CN116798933A - Clamp and method for packaging semiconductor chip - Google Patents
Clamp and method for packaging semiconductor chip Download PDFInfo
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- CN116798933A CN116798933A CN202310156056.5A CN202310156056A CN116798933A CN 116798933 A CN116798933 A CN 116798933A CN 202310156056 A CN202310156056 A CN 202310156056A CN 116798933 A CN116798933 A CN 116798933A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 92
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 67
- 238000000034 method Methods 0.000 title claims abstract description 34
- 238000003825 pressing Methods 0.000 claims description 27
- 230000008569 process Effects 0.000 claims description 18
- 239000007789 gas Substances 0.000 claims description 11
- 230000009471 action Effects 0.000 claims description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 230000003139 buffering effect Effects 0.000 claims description 6
- 230000000694 effects Effects 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 4
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims description 3
- 230000008859 change Effects 0.000 claims description 3
- 235000019253 formic acid Nutrition 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 3
- 238000005086 pumping Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000012423 maintenance Methods 0.000 abstract 1
- 125000006850 spacer group Chemical group 0.000 description 4
- 238000012536 packaging technology Methods 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a clamp and a method for packaging semiconductor chips, which relate to the technical field of semiconductor chip packaging and are used for clamping semiconductor chips. The clamp and the method for packaging the semiconductor chips are based on the special packaging clamp, the structure is simple and ingenious, the assembly and the maintenance are convenient, the semiconductor chips are aligned by utilizing mechanical limiting, the clamping of the semiconductor chips with different numbers is completed, the clamping force is correspondingly adjusted, the clamp can be produced in a large scale, meanwhile, the clamp is convenient to debug, the operation is simple, and the production efficiency of packaging the semiconductor chips is greatly improved.
Description
Technical Field
The invention relates to the technical field of semiconductor chip packaging, in particular to a clamp and a method for packaging a semiconductor chip.
Background
The existing semiconductor chip packaging technology manually aligns the semiconductor chips, only one semiconductor chip can be packaged at a time, and packaging is completed in the air (oxygen element in the air oxidizes flux, so that the service life of the semiconductor chip is shortened after packaging) finally results in: the production efficiency is low, the packaging quality is unstable, and the packaging consistency is poor.
Disclosure of Invention
(one) solving the technical problems
Aiming at the defects of the prior art, the invention provides a clamp and a method for packaging semiconductor chips, which solve the problems that the existing semiconductor chip packaging technology manually aligns the semiconductor chips, only one semiconductor chip can be packaged at a time, and the packaging quality is unstable in air.
(II) technical scheme
In order to achieve the above purpose, the invention is realized by the following technical scheme: the clamp comprises a guide sleeve, wherein one side of the inside of the guide sleeve is provided with a quantity adjusting device, the guide sleeve can be locked on the guide sleeve in a sliding manner and used for adjusting the placing quantity of the semiconductor chips, the other side of the inside of the guide sleeve is provided with an elastic clamping device which can rebound to act on the guide sleeve, the semiconductor chips are placed between the quantity adjusting device and the elastic clamping device to form clamping force, and the guide sleeve is provided with an elastic computing device which resists the elastic clamping device and is used for controlling the clamping force acting on the side edges of the semiconductor chips.
Further, the quantity adjusting device comprises a sliding block, a pressing piece is arranged above the sliding block, the sliding block slides on the inner wall of the guide sleeve, a first bolt is arranged between the pressing piece and the sliding block in a threaded mode, and when the pressing piece is screwed, the pressing piece presses the top of the guide sleeve, and the sliding block is locked on the guide sleeve.
Further, the elastic clamping device comprises a moving block and a sliding plate fixedly arranged at the top of the moving block, the sliding plate slides at the top of the guide sleeve, at least one first spring is fixedly arranged on the side wall, far away from the sliding block, of the moving block, and the end part of the first spring is fixedly arranged on the inner wall of the guide sleeve.
Further, at least one guide post is fixedly arranged on one side, away from each other, of the sliding block and the moving block, the guide post penetrates through the guide sleeve and slides with the inner wall of the guide sleeve, and the first spring is sleeved outside the guide post.
Further, elasticity calculation device is including sliding the cross frame board of establishing between the guide pin bushing bottom, both sides all run through around the guide pin bushing top and have been seted up the ladder groove, and the ladder groove is divided into wide, narrow portion from top to bottom, and the screw thread is equipped with the second bolt on the cross frame board, and the head of second bolt is located ladder groove wide portion, and when screwing, cross frame board extrusion guide pin bushing bottom, cross frame board locking are on the guide pin bushing, cross frame board is located movable block one side and extends outwards and form the arch, the movable block keep away from the logical groove of slider looks adaptation all has been seted up with cross frame board bottom, and the arch is used for spacing fixedly to the movable block.
Further, the locating pieces are fixedly arranged on the opposite sides of the sliding block and the moving block, the semiconductor chip is located between the two locating pieces, and the bottoms of the locating pieces are flush with the top of the cross frame plate.
Further, a buffer positioning device is arranged in the moving block, a plurality of clamping blocks are fixedly arranged on the front side and the rear side of the inner wall of the guide sleeve, and the buffer positioning device can be used for switching the clamping blocks to form a locking state or a moving state.
Still further, buffering positioner is including lining up the square groove of seting up both sides around the movable block, and the slip of square inslot is equipped with external seat, and the bottom of external seat has set firmly a second spring at least, and the bottom of second spring sets firmly with the bottom of square groove inner wall, set up down the hole between slide and the movable block, it is equipped with down the bolt to push down in the hole, pushes down the top of external seat of bottom accessible of bolt, drives external seat and moves down, the both sides of external seat are equipped with the switching component, and the switching component can get into the square inslot portion.
Still further, the switching component includes trapezoidal piece, well square piece and lower trapezoidal piece, goes up trapezoidal piece, well square piece and lower trapezoidal piece and sets firmly the shaping from an organic whole under going, goes up trapezoidal piece and lower trapezoidal piece's inclined plane reverse design, and on the back and forth effect fixture block respectively, go up trapezoidal piece and be close to the square groove one side of establishing the joint piece admittedly, the linking groove has been seted up to the both sides of external seat, and the linking piece is located the linking inslot and slides, the tip of linking piece has set firmly the third spring, and the tip of third spring sets firmly with the inner wall of linking groove.
The invention also discloses a method for packaging the semiconductor chip, which specifically comprises the following steps:
s1, placing a semiconductor chip in the center of the clamp, flexibly adjusting by adopting a quantity adjusting device of the clamp according to different quantity of packaged semiconductor chips, increasing the packaging application range of the semiconductor chip, and controlling the clamping force of the side edge of the semiconductor chip under the action of an elastic computing device;
s2, adopting a vacuum furnace, pumping air in the furnace by utilizing a vacuum pump, adding a proper amount of nitrogen as a protective gas, introducing formic acid as a reducing gas, and controlling the temperature change of the furnace by using a resistance wire to prevent the solder of the semiconductor chip from being oxidized during packaging;
s3, placing the fixture into a vacuum furnace, searching parameters such as gas concentration, heating temperature, heating time length and the like of the vacuum furnace according to packaging requirements and empirical data, and debugging corresponding process parameters;
s4, debugging the process parameters of the vacuum furnace, automatically running the process after clicking, automatically stopping the process of the vacuum furnace after finishing packaging, taking out the packaged semiconductor chips, manually detecting, judging whether packaging is qualified, and locking the debugged process parameters after confirming that the packaging quality is not problematic, so that the packaging of a large number of semiconductor chips can be realized.
(III) beneficial effects
The invention provides a clamp and a method for packaging a semiconductor chip. Compared with the prior art, the method has the following beneficial effects:
(1) The clamp and the method for packaging the semiconductor chips are based on the special packaging clamp, are simple and ingenious in structure, convenient to assemble and maintain, utilize mechanical limit to align the semiconductor chips, finish clamping of semiconductor chips in different numbers, correspondingly adjust clamping force, and can be produced in a large scale.
(2) The fixture and the method for packaging the semiconductor chips are based on the special vacuum furnace, so that the solder is prevented from contacting with oxygen during packaging, the stability of packaging quality is improved, the special vacuum furnace can flexibly adjust the technological parameters to meet different packaging requirements of the semiconductor chips, the parameters of the vacuum furnace are adjusted according to the packaging requirements, and the packaging consistency of the semiconductor chips in large batches can be realized.
Drawings
FIG. 1 is a perspective view of an external structure of the present invention;
FIG. 2 is a top view of the outer structure of the present invention;
FIG. 3 is a front view of the external structure of the present invention;
FIG. 4 is a left side view of the outer structure of the present invention;
FIG. 5 is a perspective exploded view of the quantity adjusting device of the present invention;
FIG. 6 is a perspective view showing the elastic clamping device of the present invention;
FIG. 7 is a schematic diagram of a first perspective view of an elastic computing device according to the present invention;
FIG. 8 is a schematic diagram of a second perspective view of the elastic computing device of the present invention;
FIG. 9 is a perspective view showing the internal structure of the moving block of the present invention;
FIG. 10 is a perspective sectional view of a moving block according to the present invention;
fig. 11 is a perspective view of a switch assembly of the present invention.
In the figure, 1-guide sleeve, 2-slide block, 201-tabletting, 202-first bolt, 3-moving block, 301-slide plate, 302-first spring, 4-guide pillar, 5-cross frame plate, 501-step groove, 502-second bolt, 503-protrusion, 504-through groove, 6-fixture block, 7-square groove, 701-external seat, 702-second spring, 703-pressing hole, 704-pressing bolt, 8-upper trapezoid block, 801-middle square block, 802-lower trapezoid block, 803-connecting block, 804-connecting groove, 805-third spring and 9-locating piece.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-11, a clamp for packaging semiconductor chips is disclosed, which is used for clamping semiconductor chips, and comprises a guide sleeve 1, wherein one side of the inside of the guide sleeve 1 is provided with a quantity adjusting device, which can be locked on the guide sleeve 1 in a sliding manner, and is used for adjusting the placement quantity of the semiconductor chips, the other side of the inside of the guide sleeve 1 is provided with an elastic clamping device, which can rebound to act on the guide sleeve 1, the semiconductor chips are placed between the quantity adjusting device and the elastic clamping device to form clamping force, and the guide sleeve 1 is provided with an elastic computing device, which resists the elastic clamping device and is used for controlling the clamping force acting on the side edges of the semiconductor chips.
For the design scheme of the quantity adjusting device, the quantity adjusting device comprises a sliding block 2, a pressing piece 201 positioned above the sliding block 2, the sliding block 2 is not directly connected with the pressing piece 201, the sliding block 2 slides on the inner wall of the guide sleeve 1, a first bolt 202 is arranged between the pressing piece 201 and the sliding block 2 through threads, the first bolt 202 is used for connecting the sliding block 2 with the pressing piece 201, when the sliding block 201 is screwed, the pressing piece 201 presses the top of the guide sleeve 1, the sliding block 2 is locked on the guide sleeve 1, and the distance between the pressing piece 201 and the sliding block 2 is reduced due to the screwing process of the first bolt 202 until the sliding block 2 cannot move.
When the semiconductor chip stacking device is used, the first bolt 202 is screwed by the screw driver, the first bolt 202 is used for contacting the pressing sheet 201 to squeeze the force at the top of the guide sleeve 1, then the screw driver is used for pushing the sliding block 2 to slide, after a set distance is set, the screw driver is used for reversing the first bolt 202, so that the sliding block 2 is fixed on the guide sleeve 1, and at the moment, the semiconductor chips can be stacked and horizontally placed.
For the design scheme of the elastic clamping device, the elastic clamping device comprises a moving block 3, a sliding plate 301 fixedly arranged at the top of the moving block 3, protruding plates are integrally welded at two sides of the moving block 3, concave grooves are formed in two sides of the inner wall of a guide sleeve 1, the protruding plates slide along the concave grooves, stability is strong, the moving block 3 and the sliding plate 301 are integrally welded, the sliding plate 301 slides at the top of the guide sleeve 1, the bottom of the sliding plate 301 is in contact with the top of the guide sleeve 1, or a protruding block is fixedly arranged at the bottom of the sliding plate 301 and slides with a groove formed in the top of the guide sleeve 1, at least one first spring 302 is fixedly arranged on the side wall, far away from the sliding block 2, of the moving block 3, preferably 2 or 4 springs are adopted, two sides are symmetrically designed, and the end part of the first spring 302 is fixedly arranged on the inner wall of the guide sleeve 1.
When the semiconductor chip clamping device is used, the moving block 3 is shifted by a screwdriver, the moving block 3 is utilized to move to one side, and after the semiconductor chip is placed, the semiconductor chip can be clamped between the sliding block 2 and the moving block 3 under the action of the first spring 302 by loosening the screwdriver.
In a further scheme, at least one guide post 4, preferably two guide posts are fixedly arranged on one side, away from each other, of the sliding block 2 and the moving block 3, the guide posts 4 penetrate through the guide sleeve 1 and slide with the inner wall of the guide sleeve 1, wherein the first springs 302 are sleeved outside the guide posts 4, and the stability of the sliding block 2 and the moving block 3 in the moving process can be enhanced due to the design of the guide posts 4.
The design scheme of the elastic computing device comprises a cross frame plate 5 which is arranged between the bottoms of guide sleeves 1 in a sliding mode, stepped grooves 501 are formed in the front side and the rear side of the top of the guide sleeve 1 in a penetrating mode, the upper portion and the lower portion of the stepped grooves 501 are divided into wide portions and narrow portions, second bolts 502 are arranged on the cross frame plate 5 in a threaded mode, the heads of the second bolts 502 are located in the wide portions of the stepped grooves 501, the threaded portions are located in the narrow portions and the cross frame plate 5, when the second bolts 502 are screwed, gaps between the cross frame plate 5 and the bottoms of the guide sleeves 1 can be reduced until the cross frame plate 5 extrudes the bottoms of the guide sleeves 1, the cross frame plate 5 is locked on the guide sleeves 1, the cross frame plate 5 is located on one side of a moving block 3 and extends outwards to form protrusions 503, through grooves 504 matched with the cross frame plate 5 are formed in the bottoms of the moving block 3, and the protrusions 503 are used for limiting and fixing the moving block 3.
When the semiconductor chip clamping device is used, the second bolt 502 is screwed by using a screwdriver, the second bolt 502 is used for rotating to enable the cross frame plate 5 and the bottom of the guide sleeve 1 not to be extruded, the cross frame plate 5 can be moved at the moment, after the position of the cross frame plate 5 is adjusted, the second bolt 502 is used for reversely screwing, at the moment, the adjusting cross frame plate 5 is fixed at the bottom of the guide sleeve 1, the position of the boss 503 synchronously moves, and the boss 503 plays a role in blocking the moving block 3, so that the elasticity of the first spring 302 can be adjusted, and reasonable adjustment is carried out according to the requirement of the semiconductor chip clamping range.
Still further scheme, all set firmly spacer 9 at slider 2 and movable block 3's opposite side, spacer 9's thickness is the same with the thickness of semiconductor chip, and is more directly perceived during the centre gripping, and both sides do not also shelter from, and semiconductor chip is located between two spacer 9, and spacer 9's bottom and the top parallel and level of cross frame plate 5.
Still further, the buffer positioning device is arranged in the moving block 3, the front side and the rear side of the inner wall of the guide sleeve 1 are fixedly provided with a plurality of clamping blocks 6, the clamping blocks 6 can be designed at equal intervals, the buffer positioning device can be used for switching the clamping blocks 6 to form a locking state or a moving state to be slowed down, and the buffer positioning device is fixed under the action of the clamping blocks 6 and can not move and the buffer positioning device slows down the elasticity of the first spring 302 under the action of the clamping blocks 6, so that the chip is prevented from being directly impacted.
For the design scheme of the buffering positioning device, the buffering positioning device comprises a square groove 7 which is formed in a penetrating mode on the front side and the rear side of a moving block 3, an external seat 701 is arranged in the square groove 7 in a sliding mode, convex plates are welded on the two sides of the external seat 701 in a uniform mode, grooves are formed in the inner wall of the square groove 7 in a corresponding mode, the convex plates move in the grooves to enhance the stability of the vertical movement of the external seat 701, at least one second spring 702 is fixedly arranged at the bottom of the external seat 701, preferably 2-4 positions are arranged on the two sides of the bottom of the external seat 701 in a symmetrical mode, stability is high, the bottom end of the second spring 702 is fixedly arranged on the bottom of the inner wall of the square groove 7, a pressing hole 703 is formed between a sliding plate 301 and the moving block 3, a pressing bolt 704 is arranged in the pressing hole 703 in a sliding mode, all operations of a screwdriver can be conveniently conducted, the bottom end of the pressing bolt 704 can act on the top of the external seat 701, a switching assembly is arranged on the two sides of the external seat 701 in a downward movement mode, and the switching assembly can enter the square groove 7. Preferably, the switching component comprises an upper trapezoid block 8, a middle trapezoid block 801 and a lower trapezoid block 802, the upper trapezoid block, the middle trapezoid block and the lower trapezoid block 802 are integrally and fixedly formed from top to bottom, inclined planes of the upper trapezoid block 8 and the lower trapezoid block 802 are reversely designed, the inclined planes respectively act on the clamping blocks 6 in a reciprocating mode, a connecting block 803 is fixedly arranged on one side, close to the square groove 7, of the upper trapezoid block 8, connecting grooves 804 are formed in two sides of the external seat 701, the connecting block 803 slides in the connecting grooves 804, third springs 805 are fixedly arranged at the end portions of the connecting blocks 803, and the end portions of the third springs 805 are fixedly arranged with the inner walls of the connecting grooves 804.
When the semiconductor chip is used, after the semiconductor chip is placed, the holding screw driver presses the pressing screw bolt 704, the pressing screw bolt 704 is utilized to press the external seat 701, the external seat 701 moves downwards, so that the upper trapezoid block 8, the middle trapezoid block 801 and the lower trapezoid block 802 move downwards, the third spring 805 is compressed, then the position of the upper trapezoid block 8 corresponds to the inclined plane to act on the clamping block 6, at the moment, the clamping block 6 can not block the upper trapezoid block 8 to move to one side under the action of the inclined plane, the clamping block 6 pushes the connecting block 803 to move in the connecting groove 804 to reciprocate and squeeze the third spring 805 until the moving block 3 clamps the semiconductor chip, the elasticity of the first spring 302 is slowed down, the moving block 3 can not directly impact the semiconductor chip, the protection effect is achieved, and then when the semiconductor chip is required to be taken out, the moving block 3 can be directly pushed to the outside to be locked by the self by the lower trapezoid block 802 corresponding to the inclined plane to act on the clamping block 6 after the screw driver is loosened.
The invention also discloses a method for packaging the semiconductor chip, which specifically comprises the following steps:
s1, placing a semiconductor chip in the center of the clamp, flexibly adjusting by adopting a quantity adjusting device of the clamp according to different quantity of packaged semiconductor chips, increasing the packaging application range of the semiconductor chip, and controlling the clamping force of the side edge of the semiconductor chip under the action of an elastic computing device;
s2, developing a special vacuum furnace, pumping air in the furnace by utilizing a vacuum pump, adding a proper amount of nitrogen as protective gas to adjust the gas concentration according to the packaging requirement and the experimental effect, adding a proper amount of formic acid as reducing gas to adjust the gas concentration according to the packaging requirement and the experimental effect, controlling the temperature change of the furnace by using a resistance wire, and adjusting the temperature parameter according to the experimental effect to prevent the solder of the semiconductor chip from being oxidized during packaging;
s3, placing the clamped special packaging clamp into a special vacuum furnace, searching parameters such as gas concentration, heating temperature, heating time length and the like of the vacuum furnace according to packaging requirements and empirical data, and debugging corresponding process parameters. The variables such as solder material, specification, size, quantity and the like are more, the corresponding technological parameters are different, the debugging process variables are more, the variables are required to be controlled, and the parameters are adjusted one by one;
s4, debugging process parameters of the special vacuum furnace, automatically running after program clicking, automatically stopping the vacuum furnace program after packaging is finished, taking out the packaged semiconductor chips, manually detecting, judging whether packaging is qualified or not, comparing the qualified standard with manual packaging, comparing appearance, functions, service life, consistency and the like, performing small-batch trial production, and locking the debugged process parameters after confirming that the packaging quality is not problematic, so that the packaging of a large number of semiconductor chips can be realized.
The semiconductor chip packaging technology utilizes a special packaging clamp to realize semi-automatic alignment of semiconductor chips, and each clamp can realize simultaneous packaging of a plurality of semiconductor chips each time, and is matched with a special vacuum furnace to complete packaging in a vacuum environment, so that the production efficiency is improved, the stability of packaging quality is improved, and the packaging consistency of the semiconductor chips is improved.
And all that is not described in detail in this specification is well known to those skilled in the art.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. A clamp for packaging semiconductor chips is used for clamping the semiconductor chips, and is characterized in that: the semiconductor chip clamping device comprises a guide sleeve, wherein one side of the inside of the guide sleeve is provided with a quantity adjusting device which can be locked on the guide sleeve in a sliding manner and is used for adjusting the placing quantity of semiconductor chips, the other side of the inside of the guide sleeve is provided with an elastic clamping device which can be elastically acted on the guide sleeve, the semiconductor chips are placed between the quantity adjusting device and the elastic clamping device to form clamping force, and the guide sleeve is provided with an elastic computing device which resists the elastic clamping device and is used for controlling the clamping force acting on the side edges of the semiconductor chips.
2. The jig for semiconductor chip packaging according to claim 1, wherein: the quantity adjusting device comprises a sliding block, a pressing piece positioned above the sliding block, the sliding block slides on the inner wall of the guide sleeve, a first bolt is arranged between the pressing piece and the sliding block in a threaded mode, and when the pressing piece is screwed, the pressing piece presses the top of the guide sleeve, and the sliding block is locked on the guide sleeve.
3. The jig for semiconductor chip packaging according to claim 2, wherein: the elastic clamping device comprises a moving block and a sliding plate fixedly arranged at the top of the moving block, the sliding plate slides at the top of the guide sleeve, at least one first spring is fixedly arranged on the side wall of the moving block far away from the sliding block, and the end part of the first spring is fixedly arranged on the inner wall of the guide sleeve.
4. A jig for semiconductor chip packaging according to claim 3, wherein: at least one guide post is fixedly arranged on one side, away from each other, of the sliding block and the moving block, the guide post penetrates through the guide sleeve and slides with the inner wall of the guide sleeve, and the first spring is sleeved outside the guide post.
5. A jig for semiconductor chip packaging according to claim 3, wherein: the elastic computing device comprises a cross frame plate which is arranged between the bottoms of the guide sleeves in a sliding mode, stepped grooves are formed in the front side and the rear side of the top of the guide sleeve in a penetrating mode, the stepped grooves are divided into wide portions and narrow portions in the upper portion and the lower portion, second bolts are arranged on the cross frame plate in a threaded mode, the heads of the second bolts are located in the wide portions of the stepped grooves, when the cross frame plate is screwed, the bottom of the guide sleeve is extruded by the cross frame plate, the cross frame plate is locked on the guide sleeve, the cross frame plate is located on one side of the moving block and extends outwards to form a protrusion, through grooves matched with the cross frame plate are formed in the bottoms, away from the sliding blocks, of the moving block, and the protrusion is used for limiting and fixing the moving block.
6. The jig for semiconductor chip packaging according to claim 5, wherein: the opposite sides of the sliding block and the moving block are fixedly provided with positioning pieces, the semiconductor chip is positioned between the two positioning pieces, and the bottoms of the positioning pieces are flush with the top of the cross frame plate.
7. A jig for semiconductor chip packaging according to claim 3, wherein: the inside of movable block is equipped with buffering positioner, both sides all have set firmly a plurality of fixture block around the inner wall of guide pin bushing, and buffering positioner can switch the effect fixture block, forms locking state or slows down the mobile state.
8. The jig for semiconductor chip packaging according to claim 7, wherein: the buffering positioning device comprises a square groove which is formed in the front side and the rear side of the moving block in a penetrating mode, an external seat is arranged in the square groove in a sliding mode, at least one second spring is fixedly arranged at the bottom of the external seat, the bottom end of the second spring is fixedly arranged at the bottom of the inner wall of the square groove, a pressing hole is formed between the sliding plate and the moving block, a pressing bolt is arranged in the pressing hole in a sliding mode, the bottom end of the pressing bolt can act on the top of the external seat to drive the external seat to move downwards, switching components are arranged on the two sides of the external seat, and the switching components can enter the inside of the square groove.
9. The jig for semiconductor chip packaging according to claim 8, wherein: the switching assembly comprises an upper trapezoid block, a middle trapezoid block and a lower trapezoid block, wherein the upper trapezoid block, the middle trapezoid block and the lower trapezoid block are integrally and fixedly formed from top to bottom, inclined planes of the upper trapezoid block and the lower trapezoid block are reversely designed and respectively act on clamping blocks in a reciprocating mode, one side, close to the square groove, of the upper trapezoid block is fixedly provided with a connecting block, two sides of the external seat are provided with connecting grooves, the connecting block is located in the connecting grooves and slides, the end portion of the connecting block is fixedly provided with a third spring, and the end portion of the third spring is fixedly arranged with the inner wall of the connecting groove.
10. A method for implementing the semiconductor chip-based packaging of any one of claims 1 to 9, characterized in that: the method specifically comprises the following steps:
s1, placing a semiconductor chip in the center of the clamp, flexibly adjusting by adopting a quantity adjusting device of the clamp according to different quantity of packaged semiconductor chips, increasing the packaging application range of the semiconductor chip, and controlling the clamping force of the side edge of the semiconductor chip under the action of an elastic computing device;
s2, adopting a vacuum furnace, pumping air in the furnace by utilizing a vacuum pump, adding a proper amount of nitrogen as a protective gas, introducing formic acid as a reducing gas, and controlling the temperature change of the furnace by using a resistance wire to prevent the solder of the semiconductor chip from being oxidized during packaging;
s3, placing the fixture into a vacuum furnace, searching parameters such as gas concentration, heating temperature, heating time length and the like of the vacuum furnace according to packaging requirements and empirical data, and debugging corresponding process parameters;
s4, debugging the process parameters of the vacuum furnace, automatically running the process after clicking, automatically stopping the process of the vacuum furnace after finishing packaging, taking out the packaged semiconductor chips, manually detecting, judging whether packaging is qualified, and locking the debugged process parameters after confirming that the packaging quality is not problematic, so that the packaging of a large number of semiconductor chips can be realized.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310156056.5A CN116798933A (en) | 2023-02-23 | 2023-02-23 | Clamp and method for packaging semiconductor chip |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310156056.5A CN116798933A (en) | 2023-02-23 | 2023-02-23 | Clamp and method for packaging semiconductor chip |
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| CN116798933A true CN116798933A (en) | 2023-09-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202310156056.5A Pending CN116798933A (en) | 2023-02-23 | 2023-02-23 | Clamp and method for packaging semiconductor chip |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117548294A (en) * | 2024-01-12 | 2024-02-13 | 凯瑞电子(诸城)有限公司 | Dispensing machine for chip packaging |
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- 2023-02-23 CN CN202310156056.5A patent/CN116798933A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117548294A (en) * | 2024-01-12 | 2024-02-13 | 凯瑞电子(诸城)有限公司 | Dispensing machine for chip packaging |
| CN117548294B (en) * | 2024-01-12 | 2024-04-16 | 凯瑞电子(诸城)有限公司 | Dispensing machine for chip packaging |
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