, thereby being more beneficial to solving the shrinkage cracking problem of the epoxy resin layer and improving the overall anti-corrosion effect. In addition, for the composition of the above-mentioned electrophoresis liquid, the voltage used in the electrophoresis process can be 185V-195V, such as 188V, 190V or 192V, the electrophoresis temperature can be 27-29 ℃, such as 28 ℃, the electrophoresis time can be 10min, and the inventor finds that controlling the above-mentioned electrophoresis parameters is more favorable for obtaining a resin layer with a thickness of 40 μm-50 μm, so as to achieve a better anti-corrosion effect. It is understood that the electrophoresis is completed by removing the residual electrophoresis liquid by washing with water and drying; in addition, it should be noted that the filtration cycle of the electrophoresis tank body should be sufficient to prevent gas accumulation in the electrophoresis process.
According to the embodiment of the present application, due to the antenna clearance requirement, plastic must be molded through a nano injection molding process in the manufacturing process of the middle frame to fill the structure between the aluminum outer frame 20 and the magnesium middle plate 10, and the anodic oxidation process of the aluminum outer frame 10 is performed to increase the metal texture expressive force. In order to improve the bonding strength between the plastic part 30 and the aluminum outer frame 10, a plurality of nanopores may be distributed on the surface of the aluminum outer frame 20 facing the plastic part 30, and at least a portion of the plastic part 30 is embedded in the nanopores, so as to ensure the bonding strength between the aluminum outer frame and the plastic. In particular, as will be appreciated with reference to fig. 6,the surface of the aluminum frame may be roughened to form a plurality of nanopores in the surface of the aluminum frame facing the plastic portion, and for example, the roughening may be a T-treatment, and the nanopores may be etched in the surface of the aluminum frame by the T-treatment (S in fig. 6 2 The partial bonding area of the nanopores and the plastic after the aluminum alloy outer frame T treatment is shown). Further, the magnesium middle plate 10 can be die-cast to the magnesium alloy by a die-casting die, and the magnesium middle plate itself is firmly combined with the plastic by a die-cast glue-drawing hole, a dovetail groove and other glue-drawing structures (S in fig. 6) 3 Shows the structure of a part of the glue pulling hole of the magnesium alloy middle plate and the plastic, in addition, S 1 Showing the partial welded structure of the magnesium alloy middle plate and the aluminum alloy outer frame).
According to the embodiment of the present application, considering the adhesion of the resin layer and the overall anti-corrosion effect, the roughness of the surface of the magnesium middle plate 10 may be 0.7 to 1.2, for example, may be 0.75, 0.8, 0.85, 0.9, 0.95, 1.0, 1.05, 1.1 or 1.15, etc., and the inventors found that the roughness of the surface of the magnesium middle plate 10 may affect the adhesion of the resin layer 11 and the anti-corrosion effect, and if the roughness of the surface of the magnesium middle plate is too small, the adhesion of the magnesium middle plate to the resin layer may be poor, the effective combination of the two may be difficult to be ensured, and the protection effect on the magnesium middle plate may be affected; if the roughness of the surface of the magnesium middle plate is too large, the resin layer is difficult to achieve the complete water vapor blocking effect, and the overall anti-corrosion effect is possibly influenced; by controlling the roughness of the surface of the magnesium middle plate to be in the range, the bonding strength between the resin layer and the magnesium middle plate and the integral anti-corrosion effect can be simultaneously considered, and even if the aluminum outer frame is subjected to T treatment and anodic oxidation, the magnesium middle plate can be well protected.
According to the embodiment of the application, after the resin layer 11 is directly formed on the surface of the magnesium middle plate 10, the resin layer 11 has poor adhesion, and in order to make the surface of the magnesium middle plate 10 have proper roughness, the magnesium middle plate may be roughened in advance to form a rough surface; and forming a resin layer on the rough surface. It is understood that the specific process of the roughening treatment is not particularly limited, and those skilled in the art can flexibly select the roughening treatment according to the actual situation, for example, the roughening treatment may be implemented by sand blasting. The sand blasting treatment is adopted to remove foreign matters on the surface of the base material and form a uniform rough surface, so that the rough surface is obtained, a large number of grooves with different depths exist, the specific surface area of the resin layer attached to the magnesium middle plate can be increased, the adhesive force of the resin layer is improved, the uniform and compact resin film layer with larger adhesive force is formed on the surface of the magnesium middle plate, the resin layer is not easy to wrinkle and fall off in the whole preparation process flow, and a better protection effect is achieved. In order to realize the omnibearing protection of the magnesium middle plate, the end part and the groove part of the magnesium middle plate (such as the edge of the magnesium middle plate and the connection area of the magnesium middle plate and the aluminum outer frame) should be covered when the magnesium middle plate is roughened.
According to the embodiment of the application, the grain size of the sand material used for the sand blasting treatment can be 80-150 meshes, for example, zirconium sand with 100 meshes and the like, the sand blasting pressure can be 1.2-1.5 kilogram force, for example, 1.3 kilogram force or 1.4 kilogram force and the like, and the grain size and the sand blasting pressure of the sand material are controlled, so that the roughness degree of the surface of the magnesium middle plate is more favorably regulated and controlled, and the surface of the magnesium middle plate has a proper roughness range.
It is understood that the magnesium middle plate 10 may be a magnesium metal middle plate or a magnesium alloy middle plate, and the aluminum outer frame 20 is provided with an alumina layer on the surface thereof according to an embodiment of the present application. The aluminum outer frame 20 may be a metal aluminum outer frame or an aluminum alloy outer frame, for example, an aluminum alloy outer frame may be selected, the magnesium middle plate 10 may be a magnesium alloy middle plate, the aluminum alloy and the magnesium alloy are low in cost and weight, the treatment process is mature, the processing difficulty is low, the yield is high, the processing efficiency of the magnesium alloy is higher than that of the aluminum alloy, and the aluminum alloy and the magnesium alloy are used for electronic equipment to further meet the requirements of light weight and high cost performance under the premise of meeting the appearance effect. Further, an aluminum oxide film can be formed on the surface of the aluminum alloy outer frame through anodic oxidation, so that the corrosion resistance, the wear resistance and the decoration of the middle frame are obviously improved and enhanced.
According to the embodiment of the present application, the magnesium content of the magnesium middle plate 10 may be not less than 85wt%, for example, may be a magnesium alloy having a magnesium content of 90wt% or 95wt% and above, wherein selecting a middle plate having a high magnesium content is more advantageous for reducing the overall thickness of the housing assembly. It is understood that the kind of magnesium alloy having a magnesium content of not less than 85wt% is not particularly limited, and those skilled in the art can flexibly select according to actual needs. According to a specific example of the present application, the magnesium middle plate 10 may be made of a rare earth magnesium alloy material, preferably a rare earth magnesium alloy material having a magnesium content of not less than 90wt%, wherein the middle plate made of the rare earth alloy material is selected to have a light weight, and the introduction of the rare earth material is also beneficial to improving the thermal conductivity of the magnesium alloy middle plate, thereby improving the heat dissipation effect of the housing assembly.
According to the embodiment of the application, after the resin layer is formed on the magnesium middle plate, the resin layer can pass reliability limit tests such as a water boiling test, a neutral salt spray test and a cold and hot impact test, wherein after the aluminum outer frame is anodized, the surface hardness of the magnesium middle plate can reach 4B through a hundred-cell test, and no corrosion and resin layer foaming phenomenon occur after 24h salt spray test and copper salt spray acceleration.
Based on the same inventive concept, in another aspect of the present application, the present application provides a method of preparing an electronic device housing assembly. Referring to fig. 7, the method includes:
01: providing a magnesium middle plate, forming a resin layer on the surface of the magnesium middle plate
As will be understood with reference to fig. 1, according to an embodiment of the present application, a magnesium middle plate 10 is provided, and a resin layer is formed on the surface of the magnesium middle plate 10. For example, the magnesium alloy may be die-cast to obtain a middle plate body by a die-casting die, and the magnesium middle plate may be subjected to a first roughening treatment (e.g., sand blasting) in advance to form a rough surface, and then the rough surface may be provided with a resin layer by electrostatic spraying, electrophoresis, or the like, because the resin layer formed directly on the magnesium alloy body by electrostatic spraying, electrophoresis, or the like has poor adhesion. For example, the magnesium alloy middle plate body can be subjected to a sand blasting and electrophoresis process, the foreign matters on the surface of the magnesium alloy body can be removed through sand blasting treatment, a uniform rough surface is formed, a large number of grooves with different depths exist on the rough surface, the adhesive force can be improved by increasing the adhesive surface area of a resin layer, when the resin layer is formed on the surface of the magnesium alloy through the electrophoresis process, the compactness and the film thickness of the resin layer can be improved through improving the electrophoresis liquid component and the electrophoresis process parameters, the resin layer can resist the corrosion reaction of T treatment and anodic oxidation high temperature and acidic substances, the resin layer can not be wrinkled or shed at the high temperature of the mold in an injection mold, and in the whole subsequent processing and transferring processes, the resin layer can keep good adhesive force and can not shed due to mechanical collision, so that the whole process flow of the magnesium alloy middle plate is protected.
According to the embodiment of the application, the first roughening treatment can be sand blasting treatment, wherein the grain size of sand materials adopted in the sand blasting treatment is 80-150 meshes, and the sand blasting pressure is 1.2-1.5 kg-force; when the resin layer is formed by adopting an electrophoresis method, the electrophoresis liquid adopted by the electrophoresis method comprises epoxy resin emulsion and water, wherein the mass ratio of the epoxy resin emulsion in the electrophoresis liquid is 17-23 wt%; the process parameters of the electrophoresis method meet at least one of the following conditions: the voltage is 185V-195V, the temperature is 27-29 ℃ and the time is 10min. The forming method and material of the magnesium middle plate, the surface roughness of the magnesium middle plate, the method for forming the rough surface and the controlled technological parameters, the forming method of the resin layer, the thickness of the resin layer, the material of the resin layer, the glossiness of the resin layer, the controlled technological parameters when forming the resin layer, and other relevant features and effects have been described above, and are not repeated here. In addition, it is understood that the thickness of the magnesium middle plate is not particularly limited, and those skilled in the art can flexibly select according to actual circumstances.
02: providing an aluminum outer frame which is arranged along the circumferential direction of the magnesium middle plate and is connected with the magnesium middle plate
According to the embodiment of the present application, when the aluminum outer frame 20 is manufactured, an inner cavity structure of the aluminum/aluminum alloy profile can be processed through CNC, and the magnesium middle plate 10 formed with the resin layer 11 and the aluminum outer frame 20 are fixed together through welding or riveting, and the resin layer needs to be protected from being damaged and scratched in the welding process. After the fixing is completed, a second roughening treatment (such as T treatment) may be performed on the aluminum outer frame, and a plurality of nanopores may be formed on the surface of the aluminum outer frame facing the plastic portion. The material of the aluminum outer frame, the connection mode of the aluminum outer frame and the magnesium middle plate, and other relevant features and effects have been described in the foregoing, and will not be described here again.
It will be appreciated that CNC machining refers to computer numerically controlled precision machining and may be performed using CNC machining lathes, CNC machining milling machines, CNC machining boring and milling machines, and the like. Has the following advantages: the number of tools is greatly reduced, and complex tools are not needed for processing parts with complex shapes; the processing quality is stable, the processing precision is high, and the repetition precision is high; can process complex molded surfaces which are difficult to process by conventional methods, and even can process a plurality of processing parts which cannot be observed. Wherein, adopt CNC processing aluminium system frame time can go on through following step: and (3) adsorbing the aluminum alloy section to a CNC equipment processing jig for fixing, programming and adjusting CNC feed numerical control programs according to the inner cavity structure of the aluminum outer frame, and finishing the prefabricated texture by adjusting the 3D tool path to obtain the aluminum outer frame with the expected structure.
03: filling a plastic part between the magnesium middle plate and the aluminum outer frame through a nano injection molding process, and forming an antenna groove in the plastic part
According to the embodiment of the present application, in order to improve the bonding strength between the plastic part and the aluminum outer frame, before filling the plastic between the magnesium middle plate and the aluminum outer frame, the aluminum outer frame 20 may be first subjected to a second roughening treatment, and a plurality of nanopores may be formed on the surface of the aluminum outer frame 20 facing the plastic part 30, for example, a T treatment may be used to etch nanopores on the surface of the aluminum outer frame; the bonding strength between the magnesium middle plate 10 and the plastic part 30 can be achieved by the glue pulling structure of the magnesium middle plate 10.
According to an embodiment of the present application, after forming the plastic part, further includes: CNC processing and anodic oxidation treatment are carried out on the aluminum outer frame. Wherein, the corrosion resistance, the wear resistance and the decoration of the metal middle frame can be obviously improved and enhanced by carrying out anodic oxidation treatment on the aluminum outer frame. CNC machining may include finish milling the outer surface of the bezel to correct the shape using a CNC finish milling process to obtain the desired face shape.
According to the embodiment of the application, the magnesium middle plate and the aluminum outer frame are combined, the aluminum outer frame is subjected to second roughening treatment and then subjected to nano injection molding, and the subsequent CNC processing and appearance anodic oxidation process are combined to obtain the finished product of the middle frame, so that the texture of aluminum alloy appearance anodic oxidation can be obtained, and the overall weight is reduced through the application of magnesium alloy.
It is to be understood that the method for preparing an electronic device housing assembly according to the embodiment of the present application and the electronic device housing assembly according to the present application are provided based on the same inventive concept, and all the features and advantages described for the electronic device housing assembly according to the embodiment of the present application are also applicable to the method for preparing an electronic device housing assembly, and are not described in detail herein.
In summary, the method for preparing an electronic device housing assembly and the electronic device housing assembly according to the above embodiments of the present application have the following advantages: 1. the middle frame of the electronic equipment is split into the aluminum outer frame, the magnesium middle plate and the plastic three structures, so that the weight of the middle frame can be obviously reduced while the appearance anodic oxidation texture of the middle frame is ensured, meanwhile, the strength and the appearance surface treatment process of the aluminum alloy middle frame are maintained, and the processing efficiency of the magnesium alloy is higher than that of the aluminum alloy, so that the cost optimization is facilitated; 2. the aluminum outer frame and the magnesium middle plate are fixed into a whole through welding or riveting and other structures, so that the reliability of the combination of the outer frame and the middle plate is ensured; then the aluminum outer frame can be subjected to T treatment in advance and then subjected to nano injection molding, so that the binding force of aluminum alloy and plastic is ensured; the magnesium middle plate can be firmly combined with the plastic through glue pulling structures such as glue pulling holes, dovetail grooves and the like formed by die casting; 3. the compact and uniform protective film layer can be formed on the surface of the magnesium middle plate through the sand blasting and electrophoretic paint processes of magnesium/magnesium alloy with active chemical properties, so that the magnesium/magnesium alloy can not be corroded through high temperature and acidic environment in subsequent processes, and the magnesium alloy can be protected through a full process, and the application scene of the magnesium alloy is increased; 4. for the whole machine, the weight of the whole machine is reduced, the overall strength and the appearance texture are ensured, the user experience is better, and the product is more competitive; 5. the preparation process is simple, the processing efficiency is high, after the anodic oxidation is carried out on the aluminum outer frame, the appearance of the surface of the middle plate is free from abnormality, and reliability limit tests such as a water boiling test, a neutral salt spray test and a cold and hot impact test can be passed, wherein after the anodic oxidation is carried out on the aluminum outer frame, the surface hardness of the magnesium middle plate can reach 4B through a hundred-grid test, and after the 24-hour salt spray test and copper salt spray acceleration, no corrosion and resin layer foaming phenomenon exist.
In yet another aspect of the present application, an electronic device is presented. The electronic device includes: an electronic device housing assembly as described above, or an electronic device housing assembly made using the method of making an electronic device housing assembly as described above; the display screen assembly is connected with the electronic equipment shell assembly, and an installation space is defined between the display screen assembly and the electronic equipment shell assembly; and the main board is arranged in the installation space and is electrically connected with the display screen assembly. Thus, the electronic device has all of the features and advantages of the electronic device housing assembly described above and the method of making the electronic device housing assembly described above, and are not described in detail herein. In general, the electronic device has lighter overall weight, high strength and good appearance surface texture.
It will be appreciated that the specific type of the electronic device in the present application is not particularly limited, and those skilled in the art can flexibly select the electronic device according to practical situations, for example, the electronic device may be a mobile phone, a smart watch, a palm computer, a PDA, a notebook computer, or the like. The electronic device may be any of various types of computer system devices that are mobile or portable and that perform wireless communications. In particular, the electronic device may be a mobile phone or a smart phone, a portable gaming device, a laptop, a PDA, a portable internet device, a music player, and a data storage device, other handheld devices, and devices such as watches, in-ear headphones, pendants, headsets, etc., and may also be other wearable devices (e.g., a Head Mounted Device (HMD) such as an electronic glasses, an electronic garment, an electronic bracelet, an electronic necklace, an electronic tattoo, or a smart watch). In some embodiments of the present application, referring to fig. 8, the electronic device may be a mobile phone, where the electronic device housing assembly 1000 may be a rear cover of the mobile phone. It will be appreciated that, in addition to the above-described electronic device housing assembly, the electronic device further includes the necessary structures or components of a conventional electronic device, for example, a mobile phone, which includes, in addition to the above-described electronic device housing assembly, the necessary structures or components of a conventional mobile phone such as a glass cover, a display panel, an audio processing module, a camera module, a touch screen, and the like.
It should be specifically noted that, in the description of the present application, unless explicitly specified and limited otherwise, terms such as "connected," "connected," and the like are to be construed broadly and may be fixedly connected, detachably connected, or integrally formed, for example; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
In the description of the present application, the description with reference to the terms "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
While embodiments of the present application have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the application, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the application.

Claims (10)

1. An electronic device housing assembly comprising a center, the center comprising:
the surface of the magnesium middle plate is provided with a resin layer;
the aluminum outer frame is arranged along the circumferential direction of the magnesium middle plate and is connected with the magnesium middle plate;
and at least one part of the plastic part is arranged between the magnesium middle plate and the aluminum outer frame, and the plastic part is provided with an antenna groove.
2. The electronic device housing assembly according to claim 1, wherein the thickness of the resin layer is 40 to 50 μm; and/or the surface glossiness of the resin layer is 30-36 GU.
3. The electronic device housing assembly of claim 1 or 2, wherein the aluminum outer frame has a plurality of nanopores distributed on a surface thereof facing the plastic portion, at least a portion of the plastic portion being embedded in the nanopores.
4. The electronic device housing assembly according to claim 1 or 2, wherein the roughness of the surface of the magnesium middle plate is 0.7-1.2, the magnesium middle plate is a magnesium alloy middle frame, and the aluminum outer frame is an aluminum alloy frame.
5. A method of making an electronic device housing assembly, comprising:
providing a magnesium middle plate, and forming a resin layer on the surface of the magnesium middle plate;
providing an aluminum outer frame, and enabling the aluminum outer frame to be arranged along the circumferential direction of the magnesium middle plate and connected with the magnesium middle plate;
and filling a plastic part between the magnesium middle plate and the aluminum outer frame through a nano injection molding process, and arranging an antenna groove on the plastic part.
6. The method according to claim 5, wherein the magnesium middle plate is subjected to a first roughening treatment in advance to form a roughened surface; and forming the resin layer on the rough surface.
7. The method of claim 6, wherein the first roughening treatment is grit blasting; and/or forming the resin layer by electrostatic spraying or electrophoresis.
8. The method according to claim 7, wherein the resin layer is formed by an electrophoresis method, and an electrophoresis liquid used in the electrophoresis method comprises an epoxy resin emulsion and water, wherein the mass ratio of the epoxy resin emulsion in the electrophoresis liquid is 17-23 wt%.
9. The method of claim 5, further comprising, prior to forming the plastic portion: and performing second roughening treatment on the aluminum outer frame, and forming a plurality of nanopores on the surface of the aluminum outer frame facing the plastic part.
10. An electronic device, comprising:
an electronic device housing assembly according to any one of claims 1 to 4, or an electronic device housing assembly produced by the method according to any one of claims 5 to 9;
the display screen assembly is connected with the electronic equipment shell assembly, and an installation space is defined between the display screen assembly and the electronic equipment shell assembly; and
and the main board is arranged in the installation space and is electrically connected with the display screen assembly.
CN202210253971.1A 2022-03-15 2022-03-15 Electronic equipment shell assembly, preparation method thereof and electronic equipment Pending CN116801523A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210253971.1A CN116801523A (en) 2022-03-15 2022-03-15 Electronic equipment shell assembly, preparation method thereof and electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210253971.1A CN116801523A (en) 2022-03-15 2022-03-15 Electronic equipment shell assembly, preparation method thereof and electronic equipment

Publications (1)

Publication Number Publication Date
CN116801523A true CN116801523A (en) 2023-09-22

Family

ID=88040659

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210253971.1A Pending CN116801523A (en) 2022-03-15 2022-03-15 Electronic equipment shell assembly, preparation method thereof and electronic equipment

Country Status (1)

Country Link
CN (1) CN116801523A (en)

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