CN116793424A - MEMS sensor and electronic device - Google Patents
MEMS sensor and electronic device Download PDFInfo
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- CN116793424A CN116793424A CN202310762669.3A CN202310762669A CN116793424A CN 116793424 A CN116793424 A CN 116793424A CN 202310762669 A CN202310762669 A CN 202310762669A CN 116793424 A CN116793424 A CN 116793424A
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- 239000000758 substrate Substances 0.000 claims abstract description 148
- 239000010408 film Substances 0.000 claims description 33
- 239000000463 material Substances 0.000 claims description 25
- 238000002161 passivation Methods 0.000 claims description 12
- 239000010409 thin film Substances 0.000 claims description 7
- 238000004378 air conditioning Methods 0.000 claims description 4
- 239000002033 PVDF binder Substances 0.000 claims description 3
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims description 3
- 239000012528 membrane Substances 0.000 claims description 2
- 230000035945 sensitivity Effects 0.000 abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 230000008859 change Effects 0.000 description 6
- 238000001514 detection method Methods 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 229910052814 silicon oxide Inorganic materials 0.000 description 5
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 239000002210 silicon-based material Substances 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000011257 shell material Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
Abstract
The invention discloses an MEMS sensor and electronic equipment, wherein the MEMS sensor comprises a substrate, a first sensor and a second sensor, the first sensor is arranged on the substrate and is enclosed with the substrate to form a deformation cavity, the first sensor is electrically connected with the substrate, the second sensor is overlapped on one side of the first sensor, which is opposite to the substrate, and the projection of the second sensor on the substrate and the projection of the deformation cavity on the substrate are at least partially overlapped. The invention aims to provide an integrated and miniaturized MEMS sensor, which not only has various functions, but also can effectively prevent the problem of false touch and improve the sensitivity of the sensor.
Description
Technical Field
The invention relates to the technical field of MEMS sensors, in particular to an MEMS sensor and electronic equipment applying the same.
Background
In the related art, the touch mode includes mechanical key, capacitive touch, piezoresistive touch and ultrasonic touch. The mechanical key is not suitable for devices sensitive to volume and weight due to the complicated mechanical structure and huge volume, and especially the development trend of wearable devices is small and light. Although the capacitive touch scheme has been widely used in various consumer electronic devices, it has a limitation on panel materials, and metal materials cannot be used; in addition, once the finger is soaked in water, the capacitive sensing can be disabled. The piezoresistive pressure sensor is made of semiconductor materials and is greatly influenced by temperature, so that the piezoresistive pressure sensor must be subjected to temperature compensation when being used in an environment with large temperature variation; and false touch of the capacitive pressure sensor is also liable to occur. The ultrasonic touch principle is that ultrasonic waves can be reflected at interfaces of materials with different acoustic impedances, different reflectivity can be caused by different acoustic impedance differences, and man-machine touch interaction can be realized on any material panel by detecting the energy difference of the ultrasonic waves before and after reflection. The ultrasonic touch based on the principle has extremely high sensitivity, compared with the capacitive touch, the ultrasonic touch has extremely high/widened selection of electronic product shell materials, and the environmental interference resistance can be improved, but because the materials such as water drops/oil and the like have similar acoustic impedance with fingers, the ultrasonic touch is difficult to distinguish between water drop contact and finger contact, so that the problem of false touch occurs.
Disclosure of Invention
The invention mainly aims to provide an MEMS sensor and electronic equipment, and aims to provide an integrated and miniaturized MEMS sensor which has various functions, can effectively prevent the problem of false touch and improves the sensitivity of the sensor.
To achieve the above object, the present invention proposes a MEMS sensor comprising:
a substrate;
the first sensor is arranged on the substrate, surrounds the substrate to form a deformation cavity, and is electrically connected with the substrate; a kind of electronic device with high-pressure air-conditioning system
The second sensor is overlapped on one side, opposite to the substrate, of the first sensor, and the projection of the second sensor on the substrate and the projection of the deformation cavity on the substrate are at least partially overlapped.
In one embodiment, the first sensor comprises:
the elastic piece is arranged on the substrate and is enclosed with the substrate to form a deformation cavity, and the elastic piece is electrically connected with the substrate; and
the polar plate piece is connected to the substrate, is positioned in the deformation cavity, is opposite to part of the elastic piece in the stacking direction of the first sensor and the second sensor, is arranged at intervals, and is electrically connected with the substrate;
the second sensor is arranged on one side of the elastic piece, which is opposite to the polar plate piece.
In an embodiment, the elastic member includes a film portion and a fixing portion that are connected, the fixing portion surrounds the film portion and encloses with the film portion to form a groove, the fixing portion is connected with the substrate, so that the substrate is enclosed with the notch of the groove to form the deformation cavity, the film portion is spaced from and opposite to the pole plate member, and the second sensor is connected to a side of the film portion facing away from the pole plate member.
In one embodiment, the elastic member is an elastic film;
and/or the film part and the fixing part are of an integrated structure;
and/or, one side of the film part facing the polar plate piece is also provided with an upper polar plate which is spaced from and opposite to the polar plate piece;
and/or the projection area of the polar plate piece on the substrate is smaller than or equal to the projection area of the thin film part on the substrate.
In one embodiment, the second sensor comprises:
the first polar plate is connected to one side of the first sensor, which is away from the substrate;
the piezoelectric layer is arranged on one side of the first polar plate, which is opposite to the first sensor; a kind of electronic device with high-pressure air-conditioning system
The second polar plate is arranged on one side of the piezoelectric layer, which is opposite to the first polar plate.
In one embodiment, the piezoelectric layer is made of a piezoelectric material;
and/or the material of the piezoelectric layer comprises AlN, PZT, znO, alScN, baTiO 3 One of PVDF;
and/or the material of the first polar plate comprises one of Mo, au, pt, al;
and/or the material of the second polar plate comprises one of Mo, au and Al.
In an embodiment, an insulating layer is arranged on the side of the substrate facing the first sensor;
and/or the MEMS sensor further comprises a passivation layer, wherein the passivation layer covers one side of the first sensor and the second sensor, which is away from the substrate;
and/or the substrate is further provided with a plurality of bonding pads, and the first sensor and the second sensor are respectively and electrically connected with the bonding pads;
and/or the first sensor is a capacitive pressure sensor, and the second sensor is a piezoelectric ultrasonic touch sensor.
In an embodiment, the second sensor includes a plurality of second sensors, a portion of the second sensors being receiving sensors and a portion of the second sensors being transmitting sensors.
In an embodiment, the first sensor includes a plurality of sensors, and at least a part of the second sensors are stacked on a side of a part of the first sensors facing away from the substrate;
the number of the first sensors is the same as the number of the second sensors; or, the number of the first sensors is different from the number of the second sensors.
The invention also provides electronic equipment, which comprises an equipment main body and the MEMS sensor, wherein the MEMS sensor is arranged on the equipment main body.
According to the MEMS sensor, the first sensor and the second sensor are arranged on the substrate, so that the first sensor and the substrate are enclosed to form the deformation cavity and are electrically connected with the substrate, the second sensor is overlapped on one side of the first sensor, which is opposite to the substrate, so that the projection of the second sensor on the substrate is at least partially overlapped with the projection of the deformation cavity on the substrate, the first sensor and the second sensor can be integrated on the same substrate, the integrated structure can be simplified, the first sensor and the second sensor share the same deformation cavity, the detection of the sensors with different functions is realized, the MEMS sensor can effectively prevent the problem of false touch through the cooperation of the first sensor and the second sensor, and the sensitivity of the sensor is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic top view of a MEMS sensor according to an embodiment of the invention;
FIG. 2 is a schematic top view of a MEMS sensor according to another embodiment of the present invention;
FIG. 3 is a schematic top view of a MEMS sensor according to another embodiment of the present invention;
FIG. 4 is a schematic cross-sectional view of a MEMS sensor according to an embodiment of the invention;
FIG. 5 is a schematic cross-sectional view of a MEMS sensor according to another embodiment of the invention.
Reference numerals illustrate:
| reference numerals | Name of the name | Reference numerals | Name of the name |
| 100 | MEMS sensor | 23 | Pole plate |
| 1 | Substrate | 3 | Second sensor |
| 11 | Insulating layer | 31 | First polar plate |
| 12 | Bonding pad | 32 | Piezoelectric layer |
| 2 | First sensor | 33 | Second pole plate |
| 21 | Deformation cavity | 34 | Receiving sensor |
| 22 | Elastic piece | 35 | Emission sensor |
| 221 | Film portion | 36 | Elastic cavity |
| 222 | Fixing part | 4 | Passivation layer |
The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present invention are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.
Meanwhile, the meaning of "and/or" and/or "appearing throughout the text is to include three schemes, taking" a and/or B "as an example, including a scheme, or B scheme, or a scheme that a and B satisfy simultaneously.
Furthermore, descriptions such as those referred to as "first," "second," and the like, are provided for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implying an order of magnitude of the indicated technical features in the present disclosure. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.
In the related art, the touch mode includes mechanical key, capacitive touch, piezoresistive touch and ultrasonic touch. The mechanical key is not suitable for devices sensitive to volume and weight due to the complicated mechanical structure and huge volume, and especially the development trend of wearable devices is small and light. Although the capacitive touch scheme has been widely used in various consumer electronic devices, it has a limitation on panel materials, and metal materials cannot be used; in addition, once the finger is soaked in water, the capacitive sensing can be disabled. The piezoresistive pressure sensor is made of semiconductor materials and is greatly influenced by temperature, so that the piezoresistive pressure sensor must be subjected to temperature compensation when being used in an environment with large temperature variation; and false touch of the capacitive pressure sensor is also liable to occur. The ultrasonic touch principle is that ultrasonic waves can be reflected at interfaces of materials with different acoustic impedances, different reflectivity can be caused by different acoustic impedance differences, and man-machine touch interaction can be realized on any material panel by detecting the energy difference of the ultrasonic waves before and after reflection. The ultrasonic touch based on the principle has extremely high sensitivity, compared with the capacitive touch, the ultrasonic touch has extremely high/widened selection of electronic product shell materials, and the environmental interference resistance can be improved, but because the materials such as water drops/oil and the like have similar acoustic impedance with fingers, the ultrasonic touch is difficult to distinguish between water drop contact and finger contact, so that the problem of false touch occurs.
Based on the above concepts and problems, the present invention proposes a MEMS sensor 100. It can be appreciated that the MEMS sensor 100 integrates the plurality of sensors, so that the advantages of the plurality of sensors are integrated, the advantages are compensated, the device performance is greatly improved, and meanwhile, the integrated plurality of sensors are simplified, so that the structure of the MEMS sensor 100 is effectively simplified. It is understood that the MEMS sensor 100 may alternatively be a compound sensor. Optionally, the MEMS sensor 100 integrates a capacitive pressure sensor and a piezoelectric ultrasonic touch sensor (PMUT-piezoelectric micromachined ultrasonic transducer) on a single chip structure at the same time, so that the MEMS sensor 100 is applied to the field of micro-Mechanical Electronics (MEMS), mainly applied to pressure touch, and the like, so that the MEMS sensor 100 can be applied to multiple working modes.
Referring to fig. 1 to 5 in combination, in an embodiment of the invention, the MEMS sensor 100 includes a substrate 1, a first sensor 2 and a second sensor 3, wherein the first sensor 2 is disposed on the substrate 1 and encloses with the substrate 1 to form a deformation cavity 21, the first sensor 2 is electrically connected with the substrate 1, the second sensor 3 is stacked on a side of the first sensor 2 facing away from the substrate 1, and a projection of the second sensor 3 on the substrate 1 and a projection of the deformation cavity 21 on the substrate 1 at least partially overlap.
In the present embodiment, the substrate 1 of the MEMS sensor 100 is used for mounting, fixing and protecting the components of the first sensor 2 and the second sensor 3, that is, the substrate 1 provides a mounting base for the components of the first sensor 2 and the second sensor 3. It will be appreciated that the base 1 may be selected from a substrate, a silicon substrate, a circuit board, a chip, etc., without limitation.
It will be appreciated that in order to ensure that the first sensor 2 and the second sensor 3 integrated in the substrate 1 are able to perform their functions, the first sensor 2 and the second sensor 3 are electrically connected to the substrate 1, i.e. the substrate 1 may provide support for both the first sensor 2 and the second sensor 3 and may also perform a transmission circuit or signal for both the first sensor 2 and the second sensor 3. In this embodiment, a conductive layer or a conductive line is disposed in the substrate 1. Of course, in other embodiments, the first sensor 2 and the second sensor 3 may be connected to an external circuit by other manners, which is not limited herein.
In the present embodiment, as shown in fig. 4 and 5, the side of the substrate 1 facing the first sensor 2 is provided with an insulating layer 11. It will be appreciated that by providing the insulating layer 11, insulation of the first sensor 2 from other components on the substrate 1 can be effectively achieved. Optionally, the insulating layer 11 is made of silicon oxide or silicon nitride.
In order to realize signal transmission or conduction of the first sensor 2 and the second sensor 3 through the substrate 1, the structures such as a conductive layer or a conductive line in the substrate 1 are electrically connected to the first sensor 2 and the second sensor 3, for example, the structures such as a pad, a soldering tab, a contact or an electrode are used to realize structural connection of the first sensor 2 and the second sensor 3 to the conductive layer or the conductive line in the substrate 1. Of course, in other embodiments, the first sensor 2 and the second sensor 3 may also be connected to a pad, a soldering lug, a contact or an electrode on the substrate 1 through a gold wire or the like to achieve connection and conduction with a conductive layer or a conductive line in the substrate 1, which is not limited herein.
Alternatively, as shown in fig. 1 to 3, the substrate 1 is further provided with a plurality of pads 12, and the first sensor 2 and the second sensor 3 are electrically connected to the pads 12, respectively. It will be appreciated that the plurality of pads 12 includes a plurality of input pads and a plurality of output pads, which are electrically connected to the first sensor 2 and the second sensor 3, respectively, without limitation. Alternatively, the bonding pad 12 may be a bonding pad, a contact, or a conductive post of the pipe insulating layer 11, which is not limited herein. The bonding pad 12 is connected to a conductive layer or conductive line in the substrate 1.
In the present embodiment, the first sensor 2 may be selected to be a capacitive pressure sensor, and the second sensor 3 may be selected to be a piezoelectric ultrasonic touch sensor. The first sensor 2 and the substrate 1 are enclosed to form a deformation cavity 21, so that the first sensor 2 deforms to change the distance between two opposite side walls of the deformation cavity 21 after receiving external pressure, thereby causing the signal of the first sensor 2 to change so as to realize detection. It will be appreciated that the detection is achieved by stacking the second sensor 3 on the side of the first sensor 2 facing away from the substrate 1 such that the projection of the second sensor 3 onto the substrate 1 coincides at least partially with the projection of the deformation chamber 21 onto the substrate 1, i.e. the second sensor 3 is operated by causing deformation of the deformation chamber 21, thereby generating an inspection signal.
According to the MEMS sensor 100 disclosed by the invention, the first sensor 2 and the second sensor 3 are arranged on the substrate 1, so that the first sensor 2 and the substrate 1 are enclosed to form the deformation cavity 21 and are electrically connected with the substrate 1, and the second sensor 3 is overlapped on one side of the first sensor 2, which is opposite to the substrate 1, so that the projection of the second sensor 3 on the substrate 1 is at least partially overlapped with the projection of the deformation cavity 21 on the substrate 1, the first sensor 2 and the second sensor 3 can be integrated on the same substrate 1, the integrated structure can be simplified, the first sensor 2 and the second sensor 3 share the same deformation cavity 21, the sensor detection with different functions can be realized, the MEMS sensor 100 can effectively prevent the problem of false touch through the cooperation of the first sensor 2 and the second sensor 3, and the sensitivity of the sensor is improved.
In an embodiment, the MEMS sensor 100 further comprises a passivation layer 4, the passivation layer 4 covering the side of the first sensor 2 and the second sensor 3 facing away from the substrate 1.
In the present embodiment, as shown in fig. 4 and 5, by providing the passivation layer 4, the first sensor 2 and the second sensor 3 can be packaged on the substrate 1 using the passivation layer 4. The passivation layer 4 may enable protection of the first sensor 2 and the second sensor 3. It will be appreciated that the passivation layer 4 may alternatively be a layered structure covering or being laid on the side of the first sensor 2 and the second sensor 3 facing away from the substrate 1. Optionally, the passivation layer 4 is made of silicon oxide, silicon nitride, or the like, which is not limited herein.
In one embodiment, the first sensor 2 includes an elastic member 22 and a plate member 23, the elastic member 22 is disposed on the substrate 1 and surrounds the substrate 1 to form a deformation cavity 21, the elastic member 22 is electrically connected with the substrate 1, the plate member 23 is connected with the substrate 1 and is located in the deformation cavity 21, and in the stacking direction of the first sensor 2 and the second sensor 3, the plate member 23 is opposite to and spaced from a part of the elastic member 22 and is electrically connected with the substrate 1; the second sensor 3 is arranged on the side of the elastic element 22 facing away from the pole plate element 23.
In the present embodiment, as shown in fig. 4 and 5, the first sensor 2 may be selected to be a capacitive pressure sensor. The elastic member 22 and the plate member 23 of the first sensor 2 form a capacitive structure on the substrate 1, and the elastic member 22 and the plate member 23 may alternatively be plate-like structures. It will be appreciated that in order to achieve a capacitive structure of the elastic member 22 and the pole plate member 23, i.e. a structure in which the elastic member 22 and the pole plate member 23 are opposed and spaced apart. A groove may be provided on the substrate 1, such that the plate member 23 is disposed at the bottom wall of the groove, and the elastic member 22 covers the notch of the groove, such that the elastic member 22 and the plate member 23 are opposite and spaced apart to form the deformation cavity 21, so that the elastic member 22 and the plate member 23 are electrically connected to the substrate 1, that is, to the bonding pad 12 of the substrate 1, respectively, and after the elastic member 22 and the plate member 23 are energized, a capacitance is formed between the elastic member 22 and the plate member 23. After the elastic member 22 receives an external pressure, the elastic member 22 is shaped to change the interval between the elastic member 22 and the plate member 23, that is, the deformation chamber 21 is changed, thereby causing a change in capacitance between the elastic member 22 and the plate member 23, and generating an inspection signal.
It will be appreciated that, as shown in fig. 4 and 5, a groove structure may be formed on the elastic member 22, and a side of the elastic member 22 having a notch may be connected to the substrate 1, so that the groove structure of the elastic member 22 encloses with the substrate 1 to form a deformation cavity 21, and the electrode plate 23 is disposed on the substrate 1 and located in the deformation cavity 21, so that the electrode plate 23 is opposite to and spaced from a side of the deformation cavity 21 facing the electrode plate 23 to form a capacitor structure, which is not limited herein.
In an embodiment, as shown in fig. 4 and 5, the elastic member 22 includes a film portion 221 and a fixing portion 222 connected to each other, the fixing portion 222 is disposed around the film portion 221 and encloses with the film portion 221 to form a groove, the fixing portion 222 is connected to the substrate 1, so that the substrate 1 covers the notch of the groove and encloses to form the deformation cavity 21, the film portion 221 is spaced from and opposite to the pole plate 23, and the second sensor 3 is connected to a side of the film portion 221 facing away from the pole plate 23.
In this embodiment, the elastic member 22 may be selected to be an elastic film. In order to achieve the electrical connection of the elastic member 22 through the substrate 1 and to enable deformation when receiving external pressure, the elastic member 22 may be selected from a material that is easily conductive and capable of deformation. Alternatively, the material of the elastic member 22 may be selected from silicon material, silicon oxide, metal material, etc., which is not limited herein. When the material of the elastic member 22 is a silicon material or silicon oxide, the structure is not limited to this, and conductive particles or a conductive layer is provided in the silicon material or silicon oxide.
In one embodiment, the side of the film portion 221 facing the plate member 23 is further provided with an upper plate, which is spaced apart from and opposite to the plate member 23. It will be appreciated that the membrane portion 221 provides a mounting and support foundation for the upper plate, which may alternatively be a plate-like structure. In order to achieve that the elastic member 22 and the pole plate member 23 form a capacitive structure, i.e. a structure in which the upper pole plate and the pole plate member 23 are opposed and spaced apart. Alternatively, the upper plate and plate member 23 is electrically connected to the substrate 1, and the upper plate and plate member 23 is electrically connected to the substrate 1 by, for example, a pad, tab, contact or electrode, etc., without limitation.
It will be appreciated that the film portion 221 and the fixing portion 222 of the elastic member 22 may be formed integrally, so that the structural strength of the elastic member 22 can be improved and the deformability of the film portion 221 can be ensured. Alternatively, the film portion 221 may be an elastic film structure. In the present embodiment, the projection area of the pole plate member 23 on the substrate 1 is smaller than or equal to the projection area of the thin film portion 221 on the substrate 1, so that the pole plate member 23 and the elastic member 22 can be relatively insulated, so as to ensure the capacitance formed between the pole plate member 23 and the elastic member 22.
In an embodiment, the second sensor 3 includes a first electrode plate 31, a piezoelectric layer 32, and a second electrode plate 33, where the first electrode plate 31 is connected to a side of the first sensor 2 facing away from the substrate 1 and is electrically connected to the substrate 1, the piezoelectric layer 32 is stacked on a side of the first electrode plate 31 facing away from the first sensor 2, and the second electrode plate 33 is stacked on a side of the piezoelectric layer 32 facing away from the first electrode plate 31 and is electrically connected to the substrate 1.
In the present embodiment, as shown in fig. 4 and 5, the second sensor 3 may be selected to be a piezoelectric ultrasonic touch sensor. The first electrode plate 31, the piezoelectric layer 32 and the second electrode plate 33 of the second sensor 3 are sequentially stacked on the side of the first sensor 2 facing away from the substrate 1, and the first electrode plate 31 and the second electrode plate 33 are respectively electrically connected with the substrate 1.
It will be appreciated that the first plate 31, the piezoelectric layer 32 and the second plate 33 may alternatively be plate-like structures. In order to avoid interference between the first plate 31 of the second sensor 3 and the elastic member 22 of the first sensor 2, the first plate 31 and the elastic member 22 are arranged insulated from each other, for example, an insulating layer is arranged between the first plate 31 and the elastic member 22; or, the first electrode plate 31 and/or the elastic member 22 may be covered with an insulating layer or the like, which is not limited herein.
In this embodiment, the first electrode plate 31 and the second electrode plate 33 are electrically connected to the bonding pad 12 of the substrate 1, so that the first electrode plate 31 and the second electrode plate 33 are electrified, so that the first electrode plate 31 and the second electrode plate 33 act on the piezoelectric layer 32, and the piezoelectric layer 32 is deformed to drive the thin film portion 221 of the elastic member 22 to deform and vibrate, so as to generate an acoustic wave, after encountering an obstacle, the acoustic wave is reflected, and the reflected acoustic wave is transferred to the elastic member 22, so that the thin film portion 221 deforms and vibrates, and the piezoelectric layer 32 is driven to deform, so that the current of the first electrode plate 31 and the second electrode plate 33 is caused to change, so as to generate a detection signal.
It will be appreciated that as shown in fig. 2 and 3, the second sensors 3 may be selected from a plurality, and some of the second sensors 3 in the plurality of second sensors 3 are receiving sensors 34 and some of the second sensors 3 are transmitting sensors 35. That is, the first polar plate 31 and the second polar plate 33 of the emission sensor 35 are electrified, so that the first polar plate 31 and the second polar plate 33 act on the piezoelectric layer 32, and the piezoelectric layer 32 is deformed to drive the thin film part 221 of the elastic piece 22 to deform and vibrate, so as to generate sound waves; after the sound wave encounters an obstacle, the sound wave is reflected, and the reflected sound wave is transmitted to the elastic member 22 by the receiving sensor 34, so that the thin film portion 221 deforms and vibrates, and the piezoelectric layer 32 of the receiving sensor 34 is driven to deform, so that the current of the first polar plate 31 and the second polar plate 33 of the receiving sensor 34 is caused to change, and a detection signal is generated.
In the present embodiment, the second sensor 3 includes at least two, but may be three, four, five, six or more. The number of the receiving sensors 34 and the number of the transmitting sensors 35 in the plurality of second sensors 3 may be the same or different, and are not limited herein. It will be appreciated that the first sensor 2 may be one, two, three, four, five or more, etc. Alternatively, the number of first sensors 2 is the same as the number of second sensors 3. Of course, in other embodiments, the number of first sensors 2 is different from the number of second sensors 3.
It will be appreciated that when the first sensor 2 includes a plurality and the second sensor 3 includes a plurality, at least a portion of the second sensor 3 is stacked on a side of a portion of the first sensor 2 facing away from the substrate 1, as shown in fig. 1 to 5.
In an embodiment, when the number of the first sensors 2 is the same as the number of the second sensors 3, at least a part of the second sensors 3 are stacked on a side of a part of the first sensors 2 facing away from the substrate 1, and in this case, each second sensor 3 of all the second sensors 3 may be stacked on a side of the first sensor 2 facing away from the substrate 1, as shown in fig. 4. It can be appreciated that each receiving sensor 34 of all the second sensors 3 is stacked on a side of a first sensor 2 facing away from the substrate 1, and each emitting sensor 35 is stacked on a side of the first sensor 2 facing away from the substrate 1. Of course, each second sensor 3 of the second sensors 3 is stacked on a side of the first sensor 2 facing away from the substrate 1, and the remaining second sensors 3 are disposed on a side of the substrate 1 or the elastic member 22 facing away from the substrate 1, where the remaining second sensors 3 and the first sensor 2 do not share the deformation cavity 21, and in order to implement the function of the second sensors 3, the second sensors 3 and the substrate 1 enclose an elastic cavity 36, or the elastic member 22 and the substrate 1 enclose an elastic cavity 36, and the second sensors 3 are disposed opposite to the elastic cavity 36, as shown in fig. 5.
It can be understood that, as shown in fig. 5, each of the receiving sensors 34 of all the second sensors 3 is stacked on a side of the first sensor 2 facing away from the substrate 1, and all the transmitting sensors 35 of all the second sensors 3 are disposed at intervals on a side of the substrate 1 or the elastic member 22 facing away from the substrate 1; alternatively, each of the emission sensors 35 of all the second sensors 3 is stacked on a side of the first sensor 2 facing away from the substrate 1, and all the receiving sensors 34 of all the second sensors 3 are disposed at intervals on a side of the substrate 1 or the elastic member 22 facing away from the substrate 1; alternatively, each of the receiving sensors 34 of the partial receiving sensors 34 of all the second sensors 3 is stacked on a side of the first sensor 2 facing away from the substrate 1, and the remaining receiving sensors 34 are disposed at intervals on a side of the substrate 1 or the elastic member 22 facing away from the substrate 1, each of the partial emitting sensors 35 is stacked on a side of the first sensor 2 facing away from the substrate 1, and the remaining emitting sensors 35 are disposed at intervals on a side of the substrate 1 or the elastic member 22 facing away from the substrate 1, which is not limited herein. At this time, the first sensors 2 which are not stacked by the second sensors 3 are disposed at intervals on the substrate 1.
In an embodiment, when the number of the first sensors 2 is different from the number of the second sensors 3, for example, when the number of the first sensors 2 is greater than the number of the second sensors 3, the manner of the first sensors 2 and the second sensors 3 refers to the above manner, and the first sensors 2 not stacked by the second sensors 3 are disposed on the substrate 1 at intervals. When the number of the first sensors 2 is smaller than the number of the second sensors 3, all the first sensors 2 and part of the second sensors 3 may be arranged in a stacked manner as shown in fig. 4; alternatively, part of the first sensors 2 and part of the second sensors 3 may be disposed in a stacked manner as shown in fig. 4, and the remaining part of the first sensors 2 and the remaining part of the second sensors 3 may be disposed on the substrate 1 at intervals, and disposed in a manner as shown in fig. 5, which is not limited herein.
In this embodiment, the piezoelectric layer 32 is optionally made of a piezoelectric material. The material of the piezoelectric layer 32 may be AlN, PZT (lead zirconate titanate piezoelectric ceramic), znO, alScN, baTiO 3 PVDF, and the like, are not limited herein. Optionally, the material of the first electrode plate 31 includes one of Mo, au, pt, al. Optionally, the material of the second electrode plate 33 includes one of Mo, au, and Al.
According to the MEMS sensor 100, the elastic piece 22 of the first sensor 2 is of a cavity film structure, namely the elastic piece 22 and the substrate 1 form the deformation cavity 21, so that the integration of the capacitive pressure sensor and the piezoelectric ultrasonic touch sensor can be realized at the same time, and the high integration, the miniaturization and the functional diversification of a chip are realized.
When the MEMS sensor 100 works, if water drops drop in a touch area, the piezoelectric ultrasonic touch sensor is difficult to distinguish whether the water drops or the fingers, and false touch recognition is easy to cause, but the capacitive pressure sensor does not generate signals, false touch can not occur, and the false touch problem of the single piezoelectric ultrasonic touch sensor during work is solved; meanwhile, if any external force touches the sensor, the capacitive pressure sensor generates a signal, but the piezoelectric ultrasonic touch sensor judges that the sensor is not a finger, so that the problem of false touch during the operation of the single capacitive pressure sensor is solved, and the sensitivity of the sensor can be effectively improved.
In this embodiment, as shown in fig. 4, the first sensor 2 (i.e., capacitive pressure sensor) and the second sensor 3 (i.e., piezoelectric ultrasonic touch sensor) share a single cavity film, but do not operate simultaneously at the same time. As shown in fig. 3 and 5, after the cavity film is formed, part of the cavity film is used as a structural layer of the second sensor 3 (i.e., a piezoelectric ultrasonic touch sensor), and the other part of the cavity film is used as a bonding pad on the first sensor 2 (i.e., a capacitive pressure sensor), so that the cavity film can work simultaneously.
It will be appreciated that the outline of the first sensor 2 may be polygonal or shaped, such as circular, oval, square, triangular, etc. The outline of the second sensor 3 may be a polygon or a special shape such as a circle, an ellipse, a square, a triangle, etc. In this embodiment, the elastic member 22 of the first sensor 2 may be directly laid on the surface of the substrate 1, and the elastic member 22 and the surface of the substrate 1 enclose to form a plurality of cavity structures disposed at intervals, and the cavity structures may be all used as the deformation cavity 21 (i.e. the deformation cavity 21 is the first sensor 2 and the second sensor 3) in common; alternatively, the cavity structure may be partially shared as the deformation cavity 21 (i.e., the deformation cavity 21 is the first sensor 2 and the second sensor 3), and partially used as the deformation cavity 21 of the first sensor 2 and/or the elastic cavity 36 of the second sensor 3, which is not limited herein.
The invention also provides an electronic device, which comprises a device main body and the MEMS sensor 100, wherein the MEMS sensor 100 is arranged on the device main body. The specific structure of the MEMS sensor 100 refers to the foregoing embodiments, and since the electronic device adopts all the technical solutions of all the foregoing embodiments, at least the MEMS sensor has all the beneficial effects brought by the technical solutions of the foregoing embodiments, which are not described in detail herein.
The foregoing description is only of the optional embodiments of the present invention, and is not intended to limit the scope of the invention, and all equivalent structural modifications made by the present description and accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the present invention.
Claims (10)
1. A MEMS sensor, the MEMS sensor comprising:
a substrate;
the first sensor is arranged on the substrate, surrounds the substrate to form a deformation cavity, and is electrically connected with the substrate; a kind of electronic device with high-pressure air-conditioning system
The second sensor is overlapped on one side, opposite to the substrate, of the first sensor, and the projection of the second sensor on the substrate and the projection of the deformation cavity on the substrate are at least partially overlapped.
2. The MEMS sensor of claim 1, wherein the first sensor comprises:
the elastic piece is arranged on the substrate and is enclosed with the substrate to form a deformation cavity, and the elastic piece is electrically connected with the substrate; and
the polar plate piece is connected to the substrate, is positioned in the deformation cavity, is opposite to part of the elastic piece in the stacking direction of the first sensor and the second sensor, is arranged at intervals, and is electrically connected with the substrate;
the second sensor is arranged on one side of the elastic piece, which is opposite to the polar plate piece.
3. The MEMS sensor of claim 2, wherein the elastic member comprises a film portion and a fixing portion connected to each other, the fixing portion is disposed around the film portion and surrounds the film portion to form a groove, the fixing portion is connected to the substrate so that the substrate fits into a notch of the groove and surrounds the groove to form the deformation cavity, the film portion is spaced apart from and opposite to the plate member, and the second sensor is connected to a side of the film portion facing away from the plate member.
4. The MEMS sensor of claim 3, wherein the elastic member is an elastic membrane;
and/or the film part and the fixing part are of an integrated structure;
and/or, one side of the film part facing the polar plate piece is also provided with an upper polar plate which is spaced from and opposite to the polar plate piece;
and/or the projection area of the polar plate piece on the substrate is smaller than or equal to the projection area of the thin film part on the substrate.
5. The MEMS sensor of claim 1, wherein the second sensor comprises:
the first polar plate is connected to one side of the first sensor, which is away from the substrate;
the piezoelectric layer is arranged on one side of the first polar plate, which is opposite to the first sensor; a kind of electronic device with high-pressure air-conditioning system
The second polar plate is arranged on one side of the piezoelectric layer, which is opposite to the first polar plate.
6. The MEMS sensor of claim 5, wherein the piezoelectric layer is made of a piezoelectric material;
and/or the material of the piezoelectric layer comprises AlN, PZT, znO, alScN, baTiO 3 One of PVDF;
and/or the material of the first polar plate comprises one of Mo, au, pt, al;
and/or the material of the second polar plate comprises one of Mo, au and Al.
7. The MEMS sensor according to any one of claims 1-6, wherein a side of the substrate facing the first sensor is provided with an insulating layer;
and/or the MEMS sensor further comprises a passivation layer, wherein the passivation layer covers one side of the first sensor and the second sensor, which is away from the substrate;
and/or the substrate is further provided with a plurality of bonding pads, and the first sensor and the second sensor are respectively and electrically connected with the bonding pads;
and/or the first sensor is a capacitive pressure sensor, and the second sensor is a piezoelectric ultrasonic touch sensor.
8. The MEMS sensor of any one of claims 1-6, wherein the second sensor comprises a plurality of, a portion of the second sensor being a receiving sensor and a portion of the second sensor being a transmitting sensor.
9. The MEMS sensor of claim 8, wherein the first sensor comprises a plurality of at least a portion of the second sensor is stacked on a side of a portion of the first sensor facing away from the substrate;
the number of the first sensors is the same as the number of the second sensors; or, the number of the first sensors is different from the number of the second sensors.
10. An electronic device comprising a device body and the MEMS sensor according to any one of claims 1 to 9, the MEMS sensor being provided to the device body.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310762669.3A CN116793424A (en) | 2023-06-26 | 2023-06-26 | MEMS sensor and electronic device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310762669.3A CN116793424A (en) | 2023-06-26 | 2023-06-26 | MEMS sensor and electronic device |
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| CN116793424A true CN116793424A (en) | 2023-09-22 |
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| CN202310762669.3A Pending CN116793424A (en) | 2023-06-26 | 2023-06-26 | MEMS sensor and electronic device |
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| CN (1) | CN116793424A (en) |
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- 2023-06-26 CN CN202310762669.3A patent/CN116793424A/en active Pending
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