CN116801433A - Manufacturing method of graphene heating glass - Google Patents
Manufacturing method of graphene heating glass Download PDFInfo
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- CN116801433A CN116801433A CN202310778232.9A CN202310778232A CN116801433A CN 116801433 A CN116801433 A CN 116801433A CN 202310778232 A CN202310778232 A CN 202310778232A CN 116801433 A CN116801433 A CN 116801433A
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- silica gel
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 74
- 229910021389 graphene Inorganic materials 0.000 title claims abstract description 65
- 239000011521 glass Substances 0.000 title claims abstract description 58
- 238000010438 heat treatment Methods 0.000 title claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 39
- 238000000576 coating method Methods 0.000 claims abstract description 23
- 239000011248 coating agent Substances 0.000 claims abstract description 22
- 239000002002 slurry Substances 0.000 claims abstract description 19
- 238000005245 sintering Methods 0.000 claims abstract description 6
- 238000007639 printing Methods 0.000 claims abstract description 5
- 238000001035 drying Methods 0.000 claims abstract description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 58
- 239000000741 silica gel Substances 0.000 claims description 48
- 229910002027 silica gel Inorganic materials 0.000 claims description 48
- 239000000843 powder Substances 0.000 claims description 27
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 20
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 15
- 239000010445 mica Substances 0.000 claims description 12
- 229910052618 mica group Inorganic materials 0.000 claims description 12
- 239000006004 Quartz sand Substances 0.000 claims description 10
- 229910000416 bismuth oxide Inorganic materials 0.000 claims description 10
- 239000000919 ceramic Substances 0.000 claims description 10
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 claims description 10
- BDAGIHXWWSANSR-NJFSPNSNSA-N hydroxyformaldehyde Chemical compound O[14CH]=O BDAGIHXWWSANSR-NJFSPNSNSA-N 0.000 claims description 10
- XGZVUEUWXADBQD-UHFFFAOYSA-L lithium carbonate Chemical compound [Li+].[Li+].[O-]C([O-])=O XGZVUEUWXADBQD-UHFFFAOYSA-L 0.000 claims description 10
- 229910052808 lithium carbonate Inorganic materials 0.000 claims description 10
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 10
- 239000000395 magnesium oxide Substances 0.000 claims description 10
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 10
- 229910000018 strontium carbonate Inorganic materials 0.000 claims description 10
- 239000011787 zinc oxide Substances 0.000 claims description 10
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims description 9
- 239000004327 boric acid Substances 0.000 claims description 9
- 238000002156 mixing Methods 0.000 claims description 9
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 9
- 239000002994 raw material Substances 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 8
- 239000002241 glass-ceramic Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 238000000748 compression moulding Methods 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 6
- 238000005265 energy consumption Methods 0.000 abstract description 5
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 239000002131 composite material Substances 0.000 abstract 2
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 231100000252 nontoxic Toxicity 0.000 description 2
- 230000003000 nontoxic effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000009967 tasteless effect Effects 0.000 description 2
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001954 sterilising effect Effects 0.000 description 1
- 238000004659 sterilization and disinfection Methods 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/017—Manufacturing methods or apparatus for heaters
Landscapes
- Resistance Heating (AREA)
Abstract
The invention discloses a manufacturing method of graphene heating glass, which comprises the following steps: step 1, providing microcrystalline glass plate substrate and inorganic conductive resistor film raw slurry; step 2, printing the primary slurry of the inorganic conductive resistor film on the front surface and/or the back surface of the microcrystalline glass plate substrate, and drying and sintering the primary slurry to cover the inorganic conductive resistor film on the front surface and/or the back surface of the microcrystalline glass plate substrate; step 3, coating a high-temperature-resistant insulating ink layer on the front surface and/or the back surface of the microcrystalline glass plate substrate corresponding to the outer surface of the inorganic conductive resistance film; step 4, coating a first graphene layer on the outer surface of the high-temperature-resistant insulating ink layer corresponding to the front surface and/or the back surface of the microcrystalline glass plate substrate; and 5, arranging an insulating heat conduction layer on the front surface and/or the back surface of the microcrystalline glass plate substrate, which corresponds to the outer surface of the first graphene layer. The graphene composite material has stable heating performance, and is combined with the arrangement of the graphene layer, so that the graphene composite material has the advantages of high heating speed, good heat dissipation effect, low energy consumption and low cost.
Description
Technical Field
The invention relates to the technology in the field of heating glass manufacturing, in particular to a manufacturing method of graphene heating glass.
Background
The heating glass is characterized in that a plurality of nonmetallic conductive materials such as glass and infrared radiation materials are compounded on the outer surface of the glass through processes such as printing, high-temperature sintering and the like, and the glass is always made into a whole with the glass to form an inorganic conductive resistance film, and the inorganic conductive resistance film emits infrared heat after being electrified and heated to form a heat radiation source and conduct and convection type heating. The prior heating glass has the defects of uneven heating, unsatisfactory heat insulation effect and potential safety hazard of electric leakage.
Later on, graphene coated glass ceramic heating plates were developed on the market, for example: CN217445536U, it includes the heating plate subassembly, the top coating of heating plate subassembly has graphene coating, graphene coating's top has coated conducting electrode coating, high temperature resistant insulating protection layer and thermal insulation layer in proper order, the external connection of heating plate subassembly has the protection screen panel, through graphene coating, conducting electrode coating, high temperature resistant insulating protection layer and thermal insulation layer and the setting of protection screen panel, make heating rate faster, temperature distribution more even, the energy consumption is low, but this kind solves the inhomogeneous that generates heat through setting up multilayer structure, the design of the potential safety hazard that has the electric leakage, has the structure complicacy, the coating process is too loaded down with trivial details etc. not enough, leads to whole glass that generates heat's production cost height, is unfavorable for using widely on a large scale.
Therefore, a new technical solution is needed to solve the above problems.
Disclosure of Invention
In view of the defects existing in the prior art, the main purpose of the invention is to provide the manufacturing method of the graphene heating glass, which has stable performance after the inorganic conductive resistance film is formed, is favorable for stable heating performance, and simultaneously ensures high heating speed, good heat dissipation effect, low energy consumption, effectively reduces cost, better meets the use requirement and is favorable for large-scale popularization and use by combining with the arrangement of the graphene layer.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
a manufacturing method of graphene heating glass comprises the following steps of
Step 1, providing microcrystalline glass plate substrate and inorganic conductive resistor film raw slurry; the microcrystalline glass plate substrate is provided with a front surface and a back surface which are arranged on opposite sides, and the inorganic conductive resistor film raw slurry is formed by mixing the following materials: graphite powder, far infrared ceramic powder, superfine mica powder, bismuth oxide, zinc oxide, antimonous oxide, boric acid, strontium carbonate, aluminum oxide, magnesium oxide, quartz sand, lithium carbonate and an organic liquid medium;
step 2, printing the primary slurry of the inorganic conductive resistor film on the front surface and/or the back surface of the microcrystalline glass plate substrate, and drying and sintering the primary slurry to cover the inorganic conductive resistor film on the front surface and/or the back surface of the microcrystalline glass plate substrate;
step 3, coating a high-temperature-resistant insulating ink layer on the front surface and/or the back surface of the microcrystalline glass plate substrate corresponding to the outer surface of the inorganic conductive resistance film;
step 4, a first graphene layer is coated on the front surface and/or the back surface of the microcrystalline glass plate substrate, which corresponds to the outer surface of the high-temperature-resistant insulating ink layer;
and 5, arranging an insulating heat conduction layer on the front surface and/or the back surface of the microcrystalline glass plate substrate corresponding to the outer surface of the first graphene layer.
As a preferable scheme, the insulating heat conducting layer is a mica coating or a silica gel coating.
As a preferable scheme, the outer surface of the insulating heat conducting layer is also covered with a second graphene layer.
As a preferable scheme, the insulating heat conduction layer is a graphene silica gel layer, and raw materials of the graphene silica gel layer comprise graphene powder and silica gel which are mixed.
As a preferable scheme, the method for manufacturing the graphene silica gel layer comprises the following steps of
Step 5-1, firstly adding the raw silica gel into a mixing mill for softening treatment, and then adding graphene powder for uniform mixing;
step 5-2, discharging the sheet to obtain a half-raw half-cooked silica gel sheet, wherein the peripheral size of the half-raw half-cooked silica gel sheet is larger than that of the glass ceramic plate substrate and is matched with the inner cavity of the die;
and 5-3, stacking the half-cooked silica gel sheet and the microcrystalline glass plate substrate covered with the first graphene layer in the step 4 into the inner cavity of the die to form a stacked state that the lower layer is the half-cooked silica gel sheet, the middle layer is the microcrystalline glass plate substrate covered with the first graphene layer in the step 4 and the upper layer is the half-cooked silica gel sheet, pressing the top of the half-cooked silica gel sheet on the upper layer by using a pressure forming machine, and performing compression molding treatment to integrate the periphery of the half-cooked silica gel sheet on the upper layer with the periphery of the half-cooked silica gel sheet on the lower layer, thereby realizing full coating of the microcrystalline glass plate substrate covered with the first graphene layer in the step 4.
Compared with the prior art, the invention has obvious advantages and beneficial effects, and particularly, the technical proposal shows that the inorganic conductive resistor film is mainly formed by adopting graphite powder, superfine mica powder, far infrared ceramic powder, bismuth oxide, zinc oxide, antimony trioxide, boric acid, aluminum oxide, strontium carbonate, magnesium oxide, quartz sand, lithium carbonate and organic liquid medium to prepare slurry for film formation, and the method is simple and has stable performance after film formation. In addition, the arrangement of the graphene layer ensures that the heating speed is high, the heat dissipation effect is good, the energy consumption is low, the cost is effectively reduced, the use requirement is better met, and the large-scale popularization and use are facilitated.
Especially, when the insulating heat conduction layer adopts graphene silica gel layer, the raw materials of graphene silica gel layer are including mixed graphene powder and silica gel, and its radiating rate promotes, and whole graphene generates heat glass's temperature degree of consistency is better, simultaneously, nontoxic tasteless, waterproof, acid and alkali resistant, and humid environment is applicable.
In order to more clearly illustrate the structural features and efficacy of the present invention, the invention will be described in detail below with reference to specific examples.
Detailed Description
In the description of the present invention, it should be noted that the terms "upper," "lower," "left," "right," and the like indicate an orientation or positional relationship merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements to be referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.
An embodiment I provides a method for manufacturing graphene heating glass, comprising the following steps of
Step 1, providing microcrystalline glass plate substrate and inorganic conductive resistor film raw slurry; the microcrystalline glass plate substrate is provided with a front surface and a back surface which are arranged on opposite sides, and the inorganic conductive resistor film raw slurry is formed by mixing the following materials: graphite powder, far infrared ceramic powder, superfine mica powder, bismuth oxide, zinc oxide, antimonous oxide, boric acid, strontium carbonate, aluminum oxide, magnesium oxide, quartz sand, lithium carbonate and an organic liquid medium; graphite powder, far infrared ceramic powder, superfine mica powder, bismuth oxide, zinc oxide, antimonous oxide, boric acid, strontium carbonate, aluminum oxide, magnesium oxide, quartz sand and lithium carbonate are used as main raw materials, and the weight ratio of the main raw materials to the organic liquid medium is as follows: (1-1.5)/(1.5-2). Specifically, the weight parts of graphite powder, superfine mica powder, far infrared ceramic powder, bismuth oxide, zinc oxide, antimonous oxide, boric acid, aluminum oxide, strontium carbonate, magnesium oxide, quartz sand and lithium carbonate are as follows: 250-280 parts of graphite powder, 100-120 parts of superfine mica powder, 100-120 parts of far infrared ceramic powder, 350-400 parts of bismuth oxide, 260-300 parts of zinc oxide, 120-140 parts of antimonous oxide, 200-220 parts of boric acid, 80-100 parts of aluminum oxide, 90-100 parts of strontium carbonate, 50-60 parts of magnesium oxide, 50-70 parts of quartz sand and 100-120 parts of lithium carbonate. The organic liquid medium comprises the following components in parts by weight: 3000-4000 parts of terpineol, 350-400 parts of ethyl cellulose and 200-250 parts of silane coupling agent. When the inorganic conductive resistance film raw slurry is specifically manufactured, bismuth oxide, zinc oxide, antimonous oxide, boric acid, aluminum oxide, strontium carbonate, magnesium oxide, quartz sand and lithium carbonate are heated and melted, cooled, ground and sieved, graphite powder, superfine mica powder and far infrared ceramic powder are added to be mixed as main raw materials, and then organic liquid medium is added according to the proportion, and the mixture is fully mixed to obtain the inorganic conductive resistance film raw slurry.
Step 2, printing the primary slurry of the inorganic conductive resistor film on the front surface and/or the back surface of the microcrystalline glass plate substrate, and drying and sintering the primary slurry to cover the inorganic conductive resistor film on the front surface and/or the back surface of the microcrystalline glass plate substrate; in actual fabrication, the resistance can be controlled by changing the film thickness. Among the raw materials of the inorganic conductive resistor film, the strontium carbonate, the magnesium oxide, the quartz sand and the lithium carbonate have the functions of improving the surface wear resistance and the adhesive force of the inorganic conductive resistor film, and are not easy to crack during sintering, and the surface is not easy to be worn during the subsequent step 3. Bismuth oxide, zinc oxide and antimony trioxide are matched with each other, so that the stability of electrical performance is improved, and the heat-resistant temperature during heating operation can be improved. The far infrared ceramic powder enables the inorganic conductive resistor film to have far infrared performance, the inorganic conductive resistor film emits infrared heat after being electrified and heated, a heat radiation source is formed, conduction and convection type heating are carried out, substances such as benzene, formaldehyde, sulfide and ammonia can be removed, and a sterilization function is achieved. The cost of the inorganic conductive resistor film can be controlled to be lower, the inorganic conductive resistor film is environment-friendly, does not contain lead-containing substances, can avoid pollution to the environment caused by preparation waste and adverse effects of lead on human health, accords with the environment-friendly concept, and is suitable for popularization and application.
And step 3, coating a high-temperature-resistant insulating ink layer on the front surface and/or the back surface of the microcrystalline glass plate substrate corresponding to the outer surface of the inorganic conductive resistor film.
And 4, coating a first graphene layer on the front surface and/or the back surface of the microcrystalline glass plate substrate, which corresponds to the outer surface of the high-temperature-resistant insulating ink layer.
And 5, arranging an insulating heat conduction layer on the front surface and/or the back surface of the microcrystalline glass plate substrate corresponding to the outer surface of the first graphene layer. The insulating heat conducting layer is a mica coating.
And 6, further coating a second graphene layer on the outer surface of the insulating heat conducting layer.
The second embodiment is basically the same as the first embodiment, and the main difference is that: the insulating heat conducting layer in the step 5 is a silica gel coating.
Embodiment three is substantially the same as that of embodiment one, with the main differences: in the step 5, the insulating heat conducting layer is a graphene silica gel layer, and raw materials of the graphene silica gel layer comprise graphene powder and silica gel which are mixed. The method for manufacturing the graphene silica gel layer comprises the following steps:
step 5-1, firstly adding the raw silica gel into a mixing mill for softening treatment, and then adding graphene powder for uniform mixing;
step 5-2, discharging the sheet to obtain a half-raw half-cooked silica gel sheet, wherein the peripheral size of the half-raw half-cooked silica gel sheet is larger than that of the glass ceramic plate substrate and is matched with the inner cavity of the die;
and 5-3, stacking the half-cooked silica gel sheet and the microcrystalline glass plate substrate covered with the first graphene layer in the step 4 into the inner cavity of the die to form a stacked state that the lower layer is the half-cooked silica gel sheet, the middle layer is the microcrystalline glass plate substrate covered with the first graphene layer in the step 4 and the upper layer is the half-cooked silica gel sheet, pressing the top of the half-cooked silica gel sheet on the upper layer by using a pressure forming machine, and performing compression molding treatment to integrate the periphery of the half-cooked silica gel sheet on the upper layer with the periphery of the half-cooked silica gel sheet on the lower layer, thereby realizing full coating of the microcrystalline glass plate substrate covered with the first graphene layer in the step 4.
The invention mainly aims at providing an inorganic conductive resistor film which is formed by adopting graphite powder, superfine mica powder, far infrared ceramic powder, bismuth oxide, zinc oxide, antimonous oxide, boric acid, aluminum oxide, strontium carbonate, magnesium oxide, quartz sand, lithium carbonate and an organic liquid medium to prepare slurry for film forming, and has the advantages of simple method and stable performance after film forming. In addition, the arrangement of the graphene layer ensures that the heating speed is high, the heat dissipation effect is good, the energy consumption is low, the cost is effectively reduced, the use requirement is better met, and the large-scale popularization and use are facilitated.
Especially, when the insulating heat conduction layer adopts graphene silica gel layer, the raw materials of graphene silica gel layer are including mixed graphene powder and silica gel, and its radiating rate promotes, and whole graphene generates heat glass's temperature degree of consistency is better, simultaneously, nontoxic tasteless, waterproof, acid and alkali resistant, and humid environment is applicable.
The foregoing description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so any minor modifications, equivalent changes and modifications made to the above embodiments according to the technical principles of the present invention are still within the scope of the technical solutions of the present invention.
Claims (5)
1. A manufacturing method of graphene heating glass is characterized by comprising the following steps: comprises the following steps of
Step 1, providing microcrystalline glass plate substrate and inorganic conductive resistor film raw slurry; the microcrystalline glass plate substrate is provided with a front surface and a back surface which are arranged on opposite sides, and the inorganic conductive resistor film raw slurry is formed by mixing the following materials: graphite powder, far infrared ceramic powder, superfine mica powder, bismuth oxide, zinc oxide, antimonous oxide, boric acid, strontium carbonate, aluminum oxide, magnesium oxide, quartz sand, lithium carbonate and an organic liquid medium;
step 2, printing the primary slurry of the inorganic conductive resistor film on the front surface and/or the back surface of the microcrystalline glass plate substrate, and drying and sintering the primary slurry to cover the inorganic conductive resistor film on the front surface and/or the back surface of the microcrystalline glass plate substrate;
step 3, coating a high-temperature-resistant insulating ink layer on the front surface and/or the back surface of the microcrystalline glass plate substrate corresponding to the outer surface of the inorganic conductive resistance film;
step 4, a first graphene layer is coated on the front surface and/or the back surface of the microcrystalline glass plate substrate, which corresponds to the outer surface of the high-temperature-resistant insulating ink layer;
and 5, arranging an insulating heat conduction layer on the front surface and/or the back surface of the microcrystalline glass plate substrate corresponding to the outer surface of the first graphene layer.
2. The method for manufacturing the graphene heating glass according to claim 1, wherein the method comprises the following steps: the insulating heat conducting layer is a mica coating or a silica gel coating.
3. The method for manufacturing the graphene heating glass according to claim 2, wherein the method comprises the following steps: the outer surface of the insulating heat conduction layer is also covered with a second graphene layer.
4. The method for manufacturing the graphene heating glass according to claim 1, wherein the method comprises the following steps: the insulating heat conduction layer is a graphene silica gel layer, and raw materials of the graphene silica gel layer comprise graphene powder and silica gel which are mixed.
5. The method for manufacturing the graphene heating glass according to claim 4, wherein the method comprises the following steps: the method for manufacturing the graphene silica gel layer comprises the following steps of
Step 5-1, firstly adding the raw silica gel into a mixing mill for softening treatment, and then adding graphene powder for uniform mixing;
step 5-2, discharging the sheet to obtain a half-raw half-cooked silica gel sheet, wherein the peripheral size of the half-raw half-cooked silica gel sheet is larger than that of the glass ceramic plate substrate and is matched with the inner cavity of the die;
and 5-3, stacking the half-cooked silica gel sheet and the microcrystalline glass plate substrate covered with the first graphene layer in the step 4 into the inner cavity of the die to form a stacked state that the lower layer is the half-cooked silica gel sheet, the middle layer is the microcrystalline glass plate substrate covered with the first graphene layer in the step 4 and the upper layer is the half-cooked silica gel sheet, pressing the top of the half-cooked silica gel sheet on the upper layer by using a pressure forming machine, and performing compression molding treatment to integrate the periphery of the half-cooked silica gel sheet on the upper layer with the periphery of the half-cooked silica gel sheet on the lower layer, thereby realizing full coating of the microcrystalline glass plate substrate covered with the first graphene layer in the step 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310778232.9A CN116801433A (en) | 2023-06-29 | 2023-06-29 | Manufacturing method of graphene heating glass |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310778232.9A CN116801433A (en) | 2023-06-29 | 2023-06-29 | Manufacturing method of graphene heating glass |
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| Publication Number | Publication Date |
|---|---|
| CN116801433A true CN116801433A (en) | 2023-09-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310778232.9A Pending CN116801433A (en) | 2023-06-29 | 2023-06-29 | Manufacturing method of graphene heating glass |
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| Country | Link |
|---|---|
| CN (1) | CN116801433A (en) |
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2023
- 2023-06-29 CN CN202310778232.9A patent/CN116801433A/en active Pending
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