CN116787499B - Wafer cutter of polypropylene capacitance film splitting machine - Google Patents
Wafer cutter of polypropylene capacitance film splitting machine Download PDFInfo
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- CN116787499B CN116787499B CN202311038149.4A CN202311038149A CN116787499B CN 116787499 B CN116787499 B CN 116787499B CN 202311038149 A CN202311038149 A CN 202311038149A CN 116787499 B CN116787499 B CN 116787499B
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- 239000004743 Polypropylene Substances 0.000 title claims abstract description 23
- -1 polypropylene Polymers 0.000 title claims abstract description 23
- 229920001155 polypropylene Polymers 0.000 title claims abstract description 23
- 239000000919 ceramic Substances 0.000 claims abstract description 27
- 239000003990 capacitor Substances 0.000 claims abstract description 23
- 238000002360 preparation method Methods 0.000 claims abstract description 12
- 238000005245 sintering Methods 0.000 claims abstract description 12
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 10
- 229910052581 Si3N4 Inorganic materials 0.000 claims abstract description 4
- 239000000203 mixture Substances 0.000 claims abstract description 3
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims abstract description 3
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims abstract description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 15
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 12
- 229910002804 graphite Inorganic materials 0.000 claims description 12
- 239000010439 graphite Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 11
- 239000000843 powder Substances 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 9
- 239000011812 mixed powder Substances 0.000 claims description 9
- 238000003825 pressing Methods 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000002156 mixing Methods 0.000 claims description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 229910052582 BN Inorganic materials 0.000 claims description 6
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 6
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims description 6
- 238000000498 ball milling Methods 0.000 claims description 6
- 239000002270 dispersing agent Substances 0.000 claims description 6
- 239000012299 nitrogen atmosphere Substances 0.000 claims description 6
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical group [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 claims description 5
- 238000000227 grinding Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 239000012752 auxiliary agent Substances 0.000 claims description 3
- 238000005219 brazing Methods 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 235000019441 ethanol Nutrition 0.000 claims description 3
- 238000001704 evaporation Methods 0.000 claims description 3
- 238000011049 filling Methods 0.000 claims description 3
- 238000007731 hot pressing Methods 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 239000011159 matrix material Substances 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 239000002002 slurry Substances 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 239000012856 weighed raw material Substances 0.000 claims description 3
- 238000005303 weighing Methods 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- 229910052593 corundum Inorganic materials 0.000 claims description 2
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims description 2
- 229910001845 yogo sapphire Inorganic materials 0.000 claims description 2
- 238000005520 cutting process Methods 0.000 abstract description 15
- 239000000956 alloy Substances 0.000 abstract description 7
- 229910045601 alloy Inorganic materials 0.000 abstract description 7
- 238000003491 array Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 4
- 230000002787 reinforcement Effects 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Abstract
The invention discloses a wafer cutter of a polypropylene capacitor film dividing and cutting machine, and relates to the technical field of wafer cuttersThe blade comprises a blade ring body, wherein the blade ring body comprises an inner ring body and an outer ring body which are positioned in the blade ring body, and a plurality of annular arrays and mounting plates which are arranged in the same direction are arranged at the outer edge of the inner ring body; a reinforcing component is arranged between the inner ring body and the outer ring body, a blade component is soldered on a vertical surface of the mounting piece clockwise relative to the outer ring body, and the blade component is contacted with the propylene capacitor film when rotating; the first blade and the second blade are made of TiC-Si3N4 ceramic, and the composition of the first blade and the second blade comprises the following components: the mass ratio of the alpha-Si 3N4 to the TiC to the sintering aid is 75-85:10-20:5. by TiC-Si 3 N 4 The common alloy blade is replaced by the ceramic, the preparation cost is low, the preparation method is simple, and the economic cost is saved due to the relatively low density of the ceramic, and the prepared TiC-Si 3 N 4 The ceramic has better heat conductivity coefficient and high tissue stability, and prolongs the service life of the wafer cutter.
Description
Technical Field
The invention relates to the technical field of wafer cutters, in particular to a wafer cutter of a polypropylene capacitor film dividing and cutting machine.
Background
Film capacitors, also known as plastic film capacitors, use plastic films as dielectrics, wherein polypropylene is more common in dielectrics, and when polypropylene is applied to capacitors, a slitting machine is required to cut the polypropylene film.
The circular cutters of the existing splitting machine are integrally arranged and are annular or circular, but the structure is simpler, the internal stress of the circular cutters is not easy to release to the outside under the high-speed or high-heat state, and after the circular cutters are used for many times, metal fatigue is extremely easy to generate, so that the service life is shortened.
Disclosure of Invention
(one) solving the technical problems
Aiming at the defects of the prior art, the invention provides a wafer cutter of a polypropylene capacitance film dividing and cutting machine,
the existing annular blade is arranged in a modularized mode, the annular blade is divided into a blade ring body, a blade assembly and a reinforcing assembly, the reinforcing assembly is utilized to buffer and reinforce, the blade ring body is convenient to release internal stress, the existing cutting surface is improved through ceramic materials, the cutting effect is improved, and the problems in the prior art are solved
In order to achieve the above purpose, the invention is realized by the following technical scheme: the wafer cutter of the polypropylene capacitance film dividing and cutting machine comprises a blade ring body, wherein the blade ring body comprises an inner ring body and an outer ring body which are positioned in the blade ring body, and a plurality of mounting plates which are arrayed in a ring shape and are arranged in the same direction are arranged at the outer edge of the inner ring body; a reinforcing component is arranged between the inner ring body and the outer ring body, a blade component is soldered on a vertical surface of the mounting piece clockwise relative to the outer ring body, and the blade component is contacted with the propylene capacitor film when rotating; the blade assembly comprises a first blade and a second blade, wherein the first blade and the second blade are made of TiC-Si3N4 ceramic, and the composition of the blade assembly comprises the following components: the mass ratio of the alpha-Si 3N4 to the TiC to the sintering aid is 75-85:10-20:5.
further, the blade assembly includes the second blade of being connected with the installation piece in a brazing way, and the tip outside that the installation piece was kept away from to the second blade is crossed the connecting piece and is detachably connected with first blade, has seted up the holding tank at the terminal surface of first blade towards the second blade, and the tip of second blade extends to the inside of holding tank.
Further, the connecting piece is located between holding tank and the second blade, and the connecting piece includes the draw-in groove that is located the second blade surface to and be located the holding tank inner wall, draw-in groove and draw-in groove gomphosis mutually.
Further, the reinforcement assembly comprises an inner rod connected to the inner wall of the outer ring body and an outer pipe body connected to the outer wall of the inner ring body, the inner rod extends to the inside of the outer pipe body, and a connecting rod is connected between two adjacent inner rods.
Further, the inner rod slides along the inner part of the outer pipe body, a buffer part is arranged at the end of the stroke of the inner rod and comprises two parallel contact plates, and elastic sheets are arranged between the two contact plates, wherein the elastic sheets are sigma-shaped, and two adjacent elastic sheets are symmetrically distributed.
Further, the annular preparation method of the wafer cutter comprises the following steps:
step one, weighing materials: alpha-Si 3N4, tiC and sintering auxiliary agent are mixed according to the mass ratio of 75-85:10-20:5, a step of;
step two, mixing materials: comprising the following steps:
step 201, stirring the weighed raw material powder, a Y2O3/Al2O3 sintering aid and absolute ethyl alcohol by using a magnetic stirrer at a rotating speed of 100r/min;
step 202, putting the mixed powder into a ball milling tank of tetrafluoroethylene, adding silicate dispersing agent, and carrying out wet mixing, wherein the ball milling time is 10 hours, and the rotating speed is 200r/min; the silicate dispersant can select aluminum silicate, and the aluminum silicate is dispersed into a matrix, so that the self deformation of the alpha-Si 3N4 ceramic is reduced;
and 203, injecting the slurry into a round-bottomed flask under the water bath condition of 80 ℃ for 2 hours, and evaporating the absolute ethyl alcohol by using an evaporator to obtain dry mixed powder.
Further, the method further comprises the following steps: step three, injecting materials into a grinding tool:
step 301, preparing a water-ink grinding tool according to the shape of a blade;
step 302, filling the dried mixed powder into a graphite mold coated with a boron nitride ethanol solution, and compacting by applying pressure of 10MPa on a liquid oil press;
step 303, placing a graphite felt sheet coated with boron nitride between two ends of the powder and a graphite pressing head.
Further, the method further comprises the following steps: step four, sintering ceramics;
step 401, placing the graphite mold filled with the powder into a vacuum hot pressing furnace, raising the temperature to 1200 ℃ at a temperature raising rate of 15 ℃ per minute, and preserving heat for 120 minutes; heating to 1800 ℃ at a heating rate of 10 ℃ per min, preserving heat for 90-120min, applying pressure of 30MPa, preserving heat and pressure for 1h, and then releasing pressure;
step 4034, cooling the furnace body in a nitrogen atmosphere, and further cooling the sample to room temperature; by cooling in a nitrogen atmosphere, the reaction of the sintered ceramic with oxygen and the like is avoided even when a nitrogen source is provided, and the tissue performance is also prevented from being affected.
And step 404, after polishing treatment, the blade preparation is completed.
The invention provides a wafer cutter of a polypropylene capacitor film dividing and cutting machine. The beneficial effects are as follows:
through set up interior pole at the inside of outer body, deformation can transmit the surface of contact plate at interior ring body or outer ring body, utilizes the deformation of elastic sheet, absorbs the vibration that produces when interior pole removes, and then plays the cushioning effect to outer ring body or interior ring body, increases the shock resistance of outer ring body and interior ring body, and then increases the shock resistance of blade subassembly, prolongs the life of blade subassembly.
By adding TiC, si can be increased 3 N 4 The wear resistance and the thermal conductivity of the ceramic reduce material loss caused by abrasion in the high-speed rotation and cutting process of the blade assembly, and the high-speed heating capacity is transferred out when the ceramic contains higher heat due to the fact that the thermal conductivity coefficients of the first blade and the second blade are improved, so that negative influence of high temperature on internal tissues is avoided.
By TiC-Si 3 N 4 The common alloy blade is replaced by the ceramic, the preparation cost is low, the preparation method is simple, and the economic cost is saved due to the relatively low density of the ceramic, and the prepared TiC-Si 3 N 4 The ceramic has better heat conductivity coefficient and high tissue stability, and prolongs the service life of the wafer cutter when being used for cutting the polypropylene capacitor film.
Drawings
FIG. 1 is a schematic elevational view of a wafer cutter according to the present invention;
FIG. 2 is an enlarged schematic view of the structure A in FIG. 2 according to the present invention;
FIG. 3 is a schematic cross-sectional view of the contact plate of the present invention;
FIG. 4 is a schematic cross-sectional view of a blade assembly of the present invention;
FIG. 5 is an enlarged schematic view of the structure at B in FIG. 4 according to the present invention;
FIG. 6 shows TiC-Si in the present invention 3 N 4 SEM topography of ceramic powder.
In the figure:
10. a blade ring body; 11. an outer ring body; 12. an inner ring body; 13. a mounting piece;
20. a blade assembly; 21. a first blade; 22. a second blade; 23. a receiving groove; 24. a clamping groove; 25. clamping strips;
30. a reinforcement assembly; 31. an outer tube body; 32. an inner rod; 33. a connecting rod; 34. a contact plate; 35. an elastic sheet.
Description of the embodiments
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Examples
Referring to fig. 1-5, the invention provides a wafer cutter of a polypropylene capacitor film splitting machine, which comprises a blade ring body 10, wherein the blade ring body 10 comprises an inner ring body 12 and an outer ring body 11 which are positioned in the inner part, and a plurality of mounting plates 13 which are arrayed in a ring shape and are arranged in the same direction are arranged at the outer edge of the inner ring body 12;
a reinforcing component 30 is arranged between the inner ring body 12 and the outer ring body 11, and plays a role in buffering before the outer ring body 11 and the inner ring body 12;
the mounting piece 13 is brazed with a blade assembly 20 on a vertical surface clockwise relative to the outer ring body 11, and the blade assembly 20 contacts with the acrylic capacitor film when rotating, and cuts the acrylic capacitor film to complete cutting.
In this embodiment, the existing circular cutters are all integrally arranged and are annular or circular, but the structure is relatively simple, the internal stress of the circular cutters is not easy to release to the outside in a high-speed or high-heat state, and after multiple uses, metal fatigue is very easy to generate, so that the service life is shortened.
In this application, carry out the modularization setting with current annular blade, cut apart into blade ring body 10, blade subassembly 20 and consolidate subassembly 30, utilize consolidate subassembly 30 to play buffering and consolidate, be convenient for blade ring body 10 release the stress of inside, rethread blade subassembly 20 improves current cutting face, improves the cutting effect.
Examples
Referring to fig. 1-6, the present invention provides a wafer cutter of a polypropylene capacitor film splitting machine, the embodiment further discloses a blade assembly 20 in embodiment 1, the blade assembly 20 includes a first blade 21, a second blade 22, a receiving slot 23, a clamping slot 24, and a clamping strip 25; wherein;
the blade assembly 20 comprises a second blade 22 which is connected with the mounting blade 13 in a brazing way, and a first blade 21 is detachably connected with the outer side of the end part of the second blade 22, which is far away from the mounting blade 13, through a connecting piece;
as a further disclosure:
an accommodating groove 23 is formed in the end face, facing the second blade 22, of the first blade 21, the end portion of the second blade 22 extends to the inside of the accommodating groove 23, a connecting piece is located between the accommodating groove 23 and the second blade 22, the connecting piece comprises a clamping strip 25 located on the surface of the second blade 22 and a clamping groove 24 located on the inner wall of the accommodating groove 23, and the clamping strip 25 is embedded with the clamping groove 24.
In use, in the present embodiment, the first blade 21 and the second blade 22 are provided to form a detachable effect, and after a plurality of times of use, the first blade 21 can be replaced, and if the first blade 21 located outside is damaged, the first blade 21 can be completely detached, and the second blade 22 is used as a cutting blade, so that the service life of the blade ring 10 is prolonged.
Examples
Referring to fig. 2-3, the present invention provides a wafer cutter of a polypropylene capacitor film splitting machine, and this embodiment further discloses a reinforcing component 30 in embodiment 1, where the reinforcing component 30 includes an outer tube 31, an inner rod 32, a connecting rod 33, a contact plate 34 and an elastic sheet 35; wherein,
the reinforcement assembly 30 includes a plurality of inner rods 32 connected to the inner wall of the outer ring 11 and an outer tube 31 connected to the outer wall of the inner ring 12, wherein the inner rods 32 extend into the outer tube 31, and a connecting rod 33 is connected between two adjacent inner rods 32. By arranging the connecting rod 33, the inner rod 32 and the outer pipe body 31, a reinforcing effect is achieved between the outer ring body 11 and the inner ring body 12, and stability between the outer ring body 11 and the inner ring body 12 is improved.
As a further improvement:
the inner rod 32 slides along the inner part of the outer tube 31, and a buffer member is arranged at the stroke end of the inner rod 32, the buffer member comprises two parallel contact plates 34, and an elastic sheet 35 is arranged between the two contact plates 34, wherein the elastic sheet 35 is sigma-shaped, and two adjacent elastic sheets 35 are symmetrically distributed.
When the cutter blade assembly is used, the inner rod 32 is arranged in the outer pipe body 31, the inner ring body 12 or the outer ring body 11 deforms, deformation is transmitted to the surface of the contact plate 34, and the elastic piece 35 deforms to absorb vibration generated when the inner rod 32 moves, so that the outer ring body 11 or the inner ring body 12 is buffered, the anti-seismic performance of the outer ring body 11 and the inner ring body 12 is improved, the anti-seismic performance of the cutter blade assembly 20 is improved, and the service life of the cutter blade assembly 20 is prolonged.
Examples
Referring to fig. 1-6, the present invention provides a wafer cutter of a polypropylene capacitor film splitting machine, in which the first blade 21 and the second blade 22 are further modified in this embodiment, and the conventional blades are typically made of an alloy, such as stainless steel or cemented carbide represented by tungsten steel. The embodiment provides a silicon nitride ceramic blade, which is used for replacing the existing alloy blade; the annular preparation method of the wafer cutter comprises the following steps of; the method comprises the following steps:
step one, weighing materials: by reacting alpha-Si 3 N 4 TiC and sintering auxiliary agent according to the mass ratio of 75-85:10-20:5, a step of;
in this step, si can be increased by adding TiC 3 N 4 The wear resistance and thermal conductivity of the ceramic reduces material loss due to wear during the high speed rotation of the blade assembly 20 and cutting, and the thermal conductivity of the first and second blades 21, 22 is increased to allow rapid heat transfer away when they contain high heat to avoid high temperatures from adversely affecting internal tissue.
Step two, mixing materials:
step 201, mixing the weighed raw material powder with Y 2 O 3 /Al 2 O 3 Stirring the sintering aid and absolute ethyl alcohol by adopting a magnetic stirrer at the rotating speed of 100r/min;
step 202, adding the mixed powder into tetrafluoroethyleneAdding silicate dispersing agent into a ball milling tank, and carrying out wet mixing, wherein the ball milling time is 10 hours, and the rotating speed is 200r/min; the silicate dispersant may be selected from aluminum silicate, which is dispersed in a matrix to reduce alpha-Si 3 N 4 The self deformation of the ceramic;
and 203, injecting the slurry into a round-bottomed flask under the water bath condition of 80 ℃ for 2 hours, and evaporating the absolute ethyl alcohol by using an evaporator to obtain dry mixed powder.
Step three, material mould:
step 301, preparing a water-ink grinding tool according to the shape of a blade;
step 302, filling the dried mixed powder into a graphite mold coated with a boron nitride ethanol solution, and compacting by applying pressure of 10MPa on a liquid oil press;
step 303, placing a graphite felt sheet coated with boron nitride between two ends of the powder and a graphite pressing head.
Step four, sintering ceramics;
step 401, placing the graphite mold filled with the powder into a vacuum hot pressing furnace, raising the temperature to 1200 ℃ at a temperature raising rate of 15 ℃ per minute, and preserving heat for 120 minutes; heating to 1800 ℃ at a heating rate of 10 ℃ per min, preserving heat for 90-120min, applying pressure of 30MPa, preserving heat and pressure for 1h, and then releasing pressure;
step 4034, cooling the furnace body in a nitrogen atmosphere, and further cooling the sample to room temperature; by cooling in a nitrogen atmosphere, the reaction of the sintered ceramic with oxygen and the like is avoided even when a nitrogen source is provided, and the tissue performance is also prevented from being affected.
And step 404, after polishing treatment, the blade preparation is completed.
In the present embodiment, by using alpha-Si 3 N 4 With TiC as raw material to prepare TiC-Si 3 N 4 The ceramic was measured by SEM and the image is shown in figure 6.
The flexural strength of the alloy was 817.+ -. 11 (MP a) and the fracture toughness of the alloy was 11.4.+ -. 0.3 (MPa-m) 0.5 ) The elastic modulus is 181+/-5 (GPa), and the Poisson's ratio is 0.28; vickers hardness 17.05Gpa.
In the present embodimentThrough TiC-Si 3 N 4 The common alloy blade is replaced by the ceramic, the preparation cost is low, the preparation method is simple, and the economic cost is saved due to the relatively low density of the ceramic, and the prepared TiC-Si 3 N 4 The ceramic has good heat conductivity coefficient and high tissue stability, and can prolong the service life of the wafer cutter when being used for cutting the polypropylene capacitor film.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The wafer cutter of the polypropylene capacitance film splitting machine comprises a blade ring body (10), wherein the blade ring body (10) comprises an inner ring body (12) and an outer ring body (11) which are positioned in the blade ring body, and a plurality of mounting sheets (13) which are annularly arrayed and are arranged in the same direction are arranged at the outer edge of the inner ring body (12); the method is characterized in that:
a reinforcing component (30) is arranged between the inner ring body (12) and the outer ring body (11),
the mounting piece (13) is brazed with a blade assembly (20) on a vertical surface in the clockwise direction relative to the outer ring body (11), and the blade assembly (20) is contacted with the propylene capacitor film when rotating;
the reinforcing assembly (30) comprises an inner rod (32) connected to the inner wall of the outer ring body (11) and an outer pipe body (31) connected to the outer wall of the inner ring body (12), the inner rod (32) extends into the outer pipe body (31), and a connecting rod (33) is connected between two adjacent inner rods (32);
the blade assembly (20) comprises a first blade (21) and a second blade (22), wherein the first blade (21) and the second blade (22) are made of TiC-Si3N4 ceramics, and the composition comprises the following components: the mass ratio of the alpha-Si 3N4 to the TiC to the sintering aid is 75-85:10-20:5.
2. the wafer cutter of the polypropylene capacitor film slitting machine as set forth in claim 1, wherein: the blade assembly (20) comprises a second blade (22) which is connected with the mounting piece (13) in a brazing mode, the second blade (22) is far away from the outer side of the end portion of the mounting piece (13), a first blade (21) is detachably connected through a connecting piece, a containing groove (23) is formed in the end face, facing the second blade (22), of the first blade (21), and the end portion of the second blade (22) extends to the inside of the containing groove (23).
3. The wafer cutter of the polypropylene capacitor film slitting machine as set forth in claim 2, wherein: the connecting piece is located between the accommodating groove (23) and the second blade (22), and comprises a clamping strip (25) located on the surface of the second blade (22), and a clamping groove (24) located on the inner wall of the accommodating groove (23), wherein the clamping strip (25) is embedded with the clamping groove (24).
4. The wafer cutter of the polypropylene capacitor film slitting machine as set forth in claim 1, wherein: the inner rod (32) slides along the inner part of the outer pipe body (31), a buffer part is arranged at the stroke end of the inner rod (32), the buffer part comprises two parallel contact plates (34), and an elastic sheet (35) is arranged between the two contact plates (34), wherein the elastic sheet (35) is sigma-shaped, and the two adjacent elastic sheets (35) are symmetrically distributed.
5. The wafer cutter of the polypropylene capacitor film slitting machine as set forth in claim 1, wherein: the annular preparation method of the wafer cutter comprises the following steps:
step one, weighing materials: alpha-Si 3N4, tiC and sintering auxiliary agent are mixed according to the mass ratio of 75-85:10-20:5, a step of;
step two, mixing materials: comprising the following steps:
step 201, stirring the weighed raw material powder, a Y2O3/Al2O3 sintering aid and absolute ethyl alcohol by using a magnetic stirrer at a rotating speed of 100r/min;
step 202, putting the mixed powder into a ball milling tank of tetrafluoroethylene, adding silicate dispersing agent, and carrying out wet mixing, wherein the ball milling time is 10 hours, and the rotating speed is 200r/min; the silicate dispersing agent is aluminum silicate, and the aluminum silicate is dispersed into a matrix to reduce the self-deformation of the alpha-Si 3N4 ceramic;
and 203, injecting the slurry into a round-bottomed flask under the water bath condition of 80 ℃ for 2 hours, and evaporating the absolute ethyl alcohol by using an evaporator to obtain dry mixed powder.
6. The wafer cutter of the polypropylene capacitor film slitting machine according to claim 5, wherein: further comprises: step three, injecting materials into a grinding tool:
step 301, preparing a water-ink grinding tool according to the shape of a blade;
step 302, filling the dried mixed powder into a graphite mold coated with a boron nitride ethanol solution, and compacting by applying pressure of 10MPa on a liquid oil press;
step 303, placing a graphite felt sheet coated with boron nitride between two ends of the powder and a graphite pressing head.
7. The wafer cutter of the polypropylene capacitor film slitting machine as set forth in claim 6, wherein: further comprises: step four, sintering ceramics;
step 401, placing the graphite mold filled with the powder into a vacuum hot pressing furnace, raising the temperature to 1200 ℃ at a temperature raising rate of 15 ℃ per minute, and preserving heat for 120 minutes; heating to 1800 ℃ at a heating rate of 10 ℃ per min, preserving heat for 90-120min, applying pressure of 30MPa, preserving heat and pressure for 1h, and then releasing pressure;
step 4034, cooling the furnace body in a nitrogen atmosphere, and further cooling the sample to room temperature; by cooling in the nitrogen atmosphere, the reaction of the sintered ceramic with oxygen and the like is avoided under the condition of providing a nitrogen source, and the tissue performance is influenced;
and step 404, after polishing treatment, the blade preparation is completed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311038149.4A CN116787499B (en) | 2023-08-17 | 2023-08-17 | Wafer cutter of polypropylene capacitance film splitting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311038149.4A CN116787499B (en) | 2023-08-17 | 2023-08-17 | Wafer cutter of polypropylene capacitance film splitting machine |
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| CN116787499B true CN116787499B (en) | 2023-12-19 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109499717A (en) * | 2018-12-26 | 2019-03-22 | 镇江市润州京阳传动机械厂 | A kind of complex and spiral knife group device |
| CN210148150U (en) * | 2019-05-16 | 2020-03-17 | 南京东成机械刀具有限公司 | Anticorrosive type electricity trade divide strip blade |
| CN212493339U (en) * | 2019-11-29 | 2021-02-09 | 安徽轩亚机械制造有限公司 | Knife roll structure of double-shaft shredder |
| CN212763682U (en) * | 2020-05-29 | 2021-03-23 | 江苏宜合日用品有限公司 | CPP film production is with cutting device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6829971B1 (en) * | 2003-06-04 | 2004-12-14 | Chien-Tsai Huang | Cutting fixture for heat-shrink film sleeve labeling machines |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109499717A (en) * | 2018-12-26 | 2019-03-22 | 镇江市润州京阳传动机械厂 | A kind of complex and spiral knife group device |
| CN210148150U (en) * | 2019-05-16 | 2020-03-17 | 南京东成机械刀具有限公司 | Anticorrosive type electricity trade divide strip blade |
| CN212493339U (en) * | 2019-11-29 | 2021-02-09 | 安徽轩亚机械制造有限公司 | Knife roll structure of double-shaft shredder |
| CN212763682U (en) * | 2020-05-29 | 2021-03-23 | 江苏宜合日用品有限公司 | CPP film production is with cutting device |
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