CN116801516A - PCB processing method, PCB and electronic equipment - Google Patents
PCB processing method, PCB and electronic equipment Download PDFInfo
- Publication number
- CN116801516A CN116801516A CN202310699983.1A CN202310699983A CN116801516A CN 116801516 A CN116801516 A CN 116801516A CN 202310699983 A CN202310699983 A CN 202310699983A CN 116801516 A CN116801516 A CN 116801516A
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- pcb
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- 238000003672 processing method Methods 0.000 title claims abstract description 14
- 239000011810 insulating material Substances 0.000 claims abstract description 59
- 238000012545 processing Methods 0.000 claims abstract description 34
- 238000003825 pressing Methods 0.000 claims abstract description 8
- 238000009713 electroplating Methods 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000011889 copper foil Substances 0.000 claims description 7
- 238000003475 lamination Methods 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 229920001187 thermosetting polymer Polymers 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 abstract description 5
- 238000005336 cracking Methods 0.000 abstract description 4
- IYZWUWBAFUBNCH-UHFFFAOYSA-N 2,6-dichlorobiphenyl Chemical compound ClC1=CC=CC(Cl)=C1C1=CC=CC=C1 IYZWUWBAFUBNCH-UHFFFAOYSA-N 0.000 description 25
- SXHLTVKPNQVZGL-UHFFFAOYSA-N 1,2-dichloro-3-(3-chlorophenyl)benzene Chemical compound ClC1=CC=CC(C=2C(=C(Cl)C=CC=2)Cl)=C1 SXHLTVKPNQVZGL-UHFFFAOYSA-N 0.000 description 13
- MTLMVEWEYZFYTH-UHFFFAOYSA-N 1,3,5-trichloro-2-phenylbenzene Chemical compound ClC1=CC(Cl)=CC(Cl)=C1C1=CC=CC=C1 MTLMVEWEYZFYTH-UHFFFAOYSA-N 0.000 description 13
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 4
- 238000005553 drilling Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Abstract
The invention discloses a PCB processing method, a PCB and electronic equipment, comprising the following steps: pressing the inner layer PCB and the outer layer PCB to obtain a multi-layer PCB; the inner layer PCB is provided with a first conductive hole, and a first insulating material is filled in the first conductive hole; processing a first positioning hole on the multilayer PCB, wherein the first positioning hole penetrates through the first insulating material; processing a second conductive hole on the multilayer PCB based on the first positioning hole to obtain a PCB provided with coaxial holes; the aperture of the second conductive hole is larger than that of the first positioning hole and smaller than that of the first conductive hole. According to the technical scheme, the first positioning holes penetrating through the first insulating materials are machined in the multilayer PCB in advance, so that the second conductive holes can be prevented from being deviated, and the first insulating materials can be prevented from cracking when the second conductive holes are machined, and the quality of coaxial holes in the PCB is improved.
Description
Technical Field
The invention relates to the technical field of PCBs, in particular to a PCB processing method, a PCB and electronic equipment.
Background
With the vigorous development of wireless communication technology, the requirements on the performance and stability of the antenna are higher and higher, and meanwhile, the antenna with high performance and low cost is required to be realized. At present, the problem of electromagnetic compatibility is one of factors limiting the performance of the antenna, so that when designing a PCB board, some measures need to be taken to reduce electromagnetic interference so as to improve the performance and stability of the antenna. The coaxial hole is used as a common antenna process, so that electromagnetic interference can be reduced and the matching degree of the input impedance of the antenna can be improved; however, when the coaxial holes are processed on the PCB, problems such as drilling deviation and resin cracking may occur, and these problems may cause short circuit and reduced shielding performance of the coaxial inner signal layer, thereby affecting the performance and stability of the antenna. Therefore, how to improve the machining precision and quality of coaxial holes is a problem to be solved at present.
Disclosure of Invention
The embodiment of the invention provides a PCB processing method, a PCB and electronic equipment, which are used for solving the problems of low processing precision and poor quality of coaxial holes.
A PCB processing method comprises the following steps:
pressing the inner layer PCB and the outer layer PCB to obtain a multi-layer PCB; the inner-layer PCB is provided with a first conductive hole, and a first insulating material is filled in the first conductive hole;
processing a first positioning hole on the multilayer PCB, wherein the first positioning hole penetrates through the first insulating material;
processing a second conductive hole on the multilayer PCB based on the first positioning hole to obtain a PCB provided with a coaxial hole;
the aperture of the second conductive hole is larger than that of the first positioning hole and smaller than that of the first conductive hole.
Further, the aperture of the first positioning hole is smaller than 70% of the aperture of the second conductive hole.
Further, the aperture of the first conductive hole is 0.75 to 1 mm, and the aperture of the second conductive hole is 0.2 to 0.35 mm.
Further, the laminating the inner layer PCB board and the outer layer PCB board to obtain a multilayer PCB board comprises:
processing a first via hole on the inner layer PCB;
electroplating on the first via hole to obtain a first conductive hole;
filling the first conductive holes with the first insulating material to obtain a PCB to be pressed;
and pressing the PCB to be pressed with the outer-layer PCB to obtain the multilayer PCB.
Further, the first insulating material is a thermosetting resin.
Further, the inner layer PCB comprises at least two layers of copper-clad plates.
Further, the step of pressing the to-be-pressed PCB with the outer PCB to obtain the multilayer PCB includes:
and adding a prepreg and a copper foil layer between the PCB to be laminated and the outer-layer PCB for lamination to obtain the multilayer PCB.
Further, based on the first positioning hole, the second conductive hole is processed on the multilayer PCB to obtain a PCB provided with coaxial holes, including:
processing a second via hole at the position where the first positioning hole is located;
electroplating on the second via hole to obtain a second conductive hole;
filling a second insulating material in the second conductive hole;
and electroplating a first metal layer for realizing signal connection on the surface of the second insulating material to obtain the PCB provided with the coaxial holes.
A PCB is obtained by adopting the PCB processing method.
An electronic device comprises the PCB.
According to the PCB processing method, the PCB and the electronic equipment, the inner-layer PCB and the outer-layer PCB are pressed to obtain the multi-layer PCB, the inner-layer PCB is guaranteed to be provided with the first conductive holes, and the first conductive holes are filled with the first insulating material. Then, processing first locating hole on multilayer PCB board, first locating hole runs through first insulating material, finally, based on first locating hole, processing second conducting hole on multilayer PCB board, obtain the PCB board that is equipped with the coaxial hole, and guarantee the aperture of second conducting hole and be greater than the aperture of first locating hole, and be less than the aperture of first conducting hole, through processing the first locating hole that runs through first insulating material on multilayer PCB board in advance, not only can prevent the second conducting hole skew, and because the aperture of second conducting hole is greater than the aperture of first locating hole, and be less than the aperture of first conducting hole, therefore the first locating hole of processing through first insulating material in advance can also prevent to appear first insulating material fracture when processing the second conducting hole on multilayer PCB board, thereby improve the quality of coaxial hole on the PCB board.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the description of the embodiments of the present invention will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of a PCB processing method according to an embodiment of the invention;
FIG. 2 is another flow chart of a PCB processing method according to an embodiment of the invention;
FIG. 3 is another flow chart of a PCB processing method according to an embodiment of the invention;
fig. 4 is a flow chart of a method for processing a PCB according to an embodiment of the invention.
In the figure: 10. a multi-layer PCB board; 20. an inner layer PCB board; 21. a first conductive via; 22. a first insulating material; 30. an outer layer PCB board; 31. a first positioning hole; 32. and a second conductive hole.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be understood that the present invention may be embodied in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
In the following description, for the purpose of providing a thorough understanding of the present invention, detailed structures and steps are presented in order to illustrate the technical solution presented by the present invention. Preferred embodiments of the present invention are described in detail below, however, the present invention may have other embodiments in addition to these detailed descriptions.
The present embodiment provides a method for processing a PCB board, as shown in fig. 1, including:
s101: the inner layer PCB 20 and the outer layer PCB 30 are pressed together to obtain the multi-layer PCB 10, wherein the inner layer PCB 20 is provided with a first conductive hole 21, and the first conductive hole 21 is filled with a first insulating material 22.
S102: first positioning holes 31 are processed on the multi-layer PCB board 10, and the first positioning holes 31 penetrate through the first insulating material 22.
S103: based on the first positioning hole 31, a second conductive hole 32 is processed on the multilayer PCB 10 to obtain a PCB provided with coaxial holes, wherein the aperture of the second conductive hole 32 is larger than the aperture of the first positioning hole 31 and smaller than the aperture of the first conductive hole 21.
The multi-layer PCB 10 is a PCB obtained by laminating an inner layer PCB 20 and an outer layer PCB 30. The inner PCB 20 refers to a PCB located between two outer PCBs 30. The outer PCB 30 refers to a PCB located on the top and bottom surfaces of the multi-layered PCB 10. It will be appreciated that the PCB (Printed Circuit Board, printed circuit board, PCB) board generally refers to a copper-clad plate on which a circuit is printed, that is, a circuit board manufactured by a printing process on an insulating substrate.
As an example, in step S101, as shown in fig. 4, an inner PCB board 20 and an outer PCB board 30 are provided, and then the inner PCB board 20 and the outer PCB board 30 are pressed together to obtain the multi-layer PCB board 10. Optionally, the inner layer PCB 20 may be a layer PCB or at least two layers of PCBs, so as to ensure that the inner layer PCB 20 is provided with a first conductive hole 21, and the first conductive hole 21 is filled with a first insulating material 22. It should be noted that, the first conductive hole 21 on the inner PCB 20 is used as an outer ring hole of the coaxial hole formed in the subsequent processing, i.e. an outer ring metal layer. It will be appreciated that coaxial bores generally include an outer ring bore (outer ring metal layer), an inner ring bore (inner ring metal layer), and an insulating spacer layer between the outer ring bore and the inner ring bore. The first insulating material 22 may act as an insulating barrier between the outer and inner race bores of the coaxial bore to prevent the coaxial Kong Duanlu, resulting in a more stable and reliable electrical performance of the coaxial bore connection. Meanwhile, the first insulating material 22 can also play a role in supporting the relative position between the outer ring hole and the inner ring hole of the coaxial hole, so that the relative position between the inner metal and the outer metal is stabilized, the route deviation is effectively avoided, and the reliability of the PCB is improved.
As an example, in step S102, as shown in fig. 4, a first positioning hole 31 is processed on the multi-layered PCB board 10, and the first positioning hole 31 penetrates the first insulating material 22. Illustratively, first, a pre-drilled hole position, which refers to a position for processing the first positioning hole 31, is determined on the outer layer PCB 30 (e.g., on the top or bottom PCB) of the multi-layer PCB 10. It should be noted that, the pre-drilling position corresponds to the central position of the first insulating material 22, so as to ensure that the first positioning hole 31 and the first conductive hole 21 are coaxially arranged, so that the coaxial hole cannot deviate in the subsequent PCB processing process, and the processing precision of the coaxial hole is ensured. Next, a first positioning hole 31 is processed at the pre-drilled position, and the first positioning hole 31 is penetrated through the first insulating material 22. It will be appreciated that the first positioning holes 31 extend through the outer PCB 30 of the multi-layer PCB 10 at the same time as the first insulating material 22. In this embodiment, the first positioning hole 31 is formed on the multilayer PCB 10, and the first positioning hole 31 penetrates through the first insulating material 22, so that the first positioning hole 31 and the first conductive hole 21 are coaxially arranged, and the coaxial hole is not offset in the subsequent PCB processing process, so that the processing precision of the coaxial hole is ensured.
As an example, in step S103, as shown in fig. 4, based on the first positioning hole 31, the second conductive hole 32 is processed on the multi-layer PCB 10 to obtain a PCB provided with a coaxial hole, wherein the aperture of the second conductive hole 32 is larger than the aperture of the first positioning hole 31 and smaller than the aperture of the first conductive hole 21. In this example, the second conductive vias 32 are processed on the multi-layered PCB board 10 on the basis of the first positioning holes 31 to obtain coaxial holes formed by the first conductive vias 21, the second conductive vias 32 and the first insulating material 22, thereby obtaining a PCB board provided with coaxial holes. It should be noted that, due to the positioning effect of the first positioning hole 31, when the second conductive hole 32 is processed, the second conductive hole 32 can be prevented from being deviated, the processing precision of the coaxial hole is ensured, meanwhile, the first positioning hole 31 penetrating the first insulating material 22 is processed on the multi-layer PCB board 10 in advance, not only the second conductive hole 32 can be prevented from being deviated, but also the first positioning hole 31 penetrating the first insulating material 22 is processed on the multi-layer PCB board 10 in advance because the aperture of the second conductive hole 32 is larger than the aperture of the first positioning hole 31 and smaller than the aperture of the first conductive hole 21, and the first insulating material 22 can be prevented from cracking when the second conductive hole 32 is processed, thereby improving the quality of the coaxial hole on the PCB board.
In this embodiment, the inner layer PCB 20 and the outer layer PCB 30 are pressed together to obtain the multi-layer PCB 10, and the inner layer PCB 20 is guaranteed to be provided with the first conductive holes 21, and the first conductive holes 21 are filled with the first insulating material 22. Next, the first positioning hole 31 is processed on the multi-layer PCB 10, the first positioning hole 31 penetrates through the first insulating material 22, and finally, the second conductive hole 32 is processed on the multi-layer PCB 10 based on the first positioning hole 31, so that a PCB provided with coaxial holes is obtained, the aperture of the second conductive hole 32 is ensured to be larger than that of the first positioning hole 31 and smaller than that of the first conductive hole 21, by processing the first positioning hole 31 penetrating through the first insulating material 22 on the multi-layer PCB 10 in advance, not only the second conductive hole 32 is prevented from being deviated, but also the aperture of the second conductive hole 32 is larger than that of the first positioning hole 31 and smaller than that of the first conductive hole 21, so that the first insulating material 22 cracking can be prevented from occurring when the first positioning hole 31 penetrating through the first insulating material 22 is processed on the multi-layer PCB 10 in advance, thereby improving the quality of the coaxial holes on the PCB.
In one embodiment, the aperture of the first positioning hole 31 is less than 70% of the aperture of the second conductive hole 32.
In this embodiment, the aperture of the first positioning hole 31 is ensured to be smaller than 70% of the aperture of the second conductive hole 32, so that the first insulating material 22 is ensured not to crack when the second conductive hole 32 is processed on the basis of the first positioning hole 31, and the quality of coaxial holes on the PCB board is ensured.
In one embodiment, the aperture of the first conductive via 21 is 0.75 mm to 1 mm and the aperture of the second conductive via 32 is 0.2 mm to 0.35 mm.
In this embodiment, the aperture of the first conductive hole 21 is 0.75 mm to 1 mm, the aperture of the second conductive hole 32 is 0.2 mm to 0.35 mm, the aperture of the first positioning hole 31 is less than 70% of the aperture of the second conductive hole 32, so that the coaxial hole obtained in the PCB processing process cannot deviate, the first insulating material 22 between the first conductive hole 21 and the second conductive hole 32 cannot crack, and the processing precision and quality of the coaxial hole on the PCB board are improved.
In an embodiment, as shown in fig. 2, in step S101, the inner PCB 20 and the outer PCB 30 are pressed together to obtain a multi-layer PCB 10, which includes:
s201: a first via is processed on the inner PCB board 20.
S202: electroplating is performed on the first via hole, so as to obtain a first conductive hole 21.
S203: and filling the first conductive holes 21 with a first insulating material 22 to obtain the PCB to be pressed.
S204: and pressing the PCB to be pressed with the outer PCB 30 to obtain the multilayer PCB 10.
As an example, in step S201, a first via is processed on the inner PCB using a suitable drill, and the size of the drill of the first via is selected to ensure that the first conductive via 21 has a pore diameter of 0.75 mm to 1 mm after electroplating on the first via.
As an example, in step S202, the first via hole is electroplated to obtain the first conductive hole 21, so as to electrically connect the inner PCB board 20 and serve as an outer ring hole of the coaxial hole. Alternatively, the electroplating process for electroplating the first via hole may be an existing electroplating process, which is not described herein.
As an example, in step S203, the first conductive hole 21 is filled with the first insulating material 22, so as to obtain a PCB board to be laminated, so that the first insulating material 22 is used as an insulating isolation layer between the outer ring hole and the inner ring hole in the coaxial hole, so as to prevent the coaxial Kong Duanlu, and the coaxial hole connection has more stable and reliable electrical performance.
As an example, in step S204, the PCB to be laminated refers to the inner PCB 20 having the first conductive holes 21 and the first insulating material 22. In this example, the PCB board to be laminated and the outer PCB board 30 are laminated to obtain the multi-layer PCB board 10, so that the multi-layer PCB board 10 having coaxial holes is formed in a subsequent step by using the PCB board to be laminated having the first conductive holes 21 and the first insulating material 22.
In this embodiment, a first via hole is processed on the inner layer PCB 20, a first conductive hole 21 is obtained by electroplating on the first via hole, a first insulating material 22 is filled in the first conductive hole 21 to obtain a PCB to be pressed, the PCB to be pressed is pressed with the outer layer PCB 30 to obtain the multilayer PCB 10, so that the multilayer PCB 10 with the first conductive hole 21 and the first insulating material 22 can be obtained, on the basis, the first positioning hole 31 is processed on the multilayer PCB 10 to ensure that the first positioning hole 31 penetrates through the first insulating material 22, and a second conductive hole 32 is processed on the multilayer PCB 10 based on the first positioning hole 31 to obtain a PCB with coaxial holes, thereby improving the processing precision and quality of the coaxial holes on the PCB.
In one embodiment, the first insulating material 22 is a thermosetting resin. In this embodiment, the first insulating material 22 is a thermosetting resin, which can provide good insulating performance to the coaxial hole, prevent signal interference and leakage, reduce reflection of the electrical signal in the coaxial hole, and improve signal transmission quality of the coaxial hole. In addition, the thermosetting resin has good mechanical strength, so that the structural strength of the PCB can be enhanced.
In one embodiment, the inner PCB board 20 includes at least two layers of copper clad laminate. In this embodiment, the inner layer PCB 20 includes at least two layers of copper clad laminates, so as to reduce the reflected signals from the outer layer PCB 30, and add additional capacitance to compensate the capacitance of the gap around the coaxial hole, thereby maintaining the integrity and stability of the coaxial hole transmission signal and improving the problem of uneven electromagnetic field distribution inside the coaxial hole.
In an embodiment, the to-be-laminated PCB board is laminated with the outer layer PCB board 30 to obtain the multilayer PCB board 10, including: and adding a prepreg and a copper foil layer between the PCB to be laminated and the outer-layer PCB 30 for lamination to obtain the multilayer PCB 10.
The prepreg can be selected to have different thickness and size according to design requirements. The prepreg may be FR-4 glass fiber, polyamide, polytetrafluoroethylene, or the like. The copper foil layer is a metal copper sheet and is used for covering the surface of the PCB to transmit electric signals.
As an example, a prepreg and a copper foil layer are added between the PCB to be laminated and the outer PCB 30, and then put into a PCB lamination machine to be laminated. In the lamination process, the PCB board is heated and compressed by the PCB board lamination machine to obtain the multilayer PCB board 10.
In this embodiment, a prepreg and a copper foil layer are added between the PCB to be laminated and the outer PCB 30 for lamination to obtain the multi-layer PCB 10, the electrical environment of the multi-layer PCB 10 is established through the copper foil layer, the strength, bending resistance and flexural resistance of the multi-layer PCB 10 can be ensured through the prepreg,
in one embodiment, as shown in fig. 3, in step S103, processing the second conductive vias 32 on the multi-layer PCB 10 based on the first positioning holes 31, to obtain a PCB provided with coaxial holes, includes:
s301: a second via is processed at the location of the first pilot hole 31.
S302: electroplating over the second via results in a second conductive via 32.
S303: the second conductive via 32 is filled with a second insulating material.
S304: electroplating a first metal layer for realizing signal connection on the surface of the second insulating material to obtain the PCB provided with the coaxial holes.
As an example, in step S301, a second via hole is processed at a position where the first positioning hole 31 on the multi-layer PCB board 10 is located, where the size of the drill of the second via hole is selected to ensure that the aperture of the second conductive hole 32 obtained after electroplating on the second via hole is 0.2 mm to 0.35 mm.
As an example, in step S302, a second conductive via 32 is electroplated on the second via to realize the electrical connection of the multi-layer PCB 10 and serve as an inner ring hole of the coaxial hole. Alternatively, the electroplating process for electroplating the second via hole may be an existing electroplating process, which is not described herein.
As an example, in step S303, the second conductive via 32 is filled with a second insulating material, which is used for insulation and isolation, to reduce mutual interference between coaxial vias, thereby improving signal transmission quality and reliability. In this example, the second insulating material may be a thermosetting resin.
As an example, in step S304, a first metal layer for realizing signal connection is electroplated on the surface of the second insulating material, so as to obtain a PCB board provided with coaxial holes. In this example, a first metal layer for signal connection is electroplated on the surface of the second insulating material to establish electrical connection between coaxial pre-PCB boards.
The embodiment provides a PCB, which is obtained by adopting the PCB processing method.
The embodiment provides an electronic device, which comprises the PCB.
The above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention, and are intended to be included in the scope of the present invention.
Claims (10)
1. The PCB processing method is characterized by comprising the following steps:
pressing the inner layer PCB and the outer layer PCB to obtain a multi-layer PCB; the inner-layer PCB is provided with a first conductive hole, and a first insulating material is filled in the first conductive hole;
processing a first positioning hole on the multilayer PCB, wherein the first positioning hole penetrates through the first insulating material;
processing a second conductive hole on the multilayer PCB based on the first positioning hole to obtain a PCB provided with a coaxial hole;
the aperture of the second conductive hole is larger than that of the first positioning hole and smaller than that of the first conductive hole.
2. The method of claim 1, wherein the first positioning hole has a hole diameter less than 70% of the hole diameter of the second conductive hole.
3. The method of claim 2, wherein the first conductive via has a hole diameter of 0.75 mm to 1 mm and the second conductive via has a hole diameter of 0.2 mm to 0.35 mm.
4. The method for processing the PCB of claim 1, wherein the step of laminating the inner PCB and the outer PCB to obtain a multi-layered PCB comprises:
processing a first via hole on the inner layer PCB;
electroplating on the first via hole to obtain a first conductive hole;
filling the first conductive holes with the first insulating material to obtain a PCB to be pressed;
and pressing the PCB to be pressed with the outer-layer PCB to obtain the multilayer PCB.
5. The method of claim 1 or 4, wherein the first insulating material is a thermosetting resin.
6. The PCB processing method of claim 1 or 4, wherein the inner layer PCB includes at least two layers of copper clad laminate.
7. The method for processing a PCB according to claim 4, wherein the step of pressing the PCB to be pressed with the outer PCB to obtain the multi-layered PCB includes:
and adding a prepreg and a copper foil layer between the PCB to be laminated and the outer-layer PCB for lamination to obtain the multilayer PCB.
8. The method for processing a PCB according to claim 1, wherein the processing the second conductive via on the multi-layer PCB based on the first positioning hole to obtain a PCB provided with coaxial holes includes:
processing a second via hole at the position where the first positioning hole is located;
electroplating on the second via hole to obtain a second conductive hole;
filling a second insulating material in the second conductive hole;
and electroplating a first metal layer for realizing signal connection on the surface of the second insulating material to obtain the PCB provided with the coaxial holes.
9. A PCB board, characterized in that it is manufactured by the PCB board manufacturing method according to any one of claims 1 to 8.
10. An electronic device comprising the PCB of claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310699983.1A CN116801516A (en) | 2023-06-13 | 2023-06-13 | PCB processing method, PCB and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310699983.1A CN116801516A (en) | 2023-06-13 | 2023-06-13 | PCB processing method, PCB and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116801516A true CN116801516A (en) | 2023-09-22 |
Family
ID=88035517
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310699983.1A Pending CN116801516A (en) | 2023-06-13 | 2023-06-13 | PCB processing method, PCB and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116801516A (en) |
-
2023
- 2023-06-13 CN CN202310699983.1A patent/CN116801516A/en active Pending
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