CN116791181B - Electroplating hanger for circuit board - Google Patents
Electroplating hanger for circuit board Download PDFInfo
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- CN116791181B CN116791181B CN202311091040.7A CN202311091040A CN116791181B CN 116791181 B CN116791181 B CN 116791181B CN 202311091040 A CN202311091040 A CN 202311091040A CN 116791181 B CN116791181 B CN 116791181B
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- 238000009713 electroplating Methods 0.000 title claims abstract description 108
- 230000007704 transition Effects 0.000 claims abstract description 50
- 230000000712 assembly Effects 0.000 claims abstract description 12
- 238000000429 assembly Methods 0.000 claims abstract description 12
- 239000007788 liquid Substances 0.000 claims description 38
- 238000007747 plating Methods 0.000 claims description 32
- 238000003756 stirring Methods 0.000 claims description 25
- 230000001360 synchronised effect Effects 0.000 claims description 19
- 230000007246 mechanism Effects 0.000 claims description 13
- 238000009826 distribution Methods 0.000 claims description 6
- 230000001154 acute effect Effects 0.000 claims description 3
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- 230000001737 promoting effect Effects 0.000 claims description 2
- 238000012545 processing Methods 0.000 abstract description 6
- 238000003860 storage Methods 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000010079 rubber tapping Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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Abstract
The invention relates to the technical field of electroplating hanging tools, in particular to a circuit board electroplating hanging tool, which comprises a lifting frame with a square frame structure, wherein a plurality of sub-hanging tools are uniformly distributed along the direction perpendicular to the frame opening of the lifting frame, a transition frame with a square frame structure is arranged between any two adjacent sub-hanging tools, and one transition frame is fixed on the lifting frame; each transition frame is provided with a retraction assembly and is connected between two adjacent sub-hangers, and under the serial connection of the retraction assemblies, the sub-hangers and the rest transition frames except the transition frames fixed on the lifting frame can be retracted or pulled away from the transition frames fixed on the lifting frame relatively; the electroplating hanger provided by the invention ensures enough conductive contact area of the circuit board, is better in conductivity and is more beneficial to electroplating processing; the integrated structure design of receiving and releasing has made things convenient for the handling of hanger to shift and has reduced handling frequency, and has reduced the storage occupation space of hanger greatly.
Description
Technical Field
The invention relates to the technical field of electroplating hangers, and particularly provides a circuit board electroplating hanger.
Background
The circuit board electroplating can improve the corrosion resistance and the service life of the circuit board, and can also play a role in enhancing the decorative appearance; the circuit board needs to be electrified in the electroplating processing, so that when the circuit board is mounted on an electroplating rack, good conductive contact is required to be ensured, and the circuit board is considered to be of a thin plate structure, so that in the prior art, the circuit board is mostly clamped and mounted by adopting electroplating clamps, the circuit board is required to be manually clamped on each electroplating clamp one by one during mounting, and the circuit board is also required to be manually dismounted one by one when electroplating unloading is completed, when the circuit board in a large batch is subjected to electroplating processing in a manual production line production environment, the circuit board is obviously time-consuming and labor-consuming to assemble and disassemble by adopting the manual operation, and in addition, the existing electroplating rack for a manual line is basically of a rack device with a fixed structure, so that the hanging amount of the small rack is small, and the lifting of a plurality of batches is required to be completed, and is more troublesome; the large-scale hanger is large in hanging capacity, but inconvenient to hoist and transfer, and meanwhile large in storage occupied space.
Disclosure of Invention
In order to solve the above problems, the present invention provides a circuit board electroplating rack for solving the problems mentioned in the background art.
In order to achieve the above purpose, the present invention is implemented by adopting the following technical scheme: the circuit board electroplating hanger comprises a lifting frame with a square frame structure, a plurality of sub-hangers are uniformly distributed along the direction perpendicular to the frame opening of the lifting frame, a transition frame with a square frame structure is arranged between any two adjacent sub-hangers, and one transition frame is fixed on the lifting frame; each transition frame is provided with a folding and unfolding assembly and is connected between two adjacent sub-hanging tools, and under the serial connection of the folding and unfolding assemblies, the sub-hanging tools and other transition frames except for the transition frames fixed on the lifting frame can be relatively and fixedly installed on the lifting frame to be close to and far away from and pull away.
The sub-hanger comprises a hanger frame which is connected with the retraction assembly and is of a square frame structure, a plurality of electroplating clamping plate groups are slidably mounted on the hanger frame along the direction of the horizontal frame edge, each electroplating clamping plate group comprises two electroplating clamping plates which are arranged in a sliding manner and are used for clamping the circuit board electrically, and a synchronous clamping mechanism which synchronously drives the plurality of electroplating clamping plate groups to enable the two electroplating clamping plates to reversely slide is arranged at the bottom end of the hanger frame.
The frame face of transition frame with hanger frame face parallel arrangement, the left and right sides on the transition frame in the direction of perpendicular to a plurality of sub-hangers distribution all is equipped with and promotes the plating solution to flow between two adjacent sub-hangers dialling liquid subassembly.
Preferably, the side wall of the other electroplating clamping plate in the same electroplating clamping plate group is provided with a clamping slot which extends downwards and vertically from the top end, and the bottom end of the electroplating clamping plate is provided with a bottom supporting plate which extends horizontally to one side of the clamping slot.
Preferably, the liquid stirring assembly comprises two liquid stirring rollers which are vertically and rotatably arranged on the transition frame, a plurality of blades are circumferentially distributed on the liquid stirring rollers, a gear is fixed at one side shaft end of each liquid stirring roller, and the gears of the two liquid stirring rollers are meshed with each other.
Preferably, a sliding rail guided along the long side is fixed on the inner end surface of the upper frame of the transition frame; the folding and unfolding assembly comprises two sliding blocks which are slidably arranged on the sliding rails, two folding and unfolding connecting rods are hinged to the two sliding blocks, two folding and unfolding connecting rods hinged to the same sliding block are correspondingly hinged to hanger frames of two adjacent sub-hangers, and four folding and unfolding connecting rods are in diamond distribution.
Preferably, the synchronous clamping mechanism comprises a screw sleeve rotating shaft horizontally arranged at the bottom of the hanger frame in a rotating mode and a driving shaft horizontally slidably arranged at the bottom of the hanger frame, a screw rod section in threaded fit connection with the screw sleeve rotating shaft is arranged on the driving shaft, a connecting rod assembly is assembled and connected between the same side ends of at least one side of two electroplating clamping plates in the electroplating clamping plate group, the connecting rod assembly is connected with the driving shaft, and when the screw sleeve rotating shaft is rotated, the driving shaft slides and drives the two electroplating clamping plates to reversely slide through the connecting rod assembly.
Preferably, a driving block is correspondingly and fixedly arranged on the driving shaft in a matched manner relative to each electroplating clamping plate group, and an extension pin hole is formed in the driving block, wherein the extension direction of the extension pin hole is arranged at an acute angle with the axial direction of the driving shaft; the hanger frame is fixedly connected with a guide lug plate on the same side of each connecting rod assembly; the connecting rod assembly comprises a hinging block, a guide rod which is vertically arranged relative to the driving shaft and is horizontally matched with the guide lug plate at the corresponding position in a sliding mode is fixed on the hinging block, a driven pin which is inserted into the extension pin hole is vertically fixed on the hinging block, two driving connecting rods are hinged on the hinging block, and the other ends of the two driving connecting rods are respectively hinged on the two electroplating clamping plates.
Preferably, a plurality of extractable serial rods are slidably assembled between the hanger frames of the plurality of sub-hangers.
Preferably, the cross section of the clamping slot is in a rectangular groove structure, and the opening end of the clamping slot on the side wall of the electroplating clamping plate is in flaring processing arrangement.
The technical scheme has the following advantages or beneficial effects: 1. the invention provides a circuit board electroplating hanger, wherein a plurality of electroplating clamping plate groups are arranged in a sub-hanger, a circuit board can be quickly inserted between two electroplating clamping plates of the electroplating clamping plate groups one by one, the mounting is stable, and the clamping contact on the two sides of the circuit board ensures enough conductive contact area, is better in conductivity and is more beneficial to electroplating processing; in addition, the synchronous clamping mechanism is arranged in the sub-hanger in a matched mode, so that all the mounted circuit boards can be uniformly clamped and discharged in a uniform tightness mode, and the operation is more convenient and efficient.
2. The invention provides a circuit board electroplating hanger, which is divided into a plurality of sub-hangers, and the plurality of sub-hangers are connected in series through a plurality of winding and unwinding components, so that the plurality of sub-hangers can be unfolded in the electroplating process to ensure effective circulation of electroplating liquid, the plurality of sub-hangers can be gathered and wound after electroplating is finished, the larger hanging capacity is ensured, the lifting and transferring of the hanger are facilitated, the lifting frequency is reduced, and the storage occupied space of the hanger is greatly reduced.
3. The invention provides a circuit board electroplating hanger, wherein a transition frame is arranged between two adjacent sub-hangers in the middle, liquid poking assemblies are oppositely arranged on the transition frame, the circuit board is of a thin plate structure, the electroplating surface of the circuit board is of a two-side plate surface, the liquid poking assemblies can promote the flow of electroplating liquid to the space between the two adjacent sub-hangers, the contact between plating metal and the circuit board plate surface is enhanced, the electroplating efficiency is improved, and the even thickness and smooth surface of the plating layer are ensured.
Drawings
The invention and its features, aspects and advantages will become more apparent from the detailed description of non-limiting embodiments with reference to the following drawings. Like numbers refer to like parts throughout the several views, and are not intended to scale, emphasis instead being placed upon illustrating the principles of the invention.
Fig. 1 is a schematic perspective view of a circuit board electroplating rack provided by the invention.
Fig. 2 is a front view of a circuit board electroplating rack provided by the invention.
Fig. 3 is a top view of a circuit board electroplating rack provided by the invention.
Fig. 4 is a side view of a circuit board electroplating rack provided by the invention.
Fig. 5 is a cross-sectional view taken along A-A in fig. 4.
Fig. 6 is a bottom view of a circuit board electroplating rack provided by the invention.
Fig. 7 is a partial enlarged view at B in fig. 6.
Fig. 8 is a perspective view of a sub-hanger.
Fig. 9 is a schematic perspective assembly view of the synchronized clamping mechanism and a plurality of plating clamping plate sets.
Fig. 10 is a partial enlarged view at C in fig. 9.
Fig. 11 is a schematic perspective view of a transition frame.
In the figure: 1. a lifting frame; 2. a sub-hanger; 21. a hanger frame; 211. a hanger frame; 2111. an elongated aperture; 212. a connecting pipe; 213. a guide ear plate; 22. a guide rail; 23. electroplating a clamping plate group; 231. electroplating a clamping plate; 2311. a clip slot; 2312. a bottom support plate; 2313. a sliding pin; 24. a synchronous clamping mechanism; 241. a swivel axis of the screw sleeve; 242. a drive shaft; 2421. a screw section; 2422. a driving block; 2423. extending the pin hole; 243. a connecting rod assembly; 2431. a hinge block; 2432. a guide rod; 2433. a follower pin; 2434. a drive link; 3. a transition frame; 31. a liquid poking component; 311. a liquid poking roller; 312. a blade; 313. a gear; 314. a belt wheel; 32. a synchronous belt; 33. a slide rail; 4. a retraction assembly; 41. a slide block; 42. a connecting rod is retracted and released; 43. and (5) connecting rods in series.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In order that those skilled in the art will better understand the present invention, the following description will be given in detail with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1, 3 and 4, a circuit board electroplating hanger comprises a lifting frame 1 with a square frame structure, wherein a lifting end convenient for lifting is welded at the top end of the lifting frame 1, and the bottom end of the lifting frame 1 can be directly placed on a horizontal plane for supporting the whole hanger; a plurality of sub-hangers 2 are uniformly distributed along the direction perpendicular to the frame opening of the lifting frame 1, a transition frame 3 with a square frame structure is arranged between any two adjacent sub-hangers 2 in the middle, and one transition frame 3 is welded on the lifting frame 1; it should be noted that, the number of the sub-hangers 2 and the transition frames 3 shown in the drawings is four and three respectively, and because the assembly relationships between the sub-hangers 2 and the transition frames 3 are the same, the number of the sub-hangers 2 and the transition frames 3 in the drawings is simplified, and the actual assembly number can be more than that shown in the drawings, and in addition, because the lifting frames 1 function as central main frames for the hangers, in order to make the gravity center of the whole hanger relatively central to ensure the stability of lifting and the stability of placement, the preferred assembly number of the sub-hangers 2 is an even number of four or more, the preferred assembly number of the transition frames 3 is an odd number of three or more, wherein the transition frames 3 distributed in the middle are welded in the lifting frames 1 in the middle, and the equal numbers of the rest transition frames 3 except the middle are distributed on both sides of the transition frames 3 located in the central position.
As shown in fig. 1, 3 and 4, each transition frame 3 is provided with a retraction assembly 4 and is connected between two adjacent sub-hangers 2, and under the serial connection of the retraction assemblies 4, the plurality of sub-hangers 2 and the rest transition frames 3 except the transition frames 3 fixed on the lifting frame 1 can be relatively and fixedly installed on the lifting frame 1 to be close to and be pulled away from each other.
As shown in fig. 2, 5, 7, 8, 9 and 10, the sub-hanger 2 includes a hanger frame 21 connected with the retractable assembly 4 and having a square frame structure, the hanger frame 21 includes two hanger frames 211 having two square frame structures, connecting pipes 212 are welded between the top angle positions of the four square frames, connecting ends of each connecting pipe 212 on the frame surfaces of the two hanger frames 211 are communicated with the pipe orifice, guide rails 22 are horizontally welded on inner side walls of the two hanger frames 211 on the upper and lower frame edges, the guide rails 22 on the upper and lower sides of the two hanger frames 211 respectively form a group, and two guide rails 22 in the group are oppositely arranged; the rack frame 21 is evenly distributed with a plurality of electroplating clamping plate groups 23 along the horizontal frame edge direction, what needs to be supplemented is that in order to facilitate series flow of electroplating solution between a plurality of sub-racks 2, circulation gaps are reserved between every two adjacent electroplating clamping plate groups 23, each electroplating clamping plate group 23 comprises two electroplating clamping plates 231 which are arranged between the upper and lower two groups of guide rails 22 in a sliding mode and are used for clamping a circuit board electrically, clamping slots 2311 which vertically extend downwards from the top end are formed in the side wall of the other electroplating clamping plate 231 in the same electroplating clamping plate group 23 on the electroplating clamping plates 231, the cross section of each clamping slot 2311 is of a rectangular groove structure, the width of each rectangular groove is slightly wider than the thickness of the edge of a circuit board, the circuit board is vertically inserted into and clamped in the clamping slots 2311 of the two electroplating clamping plates 231, and in order to facilitate insertion of the circuit board, and the opening ends of the clamping slots 2311 on the side wall of the electroplating clamping plates 231 are in a flaring processing mode. The bottom end of the plating clamp 231 is provided with a bottom support plate 2312 extending horizontally to one side of the clamping slot 2311, and the hanger provided by the invention is a special hanger specially used for plating a circuit board with a specific size, so that the side clamping widths of the two plating clamp 231 in the plating clamp group 23 are set according to the size of the circuit board, a plurality of circuit boards can be vertically stacked and spliced between the two plating clamp 231, and the circuit board positioned at the lowest part is supported and placed by the two bottom support plates 2312.
As shown in fig. 2, 6, 8 and 9, the circuit board is used as a plating member in the plating process, and therefore needs to be connected with a cathode, the plating clamping plate set 23 is used for clamping the circuit board to make the two side surfaces of the circuit board fully contact with the plating solution, in addition, in the embodiment, the plating clamping plate set 23 is electrically connected to the cathode end, when the circuit board is clamped in the plating clamping plate set 23 in a plugging manner, the cathode is communicated, the plating clamping plate set 23 replaces the existing plating clamp, and a plurality of circuit boards can be clamped simultaneously. In this embodiment, in order to release the two plating splints 231 to facilitate inserting the circuit boards one by one into the plating splints 23, and simultaneously enable the two plating splints 231 to maintain effective electrical clamping contact with the circuit boards placed therebetween, the bottom end of the rack frame 21 is equipped with a synchronous clamping mechanism 24 that synchronously drives the plurality of plating splints 23 to enable the two plating splints 231 to slide reversely.
As shown in fig. 2, 6, 7, 8, 9 and 10, the synchronous clamping mechanism 24 includes a screw sleeve rotating shaft 241 horizontally rotatably installed at the bottom of the hanger frame 21 and a driving shaft 242 horizontally slidably installed at the bottom of the hanger frame 21, a seated bearing for rotatably installing the screw sleeve rotating shaft 241 is welded between the two hanger frames 211, and a sliding sleeve for slidably installing the driving shaft 242 is also welded between the two hanger frames 211; the driving shaft 242 is provided with a screw section 2421 in threaded fit connection with the screw sleeve rotating shaft 241, and in this embodiment, in order to maintain the balance and stability of driving, the connecting rod assemblies 243 are assembled and connected between the same side ends of the two electroplating clamping plates 231 on two sides in the electroplating clamping plate group 23; an extension hole 2111 is formed on the frame surface of the lower frame, which is opposite to each electroplating clamping plate 231, of the two hanger frames 211 in the hanger frame 21, a sliding pin 2313 is welded on the electroplating clamping plates 231 horizontally and vertically in the sliding direction of the two sides, and the sliding pin 2313 slides in a penetrating manner along the extension hole 2111 correspondingly arranged on the same side; a driving block 2422 is correspondingly and fixedly arranged on the driving shaft 242 corresponding to each electroplating clamping plate group 23, two extending pin holes 2423 which are arranged in an acute angle with the axial direction of the driving shaft 242 in the extending direction are arranged on the driving block 2422, and the two extending pin holes 2423 are symmetrically arranged about the driving shaft 242; each connecting rod assembly 243 of the hanger frame 211 on the lower frame surface and on the same side is correspondingly welded with a guide lug plate 213, and the guide lug plate 213 is arranged in the middle relative to the two electroplating clamping plates 231; the link assembly 243 includes a hinge block 2431, a guide rod 2432 vertically disposed relative to the driving shaft 242 and horizontally slidably engaged with the guide lug 213 at a corresponding position is welded to the hinge block 2431, a driven pin 2433 inserted into the extension pin hole 2423 at an adjacent position is vertically welded to the hinge block 2431, two driving links 2434 are hinged to the hinge block 2431, and the other ends of the two driving links 2434 are respectively hinged to the two plating clamping plates 231.
The synchronous clamping mechanism 24 can realize synchronous driving control of the plurality of plating clamping plate groups 23, and can increase or decrease the relative distance between the two plating clamping plates 231, as shown in fig. 7, when the screw sleeve rotating shaft 241 is rotated and the driving shaft 242 is moved downwards, the driving block 2422 will move downwards along with the driving shaft 242 synchronously, the driving block 2422 will drive the driven pin 2433 through the extending hole 2111, so that the guide rods 2432 on the left and right sides slide leftwards and rightwards respectively, the hinge block 2431 will make the distance between the two plating clamping plates 231 gradually increase through the two driving connecting rods 2434, conversely, when the driving shaft 242 moves upwards, the distance between the two plating clamping plates 231 can gradually decrease from the increasing state, and because the driven pin 2433 is penetrated in the extending pin hole 2423 and limited by the hole length thereof, the distance change amount of the two plating clamping plates 231 is determined by the extending pin hole 2423. Through the synchronous clamping mechanism 24 that sets up can be after accomplishing the circuit board and place synchronous carry out the electrical property clamp operation to all circuit boards, avoided current mode that adopts electroplating clamp to need carry out the trouble of centre gripping one by one to every circuit board, also be convenient for follow-up completion electroplate the back and carry out the quick unloading to all circuit boards that lie in same sub-hanger 2, improved convenience and the efficiency of operation greatly.
As shown in fig. 1 and 5, a sliding rail 33 guided along a long side is welded on the inner end surface of the upper frame of the transition frame 3; the retraction assembly 4 comprises two sliding blocks 41 which are slidably arranged on the sliding rail 33, two retraction connecting rods 42 are hinged on the two sliding blocks 41, the two retraction connecting rods 42 hinged on the same sliding block 41 are correspondingly hinged on the hanger frames 211 of the two adjacent sub-hangers 2, the two retraction connecting rods 42 hinged with the same hanger frame 211 on the two sliding blocks 41 are jointly hinged on the same hinged end, the hinged end is positioned at the central position of the upper frame of the hanger frame 211, and the four retraction connecting rods 42 are in diamond distribution. The transition frame 3 is used as an installation supporting structure of each retractable assembly 4, and the plurality of retractable assemblies 4 realize the sequential series connection among the plurality of sub-hangers 2; before the electroplating operation, after the placement of the circuit boards is completed in each sub-hanger 2, each transition frame 3 which is not fixed on the lifting frame 1 is pulled one by one to move away from the transition frame 3 which is fixedly installed relatively, so that the distance between the adjacent sub-hangers 2 is opened one by one under the connection of the retraction assembly 4, and then the space between the circuit boards in the adjacent two sub-hangers 2 is increased, so that the electroplating liquid can circulate conveniently; it should be added that, in order to make the pulling-apart intervals of any two adjacent sub-hangers 2 reasonable and equal as much as possible, a limiting block or limiting plate for limiting the sliding block 41 may be fixedly installed in the sliding rail 33. After electroplating is completed, the transition frame 3 can be reversely moved, so that the transition frame 3 and the sub-hanging tool 2 can be gathered and close to the lifting frame 1, the hanging tool which is gathered and placed is more compact, the storage occupied space of the hanging tool can be greatly reduced while the larger hanging capacity of the hanging tool is maintained, the problem that the occupied space is large and the lifting and transferring are inconvenient due to the fact that the structure of the traditional similar hanging tool is fixed is solved, and meanwhile, the trouble that a plurality of hanging tools with small hanging capacity are required to be lifted and transported for a plurality of times is solved. Because the sub-hangers 2 are connected in series only through the retraction assembly 4, in order to ensure the stability of the structure, a plurality of series connection rods 43 are assembled between the hanger frames 21 of the sub-hangers 2 in a sliding manner, the series connection rods 43 penetrate through connecting pipes 212 arranged at corresponding positions of the sub-hangers 2, the series connection rods 43 can be pulled out, and when the hangers are retracted, the series connection rods 43 can be pulled out.
As shown in fig. 2, 3, 5 and 11, the frame surface of the transition frame 3 is parallel to the frame surface of the rack frame 21, and liquid pulling assemblies 31 for promoting the flow of the electroplating liquid between two adjacent sub-racks 2 are mounted on the transition frame 3 on both the left and right sides in the distribution direction perpendicular to the plurality of sub-racks 2. The liquid stirring assembly 31 comprises two liquid stirring rollers 311 which are vertically and rotatably arranged on the transition frame 3, a plurality of blades 312 are circumferentially distributed on the liquid stirring rollers 311, a gear 313 is fixed at one side shaft end of the liquid stirring rollers 311, and the gears 313 of the two liquid stirring rollers 311 are meshed with each other; in order to achieve synchronous driving of the four tapping rollers 311, a motor, which is not shown in the drawings, is mounted at the shaft end of one of the tapping rollers 311, and the motor is hermetically mounted to avoid direct electrical contact with the plating liquid; in addition, as shown in fig. 3, in the same transition frame 3, the belt pulley 314 is fixed at the shaft end of the liquid stirring roller 311 located on the right side in the liquid stirring assembly 31 located above, the belt pulley 314 is fixed at the shaft end of the liquid stirring roller 311 located on the left side in the liquid stirring assembly 31 located below, and the synchronous belt 32 is assembled between the two belt pulleys 314, after the motor is started, the left and right liquid stirring rollers 311 in the liquid stirring assembly 31 located above rotate clockwise and anticlockwise respectively, and under the driving of the synchronous belt 32, the left and right liquid stirring rollers 311 in the liquid stirring assembly 31 located below rotate anticlockwise and clockwise respectively, so that the two groups of liquid stirring rollers 311 can stir the electroplating liquid to flow towards between the adjacent two sub-hangers 2 actively, and the flow of the plating metal cations towards the middle is promoted to enhance the contact with the surface of the circuit board, thereby improving the electroplating efficiency and the uniformity of the plating combination.
When the hanger provided by the invention is used for electroplating the circuit board, the electroplating method can be carried out according to the following steps: firstly, hanging the hanging tool to the side of the electroplating bath in a folded state, then, keeping the electroplating clamping plate groups 23 in a loose clamping state through the synchronous clamping mechanism 24, then, putting the circuit boards into each electroplating clamping plate group 23 in each sub-hanging tool 2 one by one, after the circuit boards are all put in, electrically clamping the circuit boards through the synchronous clamping mechanism 24, then, pushing and pulling the hanging tool open, hanging the hanging tool in the electroplating bath in a state of keeping the hanging tool open for electroplating operation, after electroplating is finished, hanging the hanging tool from the electroplating bath, loosening each electroplating clamping plate group 23 one by one, and lifting and pulling the circuit boards upwards for discharging.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
In the description of the present invention, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "connected," "mounted," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
The preferred embodiments of the present invention have been described above. It is to be understood that the invention is not limited to the specific embodiments described above, wherein devices and structures not described in detail are to be understood as being implemented in a manner common in the art; any person skilled in the art will make many possible variations and modifications, or adaptations to equivalent embodiments without departing from the technical solution of the present invention, which do not affect the essential content of the present invention. Therefore, any simple modification, equivalent variation and modification of the above embodiments according to the technical substance of the present invention still fall within the scope of the technical solution of the present invention.
Claims (7)
1. A circuit board electroplating hanger is characterized in that: the lifting frame (1) comprises a square frame structure, a plurality of sub-hangers (2) are uniformly distributed along the direction perpendicular to the frame opening of the lifting frame (1), transition frames (3) with square frame structures are arranged between any two adjacent sub-hangers (2), and one transition frame (3) is fixed on the lifting frame (1); each transition frame (3) is provided with a folding component (4) and is connected between two adjacent sub-hangers (2), and under the serial connection of the folding components (4), the sub-hangers (2) and the rest transition frames (3) except the transition frames (3) fixed on the lifting frame (1) can be relatively and fixedly installed on the lifting frame (1) to be close to and far away from each other; wherein:
the sub-hanger (2) comprises a hanger frame (21) which is connected with the retraction assembly (4) and is of a square frame structure, a plurality of electroplating clamping plate groups (23) are slidably arranged on the hanger frame (21) along the direction of the horizontal frame edge, each electroplating clamping plate group (23) comprises two electroplating clamping plates (231) which are slidably arranged relatively and are used for clamping a circuit board electrically, and a synchronous clamping mechanism (24) which synchronously drives the plurality of electroplating clamping plate groups (23) to enable the two electroplating clamping plates (231) to reversely slide is arranged at the bottom end of the hanger frame (21);
the frame surface of the transition frame (3) is parallel to the frame surface of the hanger frame (21), and liquid poking assemblies (31) for promoting electroplating liquid to flow between two adjacent sub-hangers (2) are arranged on the left side and the right side of the transition frame (3) in the distribution direction perpendicular to the plurality of sub-hangers (2);
the liquid stirring assembly (31) comprises two liquid stirring rollers (311) which are vertically and rotatably arranged on the transition frame (3), a plurality of blades (312) are circumferentially distributed on the liquid stirring rollers (311), a gear (313) is fixed at one side shaft end of each liquid stirring roller (311), and the gears (313) of the two liquid stirring rollers (311) are meshed with each other.
2. The circuit board electroplating rack of claim 1, wherein: the electroplating clamp plate (231) is provided with clamp slots (2311) which vertically extend downwards from the top end on the side wall of the other electroplating clamp plate (231) facing the same electroplating clamp plate group (23), and the bottom end of the electroplating clamp plate (231) is provided with a bottom supporting plate (2312) which horizontally extends towards one side of the clamp slots (2311).
3. The circuit board electroplating rack of claim 1, wherein: a sliding rail (33) guided along the long side is fixed on the inner end surface of the upper frame of the transition frame (3); the folding and unfolding assembly (4) comprises two sliding blocks (41) which are slidably mounted on the sliding rails (33), two folding and unfolding connecting rods (42) are hinged on the two sliding blocks (41), two folding and unfolding connecting rods (42) hinged on the same sliding block (41) are correspondingly hinged on the hanger frames (21) of two adjacent sub-hangers (2), and four folding and unfolding connecting rods (42) are in diamond distribution.
4. The circuit board electroplating rack of claim 2, wherein: the synchronous clamping mechanism (24) comprises a screw sleeve rotating shaft (241) horizontally arranged at the bottom of the hanger frame (21) in a rotating mode and a driving shaft (242) horizontally arranged at the bottom of the hanger frame (21) in a sliding mode, a screw rod section (2421) in threaded fit connection with the screw sleeve rotating shaft (241) is arranged on the driving shaft (242), connecting rod assemblies (243) are assembled and connected between the same side ends of at least one side of two electroplating clamping plates (231) in the electroplating clamping plate group (23), the connecting rod assemblies (243) are connected with the driving shaft (242), and when the screw sleeve rotating shaft (241) is rotated, the driving shaft (242) slides and drives the two electroplating clamping plates (231) to reversely slide through the connecting rod assemblies (243).
5. The plating rack of claim 4, wherein: a driving block (2422) is correspondingly and fixedly arranged on the driving shaft (242) corresponding to each electroplating clamping plate group (23), and an extension pin hole (2423) with an extension direction being in an acute angle with the axial direction of the driving shaft (242) is arranged on the driving block (2422); the hanger frame (21) is fixedly connected with a guide lug plate (213) on the same side of each connecting rod assembly (243); the connecting rod assembly (243) comprises a hinging block (2431), a guide rod (2432) which is vertically arranged relative to the driving shaft (242) and is horizontally matched with the guide lug plate (213) at the corresponding position in a sliding mode is fixed on the hinging block (2431), a driven pin (2433) which is inserted into the extension pin hole (2423) is vertically fixed on the hinging block (2431), two driving connecting rods (2434) are hinged on the hinging block (2431), and the other ends of the two driving connecting rods (2434) are respectively hinged on the two electroplating clamping plates (231).
6. The circuit board electroplating rack of claim 1, wherein: a plurality of extractable serial rods (43) are jointly and slidably assembled between the hanger frames (21) of the plurality of sub-hangers (2).
7. The circuit board electroplating rack of claim 2, wherein: the cross section of the clamping slot (2311) is of a rectangular groove structure, and the opening end of the clamping slot (2311) positioned on the side wall of the electroplating clamping plate (231) is provided with a flaring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311091040.7A CN116791181B (en) | 2023-08-29 | 2023-08-29 | Electroplating hanger for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311091040.7A CN116791181B (en) | 2023-08-29 | 2023-08-29 | Electroplating hanger for circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116791181A CN116791181A (en) | 2023-09-22 |
| CN116791181B true CN116791181B (en) | 2023-11-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311091040.7A Active CN116791181B (en) | 2023-08-29 | 2023-08-29 | Electroplating hanger for circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116791181B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2087430A (en) * | 1980-11-14 | 1982-05-26 | Alford Process Equipment Ltd | Plating Apparatus |
| KR20100138349A (en) * | 2009-06-25 | 2010-12-31 | 이상경 | A plating device for super thin pcb |
| KR20140004991U (en) * | 2013-03-07 | 2014-09-17 | 주식회사 써피스텍 | A jig apparatus for plating object |
| CN205576342U (en) * | 2016-04-28 | 2016-09-14 | 苏州市汉宜化学有限公司 | Be applied to axle bush local electroplating's hanger |
| CN107059099A (en) * | 2017-04-18 | 2017-08-18 | 林春芳 | A kind of pcb board Electropolating hangers |
| CN216274436U (en) * | 2021-07-30 | 2022-04-12 | 惠州市方能精密电子有限公司 | Hanging tool for electroplating electronic frame |
| CN219297669U (en) * | 2022-12-20 | 2023-07-04 | 湖州红缨再生资源有限公司 | Aluminium alloy anodic oxidation anchor clamps that stability is good efficient |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20190157708A1 (en) * | 2017-11-20 | 2019-05-23 | Shenzhen Newpower Automation Equipment Co., LTD. | Lithium Battery Formation Fixture and Automation Battery Formation Equipment |
-
2023
- 2023-08-29 CN CN202311091040.7A patent/CN116791181B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2087430A (en) * | 1980-11-14 | 1982-05-26 | Alford Process Equipment Ltd | Plating Apparatus |
| KR20100138349A (en) * | 2009-06-25 | 2010-12-31 | 이상경 | A plating device for super thin pcb |
| KR20140004991U (en) * | 2013-03-07 | 2014-09-17 | 주식회사 써피스텍 | A jig apparatus for plating object |
| CN205576342U (en) * | 2016-04-28 | 2016-09-14 | 苏州市汉宜化学有限公司 | Be applied to axle bush local electroplating's hanger |
| CN107059099A (en) * | 2017-04-18 | 2017-08-18 | 林春芳 | A kind of pcb board Electropolating hangers |
| CN216274436U (en) * | 2021-07-30 | 2022-04-12 | 惠州市方能精密电子有限公司 | Hanging tool for electroplating electronic frame |
| CN219297669U (en) * | 2022-12-20 | 2023-07-04 | 湖州红缨再生资源有限公司 | Aluminium alloy anodic oxidation anchor clamps that stability is good efficient |
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| Publication number | Publication date |
|---|---|
| CN116791181A (en) | 2023-09-22 |
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