CN116784006A

CN116784006A - Vehicle controller and vehicle

Info

Publication number: CN116784006A
Application number: CN202180087700.7A
Authority: CN
Inventors: 王恺睿; 李红山; 谢成浩
Original assignee: SZ DJI Technology Co Ltd
Current assignee: SZ DJI Technology Co Ltd
Priority date: 2021-03-09
Filing date: 2021-03-09
Publication date: 2023-09-19
Also published as: WO2022188036A1

Abstract

Provided is a vehicle controller (100) including a housing (10) and a circuit board (20), the housing (10) including a mounting portion (11) for mounting on a body main body (200) of a vehicle (1000); a heat exchange flow channel (12) for the circulation of a heat exchange medium is formed, the heat exchange flow channel (12) comprises a liquid inlet (121), a liquid outlet (122) and a medium channel (123), and the liquid inlet (121) and the liquid outlet (122) are respectively communicated with the medium channel; the circuit board (20) is arranged on the shell (10) and is used for being electrically connected with a gateway of the vehicle (1000) and a sensor arranged on the vehicle (1000); the circuit board (20) is in heat conduction connection with the shell (10), and heat exchange medium in the heat exchange flow channel (12) can exchange heat with the shell (10), so that heat generated by the circuit board (20) is dissipated. A vehicle (1000) is also provided.

Description

Vehicle controller and vehicle

Technical Field

The application relates to the technical field of vehicles, in particular to a vehicle controller and a vehicle.

Background

With the improvement of the information density collected by various sensors of an automobile and the continuous expansion of advanced auxiliary driving or automatic driving functions, the requirements on the calculation force and the like of a chip mounted on a vehicle controller are correspondingly improved, the power consumption of the vehicle controller is increased, and the problem of the increase of the heating value is caused. If the larger heating value can not conduct or dissipate heat in time, the vehicle controller can be at a higher working temperature for a long time, the service life of components of the vehicle controller is influenced, and even abnormal conditions such as overheat damage and the like can occur.

Disclosure of Invention

The application provides a vehicle controller and a vehicle, and aims to timely radiate heat of a circuit board.

In a first aspect, an embodiment of the present application provides a vehicle controller, including:

a housing including a mounting portion for mounting to a body main body of a vehicle; the heat exchange flow channel comprises a liquid inlet, a liquid outlet and a medium channel, wherein the liquid inlet and the liquid outlet are communicated with the medium channel;

the circuit board is arranged on the shell and is used for being electrically connected with a gateway of the vehicle and a sensor arranged on the vehicle;

the circuit board is in heat conduction connection with the shell, and heat exchange medium in the heat exchange flow channel can exchange heat with the shell, so that heat generated by the circuit board is dissipated.

In a second aspect, an embodiment of the present application provides a vehicle including:

a body main body; and

the vehicle controller according to any one of the above, provided in the vehicle body.

The embodiment of the application provides a vehicle controller and a vehicle, wherein heat on a circuit board of the vehicle controller can be dissipated in time through heat conduction of heat exchange media in a shell and a heat exchange flow channel, so that the working life of the circuit board is prevented from being influenced by overheat of the circuit board, and even abnormal conditions such as damage and the like are avoided.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure of embodiments of the application.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of a vehicle controller according to an embodiment of the present application;

FIG. 2 is a cross-sectional view of a vehicle controller provided by an embodiment of the present application;

fig. 3 is a schematic structural diagram of a vehicle controller according to an embodiment of the present application;

FIG. 4 is a partial cross-sectional view of a vehicle controller provided by an embodiment of the present application;

FIG. 5 is an exploded schematic view of a vehicle controller according to an embodiment of the present application;

FIG. 6 is an exploded schematic view of a vehicle controller according to an embodiment of the present application;

fig. 7 is a schematic structural view of a first shell portion according to an embodiment of the present application.

Fig. 8 is a schematic structural view of a vehicle controller according to an embodiment of the present application;

fig. 9 is a schematic structural view of a vehicle according to an embodiment of the present application.

Reference numerals illustrate:

1000. a vehicle;

100. a vehicle controller;

10. a housing; 11. a mounting part; 12. a heat exchange flow passage; 121. a liquid inlet; 122. a liquid outlet; 123. a media channel; 1231. a first sub-flow path; 1232. a second sub-flow path; 1233. a third sub-flow path; 1234. a first step; 1235. a second step;

13. a first shell portion; 131. a first fitting portion; 132. a first plate body; 1321. a first guide groove; 133. a second plate body; 1331. a second guide groove; 14. a second shell portion; 141. a second fitting portion; 142. a limiting hole; 15. a receiving chamber; 16. a protruding structure; 161. a first protrusion; 162. a second protrusion; 17. a locking piece; 18. positioning columns;

20. a circuit board; 201. a first surface; 202. a second surface; 21. a first electronic component; 22. a second electronic component; 23. positioning holes;

30. a heat conductive member; 31. a first heat conductive member; 32. a second heat conductive member;

40. an electrical connection interface; 50. quick release connectors;

200. a body main body.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

It is also to be understood that the terminology used in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It should be further understood that the term "and/or" as used in the present specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.

Some embodiments of the present application are described in detail below with reference to the accompanying drawings. The following embodiments and features of the embodiments may be combined with each other without conflict.

Referring to fig. 1, a vehicle controller 100 is provided in an embodiment of the application. The vehicle controller 100 may control a controlled member of a vehicle 1000 (see fig. 9). The vehicle controller 100 may send control signals to the controlled element to control the operation of the controlled element.

Illustratively, the vehicle controller 100 includes at least one of a power motor controller, a throttle controller, an electronic steering controller, and the like.

Illustratively, the controlled member includes at least one of a power motor, a throttle, and the like.

Illustratively, the power motor controller is configured to control operation of the power motor to move a body 200 (see fig. 9) of the vehicle 1000.

Referring to fig. 2-4, in some embodiments, a vehicle controller 100 includes a housing 10 and a circuit board 20. The housing 10 includes a mounting portion 11 for mounting to a body 200 of the vehicle 1000. The housing 10 is formed with a heat exchange flow passage 12 through which a heat exchange medium flows. The heat exchange flow passage 12 includes a liquid inlet 121, a liquid outlet 122, and a medium passage 123. Both the liquid inlet 121 and the liquid outlet 122 are in communication with the medium channel 123. A circuit board 20 is provided on the housing 10 for electrical connection with a gateway of the vehicle 1000 and a sensor provided to the vehicle 1000.

The circuit board 20 is in heat conduction connection with the housing 10, and the heat exchange medium in the heat exchange flow channel 12 can exchange heat with the housing 10, so that heat generated by the circuit board 20 is dissipated.

In the vehicle controller 100 of the above embodiment, heat on the circuit board 20 can be conducted to the housing 10, and the housing 10 can exchange heat with the heat exchange medium in the heat exchange flow channel 12, so that heat on the circuit board 20 can be conducted by the heat exchange medium in the housing 10 and the heat exchange flow channel 12 and dissipated in time, thereby avoiding abnormal conditions such as damage and the like even when the circuit board 20 is overheated to affect the service life of the circuit board 20. In addition, the vehicle controller 100 according to the embodiment of the application has low noise during heat dissipation, thus improving the comfort of personnel in the vehicle 1000, and the volume of the housing 10 is smaller on the premise of ensuring the heat dissipation effect, so that the space required when the vehicle controller 100 is arranged on the body main body 200 of the vehicle 1000 is smaller, which is beneficial to realizing miniaturization design.

Illustratively, the heat exchange medium comprises at least one of a gaseous heat exchange medium, a liquid heat exchange medium. Such as where the heat exchange medium comprises water.

Illustratively, the sensor includes: at least one of a temperature sensor, a flow sensor, a concentration sensor, a power motor rotation speed sensor, a vehicle speed sensor and the like.

Illustratively, the temperature sensor includes at least one of a motor coolant temperature sensor, an intake air temperature sensor, an exhaust gas temperature sensor, a fuel temperature sensor, and the like.

Illustratively, the flow sensor includes at least one of an air flow sensor, a fuel flow sensor, and the like.

Illustratively, the concentration sensor may include at least one of an oxygen sensor for collecting an oxygen concentration, a sensor for collecting an alcohol concentration, and the like.

Referring to fig. 2, 5 and 6, in some embodiments, the housing 10 includes a first shell portion 13 and a second shell portion 14. The heat exchange flow passage 12 is formed in the first shell portion 13. The second shell portion 14 is connected with the first shell portion 13. The second housing portion 14 cooperates with the first housing portion 13 to form a receiving cavity 15 for receiving the circuit board 20. The mounting portion 11 is provided on the first housing portion 13 or the second housing portion 14.

Illustratively, the mounting portion 11 is provided on the first shell portion 13.

In some embodiments, the first shell portion 13 is fixedly connected or removably connected with the second shell portion 14. For example, the first shell portion 13 is fixedly connected to the second shell portion 14 by at least one of a snap structure, a screw, a magnetic structure, an adhesive layer, and the like.

Referring to fig. 5 and 6, the first housing portion 13 is exemplarily provided with a first assembling portion 131, and the second housing portion 14 is provided with a second assembling portion 141 detachably coupled to the first assembling portion 131.

For example, the first fitting portion 131 is snap-fitted with the second fitting portion 141, thereby achieving detachable connection of the first and second shell portions 13 and 14.

Referring to fig. 5 and 6, for another example, the first fitting part 131 is detachably connected to the second fitting part 141 by the locking member 17. The locking member 17 penetrates the first fitting portion 131, the circuit board 20, and the second fitting portion 141 to lock the first and second case portions 13 and 14.

Illustratively, the fastener 17 comprises a screw.

The number of locking elements 17 may be designed according to the actual requirements, such as one, two, three, four or more. Illustratively, the number of locking members 17 is plural, and each locking member 17 is provided with one first fitting portion 131 and one second fitting portion 141. The plurality of first fitting portions 131 are disposed on the first shell portion 13 at intervals. For example, a plurality of first fitting portions 131 are provided at intervals along the peripheral edge of the first shell portion 13 to improve connection reliability of the first shell portion 13 and the second shell portion 14.

Referring to fig. 5 and 6, in some embodiments, the housing 10 further includes a projection arrangement 16. The projection arrangement 16 projects onto the first shell portion 13 and/or the second shell portion 14. The protruding structure 16 is in thermally conductive connection with the power consuming elements of the circuit board 20.

In some embodiments, the circuit board 20 is in direct thermally conductive connection with the housing 10. In this way, the number of parts of the vehicle controller 100 is small, and the assembly efficiency is high.

Illustratively, the circuit board 20 is in contact and thermally conductive connection with the housing 10. For example, the contact thermal conductive connection includes at least one of a surface contact thermal conductive connection, a line contact thermal conductive connection, and a point contact thermal conductive connection.

Illustratively, the projecting structure 16 is in contact and thermally conductive connection with the power-consuming element.

In some embodiments, the circuit board 20 is in indirect thermally conductive connection with the housing 10. I.e. the circuit board 20 is in non-direct contact heat conductive connection with the housing 10.

Illustratively, the projecting structure 16 is in indirect thermally conductive connection with the power-consuming element.

Referring to fig. 5 and 6, in some embodiments, the vehicle controller 100 further includes a thermally conductive member 30. The circuit board 20 is thermally connected to the housing 10 via a thermally conductive member 30. The circuit board 20 can exchange heat with the heat conductive member 30, and the heat conductive member 30 can exchange heat with the housing 10, so that heat of the circuit board 20 can be conducted to the housing 10 through the heat conductive member 30.

Illustratively, the projecting structure 16 is in thermally conductive connection with the power-consuming element via a thermally conductive member 30. The power dissipation element and the protrusion structure 16 can exchange heat with the heat conduction member 30, so that heat of the power dissipation element can be conducted to the protrusion structure 16 and then conducted to the first shell portion 13 and/or the second shell portion 14 via the protrusion structure 16 to be dissipated.

Illustratively, different portions of the thermally conductive member 30 are in contact and thermally conductive connection with the circuit board 20 and the housing 10, respectively. For example, opposite sides of the heat conductive member 30 are respectively attached to the circuit board 20 and the case 10.

In some embodiments, the thermally conductive member 30 comprises a thermally conductive adhesive layer. Thus, the heat conducting adhesive layer not only can play a role in heat conduction, but also can realize the fixation or limit of the circuit board 20 and the shell 10; in addition, the heat conducting adhesive layer can also reduce the processing difficulty of heat conducting connection between the circuit board 20 and the shell 10 on the premise of ensuring the heat conducting effect. The heat conducting adhesive layer comprises at least one of an acrylic ester heat conducting adhesive layer, a rubber heat conducting adhesive layer and a silica gel heat conducting adhesive layer.

Illustratively, the thermally conductive adhesive layer includes a two-component thermally conductive adhesive layer. In this way, good contact of the power consumption element of the vehicle controller 100, the heat conductive adhesive layer, and the case 10 can be ensured while effectively conducting heat.

Illustratively, the two sides of the thermally conductive adhesive layer are respectively attached to the circuit board 20 and the housing 10.

In other embodiments, the heat conducting member 30 may be other heat conducting structures, such as a metal heat conducting member.

Illustratively, the Power consuming elements include heat generating devices of any circuit board 20, such as at least one of a chip, a Power Management Integrated Circuit (PMIC), an inductance, a double rate synchronous dynamic random access memory, a capacitance, and the like.

Referring to fig. 5 and 6, in some embodiments, the power consuming elements include a first electronic element 21. The projection arrangement 16 comprises a first projection 161. The first protrusion 161 is protruded from a side surface of the first housing portion 13 facing the second housing portion 14. The first housing portion 13 and the first electronic component 21 are both thermally connected to the first protrusion 161.

Referring to fig. 5 and 6, for example, the circuit board 20 includes opposing first and second surfaces 201 and 202. The first surface 201 faces the first shell portion 13. The second surface 202 faces the second shell portion 14. The first protrusion 161 is provided on the first surface 201 of the circuit board 20.

Referring to fig. 5 and 6, the heat conductive member 30 illustratively includes a first heat conductive member 31. Opposite sides of the first heat conductive member 31 are in heat conductive contact with the first protrusion 161 and the first electronic component 21, respectively. In this way, the heat of the first electronic component 21 can be conducted to the first shell 13 through the first heat conducting member 31 and the first protrusion 161, so that the heat of the first electronic component 21 is timely dissipated, the first electronic component 21 is effectively protected, and the risk that the service life of the first electronic component 21 is reduced or overheat damage is easy to occur under the high temperature condition is reduced.

Illustratively, the first shell portion 13 includes a structure with thermal conductivity to ensure that heat of the first protrusion 161 can be conducted to the first shell portion 13, and that the first shell portion 13 can exchange heat with the heat exchange medium in the heat exchange flow channel 12, so that heat on the circuit board 20 can be timely dissipated.

The number of first electronic components 21 may include one, two, three, or more. When the number of the first electronic components 21 is plural, the functions (sizes or models) of the plural first electronic components 21 may be the same, partially the same, or different from each other, and are not limited herein.

In some embodiments, the number of first protrusions 161 includes a plurality. The plurality of first protrusions 161 are disposed at intervals.

Illustratively, each of the first protrusions 161 may correspond to one of the first electronic components 21. For example, a first protrusion 161 is in thermally conductive contact with a first electronic component 21.

One first protrusion 161 and each first protrusion 161 may also correspond to a plurality of first electronic components 21. For example, the plurality of first electronic components 21 are each in heat conductive contact with one first projection 161.

Illustratively, the plurality of first protrusions 161 may correspond to one first electronic component 21. For example, the plurality of first protrusions 161 are each in heat conductive contact with the same first electronic component 21.

In some embodiments, the number of first protrusions 161 includes a plurality of first protrusions 161 having different protruding thicknesses.

Illustratively, the protruding thickness of the first protrusion 161 is adapted to the height of the first electronic component 21. The sum of the protruding thickness of the first protrusion 161 and the height of the first electronic component 21 is substantially less than or equal to the maximum separation distance between the first surface 201 of the circuit board 20 and the side surface of the first shell portion 13 facing the circuit board 20. It will be appreciated that if the height of the first electronic component 21 is larger, the protruding thickness of the corresponding first protrusion 161 is correspondingly smaller.

Illustratively, the protruding thickness of each first protrusion 161 may be the same or different from each other. Of course, the first protrusions 161 may have a different protruding thickness in one portion and a same protruding thickness in another portion.

It is understood that the first protrusions 161 and the corresponding first electronic components 21 have a gap therebetween for filling the first heat conductive member 31, so as to reduce the difficulty of processing while ensuring the heat conductive effect.

In some embodiments, the gap between each first protrusion 161 and the corresponding first electronic component 21 is substantially the same. Therefore, the heat conduction device is convenient to process and assemble on the premise of guaranteeing the heat conduction effect.

Referring to fig. 5 and 6, in some embodiments, the power consuming elements include a second electronic element 22. The projection arrangement 16 includes a second projection 162. The second protrusion 162 is protruded from a side surface of the second shell portion 14 facing the first shell portion 13. The second housing portion 14 and the second electronic component 22 are both in thermally conductive connection with the second protrusion 162.

Referring to fig. 5 and 6, the heat conductive member 30 illustratively includes a second heat conductive member 32. The opposite sides of the second heat conductive member 32 are in heat conductive contact with the second protrusion 162 and the second electronic component 22, respectively. In this way, the heat of the second electronic component 22 can be conducted to the second shell 14 through the second heat conducting member 32 and the second protrusion 162, so that the heat of the second electronic component 22 is timely dissipated, the second electronic component 22 is effectively protected, and the risk that the service life of the second electronic component 22 is reduced or overheat damage is easy to occur under the high temperature condition is reduced.

Illustratively, the second shell portion 14 includes a structure having thermal conductivity to ensure that heat from the second projections 162 is conducted to the second shell portion 14 for dissipation.

Illustratively, the second shell portion 14 is thermally conductively coupled to the first shell portion 13 such that the second shell portion 14 is capable of exchanging heat with the first shell portion 13 and the first shell portion 13 is capable of exchanging heat with the heat exchange medium within the heat exchange flow channels 12 such that heat from the second shell portion 14 is conducted to the first shell portion 13 for dissipation.

The number of second electronic components 22 may include one, two, three, or more. When the number of the second electronic components 22 is plural, the functions (sizes or models) of the plural second electronic components 22 may be the same, partially the same, or different from each other, and are not limited herein.

In some embodiments, the number of second protrusions 162 includes a plurality. The plurality of second protrusions 162 are spaced apart.

Illustratively, each of the second protrusions 162 may correspond to one of the second electronic components 22. For example, a second protrusion 162 is in thermally conductive contact with a second electronic component 22.

One second protrusion 162 and each second protrusion 162 may also correspond to a plurality of second electronic components 22. For example, a plurality of second electronic components 22 are each in thermally conductive contact with one of the second protrusions 162.

Illustratively, the plurality of second protrusions 162 may correspond to one second electronic component 22. For example, the plurality of second protrusions 162 are each in thermally conductive contact with the same second electronic component 22.

In some embodiments, the number of second protrusions 162 includes a plurality, and the protruding thickness of the plurality of second protrusions 162 is different.

Illustratively, the protruding thickness of the second protrusion 162 is adapted to the height of the second electronic component 22. The sum of the projected thickness of the second projection 162 and the height of the second electronic component 22 is substantially less than or equal to the maximum separation distance between the second surface 202 of the circuit board 20 and the side surface of the second shell portion 14 facing the circuit board 20. It will be appreciated that if the height of the second electronic component 22 is greater, the protruding thickness of the corresponding second protrusion 162 is correspondingly smaller.

The protruding thickness of each second protrusion 162 is the same or different from each other, for example. Of course, one part of the second protrusions 162 may have a different protruding thickness, and the other part may have the same protruding thickness.

It can be appreciated that the second protrusions 162 have a gap between the corresponding second electronic component 22 for filling the second heat conductive member 32, so as to reduce the processing difficulty while ensuring the heat conductive effect.

In some embodiments, the gap between each second protrusion 162 and the corresponding second electronic component 22 is substantially the same. Therefore, the heat conduction device is convenient to process and assemble on the premise of guaranteeing the heat conduction effect.

It will be appreciated that in other embodiments, either the first electronic component 21 or the second electronic component 22 may be omitted.

Referring to fig. 7, in some embodiments, the first shell portion 13 includes a first plate 132 and a second plate 133. The first plate 132 is formed with a first guide groove 1321. The second plate 133 is formed with a second guide groove 1331. The first guide groove 1321 cooperates with the second guide groove 1331 to form the heat exchange flow passage 12. The second plate 133 cooperates with the second shell portion 14 to form the receiving cavity 15.

It is understood that the first shell portion 13 is sealingly connected to the second shell portion 14, thereby achieving fixation of the first shell portion 13 to the second shell portion 14 and securing sealing performance of the heat exchange flow passage 12. For example, the first plate 132 is hermetically connected to the second plate 133 by a welding process.

Wherein the welding process includes at least one of fusion welding, pressure welding, soldering, and the like. Illustratively, the welding process includes: at least one of gas welding, arc welding, laser welding, resistance welding, ultrasonic welding, soldering, brazing, and the like.

For example, the first plate 132 is sealingly connected to the second plate 133 by a friction stir welding process. In this way, the connection reliability of the first plate 132 and the second plate 133 can be ensured, and the sealing performance of the connection between the first plate 132 and the second plate 133 can be ensured, so that the sealing reliability of the heat exchange flow channel 12 is ensured.

Referring to fig. 5 and 6, in some embodiments, one of the housing 10 and the circuit board 20 is provided with a positioning post 18, and the other is provided with a positioning hole 23 that mates with the positioning post 18. For example, the casing 10 is provided with a positioning post 18, and the circuit board 20 is provided with a positioning hole 23, so that the casing 10 and the circuit board 20 are positioned, and the follow-up accurate assembly and fixation are facilitated.

Illustratively, the second shell portion 14 is provided with a retention aperture 142. The positioning posts 18 sequentially penetrate through the positioning holes 23 and the limiting holes 142, so that the circuit board 20 is positioned.

In some embodiments, the heat exchange flow path 12 includes one or more. Illustratively, the heat exchange flow path 12 includes one piece to simplify the structure of the heat exchange flow path 12, facilitate processing, and reduce the number of interfaces of the heat exchange flow path 12.

Illustratively, the electronic components on the circuit board 20 are laid out according to the amount of heat generated when the power-consuming components are in operation, so that the power-consuming components that primarily generate heat of the circuit board 20 are distributed as evenly as possible, avoiding localized heat concentrations.

It will be appreciated that the design of the medium channel 123 may refer to the placement of the power consuming elements on the circuit board 20 such that the heat exchanging medium within the medium channel 123 is able to flow through the power consuming elements to be heat dissipated.

Referring to fig. 8, in some embodiments, the medium channel 123 includes a first sub-channel 1231, a second sub-channel 1232, and a third sub-channel 1233. The first sub flow passage 1231 is connected to the liquid inlet 121. The second sub flow path 1232 is connected to the first sub flow path 1231. The third sub flow path 1233 is connected to the second sub flow path 1232. The third sub-flow passage 1233 is connected to the liquid outlet 122.

The shapes of the first, second and third sub-flow paths 1231, 1232 and 1233 may be designed to any suitable shape. For example, the second sub-flow path 1232 is bent. When the size of the housing 10 is fixed, the second sub-flow passage 1232 is bent to extend the total length of the medium passage 123 as much as possible, and increase the flow path of the heat exchange medium as much as possible, thereby improving the heat dissipation efficiency.

The relative positional relationship among the first sub-flow passage 1231, the second sub-flow passage 1232, and the third sub-flow passage 1233 may be set according to actual demands. For example, referring to fig. 8, the second sub-flow path 1232 and the third sub-flow path 1233 are disposed non-coplanar.

Referring to fig. 8, in some embodiments, the second sub-runner 1232 and the third sub-runner 1233 cooperate to form a first step 1234 such that the third sub-runner 1233 is located above the second sub-runner 1232 along the direction of gravity. In this way, a height difference can be formed between at least a portion of the third sub-flow passage 1233 and the second sub-flow passage 1232, facilitating the air discharge in the medium passage 123 under the influence of gravity.

Referring to fig. 8, in some embodiments, the first sub-flow path 1231 and the second sub-flow path 1232 are disposed non-coplanar.

Referring to fig. 8, in some embodiments, the first sub-flow channel 1231 and the second sub-flow channel 1232 cooperate to form a second step 1235, such that the first sub-flow channel 1231 is located above the second sub-flow channel 1232 along the gravitational direction. In this way, a height difference can be formed between at least a portion of the first sub-flow passage 1231 and the second sub-flow passage 1232, facilitating the air discharge in the medium passage 123 under the influence of gravity.

Referring to fig. 8, in some embodiments, the first sub-flow passage 1231 and the third sub-flow passage 1233 are disposed coplanar. In this way, the liquid inlet 121 and the liquid outlet 122 can be ensured to be arranged substantially coplanar.

In other embodiments, the first sub-runner 1231 is disposed non-coplanar with the third sub-runner 1233.

Referring to fig. 8, the W reference direction is taken as an example. As indicated by the W reference direction, the projection of the inlet 121 onto the plane epsilon is above the projection of the second sub-flow path 1232 onto the plane epsilon.

In one embodiment, the projection of the outlet 122 onto plane ε along the W reference direction is above the projection of the second sub-flow path 1232 onto plane ε.

In one embodiment, if the vehicle controller is placed horizontally in the vehicle, the W reference direction may be a direction of gravity. The position of the liquid outlet 122 or the liquid inlet 121 in the gravity direction is higher than the position of the flow channel.

Illustratively, the plane ε is substantially parallel to the side of the housing 10 on the side of the inlet 121.

Referring to fig. 8, in some embodiments, the liquid inlet 121 and the liquid outlet 122 are disposed coplanar.

Illustratively, the liquid inlet 121 and the liquid outlet 122 are disposed coplanar, the first sub-flow passage 1231 is located above the second sub-flow passage 1232 along the direction of gravity, and the third sub-flow passage 1233 is located above the second sub-flow passage 1232 along the direction of gravity. This arrangement can provide design space for other components of the housing 10 on the side of the outlet 122 (such as the electrical connection interface 40 in fig. 8), facilitating compact construction of the vehicle controller 100 or facilitating compact construction of the vehicle 1000; and can form a height difference to facilitate the air discharge in the medium passage 123 under the influence of gravity.

In other embodiments, the inlet 121 and the outlet 122 are disposed non-coplanar.

Referring to fig. 8, in some embodiments, the liquid inlet 121 and the liquid outlet 122 are located on the same side of the housing 10. Thus, the external liquid inlet pipe and the external liquid outlet pipe can be connected with the liquid inlet 121 and the liquid outlet 122 from the same side of the shell 10, so that the design is reasonable, and the liquid path layout of the vehicle controller 100 is convenient.

Referring to fig. 8, in some embodiments, the vehicle controller 100 further includes an electrical connection interface 40. An electrical connection interface 40 is electrically connected to the circuit board 20 for electrical connection with the gateway and sensors of the vehicle 1000.

Referring to fig. 8, the electrical connection port 40, the liquid inlet 121 and the liquid outlet 122 are illustratively located on the same side of the housing 10. In this way, the external liquid inlet pipe, the external liquid outlet pipe and the electric connecting piece (such as an electric connecting wire) for electrically connecting the circuit board 20 and other components (such as a gateway or a sensor) can be respectively connected with the liquid inlet 121, the liquid outlet 122 and the electric connecting interface 40 from the same side of the shell 10, so that the components of a liquid path and a circuit are optimized, the structure is compact, the design is reasonable, and the assembly or the maintenance is convenient.

It will be appreciated that the number of electrical connection interfaces 40 may be designed according to actual requirements, such as one, two, three or more. For example, the number of the electrical connection interfaces 40 is two, and the two electrical connection interfaces 40 are located on the same side of the housing 10, so that the design of the plugging space can be simplified, and the components of the electrical connection wires are convenient.

Referring to fig. 8, in some embodiments, the vehicle controller 100 further includes two quick release connectors 50. The two quick release connectors 50 are detachably connected with the flow channel wall at the liquid inlet 121 and the flow channel wall at the liquid outlet 122 respectively. For example, one of the two quick release connectors 50 is inserted into or screwed to the wall of the flow channel at the liquid inlet 121, and the other of the two quick release connectors 50 is inserted into or screwed to the wall of the flow channel at the liquid outlet 122.

For example, quick disconnect 50 includes a plug.

The quick release connector 50 is sealingly connected to the wall of the flow channel at the liquid inlet 121 or the wall of the flow channel at the liquid outlet 122 by a raw material tape or a sealant layer. For example, one of the two quick release connectors 50 is sealingly connected to the wall of the flow channel at the inlet 121 by a raw tape. The other of the two quick release connectors 50 is sealingly connected to the wall of the flow channel at the outlet 122 by a raw material strip.

Referring to fig. 9, the embodiment of the present application further provides a vehicle 1000 including a body 200 and a vehicle controller 100. The vehicle controller 100 is the vehicle controller 100 of any of the above embodiments. The vehicle controller 100 is provided on the vehicle body 200.

In some embodiments, the attachment means of the mounting portion 11 to the body 200 includes a snap connection, a magnetic attachment, a screw connection, and an adhesive connection.

In the vehicle 1000 of the embodiment, the heat on the circuit board 20 of the vehicle controller 100 can be conducted to the housing 10, and the housing 10 can exchange heat with the heat exchange medium in the heat exchange flow channel 12, so that the heat on the circuit board 20 can be conducted by the heat exchange medium in the housing 10 and the heat exchange flow channel 12 and dissipated in time, and the abnormal conditions such as damage and the like even caused by the influence of the overheat of the circuit board 20 on the service life of the circuit board 20 are avoided. In addition, the vehicle controller 100 according to the embodiment of the application has low noise during heat dissipation, thus improving the comfort of personnel in the vehicle 1000, and the volume of the housing 10 is smaller on the premise of ensuring the heat dissipation effect, so that the space required when the vehicle controller 100 is arranged on the body main body 200 of the vehicle 1000 is smaller, which is beneficial to realizing miniaturization design.

In the description of the present application, it should be noted that the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected, unless otherwise specifically defined and limited. Either mechanically or electrically. Can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

The above disclosure provides many different embodiments, or examples, for implementing different structures of the application. The foregoing description of specific example components and arrangements has been presented to simplify the present disclosure. They are, of course, merely examples and are not intended to limit the application. Furthermore, the present application may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present application provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.

In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular method step, feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular method steps, features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While the application has been described with reference to certain preferred embodiments, it will be understood by those skilled in the art that various changes and substitutions of equivalents may be made and equivalents will be apparent to those skilled in the art without departing from the scope of the application. Therefore, the protection scope of the application is subject to the protection scope of the claims.

Claims

A vehicle controller, characterized by comprising:

a housing including a mounting portion for mounting to a body main body of a vehicle; the heat exchange flow channel comprises a liquid inlet, a liquid outlet and a medium channel, wherein the liquid inlet and the liquid outlet are communicated with the medium channel;

the circuit board is arranged on the shell and is used for being electrically connected with a gateway of the vehicle and a sensor arranged on the vehicle;

the circuit board is in heat conduction connection with the shell, and heat exchange medium in the heat exchange flow channel can exchange heat with the shell, so that heat generated by the circuit board is dissipated.
The vehicle controller of claim 1, wherein the circuit board is in direct thermally conductive connection with the housing.
The vehicle controller of claim 2, wherein the circuit board is in contact and thermally conductive connection with the housing.
The vehicle controller of claim 1, wherein the circuit board is in indirect thermally conductive connection with the housing.
The vehicle controller according to claim 4, characterized in that the vehicle controller further comprises:

and the circuit board is in heat conduction connection with the shell through the heat conduction piece.
The vehicle controller of claim 5, wherein different portions of the thermally conductive member are in contact and thermally conductive connection with the circuit board and the housing, respectively.
The vehicle controller of claim 6, wherein the thermally conductive member comprises a thermally conductive adhesive layer.
The vehicle controller of claim 7, wherein the layer of thermally conductive adhesive comprises a two-component layer of thermally conductive adhesive.
The vehicle controller of claim 1, wherein the housing comprises:

the heat exchange flow channel is formed on the first shell;

the second shell part is connected with the first shell part and is matched with the first shell part to form a containing cavity for containing the circuit board; the mounting portion is provided on the first shell portion or the second shell portion.
The vehicle controller of claim 9, wherein the housing further comprises:

and the protruding structure is arranged on the first shell part and/or the second shell part in a protruding way and is in heat conduction connection with the power consumption element of the circuit board.
The vehicle controller of claim 10, wherein the protruding structure is in contact thermally conductive connection or in indirect thermally conductive connection with the power consuming element.
The vehicle controller of claim 11, wherein the protruding structure is thermally coupled to the power-consuming element via a thermally conductive member.
The vehicle controller of claim 10, wherein the power consuming element comprises a first electronic element; the projection structure includes:

and the first bulge is arranged on one side surface of the first shell part, which faces the second shell part, and the first shell part and the first electronic element are both in heat conduction connection with the first bulge.
The vehicle controller of claim 13, wherein the number of first protrusions includes a plurality of the first protrusions spaced apart.
The vehicle controller of claim 13, wherein the number of first protrusions includes a plurality of the first protrusions having different protrusion thicknesses.
The vehicle controller of claim 15, wherein a gap between each of the first protrusions and the corresponding first electronic component is substantially the same.
The vehicle controller of claim 10, wherein the power consuming element comprises a second electronic element; the projection structure includes:

and the second bulge is arranged on one side surface of the second shell part, which faces the first shell part, in a protruding way, and the second shell part and the second electronic element are both in heat conduction connection with the second bulge.
The vehicle controller of claim 17, wherein the number of second protrusions includes a plurality of the second protrusions spaced apart.
The vehicle controller according to claim 17, wherein the number of the second protrusions includes a plurality of which the protrusion thicknesses are different.
The vehicle controller of claim 19, wherein a gap between each of the second protrusions and the corresponding second electronic component is substantially the same.
The vehicle controller of claim 10, wherein the power consuming element comprises at least one of a chip, a power management integrated circuit, an inductor, a double rate synchronous dynamic random access memory, a capacitor.
The vehicle controller of claim 9, wherein the first shell portion is fixedly connected or detachably connected to the second shell portion.
The vehicle controller of claim 22, wherein the first housing portion is provided with a first mounting portion and the second housing portion is provided with a second mounting portion detachably connected to the first mounting portion.
The vehicle controller of claim 23, wherein the first fitting portion is snap-fit with the second fitting portion.
The vehicle controller of claim 23, wherein the first fitting portion is detachably connected to the second fitting portion by a lock.
The vehicle controller of claim 25, wherein the locking member passes through the first fitting portion, the circuit board, and the second fitting portion to lock the first and second housing portions.
The vehicle controller of claim 25, wherein the fastener comprises a screw.
The vehicle controller of claim 9, wherein the first shell portion comprises:

the first plate body is provided with a first guide groove;

the second plate body is provided with a second guide groove, the first guide groove is matched with the second guide groove to form the heat exchange flow channel, and the second plate body is matched with the second shell part to form the accommodating cavity.
The vehicle controller of claim 28, wherein the first plate is sealingly connected to the second plate by a welding process.
The vehicle controller of claim 29, wherein the first plate is sealingly connected to the second plate by a friction stir welding process.
The vehicle controller of claim 1, wherein one of the housing and the circuit board is provided with a positioning post and the other is provided with a positioning hole that mates with the positioning post.
The vehicle controller of claim 1, wherein the heat exchange flow path comprises one or more.
The vehicle controller of claim 1, wherein the medium passage comprises:

the first sub-runner is connected with the liquid inlet;

the second sub-runner is connected with the first sub-runner;

and the third sub-runner is connected with the second sub-runner and is connected with the liquid outlet.
The vehicle controller of claim 33, wherein the second sub-flow passage is non-coplanar with the third sub-flow passage.
The vehicle controller of claim 34, wherein the second sub-flow passage cooperates with the third sub-flow passage to form a first step such that the third sub-flow passage is located above the second sub-flow passage in the direction of gravity.
The vehicle controller of claim 33, wherein the first sub-flow passage is non-coplanar with the second sub-flow passage.
The vehicle controller of claim 36, wherein the first sub-flow passage cooperates with the second sub-flow passage to form a second step such that the first sub-flow passage is located above the second sub-flow passage in the direction of gravity.
The vehicle controller of claim 33, wherein the first sub-flow passage is disposed coplanar with the third sub-flow passage.
The vehicle controller of claim 33, wherein the second sub-flow passage is curved.
The vehicle controller of claim 1, wherein the liquid inlet and the liquid outlet are disposed coplanar.
The vehicle controller of claim 1, wherein the liquid inlet and the liquid outlet are disposed non-coplanar.
The vehicle controller of claim 41, wherein the liquid outlet is disposed above the liquid inlet in a direction of gravity.
The vehicle controller of any of claims 1-42, wherein the liquid inlet and the liquid outlet are located on the same side of the housing.
The vehicle controller of any of claims 1-42, further comprising:

and the electric connection interface is electrically connected with the circuit board and is used for being electrically connected with the gateway and the sensor of the vehicle.
The vehicle controller of claim 44, wherein the electrical connection interface, the fluid inlet, and the fluid outlet are located on a same side of the housing.
The vehicle controller according to claim 1, characterized by further comprising:

the two quick-release connecting pieces are respectively detachably connected with the runner wall at the liquid inlet and the runner wall at the liquid outlet.
The vehicle controller of claim 46, wherein the quick release connector is sealingly connected to the flow passage wall at the inlet or the flow passage wall at the outlet by a raw tape or sealant layer.
A vehicle, characterized by comprising:

a body main body; and

1-47, provided on the vehicle body.